JP2006245114A - Cooling member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cooling member which suppresses a temperature difference between an electronic component mounted inside an electronics module and a cooling medium for cooling the electronic component which is supplied from outside, and has a good maintenability at the time of removing the electronics module. <P>SOLUTION: The cooling member includes a chassis 7 which has a heat radiation surface in contact with and thermally connected to a cooling plate 3, and a mounting surface with a plurality of modules 2 mounted with the pyrogenetic electronic component 8, and which is formed with passages 20 and 21 wherein an actuation liquid which evaporates and condenses between the mounting surface and the heat radiation surface is sealed; and a fixing member which fixes the chassis 7 by bringing the heat radiation surface of the chassis 7 into contact with the cooling plate 3. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a cooling member that cools an electronic module on which an exothermic electronic component is mounted.

  Conventionally, a cooling plate that efficiently cools a plurality of modules by bringing a plurality of electronic modules (hereinafter referred to as modules) into contact with a cooling plate through which a refrigerant flows is known. This cooling plate is formed by joining a thin flat plate with a flow channel through which refrigerant flows and an extremely thin flat plate of uniform thickness, and a rectangular cross-section channel surrounded by the thin flat plate is formed in the cooling plate. The When the refrigerant flows through the cooling plate, the internal pressure rises, and the flat plate constituting the cooling plate expands due to the increase in internal pressure, and the surface adheres closely to the module. Thereby, the air layer between the module and the cooling plate can be reduced, the contact thermal resistance can be reduced, and the heat generated by the electronic components in the module can be dissipated (see, for example, Patent Document 1).

Japanese Examined Patent Publication No. 3-22074 (page 3, Fig. 3)

  In the conventional cooling member of the module, the outer wall surface of the cooling plate through which the refrigerant flows and the individual outer wall surfaces of the plurality of modules are brought into contact with each other. When removing a module from an electronic device at the time of inspection, it is necessary to remove the modules one by one.

  The present invention has been made to solve such a problem, and improves the maintainability when removing a module on which an electronic component is mounted, so that the electronic component and the refrigerant inside the cooling plate disposed outside can be reduced. It aims at obtaining the cooling member which suppresses the temperature difference between them small.

  The cooling member according to the present invention has a heat radiating surface that is in thermal contact with a cooling plate having an internal flow path, and a mounting surface for mounting a plurality of modules on which heat-generating electronic components are mounted, A chassis in which a flow path enclosing a working fluid that performs evaporation and condensation between the mounting surface and the heat radiating surface is formed, and a fixing that fixes the chassis by bringing the heat radiating surface of the chassis into contact with the cooling plate. And a member.

  Also, a heat dissipating surface that is in thermal contact with the cooling plate having an internal flow path, a mounting surface for mounting a plurality of modules on which heat-generating electronic components are mounted, the heat dissipating surface, and the mounting surface A chassis having a refrigerant flow path formed between them, a pump for discharging the refrigerant into the refrigerant flow path, and a fixing member for fixing the chassis by bringing the heat dissipation surface of the chassis into contact with the cooling plate , May be provided.

According to the present invention, a plurality of modules having electronic components mounted thereon are mounted on a common chassis, and a plurality of modules are attached and detached simultaneously by forming a flow path for transferring heat generated by the electronic components inside the chassis. And maintainability is improved.
In addition, the temperature difference between the electronic component and the refrigerant inside the cooling plate disposed outside the chassis can be reduced.

Embodiment 1 FIG.
FIG. 1 is a perspective view of an electronic apparatus in which antenna elements 1 fixed to a frame 5 are regularly arranged as in an electronic scanning antenna device such as an active phased array antenna in Embodiment 1 of the present invention. . 2 is a cross-sectional view taken along the line AA of FIG.
The cooling member according to the first embodiment includes a chassis 7, a thermal interface 12, a heat conducting member 13, frames 10 and 11, and a fixture 30.

In the electronic scanning antenna, an electronic module (hereinafter referred to as a module) 2 in which an electronic component 8 is mounted inside a metal module case is regularly arranged inside the frame 5 corresponding to the antenna element 1. The module 2 accommodates and is mounted with a heat-generating electronic component 8 inside. The power feeding terminal of the antenna element 1 is electrically connected to the power feeding terminal of the module 2 by a connector having a detachable electrical terminal (not shown). Inside the electronic scanning antenna, a cooling plate 3 having a flow path through which the refrigerant 4 flows is provided. The cooling plate 3 is fixed to the frame body 5. The refrigerant 4 flows along the cooling plate 3 in the direction of reference numeral 61 in FIG.
Since this embodiment is characterized by a thermal interface, description of the connector is omitted. As the connector, for example, a normal connector that transmits microwaves using a pin connector or a flexible coaxial line may be used.

  A frame 10 and a frame 11 are arranged inside the electronic scanning antenna and fixed to the frame 5. The frames 10 and 11 are spaced apart from each other and are erected in a direction perpendicular to the flow path of the cooling plate 3. One end face of the frame 10 is in close contact with the cooling plate 3 and thermally joined. The other end surface of the frame 11 is joined to the cooling plate 3. Note that the frame 11 does not need to be thermally connected to the cooling plate 3, but rather should be thermally disconnected.

  A plurality of modules 1 are mounted on the mounting surface of the chassis 7. The chassis 7 is inserted between the frame 10 and the frame 11 and a plurality of chassis 7 are arranged inside the electronic scanning antenna device. The chassis 7 includes two orthogonal flat surfaces on a side surface perpendicular to the mounting surface of the module 1. The chassis 7 has a fixed surface 31 forming one inclined surface at a corner on a diagonal line with respect to a corner where these two surfaces intersect. On two orthogonal surfaces of the chassis 7, a heat conductive member 13 formed of a copper alloy, an aluminum alloy, or the like is joined. The heat conducting member 13 may be configured integrally with the chassis 7.

  The heat conducting member 13 is composed of two linear members that are orthogonal to each other. A thermal interface 12 is intimately bonded to each two surfaces of the heat conducting member 13. The thermal interface 12 has a high thermal conductivity (for example, a thermal conductivity of 5 W / (m · K) or more) and high surface accuracy so that the contact thermal resistance is improved (for example, the surface accuracy is 10 points). It is composed of a polished metal surface with a roughness of 0.1 μm or less. The thermal interface 12 may be configured integrally with the heat conducting member 13. One heat radiating surface of the thermal interface 12 is in close contact with and joined to the cooling plate 3. Further, the other heat radiating surface of the thermal interface 12 is in close contact with the frame 10 between one end surface and the other end surface of the frame 10, and the longitudinal direction thereof is arranged along the longitudinal direction of the frame 10.

  The frame 11 includes a fixture 30. The fixture 30 has a screw hole through which the screw 32 passes, and is screwed to the other end surface of the frame 11 with the screw 32 interposed. The fixing tool 30 has a wedge shape, and the inclined surface of the fixing tool 30 is disposed so as to be able to contact the fixing surface 31 of the chassis 7. The frame 11, the fixture 30, and the screw 32 constitute a fixing member.

FIG. 3 is a diagram showing a portion where the chassis 7 according to the first embodiment is mounted on the electronic scanning antenna.
A flow path 20 and a flow path 21 are integrally formed inside the chassis 7. The flow path is formed by a method of hermetically sealing processed parts by welding or the like, or an optical modeling method. The thermal interface portion 12 of the chassis 7 is perpendicular to the mounting surface on which the module 2 is mounted as described above. One end of the flow path 120 and the flow path 21 formed in the chassis 7 is disposed in the vicinity immediately below the module 2, and the other end is disposed in the vicinity of the thermal interface section 12 to connect the two. It is provided as follows.
A substrate having a signal line for supplying a signal to the module 2 may be disposed on the lower surface of the chassis 7.

  The chassis 7 is mounted inside the electronic scanning antenna device so that the mounting surface of the module 2 is parallel to the direction of gravity. The flow path 20 is formed in parallel with the gravity direction, and the flow path 21 is formed so that the angle between the horizontal direction and the line connecting the vicinity of the module 2 and the thermal interface 12 is a positive value. The That is, one end portion on the thermal interface 12 side of the flow channel 20 and the flow channel 21 is arranged to be positioned above the other end portion. The flow path 20 and the flow path 21 are filled with a working liquid 28 that evaporates at the high temperature portion and condenses at the low temperature portion.

Next, the heat radiation operation of the cooling member according to the first embodiment will be described.
The chassis 7 has a wedge-shaped fixing tool 30 fixed by screws 32 fitted to the frame 11, whereby a fixing force is generated at the fixing surface 31, and the thermal interface portion 12 has the frame 11 or It is fixed so as to contact the cooling plate 3.
That is, by fastening the screw 32 to the frame 11, the fixing surface of the fixture 30 biases the fixing surface 31. The fixing surface 31 is urged by the fixing surface of the fixture 30, and the thermal interface 13 of the chassis 7 receives a reaction force from the frame 10 and the cooling plate, and the thermal interface 13 includes the cooling plate 3 and Adhere tightly to the frame 10. Further, by loosening the screw 32, the restraining force from the fixture 30 is released, and the chassis 7 is separated from the frame 10 and the cooling plate 3.

The heat generated in the electronic component 8 mounted inside the module 2 is exhausted into the flow path 20 and the flow path 21 near the position where the module 2 is mounted on the chassis 7 in the flow path 20 and the flow path 21. It is. As a result, the working fluid 8 enclosed in the flow path 20 and the flow path 21 evaporates.
The evaporated working fluid 8 is transferred by heat by moving in the flow path 120 and flow path 21 to the vicinity of the thermal interface portion 12 of the chassis 7 in the direction opposite to the gravity. In the vicinity of the thermal interface portion 12 of the flow channel 20 and the flow channel 21, the hydraulic fluid 28 condenses, whereby heat is transferred from the hydraulic fluid 28 to the thermal interface portion 12 through the heat conducting member 13. The heat transferred to the thermal interface unit 12 is transferred to the refrigerant 4 through the cooling plate 3 in contact with the thermal interface unit 12 and is discharged to the outside along with the flow of the refrigerant 4.

In the conventional cooling structure, the heat of the electronic components housed in the module is transferred to the cooling plate by the heat conduction inside the chassis, but the heat conductivity of the chassis members is not necessarily small enough, In the heat transfer path to the refrigerant inside the cooling plate, a high temperature difference occurs inside the chassis, and the temperature of the electronic component has risen to an unacceptable temperature.
However, in this embodiment, the thermal resistance between the module 2 and the cooling plate 3 is reduced by increasing the thermal conductivity of the thermal interface 12 and decreasing the contact thermal resistance to the cooling plate. Yes.

  As described above, in this embodiment, a plurality of modules in which heat-generating electronic components are mounted is mounted in one chassis, and a flow path is formed that encloses hydraulic fluid for transferring heat provided in the chassis. As a result, the heat of the electronic components mounted inside the module can be transferred, and a plurality of modules can be attached and detached simultaneously, improving the maintainability when attaching and detaching the modules. In addition, the temperature difference between the electronic component and the refrigerant inside the cooling plate disposed outside the chassis can be reduced.

  In addition, heat of the electronic component is transferred to a thermal interface portion having a surface perpendicular to a surface on which a plurality of modules for mounting the heat-generating electronic components are mounted, and the outside of the chassis is transferred via the thermal interface portion. By having a structure in which heat is transferred to the refrigerant inside the arranged cooling plate, the temperature difference between the electronic component and the refrigerant inside the cooling plate arranged outside the chassis can be reduced.

  Further, the first surface is provided with a two-sided thermal interface portion that is perpendicular to the surface on which the plurality of modules for mounting the heat-generating electronic components are mounted, and the angle formed is substantially vertical. The heat of the electronic component is transferred from the first flow path to the second surface, the heat is transferred from the second flow path to the second surface, and the refrigerant in the cooling plate disposed outside the chassis via the thermal interface portion. By having a structure in which heat is transferred to the heat exchanger, the temperature difference between the electronic component and the refrigerant inside the cooling plate arranged outside the chassis can be reduced.

  In addition, the surface on which a plurality of modules on which heat-generating electronic components are mounted is arranged parallel to the direction of gravity, and the flow path of the hydraulic fluid connects the vicinity of the position where the module is mounted and the vicinity of the thermal interface section. By arranging so that the angle between the line and the horizontal direction becomes a positive value, the evaporated hydraulic fluid moves in the direction opposite to gravity, and the condensed hydraulic fluid moves easily in the direction of gravity. The heat of the electronic component is effectively transferred, and the temperature difference between the electronic component and the refrigerant inside the cooling plate disposed outside the chassis can be reduced.

  Furthermore, by mounting a plurality of modules on which heat-generating electronic components are mounted in one chassis and having the structure in which the chassis can be easily detached from the electronic scanning antenna with a wedge-shaped fixture, the plurality of modules can be mounted. It is possible to attach and detach at the same time, and it is possible to improve the maintainability when attaching and detaching.

Embodiment 2. FIG.
FIG. 4 is a diagram showing a portion where the chassis 7 according to the second embodiment is mounted on the electronic scanning antenna device. The fixture 33 is pivotally supported so as to rotate around the axis of the rotation shaft 34 provided in the chassis 7. The fixture 33 has a groove for fitting into a convex portion (fitting portion) provided on the frames 10 and 11 (posts). The frames 10 and 11 and the fixture 33 constitute a fixing member.
By tightening the screw 35 fixed to the chassis 7, the groove of the fixture 33 acts like a cam against the convex portion of the frame 10, urging the chassis 7 to the cooling plate 3, and thermal The interface 12 contacts the side surface of the cooling plate 3.
As a result, the fixed chassis 7 is fixed to the cooling plate 3 in a state in which the convex portion of the frame 10 is fitted in the groove of the fixture 33 so that a contact pressure is generated between the cooling plate 3 and the cooling plate 3. Other structures are the same as those of the first embodiment.

  As described above, in this embodiment, the plurality of modules 2 for mounting the heat-generating electronic components 8 are mounted in one chassis, and the chassis is fixed by the fixture 33. The fixing tool 33 has a groove for rotating around a rotation axis provided in the chassis and fitting with the frame convex portion. By providing a screw for fixing in a state where it is fitted to the convex part of the frame, and having a structure that allows the chassis to be easily attached and detached from the electronic scanning antenna with a fixture, multiple modules can be attached and detached at the same time. The maintainability during the process can be improved.

Embodiment 3 FIG.
FIG. 5 is a diagram showing a portion where the chassis 7 according to the third embodiment is mounted on the electronic scanning antenna device. The fixture 38 holds the spring 36, and the chassis 7 is fixed to the cooling plate 3 by coupling the screw 32 to both the frames 10 and 11. That is, by tightening the screw 32, the thermal interface 12 joined to the chassis 7 is urged to the cooling plate 3 by the reaction force of the spring 36, and a contact pressure is generated between the cooling plate 3 and the chassis. 7 is fixed. Other structures are the same as those in the first embodiment.
The frames 10 and 11, the spring 36, and the fixture 38 constitute a fixing member.

  As described above, this embodiment has a structure in which a plurality of modules in which heat-generating electronic components are mounted are mounted in one chassis, and the chassis can be easily attached to and detached from the electronic scanning antenna by a fixture that applies a spring force. As a result, a plurality of modules can be attached and detached at the same time, and the maintainability at the time of attachment / detachment can be improved.

Embodiment 4 FIG.
FIG. 6 is a diagram showing a portion where the chassis 7 according to the fourth embodiment is mounted on the electronic scanning antenna device. A module 2 having an exothermic electronic component mounted therein is mounted on the chassis 7. The thermal interface portion 12 provided on the heat conducting member 13 joined to the chassis 7 is provided on a surface perpendicular to the surface on which the module 2 is mounted.

  A flow path 25 is integrally formed in the chassis 7. A coolant 29 is sealed in the flow path 25, and a pump 26 that causes the coolant 29 to flow is joined in a watertight manner. The pump 26 is configured by a diagram system or a system in which a magnetic fluid is used as a refrigerant and a flow is generated by a magnetic force. The flow path 25 formed in the chassis 7 is formed in a closed loop shape so that the refrigerant 29 circulates through the vicinity of the module 2 and the vicinity of the thermal interface unit 12. The flow path 25 is branched and formed so as to pass through the vicinity of the plurality of modules 2, join at the downstream side thereof, and be connected to the pump 26. Other configurations are the same as those in the first embodiment.

  The chassis 7 is fixed at the fixing surface 31 by fixing the wedge-shaped fixing tool 30 with the screw 32 fitted to the frame 11 in the same manner as the fixing tool 30 described in FIG. 3 of the first embodiment. Power is generated. The chassis 7 is fixed at the thermal interface portion 12 so as to contact the cooling plate 3. In addition to the structure using the wedge-shaped fixture 30, the chassis 7 has a rotation shaft and a groove that rotates around the rotation axis and fits to the external structure, as described in the second embodiment. You may use the structure using the fixing tool 33 which provided the screw for fixing in the state fitted to the external structure part. Moreover, the structure using the fixing tool 38 using a spring force may be sufficient.

  Two chassis 7 may be provided, and a board having a signal line for supplying signals to the module 2 may be mounted so as to be sandwiched between the two chassis 7.

Next, the heat radiation operation of this embodiment will be described.
The heat generated in the electronic component 8 mounted inside the module 2 is transferred to the refrigerant 29 by heat transfer near the position where the module 2 in the flow path 25 is mounted on the chassis 7, and is discharged from the pump 26. According to the flow of 29, it is transferred to the vicinity of the thermal interface section 12. In the vicinity of the thermal interface portion 12 of the flow path 25, heat is transferred from the refrigerant 29 to the thermal interface portion 12 by heat transfer, and the heat is transferred to the refrigerant 4 via the cooling plate 3 and the flow of the refrigerant 4. And it is discharged outside.

  As described above, in this embodiment, a pump that generates a flow by mounting a plurality of modules in which heat-generating electronic components are mounted in one chassis, enclosing a refrigerant to transfer heat provided in the chassis, and Use a closed flow path. By transferring the heat of the electronic components mounted inside the module, a plurality of modules can be attached and detached at the same time, and maintainability is improved. In addition, the temperature difference between the electronic component and the refrigerant inside the cooling plate disposed outside the chassis can be reduced.

  In addition, heat of the electronic component is transferred to a thermal interface portion having a surface perpendicular to a surface on which a plurality of modules for mounting the heat-generating electronic components are mounted, and the outside of the chassis is transferred via the thermal interface portion. By having a structure in which heat is transferred to the refrigerant inside the arranged cooling plate, the temperature difference between the electronic component and the refrigerant inside the cooling plate arranged outside the chassis can be reduced.

  In addition, by branching the flow path and passing through the vicinity of the plurality of modules and joining them on the downstream side, the electronic components mounted inside each of the plurality of modules and the outside of the chassis are arranged. The temperature difference with the refrigerant inside the cooling plate can be reduced.

  In addition, a plurality of modules in which heat-generating electronic components are mounted may be mounted on one chassis, and the chassis may be easily detached from the electronic scanning antenna with a wedge-shaped fixture. As a result, a plurality of modules can be attached and detached at the same time, and maintainability can be improved.

  Also, a plurality of modules for mounting the heat-generating electronic components are mounted on one chassis, the chassis is rotated around the rotation axis and a groove for fitting with the frame protrusion, and the frame has You may provide the screw and fixing tool for fixing in the state fitted to the convex part. By having such a structure that can be easily attached to and detached from the electronic scanning antenna, a plurality of modules can be attached and detached simultaneously, and the maintainability can be improved.

  In addition, a plurality of modules in which the heat-generating electronic components are mounted may be mounted on one chassis, and the chassis may be easily detached from the electronic scanning antenna by a fixing tool using a spring force. As a result, a plurality of modules can be attached and detached at the same time, and maintainability can be improved.

Embodiment 5. FIG.
FIG. 7 is a diagram showing a portion where the chassis 7 according to the fifth embodiment is mounted on the electronic scanning antenna device. 8 is a cross-sectional view taken along line AA in FIG.

A module 2 having an exothermic electronic component 8 mounted therein is mounted on the chassis 7. The chassis 7 is provided with a flow path 25 in which a refrigerant 29 is sealed and a pump 26 is connected in a watertight manner. A thermal interface section 12 is provided on the chassis 7 in parallel with the surface on which the module 2 is mounted.
Two chassis 7 are provided, and the cooling plate 3 is sandwiched between the two chassis 7. The flow path 25 provided in the chassis 7 is arranged so as to connect from the vicinity of the module 2 to the vicinity of the thermal interface unit 12. The chassis 7 is sandwiched between two concave fixtures 38 (fixing members) and fixed to the cooling plate 3. Both end portions of the chassis 7 are sloped, and the two fixtures 38 are also provided with the same slope shape, whereby the two fixtures 38 are urged and fixed in directions approaching each other, so A contact force is generated between the chassis 7 and the cooling plate 3.
The cooling plate 3 is fixed to the frame 5 by screw fastening or the like. Of the four fixtures 38 shown in the figure, two fixtures 38 on the antenna element 1 side may be fixed to the frame 5.
Other configurations are the same as those of the first embodiment described with reference to FIG.

  The heat generated in the electronic component 8 mounted inside the module 2 is transferred to the refrigerant 29 by heat transfer in the vicinity of the position where the module 2 in the flow path 25 is mounted on the chassis 7. To the vicinity of a typical interface unit 12. In the vicinity of the thermal interface portion 12 of the flow path 25, heat is transferred from the refrigerant 29 to the thermal interface portion 12 by heat transfer, and the heat is transferred to the refrigerant 4 via the cooling plate 3 and the flow of the refrigerant 4. And it is discharged outside.

The chassis 7 encloses a working fluid for heat transfer according to the principle of liquid evaporation and condensation as described in the first embodiment, in addition to a structure in which a flow path in which a refrigerant is enclosed and a pump is connected is provided. A structure provided with a flow path may be used.
Two chassis 7 may be provided, and a board having a signal line for supplying signals to the module 2 may be mounted so as to be sandwiched between the two chassis 7.

  As described above, in this embodiment, a plurality of modules in which heat-generating electronic components are mounted is mounted in one chassis, and a pump is provided that encloses a refrigerant and generates a flow to transfer heat provided in the chassis. The heat of the electronic component mounted inside the module is transferred by the closed flow path. Thereby, a plurality of modules can be attached and detached at the same time, and maintainability is improved. In addition, the temperature difference between the electronic component and the refrigerant inside the cooling plate disposed outside the chassis can be reduced.

  In addition, a plurality of modules in which heat-generating electronic components are mounted are mounted in one chassis, and an electronic circuit mounted in the module is provided by a flow path enclosing a working fluid for transferring heat provided in the chassis. Transfers part heat. Thereby, a plurality of modules can be attached and detached at the same time, and maintainability is improved. In addition, the temperature difference between the electronic component and the refrigerant inside the cooling plate disposed outside the chassis can be reduced.

Embodiment 6 FIG.
FIG. 9 is a diagram illustrating a portion where the chassis 7 according to the sixth embodiment is implemented in the scanning antenna device.

The chassis 7 is formed with a straight flow path 27 in which a refrigerant 29 is sealed and a pump 26 is connected in a watertight manner. Other structures are the same as those of the fifth embodiment. The pump 26 is of a diagram type, and generates an oscillating flow that repeatedly reciprocates in the refrigerant 29 inside the flow path 27 by applying pressure and pressure reduction.
Other configurations are the same as those of the fifth embodiment.

In this embodiment, the heat dissipation operation is performed as follows.
The heat generated in the electronic component 8 mounted inside the module 2 is transferred to the refrigerant 29 by heat transfer in the vicinity of the position where the module 2 in the flow path 25 is mounted on the chassis 7. To the vicinity of a typical interface unit 12. In the vicinity of the thermal interface unit 12 in the flow path 25, heat is transferred from the refrigerant 29 to the thermal interface unit 12 by heat transfer. The heat transmitted to the interface unit 12 is transferred to the refrigerant 4 via the cooling plate 3 and discharged to the outside along with the flow of the refrigerant 4.
Even when the flow path of the cooling plate 3 exists directly under the module 2, the refrigerant 29 is mounted inside the module 2 by generating an oscillating flow inside the flow path 26 in the vicinity of the module 2. The heat generated in the electronic component 8 has an effect of being diffused and transmitted. For this reason, the heat generated in the electronic component 8 is effectively transferred to the refrigerant 4 via the cooling plate 3.

  As described above, in this embodiment, a plurality of electronic modules for mounting heat-generating electronic components are mounted in one chassis, and a pump is provided that encloses a refrigerant and generates a flow to transfer heat provided in the chassis. By transferring the heat of the electronic components mounted inside the electronics module through the closed flow path, a plurality of electronics modules can be attached and detached at the same time, and maintainability is improved. In addition, the temperature difference between the electronic component and the refrigerant inside the cooling plate disposed outside the chassis can be reduced.

Embodiment 7 FIG.
FIG. 10 is a cross-sectional view showing a portion where the chassis 7 according to the seventh embodiment is mounted on the electronic scanning antenna device.

  A module 2 having a heat generating electronic component 8 mounted therein is mounted on the chassis 7. The chassis 7 is provided with a first flow path 70 immediately below the surface on which the module 2 is mounted, and the thermal interface 12 located on a plane parallel to the first flow path 70 and the surface on which the module 2 is mounted. A second flow path 71 is provided between the two. The first channel 70 and the second channel 71 are connected to each other to form a channel in a closed loop. Other configurations are the same as those of the fifth embodiment.

  As described above, in this embodiment, a plurality of modules in which heat-generating electronic components are mounted is mounted in one chassis, and a pump is provided that encloses a refrigerant and generates a flow to transfer heat provided in the chassis. The heat of the electronic component mounted inside the module is transferred by the closed flow path. Thereby, a plurality of modules can be attached and detached at the same time, and maintainability is improved. In addition, the temperature difference between the electronic component and the refrigerant inside the cooling plate disposed outside the chassis can be reduced.

Embodiment 8 FIG.
FIG. 11 is a cross-sectional view showing a portion where the module 2 according to the eighth embodiment is mounted on the chassis 7.

  The module 2 or the heat generating electronic component 8 is fixed to a fixing member 80 having fins 81. The fixing member 80 is watertightly joined to the flow path 25 provided in the chassis 7. The fins 81 are in direct contact with the refrigerant 29 inside the flow path 25 provided in the chassis 7. Thereby, the heat generated in the heat-generating electronic component 8 is effectively transferred in the flow direction indicated by the reference numeral 61 of the refrigerant 29. Other configurations are the same as those of the fifth embodiment.

  As described above, in this embodiment, a plurality of modules in which heat-generating electronic components are mounted is mounted in one chassis, and a pump is provided that encloses a refrigerant and generates a flow to transfer heat provided in the chassis. The heat of the electronic component mounted inside the module is transferred by the closed flow path. As a result, a plurality of modules can be attached and detached at the same time, and the maintainability is improved. In addition, the temperature difference between the electronic component and the refrigerant inside the cooling plate disposed outside the chassis can be reduced.

Embodiment 9 FIG.
FIG. 12 is a cross-sectional view showing a portion where the module 2 according to the ninth embodiment is mounted on the chassis 7.

The module 2 or the heat-generating electronic component 8 is fixed to the package 82. The package 82 is mounted on a substrate 84 that is electrically connected to the module 2 or the electronic component 8. The heat sink 83 has a space that covers the package 82. The bottom surface of the heat sink 83 is filled with thermally conductive grease, or a thermal interface such as a thermally conductive rubber inserted between the bottom surface of the heat sink 83 and the bottom surface of the package 82 is provided. Through these thermal interfaces, the heat sink 83 is thermally connected to the bottom surface of the package 82. The substrate 84 is fixed to the heat sink 83. The heat sink 83 is thermally connected to the chassis 7 in the vicinity of the flow path 25 and is fixed to the chassis 7.
Thereby, the constituent material between the electronic component 8 and the chassis 7 can be simplified, and heat can be effectively transferred from the electronic component 8 to the refrigerant inside the chassis 7. The cooling plate 3 is thermally connected to the lower surface of the chassis 7, and the heat generated by the electronic component 8 is transferred to the refrigerant 4 of the cooling plate 3. Other configurations are the same as those of the fifth embodiment.

As described above, in this embodiment, a plurality of modules in which heat-generating electronic components are mounted are mounted in one chassis, and a pump is provided that encloses a refrigerant and generates a flow to transfer heat provided in the chassis. The heat of the electronic component mounted inside the module is transferred by the closed flow path. As a result, a plurality of modules can be attached and detached at the same time, and the maintainability is improved.
In addition, the temperature difference between the electronic component and the refrigerant inside the cooling plate disposed outside the chassis can be reduced.

Embodiment 10 FIG.
FIG. 13 is a cross-sectional view showing a portion where the module 2 according to the tenth embodiment is mounted on the chassis 7.

  The module 2 or the heat-generating electronic component 8 is fixed to a package 82, and the package 82 is mounted on a substrate 84 that is electrically connected to the module 2 or the electronic component 8. The chassis 7 is provided with a frame around the periphery, and is provided with a recess according to the height of the package 82 mounted on the substrate 84. The substrate 84 has a metallized layer that communicates with the ground at a portion corresponding to the frame of the chassis 7 and is in electrical contact with the frame of the chassis 7. A recess is formed in the vicinity of the flow path 25 of the chassis 7. The hollow portion of the chassis 7 and the package are thermally formed by heat conductive grease filled in the hollow portion of the chassis 7 or a heat conductive rubber inserted between the hollow portion of the chassis 7 and the bottom surface of the package 82. Connecting. Thus, the constituent material between the electronic component 8 and the chassis 7 can be simplified, and heat can be effectively transferred from the electronic component 8 to the refrigerant 4 inside the cooling plate 3 in the same manner as in the ninth embodiment. . Other configurations are the same as those of the ninth embodiment.

  As described above, in this embodiment, a plurality of modules in which heat-generating electronic components are mounted is mounted in one chassis, and a pump is provided that encloses a refrigerant and generates a flow to transfer heat provided in the chassis. The heat of the electronic component mounted inside the module is transferred by the closed flow path. Thereby, a plurality of modules can be attached and detached at the same time, and maintainability is improved. In addition, the temperature difference between the electronic component and the refrigerant inside the cooling plate disposed outside the chassis can be reduced.

It is a figure which shows the electronic scanning antenna apparatus by Embodiment 1 of this invention. It is a figure which shows the partial cross section of the electronic scanning antenna apparatus by Embodiment 1 of this invention. It is a figure which shows the cooling structure by Embodiment 1 of this invention. It is a figure which shows the cooling structure by Embodiment 2 of this invention. It is a figure which shows the cooling structure by Embodiment 3 of this invention. It is a figure which shows the cooling structure by Embodiment 4 of this invention. It is a figure which shows the cooling structure by Embodiment 5 of this invention. It is sectional drawing which shows the cooling structure by Embodiment 5 of this invention. It is a figure which shows the cooling structure by Embodiment 6 of this invention. It is sectional drawing which shows the cooling structure by Embodiment 7 of this invention. It is sectional drawing which shows the cooling structure by Embodiment 8 of this invention. It is sectional drawing which shows the cooling structure by Embodiment 9 of this invention. FIG. 10 is a sectional view showing a cooling structure according to Embodiment 10 of the present invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Antenna element 2 Module 3 Cooling plate 4 Refrigerant 5 Frame 7 Chassis 8 Electronic component 9 10 Frame 11 Frame 12 Thermal interface part 13 Heat conduction member 20 Flow path 21 Flow path, 25 Flow path 3, 26 Pump, 27 Flow path 3, 28 Hydraulic fluid, 29 Refrigerant, 30 Fixing tool, 31 Fixing surface, 32 Screw, 33 Fixing tool, 34 Rotating shaft, 35 Screw, 36 Spring, 37 Screw , 38 Fixing tool, 61 Flow direction, 70 First flow path, 71 Second flow path, 80 Fixing member, 81 Fin, 82 Package, 83 Heat sink, 84 Substrate, 85 Depression, 86 Frame.

Claims (20)

A heat-dissipating surface that is in thermal contact with a cooling plate having an internal flow path, and a mounting surface for mounting a plurality of modules on which heat-generating electronic components are mounted. A chassis formed with a flow path enclosing a working fluid that performs evaporation and condensation between them,
A fixing member for fixing the chassis by bringing the heat dissipation surface of the chassis into contact with the cooling plate;
A cooling member. The heat dissipation surface of the chassis is provided perpendicular to the mounting surface,
The cooling member according to claim 1, wherein one end of the flow path of the chassis is disposed in the vicinity of the heat radiating surface, and the other end is disposed immediately below the mounting surface. The chassis has two heat dissipating surfaces perpendicular to each other,
One of the heat radiating surfaces is arranged in parallel with the flow path formed in the cooling plate,
The cooling member according to claim 2, wherein the other end of the flow path formed in the chassis is disposed close to the one heat radiating surface.   4. The flow path of the chassis is parallel to gravity or has a positive angle with the horizontal, and the one end is located above the other end. Cooling member.   The cooling member according to claim 2, wherein the fixing member includes a wedge-shaped fixing tool that urges the heat radiating surface of the chassis detachably with respect to the cooling plate. The fixing member includes a fixture that urges the heat radiating surface of the chassis detachably with respect to the cooling plate, and a support column having a fitting portion.
The fixture is rotatably supported by the chassis, and a groove is formed to be fitted to the fitting portion in a state where the heat radiation surface of the chassis is biased to the cooling plate, and the fixture The cooling member according to claim 2, further comprising a screw for fixing the screw to the chassis.   The cooling member according to claim 2, wherein the fixing member includes a spring that detachably biases the heat radiating surface of the chassis with respect to the cooling plate, and a fixture that fixes the spring. .   The cooling member according to claim 1, wherein the heat radiating surface forms a surface substantially parallel to a mounting surface of the chassis. A heat dissipating surface that is in thermal contact with a cooling plate having an internal flow path, a mounting surface for mounting a plurality of modules on which heat-generating electronic components are mounted, and between the heat dissipating surface and the mounting surface A chassis having a refrigerant flow path formed on and a pump for discharging the refrigerant to the refrigerant flow path,
A fixing member for fixing the chassis by bringing the heat dissipation surface of the chassis into contact with the cooling plate;
A cooling member. The heat dissipation surface of the chassis is provided perpendicular to the mounting surface,
The cooling member according to claim 9, wherein one end of the flow path of the chassis is disposed in the vicinity of the heat radiating surface, and the other end is disposed immediately below the mounting surface.   10. The cooling according to claim 9, wherein the flow path of the chassis branches into a plurality of downstreams of the pump, and passes through the vicinity of the plurality of heat-generating electronic components and merges on the upstream side of the pumps. Element.   The cooling member according to claim 9, wherein the flow path of the chassis is formed in a straight tube shape and generates a vibration flow together with a pump connected to the flow path.   The flow path of the chassis forms first and second flow paths that form a closed loop immediately below the mounting surface, and the first flow path is disposed between the second flow path and the mounting surface. The cooling member according to claim 9, wherein the cooling member is formed. The chassis includes a mounting board having fins below the mounting surface,
The cooling member according to claim 9, wherein the fin of the mounting substrate is disposed so as to protrude into the flow path. The electronic component is housed in a package and mounted on a substrate.
The substrate is placed on a heat sink member constituting the chassis,
10. The cooling member according to claim 9, wherein the heat sink member is thermally connected to the chassis in the vicinity of the flow path, and the package and the heat sink member are thermally connected. The electronic component is housed in a package and mounted on a substrate.
The substrate is placed on the chassis,
The cooling member according to claim 9, wherein the package is thermally connected to a recess provided in the chassis in the vicinity of the flow path.   The cooling member according to claim 9, wherein the fixing member includes a wedge-shaped fixing tool that urges the heat radiating surface of the chassis detachably with respect to the cooling plate. The fixing member includes a fixture that urges the heat radiating surface of the chassis detachably with respect to the cooling plate, and a support column having a fitting portion.
The fixture is rotatably supported by the chassis, and a groove is formed to be fitted to the fitting portion in a state where the heat radiation surface of the chassis is biased to the cooling plate, and the fixture The cooling member according to claim 9, further comprising a screw for fixing the screw to the chassis.   The cooling member according to claim 9, wherein the fixing member includes a spring that detachably biases the heat radiating surface of the chassis with respect to the cooling plate, and a fixture that fixes the spring. . The chassis is composed of two separate members,
The cooling member according to claim 9, further comprising a substrate for supplying a signal to the electronic component between the two members.

Images