JP2006306403A - Manufacturing method of semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To keep a moistureproof environment of a tape and a reel. <P>SOLUTION: In a manufacturing method of a semiconductor device, a carrier tape 2 joined to a cover tape 3 having an aluminum layer, equipped with a plurality of pockets 2a and made of a polymer material, and a reel taking up the carrier tape 2, are provided. A seal 6 formed by heat-sealing is formed to be connected around the pocket 2a. Thus, the open air outside the seal 6 does not enter the interior of the seal 6, so that the pocket 2a is hermetically sealed, to keep the moistureproof environment of the tape and the reel. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a semiconductor manufacturing technique, and more particularly to a technique effective when applied to a tape reel that houses a semiconductor device.

  The sealing method of the carrier tape for packaging electronic components is a sealing method of sealing a plastic embossed tape in which storage pockets for storing chip-type electronic components are continuously formed and its cover tape, and rib portions between the storage pockets. Is sealed in an X shape so that each storage pocket has a hexagonal seal (see, for example, Patent Document 1).

The carrier tape for packaging chip-type electronic components is a plastic embossed carrier tape in which pockets for storing chip-type electronic components are continuously formed. The first layer is an embossable resin layer, and the second layer is It consists of a composite sheet of two or more layers, which is a resin layer with excellent moisture resistance (see, for example, Patent Document 2).
JP-A-5-338617 (FIG. 1) JP-A-5-193670 (FIG. 1)

  As one form of shipment of semiconductor devices such as semiconductor packages and semiconductor chips, tape and reel (hereinafter referred to as tape / reel) is known. The tape / reel is a system in which a semiconductor device is accommodated in a pocket (concave portion) of a carrier tape, which is sealed from above with a cover tape, and then wound around a reel before shipment.

  In shipping by tape and reel, as a moisture-proof measure for products, they are shipped in a bag made of aluminum foil or the like that does not absorb moisture (hereinafter also referred to as a moisture-proof bag) and deaerated.

  In the tape / reel method, there is a restriction that a product (semiconductor device or the like) is generally mounted within 168 hours after the moisture-proof bag is opened. If this time is exceeded, the product must be baked.

  However, since the baking process in the state accommodated in the tape / reel is difficult due to the heat resistance problem of the material forming the tape / reel, the product is once transferred to the tray to perform the baking process.

  Therefore, in the tape / reel system, there is a problem that there is a time restriction until use after opening.

  There is also a method called a vacuum baking method in which baking is performed at a temperature of 50 to 60 ° C. in a tape / reel state. However, there are problems such as large equipment, time consuming and deformation of the reel due to vacuum exhaust. There is.

  In addition, as a shipment form, shipment using a tray instead of a tape / reel is also performed, but a device (mounting device) for taking out a product (semiconductor device) from the tray when using the tray is large. The problem is that space efficiency is poor. Further, since the take-out device is large, the cost is high and the processing time is required for transfer.

  As described above, the need for a tape / reel as a means for accommodating a semiconductor device is increasing more than a tray.

  In Patent Documents 1 and 2, there is no description of a technique for easily removing the cover tape and a technique for improving the use area of the carrier tape while maintaining the moisture-proof environment of the product.

  An object of the present invention is to provide a technique capable of maintaining a moisture-proof environment in a tape reel.

  Another object of the present invention is to provide a technique capable of eliminating the moisture-proof bag and eliminating the mounting conditions after opening.

  Furthermore, another object of the present invention is to provide a technique capable of reducing the cost in shipping using a tape / reel.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in this application, the outline of typical ones will be briefly described as follows.

  That is, the present invention provides a tape reel having a carrier tape made of a polymer material and a cover tape provided with an aluminum layer, and after housing the semiconductor device in the recess of the carrier tape, The cover tape is heat-sealed, and the seal portion is connected to surround the recess.

  In addition, the present invention is formed by heat sealing a carrier tape in which a semiconductor device is accommodated in a recess and a cover tape having an aluminum layer, and the seal portion is connected to surround the recess. The seal portions between the recesses of the recess rows arranged in parallel are formed so as to gradually spread from the peeling base point in the peeling direction of the cover tape.

  Furthermore, the present invention heat-seals a carrier tape in which a semiconductor device is housed in a recess and a cover tape having an aluminum layer, and the first recess and the second recess that are adjacent to each other among the plurality of recesses of the carrier tape. The distance between the center of the first recess and the center of the seal portion is longer than the distance between the center of the second recess and the center of the seal portion.

  The present invention also provides a carrier tape made of a polymer material and a cover tape having an aluminum layer, and after the semiconductor device is accommodated in the recess of the carrier tape, the carrier tape and the cover tape are heat sealed around the recess. Then, after cutting the carrier tape for each of a plurality of predetermined recessed regions, the cut carrier tape is packed and shipped.

  Of the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.

  In the tape / reel, the cover tape includes an aluminum layer, and the seal portion by heat sealing between the carrier tape and the cover tape is connected so as to surround the recess, so that a moisture-proof environment can be maintained in the state of the tape / reel. Further, since the moisture-proof environment can be maintained with the tape and reel, the use of the moisture-proof bag can be abolished, and the mounting conditions after the moisture-proof bag is opened can be eliminated.

  In the following embodiments, the description of the same or similar parts will not be repeated in principle unless particularly necessary.

  Further, in the following embodiment, when it is necessary for the sake of convenience, the description will be divided into a plurality of sections or embodiments, but they are not irrelevant to each other unless otherwise specified. The other part or all of the modifications, details, supplementary explanations, and the like are related.

  Also, in the following embodiments, when referring to the number of elements (including the number, numerical value, quantity, range, etc.), particularly when clearly indicated and when clearly limited to a specific number in principle, etc. Except, it is not limited to the specific number, and it may be more or less than the specific number.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiments, and the repetitive description thereof will be omitted.

(Embodiment)
1 is a partially cutaway side view and enlarged partial sectional view showing an example of the structure of a tape reel used in the method for manufacturing a semiconductor device according to an embodiment of the present invention, and FIG. 2 is a tape reel shown in FIG. FIG. 3 is a cross-sectional view showing an example of the structure of the carrier tape substrate in the tape reel shown in FIG. 4 is a cross-sectional view showing a modified example of the base material structure of the carrier tape in the tape reel shown in FIG. 1, and FIG. 5 shows an example of the base material structure of the cover tape in the tape reel shown in FIG. FIG. 6 is a sectional view showing a modification of the structure of the base material of the cover tape in the tape reel shown in FIG.

  7 to 10 are partial plan views showing the structure of the carrier tape of the tape / reel shown in FIG. 1 and the seal portion of the modification, and FIG. 11 is the structure and modification of the carrier tape of the tape / reel shown in FIG. FIG. 12 is an enlarged plan view showing a seal portion of a modification of the carrier tape of the tape / reel shown in FIG. 1. Further, FIG. 13 to FIG. 15 are partial plan views showing the structure of the carrier tape of the modified example of the tape and reel shown in FIG. 1 and its sealing portion, and FIG. 16 is a direction along the longitudinal direction of the carrier tape shown in FIG. It is an expanded partial sectional view which shows an example of the structure of a cross section.

  FIG. 17 is a manufacturing process flow chart showing an example of a method for manufacturing a semiconductor device according to an embodiment of the present invention. FIG. 18 is a diagram showing an example of the structure of a taping device used in the method for manufacturing a semiconductor device shown in FIG. FIG. 19 is a partially enlarged perspective view showing an example of the structure of the main part of the heat seal portion of the taping device shown in FIG. 20 is a rear view showing an example of the structure of the heat sealing surface of the sealing iron in the heat sealing portion shown in FIG. 19, and FIG. 21 is used in the semiconductor device manufacturing method according to the modification of the embodiment of the present invention. It is a fragmentary top view which shows an example of the shipment form of a carrier tape.

  The manufacturing method of the semiconductor device according to the present embodiment uses a carrier tape and a cover tape. The carrier tape and the cover tape are provided with moisture-proof measures and improve the peelability of the cover tape.

  First, a tape / reel using a carrier tape and a cover tape will be described. The tape reel 1 shown in FIG. 1 has a cover tape 3 provided with an aluminum layer 3a as shown in FIG. 5 and a plurality of pockets (concave portions) 2a, and is made of a polymer material. It comprises a carrier tape 2 and a reel 4 on which the carrier tape 2 can be wound.

  As shown in FIG. 1 and FIG. 2, the carrier tape 2 is formed with a plurality of pockets 2a which are concave portions arranged at equal intervals. Each pocket 2a is formed in a semiconductor device 5 such as a semiconductor package or a semiconductor chip. Can be accommodated. Each pocket 2a is not formed with a hole for pushing up the product. The semiconductor package may be, for example, a lead frame type semiconductor device 5 having an outer lead or a substrate type semiconductor device 5 having a bump electrode. There may be.

  As shown in FIG. 2, a plurality of sprocket holes 2e, which are guide holes for tape feeding, are formed at equal intervals at one end in the width direction of the carrier tape 2.

  Further, a cover tape 3 for closing the opening of the pocket 2a is joined to the upper surface of the carrier tape 2 after heat sealing. The carrier tape 2 that has been heat-sealed is wound around the reel 4 shown in FIG. 1 and accommodated in the interior box 11 shown in FIG.

  In addition, as shown in FIG. 3, the carrier tape 2 is formed of a single layer made of a polymer material such as polycarbonate (PC), polystyrene (PS), or polyester (PET), for example. For example, it is about 0.3 to 0.5 mm.

  On the other hand, as shown in FIG. 5, the cover tape 3 has a four-layer structure including, for example, a polyester layer 3c, an aluminum layer 3a, a nylon layer 3b, and a polyethylene (PE) layer 3d, and the thickness thereof is, for example, 30 μm. Degree.

  As shown in FIG. 2, a seal portion 6 is formed around each pocket 2a of the carrier tape 2 to which the cover tape 3 is heat-sealed. The seal portion 6 surrounds the pocket 2a. It is formed in a connected state. In the seal part 6, the upper surfaces of the cover tape 3 and the carrier tape 2 are joined by thermocompression bonding. For example, the seal portion 6 is formed so as to be connected substantially along the four sides of the rectangular pocket 2 a, so that the outside air outside the seal portion 6 does not enter the inside of the seal portion 6.

  That is, the pocket 2a, the entire circumference of which is surrounded by the seal portion 6, is in a sealed state, and the semiconductor device 5 accommodated in the pocket 2a does not come into contact with the outside air.

Thus, by enclosing the entire circumference of the pocket 2a of the carrier tape 2 with the seal portion 6 and sealing the pocket 2a, the moisture permeability is 1.5 g / m ² 24 hr (40 ° C., 90% RH) or less (JIS -Z0208).

Therefore, a moisture-proof structure capable of maintaining a moisture-proof environment can be realized in the tape reel 1. Furthermore, since the cover tape 3 has the aluminum layer 3a, it is possible to further enhance the moisture-proof effect and to reliably maintain the moisture permeability at 1.5 g / m ² 24 hr (40 ° C./90% RH) or less. .

  In addition, as shown in the carrier tape 2 of the modification of FIG. 4, in the carrier tape 2, the three-layer structure which consists of the polystyrene layer 2g, the aluminum layer 2f, and the polystyrene layer 2g on both sides of the aluminum layer 2f between the polystyrene layers 2g. It is good. In this case, by combining the cover tape 3 with the aluminum layer 3a, the carrier tape 2 also has the aluminum layer 2f, so that the moisture-proof effect in the tape reel 1 can be further enhanced.

  Further, as shown in the cover tape 3 of the modified example of FIG. 6, the structure may be a four-layer structure including, for example, an inorganic barrier (Inorganic Barrier PET) layer 3e, a polyethylene layer 3d, a nylon layer 3b, and a polyethylene layer 3d. Good. In this case, by combining the carrier tape 2 with a single layer made of a polymer material, the cover tape 3 is also formed of an inorganic material or a polymer material, so that the environmental load can be reduced.・ Reel 1 can be realized.

  Further, as shown in FIG. 2, in the carrier tape 2 in which the cover tape 3 is heat-sealed, the seal portion 6 formed between the pockets 2 a in the row of pockets 2 a arranged in parallel to the peeling direction 7 of the cover tape 3. Is preferably formed so as to gradually spread from the peeling base point 6 a toward the peeling direction 7 of the cover tape 3. That is, the seal portion 6 between the pockets 2 a in the carrier tape 2 shown in FIG. 2 is formed to be curved with respect to the width direction of the carrier tape 2. Therefore, the most protruding end portion in the seal forming direction 14 of the curved seal portion 6 can be set as the peeling base point 6a, and the area of the seal portion 6 gradually increases from the peeling base point 6a toward the peeling direction 7 of the cover tape 3. It is getting bigger.

  Since the seal portion 6 is formed so as to gradually spread from the peeling base point 6a in the peeling direction 7 of the cover tape 3 in this way, the force necessary for peeling off the cover tape 3 is reduced by one point. You can start over and start over a wide area.

  As a result, it is possible to prevent the semiconductor device 5 that is a stored item from jumping out from the pocket 2a due to a large force applied to the carrier tape 2 when the cover tape 3 is peeled off. Therefore, in the tape reel 1, the peelability of the cover tape 3 can be improved.

  Further, it is preferable that the peeling base point 6 a is provided at the center of the seal portion 6 in the width direction of the cover tape 3 so that the force when peeling the cover tape 3 is applied to the carrier tape 2 in a well-balanced manner. The seal forming direction 14 is the direction opposite to the peeling direction 7 of the cover tape 3.

  Further, among the plurality of pockets 2a provided on the carrier tape 2, as shown in FIG. 2, in the adjacent first pocket 2b and second pocket 2c, the center 2d of the first pocket 2b and the seal portion 6 is preferably formed to be longer than the distance (A2) between the center 2d of the second pocket 2c and the center 6b of the seal portion 6. That is, the distance (B) between the center 2d of the first pocket 2b and the center 2d of the second pocket 2c is B = A1 + A2, and A1> A2.

  This is because it is preferable that the outer periphery of the pocket 2a and the seal portion 6 are separated from each other so that the seal portion 6 formed between the pockets 2a is a curved seal portion 6. The distance (C) between the corner portion and the seal portion 6 and the distance (D) between the second pocket 2c and the seal portion 6 are preferably C≈D. If the curved seal portion 6 is formed between the pockets 2a so that C≈D, A1> A2 is necessarily satisfied.

  Since the curved seal portion 6 is formed between the pockets 2a so that A1> A2, the space between the storage pockets as described in JP-A-5-338617 (Patent Document 1) is obtained. It is possible to reduce the distance between the pockets 2a as compared to the case where an X-shaped seal is formed on the top (in the content of Patent Document 1, B = 2 × A1). Thereby, the number of pockets 2a formed per unit length of the carrier tape 2 can be increased. That is, the housing efficiency of the semiconductor device 5 in the carrier tape 2 can be improved.

  The outer periphery of the pocket 2a and the seal portion 6 are preferably separated from each other, but may be in contact with each other in relation to the shape of the seal portion 6.

  Next, a modification of the heat seal mode will be described.

  The seal portion 6 of the modified example shown in FIG. 7 is obtained by heat-sealing the cover tape 3, and the seal portion 6 formed between the pockets 2a is a combination of the linear seal portion 6 and the triangular seal portion 6. It is a thing. W2> W1, and the seal portion 6 formed between the pockets 2a is formed so as to gradually spread from the peeling base point 6a toward the peeling direction 7 of the cover tape 3. As a result, when the cover tape 3 is peeled off, the force necessary for peeling off can be applied from one point, and can be gradually applied over a wide range. As a result, it is possible to prevent the semiconductor device 5 which is the contained material from jumping out from the pocket 2a due to a large force applied to the carrier tape 2 when the cover tape 3 is peeled off, and the peelability of the cover tape 3 can be improved.

  Further, it is preferable that the peeling base point 6 a is provided at the center of the seal portion 6 in the width direction of the cover tape 3 so that the force when peeling the cover tape 3 is applied to the carrier tape 2 in a well-balanced manner.

  The seal portion 6 of the modification shown in FIG. 8 is formed so that the seal portion 6 surrounds the plurality of pockets 2a, and the seal portion 6 is connected around the plurality of pockets 2a. That is, the plurality of pockets 2a are grouped and heat-sealed for each of the plurality of pockets 2a.

  Thereby, compared with the case of heat sealing for each individual pocket 2a, the number of locations of the seal portion 6 is reduced, so that the cover tape 3 can be easily peeled off and the peelability of the cover tape 3 is improved. be able to.

  The seal portion 6 of the modification shown in FIG. 9 is such that the seal portion 6 individually surrounds each pocket 2a and each seal portion 6 is formed in a circular shape. By forming the seal portion 6 in a circular shape, the seal portion 6 is entirely made of a curve, and no corners are formed in the seal portion 6, so that the stress when peeling the cover tape 3 is not evenly concentrated and is almost evenly distributed. As a result, the cover tape 3 can be easily peeled off. That is, the peelability of the cover tape 3 can be improved.

  The seal portion 6 of the modified example shown in FIG. 10 is such that the shape of the seal portion 6 is circular as in FIG. 9, and adjacent circles are connected by a connecting portion 6c by heat sealing. Thereby, since the adjacent circles are connected by the connecting portion 6c by heat sealing, the cover tape 3 can be continuously peeled when the cover tape 3 is peeled off, and the peelability of the cover tape 3 can be improved. .

  The seal part 6 of the modification shown in FIG. 11 is a combination of a linear seal part 6 and a small triangular seal part 6. It is sufficient that E> F and the peeling base point 6 a slightly protrudes from the linear seal portion 6. Furthermore, it is preferable that the peeling base point 6a is one place. Moreover, the seal part 6 of the modification shown in FIG. 12 is a combination of a linear seal part 6 and a small semicircular seal part 6. According to the modification shown in FIG. 11 and FIG. 12, since the sealing area is small, the cover tape 3 can be easily peeled off and the product accommodation efficiency can be improved.

  FIG. 13 shows a modified carrier tape 2 in which a plurality of pockets 2a of the carrier tape 2 are formed in a matrix arrangement, and the pockets in the longitudinal direction of the carrier tape 2 in adjacent pockets 2a. The pitch (H) between the pockets 2a in the width direction is much shorter than the pitch (G) between 2a.

  That is, by arranging the plurality of pockets 2a in a matrix arrangement, more semiconductor devices 5 can be taken out in the matrix arrangement when the amount of the cover tape 3 peeled is the same as in the case of the single row arrangement. it can. Furthermore, the accommodation efficiency per unit length of the carrier tape 2 can be improved by making the pitch between the pockets 2a in the width direction as small as possible in the matrix arrangement.

  Also, in handling of a product (semiconductor device 5 or the like) take-out device (mounting device) at the time of product take-off, by reducing the pitch between the pockets 2a in the width direction of the carrier tape 2 as much as possible, waste in handling is avoided. The handling time can be improved by shortening the time required.

  In the modification shown in FIG. 14, a barcode 13 indicating information on a product (semiconductor device 5) is printed on the surface of the cover tape 3. That is, information for each product (for example, lot number, heat-resistant temperature, etc.) is printed on the surface of the cover tape 3 with a barcode 13, and this information is read at the time of product mounting to obtain product information. Recognize and implement.

  As a result, the product can be mounted after confirming the holding period of the product, and can be used very effectively as the moisture-proof tape / reel 1.

  In the modification shown in FIG. 15, a mu chip 8, which is a small semiconductor chip, is embedded in the carrier tape 2. As shown in FIG. 16, the muchip 8 is embedded in, for example, an empty area between the pockets 2 a of the carrier tape 2. Note that the muchip 8 has a memory circuit, and information (lot number, etc.) of the product (semiconductor device 5) is stored in the memory circuit. In addition, the muchip 8 may be embedded in the carrier tape 2 when the cover tape 3 is heat sealed, or may be embedded when the carrier tape 2 is molded.

  Next, a method for manufacturing the semiconductor device of the present embodiment will be described.

  First, as shown in step S1 of FIG. 17, a tray 9 containing a product such as the semiconductor device 5 is prepared.

  On the other hand, a tape reel 1 having a plurality of pockets 2a arranged side by side and a carrier tape 2 made of a polymer material such as polycarbonate (PC), a cover tape 3 provided with an aluminum layer 3a, and a reel 4 is provided. prepare. The carrier tape 2 is empty and does not contain anything in each pocket 2a.

  Thereafter, the tray 9, the empty carrier tape 2, the cover tape 3, and the reel 4 are set on the taping device 10.

  As shown in FIG. 18, the taping device 10 performs thermocompression bonding with a delivery reel 10 a that sends out an empty carrier tape 2, a take-up reel 10 b that takes up the carrier tape 2 after heat sealing, and a heat sealing portion 10 f. A seal iron 10c is provided.

  Then, the accommodation shown in step S2 is performed. Here, the semiconductor device 5 is accommodated in the pocket 2 a of the carrier tape 2. That is, the semiconductor device 5 is picked up from the tray 9 and transferred to the pocket 2 a of the carrier tape 2.

  Thereafter, taping shown in step S3 is performed. That is, as shown in FIG. 19, the cover tape 3 is heat-sealed on the upper surface of the carrier tape 2 by performing thermocompression bonding with the seal iron 10c. At that time, heat sealing is performed around the pocket 2a so that the seal portion 6 formed by heat sealing surrounds the pocket 2a.

  For example, when the curved seal portion 6 is formed between the pockets 2a, the heat sealing surface 10d of the seal iron 10c has a curved shape for forming the curved seal portion 6 as shown in FIG. A projection 10e including the same is formed. Therefore, the curved seal portion 6 can be formed between the pockets 2a by pressing the protrusion 10e of the heat seal surface 10d from the cover tape 3 during heat sealing. Note that the carrier tape 2 is fed by the pitch for each heat seal corresponding to the pitch of the adjacent pockets 2a and heat sealed with a seal iron 10c.

  Therefore, by forming the horizontal protrusions 10g parallel to the tape feed direction of the protrusions 10e of the seal iron 10c sufficiently longer than the pitch, the tape feed direction can be achieved by heat sealing each time of the seal iron 10c. It is possible to heat-seal by overlapping the seal portions 6 parallel to each other. As a result, heat sealing can be performed so that the seal portion 6 is reliably connected around each pocket 2a.

  Thereafter, the winding shown in step S4 is performed. That is, the carrier tape 2 that has been heat-sealed is taken up on a take-up reel 10b (reel 4) to complete the tape reel 1 containing the semiconductor device 5.

  Then, the packing shown in step S5 is performed. Here, the tape / reel 1 is put in the interior box 11 and packed. Thereafter, the shipment shown in step S6 is performed.

  In the modification shown in FIG. 21, for example, the cover tape 3 is heat-sealed with respect to the carrier tape 2 in which the bare chip 12 is accommodated in the pocket 2a, and after the heat sealing, cutting is performed for each of a plurality of predetermined pockets 2a. The carrier tape 2 is cut by means (for example, scissors) 15 and the cut carrier tape 2 is packed and shipped. That is, the carrier tape 2 is divided into regions each having a plurality of pockets 2a, and the state of the separated carrier tape 2 is shipped as a shipment form.

  Thereby, according to the request number of a customer, it can cut | disconnect and ship in a request number unit. Furthermore, since simple packaging is possible rather than tray packaging, transportation costs can be greatly reduced.

  According to the manufacturing method of the semiconductor device of the present embodiment, in the tape / reel 1, at least the cover tape 3 has the aluminum layer 3a, and the seal portion 6 by heat sealing between the carrier tape 2 and the cover tape 3 has the pocket 2a. By surrounding and connecting, the moisture-proof environment can be maintained in the state of the tape reel 1.

  Furthermore, since the moisture-proof environment can be maintained in the state of the tape / reel 1, the tape / reel 1 can be stored and packed in the interior box 11 as it is, and can be shipped with simple packaging. become.

  In addition to the cover tape 3, the carrier tape 2 also has the aluminum layer 2f, so that the moisture-proof environment in the tape reel 1 can be further strengthened.

  Furthermore, since the moisture-proof environment can be maintained with the tape reel 1, the use of the moisture-proof bag can be abolished, and the mounting conditions can be eliminated after the moisture-proof bag is opened. That is, it is possible to eliminate the time restriction for mounting after opening the moisture-proof bag.

  In addition, since the seal portion 6 of the carrier tape 2 is connected so as to surround the pocket 2a, the moisture-proof effect of the product remaining on the carrier tape 2 is not lowered even when a necessary number of products are taken out. The reel 1 can be stored.

  Further, it is possible to reduce the number of parts of moisture-proof packing materials such as moisture-proof bags, silica gel, and indicator cards, and to reduce packing costs and work costs. As a result, cost reduction can be achieved in maintaining the moisture-proof environment of the tape / reel 1. Furthermore, since simple packaging can be realized, packaging that does not give a load to the environment can be realized.

  Further, since the moisture-proof bag can be eliminated, it is possible to eliminate the deaeration work, and it is possible to eliminate the defective potential such as the deformation of the reel caused by the deaeration work.

  Further, since the moisture-proof environment can be maintained with the tape / reel, the mounting device for taking out the product (semiconductor device) from the tape / reel 1 can be downsized, thereby improving the space efficiency. it can.

  Further, by attaching the barcode 13 or the muchip 8 in which the product information is written to the cover tape 3 or the carrier tape 2, the individual product information can be traced.

  Although the invention made by the present inventor has been specifically described based on the embodiments of the invention, the present invention is not limited to the embodiments of the invention, and various modifications can be made without departing from the scope of the invention. It goes without saying that it is possible.

  For example, the semiconductor device 5 accommodated in the pocket 2a described in the above embodiment may be a lead frame type such as QFP (Quad Flat Package) or QFN (Quad Flat Non-leaded Package), or BGA (Ball Grid). It may be a substrate type such as Array) or LGA (Land Grid Array), and may be a bare chip 12 or the like.

  The present invention is suitable for an electronic component housing technique using a carrier tape.

FIG. 3 is a side view and an enlarged partial cross-sectional view showing a partially broken example of the structure of the tape / reel used in the method of manufacturing a semiconductor device according to the embodiment of the present invention. It is the elements on larger scale which show the structure of the carrier tape of a tape reel shown in FIG. 1, and a seal part. It is sectional drawing which shows an example of the structure of the base material of the carrier tape in the tape reel shown in FIG. It is sectional drawing which shows the modification of the structure of the base material of the carrier tape in the tape reel shown in FIG. It is sectional drawing which shows an example of the structure of the base material of the cover tape in the tape reel shown in FIG. It is sectional drawing which shows the modification of the structure of the base material of the cover tape in the tape reel shown in FIG. It is a partial top view which shows the structure of the carrier tape of a tape reel shown in FIG. 1, and the seal part of a modification. It is a partial top view which shows the structure of the carrier tape of a tape reel shown in FIG. 1, and the seal part of a modification. It is a partial top view which shows the structure of the carrier tape of a tape reel shown in FIG. 1, and the seal part of a modification. It is a partial top view which shows the structure of the carrier tape of a tape reel shown in FIG. 1, and the seal part of a modification. It is the fragmentary top view and enlarged plan view which show the structure of the carrier tape of a tape reel shown in FIG. 1, and the seal part of a modification. It is an enlarged plan view which shows the seal part of the modification in the carrier tape of the tape reel shown in FIG. It is a partial top view which shows the structure of the carrier tape of the modification in the tape reel shown in FIG. 1, and its seal part. It is a partial top view which shows the structure of the carrier tape of the modification in the tape reel shown in FIG. 1, and its seal part. It is a partial top view which shows the structure of the carrier tape of the modification in the tape reel shown in FIG. 1, and its seal part. FIG. 16 is an enlarged partial cross-sectional view showing an example of a cross-sectional structure in a direction along the longitudinal direction of the carrier tape shown in FIG. 15. It is a manufacturing process flowchart which shows an example of the manufacturing method of the semiconductor device of embodiment of this invention. FIG. 18 is a schematic configuration diagram illustrating an example of a structure of a taping device used in the method for manufacturing the semiconductor device illustrated in FIG. 17. It is a partial expansion perspective view which shows an example of the structure of the principal part of the heat seal part of the taping apparatus shown in FIG. It is a back view which shows an example of the structure of the heat seal surface of the sealing iron in the heat seal part shown in FIG. It is a fragmentary top view which shows an example of the shipment form of the carrier tape used with the manufacturing method of the semiconductor device of the modification of embodiment of this invention.

Explanation of symbols

1 Tape / Reel 2 Carrier Tape 2a Pocket (recess)
2b First pocket (first recess)
2c Second pocket (second recess)
2d Center 2e Sprocket hole 2f Aluminum layer 2g Polystyrene layer 3 Cover tape 3a Aluminum layer 3b Nylon layer 3c Polyester layer 3d Polyethylene layer 3e Inorganic barrier layer 4 Reel 5 Semiconductor device 6 Sealing part 6a Peeling base point 6b Center 6c Connecting part 7 Peeling direction 8 Muchip (semiconductor chip)
DESCRIPTION OF SYMBOLS 9 Tray 10 Taping apparatus 10a Delivery reel 10b Take-up reel 10c Sealing iron 10d Heat seal surface 10e Projection part 10f Heat seal part 10g Horizontal projection part 11 Inner box 12 Bare chip 13 Bar code 14 Seal formation direction 15 Cutting means

Claims (19)

(A) a step of preparing a tape reel having a plurality of recesses, a carrier tape made of a polymer material, and a cover tape provided with an aluminum layer;
(B) receiving a semiconductor device in the recess of the carrier tape;
(C) heat sealing the carrier tape and the cover tape around the recess;
(D) winding the carrier tape around the reel,
A method of manufacturing a semiconductor device, wherein a seal portion formed by the heat seal is connected to surround the recess.   2. The method of manufacturing a semiconductor device according to claim 1, wherein the seal portion surrounds and connects the plurality of recesses.   2. The method of manufacturing a semiconductor device according to claim 1, wherein the seal portion formed between the recesses of the recess array arranged in parallel with the peeling direction of the cover tape peels toward the peeling direction of the cover tape. A method of manufacturing a semiconductor device, wherein the semiconductor device is formed so as to gradually spread from a base point.   2. The method of manufacturing a semiconductor device according to claim 1, wherein a center of the first recess and a center of the seal portion are adjacent to each other in the first recess and the second recess among the plurality of recesses of the carrier tape. Is longer than the distance between the center of the second recess and the center of the seal portion.   2. The method of manufacturing a semiconductor device according to claim 1, wherein a plurality of the recesses are formed in a matrix arrangement on the carrier tape, and the adjacent recesses are wider than a pitch between the recesses in the longitudinal direction of the carrier tape. A method of manufacturing a semiconductor device, wherein a pitch between concave portions in a direction is shorter.   2. The method of manufacturing a semiconductor device according to claim 1, wherein the seal portion is formed in a circular shape.   2. The method of manufacturing a semiconductor device according to claim 1, wherein the recess is formed in a quadrangle, and the seal portion is formed along a side of the quadrangle of the recess. .   2. The method of manufacturing a semiconductor device according to claim 1, wherein the carrier tape has an aluminum layer.   2. The method of manufacturing a semiconductor device according to claim 1, wherein the carrier tape includes a semiconductor chip having a memory circuit. (A) preparing a tape reel having a carrier tape provided with a plurality of recesses and a cover tape provided with an aluminum layer;
(B) receiving a semiconductor device in the recess of the carrier tape;
(C) heat sealing the carrier tape and the cover tape around the recess;
(D) winding the carrier tape around the reel,
The seal portion formed by the heat seal is formed in a state of being connected so as to surround the recess, and the seal portion formed between the recesses of the recess rows arranged in parallel to the peeling direction of the cover tape is A method of manufacturing a semiconductor device, wherein the cover tape is formed so as to gradually spread from a peeling base point in the peeling direction of the cover tape.   11. The method of manufacturing a semiconductor device according to claim 10, wherein the seal portion is connected so as to surround the plurality of recesses.   11. The method of manufacturing a semiconductor device according to claim 10, wherein, among the plurality of recesses of the carrier tape, the first recess and the second recess that are adjacent to each other, the center of the first recess and the center of the seal portion. Is longer than the distance between the center of the second recess and the center of the seal portion.   11. The method of manufacturing a semiconductor device according to claim 10, wherein a plurality of the recesses are formed in a matrix arrangement on the carrier tape, and the adjacent recesses are wider than a pitch between the recesses in the longitudinal direction of the carrier tape. A method of manufacturing a semiconductor device, wherein a pitch between concave portions in a direction is shorter.   11. The method of manufacturing a semiconductor device according to claim 10, wherein the seal portion is formed in a circular shape. (A) preparing a tape reel having a carrier tape provided with a plurality of recesses and a cover tape provided with an aluminum layer;
(B) receiving a semiconductor device in the recess of the carrier tape;
(C) heat sealing the carrier tape and the cover tape around the recess;
(D) winding the carrier tape around the reel,
A seal portion is formed around the concave portion by the heat seal, and the first concave portion and the second concave portion adjacent to each other among the plurality of concave portions of the carrier tape, and the center of the first concave portion The semiconductor device manufacturing method, wherein a distance between the centers of the seal portions is longer than a distance between the center of the second recess and the center of the seal portions.   16. The method of manufacturing a semiconductor device according to claim 15, wherein the sealing portion surrounds and connects the plurality of recesses.   16. The method of manufacturing a semiconductor device according to claim 15, wherein the seal portion formed between the recesses of the recess row arranged in parallel with the peeling direction of the cover tape is peeled toward the peeling direction of the cover tape. A method of manufacturing a semiconductor device, wherein the semiconductor device is formed so as to gradually spread from a base point.   16. The method of manufacturing a semiconductor device according to claim 15, wherein the seal portion is formed in a circular shape. (A) a step of preparing a carrier tape made of a polymer material provided with a plurality of recesses and a cover tape provided with an aluminum layer;
(B) receiving a semiconductor device in the recess of the carrier tape;
(C) heat sealing the carrier tape and the cover tape around the recess;
(D) cutting the carrier tape for each of a plurality of predetermined recessed regions;
(E) packing and shipping the cut carrier tape, and manufacturing the semiconductor device.