JP2006179536A - Apparatus and method for mounting electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for mounting an electronic component while sucking it without causing any damage. <P>SOLUTION: When an IC chip arranged on a supply member is mounted on a printed board while being sucked and held, air is blown to the outer circumferential edge thereof from an air blow-off hole 11 opening to a cylindrical space chamber 4 provided at a lower section of a suction nozzle 1 in order to float the IC chip W above the supply member and to hold it in noncontact state for the suction nozzle 1. Subsequently, air is sucked from an air suction hole 12 opening to the cylindrical space chamber 4 of the suction nozzle 1 thus sucking the floating IC chip W to the lower end face of the suction nozzle 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electronic component mounting machine and an electronic component mounting method.

In recent years, electronic devices have been miniaturized, and electronic components mounted on the electronic devices have also been rapidly miniaturized, particularly thinned.
Generally, in an electronic component mounting machine, very small electronic components are mounted on a printed circuit board at a high speed, and the electronic components are sucked one by one by a suction nozzle and placed at a predetermined position on the printed circuit board. After that, it was mounted by bonding.

Conventionally, as this suction nozzle, a cylindrical one having a hole-shaped internal space formed at the center is used, and a vacuum device is connected to the internal space, and the internal space is brought into a vacuum state. An electronic component is adsorbed and held on the nozzle tip surface (see Patent Document 1).
Japanese Patent No. 2648118

  However, according to the configuration of the conventional suction nozzle, air is sucked from the inner space formed at the center thereof to suck and hold an electronic component such as an IC chip. As shown in FIG. At the time of W adsorption, the IC chip W is adsorbed by the adsorption nozzle 51 in a tilted state, and may be damaged by hitting it. In particular, with the recent thinning of electronic components, the risk of damage is increasing.

  There are some electronic parts that are not lifted by the suction nozzle and are held in a non-contact state to hold the electronic parts in order to transport the electronic parts. However, when mounting the electronic parts on the substrate, positioning accuracy is ensured. It is something that cannot be done.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting machine and an electronic component mounting method capable of adsorbing and mounting electronic components without damaging them.

In order to solve the above-described problems, an electronic component mounting machine according to the present invention is an electronic component mounting which sucks and holds an electronic component arranged on a supply member of the electronic component and mounts the electronic component on a mounted member. Machine,
Air suction for sucking out air in the concave portion at a position different from the air blowing hole of the suction nozzle in which a concave portion is formed in the center of the lower surface and an air blowing hole for blowing air into the concave portion is formed. A hole is formed.

Further, another electronic component mounting machine of the present invention connects an air supply device that supplies air to the air blowing hole in the electronic component mounting device described above, and an air suction device for sucking air into the air suction hole. connection,
While having a control device for controlling these air supply device and air suction device,
By this control device, the air supply device is operated, air is blown out from the air blowing hole, the electronic component is floated to the suction nozzle side and in a non-contact state with respect to the suction nozzle, and then the air suction device is operated. The electronic component that has been lifted up is sucked by the suction nozzle.

  Further, an elastic material is provided at the lower end of the peripheral portion of the suction nozzle in each electronic component mounting machine, and the lower end surface of the peripheral portion is inclined with respect to the suction surface of the electronic component. A guide member that guides the electronic component to be sucked to the suction position is provided outside the peripheral edge, and the sucked electronic component can be pressed to the mounted member side during mounting in the concave portion of the suction nozzle. A pressing member is provided.

Further, the electronic component mounting method of the present invention, when the electronic component arranged on the supply member is sucked and held by the suction nozzle and mounted on the mounted member,
After air is blown from the air blowing hole opened in the concave portion of the suction nozzle to the outer periphery, the electronic component is lifted from the supply member, and then the air is sucked out from the air suction hole opened in the concave portion of the suction nozzle. This is a method of adsorbing the floated electronic component to the adsorption nozzle.

  According to each of the above configurations, when mounting the electronic component on the mounted member, air is first blown into the concave portion of the suction nozzle, and the electronic component is temporarily lifted by the ejector action and held in a non-contact state, and then air suction is performed. Since the electronic component is absorbed by the suction nozzle by the device, it is possible to avoid the electronic component from hitting one piece compared to the case where the electronic component is suddenly sucked by the suction nozzle. Can be mounted at a predetermined position on the mounted member with high accuracy.

  In addition, by providing an elastic material or a guide member to the suction nozzle, it is possible to prevent damage to the electronic component during the suction or mounting of the electronic component, and to more accurately position the electronic component. it can.

[Embodiment]
Hereinafter, an electronic component mounting machine and an electronic component mounting method according to the present invention will be described with reference to FIGS. 1 and 2.

  In the present embodiment, the electronic component is very thin, such as a bare IC chip obtained by dicing a wafer on which an electronic circuit is formed (of course, limited to a thin electronic component) However, a mounting machine that performs flip chip bonding of the IC chip on, for example, a printed circuit board will be described.

  This electronic component mounting machine is a bumped IC chip that is an electronic component from an IC chip supply member (for example, a component supply sheet in which IC chips are arranged at predetermined intervals) by a suction nozzle provided in a mounting head. Are held one by one and placed on a printed circuit board (an example of a member to be mounted) and bonded by reflow.

  By the way, as shown in FIG. 1, the suction nozzle 1 includes a mounting shaft portion 2 held on the mounting head (not shown) side, a lower portion of the mounting shaft portion 2, and a circular lower surface on the center lower surface. An annular horizontal portion 3a having a columnar space chamber (an example of a concave portion) 4, more precisely an annular horizontal portion 3a connected to the mounting shaft portion 2, and a cylindrical vertical portion (of the suction nozzle) suspended from the outer periphery of the annular horizontal portion 3a. And a covered cylindrical suction part 3 consisting of 3b (corresponding to the peripheral part).

  The attachment shaft portion 2 of the suction nozzle 1 has an air blowing hole 11 for blowing air into the cylindrical space chamber 4 and an air suction hole 12 for sucking air inside the cylindrical space chamber 4. Is formed. In other words, the air blowing hole 11 and the air suction hole 12 are opened on the inner surface of the cylindrical space chamber 4. Note that at least the air blowing hole 11 is formed at the center position of the cylindrical space chamber 4 so that air is evenly guided to the outer peripheral edge of the adsorbing portion 3. Further, the electronic component mounting machine includes an air supply device 21 for supplying air to the air blowing hole 11, an air suction device 22 for sucking air from the air suction hole 12, and at least these for sucking air. A control device 23 for controlling both devices 21 and 22 is provided. Note that the air suction hole 12 may be referred to as an air suction hole in the sense of sucking air.

Next, a method for mounting an IC chip, which is an electronic component, on a printed board using the electronic component mounting machine will be described.
The suction nozzle 1 is moved to a predetermined height position on the IC chip arranged on the supply member, and the air supply device 21 is operated by the control device 23 so that a predetermined amount of air is sent from the air blowing hole 11 to the cylindrical space. Blow out into chamber 4.

  Then, as indicated by the arrow a in FIG. 2, the air moves from the center to the outside and flows out from the outer peripheral edge. At this time, the vicinity of the center becomes a negative pressure (pressure lower than the atmospheric pressure), and on the supply member IC chip W is sucked (by ejector action).

  By this suction, the IC chip W approaches the lower end surface of the suction nozzle 1, but if it approaches too much, conversely, it will be pressed downward by the air pressure (air flow) flowing out from its outer peripheral edge (it can also be said to be a cushion action). ), And therefore floated at a position a predetermined distance α away from the lower end surface of the suction nozzle 1 (the lower end surface of the cylindrical vertical portion), that is, held in a non-contact state and in a substantially horizontal posture (horizontal state) (FIG. 2 indicated by a solid line). In addition, when the IC chip W is levitated in a non-contact state, air is uniformly guided to the outer peripheral edge, so that the IC chip W is maintained in a substantially horizontal posture.

  Then, after being held in a non-contact state and in a horizontal posture (although very little time), the air suction device 22 is operated by the control device 23 and the air in the cylindrical space chamber 4 is sucked. The IC chip W is sucked and held on the lower end surface of the suction nozzle 1 (indicated by an imaginary line in FIG. 2).

  That is, since the IC chip W is temporarily floated on the supply member and brought into a non-contact state and in a horizontal posture so as to have a predetermined gap, the IC chip W is sucked and held by the suction nozzle 1. Therefore, the IC chip W can be sucked and held without damaging the IC chip W.

  Next, in a state where the IC chip W is sucked, the IC chip W is recognized by a recognition camera or the like, and based on the recognition result, the suction nozzle 1 is moved to a predetermined position on the printed circuit board, and then the IC chip W Is placed at a predetermined position on the printed circuit board and fixed by reflow.

  As described above, when the IC chip W is mounted on the printed board, the IC chip W is first floated by the suction nozzle 1 and held in a non-contact state with respect to the lower end surface and in a substantially horizontal posture. Since the IC chip W is adsorbed to the adsorption nozzle 1 by the air suction device 22, the state per one piece is avoided as compared with the case where the IC chip is suddenly adsorbed to the adsorption nozzle as in the prior art. In addition, since the IC chip W is attracted to the suction nozzle 1 at the time of mounting, it can be accurately guided to a predetermined position on the printed board and mounted.

  By the way, in the said embodiment, although nothing was provided in the lower end surface of the cylindrical vertical part 3b of the adsorption | suction part 3 corresponded to the peripheral part of the adsorption nozzle 1, as shown in FIG. A ring-shaped elastic material 31 having a predetermined thickness may be provided to prevent the IC chip from being damaged when the IC chip is attracted and mounted. In addition, as this elastic material 31, what does not generate | occur | produce dust by contact like a silicon resin, a polyimide resin, etc. is used, and it forms by coating.

  Moreover, as shown in FIG. 4, instead of providing the elastic material over the entire lower end surface of the cylindrical vertical portion 3b, the elastic material 32 can be provided only on one side (for example, a semicircular circumference). In this case, when the IC chip is sucked and mounted, the suction operation and the mounting operation for the IC chip are performed with reference to one side where no elastic material is provided.

  In the above embodiment, the lower end surface of the cylindrical vertical portion 3b of the suction portion 3 corresponding to the peripheral portion of the suction nozzle 1 is set to be horizontal, that is, parallel to the suction surface of the IC chip. As shown in FIG. 5, it may be inclined at a predetermined angle (for example, in the range of 0.1 to 1 degree) θ with respect to the suction surface Ws which is the surface of the IC chip W.

  According to this configuration, since the IC chip W is attracted and transported in an inclined state, a drag force is generated against a horizontal shift, and therefore, the IC chip W can be transported in a stable state. In addition, if the lower end surface of the suction nozzle 1 is symmetrical (horizontal), the direction in which the IC chip is displaced is not determined. However, if the lower end surface is inclined, the IC chip is always the same because it is displaced in the same direction. In addition to being attracted at the position, the recognition area is also constant without being biased. Therefore, the IC chip can be mounted easily and accurately.

  Further, as shown in FIG. 6, the outer shape of the suction portion 3 'of the suction nozzle 1 is made to be rectangular according to the outer shape of the IC chip W, and the rectangular vertical portion suspended from the annular horizontal portion 3'a. L-shaped and bar-shaped guides for guiding the periphery of the IC chip W when the IC chip W is attracted to the outer side of the 3'b and making the position (the attracting position) when the IC chip W is attracted constant. Each member 33 may be provided. Note that an elastic material (for example, a spring material) is used as the guide member 33 so that it naturally bends upward when the IC chip W is mounted.

  In addition, as shown in FIG. 7, while providing the raising / lowering member 34 in the outer side of the attachment shaft part 2, the same guide member as above-mentioned to the raising / lowering member 34, ie, the outer four sides, is guided. The guide member 35 may be configured to be moved up and down by holding four L-shaped and rod-shaped guide members 35 for making the suction position of the IC chip W constant.

  For example, when the IC chip W is attracted, the guide member 35 is lowered to guide the periphery of the IC chip W, and when the IC chip W is mounted, the guide member 35 is raised to press the IC chip W. To be out of the way.

  Further, as shown in FIGS. 8A to 8C, guide members 36 each having an air outlet 36a are arranged on the outer four sides (outer four sides) of the suction portion 3 'whose horizontal cross section is rectangular. May be.

  According to this configuration, when the IC chip W is suctioned, the IC chip can be guided to the suction position in the center of the suction portion 3 by blowing the air downward on the outer four sides. Of course, the air outlet 36a is positioned slightly outside the outer periphery of the IC chip W to be adsorbed, and air is supplied, for example, through an air supply hole (not shown) provided in the mounting shaft portion 2. Is supplied.

  Further, as shown in FIG. 9, a plurality of rod-like push members (also called push rods) 37 capable of pressing the surface of the IC chip are provided in the cylindrical space chamber 4 which is a concave portion formed in the suction portion 3. It may be provided. The push member 37 is provided so as to hang down from the annular horizontal portion 3a of the suction portion 3, and its tip (lower end) is rounded so as not to damage the IC chip and prevent air flow. ing.

  According to this configuration, when the IC chip is mounted on the substrate, the pressing member 37 can hold the IC chip over the entire surface, and when the IC chip is large, the flatness can be maintained. This is advantageous when mounting.

  As shown in FIGS. 10 (a) and 10 (b), naturally, the same push member (push bar) is also applied to the rectangular space 4 'of the suction portion 3' whose horizontal cross section is rectangular. ) 38 can be provided.

  Moreover, in the said embodiment, although the air blowing hole 11 and the air suction hole 12 were formed in the attachment shaft part 2 of the suction nozzle 1, the air blowing hole 11 and / or the air suction hole 12 are made into the suction part 3 side (from more Specifically, it may be formed on the annular horizontal portion 3a). In this case, at least the air blowing hole 11 is provided as close to the center of the cylindrical space chamber 4 as possible.

  Moreover, in the said embodiment, although demonstrated (illustrated) that the lower end part of the adsorption | suction part 3 of the adsorption nozzle 1 remains the cylindrical vertical part 3b, ie, it is straight, it blows off, for example in the cylindrical space chamber 4 The bottom end may be bent outward so that the air can easily flow out. Specifically, like the edge of a Mexican sombrero (cap), the cylindrical vertical portion may be formed in a curved shape such that the lower end cross-sectional shape swells downward.

  Moreover, in the said embodiment, although the member which forcibly blows the air which blows off toward the outer periphery was not provided in the cylindrical space chamber 4 of the adsorption nozzle 1, as shown in FIG. For the direction change for forcibly guiding the air b blown from the air blowing hole 11 at the center of the lower surface of the space chamber 4 to the outer peripheral edge of the cylindrical vertical portion 3b, the disk-shaped guide member 41 is radially formed. You may make it arrange | position via the plate-shaped attachment part 42 provided with three or four.

  As described above, by arranging the guide member 41, air can be quickly guided to the outer peripheral edge of the suction portion 3, and therefore, the negative pressure can be generated more quickly, and the IC chip W can be quickly levitated.

In addition, a heating source, a cooling source, or an ultrasonic vibration mechanism can be provided in the suction nozzle in the above embodiment.
Further, in the above-described embodiment, the electronic component mounting machine that performs flip chip bonding has been described. However, the present invention can be applied to other types of mounting machines, for example, die bonding mounting machines.

  In the electronic component mounting machine and the electronic component mounting method of the present invention, when the electronic component is sucked and held by the suction nozzle, the electronic component is temporarily floated in a non-contact state by the suction nozzle, and the electronic component is placed on the lower end surface. And then sucked to the suction nozzle, so that it can be sucked and held without damaging the electronic component, and is particularly effective when the electronic component is thin, It is optimal when mounting by flip chip bonding, die bonding, etc.

It is principal part sectional drawing which shows schematic structure of the mounting nozzle in the electronic component mounting machine which concerns on embodiment of this invention. It is a principal part side view for demonstrating the electronic component mounting method which concerns on the embodiment. It is a schematic sectional drawing of the suction nozzle which shows the modification of the electronic component mounting machine which concerns on the embodiment. It is a schematic sectional drawing of the suction nozzle which shows the modification of the electronic component mounting machine which concerns on the embodiment. It is a schematic sectional drawing of the suction nozzle which shows the modification of the electronic component mounting machine which concerns on the embodiment. It is a schematic perspective view of the suction nozzle which shows the modification of the electronic component mounting machine concerning the embodiment. It is a schematic perspective view of the suction nozzle which shows the modification of the electronic component mounting machine concerning the embodiment. The schematic structure of the suction nozzle in the modification of the electronic component mounting machine which concerns on the embodiment is shown, (a) is a perspective view, (b) is a side view, (c) is a bottom view. It is a schematic sectional drawing of the suction nozzle which shows the modification of the electronic component mounting machine which concerns on the embodiment. The schematic structure of the suction nozzle in the modification of the electronic component mounting machine which concerns on the embodiment is shown, (a) is a side view, (b) is a bottom view. It is a schematic sectional drawing of the suction nozzle which shows the modification of the electronic component mounting machine which concerns on the embodiment. It is a schematic side view for demonstrating the operation | movement at the time of the adsorption | suction of the electronic component in the electronic component mounting machine of a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Suction nozzle 2 Mounting shaft part 3 Suction part 3a Annular horizontal part 3b Cylindrical vertical part 4 Columnar space chamber 11 Air blowing hole 12 Air suction hole 21 Air supply device 22 Air suction device 23 Control device 31 Elastic material 32 Elastic material 33 Guide member 35 Guide member 36 Guide member 36a Air outlet 37 Push member 38 Push member 41 Guide member

Claims (8)

An electronic component mounting machine that sucks and holds an electronic component placed on a supply member of the electronic component and mounts it on the mounted member,
Air suction for sucking out air in the concave portion at a position different from the air blowing hole of the suction nozzle in which a concave portion is formed in the center of the lower surface and an air blowing hole for blowing air into the concave portion is formed. An electronic component mounting machine characterized by forming holes. Connect an air supply device that supplies air to the air blowing hole, and connect an air suction device to suck out air to the air suction hole,
While having a control device for controlling these air supply device and air suction device,
By this control device, the air supply device is operated, air is blown out from the air blowing hole, the electronic component is floated to the suction nozzle side and in a non-contact state with respect to the suction nozzle, and then the air suction device is operated. The electronic component mounting machine according to claim 1, wherein the electronic component floated up is sucked by a suction nozzle.   The electronic component mounting machine according to claim 1, wherein an elastic material is provided at a lower end of the peripheral edge of the suction nozzle.   3. The electronic component mounting machine according to claim 1, wherein a lower end surface of a peripheral portion of the suction nozzle is inclined with respect to the suction surface of the electronic component.   The electronic component mounting machine according to claim 1, wherein a guide member that guides the electronic component to be sucked to a suction position is provided outside the peripheral portion of the suction nozzle.   The electronic component mounting machine according to claim 1, wherein an air outlet for guiding an electronic component to be sucked to a suction position is provided outside the peripheral edge of the suction nozzle.   3. The electronic component mounting machine according to claim 1, wherein a pressing member capable of pressing the sucked electronic component toward the mounted member is provided in the concave portion of the suction nozzle. When the electronic component arranged on the supply member is sucked and held by the suction nozzle and mounted on the mounted member,
After air is blown from the air blowing hole opened in the concave portion of the suction nozzle to the outer periphery, the electronic component is lifted from the supply member, and then air is sucked out from the air suction hole opened in the concave portion of the suction nozzle. The electronic component mounting method, wherein the floated electronic component is adsorbed by an adsorption nozzle.

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