JP2006292919A - Exposure method and exposing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently expose a substrate with a wide exposure region by using a small mask. <P>SOLUTION: In the exposure method, exposure light from a lamp (a continuous light source) 9 is radiated on the substrate 4 being transferred at a definite speed in a specified direction with a substrate transferring means 5, on an exposure station (an exposure portion) 2 via a mask 11 arranged on an optical axis (an optical path) S of an exposure optical system 3. In exposing the substrate 4 by transferring an image of an opening portion 11a of the mask 11 thereto, a front side edge and a lateral side edge (a pattern edge) of a pixel (a reference pattern) 18 previously formed on the substrate 4 are picked up with a linear CCD 20 of an imaging means 6 so as to detect reference positions on the transfer direction and a direction vertical thereto on the substrate 4. The exposure region along the transfer direction of the substrate 4 is continuously exposed while adjusting the position of the mask 11 in such a way that the position of the mask 11 coincides with a reference position on the substrate 4 when the pixel 18 picked up with the imaging means 6 is transferred from an imaging position F to an exposure position E. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an exposure method and an exposure apparatus used when manufacturing a color filter for a liquid crystal panel and the like.

Conventionally, in the manufacture of color filters for liquid crystal panels, a substrate stage on which a substrate is placed is exposed when a red (R), green (G), or blue (B) colored layer is formed on a substrate on which a black matrix is formed. The first exposure is performed by irradiating a predetermined region on the substrate with exposure light from the light source unit through a photomask smaller than the area of the substrate in the exposure unit, and then performing the first exposure. Is moved by a predetermined distance to position the substrate again in the exposure section, and then the second exposure is performed on the area that could not be exposed for the first time, and this is repeated to form a photomask on the entire surface of the large substrate. An exposure method or an exposure apparatus that transfers a pattern is known (see, for example, Patent Document 1 and Patent Document 2).
In addition, the sheet-like substrate (substrate) wound around the roll is fed to the exposure unit and positioned, and the exposure light from the light source unit is passed through the photomask having a size corresponding to the unit substrate on the exposure unit. The photomask pattern is transferred by irradiating a predetermined area of the sheet, and then the sheet-like base material is fed out and positioned by an amount corresponding to the unit substrate to the exposure unit, and the same exposure operation is repeated to sequentially form the sheets. An exposure method or an exposure apparatus in which a photomask pattern is transferred in the longitudinal direction of a substrate is known (see, for example, Patent Document 3 and Patent Document 4).
JP-A-9-127702 JP 2000-347020 A JP 2004-341280 A JP 2001-264999 A

However, in the exposure method or the exposure apparatus, when the exposure of the predetermined region of the substrate (base material) is completed, the exposure operation is once ended and the photomask is moved stepwise relative to the substrate (base material). In addition, since it is necessary to intermittently repeat the operation of aligning the substrate (base material) and the photomask again, there is a problem that the exposure operation takes a long time and the exposure operation cannot be performed efficiently. Further, if the size of the photomask is made smaller from the viewpoint of preventing deflection due to its own weight, the number of times of repeating the exposure operation for a large substrate increases, and the exposure time becomes longer, and the above problem becomes more prominent. .
In addition, in order to reduce the number of repetitions of the exposure operation, when a relatively large photomask is used, the exposure light requires a large amount of energy. As a result, there is a problem that the exposure time cannot be shortened.
Further, in order to align the substrate (base material) and the photomask in the exposure unit, it is necessary to form alignment marks separately from the pattern on both the substrate (base material) and the photomask in advance. There is a problem that the manufacturing process of the substrate (base material) and the photomask becomes complicated.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide an exposure method and an exposure apparatus that can efficiently expose a substrate having a wide exposure area using a small mask. .

The present invention is characterized by the following points in order to solve the above problems.
That is, in the exposure method according to claim 1, the exposure light from the continuous light source is provided on the optical path of the exposure optical system with respect to the substrate being conveyed in the constant direction at a constant speed by the substrate conveying means. In an exposure method of irradiating through a mask and transferring an image of an opening of the mask onto the substrate,
The pattern edge of the reference pattern formed in advance on the substrate is imaged by the imaging means to detect the reference position in the transport direction on the substrate and the direction perpendicular thereto, and the reference pattern imaged by the imaging means is the imaging position. The exposure area along the substrate transport direction is continuously exposed while adjusting the position of the mask so that the position of the mask coincides with the reference position on the substrate when moved from the exposure position to the exposure position. Yes.

An exposure apparatus according to a second aspect of the present invention relates to a substrate transport unit that transports a substrate in a constant direction at a constant speed, and exposure light from a continuous light source to a substrate being transported by the substrate transport unit. An exposure apparatus provided with an exposure optical system that irradiates through a portion and transfers an image of the opening onto a substrate,
An imaging unit that images a pattern edge of a reference pattern previously formed on the substrate while moving the substrate, and a conveyance direction on the substrate based on an image of the pattern edge captured by the imaging unit and a direction perpendicular thereto A control device that detects a reference position and adjusts the position of the mask so that the position of the mask coincides with the reference position on the substrate when the reference pattern imaged by the imaging means is moved from the imaging position to the exposure position. In addition, the control apparatus is characterized in that irradiation of exposure light from the continuous light source onto the substrate is continued while the substrate moves through the exposure unit from an exposure start end to an exposure end on the substrate.

An exposure apparatus according to a third aspect is the exposure apparatus according to the second aspect, wherein the control device adjusts the position in a direction perpendicular to the transport direction of the mask based on a reference position in a direction perpendicular to the transport direction of the substrate. It is characterized by performing.
An exposure apparatus according to a fourth aspect of the present invention is the exposure apparatus according to the second or third aspect, wherein the control device determines a rotation angle of the mask based on an inclination with respect to a substrate transport direction obtained by detecting each of the reference positions. It is characterized by adjusting the position.
The exposure apparatus according to claim 5 is the exposure apparatus according to any one of claims 2 to 4, wherein the substrate transport unit winds a sheet-like substrate from a storage roll to a take-up roll, and the exposure unit is moved to the exposure unit. It is characterized by being moved along a plane perpendicular to the optical path of the exposure optics.

The present invention has the following excellent effects.
According to the exposure method according to claim 1 and the exposure apparatus according to claim 2, since the exposure can be performed by continuously transferring the shape of the opening of the mask while the substrate is transported by the substrate transport means. Even when a mask is used, it is not necessary to perform exposure by intermittent step movement of the substrate, and the substrate having a wide exposure area can be efficiently exposed.
In addition, since the reference position of the substrate can be detected using a reference pattern previously formed on the substrate and the position of the mask can be adjusted based on the reference position, exposure to a predetermined area of the substrate can be performed. It can be performed accurately, and it is not necessary to form alignment marks on the substrate or the mask for adjusting the position of the mask, and their manufacture is easy.

According to the exposure apparatus of the third aspect, the position of the mask in the direction perpendicular to the reference position in the direction perpendicular to the substrate conveyance direction can be reliably adjusted. The exposure of the exposed area can be performed accurately.
According to the exposure apparatus of the fourth aspect, since the position of the turning angle of the mask can be reliably adjusted in accordance with the inclination angle with respect to the transport direction of the substrate, the mask corresponding to the position change of the transported substrate. Thus, it is possible to perform the exposure of a predetermined exposure region more accurately by adjusting the position of the lens more accurately.
According to the exposure apparatus according to claim 5, with a dew light area that corresponds to a unit substrate multiple continuous sheet-shaped substrate is moved step for each of the exposure areas corresponding to the respective unit substrates, intermittent exposure operation Therefore, it is not necessary to repeat the steps, so that a large number of substrates can be exposed very efficiently, and productivity can be improved.

  The exposure apparatus according to the first embodiment of the present invention will be described below with reference to FIGS. In FIG. 1, reference numeral 1 denotes an exposure apparatus according to an embodiment of the present invention. The exposure apparatus 1 includes an exposure optical system 3 installed in an exposure station (exposure unit) 2, substrate transport means 5 for transporting a substrate 4 to be exposed below the exposure optical system 3, and the substrate 4. An image pickup means 6 for picking up an image of a specific part, an image recognition light source 7 for illuminating the substrate 4 from below in the exposure station 2, and a control device 8 connected to the respective device units for controlling them. The substrate 4 is irradiated with exposure light from the exposure optical system 3 through an opening of a mask 11 (described later) provided in the exposure optical system 3, and a pattern based on the shape of the opening is transferred onto the substrate 4. It is like that.

  The exposure optical system 3 includes a lamp (continuous light source) 9 made of an ultrahigh pressure mercury lamp or the like, an illumination lens 10 that is installed below the lamp 9 and projects the exposure light from the lamp 9 downward, A mask 11 is provided below the illumination lens 10, and its optical axis (optical path) S is set in the vertical direction, and the mask 11 is positioned in a horizontal plane perpendicular to the optical axis S. Once the lamp 9 is turned on, it continuously irradiates exposure light until a command to turn it off is given. Further, the mask 11 is formed of a rectangular flat plate having a long side in the Y-axis direction (vertical direction in FIG. 2) y perpendicular to the paper surface in FIG. 1, and the X-axis direction (FIG. 1) perpendicular to the Y-axis direction y. In the central portion of the short side in x in the left-right direction in FIG. 2, a plurality of rectangular openings 11a and 11a having long sides in the X-axis direction x are provided at predetermined intervals in the Y-axis direction y (not shown). In the example, two are provided through. The length of the opening 11a in the X-axis direction is set to be, for example, the same as the length of the pixel 18 (described later) of the substrate 4 in the X-axis direction, and the size of the mask 11 is the opening 11a, It is only necessary to have an area necessary and sufficient to provide the size of 11a, and the width of the substrate 4 in the X-axis direction x is a unit substrate (a substrate having a size corresponding to one sheet such as a liquid crystal panel is called a “unit substrate”. ) In the X-axis direction x (see FIG. 2).

  The mask 11 is supported on the upper surface of a mask stage 12 installed perpendicular to the optical axis S of the exposure optical system 3, and a line connecting the centers of the openings 11a and 11a is the exposure optical system 3. It is located on the optical axis S. The mask stage 12 includes a mask driving means 13 having a servo motor, a linear motor, and the like based on the position of the mask 11 in the Y-axis direction y and the turning angle around the center of the mask 11 in the horizontal plane. It can be adjusted through. The mask driving means 13 detects the movement position and turning angle of the mask stage 12 in the Y-axis direction y, and feeds back the detected values to the control device 8 such as the position of an encoder, a linear sensor, or the like. A sensor and an angle sensor (both not shown) are provided.

  The substrate transport means 5 is disposed on one end side (right side in FIG. 1) of the exposure station 2, a storage roll 14 for winding and storing a film (sheet-like) substrate 4, and the other end side of the exposure station 2. (On the left side in FIG. 1), the winding roll 15 that winds up the substrate 4 fed out from the storage roll 14, and the winding roll 15 is rotated to continuously rotate the substrate 4 along the X-axis direction x. And a substrate driving means 16 having a servo motor or the like that is conveyed in a traveling direction (fixed direction) b and wound on a winding roll 15. The substrate driving means 16 is provided with a position sensor such as an encoder or a linear sensor for detecting the movement position of the substrate 4 in the X-axis direction x and feeding back the detected value to the control device 8. Yes. Further, the substrate transport means 5 is provided with two pairs of guide rollers 17a and 17b which are positioned before and after the exposure station 2 (left and right in FIG. 1) and rotate while sandwiching the substrate 4 from above and below. The substrate 4 is moved below the mask stage 12 while maintaining a horizontal state.

The substrate 4 is, for example, a color filter substrate. As shown in FIG. 2A, each of the colored elements arranged in a straight line in the transport direction (X-axis direction x) of the substrate 4 in the black matrix BM. A plurality of pixels (reference patterns) 18 that are rectangular openings for layers (red R, green G, and blue B) are arranged in the width direction (Y-axis direction y) of the substrate 4 perpendicular to the transport direction. In the exposure station 2, the surface moves along a horizontal plane perpendicular to the optical axis S of the exposure optical system 3.
In addition to what is shown in the present embodiment, the reference pattern means a wiring pattern, various electrode patterns, and the like in a semiconductor component.
The imaging means 6 is opposed to the image recognition illumination 7, and a half mirror 19 disposed between the illumination lens 10 and the mask 11 inside the exposure optical system 3, and is reflected by the half mirror 19. And a linear CCD 20 for capturing the captured image.

  The linear CCD 20 is formed, for example, by arranging light receiving elements in a straight line in the Y-axis direction y over a length larger than the width of the substrate 4 (dimension in the Y-axis direction y). The position (imaging position) F of the optical axis S1 of the half mirror 19 is rearward from the position (exposure position) E of the optical axis S of the exposure optical system 3 with respect to the traveling direction A of the substrate 4 (FIG. 1, FIG. 2 on the right side) is set in advance by a predetermined distance L, and the front edge (pattern edge) 18e1 (the front edge in the traveling direction A of the substrate 4) of the pixel 18 of the substrate 4 is set by the linear CCD 20. The pixel 18 reaches the center position (exposure position) E in the X-axis direction x of the opening portion 11a of the mask 11 after a predetermined time has passed since the image was picked up through the illumination light of the image recognition illumination 7. It has become. Further, the linear CCD 20 images a side edge (pattern edge) 18e2 in the Y-axis direction y of the pixel 18 of the substrate 4.

  The control device 8 controls the operation of the entire device. The control device 8 controls the operation of the substrate 4 based on image data obtained by imaging the front edge 18e1 and the side edge 18e2 of the pixel 18 of the substrate 4 with the linear CCD 20. An image processing unit 21 for detecting a reference position in the X-axis direction x and the Y-axis direction y, a memory for storing design data of the black matrix BM of the substrate 4, data such as data relating to the reference position, an operation program for the entire apparatus, etc. The time required for the position of the front edge 18e1 of the pixel 18 to move from the imaging position F to the exposure position E is calculated from the unit 22, the distance L between the imaging position F and the exposure position E, and the transport speed of the substrate 4. A reference position (Y-axis reference position) in the Y-axis direction y of the substrate 4 based on the side edge 18e2 detected by the image processing unit 21 and the mask 1 (opening 11a) displacement with respect to the position in the Y-axis direction y, computation for calculating a displacement angle (tilt angle) θ with respect to the transport direction (X-axis direction x) of the substrate 4 in a plane including the XY axes According to the reference position (X-axis reference position) in the X-axis direction of the substrate 4 based on the portion 23 and the front edge 18e1, the foremost pixel 18a reaches the exposure position E and the last-end pixel 18b becomes the exposure position E. Until reaching the exposure position E, a lamp power source 24 for continuously irradiating the exposure light from the lamp 9 and a substrate controller 25 for operating the substrate driving means 16 to convey the substrate 4 in the traveling direction A. Then, the mask driving means 13 is operated to adjust the position of the mask stage 12 in the Y-axis direction y, and to adjust the turning angle of the mask stage 12 in the horizontal plane. The main control which is connected to the mask stage controller 26, the image processing unit 21, the storage unit 22, the calculation unit 23, the lamp power supply unit 24, the substrate controller 25, and the mask stage controller 26, and controls these operations in an integrated manner. Part 27.

Next, an exposure method according to an embodiment of the present invention will be described with reference to FIG. 3 together with the operation of the exposure apparatus 1 configured as described above.
First, when the exposure apparatus 1 is operated with the control device 8 in an operating state, the image recognition illumination 7 is turned on by a command from the main control unit 27, and the substrate transport unit 5 is operated by the operation of the substrate controller 25. When the substrate driving means 16 is driven, the substrate 4 is unwound from the storage roller 14 and taken up by the take-up roller 15 so that the exposure station 2 is kept horizontal and is conveyed in the advancing direction (step S1). . Meanwhile, the linear CCD 20 receives illumination light that has been irradiated from the lower side of the substrate 4 by the image recognition illumination 7 and has passed through the pixels 18 formed on the substrate 4 through the half mirror 19. Image data of the pixel 18 is acquired (step S2).

  The image data obtained by the linear CCD 20 is sent to the image processing unit 21 for processing, and the position of the front edge 18e1 of each pixel 18 aligned along the Y-axis direction y (X-axis reference position); The position (Y-axis reference position) of the side edge 18e2 of each pixel 18 aligned in the X-axis direction x is detected (step S3). When the X-axis reference position and the Y-axis reference position of the pixel 18a in the front row in the advancing direction (a) of the substrate 4 are detected, the calculation unit 23 detects the exposure position E and the imaging position F in the exposure station 2. The arrival time of the pixel 18a in the foremost row to the exposure position E is calculated from the distance L between and the preset transport speed of the substrate 4, and the opening 11a of the mask 11 in the Y-axis direction y is calculated. A positional deviation between the position and the Y-axis reference position (a positional deviation in the Y-axis direction y of the substrate 4 (Y-axis positional deviation)) is calculated, and, further, in the Y-axis direction y as shown in FIG. From the displacement amount t of the X-axis reference position of the pair of pixels 18 and 18 that are separated from each other and the distance u between the pair of pixels 18 and 18, from the X and Y axes in the plane including the XY axes of the substrate 4. Deviation angle (how to transport the substrate 4 Tilt angle) is calculated θ for (step S4).

  The main control unit 27 measures the arrival time with a built-in timer when the X-axis reference position of the pixel 18a in the front row is detected, and when the time measurement ends, the calculation unit 23 calculates the arrival time. In response to the Y-axis position shift of the substrate 4 and the inclination angle θ with respect to the conveyance direction of the substrate 4, the mask controller 26 is commanded to operate the mask drive unit 13, so that the mask drive unit 13 is driven. The position of the mask stage 12 in the Y-axis direction y and the turning angle in the horizontal plane (around the optical axis S of the exposure optical system 3) are adjusted so that the positions of the openings 11a and 11a of the mask 11 are the exposure areas of the substrate 4. 28 and 28 (step S5). At the same time, the main control unit 27 instructs the lamp power supply unit 24 to turn on the lamp 9, so that the exposure light from the lamp 9 is converted into parallel light by the illumination lens 10 and the opening 11 a of the mask 11. , 11a is applied to the substrate 4, and exposure is performed such that the shapes of the openings 18a, 18a are transferred to predetermined positions on the substrate 4 (step S6).

During the exposure, the substrate 4 is continuously transported at a constant speed in the advancing direction (a), and the linear CCD 20 always images the front edge 18e1 and the side edge 18e2 of each pixel 18a. The axis reference position and the Y axis reference position are detected, and the position and turning angle of the mask 11 in the Y axis direction y are adjusted according to the Y axis position shift of the substrate 4 and the inclination angle θ in the transport direction. The predetermined exposure areas 28 and 28 of the substrate 4 can be accurately exposed by the openings 11a and 11a of the mask 11.
When the X-axis reference position of the pixel 18b in the last row in the traveling direction (a) of the substrate 4 is detected as the exposure progresses, the main controller 27 after the arrival time of the X-axis reference position to the exposure position E In response to this command, the lamp power source 24 is activated to turn off the lamp 9 and the exposure operation on the substrate 4 is completed (step S7).
As described above, the exposure operation for the region corresponding to one unit substrate in the film-like (sheet-like) base material 4 is completed. Subsequently, while the base material 4 is conveyed in the traveling direction a, On the other hand, by performing the same exposure operation as described above and repeating this exposure operation, exposure (proxy exposure) can be performed on a region corresponding to a large number of unit substrates 4 along the longitudinal direction of the base material. it can.

The predetermined exposure areas 28, 28 have a width D corresponding to the width of the openings 11 a, 11 a of the mask 11 in the short side direction, and are arranged at intervals P in the Y-axis direction y of the substrate 4. This is a band-like region of rows (two rows in the illustrated example). The exposure regions 28 and 28 are band-like regions along the X-axis direction x that surround the pixels 18 of the red R colored layer of the color filter aligned in a straight line in the X-axis direction x.
In addition, the exposure operation with respect to the area | region in the other colored layer (green G, blue B) in the black matrix BM of the said board | substrate 4 is performed in the other similar exposure station installed separately. Prior to the exposure operation, the substrate 4 is coated with a color pigment on the black matrix BM, so that the color pigment in the area exposed by the exposure is cured. Therefore, when the exposed substrate 4 is washed with a cleaning liquid, the colored pigment in the unexposed areas is removed, and the pixels 18 of the respective colored layers R, G, B are formed in the exposed areas 28, 28 by the cured colored pigment. It is formed.

  As described above, in the exposure method according to the embodiment, the exposure light that is continuous light from the lamp 9 at the exposure station 2 with respect to the substrate 4 being transported in the constant direction at a constant speed by the substrate transport means 5. Is formed in advance on the substrate 4 in an exposure method in which the image of the openings 11a and 11a is transferred onto the substrate 4 by irradiating through the openings 11a and 11a of the mask 11 provided on the optical axis S of the exposure optical system 3. The front edge 18e1 and the side edge 18e2 of the pixel 18 are picked up by the image pickup means 6, and the X and Y reference positions in the transport direction (X-axis direction x) on the substrate 4 and the Y-axis direction y perpendicular thereto are obtained. Detecting and adjusting the position of the mask 11 so that the position of the mask 11 coincides with the reference position on the substrate 4 when the pixel 18 imaged by the imaging means 6 is moved to the exposure station 2. The exposure regions 28, 28 along the transport direction of the substrate 4 is continuously being configured to be exposed.

  Further, the exposure apparatus 1 according to the first embodiment causes the substrate 4 stored in the storage roll 14 to be wound around the take-up roll 15 by the substrate driving means 16, thereby causing the substrate 4 to move at a constant speed in a constant direction. The substrate transport means 5 transported to the substrate and the substrate 4 transported by the substrate transport means 5 are irradiated with exposure light as continuous light from the lamp 9 through the openings 11a and 11a of the mask 11, An exposure apparatus provided with an exposure optical system 3 for transferring the images of the openings 11a and 11 onto the substrate 4, wherein a front edge 18e1 and a side edge 18e2 of the pixel 18 formed in advance on the substrate 4 are provided. An image pickup means 6 for picking up an image while the substrate 4 is moving, and a transport direction on the substrate 4 based on the images of the front edge 18e1 and the side edge 18e2 picked up by the image pickup means 6 and a Y-axis direction y perpendicular thereto. The position of the mask 11 is positioned so that the position of the mask 11 coincides with the reference position on the substrate 4 when the pixel 18 imaged by the imaging means 6 is moved from the imaging position to the exposure position. A control device 8 for adjusting is provided, and the control device 8 irradiates the substrate 4 with exposure light from the lamp 9 while the substrate 4 moves from the exposure start end to the exposure end on the substrate 4. Is continued through the lamp light source unit 24.

Therefore, according to the exposure method and the exposure apparatus 1 according to the above-described embodiment, it is possible to perform exposure by continuously transferring the shape of the opening 11a of the mask 11 while the substrate 4 is transferred by the substrate transfer means 5. Therefore, even when a small mask is used, it is not necessary to perform exposure by intermittent step movement of the substrate 4, and the substrate 4 having a wide exposure area can be efficiently exposed.
In addition, since the reference position of the substrate 4 can be detected using the pixels (reference pattern) 18 formed in advance on the substrate 4, and the position of the mask 11 can be adjusted based on the reference position, the substrate 4 can be accurately exposed, and it is not necessary to form an alignment mark on the substrate 4 or the mask 11 for adjusting the position of the mask 11, and the manufacture thereof is easy. It is.

In the exposure apparatus 1, the sheet-like substrate 4 in which a large number of exposure regions 28, 28 corresponding to a unit substrate are continuously moved stepwise for each exposure region corresponding to each unit substrate, and the exposure operation is intermittently performed. Since it is not necessary to repeat the process, a large number of substrates 4 can be exposed very efficiently, and productivity can be improved.
In the exposure apparatus 1, the control device 8 adjusts the position in the Y-axis direction y perpendicular to the transport direction of the mask 11 based on each reference position in the substrate transport direction and the Y-axis direction y perpendicular thereto. When the position of the turning angle of the mask 11 is adjusted based on the inclination θ with respect to the transport direction of the substrate 4 obtained by detecting each reference position, the Y-axis reference perpendicular to the transport direction of the substrate 4 is performed. The position adjustment of the mask 11 in the Y-axis direction y and the position adjustment of the turning angle θ of the mask 11 can be performed at the same time in accordance with the position and the inclination angle θ of the substrate 4 with respect to the conveyance direction. The exposure of the predetermined exposure areas 28 and 28 can be more accurately performed by adjusting the position of the mask 11 more accurately in response to the change in the position of the substrate 4 to be performed.

  Next, an exposure apparatus 1A according to a second embodiment of the present invention will be described with reference to FIG. In this exposure apparatus 1A, the exposure apparatus 1 according to the above-described embodiment winds up the film (sheet-like) base material (substrate) 4 from the storage roll 14 by the take-up roll 15, thereby removing the substrate 4 from the exposure station. 2 is transported in a direction (X-axis direction x) perpendicular to the optical axis S of the exposure optical system 3, whereas a flat unit substrate (substrate) 4 is placed on the substrate stage 30. The substrate 4 is transported in the traveling direction A along the X-axis direction x in the exposure station 2. Since other configurations are the same as those of the exposure apparatus 1 according to the above-described embodiment, the same components are denoted by the same reference numerals and description thereof is omitted.

  In this exposure apparatus 1A, the substrate stage 30 is disposed below the mask stage 12 along a horizontal plane perpendicular to the optical axis S of the exposure optical system 3, and has a substrate driving means 16a having a servo motor, a linear motor, and the like. Is driven by a command from the substrate controller 25 to reciprocate in the X-axis direction x. Although not shown, the substrate transport means 16a detects a position of the substrate 4 in the X-axis direction x and feeds back the detected value to the control device 8 as a position sensor such as an encoder or a linear sensor. Is provided. The substrate stage 30 has a frame structure so as not to block the illumination light of the image recognition illumination 7 from below, and supports the substrate 4 at its peripheral portion.

In the exposure apparatus 1A, when the substrate driving unit 16a is driven by a command from the substrate controller 25 and the substrate stage 30 moves from one end side (right end side in FIG. 4) to the other end side, the substrate stage 30 The upper substrate 4 is continuously exposed to predetermined exposure regions 28 and 28 from the front end (exposure start end) in the traveling direction A by the exposure optical system 3 while being transported in the traveling direction A through the exposure station 2. Then, the exposure is stopped at the rear end (exposure end) in the traveling direction (a). When the exposure of one substrate 4 is completed, the substrate stage 30 returns to the original position, places a new substrate 4 and starts the next exposure operation. This operation is repeated to perform the exposure operation. During the exposure operation, the position of the mask 11 in the Y-axis direction y and the rotation angle are adjusted according to the Y-axis position shift in the Y-axis direction y of the substrate 4 and the tilt angle θ with respect to the transport direction. Of course, it is performed in the same manner as in FIG.
According to the exposure apparatus 1A according to this embodiment, since the exposure operation can be continuously performed while the substrate 4 is being transported similarly to the exposure apparatus 1 according to the embodiment, the predetermined exposure of the unit substrate 4 is possible. The regions 28 and 28 can be efficiently exposed (proxy exposure), and the exposure method according to the first embodiment of the present invention can be reliably performed.

  Next, an exposure apparatus 1B according to a third embodiment of the present invention will be described with reference to FIG. The exposure apparatus 1B differs from the exposure apparatus 1A according to the second embodiment in that the illumination lens 10 of the exposure optical system 3 in the exposure apparatus 1A is replaced with a projection lens 10a, and the projection lens 10a is a substrate. The mask stage 12 is disposed between the projection lens 10a and the lamp 9 while being disposed at a position close to the stage 30 (substrate 4). The half mirror 19 is disposed between the projection lens 10 a and the mask stage 12. Since other configurations are the same as those of the exposure apparatus 1A according to the above-described embodiment, the same components are denoted by the same reference numerals, and descriptions thereof are omitted.

In this exposure apparatus 1B, during the exposure operation, exposure light that is continuous light from the lamp 9 passes through the opening 11a of the mask 11 and is irradiated onto the substrate 4 by the projection lens 10a. The shape of the opening 11a is transferred to the surface. Accordingly, when the substrate 4 is conveyed in the advancing direction 2 by the substrate stage 30 in the same manner as in the case of the exposure apparatus 1A, the exposure optical system 3 continuously provides a predetermined exposure area 28 on the substrate 4. , 28 are exposed (projection exposure). Even during this exposure operation, the position of the mask 11 in the Y-axis direction y and the adjustment of the swivel angle according to the Y-axis position shift in the Y-axis direction y of the substrate 4 and the inclination angle θ with respect to the transport direction are adjusted by the exposure apparatus. Of course, it is performed in the same manner as in the case of 1.
The position adjustment can be performed by moving the projection lens 10a by attaching a driving unit similar to the mask driving unit 13 to the projection lens 10a instead of moving the mask stage 12. .
According to the exposure apparatus 1B according to this embodiment, the exposure operation can be continuously performed while the substrate 4 is being transported in the same manner as the exposure apparatuses 1 and 1A according to the above-described embodiment. The exposure areas 28 and 28 can be efficiently exposed, and the exposure method according to the embodiment of the present invention can be reliably performed.

  In the exposure method and exposure apparatus 1, 1 </ b> A, 1 </ b> B according to the embodiment, the lamp power supply unit 24 is operated in response to a command from the main control unit 27, so that a lamp is detected at the exposure start end of the substrate 4. 9 is turned on for exposure, and at the end of exposure, the lamp 9 is turned off to end the exposure. Instead, a shutter is provided below the lamp 9, and the lamp 9 remains on while the shutter is on. May be opened and closed to start and end exposure at the exposure start end and exposure end. Further, in the exposure method and exposure apparatus 1, 1A, 1B according to the above-described embodiment, it is applied when a colored layer (R, G, B) is formed on a substrate on which a black matrix is formed in manufacturing a color filter. However, the present invention is not limited to this, and can also be applied to the production of a transparent thin film electrode of a liquid crystal panel, the production of other semiconductor elements, the production of a photomask and a reticle, and the like.

It is a systematic diagram which shows the exposure apparatus which concerns on the 1st Embodiment of this invention. It is explanatory drawing of the position adjustment of the mask in exposure apparatus similarly. It is the flow which similarly shows the effect | action of an exposure apparatus. It is a systematic diagram which shows the exposure apparatus which concerns on the 2nd Embodiment of this invention. It is a systematic diagram which shows the exposure apparatus which concerns on the 3rd Embodiment of this invention.

Explanation of symbols

1, 1A, 1B Exposure equipment 2 Exposure station (exposure section)
DESCRIPTION OF SYMBOLS 3 Exposure optical system 4 Board | substrate 5 Board | substrate conveyance means 6 Imaging means 7 Illumination for image recognition 8 Control apparatus 9 Lamp (continuous light source)
DESCRIPTION OF SYMBOLS 10 Illumination lens 10a Projection lens 11 Mask 11a Opening part 12 Mask stage 13 Mask drive means 16, 16a Substrate drive means 18 Pixel (pattern)
18e1 Front edge (pattern edge)
18e2 Side edge (pattern edge)
20 linear CCD
DESCRIPTION OF SYMBOLS 21 Image processing part 22 Memory | storage part 23 Calculation part 24 Lamp power supply part 25 Board | substrate controller 26 Mask controller 27 Main control part E Exposure position F Imaging position

Claims (5)

The exposure unit emits exposure light from a continuous light source through a mask provided on the optical path of the exposure optical system to the substrate being transported in a constant direction at a constant speed by the substrate transport means, and the mask is placed on the substrate. In the exposure method for transferring the image of the opening of
The pattern edge of the reference pattern formed in advance on the substrate is imaged by the imaging means to detect the reference position in the transport direction on the substrate and the direction perpendicular thereto, and the reference pattern imaged by the imaging means is the imaging position. The exposure area is continuously exposed along the substrate transport direction while adjusting the position of the mask so that the position of the mask coincides with the reference position on the substrate when moved from the exposure position to the exposure position. Exposure method. The substrate transport means for transporting the substrate in a constant direction at a constant speed, and the substrate being transported by the substrate transport means, the exposure unit irradiates exposure light from a continuous light source through the opening of the mask. An exposure apparatus provided with an exposure optical system that transfers an image of an opening onto a substrate,
An imaging unit that images a pattern edge of a reference pattern previously formed on the substrate while moving the substrate, and a conveyance direction on the substrate based on an image of the pattern edge captured by the imaging unit and a direction perpendicular thereto A control device that detects a reference position and adjusts the position of the mask so that the position of the mask coincides with the reference position on the substrate when the reference pattern imaged by the imaging means is moved from the imaging position to the exposure position. The exposure apparatus is characterized in that the control device continues irradiation of the exposure light from the continuous light source onto the substrate while the substrate moves through the exposure unit from an exposure start end to an exposure end on the substrate. .   3. The exposure apparatus according to claim 2, wherein the control device performs position adjustment in a direction perpendicular to the mask conveyance direction based on a reference position in a direction perpendicular to the substrate conveyance direction.   4. The exposure apparatus according to claim 2, wherein the control device adjusts the position of the turning angle of the mask based on the inclination of the substrate with respect to the transport direction obtained by detecting each reference position. The said board | substrate conveyance means winds up a sheet-like board | substrate from a storing roll to a winding roll, and moves the said exposure part along a plane perpendicular | vertical to the optical path of the said exposure optical system, The said 2nd to 4th characterized by the above-mentioned. An exposure apparatus according to any one of the above.

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