JP2006116675A - Abrasive cloth and wafer polishing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an abrasive cloth and a polishing device capable of polishing a wafer highly flat with little surface sagging on an outer peripheral part of the wafer. <P>SOLUTION: The abrasive cloth 12 is attached on a surface of a disc type surface plate 11 free to rotate in the predetermined direction, and the abrasive cloth 12 has a plurality of grooves 16 on its surface. Density of the grooves 16 on a central portion 12a of the abrasive cloth 12 is higher than density of the grooves 16 on an outer peripheral portion 12b on the outside of the central portion 12a of the abrasive cloth 12. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a technique for polishing a thin plate-shaped object, and more particularly to a polishing cloth and a polishing apparatus for polishing a surface of an object that requires a highly flat surface such as a semiconductor wafer.

  Conventionally, a semiconductor wafer used as a raw material wafer for manufacturing a semiconductor device is generally polished with a polishing cloth in order to obtain a wafer having a highly flat surface.

A wafer used as a raw material wafer for manufacturing a semiconductor device is a single crystal semiconductor ingot grown by the Czochralski method (CZ method) or the floating zone melting method (FZ method), and the outer periphery of the grown semiconductor ingot is It is formed by grinding with a cylindrical grinder or the like and slicing with a wire saw in a slicing step.
Thereafter, the wafer peripheral portion is chamfered in a chamfering process, and after a flattening process and an etching process in a lapping process, after primary polishing and secondary polishing, an epitaxial growth process is performed on the wafer surface to obtain a mirror wafer.

The mirror surface wafer obtained through such a process is formed with a circuit on its surface to become a semiconductor device.
However, when the surface flatness of the wafer manufactured through the above steps is low, the lens focus is not partially focused during exposure in the photolithography process for forming the circuit, and it becomes difficult to form a fine pattern of the circuit. .

Therefore, extremely high flatness is required in recent high-precision device fabrication.
In order to manufacture a wafer having such extremely high flatness, the surface polishing of the wafer is very important. In general, as a polishing apparatus for performing surface polishing of a wafer, a double-side polishing apparatus, a single-wafer single-side polishing apparatus, a batch-type single-side polishing apparatus, and the like are widely known.

FIG. 17 is a schematic view showing an example of a double-side polishing apparatus. FIG. 17A is a plan view schematically showing the carrier rotation mechanism of the double-side polishing apparatus, and FIG. 17B is a longitudinal sectional view of a part of the double-side polishing apparatus.
In the double-side polishing apparatus, the upper surface plate 1a and the lower surface plate 1b that form an annular shape when viewed from above are parallel with the surfaces to which the polishing cloth 2 is attached facing each other as shown in FIG. Hold on.

  As shown in FIG. 17A, a substantially disc-shaped carrier 51 for holding a wafer is provided between the upper surface plate 1a and the lower surface plate 1b, and a sun gear 55 provided at the center of the lower surface plate 1b. Five centers are arranged at equal intervals. Each carrier 51 is made of SK5 tool steel, SUS, or the like, and has a plurality of through-loading holes 52 that accommodate the wafer W on the plate surface. In order to allow the wafer W to rotate within the loading hole 52, the loading hole 52 is a circular hole having a diameter of 201 mm, for example, when a wafer W having a diameter of 200 mm is accommodated.

  FIG. 17A shows an example in which six loading holes 52 are radially provided in the carrier 51 at equal intervals. The number and arrangement of these loading holes 52 can be set appropriately for each double-side polishing apparatus. It is a matter and it is not limited to these.

  A planet gear 53 is provided on the outer periphery of the carrier 51 and meshes with a sun gear 55 provided at the center of the lower surface plate 1b. The sun gear 55 can be rotated independently of the upper surface plate 1a and the lower surface plate 1b by driving means (not shown).

  An internal gear 54 is disposed around the lower surface plate 1 b with a certain gap from the outer periphery of the lower surface plate 1 b and meshes with the planet gear 53 of the carrier 51. The internal gear 54 has an inner peripheral surface concentric with the sun gear 55, and a gear portion is provided on the inner peripheral surface. This internal gear 54 can be rotated independently of the upper surface plate 1a and the lower surface plate 1b by driving means (not shown).

  Then, in a state where the wafer W is accommodated in the loading hole 52, both the sun gear 55 and the internal gear 54 or either one of the sun gear 55 or the internal gear 54 is rotated, so that the carrier 51 and the lower surface plate 1a are lowered. It rotates relative to the board 1b. At this time, either the upper surface plate 1a or the lower surface plate 1b or both the upper surface plate 1a and the lower surface plate 1b may be rotated.

  In this state, a polishing liquid such as a slurry is supplied to the upper surface of the carrier 51 and flows between the upper and lower surface plates 1 a and 1 b and the wafer W. As a result, the polishing cloth 2 provided on the upper surface plate 1a and the lower surface plate 1b and the wafer W slide relative to each other, and the surface of the wafer W is scraped and polished.

  FIG. 18 is a longitudinal sectional view schematically showing a single-wafer single-side polishing apparatus. This polishing apparatus is roughly composed of a polishing surface plate 1, a polishing head 64, and a slurry tube 8.

The polishing surface plate 1 is provided with a flat surface having an area that is twice or more the diameter of the wafer W that is the object to be polished, and a polishing cloth 2 such as a non-woven fabric made of polyester resin is bonded to the flat surface. It is affixed with an agent or the like, and is configured to rotate around the surface plate rotation axis.
The polishing head 64 is positioned above the polishing surface plate 1, has a head rotation shaft disposed at a position deviated from the surface plate rotation axis of the polishing surface plate 1, and is configured to rotate around the head rotation axis. Yes.

The polishing head 64 includes a vacuum chuck mechanism 65 as a holding unit that holds the wafer W.
The vacuum chuck mechanism 65 includes a suction surface provided with a plurality of suction holes, a suction tube provided at the center of the head rotation axis of the polishing head 64, and a suction tube for sucking one surface of the wafer W. It consists of a connected suction pump.

  The configuration of the polishing head 64 that holds the wafer W is not necessarily a vacuum chuck mechanism, and is a configuration in which the wafer W is water-bonded using a backing pad made of a porous resin such as a polyurethane resin porous body. May be. In the case of the vacuum chuck mechanism 65, the wafer W is fixed to the polishing head 64 in a non-rotatable manner. However, in the case of applying water with a backing pad, the wafer W is held rotatably with respect to the polishing head 64. The

  A ring-shaped retainer 68 is provided on the outer periphery of the vacuum chuck mechanism 65. The retainer 68 serves to prevent lateral displacement of the wafer W and receives pressure from the polishing cloth 2 on the outer peripheral portion of the wafer W by the retainer 68 so that the surface pressure applied to the surface to be polished of the wafer W is uniform. To. The retainer 68 is not an essential component for the single-wafer single-side polishing apparatus, and the retainer 68 may not be provided.

  The slurry tube 8 supplies a polishing liquid (slurry) between the polishing cloth 2 and the wafer W in the vicinity of the center of rotation of the polishing platen 1. Then, by rotating the polishing platen 1 and the polishing head 64 while the wafer W is attracted to the vacuum chuck mechanism 65, the wafer W is displaced on the polishing cloth 2 and the surface of the wafer W is scraped off. Polished.

Next, an example of a batch type single-side polishing apparatus is shown in FIG. FIG. 13A is a vertical cross-sectional view of a batch type single-side polishing apparatus, and FIG. 13B is an enlarged cross-sectional view of a main part of the batch type single-side polishing apparatus. A batch-type single-side polishing apparatus is an apparatus that polishes only one side of a wafer by one polishing, and can polish a plurality of wafers simultaneously.
In FIG. 13, reference numeral 1 is a surface plate having a disk shape that can be rotated in a predetermined direction (for example, counterclockwise when viewed from above), and reference numeral 2 is a non-woven fabric attached to the surface of the surface plate 1. Polishing cloth for polishing, reference numeral 4 is a polishing head arranged above the polishing cloth 2 and rotates around the support shaft 3, reference numeral 9 is a carrier plate arranged on the lower surface of the polishing head 4, and reference numeral 6 is a carrier plate A template that is fixed to the lower surface of 9 and holds the wafer W in the wafer positioning hole 6 a, and 8 is a slurry tube that supplies slurry toward the surface of the polishing cloth 2.

  The carrier plate 9 is a carrier for holding a wafer, and is formed of a porous resin such as a polyurethane resin porous body. The template 6 is formed from a glass epoxy resin, a polycarbonate sheet, a polyester sheet, or the like. Further, the template 6 has five wafer positioning holes 6a for holding five wafers W. As shown in FIG. 13B, the diameter of the wafer positioning hole 6a is larger than the wafer diameter, and when the polishing head 4 is rotated, the wafer W freely rotates within the wafer positioning hole 6a.

  In the batch type single-side polishing apparatus shown in FIGS. 13A and 13B, the template 6 is provided on the carrier plate 9 so that the wafer W can freely rotate. The wafer W may be attached to the lower surface of the carrier plate 9 and fixed.

  With the wafer W held by the carrier plate 9, the polishing liquid is supplied from the slurry tube 8 to the upper surface of the surface plate 1, and the surface plate 1 and the polishing head 4 are rotated so that the wafer W moves over the polishing cloth 2. The surface of the wafer W is scraped off and polished.

As described above, various apparatuses such as a double-side polishing apparatus, a single-wafer single-side polishing apparatus, and a batch-type single-side polishing apparatus are known as polishing apparatuses that perform polishing of a wafer surface using a polishing cloth.
JP 2004-160603 A

  In a polishing apparatus that polishes the surface of a wafer using a polishing cloth as described above, since the polishing cloth is generally elastic, if the polishing is performed while pressing the wafer against the polishing cloth, the wafer slightly sinks into the polishing cloth. . Then, as shown in FIG. 12, the elastic stress from the polishing cloth 2 is concentrated at the front end portion (broken line circle portion) in the relative movement direction of the wafer W with respect to the polishing cloth 2. The pressure applied to the outer periphery of the wafer W increases, and the outer periphery of the wafer W is excessively polished.

  For this reason, in a wafer polished by this type of polishing apparatus, surface sagging occurs at the outer peripheral portion of the wafer, resulting in a problem that the SFQR value at that portion deteriorates.

  The invention according to the present application has been made to solve the above-described problems, and a first object thereof is to provide a polishing cloth and a wafer polishing apparatus capable of supplying a wafer with high flatness. There is to do.

  A second object of the invention according to the present application is to provide a polishing cloth and a wafer polishing apparatus capable of supplying a wafer with less surface sagging at the outer periphery of the wafer.

In order to achieve the above object, a first invention according to the present application is a polishing cloth that polishes an object to be polished by sliding the object on the object to be polished, in a region through which the object to be polished passes. The polishing cloth is treated so that the polishing amount of the polishing object in a part of the region where the center of the polishing object does not pass is smaller than the polishing amount of the polishing object in the other region. A polishing cloth characterized by being applied.
According to the above-described invention, it is possible to reduce partial over-polishing of the wafer by performing a treatment that reduces the amount of polishing at an appropriate location of the polishing cloth.

Further, according to a second invention of the present application, in the polishing cloth for polishing the object to be polished, the polishing amount of the object to be polished at a central portion of the polishing cloth is determined by polishing the object to be polished. The polishing cloth is characterized in that the polishing cloth is processed so as to be less than the polishing amount of the object to be polished in a region outside the center portion of the cloth.
According to said invention, it can reduce that a wafer is grind | polished excessively in the center location | part to which a polishing cloth and a wafer move to a reverse direction.

Further, according to a third aspect of the present application, in the polishing cloth that polishes the object to be polished by rubbing with the object to be polished, the polishing amount of the object to be polished at the outer peripheral portion of the polishing cloth is equal to the polishing amount. The polishing cloth is characterized in that the polishing cloth is processed so as to be less than the polishing amount of the object to be polished in a region inside the outer peripheral portion of the cloth.
According to the above invention, it is possible to reduce the amount of polishing at the wafer outer peripheral portion where the wafer is easily polished excessively on the polishing cloth, and it is possible to reduce the surface sagging of the wafer.

According to a fourth aspect of the present invention, in the polishing cloth for polishing the object to be polished, the polishing amount of the object to be polished at the central portion and the outer peripheral portion of the polishing cloth is The polishing cloth is characterized in that the polishing cloth is processed so as to be less than the polishing amount of the object to be polished in a general part sandwiched between the central part and the outer peripheral part of the polishing cloth. .
According to the above invention, it is possible to reduce the amount of polishing at a portion where the wafer is easily polished excessively on the polishing cloth, and it is possible to reduce the surface sagging of the wafer.

Further, according to a fifth aspect of the present application, the polishing amount of the object to be polished in a part of the general part is smaller than the polishing amount of the object to be polished in a region other than the part of the general part. Thus, the polishing cloth according to the fourth invention is characterized in that the polishing cloth is processed.
According to said invention, the flatness of a wafer can be improved further.

In addition, according to a sixth aspect of the present application, the outer peripheral portion of the polishing cloth is an area of 60 mm or less from the outer periphery of the polishing cloth or the outer periphery of the region through which the workpiece passes toward the center side of the polishing cloth. The polishing cloth according to any one of claims 3 to 5, wherein the polishing cloth is a polishing cloth.
According to the above invention, excessive polishing at the outer peripheral portion of the wafer can be appropriately controlled while maintaining the flatness of the entire wafer at a high level, and surface sagging of the wafer can be reduced.

Further, according to a seventh aspect of the present invention, in the wafer polishing apparatus for polishing the wafer by relatively displacing the wafer and the polishing cloth in a state where at least one wafer is pressed against the polishing cloth, A wafer polishing apparatus characterized in that the polishing cloth is the polishing cloth described in any one of the first to sixth inventions.
According to the above-described polishing apparatus, since a process that reduces the polishing amount is performed at an appropriate location of the polishing cloth, it is possible to provide a highly flat wafer with little partial overpolishing.

Further, an eighth invention according to the present application includes at least one surface plate, a polishing cloth affixed to the surface of the surface plate, and at least one carrier capable of holding a plurality of wafers on one carrier. In a wafer polishing apparatus that holds a plurality of wafers with the carrier and polishes the wafer by rotating at least one of the surface plate or the carrier while pressing the wafer against the polishing cloth. The wafer polishing apparatus is characterized in that a filling member is provided to fill a gap between adjacent wafers of the plurality of wafers held by the one carrier.
According to the above invention, the intervals between the wafers can be made uniform, the difference in elastic stress due to the dynamic viscoelasticity of the polishing cloth can be eliminated, and the flatness of the wafer can be maintained higher. .

Further, a ninth invention according to the present application is a wafer manufacturing method including a polishing step of polishing a plurality of wafers at a time, wherein the polishing step is performed according to a distance between adjacent wafers of the plurality of wafers. In this case, the wafer is polished using means for reducing inconveniences caused by the above.
According to the above invention, inconvenience such as surface sagging that occurs according to the distance between adjacent wafers can be reduced by using a method such as processing on a polishing cloth or a compensation member, and the flatness of the wafer. Can be kept higher.

The tenth invention according to the present application includes a surface plate, a polishing cloth affixed to the surface of the surface plate, and at least one carrier capable of holding a plurality of wafers on one carrier. A polishing step of polishing the wafer by holding at least one of the surface plate and the carrier while holding the wafer with the carrier and pressing the wafer against the polishing cloth. In the wafer manufacturing method, in the polishing step, the wafer is polished using means for reducing inconvenience caused by the distance between adjacent wafers of the plurality of wafers held by the one carrier. A wafer manufacturing method characterized by the following.
According to the above invention, inconvenience such as surface sagging that occurs according to the distance between adjacent wafers can be reduced by using a method such as processing on a polishing cloth or a compensation member, and the flatness of the wafer. Can be kept higher.

  According to the polishing cloth and the wafer polishing apparatus of the present invention, it is possible to supply a highly flat wafer with less surface sagging at the outer peripheral portion of the wafer.

  Next, a polishing cloth and a wafer polishing apparatus according to the present invention will be described with reference to the drawings. In the present application, the term “polishing amount” means an amount by which a specific region of the polishing cloth polishes the object to be polished per unit time.

In the present invention, the polishing amount of the polishing object in a part of the region where the polishing object of the polishing cloth passes and the center of the polishing object does not pass is larger than the polishing amount of the polishing object in the other region. It is characterized in that the polishing cloth is treated so as to reduce the amount.
Various treatments for such a polishing cloth can be considered. In the following description, a case where a groove is formed will be described as an example of the treatment applied to the polishing cloth.

  In the following description of the embodiments, a batch type single-side polishing apparatus will be described as a model as the wafer polishing apparatus of the present invention. However, the present invention is applicable to any polishing apparatus using a polishing cloth, and is a double-side polishing apparatus. Of course, the present invention can also be applied to other polishing apparatuses such as single-sided single-side polishing apparatuses.

1 and 2 show a wafer polishing apparatus of the present invention, FIG. 1A is a schematic view of the wafer polishing apparatus of the present invention, FIG. 1B is a plan view of the polishing cloth of the present invention, and FIG. It is a longitudinal cross-sectional view of the wafer polishing apparatus of invention.
In FIG. 1A, a wafer polishing apparatus 10 of the present invention is fixed to a surface plate 11 that is controlled to rotate in a counterclockwise direction, for example, by a rotational drive device (not shown), and attached to the upper surface of the surface plate 11. The polishing cloth 12 is disposed on the bottom surface of the polishing head 14, a plurality of polishing heads 14 that are independently controlled to rotate in the counterclockwise direction, for example, in a counterclockwise direction around the support shaft 13 by a rotation driving device (not shown). And a polishing block 15 disposed opposite to the polishing cloth 12.

  As shown in FIG. 1B, the polishing cloth 12 has a plurality of grooves 16 that intersect each other on the cloth surface on which the wafer slides. The formation density of the grooves 16 differs depending on the two partitioned areas of the outer peripheral portion 12c and the general portion 12b in the region inside the outer peripheral portion 12c. As shown in FIG. 1B, the intervals between the grooves 16 intersecting each other at the outer peripheral part 12c of the polishing cloth 12 are close, and the grooves 16 intersecting each other at the general part 12b in the region inside the outer peripheral part 12c. The interval is sparser than the groove interval in the outer peripheral portion 12c.

The inner diameter of the outer peripheral portion 12c of the polishing cloth 12 is set such that the locus drawn by the center of the wafer W during polishing of the wafer does not pass through the outer peripheral portion 12c of the polishing cloth 12.
Specifically, the polishing cloth 12 is formed of a nonwoven fabric having a diameter of 1524 mm, the grooves 16 of the general portion 12b from the rotation center to the radius 712mm are in a grid of 50 mm square, and the grooves of the outer peripheral portion 12c from the radius 712mm to the radius 762mm. 16 is formed in a 25 mm square grid. Each groove 16 has a width of 2.0 mm and a depth of 0.4 mm.

  For example, as shown in FIG. 14, if the outer peripheral portion 12 c is formed in a large region including the vicinity of the center of the wafer W, the flatness of the entire wafer becomes worse than preventing the outer periphery of the wafer from sagging. Therefore, it is desirable that the outer peripheral portion 12 c is a region of 60 mm or less from the outer periphery of the polishing cloth 12 or the outer periphery of the region through which the wafer W passes toward the center side of the polishing cloth 12.

As shown in FIG. 1, five wafers W are arranged under each polishing block 15. The polishing block 15 is a carrier for holding the wafer W. The wafer W is fixed to the lower surface of the polishing block 15 by wax and is pressed against the polishing cloth 12 by the pressure from the polishing head 14. The applied pressure at this time is, for example, about 300 g / cm ² .
The diameter of the polishing block 15 is about 570 mm, and five wafers W having a diameter of 200 mm can be arranged radially. Each wafer W was arranged at a position of about 80 mm from the center of the polishing block 15.

  1 and 2 disclose an example in which four polishing heads 14 are arranged on one polishing cloth 12, the number of polishing heads 14 is not particularly limited. In addition, by arranging a plurality of polishing heads 14 for one surface plate 11, the center of rotation is shifted from the center of rotation of the surface plate 11, but this is the case where there is only one polishing head 14. However, the rotation center of the polishing head 14 and the rotation center of the surface plate 11 are not arranged coaxially.

  Further, the polishing block 15 may be fixed to the lower surface of the polishing head 14, or may not be fixed only by being pressed by pressure from the polishing head 14. When the polishing block 15 is not fixed, the polishing block 15 is fixed to the lower surface of the polishing head 14 by frictional force only by contacting with the lower surface of the polishing head 14 by pressure from the polishing head 14.

Although an example in which five wafers W are arranged below the polishing block 15 is shown, the number of wafers W to be arranged is not particularly limited.
Further, the wafer W does not have to be attached and fixed to the lower surface of the polishing block 15 with an adhesive such as wax, and the frictional force can be obtained simply by contacting the lower surface of the polishing block 15 by the pressure from the polishing head 14. Thus, the position may be fixed with respect to the lower surface of the polishing block 15.
Alternatively, using a soft chuck such as affixing water with a backing pad, it may be merely brought into contact with the lower surface of the polishing block 15 by pressure from the polishing head 14. When the soft chuck is used, the wafer W itself also rotates under the polishing block 15.

  The polishing block 15 is a carrier for holding the wafer W. In particular, the shape and structure of the polishing block 15 are not limited in the present application. For example, a recess for fitting the wafer W in accordance with the shape of the wafer W It may have a loading hole or a vacuum chuck mechanism. Moreover, as shown in FIG. 13, the structure which provided the template 6 in the lower surface of the grinding | polishing block may be sufficient.

  In such a configuration, a desired load is applied to the polishing block 15 by feeding and moving the support shaft 13 downward in a state where five wafers W are arranged under each polishing block 15. The load at this time is not necessarily positively applied by the support shaft 13 but may be due to the weight of the polishing head 14.

When the support shaft 13 is rotated from this state, the polishing block 15 is rotated integrally with the polishing head 14. As a result, the wafer W pressed against the polishing cloth 12 by the polishing block 15 also revolves around the support shaft 13 together with the polishing block 15. In this embodiment, since the wafer W is bonded and fixed to the lower surface of the polishing block 15 with an adhesive such as wax, the wafer W does not rotate.
On the other hand, the polishing cloth 12 rotates as the surface plate 11 rotates.
In this state, polishing is performed under conditions of a polishing load of 300 g / cm ² , a platen rotation speed of 30 rpm, a polishing head rotation speed of 30 rpm, and a polishing time of 9 minutes.

  The wafer W that slides on the polishing cloth 12 passes through the outer peripheral portion 12 c of the polishing cloth 12. At this time, the locus drawn by the center of the wafer W does not pass through the outer peripheral portion 12c of the polishing cloth 12, and only the outer peripheral portion of the wafer W where surface sagging easily occurs passes through the outer peripheral portion 12c.

According to the present invention, since the density of the grooves 16 in the outer peripheral portion 12c of the polishing cloth 12 is high and the polishing is performed at a pressure lower than the polishing pressure when passing through the general portion 12b, the outer peripheral portion of the wafer W is polished. The amount of polishing when sliding on the 12 outer peripheral portions 12c is suppressed.
As a result, it is possible to supply a highly flat wafer with less surface sagging at the outer periphery of the wafer.

From the same point of view, it is also possible to perform processing on the central portion of the polishing cloth 12 instead of the outer peripheral portion. 19 and 20 show the wafer polishing apparatus of the present invention, FIG. 19A is a schematic view of the wafer polishing apparatus of the present invention, FIG. 19B is a plan view of the polishing cloth of the present invention, and FIG. It is a longitudinal cross-sectional view of the wafer polishing apparatus of invention.
As shown in FIG. 19B, the polishing cloth 12 has a plurality of grooves 16 that intersect with each other on the cloth surface on which the wafer slides. The formation density of the grooves 16 differs depending on the two partitioned areas of the central portion 12a and the general portion 12b in the region outside the central portion 12a. As shown in FIG. 19B, the interval between the grooves 16 intersecting each other at the center portion 12a of the polishing cloth 12 is close, and the interval between the grooves 16 intersecting each other at the general portion 12b surrounding the center portion 12a is the center. It is sparser than the groove interval in the part 12a.

  The diameter of the central portion 12a of the polishing cloth 12 is set such that the locus drawn by the center of the wafer W during wafer polishing does not pass through the central portion 12a of the polishing cloth 12. Specifically, the polishing cloth 12 is formed of a nonwoven fabric having a diameter of 1524 mm, the grooves 16 in the central portion 12a from the rotation center to the radius of 236 mm are in the form of a 25 mm square lattice, and the grooves 16 in the general portion 12b from the radius of 236 mm to 762 mm. Is formed in a 50 mm square grid. Each groove 16 has a width of 2.0 mm and a depth of 0.4 mm.

  The wafer W that slides on the polishing cloth 12 passes through the central portion 12 a of the polishing cloth 12. At this time, the locus drawn by the center of the wafer W does not pass through the central portion 12a of the polishing cloth 12, and only the outer peripheral portion of the wafer W where surface sagging easily occurs passes through the central portion 12a.

According to the present invention, since the density of the grooves 16 in the central portion 12a of the polishing cloth 12 is high and the polishing is performed at a pressure lower than the polishing pressure when passing through the general portion 12b, the outer peripheral portion of the wafer W is polished. The amount of polishing when sliding the twelve central portions 12a is suppressed.
As a result, it is possible to supply a highly flat wafer with less surface sagging at the outer periphery of the wafer.

FIG. 15 is a schematic plan view for illustrating the moving direction of the polishing cloth 12 and the polishing block 15, and a part of the polishing cloth 12 is omitted.
When polishing with the rotation of the wafer W fixed, in the vicinity of the outer periphery of the polishing cloth 12, the movement direction of the wafer W (arrow b) and the movement direction of the polishing cloth 12 (arrow a) are substantially the same as shown in FIG. Become a direction. However, even if the rotation direction of the polishing cloth 12 and the rotation direction of the polishing block 15 are the same, in the vicinity of the center of the polishing cloth 12, the movement direction of the wafer W (arrow c) and the movement direction of the polishing cloth 2 (arrow d) ) Is in the opposite direction.

  In particular, when the rotation of the wafer W is fixed, excessive polishing of the wafer W tends to occur at a portion where the moving direction of the polishing block 15 is opposite to the moving direction of the polishing cloth 12. As a result, it has been found that the wafer W is easily excessively polished in the vicinity of the outer periphery of the polishing block 15 and the surface sagging is particularly increased for a specific part of the wafer W.

However, according to the configuration shown in FIGS. 19 and 20, the density of the grooves 16 in the central portion 12a of the polishing cloth 12 is high, and polishing is performed at a pressure lower than the polishing pressure when passing through the general portion 12b. In particular, it is possible to prevent excessive polishing of the wafer at the central portion 12a where the moving direction of the polishing cloth 12 and the moving direction of the wafer W are opposite.
As a result, it is possible to supply a highly flat wafer with less surface sagging at the outer periphery of the wafer.

  In particular, by setting the diameter of the central portion 12a within a range in which the center of the wafer W does not pass, it is possible to effectively reduce only the surface sag at the outer peripheral portion of the wafer while maintaining a high flatness of the entire wafer. .

  Next, the influence of the elastic stress due to the dynamic viscoelasticity of the polishing cloth will be described. FIG. 16 is a schematic diagram showing the relationship between the distance between wafers and the dynamic viscoelasticity of the polishing cloth. FIG. 16A is a schematic diagram showing a case where the distance between the wafers is large, and FIG. 16B is a schematic diagram showing a case where the distance between the wafers is small.

  The polishing cloth is made of non-woven fabric, and the surface is temporarily recessed when pressure is applied by the wafer. When the polishing cloth is released from the pressure received from the wafer, the polishing cloth has a property of returning to the original state. The viscosity and elasticity of the polishing cloth at this time are referred to as dynamic viscoelasticity.

  In FIG. 16A, the distance L1 between the wafer Wa and the wafer Wb is sufficiently large, and after the previous wafer Wa has passed through the polishing cloth 12, the polishing cloth 12 is reached until the next wafer Wb reaches the same location. The dent has recovered to its original state. Thus, when the distance L1 between the wafer Wa and the wafer Wb is sufficiently wide and the recovery time due to the viscoelasticity of the polishing cloth 12 is sufficient, the tip in the moving direction of the wafer Wb has the same peak as in the wafer Wa. Stress is generated.

  On the other hand, in FIG. 16B, the distance L2 between the wafer Wc and the wafer Wd is narrow, and after the previous wafer Wc passes through the polishing cloth 12, the polishing cloth is reached until the next wafer Wd reaches the same location. Twelve dents have not recovered to their original state. As described above, when the distance L2 between the wafer Wc and the wafer Wd is narrow and the recovery time due to the viscoelasticity of the polishing cloth 12 is not sufficient, the polishing cloth 12 has not recovered to the original state. Only a stress having a smaller peak than that in the case of the wafer Wb in FIG.

  Therefore, when the distance between the wafers is large, a large peak stress is generated, so the amount of polishing increases. When the distance between the wafers is small, the peak value of the stress is lowered and only a small stress is generated. It can be seen that the polishing amount decreases.

Reference is now made to FIG. FIG. 8A is a plan view showing a part of the polishing block and a part of the wafer, and FIG. 8B is a graph showing a change in the arc distance L between the wafers in a wafer having a diameter of 200 mm.
FIG. 8A shows the arc distance L between the wafers W at an arbitrary angle θ by taking the parameter θ counterclockwise from the center of the semicircular wafer W drawn on the left side shown in FIG. 8 (B).

As shown in FIGS. 8A and 8B, the arc distance L between adjacent wafers W on the polishing block 15 is not uniform over the entire outer periphery of the adjacent wafers. For example, as the distance from the outer periphery of the polishing block 15 toward the center of the polishing block 15, the arc distance L between adjacent wafers W gradually decreases from the maximum distance L _1, passes through the minimum distance L ₂ , and further reaches the center of the polishing block 15. gradually spread now from _{L 2} to _{L 3} as it goes.

For example, the inter-wafer arc distance L ₁ shown in FIG. 8A is much larger than the inter-wafer arc distance L ₂ . As described above, since the arc distance L is increased in the vicinity of the outer periphery of the polishing block 15, a stress having a large peak is generated as shown in FIG. As a result, the outer peripheral portion of the wafer W tends to be excessively polished.

  FIG. 3 is wafer shape data showing a state of surface sagging of the wafer W after polishing. The front side of the drawing corresponds to the outer peripheral side of the polishing block 15, and the back side of the drawing corresponds to the center side of the polishing block 15. As can be seen from FIG. 3, it can be seen that the outer peripheral side of the polishing block 15 (the front side of the drawing) draws a gentle arc on the outer shape of the wafer W, causing surface sagging. As described above, excessive polishing on a specific part of the wafer W lowers the flatness of the entire wafer and degrades the quality of the wafer.

In order to solve this problem, Embodiment 2 of the present invention is disclosed.
4 and 5 show a second embodiment of the wafer polishing apparatus of the present invention, FIG. 4 (A) is a schematic view of the wafer polishing apparatus of the present invention, FIG. 4 (B) is a plan view of the polishing cloth of the present invention, FIG. 5 is a longitudinal sectional view of the wafer polishing apparatus of the present invention. Since the schematic configuration of the wafer polishing apparatus of the present embodiment and that of the first embodiment is substantially the same, the same components as those of the first embodiment are denoted by the same reference numerals and description thereof is omitted.

In FIG. 4A, the wafer polishing apparatus 10 of this embodiment includes a polishing cloth 22 on the upper surface of the surface plate 11.
As shown in FIG. 4B, the polishing cloth 22 has a large number of grooves 16 intersecting each other on the cloth surface on which the wafer is slid. The formation density of the grooves 16 differs depending on the three partitioned areas of the central portion 22a, the general portion 22b, and the outer peripheral portion 22c. As shown in FIG. 4B, the interval between the grooves 16 intersecting each other at the center portion 22a of the polishing cloth 22 is close, and the interval between the grooves 16 intersecting each other at the general portion 22b surrounding the center portion 22a is the center. It is sparser than the groove interval in the region 22a.

  Further, in the outer peripheral portion 22c surrounding the general portion 22b, the interval between the grooves 16 intersecting each other is closer than the groove interval in the general portion 22b. The interval between the grooves 16 in the central portion 22a and the outer peripheral portion 22c may be the same or different as long as it is closer than the groove interval in the general portion 22b.

  The diameter of the center portion 22a of the polishing cloth 22 is set such that the locus drawn by the center of the wafer W during wafer polishing does not pass through the center portion 22a of the polishing cloth 22. The inner diameter of the outer peripheral portion 22c of the polishing cloth 22 is set such that the locus drawn by the center of the wafer W during wafer polishing does not pass through the outer peripheral portion 22c of the polishing cloth 22.

Specifically, the polishing cloth 22 is formed of a non-woven fabric having a diameter of 1524 mm, and the grooves 16 in the central portion 22a from the rotation center to the radius 236mm are in the form of a 25 mm square lattice, and the grooves in the general portion 22b from the radius 236mm to the radius 712mm. Reference numeral 16 denotes a 50 mm square lattice, and the grooves 16 in the outer peripheral portion 22 c having a radius of 712 mm to a radius of 762 mm are formed in a 25 mm square lattice. Each groove 16 has a width of 2.0 mm and a depth of 0.4 mm.
The size and configuration of the polishing block 15 and the wafer W are the same as those in the first embodiment.

In such a configuration, a desired load is applied to the polishing block 15 by feeding and moving the support shaft 13 downward in a state where five wafers W are arranged under each polishing block 15. When the support shaft 13 is rotated from this state, the polishing block 15 is rotated integrally with the polishing head 14. As a result, the wafer W pressed against the polishing cloth 22 by the polishing block 15 also revolves around the support shaft 13 together with the polishing block 15.
On the other hand, the polishing cloth 22 rotates as the surface plate 11 rotates.
In this state, polishing is performed under conditions of a polishing load of 300 g / cm ² , a platen rotation speed of 30 rpm, a polishing head rotation speed of 30 rpm, and a polishing time of 9 minutes.

  The wafer W that slides on the polishing cloth 22 passes through the central portion 22 a and the outer peripheral portion 22 c of the polishing cloth 22. At this time, the locus drawn by the center of the wafer W does not pass through the central portion 22a and the outer peripheral portion 22c, and only the outer peripheral portion of the wafer W passes through the central portion 22a and the outer peripheral portion 22c.

According to the present invention, since the density of the grooves 16 in the central portion 22a and the outer peripheral portion 22c of the polishing cloth 22 is high and the polishing is performed at a pressure lower than the polishing pressure when passing through the general portion 22b, the wafer W is centered. The amount of polishing when sliding the part 22a and the outer peripheral part 22c is suppressed.
As a result, excessive polishing at the outer peripheral portion of the wafer can be prevented, and a highly flat wafer with less surface sagging at the outer peripheral portion of the wafer can be supplied.

In particular, by setting the inner diameter of the outer peripheral portion 22c within a range in which the center of the wafer W does not pass, surface sagging at the outer peripheral portion of the wafer can be effectively reduced.
If the outer peripheral portion 22c is formed in a large area, the flatness of the entire wafer becomes worse than preventing the sagging of the outer periphery of the wafer. Therefore, it is desirable that the outer peripheral portion 22 c be a region of 60 mm or less from the outer periphery of the polishing cloth 22 or the outer periphery of the region through which the wafer W passes toward the center side of the polishing cloth 22.

  The effect of the second embodiment is remarkable when the wafer W is fixed to the lower surface of the polishing block 15 with wax. However, the wafer W is held so as to be able to rotate with respect to a carrier such as the polishing block 15. Even if it is, it has the same effect.

  In the second embodiment, an example in which the density of the grooves 16 in both the central portion 22a and the outer peripheral portion 22c of the polishing cloth 22 is increased is shown. However, in either the central portion 22a or the outer peripheral portion 22c. You may comprise so that only the density of the groove | channel 16 may become high.

  6 and 7 show a third embodiment of the wafer polishing apparatus of the present invention, FIG. 6 (A) is a schematic view of the wafer polishing apparatus of the present invention, FIG. 6 (B) is a plan view of the polishing cloth of the present invention, FIG. 7 is a longitudinal sectional view of the wafer polishing apparatus of the present invention. Since the schematic configuration of the wafer polishing apparatus of the present embodiment and that of Embodiment 2 are substantially the same, the same components as those of Embodiment 2 are denoted by the same reference numerals and description thereof is omitted. Further, since the polishing conditions are substantially the same as those in the second embodiment, the description thereof is omitted.

  The polishing cloth 22 of Example 2 described above has a close spacing between the grooves 16 intersecting each other at the center portion 22a and the outer peripheral portion 22c, and intersects each other at the general portion 22b sandwiched between the center portion 22a and the outer peripheral portion 22c. Disclosed is a sparse groove 16.

  On the other hand, in the polishing cloth 32 shown in the present embodiment, the central portion 32a and the outer peripheral portion 32c are formed as the dense grooves 16 similarly to the central portion 22a and the outer peripheral portion 22c of the second embodiment. Furthermore, the groove 16 is also dense in the intermediate part 32d located at the center of the general part 32b sandwiched between the central part 32a and the outer peripheral part 32c.

Specifically, the polishing cloth 32 is formed of a non-woven fabric having a diameter of 1524 mm, and the grooves 16 in the central portion 32a from the rotation center to the radius 236mm are in the form of a 25 mm square lattice, and grooves in the outer peripheral portion 32c from the radius 712mm to the radius 762mm. 16 is formed in a 25 mm square grid. Further, in the general portion 32b having a radius of 236mm to a radius of 712mm, the groove 16 of the intermediate portion 32d located from the radius of 374mm to the radius of 574mm is a 25mm square lattice, and the groove 16 of the other general portion 32b is a lattice of 50mm square. Is formed. Each groove 16 has a width of 2.0 mm and a depth of 0.4 mm.
The size and configuration of the polishing block 15 and the wafer W are the same as those in the first embodiment.

As shown in FIG. 8 (B), the arc distance L between wafers exhibit a greater distance at the outer periphery of the polishing block 15, whereas, the distance in the parameter angle theta = about 126 ° and the minimum distance L _2, further polishing The distance gradually increases toward the center of the block 15. That is, overpolishing of the wafer W is predicted not only in the outer peripheral portion of the polishing block 15 but also in the vicinity of the center of the polishing block 15. The value of θ indicating the minimum distance L ₂ in FIG. 8 (B) the size of the wafer W and the polishing block 15, pasting different course by such a position of the polishing block 15.

  Therefore, in Example 3, the intermediate portion 32d is further provided in the general portion 32b of the polishing cloth 32, and the groove interval in the intermediate portion 32d is made dense to prevent the above-described excessive polishing. Since excessive polishing in the vicinity of the center of the polishing block 15 is smaller than excessive polishing in the outer peripheral portion of the polishing block 15, the groove interval in the intermediate portion 32d may be sparser than the groove interval in the outer peripheral portion 32c. .

  According to the third embodiment, a portion of each wafer W positioned near the center of the polishing block 15 is also subjected to the polishing action of the closely spaced grooves 16, and excessive in the vicinity of the center of the polishing block causing surface sagging. Polishing can be relaxed and further planarization can be realized.

[Application Example 1]
By the way, in each said Examples 1-3, the change of the circular arc distance L of each adjacent wafer W was based on the circular shape of the wafer. When the arc distance L at the outer peripheral portion of the wafer W changes in this way, it is difficult to perform polishing without being affected by the elastic stress due to the dynamic viscoelasticity described above.

  Therefore, as shown in FIGS. 9A and 9B, a compensation member 18 having the same thickness as the thickness of the wafer W is provided between adjacent wafers W to relieve elastic stress due to dynamic viscoelasticity. It is also possible to do. FIG. 9A is a plan view of the polishing block, and FIG. 9B is a longitudinal sectional view of a part of the polishing apparatus.

  The filling member 18 is provided on the surface of the polishing block 15 with which the wafer W comes into contact. The filling member 18 is preferably integrally formed on the lower surface of the polishing block 15 or pasted with wax, an adhesive, or the like, but it may be pressed only by pressure from the polishing block 15 and may not be fixed. good. In that case, only by contacting the lower surface of the polishing block 15 by the pressure from the polishing head 14, the compensation member 18 is fixed to the lower surface of the polishing block 15 by frictional force.

The shape of the compensation member 18 is not particularly limited, but it is desirable to form the compensation member 18 so that the distance between the wafer W and the compensation member 18 is constant. Further, it is most effective to substantially coincide the distance between adjacent wafers W with filling member 18 and the minimum distance L ₂ between the wafers.
For example, as shown in FIG. 9A, a ginkgo leaf shape is preferable.

  In FIG. 9, the filling member 18 is provided only on the outer peripheral side of the polishing block 15, but may be provided on the inner peripheral side of the polishing block 15. Of course, it may be provided on both the outer peripheral side and the inner peripheral side of the polishing block 15, or may be used in combination with the first to third embodiments.

According to this application example, even when the arc distance between the wafers W is separated as shown in FIG. 9B, the compensation member 18 suppresses the recovery of the polishing cloth 12 by providing the compensation member 18. Therefore, excessive polishing at the outer periphery of the wafer can be prevented.
The material of the filling member 18 is one that does not cause metal contamination of the wafer during wafer polishing.

[Application 2]
In the polishing cloths 22 and 32 of Examples 2 and 3, the ones in which the dense grooves 16 are formed in the outer peripheral portions 22c and 32c are disclosed. However, as means for achieving the same effect without forming the dense grooves 16, the height of the polishing cloth (cloth thickness, bristle length, etc.) can be changed at portions corresponding to the outer peripheral portions 22c and 32c of the polishing cloth. There is a method to make it lower than this part.

  FIG. 10A is a longitudinal sectional view showing a part of the surface plate and the polishing cloth. As shown in FIG. 10A, the polishing cloth 42 is notched 42a at the outer peripheral portion of the polishing cloth 42, and the thickness of the polishing cloth 42 is made thinner than other portions. The depth of the notch 42 a may be formed so deep that the wafer W does not come into contact with the wafer W when the wafer W is pressed by the polishing block 15, or when the wafer W is pressed by the polishing block 15, It may be deep enough to allow contact.

  When the depth of the cutout 42a is formed so deep that the wafer W does not come into contact with the wafer W, the wafer W receives no polishing pressure from the cutout portion. Further, when the depth of the notch 42a is formed so shallow that the wafer W can come into contact with the wafer W, the wafer W receives a polishing pressure from the notched portion, but the polishing pressure is polished at other portions (general portions). Lower than pressure.

  By reducing the thickness of a part of the polishing cloth 42 in this way, the polishing pressure can be reduced similarly to the case where the groove is provided, and excessive polishing can be prevented.

This application example can be applied to the above first to third embodiments. In the region where the spacing density of the grooves 16 of each of the first to third embodiments is set densely, the polishing cloth is provided with a notch. The thickness may be reduced. For example, in the first embodiment, the thickness of the polishing cloth at the outer peripheral portion 12c and the central portion 12a may be reduced, and in the second embodiment, the thickness of the polishing cloth at the central portion 22a and the outer peripheral portion 22c may be reduced.
Alternatively, in addition to the grooves 16 in the first to third embodiments, a notch may be provided by assembling this application example only at the outer peripheral portion of the polishing cloth.

  As shown in FIG. 10A, a wafer polishing experiment was performed using a polishing cloth 42 having a notch 42a formed in the outer peripheral portion. FIG. 10B is a graph in which the horizontal axis represents the distance from the center of the polishing block and the vertical axis represents the sagging amount (ROA). A wafer having a diameter of about 200 mm was used, and the wafer was placed at a position of about 80 mm from the center of the polishing block. As can be seen from this graph, the amount of sagging at the outer peripheral portion is smaller when the notch is provided than when the notch is not provided. It can also be seen that the graph with the notches has less vertical variation and the flatness of the entire wafer is improved.

[Application Example 3]
In the polishing cloths 12, 22, and 32 shown in the first to third embodiments, the depth and width of the grooves 16 are the same, and only the intervals between the grooves are different. As shown in FIG. 9, instead of changing the groove interval, the narrow groove 26 and the wide groove 36 may be formed in a lattice shape. In this case, the region where the narrow groove 26 is formed corresponds to the sparse groove density, and the region where the wide groove 36 is formed corresponds to the dense groove.

  For example, when applied to the polishing cloth of Example 3, wide grooves 36 are provided in a lattice shape in the central portion 32a, the outer peripheral portion 32c, and the intermediate portion 32d, and narrow grooves 26 are provided in a lattice shape in the general portion 32b. It will be.

  In addition, the density of the groove can be changed not only by adjusting the density only by the width of the groove, but also by adjusting the notch and the depth of the groove as described in the application example 2.

  Further, as shown in FIG. 11 (B), an opening-like groove 46 extending radially from the center of rotation of the polishing cloths 12, 22, 32 is formed so as to substantially coincide with the diameter of the polishing block 15, and the groove width is set. The same effect can also be obtained by making the center part, the intermediate part, and the outer peripheral part wider and making the other general parts narrower. That is, in one groove 46, the groove density may be adjusted by changing the width of the groove in a partial portion.

In the first to third embodiments, an example in which the grooves are arranged in a lattice shape has been shown to simplify the description. However, the grooves need not necessarily be arranged in a lattice shape, as shown in FIG. They may be arranged radially from the center of the polishing cloth. In addition, the groove width and groove depth of the radially arranged grooves may be changed, or the frequency of the number of radial grooves may be changed.
That is, in the present application, the groove density does not mean only the frequency of the number of grooves, but is considered including the width and depth of the grooves.

  Further, in this application, the aim by changing the density of the groove is to reduce partial over-polishing of the wafer by the polishing cloth. Essentially, the present invention is not limited to the case where the groove is provided. A region with a small amount of polishing may be provided. For example, in Example 1, instead of providing the dense grooves 16 in the outer peripheral portion 12c and the central portion 12a, only the outer peripheral portion 12c and the central portion 12a of the polishing cloth 12 are worn in advance, or the chemical treatment reduces the surface roughness. The amount of polishing of the wafer at the outer peripheral portion 12c and the central portion 12a may be reduced by performing chemical treatment such as the above.

  In the above-described embodiment, an apparatus for polishing by fixing the rotation of the wafer by the polishing block has been described. However, the present invention can be similarly applied to a polishing apparatus in which the wafer rotates. The present invention can be applied to any polishing apparatus using a polishing cloth, and can naturally be applied to other polishing apparatuses such as a double-side polishing apparatus and a single-wafer single-side polishing apparatus.

  In the above embodiment, the semiconductor wafer is described as an example. However, the present invention is not limited to the semiconductor wafer but can be applied to a wafer (thin plate-like material) made of another material.

  The object to be polished is not limited to a disk-shaped wafer, but can be applied to a square or polygonal wafer.

1 shows Embodiment 1 of the wafer polishing apparatus of the present invention, (A) is a schematic view of the wafer polishing apparatus, and (B) is a plan view of the main part of the wafer polishing apparatus. It is a longitudinal cross-sectional view of the wafer polisher in Example 1 of this invention. It is the three-dimensional data of the wafer shape which shows the mode of the surface sag of the wafer after polishing. Embodiment 2 of the wafer polishing apparatus of the present invention is shown, (A) is a schematic view of the wafer polishing apparatus, (B) is a plan view of the main part of the wafer polishing apparatus. It is a longitudinal cross-sectional view of the wafer polisher in Example 2 of this invention. 3 shows a third embodiment of the wafer polishing apparatus of the present invention, (A) is a schematic view of the wafer polishing apparatus, and (B) is a plan view of the main part of the wafer polishing apparatus. It is a longitudinal cross-sectional view of the wafer polisher in Example 3 of this invention. (A) is a top view which shows a part of grinding | polishing block and a part of wafer, (B) is a graph which shows the relationship of the circular arc distance between adjacent wafers. The application example 1 of the wafer polisher of this invention is shown, (A) is a top view of the principal part which provided the retainer, (B) is a longitudinal cross-sectional view which shows the positional relationship of a wafer and a retainer. The application example 2 of the wafer grinding | polishing apparatus of this invention is shown, (A) is explanatory drawing of the principal part of the grinding | polishing cloth which provided the notch, (B) is a comparative graph figure which shows the amount of sagging of the wafer by the presence or absence of a notch. is there. The application example 3 of the wafer grinding | polishing apparatus of this invention is shown, (A) is explanatory drawing of the principal part which shows the example which varied groove width, (B) is explanatory drawing of the principal part which shows the example which arrange | positioned the groove | channel radially. It is. It is explanatory drawing for demonstrating the elastic stress by the dynamic viscoelasticity of the grinding | polishing cloth accompanying the movement of a wafer, and the graph of the elastic stress which matched this explanatory drawing and relative position A batch type single-side polishing apparatus is shown, (A) is a longitudinal sectional view of the batch type single-side polishing apparatus, and (B) is an enlarged sectional view of a main part of the batch type single-side polishing apparatus. It is a top view which shows the example of the grinding | polishing cloth with a large area | region of an outer peripheral part. It is explanatory drawing which shows the relationship of rotation of a grinding | polishing block and a grinding | polishing cloth. The explanatory view of the elastic stress by the dynamic viscoelasticity accompanying the wafer separation distance is shown, (A) is the explanatory view of the elastic stress of the polishing cloth when the wafer separation distance is narrow, (B) is the polishing when the wafer separation distance is wide It is explanatory drawing of the elastic stress of cloth. The double-side polishing apparatus is shown, is a plan view schematically showing the carrier rotation mechanism of the double-side polishing apparatus, and (B) is an enlarged vertical sectional view of a part of the double-side polishing apparatus. It is a longitudinal cross-sectional view which shows the outline of a single-wafer | sheet-fed single-side polish apparatus. 1 shows Embodiment 1 of the wafer polishing apparatus of the present invention, (A) is a schematic view of the wafer polishing apparatus, and (B) is a plan view of the main part of the wafer polishing apparatus. It is a longitudinal cross-sectional view of the wafer polisher in Example 1 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Surface plate 1a ... Upper surface plate 1b ... Lower surface plate 2 ... Polishing cloth 2a ... Central part 2b ... General part 2c ... Outer peripheral part 3 ... Supporting shaft 4 ... Polishing head 6 ... Template 6a ... Wafer positioning hole 8 ... Slurry pipe 9 DESCRIPTION OF SYMBOLS ... Carrier plate 10 ... Wafer polisher 11 ... Surface plate 12 ... Polishing cloth 12a ... Central part 12b ... Outer peripheral part 13 ... Support shaft 14 ... Polishing head 15 ... Polishing block 16 ... Groove 18 ... Compensation member 22 ... Polishing cloth 22a ... Center Part 22b ... General part 22c ... Outer peripheral part 26 ... Narrow groove 36 ... Wide groove 32 ... Polishing cloth 32a ... Central part 32b ... General part 32c ... Outer peripheral part 32d ... Intermediate part 42 ... Polishing cloth 42a ... Notch 46 ... Groove 51 ... Carrier 52 ... Loading hole 53 ... Planet gear 54 ... Internal gear 55 ... Support Gear 64 ... polishing head 65 ... vacuum chuck mechanism 68 ... retainer W ... wafer Wa, Wb, Wc, Wd ... wafer.

Claims (10)

In the polishing cloth for polishing the object to be polished by rubbing with the object to be polished,
The polishing amount of the polishing object in a part of the region of the polishing cloth through which the polishing object passes and the center of the polishing object does not pass is the polishing amount of the polishing object in the other region. A polishing cloth, wherein the polishing cloth is processed so as to reduce the amount of the polishing cloth. In the polishing cloth for polishing the object to be polished by rubbing with the object to be polished,
The polishing cloth was treated so that the polishing amount of the object to be polished at the central portion of the polishing cloth was smaller than the polishing amount of the object to be polished in the region outside the central portion of the polishing cloth. A polishing cloth characterized by that. In the polishing cloth for polishing the object to be polished by rubbing with the object to be polished,
The polishing cloth was processed so that the polishing amount of the object to be polished at the outer peripheral part of the polishing cloth was smaller than the polishing amount of the object to be polished in the region inside the outer peripheral part of the polishing cloth. A polishing cloth characterized by that. In the polishing cloth for polishing the object to be polished by rubbing with the object to be polished,
The polishing amount of the object to be polished at the central part and the outer peripheral part of the polishing cloth is smaller than the polishing amount of the object to be polished at a general part sandwiched between the central part and the outer peripheral part of the polishing cloth. A polishing cloth, wherein the polishing cloth is treated.   The polishing cloth is treated so that the polishing amount of the object to be polished in a part of the general part is smaller than the polishing amount of the object to be polished in a region other than the part of the general part. The polishing cloth according to claim 4 characterized by things.   The outer peripheral portion of the polishing cloth is an area of 60 mm or less from the outer periphery of the polishing cloth or the outer periphery of the region through which the workpiece passes toward the center side of the polishing cloth. A polishing cloth according to any one of the above. In a wafer polishing apparatus for polishing the wafer by relatively displacing the wafer and the polishing cloth in a state where at least one wafer is pressed against the polishing cloth,
A wafer polishing apparatus, wherein the polishing cloth is the polishing cloth according to any one of claims 1 to 6. A surface plate, a polishing cloth affixed to the surface of the surface plate, and at least one carrier capable of holding a plurality of wafers in one carrier;
In a wafer polishing apparatus that holds a plurality of wafers with the carrier and polishes the wafer by rotating at least one of the surface plate or the carrier while pressing the wafer against the polishing cloth.
A wafer polishing apparatus, comprising a filling member that fills a gap between adjacent wafers of the plurality of wafers held by the one carrier. In a wafer manufacturing method including a polishing step of polishing a plurality of wafers at once,
In the polishing step, the wafer is polished using means for reducing inconvenience caused by the distance between adjacent wafers of the plurality of wafers.
A wafer manufacturing method characterized by the above. A surface plate, a polishing cloth affixed to the surface of the surface plate, and at least one carrier capable of holding a plurality of wafers in one carrier;
A wafer including a polishing step of holding the plurality of wafers by the carrier and polishing the wafer by rotating at least one of the surface plate or the carrier while pressing the wafer against the polishing cloth. In the manufacturing method,
In the polishing step, the wafer is polished using means for reducing inconvenience caused by the distance between adjacent wafers of the plurality of wafers held by the one carrier.
A wafer manufacturing method characterized by the above.

Images