JP2006220439A - Scintillator panel, device for detecting radiation, and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve a problem wherein when a phosphor layer is removed or repaired, a phosphor protective layer is difficult to be removed from a sensor panel or a support substrate. <P>SOLUTION: The radiation detection system comprises the phosphor layer 7 which is placed on at least pixel area of the sensor panel having the pixel area comprising a plurality of photoelectric conversion elements 2 arranged in a matrix and converts radiation into light detectable with the photoelectric conversion elements, a phosphor protective member 12 having a non-adhesive surface which covers at least part of the surface of the sensor panel outside the pixel area or part of the surface of a support member and the surface and side of the phosphor layer collectively, and an adhesive member 8 placed between part of the surface of the sensor panel outside the pixel area or part of the surface of the support member and the phosphor protective member. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a scintillator panel, a radiation detection apparatus, a manufacturing method thereof, and a radiation imaging system used for medical diagnostic equipment, non-destructive inspection equipment, and the like, and more particularly to a scintillator panel, radiation detection equipment, and radiation used for X-ray photography. The present invention relates to an imaging system. In the present specification, description will be made assuming that the category of radiation includes electromagnetic waves such as X-rays and γ-rays.

  In recent years, digital radiation detection devices in which a phosphor layer that emits light by irradiating X-rays on the surface of a photoelectric conversion element formed on at least a large area plane has been commercialized.

  Among these digital radiation detection devices, as disclosed in Patent Document 1, as a highly sensitive and sharp device, a photoelectric conversion element portion in which a plurality of electric elements such as photosensors and TFTs are two-dimensionally arranged A radiation detector (“direct vapor deposition type” or “direct vapor deposition type”) that directly forms a phosphor layer for converting radiation into light that can be detected by a photoelectric conversion element on a photodetector (also referred to as “sensor panel”). Also known as "direct type").

  FIG. 9 is a schematic cross-sectional view of a direct type radiation detection apparatus described in Patent Document 1. In FIG. 9, 101 is a glass substrate, 102 is a photoelectric conversion element portion comprising a photosensor and TFT using amorphous silicon, 103 is a wiring portion, 104 is an electrode extraction portion (electrode pad portion), 105 is silicon nitride or the like. A passivation film is shown, and the sensor panel 106 is constituted by these elements. A phosphor layer (scintillator layer) 107 is formed on the sensor panel 106 so as to correspond to the photoelectric conversion element portion 103. Further, a phosphor protective layer 109 is formed so as to cover the upper surface and side surfaces of the scintillator layer 107 and to be in contact with the surface of the sensor panel 106. Furthermore, a reflective layer 110 is provided on the phosphor protective layer 109 so as to reflect the light emitted from the phosphor layer 107 toward the photoelectric conversion element unit 102, and further, the reflective layer protection for protecting the reflective layer 110. A layer 111 is provided. In addition, a sealing resin 113 is provided on the end surface of the protective member 112 that is in contact with the sensor panel 106 and includes the phosphor protective layer 109, the reflective layer 110, and the reflective layer protective layer 111.

  Further, as disclosed in Patent Document 2 and the like, a plurality of photosensors and electrical elements such as TFTs (Thin Film Transistors) are arranged on a photodetector including a photoelectric conversion element portion that is two-dimensionally arranged. , A radiation detection device (also referred to as “bonding type” or “indirect type”) formed by bonding a scintillator panel in which a phosphor layer for converting radiation into light that can be detected by a photoelectric conversion element is formed on a support substrate It has been known.

FIG. 10 is a schematic cross-sectional view of the indirect type radiation detection apparatus described in Patent Document 2. In FIG. 10, a phosphor layer (scintillator layer) 107 is provided on the surface side of the support substrate 115 on which the reflective layer 110 and the reflective layer protective layer (phosphor base layer) 114 are provided. Further, a phosphor protective layer 109 is provided so as to cover the surface and side surfaces of the phosphor layer 107 and the support substrate 115, thereby forming a scintillator panel 116. The scintillator panel 116 on the side where the phosphor layer 107 is formed and the sensor panel 106 are bonded together via an adhesive (not shown) to form a radiation detection apparatus. As the phosphor protective layer 109, an organic film such as polyparaxylylene resin is preferably used.
JP 2000-284053 A JP 2000-356679 A

  However, in the direct type radiation detection apparatus as described in Patent Document 1, when a defect occurs in the phosphor layer 107 when the phosphor layer 107 is formed on the sensor panel 106, the defect defect portion is fluorescent. Even the body layer 112 alone is disposed as a defective product for each sensor panel 100. In particular, a phosphor layer having a columnar crystal structure composed of alkali halides such as CsI: Na and CsI: Tl formed by vapor deposition has abnormal growth (splash) defects when the phosphor layer is formed. There is a case. For this reason, the yield in the manufacturing process of the radiation detection apparatus is reduced, and the cost of the radiation detection apparatus is increased.

  Further, in the indirect type radiation detection apparatus as described in Patent Document 2, defects in the phosphor layer 107, particularly abnormal growth (splash) defects that may occur in the phosphor layer 107 having a columnar crystal structure. When this occurs, there is a risk that the defective portion may compress or damage the photoelectric conversion element portion 102 or the wiring portion 103, and may further destroy the photoelectric conversion element portion 102.

  In order to solve the above-mentioned problems, it is required to remove or repair the phosphor layer 107 in which abnormal growth (splash) defects have occurred. For that purpose, the phosphor protective layer 109 is replaced with the phosphor layer 107 and the sensor panel. 106 or the supporting substrate 115 must be peeled off. However, since the phosphor protective layer 109 described in Patent Document 1 and Patent Document 2 uses an organic film made of polyparaxylylene formed by a CVD method, the phosphor layer 107 having a columnar crystal is used. It is formed to be fixed so as to enter between the crystals on the upper surface. For this reason, when the phosphor protective layer 109 is peeled off, the phosphor layer 107 is destroyed, and the peeling of the phosphor protective layer 109 and the repair of the phosphor layer 107 are accompanied with great difficulty. In particular, in the direct type radiation detection apparatus as described in Patent Document 1, the broken crystal of the phosphor layer 107 adheres to the electrode extraction unit 104 provided in the peripheral region of the sensor panel 106, and The sensor panel 106 may be destroyed.

  As a result of intensive studies to solve the above problems, the present inventor has come up with various aspects of the invention described below.

  A first radiation detection apparatus according to the present invention includes a sensor panel having a pixel region composed of a plurality of photoelectric conversion elements arranged two-dimensionally, and radiation disposed on at least the pixel region of the sensor panel. Non-adhesiveness that collectively covers a phosphor layer that converts light that can be sensed by the photoelectric conversion element, a part of the surface of the sensor panel outside the pixel region, and a surface and side surfaces of the phosphor layer. A phosphor protective member having a surface; and an adhesive member disposed between a part of the surface of the sensor panel outside the pixel region and the phosphor protective member.

  A second radiation detection apparatus according to the present invention includes a sensor panel having a pixel region composed of a plurality of photoelectric conversion elements arranged two-dimensionally, a phosphor layer formed on a support member, and at least the support member A phosphor protective layer having a non-adhesive surface that collectively covers a part of the surface of the phosphor layer and the surface and side surfaces of the phosphor layer; and between the part of the surface of the support member and the phosphor protective layer A scintillator panel having an arranged adhesive member.

  A scintillator panel according to the present invention has a phosphor layer formed on a support member, and a non-adhesive surface that collectively covers at least a part of the surface of the support member and the surface and side surfaces of the phosphor layer. A phosphor protective layer; and an adhesive member disposed between a part of the surface of the support member and the phosphor protective layer.

  The manufacturing method of the radiation detection apparatus according to the present invention includes a step of preparing a sensor panel having a pixel region composed of a plurality of photoelectric conversion elements arranged two-dimensionally, and radiation is applied to at least the pixel region of the sensor panel. A step of providing a phosphor layer that converts light that can be sensed by the photoelectric conversion element, a part of the surface of the sensor panel at least outside the pixel region, and the surface and side surfaces of the phosphor layer are non-adhesive. A step of covering in a lump using a phosphor protective member having a surface and adhering a part of the surface of the sensor panel outside the pixel region and the phosphor protective member with an adhesive member.

  The method of manufacturing a scintillator panel according to the present invention includes a step of providing a phosphor layer on a support member that converts radiation into light that can be sensed by the photoelectric conversion element, and at least the phosphor layer of the support member is provided. A part of the surface and the surface and side surfaces of the phosphor layer are collectively covered with a phosphor protective layer having a non-adhesive surface, and the part of the surface of the supporting member and the phosphor are protected. Adhering the layer with an adhesive member.

  According to the present invention, the phosphor protective member having a non-adhesive surface covers the phosphor layer surface, side surfaces, and the protective layer that is the base, and is provided in an area around the phosphor protective member. Since the structure bonded to the protective layer by the member is used, the phosphor protective member can be easily installed and peeled off. This makes it possible to arrange a phosphor protective member that ensures the moisture resistance and impact resistance of the phosphor layer and that allows easy repair of the phosphor layer. Moreover, it becomes easy to peel off the phosphor protective member without destroying the phosphor layer when repairing the phosphor layer. Therefore, it is possible to obtain a configuration in which the phosphor layer after the phosphor protective member is provided can be easily inspected and the phosphor layer discovered by the inspection can be repaired.

  Further, according to the present invention, the phosphor protective layer having a non-adhesive surface covers the surface, side surfaces, and phosphor underlayer of the phosphor layer, and is provided in a region around the phosphor protective layer. Since the configuration in which the phosphor base layer is adhered by the adhesive member is used, the phosphor protective layer can be easily installed and peeled off. This makes it possible to dispose a phosphor protective layer that ensures the moisture resistance and impact resistance of the phosphor layer and allows easy repair of the phosphor layer. Further, it becomes easy to peel off the phosphor protective layer without destroying the phosphor layer when repairing the phosphor layer. Therefore, it is possible to obtain a configuration in which the phosphor layer after the phosphor protective layer is provided can be easily inspected and the phosphor layer discovered by the inspection can be repaired.

  The best mode for carrying out the present invention will be described below in detail with reference to the drawings.

  FIG. 1 is a schematic plan view showing the main configuration of the radiation detection apparatus according to the first embodiment of the present invention. FIG. 2 is a schematic cross-sectional view showing the main configuration of the radiation detection apparatus according to the first embodiment of the present invention. FIG. 3 is a schematic cross-sectional view showing the method for manufacturing the radiation detection apparatus according to the first embodiment of the present invention. FIG. 4 is a schematic cross-sectional view showing a method for repairing a radiation detection apparatus according to the first embodiment of the present invention. FIG. 5 is a schematic cross-sectional view showing the main configuration of a scintillator panel and a radiation detection apparatus according to the second embodiment of the present invention. FIG. 6 is a schematic cross-sectional view showing a scintillator panel repairing method according to the second embodiment of the present invention. FIG. 7: is a schematic sectional drawing which shows the principal part structure of the radiation detection apparatus which concerns on the other Example in the 1st Embodiment of this invention. FIG. 8 is a schematic cross-sectional view illustrating a method for repairing a radiation detection apparatus according to another example of the first embodiment of the present invention.

<First Embodiment>
The radiation detection apparatus according to the first embodiment of the present invention will be described in detail with reference to FIGS. 1 and 2.

  1 and 2, 1 is an insulating substrate such as a glass substrate, 2 is a photosensor that is two-dimensionally arranged on the insulating substrate 1 to form a pixel region, and uses amorphous silicon. And a photoelectric conversion element portion corresponding to a pixel composed of TFT. Reference numeral 3 denotes a wiring part formed on the insulating substrate 1 and connected to the photoelectric conversion element part 2, and 4 denotes an electrode extraction part (electrode pad part) connected to the wiring part 3. Reference numeral 5 denotes a protective layer composed of a protective film made of silicon nitride or the like for covering the photoelectric conversion element portion 2 and the wiring portion, and a passivation film made of an organic resin or the like for covering the protective film. Each of these elements 1 to 5 constitutes a sensor panel (also referred to as “two-dimensional photodetector”, “photoelectric conversion panel”, etc.) 6. Reference numeral 7 denotes a phosphor layer that is a wavelength conversion body that is disposed on the protective layer 5 corresponding to the pixel region of the sensor panel 6 and converts radiation into light that can be sensed by the photoelectric conversion element unit 2. Reference numeral 9 denotes a fluorescent material protective layer for covering the fluorescent material layer 7 to protect the fluorescent material layer 7 from moisture and impact from the outside, and reference numeral 10 denotes light emitted from the fluorescent material layer 8 to the photoelectric conversion element portion 2. Reference numeral 11 denotes a reflection layer for protecting the reflection layer 10. These elements 9 to 11 constitute a phosphor protective sheet. Reference numeral 8 denotes a phosphor protective layer 9 or a phosphor protective sheet on a region around the region where the phosphor layer 7 is formed in the base member (the protective layer 5 in this embodiment) on which the phosphor layer 7 is formed. It is an adhesive member for bonding. The phosphor protective member 12 is constituted by the phosphor protective sheet and the adhesive member 8 provided in the peripheral region.

  Next, each component will be described in detail. The insulating substrate 1 is preferably a glass substrate, but other insulating substrate materials such as a plastic substrate may be used. The photoelectric conversion element unit 2 is a pixel that is provided on the glass substrate 1 and includes a photosensor (photoelectric conversion element) and a switch element. As the photosensor, a PIN photodiode formed of amorphous silicon or the like, an MIS photosensor, or the like is preferably used. As the switch element, a thin film transistor (TFT) formed of amorphous silicon or polysilicon is preferably used. The wiring part 3 is preferably made of a metal material such as Al. The electrode lead-out part 4 is formed of the same material as that of the wiring part 3, and the wiring part 3 exposed by removing the protective layer 5 is preferably used. Moreover, it is preferable that the electrode extraction part 4 is provided in the peripheral region of the sensor panel 6. The protective film constituting the protective layer 5 covers and protects the photoelectric conversion element portion 2 and the wiring portion 3, and a material that transmits light emitted from the phosphor layer 8 is preferably used. For example, it is formed of an inorganic material such as silicon nitride or silicon oxide. The passivation film constituting the protective layer 5 is used to cover the protective film and flatten the surface shape on the protective film affected by the photoelectric conversion element portion 2 and the wiring portion 3. Transparent organic resins such as polyimide, acrylic, modified acrylic resin, polysulfone, polyarylate, polycarbonate, polybutylene terephthalate, and polyethylene terephthalate are preferably used.

The phosphor layer 7 is preferably made of a material that emits light that can be sensed by the photoelectric conversion element portion 2 by radiation such as X-rays, and is composed of particulate crystals typified by Gd ₂ O ₂ S: Tb and a binder resin. A scintillator having a columnar crystal structure typified by CsI: Tl is preferably used. Particularly, a scintillator made of an alkali halide: activator having a columnar crystal structure that emits light in a wavelength region that is favorably absorbed by a photosensor made of amorphous silicon is preferably used. In addition to CsI: Tl, CsI: Na, NaI: Tl, LiI: Eu, KI: Tl, etc. are preferably used.

  The adhesive member 8 is preferably made of a material that can be bonded in a vacuum state and can be easily peeled off for repair. For example, hot melt type thermoplastic adhesives, thermosetting adhesives, rubber adhesives, etc., pressure sensitive (adhesive type) acrylic thermoplastic adhesives, rubber adhesives, etc. are preferably used. In particular, an adhesive resin such as a hot-melt thermoplastic adhesive, a thermosetting adhesive, or a rubber-based adhesive that loses adhesiveness when heated is desirable. Here, the simple peeling means that it can be peeled off due to an effect that does not cause unnecessary damage to the components other than the adhesive member 8 when peeling.

  The fluorescent substance protective layer 9 collects the area | region around the area | region in which the fluorescent substance layer 7 was formed in the protective layer 5 used as the base | substrate on which the fluorescent substance layer 7 surface 7a, side surface 7b, and fluorescent substance layer 7 are formed It is provided with a cover. However, the surface of the phosphor protective layer 9 does not have adhesiveness, and the phosphor layer 7 and the protective layer 5 are not adhered. Adhesion between the phosphor protective layer 9 and the protective layer 5 is ensured by the adhesive member 8. In this way, the surface 7a, the side surface 7b of the phosphor layer 7 and the surrounding areas of the protective layer 5 are collectively covered with the phosphor protective layer 9 having no adhesiveness, and the phosphor protective layer 9 and the phosphor protective layer 9 are protected. By adopting a configuration in which the layer 5 is adhered by the adhesive member 8, it is possible to ensure the moisture resistance and impact resistance of the phosphor layer 7 and to easily peel the phosphor protective layer 9 from the phosphor layer 7. It becomes. The phosphor protective layer 9 is required to be a sheet-like member that is a non-adhesive surface and is flexible enough to cover the surface 7 a, the side surface 7 b, and the protective layer 5 of the phosphor layer 7. Here, with regard to flexibility, for example, when it has flexibility to follow the minute surface shape of the phosphor layer 7 such as between columnar crystals in a phosphor layer such as CsI: Tl having a columnar crystal structure, the phosphor is protected. This is not preferable because the structure of the phosphor layer 7 may be destroyed when the layer 9 is peeled off. In the present invention, the phosphor protective layer 9 is not covered with fine concave portions on the surface 7a of the phosphor layer 7, and a part of fine convex portions on the surface 7a of the phosphor layer 7 and a part of the side surface 7b. And the softness | flexibility by which at least one part of the protective layer 5 used as a foundation | substrate is coat | covered is calculated | required. Examples of the material for the phosphor protective layer 9 that satisfies the above characteristics include polyesters such as polyethylene terephthalate (hereinafter abbreviated as PET), acrylic resins, acrylonitrile-butadiene-styrene copolymers (hereinafter abbreviated as ABS), cellulose, epoxy resins, Fluorine resin, polyamide, polycarbonate, polyimide, polypropylene, polyurethane, silicone, vinyl polymer, vinyl copolymer and the like are preferably used. Moreover, as thickness of the fluorescent substance protective layer 9 which satisfy | fills the said characteristic, 10-50 micrometers is desirable.

  The reflection layer 10 provided on the phosphor protective layer 9 for reflecting the light emitted from the phosphor layer 7 to the sensor panel 7 reflects the light from the phosphor layer 7 and prevents moisture from the outside. Materials that prevent intrusion are desirable, and metallic materials are particularly desirable. Specifically, metals having high reflectivity such as Al, Ag, Cr, Cu, Ni, Ti, Mg, Rh, Pt, and Au are desirable. The phosphor protective layer 9 may be bonded using an adhesive (not shown), or may be formed on the phosphor protective layer 9 by vapor deposition.

  A resin material such as polyethylene terephthalate is preferably used for the reflective layer protective layer 11 laminated on the reflective layer 10 for the purpose of protecting rigidity. A phosphor protective member 12 is configured by the phosphor protective layer 9, the reflective layer 10, the reflective layer protective layer 11, and the adhesive member 8.

  Here, in the above description, the phosphor protective layer 9 has been described as ensuring the moisture resistance and impact resistance of the phosphor layer 7, but the reflective layer 10 has high moisture resistance and impact resistance. If the phosphor protective member 12 has moisture resistance and impact resistance, it is not necessary to ensure the moisture resistance and impact resistance as the phosphor protective layer 9. In that case, as the phosphor protective member 12, at least a member having a laminated structure of the phosphor protective layer 9 and the reflective layer 10 may have the characteristics required for the phosphor protective layer 9 described above. In that case, the material and thickness of the reflective layer 10 as well as the material and thickness of the phosphor protective layer 7 affect the flexibility of the phosphor protective member 12. In order to ensure the flexibility required for the phosphor protection member 12, it is desirable that the thickness of the entire phosphor protection member 12 excluding the adhesive member 8 is 10 to 200 μm.

  Next, the manufacturing method of the radiation detection apparatus according to the first embodiment of the present invention will be described in detail with reference to FIGS.

  A plurality of photoelectric conversion element portions 2 are two-dimensionally formed on the surface of the insulating substrate 1 to form a pixel region, and a wiring portion 3 is formed. Next, a protective film is formed by covering the photoelectric conversion element portion 2 and the wiring portion 3, and further a passivation film is formed on the protective film to form a protective layer 5, thereby protecting the region that becomes the electrode extraction portion 4. The layer 5 is removed to provide an electrode extraction portion 4. The sensor panel 6 is formed by the above process. A phosphor layer 7 made of CsI: Tl having a columnar crystal structure is deposited and formed on a region including the pixel region of the sensor panel 6 formed as described above by a known vapor deposition method. And the fluorescent substance protective member comprised by the fluorescent substance protective sheet which consists of the fluorescent substance protective layer 9, the reflection layer 10, and the reflective layer protective layer 11 formed in the sheet form, and the adhesive member 8 provided in the peripheral region 12 is prepared (FIG. 3A).

  Next, the prepared phosphor protection member 12 is disposed on the sensor panel 6 and the phosphor layer 7 so as to cover the entire surface 7a of the phosphor layer 7 (FIG. 3B).

  Next, the panel in the above state is placed on the lower support base 25 in the vacuum chamber 26 of the vacuum chamber 20 which is a bonding apparatus, and the vacuum chamber 26 is brought into a vacuum state. Here, the vacuum chamber 20 includes a lower chamber 21, an upper chamber 22, a diaphragm 23, an O-ring seal 24, a lower support base 25, a vacuum chamber 26, and a pressurizing chamber 27 (FIG. 3C).

  Next, in the above state, when the pressure in the pressurizing chamber 27 is increased, the diaphragm 23 presses the surface of the phosphor protective member 12 on the reflective layer protective layer 11 side, and the phosphor protective layer 9 and the phosphor layer 7 The front surface 7 a, the side surface 7 b, and the protective layer 5 are covered, and the adhesive member 8 is further adhered to the protective layer 5. Thereby, the state by which the fluorescent substance layer 7 was interrupted | blocked from external air can be obtained (FIG.3 (d)). Thereafter, the pressurization of the pressurizing chamber 27 is stopped, the vacuum chamber 26 is opened and taken out, and a radiation detection apparatus is obtained. Here, when an adhesive resin of a hot melt type thermoplastic adhesive is used for the adhesive member 8, it is preferable to provide a heating means. In that case, the lower support base 25 may have a heating means.

  Here, in the present embodiment, the vacuum chamber 20 is used as the bonding apparatus. However, the present invention is not limited to this, and the phosphor protective member 12 can be entirely pressurized. I just need it. For example, a vacuum chamber provided with a pressure roller in a vacuum chamber may be used. When the adhesive member 8 that requires heating means is used, a heating and pressure roller may be used by providing the pressure roller with heating means. Thus, the bonding apparatus that can be used in the present invention is a phosphor in a state where the space between the phosphor protective member 12 that covers the phosphor layer 7 and the base of the phosphor layer 7 that is the protective layer 5 is evacuated. Any material can be used as long as it can apply pressure to the protective member 12 and adhere the fixing means 8 to the base in that state.

  Next, the phosphor layer repair (repair) method of the radiation detection apparatus according to the first embodiment of the present invention will be described in detail with reference to FIGS. Here, an example will be described in which it is confirmed by inspection that the foreign matter 31 is present on the surface of the phosphor layer 7.

  If it is confirmed by inspection that the foreign matter 31 is present on the surface of the phosphor layer 7, if the foreign matter 31 is large, it may cause an image defect, so that it is necessary to remove the foreign matter 31 (FIG. 4A). Therefore, the adhesion between the adhesive member 8 and the protective layer 5 as a base is removed, and the phosphor protective member 12 covering the phosphor layer 7 is peeled off (FIG. 4B). Here, since the adhesive member 8 is bonded to the protective layer 5 outside the pixel region, some damage does not affect the acquired image. Further, as described above, since the adhesive member 8 is made of a material that can be easily peeled off, a large force is not applied to the peeling, so that the protection layer 5 and the phosphor layer 7 are prevented from being broken. The Furthermore, since the phosphor protective layer 9 is made of a material having no adhesiveness, the contact surface between the phosphor protective layer 9 and the phosphor layer 7 is not adhered, and the phosphor protective member 12 is not bonded. The phosphor layer 7 is prevented from being broken when the is peeled off.

  Next, the foreign material 31 that may cause pixel defects is removed from the exposed phosphor layer 7 (FIG. 4C). Thereafter, the phosphor protective member 12 is used to cover the phosphor layer 7 and the protective layer 5 by the method described above, and a radiation detection apparatus is obtained (FIG. 4D).

  As described above, the phosphor protective layer 9 having a non-adhesive surface covers the surface 7 a and the side surface 7 b of the phosphor layer 7 and the protective layer 5 that is the base, and around the phosphor protective layer 9. Since the structure bonded to the protective layer 5 by the adhesive member 8 provided in the region is used, the phosphor protective layer 9 can be easily installed and peeled off. This makes it possible to dispose the phosphor protective layer 9 that ensures the moisture resistance and impact resistance of the phosphor layer 7 and allows the phosphor layer 7 to be easily repaired.

<Second Embodiment>
Next, the radiation detection apparatus according to the second embodiment of the present invention will be described in detail with reference to FIGS. 5 (a) and 5 (b). Here, the same numbers are assigned to the components described in the first embodiment, and the description is omitted.

  In the radiation detection apparatus shown in FIGS. 5A and 5B, 61 is a support substrate, 62 is an insulating layer, 63 is a reflective layer, and 64 is a phosphor underlayer, and is supported by these elements 61 to 64. A member is constructed. On these supporting members, the phosphor layer 7, the phosphor protective layer 9 that collectively covers the surface and side surfaces of the phosphor layer 7, and the phosphor base layer 64, and the region around the phosphor protective layer 9 The phosphor protective layer 9 and the adhesive member 8 for adhering the phosphor base layer 64 are provided, and the scintillator panel 60 is constituted by these elements 7 to 9 and 61 to 64. 65 is an adhesive, and 66 is a sealing member. The surface of the scintillator panel 60 on which the phosphor layer 7 is provided and the surface of the sensor panel 6 on which the photoelectric conversion element portion 2 is provided are bonded using an adhesive 65 and a sealing member 66. Thereby, a radiation detection apparatus is obtained.

Next, each component will be described in detail. The support substrate 61 is a substrate for supporting the phosphor layer 7 and is preferably made of a material that transmits radiation well. As the material used for the support substrate 61, glass having good radiation transparency, amorphous carbon (hereinafter referred to as aC), carbon fiber reinforced resin (hereinafter referred to as CFRP: Carbon Fiber Reinforced Plastics), and the like are preferably used. . The insulating layer 62 is a member for preventing electrochemical corrosion between the phosphor layer 7 and the support substrate 61 when a conductive material is used for the support substrate 61. When the substrate 61 is made of a non-conductive material, it is not necessary to provide it. The insulating layer 62 transmits light such as an organic film such as polyimide, polyparaxylylene, polydichloroparaxylylene, polytetrachloropolyparaxylylene, or an organic film formed by a plasma polymerization method using ethylene or styrene as a monomer. It is preferable to use an organic insulating resin such as an organic film having high properties and low moisture permeability. In addition, it is possible to use an inorganic film having high light transmittance and low moisture permeability, such as SiO ₂ , SiN, TiO ₂ , and MgF ₂ . The reflection layer 63 is a member for reflecting the light generated in the phosphor layer 7, and a metal material is particularly desirable. Specifically, metals having high reflectivity such as Al, Ag, Cr, Cu, Ni, Ti, Mg, Rh, Pt, and Au are desirable. The phosphor underlayer 64 desirably has a flat surface because the phosphor layer 7 is formed. Further, when a conductive material is used as the reflective layer 63, it is desirable that the material be insulative in order to prevent the occurrence of electrochemical corrosion between the phosphor layer 7 and the reflective layer 63. . The material constituting the phosphor underlayer 64 is preferably a material having high flatness and insulating properties, such as an organic film such as polyimide, polyparaxylylene, polydichloroparaxylylene, polytetrachloropolyparaxylylene, ethylene, and the like. It is preferable to use an organic insulating resin such as an organic film having high light transmittance and low moisture permeability, such as an organic film formed by plasma polymerization using styrene as a monomer. In addition, it is possible to use an inorganic film having high light transmittance and low moisture permeability, such as SiO ₂ , SiN, TiO ₂ , and MgF ₂ . The adhesive 65 is a member for bonding the surface of the scintillator panel 60 on the side where the phosphor layer 7 is provided and the surface of the sensor panel 6 on the side where the photoelectric conversion element portion 2 is provided. An adhesive, a silicon-based resin adhesive, a hot melt resin, or the like is preferably used. The sealing member 66 is a member that covers the periphery of the adhesion interface between the scintillator panel 60 and the sensor panel 6 and prevents moisture from entering the adhesion interface. As a material constituting the sealing member 66, a silicone resin, an acrylic resin, or the like is preferably used.

  Next, a method for manufacturing a radiation detection apparatus according to the second embodiment of the present invention will be described.

  The sensor panel 6 is prepared by the same method as in the first embodiment.

  A phosphor support member in which a support substrate 61, an insulating layer 62, a reflective layer 63, and a phosphor base layer 64 are laminated is prepared, and a known vapor deposition method is applied to an arbitrary region in the phosphor base layer 64 of the phosphor support member. Thus, the phosphor layer 7 made of CsI: Tl having a columnar crystal structure is deposited. And the fluorescent substance protective layer 9 formed in the sheet form and the adhesive member 8 provided in the peripheral region are prepared.

  Next, the prepared phosphor protective layer 9 is disposed on the support member and the phosphor layer 7 so as to cover the entire surface of the phosphor layer 7.

  Next, the panel in the above state is placed on the lower support base 25 in the vacuum chamber 26 of the vacuum chamber 20 described in the first embodiment, and the vacuum chamber 26 is brought into a vacuum state.

  Next, in the above state, the diaphragm 23 presses the surface of the phosphor protective layer 9 by increasing the pressure in the pressurizing chamber 27, and the surfaces, side surfaces, and phosphors of the phosphor protective layer 9 and the phosphor layer 7. The base layer 64 is covered, and the adhesive member 8 is further bonded to the phosphor base layer 64. Thereby, the state which the fluorescent substance layer 7 was interrupted | blocked from external air can be obtained. Thereafter, the pressurization of the pressurizing chamber 27 is stopped, the vacuum chamber 26 is opened and taken out, and the scintillator panel 60 is obtained.

  Using the adhesive 65, the surface of the scintillator panel 60 on the side where the phosphor layer 7 is provided and the surface of the sensor panel 6 on which the photoelectric conversion element portion 2 is provided are bonded. Fix it. Further, the periphery is sealed with a sealing member 66 so as to cover the adhesive interface between the scintillator panel 60 and the sensor panel 6, and the radiation detection apparatus shown in FIG. 5B is obtained.

  Next, the phosphor layer repair (repair) method for the scintillator panel according to the second embodiment of the present invention will be described in detail with reference to FIGS. Here, a case where the foreign matter indicated by 34 is present in the phosphor layer 7 and the foreign matter projection region 33 is formed by inspection is described as an example.

  If it is confirmed by inspection that the foreign matter 34 is present in the phosphor layer 7, if the foreign matter 34 is large, an image defect may be caused. Since there exists a possibility that the part 2 may be destroyed, the necessity to remove arises (FIG. 6 (a)). Therefore, the adhesion between the adhesive member 8 and the phosphor base layer 64 is eliminated, and the phosphor protective layer 9 covering the phosphor layer 7 is peeled off (FIG. 6B). Here, since the adhesive member 8 is made of a material that can be easily peeled off from the phosphor base layer 64 and a large force is not applied to the peeling, the phosphor base layer 64 and the phosphor layer 7 are destroyed. Is prevented. Furthermore, since the phosphor protective layer 9 is made of a material having no adhesiveness, the contact surface between the phosphor protective layer 9 and the phosphor layer 7 is not adhered, and the phosphor protective layer 9 The phosphor layer 7 is prevented from being broken when the is peeled off.

  Next, since the foreign material 34 exists inside the exposed phosphor layer 7, the phosphor layer 7 is entirely removed from the support member (FIG. 6C). On the support member from which the phosphor layer 7 has been removed, a new phosphor layer 7 is formed again by the same method as described in the above manufacturing method (FIG. 6D). Thereafter, the phosphor protective layer 9 is used to cover the phosphor layer 7 and the phosphor underlayer 64 by the method described above, and the scintillator panel 60 is obtained (FIG. 6E).

  As described above, the phosphor protective layer 9 having a non-adhesive surface covers the surface and side surfaces of the phosphor layer 7 and the phosphor underlayer 64, and is provided in a region around the phosphor protective layer 9. Since the configuration in which the phosphor base layer 64 is adhered by the adhesive member 8 is used, the phosphor protective layer 9 can be easily installed and peeled off. This makes it possible to dispose the phosphor protective layer 9 that ensures the moisture resistance and impact resistance of the phosphor layer 7 and allows the phosphor layer 7 to be easily repaired.

<Example 1>
Examples of the radiation detection apparatus shown in the first embodiment based on FIGS. 1 to 4 will be specifically described below.

  In a region of 430 mm × 430 mm on the surface of a glass substrate 1 having a thickness of 0.7 mm, a plurality of photoelectric conversion element portions 2 each having a pixel size of 160 μm × 160 μm constituted by MIS type photosensors and TFTs made of amorphous silicon are two-dimensionally formed. Each pixel area is provided, and a bias wiring for applying a bias to the MIS type photosensor, a driving wiring for applying a driving signal to the TFT, a signal wiring for outputting a signal charge transferred by the TFT, etc. from Al The wiring part 3 is formed. Next, a protective film made of silicon nitride is formed so as to cover the photoelectric conversion element part 2 and the wiring part 3, and a passivation film made of polyimide is further formed on the protective film to form a protective layer 5, and an electrode lead-out part The protective layer 5 on the region to be 4 is removed to provide the electrode extraction portion 4. The sensor panel 6 is formed by the above process.

  Next, CsI: Tl having a columnar crystal structure in which thallium (Tl) is added to cesium iodide (CsI) is deposited on the pixel region of the formed protective layer 5 by a vacuum deposition method in a film formation time of 4 hours. A thickness of 550 μm is formed. The concentration of Tl added was 0.1 to 0.3 mol%. The average column diameter of the CsI: Tl columnar crystal on the top side (deposition surface side) was about 5 μm. The formed CsI: Tl is heat-treated in a clean oven in a nitrogen atmosphere at 200 ° C. for 2 hours, whereby the phosphor layer 7 is obtained. Then, the phosphor formed by the phosphor protective layer 9 made of PET having a thickness of 50 μm, the reflective layer 10 made of Al having a thickness of 40 μm, and the reflective layer protective layer 11 made of PET having a thickness of 50 μm formed in a sheet shape. A phosphor protective member 12 including a protective sheet and a hot-melt resin adhesive member 8 provided in the peripheral region is prepared (FIG. 3A).

  Next, the prepared phosphor protection member 12 is disposed on the sensor panel 6 and the phosphor layer 7 so as to cover the entire surface 7a of the phosphor layer 7 (FIG. 3B).

  Next, the panel in the above state is placed on the lower support 25 in the vacuum chamber 26 of the vacuum chamber 20, and the vacuum chamber 26 is evacuated to about -700 mmHg to be in a vacuum state. (FIG. 3C).

Next, in the above state, by increasing the pressure in the pressurizing chamber 27, the diaphragm 23 presses the surface of the phosphor protective member 12 on the reflective layer protective layer 11 side with a pressurized pressure of 5 kg / cm ² , and further heating means A lower support base 25 having a temperature of 120 ° C. is heated and held. Thus, the phosphor protective layer 9 and the surface 7a, the side surface 7b, and the protective layer 5 of the phosphor layer 7 are covered, the adhesive member 8 is further adhered to the protective layer 5, and the phosphor layer 7 is shielded from the outside air. Can be obtained (FIG. 3D). Thereafter, the pressurization of the pressurization chamber 27 is stopped, the heating is stopped, the temperature is cooled to 40 ° C., the vacuum chamber 26 is opened, and the radiation detection apparatus shown in FIG. 4A is obtained.

  When the obtained radiation detection apparatus was inspected, it was confirmed that the foreign matter indicated by 31 is present on the surface of the phosphor layer 7. Since the foreign material 31 is larger than a predetermined value, which may cause an image defect, it is necessary to remove the foreign material 31.

  The radiation detecting device is heated to 120 ° C., the adhesive member 8 made of hot melt resin is melted to eliminate the adhesion with the protective layer 5, and the phosphor protective member 12 covering the phosphor layer 7 is peeled off. (FIG. 4B).

  Next, the foreign material 31 that may cause pixel defects is removed from the exposed phosphor layer 7 (FIG. 4C). Thereafter, the phosphor protective member 12 is used to cover the phosphor layer 7 and the protective layer 5 by the method described above, and a radiation detection apparatus is obtained (FIG. 4D). When the obtained radiation detection apparatus was inspected, no foreign matter that could cause pixel defects was found. After the inspection, the terminal part of the flexible circuit board (not shown) was thermocompression bonded to the electrode extraction part 4 on the sensor panel 6 via an anisotropic conductive adhesive (not shown), and a radiation detection device was obtained. .

<Example 2>
Examples of the radiation detection apparatus shown in the second embodiment based on FIGS. 5 to 6 will be specifically described below.

  In a region of 430 mm × 430 mm on the surface of a glass substrate 1 having a thickness of 0.7 mm, a plurality of photoelectric conversion element portions 2 each having a pixel size of 160 μm × 160 μm constituted by MIS type photosensors and TFTs made of amorphous silicon are two-dimensionally formed. Each pixel area is provided, and a bias wiring for applying a bias to the MIS type photosensor, a driving wiring for applying a driving signal to the TFT, a signal wiring for outputting a signal charge transferred by the TFT, etc. from Al The wiring part 3 is formed. Next, a protective film made of silicon nitride is formed so as to cover the photoelectric conversion element part 2 and the wiring part 3, and a passivation film made of polyimide is further formed on the protective film to form a protective layer 5, and an electrode lead-out part The protective layer 5 on the region to be 4 is removed to provide the electrode extraction portion 4. The sensor panel 6 is prepared by the above process.

  Next, an insulating layer 62 made of polyimide having a thickness of 8 μm, a reflective layer 63 made of Al having a thickness of 0.3 μm, and a polyimide having a thickness of 8 μm are formed on a support substrate 61 made of aC having a thickness of 1 mm. A phosphor support member on which the phosphor underlayer 64 is laminated is prepared, and CsI: Tl having a columnar crystal structure is formed in an arbitrary region of the phosphor underlayer 64 of the phosphor support member by a vacuum deposition method. A thickness of 550 μm is formed over time. The concentration of Tl added was 0.1 to 0.3 mol%. The average column diameter of the CsI: Tl columnar crystal on the top side (deposition surface side) was about 5 μm. The formed CsI: Tl is heat-treated in a clean oven in a nitrogen atmosphere at 200 ° C. for 2 hours, whereby the phosphor layer 7 is obtained. Then, a phosphor protective layer 9 made of PET having a thickness of 15 μm formed in a sheet shape and an adhesive member 8 made of an adhesive material provided in the peripheral region are prepared.

  Next, the prepared phosphor protective layer 9 is disposed on the support member and the phosphor layer 7 so as to cover the entire surface of the phosphor layer 7.

  Next, the panel in the above state is placed on the lower support 25 in the vacuum chamber 26 of the vacuum chamber 20, and the vacuum chamber 26 is evacuated to about -700 mmHg to be in a vacuum state. Is in a vacuum state.

Next, in the above state, when the pressure in the pressurizing chamber 27 is increased, the diaphragm 23 presses the surface of the phosphor protective layer 9 with a pressurizing pressure of 5 kg / cm ² , and the phosphor protective layer 9 and the phosphor layer 7 are pressed. The surface, side surfaces, and phosphor base layer 64 are covered, and the adhesive member 8 is further adhered to the phosphor base layer 64. Thereby, the state which the fluorescent substance layer 7 was interrupted | blocked from external air can be obtained. Thereafter, the pressurization of the pressurizing chamber 27 was stopped, the vacuum chamber 26 was opened and taken out, and a scintillator panel 60 shown in FIG. 6A was obtained.

  When the obtained scintillator panel 60 was inspected, it was confirmed that the foreign matter indicated by 34 was present in the phosphor layer 7 and the foreign matter projection region 33 was present. The foreign matter 34 and the foreign matter projection region 33 are larger than a predetermined value, which may cause image defects and damage to the photoelectric conversion element portion 2, thus necessitating removal.

  Therefore, the adhesion between the adhesive member 8 and the phosphor base layer 64 is eliminated, and the phosphor protective layer 9 covering the phosphor layer 7 is peeled off (FIG. 6B).

  Next, since the foreign material 34 exists inside the exposed phosphor layer 7, the phosphor layer 7 is entirely removed from the support member (FIG. 6C). On the support member from which the phosphor layer 7 has been removed, a new phosphor layer 7 is formed again by the same method as described in the above manufacturing method (FIG. 6D). Thereafter, the phosphor protective layer 9 is used to cover the phosphor layer 7 and the phosphor underlayer 64 by the method described above, and the scintillator panel 60 is obtained (FIG. 6E).

  When the obtained scintillator panel 60 was inspected, it was confirmed that the foreign matter and the foreign matter projection region 33 did not exist. The surface of the confirmed scintillator panel 60 on the side where the phosphor layer 7 is provided and the surface of the sensor panel 6 on which the photoelectric conversion element portion 2 is provided are bonded to each other with an acrylic resin. Adhesive fixing is performed using the agent 65. Further, the periphery was sealed with a sealing member 66 made of acrylic resin so as to cover the adhesive interface between the scintillator panel 60 and the sensor panel 6. Furthermore, the terminal part of a flexible circuit board (not shown) is thermocompression bonded to the electrode extraction part 4 on the sensor panel 6 via an anisotropic conductive adhesive (not shown), and the radiation shown in FIG. A detection device was obtained.

<Example 3>
Examples of the radiation detection apparatus shown in the first embodiment based on FIGS. 7 to 8 will be specifically described below.

  In a region of 430 mm × 430 mm on the surface of a glass substrate 1 having a thickness of 0.7 mm, a plurality of photoelectric conversion element portions 2 each having a pixel size of 160 μm × 160 μm constituted by MIS type photosensors and TFTs made of amorphous silicon are two-dimensionally formed. Each pixel area is provided, and a bias wiring for applying a bias to the MIS type photosensor, a driving wiring for applying a driving signal to the TFT, a signal wiring for outputting a signal charge transferred by the TFT, etc. from Al The wiring part 3 is formed. Next, a protective film made of silicon nitride is formed so as to cover the photoelectric conversion element part 2 and the wiring part 3, and a passivation film made of polyimide is further formed on the protective film to form a protective layer 5, and an electrode lead-out part The protective layer 5 on the region to be 4 is removed to provide the electrode extraction portion 4. The sensor panel 6 is formed by the above process.

Next, on the pixel region of the formed protective layer 5, a first protective layer 41 made of PET having a thickness of 5 μm, a particulate phosphor 42 having a thickness of 160 μm made of Gd ₂ O ₂ S ₂ : Tb, and a thickness. A sheet-like phosphor layer 40 formed by laminating a second protective layer 43 made of 188 μm PET is prepared. Then, the phosphor formed by the phosphor protective layer 9 made of PET having a thickness of 50 μm, the reflective layer 10 made of Al having a thickness of 40 μm, and the reflective layer protective layer 11 made of PET having a thickness of 50 μm formed in a sheet shape. A phosphor protective member 12 including a protective sheet and a hot-melt resin adhesive member 8 provided in the peripheral region is prepared (FIG. 3A).

  Next, the prepared phosphor protection member 12 is disposed on the sensor panel 6 and the phosphor layer 40 so as to cover the entire surface 43 a of the phosphor layer 40.

  Next, the panel in the above state is placed on the lower support 25 in the vacuum chamber 26 of the vacuum chamber 20, and the vacuum chamber 26 is evacuated to about -700 mmHg to be in a vacuum state.

Next, in the above state, by increasing the pressure in the pressurizing chamber 27, the diaphragm 23 presses the surface of the phosphor protective member 12 on the reflective layer protective layer 11 side with a pressurized pressure of 5 kg / cm ² , and further heating means A lower support base 25 having a temperature of 120 ° C. is heated and held. Thereby, the surface 43a, the side surfaces 41b, 42b, 43b and the protective layer 5 of the phosphor protective layer 9 and the phosphor layer 40 are covered, and the adhesive member 8 is further adhered to the protective layer 5, so that the phosphor layer 40 is exposed from the outside air. A blocked state can be obtained. Thereafter, the pressurization of the pressurizing chamber 27 is stopped, the heating is stopped, the pressure chamber 27 is cooled to 40 ° C., the vacuum chamber 26 is opened, and the radiation detecting apparatus shown in FIG. 8A is obtained.

  When the obtained radiation detection apparatus was inspected, it was confirmed that the foreign matter indicated by 51 exists inside the phosphor layer 40. Since the foreign material 31 is larger than a predetermined value, which may cause an image defect, it is necessary to remove the foreign material 31.

  The radiation detecting device is heated to 120 ° C., the adhesive member 8 made of hot melt resin is melted to eliminate the adhesion with the protective layer 5, and the phosphor protective member 12 covering the phosphor layer 40 is peeled off. (FIG. 8B).

  Next, the exposed phosphor layer 40 is peeled off from the protective layer 5 (FIG. 8C). A new phosphor layer 40 is formed again on the protective layer 5 from which the phosphor layer 40 has been removed by the same method as described in the above manufacturing method (FIG. 8D). Thereafter, the phosphor protective member 12 is used to cover the phosphor layer 40 and the protective layer 5 by the method described above, and a radiation detection apparatus is obtained (FIG. 8E). When the obtained radiation detection apparatus was inspected, no foreign matter that could cause pixel defects was found. After the inspection, the terminal part of the flexible circuit board (not shown) was thermocompression bonded to the electrode extraction part 4 on the sensor panel 6 via an anisotropic conductive adhesive (not shown), and a radiation detection device was obtained. .

<Application example>
FIG. 11 shows an application example to an X-ray diagnosis system using the radiation detection apparatus according to the present invention.

  The X-ray 6060 generated by the X-ray tube 6050 passes through the chest 6062 of the patient or subject 6061 and enters the radiation detection device 6040 on which a scintillator (phosphor) is mounted. This incident X-ray includes information inside the body of the patient 6061. The scintillator emits light in response to the incidence of X-rays, and this is photoelectrically converted to obtain electrical information. This information can be digitally converted and image-processed by an image processor 6070 as a signal processing means, and can be observed on a display 6080 as a display means in a control room.

  Further, the image processor 6070 transfers the electric signal output from the image sensor 6040 to a remote place via a transmission processing unit such as a telephone line 6090, and displays it on a display unit (display) 6081 in another place such as a doctor room. It can also be displayed. It is also possible to store the electrical signal output from the image sensor 6040 in a recording means such as an optical disk and make a diagnosis by a remote doctor using this recording means. Moreover, it can also record on the film 6110 by the film processor 6100 used as a recording means.

  The present invention is used for a radiation detection apparatus and a scintillator panel used for medical diagnostic equipment, non-destructive testing equipment, and the like.

It is a schematic plan view which shows the principal part structure of the radiation detection apparatus which concerns on the 1st Embodiment of this invention. It is a schematic sectional drawing which shows the principal part structure of the radiation detection apparatus which concerns on the 1st Embodiment of this invention. It is a schematic sectional drawing which shows the manufacturing method of the radiation detection apparatus which concerns on the 1st Embodiment of this invention. It is a schematic sectional drawing which shows the restoration method of the radiation detection apparatus which concerns on the 1st Embodiment of this invention. It is a schematic sectional drawing which shows the principal part structure of the scintillator panel and radiation detection apparatus which concern on the 2nd Embodiment of this invention. It is a schematic sectional drawing which shows the restoration method of the scintillator panel which concerns on the 2nd Embodiment of this invention. It is a schematic sectional drawing which shows the principal part structure of the radiation detection apparatus which concerns on the other Example in the 1st Embodiment of this invention. It is a schematic sectional drawing which shows the restoration method of the radiation detection apparatus which concerns on the other Example in the 1st Embodiment of this invention. It is a schematic sectional drawing which shows the principal part structure of the conventional radiation detection apparatus. It is a schematic sectional drawing which shows the principal part structure of the conventional radiation detection apparatus. It is a figure explaining the application to the radiation detection system using the radiation detection apparatus which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,101 Insulating substrate 2,102 Photoelectric conversion element part 3,103 Wiring part 4,104 Electrode extraction part 5,105 Protective layer 6,106 Sensor panel 7,107 Phosphor layer 8 Adhesive member 9,109 Phosphor protective layer DESCRIPTION OF SYMBOLS 10,110 Reflective layer 11,111 Reflective layer protective layer 12,112 Phosphor protective member 20 Vacuum chamber 21 Lower chamber 22 Upper chamber 23 Diaphragm 24 O-ring seal 25 Lower support base 26 Vacuum chamber 27 Pressurization chamber 31, 34, 51 Foreign matter 32 Indentation removed from foreign matter 33 Foreign matter projection region 40 Phosphor layer 41 First protective layer 42 Particulate phosphor 43 Second protective layer 60 Scintillator panel 61 Support substrate 62 Insulating layer 63 Reflective layer 64 Phosphor base layer 65 Adhesive 66 Sealing member 6040 Image sensor 6050 X-ray tube 60 0 X-ray 6061 subject 6070 image processor 6080 display 6081 display 6100 film processor 6110 film

Claims (20)

A sensor panel having a pixel region composed of a plurality of photoelectric conversion elements arranged two-dimensionally;
A phosphor layer that is disposed on at least the pixel region of the sensor panel and converts radiation into light that can be sensed by the photoelectric conversion element;
A phosphor protective member having a non-adhesive surface that collectively covers at least part of the surface of the sensor panel outside the pixel region and the surface and side surfaces of the phosphor layer;
An adhesive member disposed between a part of the surface of the sensor panel outside the pixel region and the phosphor protective member;
A radiation detection apparatus.   The sensor panel covers the pixel region including the plurality of photoelectric conversion elements formed on a substrate, a wiring unit connected to the photoelectric conversion device, and at least a part of the pixel region and the wiring unit. The radiation detection apparatus according to claim 1, wherein the phosphor protection member is bonded to a part of the protection layer outside the pixel region by the adhesive member.   The radiation detection apparatus according to claim 2, wherein the phosphor layer is a phosphor layer having a columnar crystal structure that is directly disposed on at least the protective layer in the pixel region.   The phosphor protective member includes polyester, acrylic resin, acrylonitrile-butadiene-styrene copolymer, cellulose, epoxy resin, fluororesin, polyamide, polycarbonate, polyimide, polypropylene, polyurethane, silicone, vinyl polymer, vinyl copolymer. A phosphor protective layer that is made of one substance selected from the group consisting of the above substances and that covers at least a part of the protective layer outside the pixel region and the surface and side surfaces of the phosphor layer in a lump. The radiation detection apparatus according to claim 2, comprising:   The said fluorescent substance protection member has the said fluorescent substance protective layer, the reflective layer provided on this fluorescent substance protective layer, and the reflective layer protective layer provided on this reflective layer. Radiation detection device.   The radiation detecting apparatus according to claim 1, wherein the adhesive member is a thermoplastic adhesive resin or a pressure-sensitive adhesive. A sensor panel having a pixel region composed of a plurality of photoelectric conversion elements arranged two-dimensionally;
A phosphor layer formed on a support member; a phosphor protective layer having a non-adhesive surface that collectively covers at least a part of the surface of the support member and the surface and side surfaces of the phosphor layer; and the support. A scintillator panel having an adhesive member disposed between a part of the surface of the member and the phosphor protective layer;
A radiation detection apparatus.   The support member includes a support substrate, a reflection layer disposed between the support substrate and the phosphor layer, and a phosphor base layer disposed between the reflection layer and the phosphor layer. The phosphor protective layer collectively covers at least a part of the surface of the phosphor base layer and the surface and side surfaces of the phosphor layer, and the adhesive member is a part of the surface of the phosphor base layer. The radiation detection apparatus according to claim 7, wherein the radiation detection apparatus is disposed between the fluorescent substance protective layer and the phosphor protective layer.   The radiation detection apparatus according to claim 7 or 8, wherein the phosphor layer has a columnar crystal structure.   The phosphor protective layer is made of polyester, acrylic resin, acrylonitrile-butadiene-styrene copolymer, cellulose, epoxy resin, fluororesin, polyamide, polycarbonate, polyimide, polypropylene, polyurethane, silicone, vinyl polymer, vinyl copolymer. The radiation detection apparatus according to any one of claims 7 to 9, comprising one substance selected from the group consisting of:   The radiation detection apparatus according to claim 7, wherein the adhesive member is a thermoplastic adhesive resin or an adhesive. A phosphor layer formed on the support member;
A phosphor protective layer having a non-adhesive surface that collectively covers at least a part of the surface of the support member and the surface and side surfaces of the phosphor layer;
An adhesive member disposed between a part of the surface of the support member and the phosphor protective layer;
A scintillator panel.   The support member includes a support substrate, a reflection layer disposed between the support substrate and the phosphor layer, and a phosphor base layer disposed between the reflection layer and the phosphor layer. The phosphor protective layer collectively covers at least a part of the surface of the phosphor base layer and the surface and side surfaces of the phosphor layer, and the adhesive member is a part of the surface of the phosphor base layer. The scintillator panel according to claim 12, which is disposed between the phosphor protective layer and the phosphor protective layer.   The scintillator panel according to claim 12 or 13, wherein the phosphor layer has a columnar crystal structure.   The phosphor protective layer is made of polyester, acrylic resin, acrylonitrile-butadiene-styrene copolymer, cellulose, epoxy resin, fluororesin, polyamide, polycarbonate, polyimide, polypropylene, polyurethane, silicone, vinyl polymer, vinyl copolymer. The scintillator panel according to any one of claims 12 to 14, wherein the scintillator panel is made of one substance selected from the group consisting of the following substances.   The scintillator panel according to any one of claims 12 to 15, wherein the adhesive member is a thermoplastic adhesive resin or an adhesive. Preparing a sensor panel having a pixel region composed of a plurality of photoelectric conversion elements arranged two-dimensionally;
Providing a phosphor layer for converting radiation into light that can be sensed by the photoelectric conversion element on at least the pixel region of the sensor panel;
At least a part of the surface of the sensor panel outside the pixel region and the surface and side surfaces of the phosphor layer are collectively covered with a phosphor protective member having a non-adhesive surface, and outside the pixel region. Bonding a part of the surface of the sensor panel and the phosphor protective member with an adhesive member;
The manufacturing method of the radiation detection apparatus which has this.   A step of removing the phosphor protective member by removing the adhesion by the adhesive member when a defect is found in the phosphor layer, a step of repairing the phosphor layer, and at least outside the pixel region A part of the surface of the sensor panel and a surface and side surfaces of the repaired phosphor layer are collectively covered with the phosphor protective member, and a part of the surface of the sensor panel outside the pixel region is covered. The manufacturing method of the radiation detection apparatus of Claim 17 which further has the process which adhere | attaches again the said fluorescent substance protection member with the said adhesive member. Providing a phosphor layer on the support member that converts radiation into light that can be sensed by the photoelectric conversion element;
At least a part of the surface of the support member on which the phosphor layer is provided and the surface and side surfaces of the phosphor layer are collectively covered with a phosphor protective layer having a non-adhesive surface, and the support Adhering a part of the surface of the time member and the phosphor protective layer with an adhesive member;
A method of manufacturing a scintillator panel having   A step of removing the phosphor protective layer by removing the adhesion by the adhesive member when a defect is found in the phosphor layer, a step of repairing the phosphor layer, and at least the support member A part of the surface and the surface and side surfaces of the repaired phosphor layer are collectively covered with the phosphor protective layer, and the part of the surface of the support member and the phosphor protective layer are covered. The method for manufacturing a scintillator panel according to claim 19, further comprising the step of re-adhering with the adhesive member.

Images