JP2006319167A - Electronic component, its manufacturing method, and electronic device using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component which has stable characteristics in the electronic component wherein an electric conductive pattern is arranged on an insulating substrate. <P>SOLUTION: The electronic component comprises an insulating substrate 21, and an electric conductive pattern 22 arranged on the insulating substrate 21. A projection 24 is formed as projecting toward the electric conductive pattern 22 from the insulating substrate 21, and a recess 23 is formed in the electric conductive pattern 22 corresponding to this projection 24. Consequently, a desired purpose can be attained. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic component used in a high-frequency device and the like, a method for manufacturing the same, and an electronic device using the electronic component.

  Hereinafter, a conventional method for manufacturing an electronic component will be described. Conventional electronic components have been manufactured by the following method. That is, in FIG. 18, the polyimide film 2 in which the groove 1 is formed is used, and the groove 1 of the polyimide film 2 is filled with the conductive paste 3 with the squeegee 4. A drying step 12 for drying the conductive pattern 5 formed with the conductive paste 3, a transfer step 13 for transferring the conductive pattern 5 to the rigid substrate 7 coated with the adhesive 6 after the drying step 12, and this After the transfer step 13, a peeling step 14 for peeling the polyimide film 2, a baking step 15 for baking the conductive pattern 5 transferred to the rigid substrate 7 at about 900 ° C. after the peeling step 14, and this baking After the process 15, the cutting process 16 which cuts the rigid board | substrate 7 with the dicing apparatus 10 was implemented, and the electronic component was manufactured.

  The electronic component manufactured as described above is fired at about 900 ° C. for 10 minutes in the firing step 15. At this time, the rigid substrate 7 does not shrink. On the other hand, the conductive pattern 5 contracts to become a conductive pattern 5a. Further, the distance 8 between the conductive patterns 5 is also contracted, so that the distance 8 a between the conductive patterns 5 a is larger than the distance 8 between the conductive patterns 5.

  9 is a residue (residual residue of the conductive paste 3) generated by contracting the conductive pattern 5 to the conductive pattern 5a.

As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP 2001-320151 A

  However, in such a conventional method for manufacturing an electronic device, the adhesive 6 shown in FIG. 19 is melted and has fluidity by firing at 900 ° C. in the firing step 15. On the other hand, the surface of the rigid substrate 7 remains flat and does not change. Therefore, it is conceivable that the conductive pattern 5 moves due to the fluidity of the adhesive 6. As a result, the distance 8 between the conductive patterns 5 varies irregularly due to the fluidity of the adhesive 6 after the baking step 15. If it does so, the space | interval between the conductive patterns 5a will fluctuate irregularly, As a result, there existed a problem that the characteristic of an electronic component fluctuated irregularly.

  Accordingly, the present invention has been made to solve this problem, and an object thereof is to provide an electronic component having stable characteristics.

  In order to achieve this object, the electronic component of the present invention is provided with a protrusion from the insulating substrate toward the conductive pattern, and a recess is provided in the conductive pattern corresponding to the protrusion. Thereby, the intended purpose can be achieved.

  As described above, the present invention is such that a protruding portion is provided from the insulating substrate toward the conductive pattern, and the conductive pattern corresponding to the protruding portion is provided with a depression, and the protruding portion formed on the insulating substrate is provided. The conductive pattern on the insulating substrate is fixed without moving because it enters and is fixed in the recess formed in the conductive pattern. Therefore, an electronic component having stable electric performance can be obtained.

  If a plurality of the conductive patterns are provided, these conductive patterns are fixed, so that the distance between the conductive patterns is fixed, the degree of coupling is constant, and stable electrical performance is obtained.

  Furthermore, there is no residue between the conductive patterns, and the insulation quality between the conductive patterns is good.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
FIG. 1 is a cross-sectional view of an essential part of an electronic component according to Embodiment 1 of the present invention. In FIG. 1, reference numeral 21 denotes an insulating substrate formed by firing a green sheet. A conductive pattern 22 baked with a conductive paste is laid on the upper surface 21 a of the insulating substrate 21.

  A recess 23 is formed on the bottom surface of the conductive pattern 22, and the upper surface 21 a of the insulating substrate 21 is provided with a protrusion 24 at a position corresponding to the recess 23. And this hollow part 23 and the protrusion part 24 are closely_contact | adhered, and are being fixed firmly so that it may not move.

  Therefore, the conductive pattern 22 does not move and the electrical performance is stable. Further, the distance 25 between the conductive patterns 22 does not change, and the distance between the conductive patterns 22 is fixed. Therefore, the coupling between the conductive patterns 22 is stabilized, and stable electrical performance such as inductive coupling and capacitive coupling is obtained. Obtainable.

(Embodiment 2)
In the second embodiment, a method for manufacturing an electronic component will be described. In FIG. 2, 26 is a filling process and 35 is a polyimide film. The polyimide film 35 is provided with a groove 36 having a pattern formed by a laser beam. The groove 36 has a taper that widens upward. This taper is provided in order to improve the insertion property of the conductive paste (described later) and facilitate peeling in the peeling step (described later).

  37 is a conductive paste formed of silver (Ag), a resin, and a solvent. The conductive paste 37 fills the groove 36 by moving the squeegee 38 in the direction of the arrow 39. In this way, the conductive paste 37 is filled into the grooves 36 of the polyimide film 35 to form the conductive pattern 43.

  Next, in the recess forming step 27, the recess 40 is formed on the central upper surface side of the conductive pattern 43. That is, the recess 40 is formed on the upper center side of the opening of the groove 36. The depth of the recess is about 7 μm.

  The hollow portion 40 is formed by centrifuging the polyimide film 35 filled with the conductive paste 37 with a centrifuge and drying it. By this centrifugation and drying, the density of silver in the conductive paste 37 can be increased. That is, the conductivity can be improved. Further, by this step, the conductive paste 37 is reliably filled up to the corners of the grooves 36.

  In this way, after the recess forming step (which is also a drying step) 27, the filling step 26 may be performed again to fill the groove 36 with the conductive paste 37 more completely. In the present embodiment, the recess forming step 27 and the filling step 26 are repeated three times to completely fill the conductive paste 37.

  Next, the transfer process 28 will be described. Reference numeral 41 denotes a green sheet affixed to the pet film 42. The pet film 42 provided on the upper surface of the green sheet 41 is peeled off. Then, the pet film 42 side of the green sheet 41 and the upper surface side 41a in this drawing are in a binder-rich state (the reason is not clear) and serve as an adhesive.

  A polyimide film 35 is placed on the upper surface side 41 a of the green sheet 41. At this time, the conductive pattern 43 (opening side of the groove 36) is the upper surface side 41 a of the green sheet 41.

  Transfer is performed under the following conditions. That is, the conductive pattern 43 is transferred to the upper surface side 41a of the green sheet 41 under the transfer conditions of pressure of 18 kg per square centimeter, temperature of 170 ° C., and time of 10 minutes. By transferring under the transfer conditions, the green sheet 41 has flexibility, so that a protruding portion 44 is formed on the upper surface 41a of the green sheet 41 so as to be fitted to the recessed portion 40.

  Next, in the peeling step 29, the polyimide film 35 is peeled from the green sheet 41. In addition, the process so far is working with the sheet | seat shape in which multiple electronic components were provided. Therefore, work efficiency is improved.

  Next, in the cutting step 30, the green sheet 41 is pushed and cut with a blade 45. Then, the electronic components are divided individually. Since this cutting process 30 cuts in the state of the green sheet 41 in an unfired state, it can be easily cut. Therefore, this cutting device can be used at a low cost.

  Next, in the firing step 31, the electronic component cut in the cutting step 30 is fired. In the firing step 31, the firing is performed at a temperature of 860 ° C. to 900 ° C. for 10 minutes. By this firing step 31, the green sheet 41 contracts to become the insulating substrate 21, and the conductive pattern 43 also contracts to become the conductive pattern 22. Further, the protruding portion 44 is baked to become the protruding portion 24, and the recessed portion 40 is baked to become the recessed portion 23. In this case, the conductive paste 37 that forms the conductive pattern 43 melts at a high temperature, but the protrusion 24 provided on the insulating substrate 21 and the recess 23 provided on the conductive pattern 22 are securely fitted. The conductive pattern 22 does not move irregularly on the insulating substrate 21. Moreover, since it baked at high temperature, the protrusion part 24 and the hollow part 23 have adhered firmly.

  In this firing step 31, since the green sheet 41 has already been cut in the cutting step 30 to be a small electronic component, the contraction rate at the center and the end within the small piece is reduced. Therefore, an electronic component having a uniform shrinkage ratio can be formed.

  Since it is manufactured as described above, this electronic component has the following characteristics. That is, before the firing step 31, the distance 46 between the conductive patterns 43 is as shown in FIG. 3, but when the firing step 31 is performed, the green sheet 41 contracts. That is, as shown in FIG. 4, the distance 25 between the conductive patterns 22 is shorter than the distance 46 before firing. By this contraction, the bond formed between the conductive patterns 22 becomes dense, and the electronic component can be downsized.

  The distance 25 between the conductive patterns 22 is determined by the wall thickness of the groove 36 formed in the polyimide film 35 and the other groove 36 adjacent to the groove 36. The thickness of this wall is It cannot be narrower than 10 μm. However, the distance 46 of the conductive pattern 43 can be fired to be narrower than 10 μm. That is, the distance between the conductive patterns 22 is reduced from the distance 46 to the distance 25 due to the shrinkage of the green sheet 41 after being baked. Thus, since the distance between the conductive patterns 22 is shortened, the degree of coupling can be increased. That is, it contributes to miniaturization. On the other hand, in the conventional technique, the distance 8a between the conductive patterns 5a is widened by firing as shown in FIG.

  In the prior art, since the rigid substrate 7 is used as shown in FIG. 5, the rigid substrate 7 does not shrink even after the firing step 15. Accordingly, since the conductive pattern 5 transferred to the upper surface of the rigid substrate 7 is also reduced in a similar shape, the corner 47 on the side surface does not change.

  In contrast, in the electronic component according to the present embodiment, as shown in FIG. 6, the green sheet 41 contracts to become the insulating substrate 21, so that the side surface 22 a of the conductive pattern 22 approaches perpendicularly. Therefore, compared with the height 5b of the conductive pattern 5a according to the conventional technique shown in FIG. 5, the height 22b of the conductive pattern 22 in the present embodiment is higher as shown in FIG. To do. As a result, the degree of coupling between the conductive patterns 22 increases, and inductive coupling and capacitive coupling increase. Therefore, the electronic component can be downsized.

  In addition, since the side surface 22a of the conductive pattern 22 approaches the vertical, even if the taper of the groove 36 is increased, it is equivalent to the conventional one having a small taper. In other words, the taper can be increased, and the filling of the conductive paste 37 in the filling process 26 and the peeling of the polyimide film 35 in the peeling process 29 are facilitated.

  Furthermore, in the present embodiment, since the so-called intaglio technique for filling the groove 36 with the conductive paste 37 is used, the height of the conductive pattern 22 can be made higher than that using the screen printing technique. Therefore, a large cross-sectional area can be realized and the electric resistance is reduced, so that an electronic component having a high cue (Q) can be obtained.

  In addition, according to this Embodiment, since the green sheet 41 also shrink | contracts, the residue 9 which became a problem in the prior art does not arise. Therefore, the insulation quality between the conductive patterns 22 of the electronic component is improved.

(Embodiment 3)
FIG. 7 is a plan view of electronic component 51 in the third embodiment. In addition, the manufacturing method of this electronic component 51 uses the manufacturing method of the electronic component demonstrated in Embodiment 2. FIG.

  In FIG. 7, 52 is an insulating substrate (corresponding to the insulating substrate 21 of the second embodiment). Conductive patterns 53a and 53b (corresponding to the conductive pattern 22 of the second embodiment) are provided on the upper surface of the insulating substrate 52 so as to be close and parallel to each other.

  One end of the conductive pattern 53a is connected to an external connection terminal 54a provided on one side surface (or the back surface) of the insulating substrate 52. Similarly, the other end of the conductive pattern 53a is also connected to an external connection terminal 54b provided on the other side surface (which may be the back surface) of the insulating substrate 52.

  Further, one end of the conductive pattern 53b is connected to an external connection terminal 54c provided on one side surface (or the back surface) of the insulating substrate 52. Similarly, the other end of the conductive pattern 53b is also connected to an external connection terminal 54d provided on the other side surface (which may be the back surface) of the insulating substrate 52.

  In this way, the electronic component 51 forms a coupler. That is, when a signal is passed from the connection terminal 54a to the connection terminal 54b, the signal is guided to the conductive pattern 53b and the connection terminals 54c and 54d appear.

  Since this electronic component 51 uses the technique of the second embodiment, the recesses formed in the conductive patterns 53a and 53b are fitted into the protrusions formed on the insulating substrate 52, and are firmly fixed. Yes. In addition, since the conductive patterns 53a and 53b can be close to each other, the degree of coupling is increased, and the electronic component 51 that is downsized can be realized. Furthermore, since the height of the conductive patterns 53a and 53b can be made higher than that of screen printing, the cross-sectional area is increased, and the electronic component 51 having a high Q can be realized.

  FIG. 8 is an equivalent circuit diagram thereof. 55a is the inductance of the conductive pattern 53a, and 55b is the inductance of the conductive pattern 53b.

(Embodiment 4)
FIG. 9 is a circuit diagram of electronic component 56 in the fourth embodiment. In addition, the manufacturing method of this electronic component 56 uses the manufacturing method of the electronic component demonstrated in Embodiment 2. FIG.

  That is, there are provided an inductor 58 (formed with a conductive pattern) and an inductor 59 (formed with a conductive pattern) arranged close to and parallel to the inductor 57 formed with a conductive pattern. Both ends of the inductor 57 are connected to external connection terminals 60a and 60b, respectively. Further, both ends of the inductor 58 are connected to external connection terminals 60c and 60d, respectively, and both ends of the inductor 59 are also connected to external connection terminals 60e and 60f, respectively.

  The electronic components 56 connected as described above constitute a balun. That is, when an unbalanced signal is input to the connection terminals 60a and 60b on the inductor 57 side, a balanced signal is output to the connection terminals 60c and 60d on the inductor 58 side and the connection terminals 60e and 60f on the inductor 59 side.

  Conversely, if a balanced signal is input to the connection terminals 60c and 60d on the inductor 58 side and the connection terminals 60e and 60f on the inductor 59 side, an unbalanced signal is output to the connection terminals 60a and 60b on the inductor 57 side.

  Since the electronic component 56 also uses the technique of the second embodiment, the same effect as the electronic component 51 of the third embodiment is achieved.

(Embodiment 5)
FIG. 10 is a plan view of electronic component 61 in the fifth embodiment. In addition, the manufacturing method of this electronic component 61 uses the manufacturing method of the electronic component demonstrated in Embodiment 2. FIG.

  A spiral conductive pattern 63 is formed on the upper surface of the insulating substrate 62. One end of the conductive pattern 63 is connected to an external connection terminal 64 a formed on one side surface (which may be the back surface) of the insulating substrate 62. The other end of the conductive pattern 63 is led out to the back surface of the insulating substrate 62 through the inner via 65, and the outside formed on the other side surface (which may be the back surface) of the insulating substrate 62 from the back surface. Are connected to the connection terminal 64b.

  Thus, since the inductor is formed by the spiral conductive pattern 63, the inductor can be miniaturized. Further, in FIG. 10, a circular shape is used as the spiral shape, but this may be a triangle, a quadrangle, or a polygon.

  Since the electronic component 61 also uses the technique of the second embodiment, the same effect as the electronic component 51 of the third embodiment can be obtained.

(Embodiment 6)
FIG. 11 is a plan view of electronic component 66 in the sixth embodiment. The method for manufacturing the electronic component 66 uses the method for manufacturing the electronic component described in the second embodiment.

  On the upper surface of the insulating substrate 67, comb-shaped conductive patterns 68a and 68b are formed so as to mesh with each other. In addition, an insulating portion with a minute interval is provided between the conductive patterns 68a and 68b. The conductive pattern 68 a is connected to an external connection terminal 69 a formed on one side surface (or the back surface) of the insulating substrate 67. The conductive pattern 68b is connected to an external connection terminal 69b formed on the other side surface (or the back surface) of the insulating substrate 67.

  In this way, a capacitor is formed by the conductive patterns 68a and 68b. Since the conductive patterns 68a and 68b are formed by the intaglio printing technique, the height of the conductive patterns 68a and 68b can be increased, and a capacitor having a large capacitance can be realized.

  Further, since the conductive patterns 68a and 68b are formed so as to mesh with each other, they can be formed in the same layer even though they are capacitors. Therefore, even a single-layer insulating substrate can be formed on a single surface.

  Since the electronic component 66 also uses the technique of the second embodiment, the same effect as the electronic component 51 of the third embodiment is achieved.

(Embodiment 7)
FIG. 12 is an exploded perspective view of the electronic component 71 according to the seventh embodiment. The manufacturing method of the electronic component 71 uses the multilayer substrate technique, but is basically the same as the manufacturing method described in the second embodiment. The only difference is that a plurality of green sheets are laminated before the cutting step 30 (FIG. 2).

  Reference numeral 72 denotes a green sheet. On the upper surface of the green sheet 72, a conductive pattern 73 using an intaglio printing technique is placed. A dielectric glass 74 and a protective glass 75 are laminated on the conductive pattern 73.

  A green sheet 77 is laminated on the back surface of the green sheet 72, and the green sheet 77 is formed with an extraction electrode 76 formed by a screen printing technique (may be an intaglio printing technique). . One end of the conductive pattern 73 is connected to the extraction electrode 76 via the inner via 78. The other end of the conductive pattern 73 is directly led to the side electrode.

  The electronic component 71 configured as described above is fired in the firing step 31 (FIG. 2) to become an electronic component having a coupler function.

(Embodiment 8)
FIG. 13 is a cross-sectional view of electronic component 79 in the eighth embodiment. In addition, the manufacturing method of this electronic component 79 forms the electronic component 79 by bonding two electronic components 71 described in the seventh embodiment back to back.

  That is, the following sheets are also laminated on the back surface of the green sheet 77 of the electronic component 71. That is, the green sheet 77a in which the extraction electrode 76a is formed by the screen printing technique, the green sheet 72a in which the inner via 78a is provided and the conductive pattern 73a is formed by the intaglio printing technique, the dielectric glass 74a, and the protective glass 75a. Are stacked in this order. Here, the extraction electrode 76a may be formed by an intaglio printing technique.

  The green sheet 77 or 77a is provided with a plate-like first conductive pattern (intaglio printing or screen printing), and the green sheet 72 or 72a is provided with a plate-like second conductive pattern (intaglio printing). A capacitor can be formed by providing the first and second conductive patterns facing each other. Also, an electronic circuit can be formed with a conductive pattern in the inner layer.

(Embodiment 9)
FIG. 14 is a circuit diagram of electronic component 81 in the ninth embodiment. The manufacturing method of the electronic component 81 is based on the first and second embodiments, and more specifically, the electronic components 61 and 66 described in the fifth and sixth embodiments or the eighth embodiment. This method uses a method for manufacturing the electronic component 79 in the laminated substrate.

  In FIG. 14, an inductor 84 is connected between an input terminal 82a and an output terminal 83a. The ground potential input terminal 82b and the ground potential output terminal 83b are directly connected as they are. And between the input terminal 82a and the input terminal 82b, the capacitor | condenser 85 is connected and the electronic component 81 which has a low-pass filter function is formed.

  Therefore, the electronic component 81 having the characteristics of the first and second embodiments can be obtained.

(Embodiment 10)
FIG. 15 is a circuit diagram of electronic component 86 in the tenth embodiment. The manufacturing method of the electronic component 86 is based on the first and second embodiments, and more specifically, the electronic components 61 and 66 described in the fifth and sixth embodiments or the eighth embodiment. This method uses a method for manufacturing the electronic component 79 in the laminated substrate.

  In FIG. 15, a capacitor 89 is connected between an input terminal 87a and an output terminal 88a. The ground potential input terminal 87b and the ground potential output terminal 88b are directly connected as they are. An inductor 90 is connected between the input terminal 87a and the input terminal 87b to form an electronic component 86 having a high-pass filter function.

  Therefore, the electronic component 86 having the characteristics of the first and second embodiments can be obtained.

(Embodiment 11)
FIG. 16 is a circuit diagram of electronic component 91 in the eleventh embodiment. The manufacturing method of the electronic component 91 is based on the first and second embodiments, and more specifically, the electronic components 61 and 66 described in the fifth and sixth embodiments or the eighth embodiment. This method uses a method for manufacturing the electronic component 79 in the laminated substrate.

  In FIG. 16, the input terminal 92a and the output terminal 93a are directly connected. The ground potential input terminal 92b and the ground potential output terminal 93b are also directly connected. An electronic component having a band-pass filter function is formed by connecting a parallel connection body of an inductor 94 and a capacitor 95 between the input terminal 92a (or the output terminal 93a) and the input terminal 92b (or the output terminal 93b). 91 is formed.

  Therefore, the electronic component 91 having the characteristics of the first and second embodiments can be obtained.

(Embodiment 12)
FIG. 17 is a block diagram of the electronic device 101 according to the twelfth embodiment. An electronic device 101 according to the present invention includes a transmission system and a reception system, and uses the electronic component according to the present invention as the component parts constituting these. In this embodiment, a so-called mobile phone in which the transmission system and the reception system are housed in the same casing is described, but this may be an independent transmitter or receiver.

  The manufacturing method of the electronic component which is an element component of the electronic apparatus 101 is based on the first and second embodiments, and more specifically, the third, fourth, fifth, sixth, ninth, tenth, The electronic component 51, 56, 61, 66, 81, 86, 91 described in 11 or the manufacturing method of the electronic component 79 in the laminated substrate described in the eighth embodiment is used.

  First, the receiving system will be described. In FIG. 17, reference numeral 102 denotes an antenna to which a high-frequency signal (such as a mobile phone or TV broadcast) is input, and this antenna 102 is connected to a common terminal of the antenna changeover switch 103. One terminal of the antenna selector switch 103 is connected to the band pass filter 104. The band pass filter 104 is configured by inserting two electronic components 91 described in the eleventh embodiment in order to separate and pass DCS (1.9 GHz) and GSM (800 MHz). .

  The GSM output of the bandpass filter 104 is input to the balun (corresponding to the electronic component 56 described in the fourth embodiment) 108a through the SAW filter 105a, the LNA (low noise amplifier) 106a, and the SAW filter 107a. The Unbalanced / balanced conversion is performed by the balun 108 a, and the output is connected to the high-frequency circuit 109. The high-frequency circuit 109 is connected to a baseband circuit 110, and the output of the baseband circuit 110 is connected to a speaker 111 (used as an example of an output unit). A microphone 112 is connected to the transmission / reception circuit 110.

  The DCS output of the bandpass filter 104 is input to the balun 108b via the SAW filter 105b, the LNA 106b, and the SAW filter 107b. Unbalanced / balanced conversion is performed by the balun 108 b, and the output is connected to the high-frequency circuit 109.

  An oscillator 113 is unbalanced / balanced converted via a balun 114, and its output is connected to the high-frequency circuit 109. The inductor constituting the resonator of this oscillator 113 can use the electronic component 61 in the fifth embodiment.

  Next, the transmission system will be described. Reference numeral 112 denotes a microphone (used as an example of an input unit), and an output of the microphone 112 is connected to the high-frequency circuit 109 via the baseband circuit 110. The oscillator 113 and the balun 114 are shared with the receiving system. Of course, this may be provided separately.

  The GSM output of the high frequency circuit 109 is connected to the balun 115a. The balun 115a performs balanced / unbalanced conversion. The output of this balun 115a is passed through a SAW filter 116a, a power amplifier 117a, and a low-pass filter (the electronic component 81 of the ninth embodiment can be used) 118a that blocks the passage of GSM frequency or higher. The coupler 119 (the electronic component 51 of the third embodiment can be used. Note that this coupler is composed of two couplers of the third embodiment) 119. The output of the coupler 119 is connected to the other terminal of the antenna selector switch 103 via a band pass filter 120 that separates GSM and DCS. Then, a high frequency signal is transmitted from the antenna 102.

  The DCS output of the high frequency circuit 109 is connected to the balun 115b. The balun 115b performs balanced / unbalanced conversion. The output of the balun 115b is input to the coupler 119 via the SAW filter 116b, the power amplifier 117b, and the low-pass filter 118b that prevents passage of the DCS frequency or higher.

  The pickup output of the coupler 119 is connected to the high frequency circuit 109 via the detection circuit 121.

  Connected as described above, the electronic apparatus 101 having a mobile phone function is configured. Here, the bandpass filters 104 and 120, the coupler 119, the lowpass filters 118a and 118b, the baluns 108a, 108b, 114, 115a, and 115b, and the inductor used for the oscillator 113 are obtained by using the electronic components of the present invention. Since the conductive pattern and the insulating substrate are securely attached, the electronic device 101 as a mobile phone that is resistant to vibration can be realized.

  In addition, since the electrical resistance can be reduced by using the electronic component of the present invention after the output of the power amplifiers 117a and 117b, the transmission power of the electronic device 101 can be improved and the power can be saved.

  Since the electronic component of the present invention has stable electrical performance, it can be used in various electronic devices.

Sectional drawing of the principal part of the electronic component in Embodiment 1 of this invention Same as above, manufacturing process diagram of electronic component in Embodiment 2 Same as above, sectional view of the main part of the electronic component before the firing process Same as above, sectional view of the main part of the electronic component after the firing process Reference cross-sectional view when using rigid board Same as above, enlarged sectional view of the main part of the electronic component after the firing process The top view of the electronic component in Embodiment 3 Same as above, circuit diagram Circuit diagram of electronic component according to Embodiment 4 The top view of the electronic component in Embodiment 5 same as the above The top view of the electronic component in Embodiment 6 same as the above The exploded perspective view of the electronic component in Embodiment 7 same as the above Sectional drawing of the principal part of the electronic component in Embodiment 8 same as the above The circuit diagram of the electronic component in the ninth embodiment Circuit diagram of electronic component in Embodiment 10 Circuit diagram of electronic component in the eleventh embodiment The block diagram of the electronic device in Embodiment 12 same as the above Conventional manufacturing process diagram Same part cross section

Explanation of symbols

21 Insulating substrate 22 Conductive pattern 23 Recessed portion 24 Protruding portion

Claims (27)

An electron comprising an insulating substrate and a conductive pattern laid on the insulating substrate, provided with a protrusion from the insulating substrate toward the conductive pattern, and a recess provided in the conductive pattern corresponding to the protrusion parts. The electronic component according to claim 1, wherein the protrusion and the recess are in close contact with each other. The conductive pattern is constructed such that the first conductive pattern and the second conductive pattern are laid in parallel, and the end of each conductive pattern is connected to a connection terminal formed on the side surface or the back surface of the insulating substrate. The electronic component according to claim 2 to be formed. The conductive pattern is a connection in which the second conductive pattern and the third conductive pattern are laid in parallel with the first conductive pattern, and the end portions of the conductive patterns are formed on the side surface or the back surface of the insulating substrate. The electronic component according to claim 2, wherein the electronic component is connected to a terminal to form a balun. The electronic component according to claim 2, wherein the conductive pattern is laid in a spiral shape, and an end portion of each conductive pattern is connected to a connection terminal formed on a side surface or a back surface of the insulating substrate to form an inductor. The conductive pattern is laid so that the first conductive pattern and the second conductive pattern mesh with each other, and the end of each conductive pattern is connected to a connection terminal formed on the side surface or the back surface of the insulating substrate. The electronic component according to claim 2, wherein a capacitor is formed. A multilayer substrate is used as the insulating substrate, and plate-like conductive patterns are laid between the layers of the multilayer substrate, and the end portions of the respective conductive patterns are connected to connection terminals formed on the side surface or the back surface of the insulating substrate. The electronic component according to claim 2, wherein the electronic component is connected to form a capacitor. The inductor according to claim 5 is connected between the first terminal and the second terminal, and the third terminal and the fourth terminal are directly connected to each other. An electronic component that forms a low-pass filter by connecting the capacitor according to claim 6 between the first terminal and the capacitor. The capacitor according to claim 6 or 7 is connected between the first terminal and the second terminal, and the third terminal and the fourth terminal are directly connected. An electronic component that forms a high-pass filter by connecting the inductor according to claim 5 between the first terminal and the first terminal. The first terminal and the second terminal are directly connected, the third terminal and the fourth terminal are directly connected, and the first terminal and the third terminal are between the first terminal and the third terminal. An electronic component that forms a band-pass filter by connecting a parallel connection body of an inductor and a capacitor according to claim 6 or 7. A filling step of filling the groove of the polyimide film in which the groove is formed with a conductive paste, and a depression that forms a depression on the center upper surface side of the conductive pattern formed by filling the conductive paste after the filling step. A forming step, a transfer step for transferring the conductive pattern to the green sheet after the depression forming step, a peeling step for peeling the polyimide film after the transferring step, and after the peeling step, The manufacturing method of an electronic component which has a baking process which bakes a green sheet at high temperature. The manufacturing method of the electronic component of Claim 11 which had the cutting process which cut | disconnects a green sheet between a peeling process and a baking process. The method for manufacturing an electronic component according to claim 12, wherein the cutting in the cutting step is push cutting. The method for manufacturing an electronic component according to claim 11, wherein the groove formed in the polyimide film used in the filling step has a taper that widens toward the opening. The method of manufacturing an electronic component according to claim 11, wherein in the transferring step, the pet film attached to the green sheet is peeled off, and the conductive pattern is transferred to the peeling surface of the pet film. The method for manufacturing an electronic component according to claim 11, wherein the formation of the depression is a drying step of drying the polyimide film filled with the conductive paste. The method of manufacturing an electronic component according to claim 16, wherein the filling step and the drying step are repeated a plurality of times. An antenna to which a high-frequency signal is input, a band-pass filter to which the signal input to the antenna is supplied, a low-noise amplifier to which the output of the band-pass filter is supplied, and an output of the low-noise amplifier is one input And an output section to which the output of the high-frequency circuit is supplied. The band-pass filter includes the electronic component according to claim 10. The electronic device used. An antenna to which a high-frequency signal is input, a band-pass filter to which the signal input to the antenna is supplied, a low-noise amplifier to which the output of the band-pass filter is supplied, and an output of the low-noise amplifier is one input A high-frequency circuit to which the output of the oscillator is supplied to the other input and an output unit to which the output of the high-frequency circuit is supplied, and the output of the low-noise amplifier and one input of the high-frequency circuit An electronic device using the electronic component according to claim 4. An antenna to which a high-frequency signal is input, a band-pass filter to which the signal input to the antenna is supplied, a low-noise amplifier to which the output of the band-pass filter is supplied, and an output of the low-noise amplifier is one input And an output unit to which the output of the high-frequency circuit is supplied to the other input, and the inductor of the resonator constituting the oscillator is provided with a high-frequency circuit. An electronic device using the electronic component described in 1. An antenna to which a high-frequency signal is input, a band-pass filter to which the signal input to the antenna is supplied, a low-noise amplifier to which the output of the band-pass filter is supplied, and an output of the low-noise amplifier is one input And a high-frequency circuit to which the output of the oscillator is supplied to the other input, and an output section to which the output of the high-frequency circuit is supplied. An electronic device using the electronic component described in 1. An input unit to which a signal is input, a high-frequency circuit in which the signal input to the input unit is supplied to one input and the output of the oscillator is supplied to the other input, and an output of the high-frequency circuit is supplied A power amplifier, a coupler to which the output of the power amplifier is supplied, an antenna to which the output of the coupler is supplied, and a detection circuit connected between the pickup output of the coupler and the high-frequency circuit, An electronic device using the electronic component according to claim 8 between the power amplifier and the coupler. An input unit to which a signal is input, a high-frequency circuit in which the signal input to the input unit is supplied to one input and the output of the oscillator is supplied to the other input, and an output of the high-frequency circuit is supplied A power amplifier, a coupler to which the output of the power amplifier is supplied, an antenna to which the output of the coupler is supplied, and a detection circuit connected between the pickup output of the coupler and the high-frequency circuit, The electronic device using the electronic component according to claim 3. An input unit to which a signal is input, a high-frequency circuit in which the signal input to the input unit is supplied to one input and the output of the oscillator is supplied to the other input, and an output of the high-frequency circuit is supplied A power amplifier, a coupler to which the output of the power amplifier is supplied, an antenna to which the output of the coupler is supplied, and a detection circuit connected between the pickup output of the coupler and the high-frequency circuit, An electronic device using the electronic component according to claim 10 between the power amplifier and the antenna. An input unit to which a signal is input, a high-frequency circuit in which the signal input to the input unit is supplied to one input and the output of the oscillator is supplied to the other input, and an output of the high-frequency circuit is supplied A power amplifier, a coupler to which the output of the power amplifier is supplied, an antenna to which the output of the coupler is supplied, and a detection circuit connected between the pickup output of the coupler and the high-frequency circuit, The electronic device using the electronic component of Claim 4 between the said power amplifier and the said high frequency circuit. An input unit to which a signal is input, a high-frequency circuit in which the signal input to the input unit is supplied to one input and the output of the oscillator is supplied to the other input, and an output of the high-frequency circuit is supplied A power amplifier, a coupler to which the output of the power amplifier is supplied, an antenna to which the output of the coupler is supplied, and a detection circuit connected between the pickup output of the coupler and the high-frequency circuit, An electronic device using the electronic component according to claim 5 as an inductor of a resonator constituting the oscillator. An input unit to which a signal is input, a high-frequency circuit in which the signal input to the input unit is supplied to one input and the output of the oscillator is supplied to the other input, and an output of the high-frequency circuit is supplied A power amplifier, a coupler to which the output of the power amplifier is supplied, an antenna to which the output of the coupler is supplied, and a detection circuit connected between the pickup output of the coupler and the high-frequency circuit, The electronic device using the electronic component of Claim 4 between the said oscillator and the said high frequency circuit.

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