JP2006147323A - Connection base plate and manufacturing method of the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connection base plate excellent in electric stability, especially by improving a form of an anisotropic conductive film, and a manufacturing method of the same. <P>SOLUTION: A transformation part 32b of a spiral contact piece 32, a through hole 31b formed on a sheet member 31, and a first through hole 35a formed on the anisotropic conductive film 35 are in a positional relation of opposing to each other in a direction of height (Z1 to Z2 direction in the figure). As a result, stick-out amount of the anisotropic conductive film 35 toward the through hole 31b formed on the sheet member 31 can be made smaller than before, more preferably, the stick-out amount of the anisotropic conductive film 35 toward the through hole 31b can be eliminated, by the above the contact piece excellent in electrical stability can be provided. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a connection board having a contactor that is electrically connected to an electronic component having a connection terminal such as BGA or LGA, and more particularly to a connection board having excellent electrical stability and its manufacture. Regarding the method.

  In order to satisfactorily perform electrical tests on ultra-fine electronic components, connection substrates having spiral contacts as elastic contacts have been developed. The connection board can also be used as a connector between the electronic component and the board.

  In the following Patent Document 1, the connection substrate has a structure in which a sheet member (resist film) having a large number of spiral contacts is attached to a base (printed substrate) via a conductive adhesive. Patent Document 1 discloses a method for manufacturing the connection substrate in FIGS. 37 to 40.

The conductive adhesive (anisotropic conductive paste, ACP) has the advantage that it is cheaper than the anisotropic conductive film (ACF), but it needs to be printed on the joint surface in advance or has high definition. There was a limit. For this reason, use of an anisotropic conductive film (ACF) for the joining between the base and the sheet member has been studied.
JP 2002-175859 A

  In the above Patent Document 1, there is no description that an anisotropic conductive film is used for joining between the base and the sheet member.

  By the way, when an anisotropic conductive film was used between the said base and a sheet | seat member, it turned out that there exist the following problems.

  FIG. 8 is a partial cross-sectional view of the connection board showing the manufacturing process of the conventional connection board, and FIG. 9 is a partial cross-sectional view of the connection board formed through the manufacturing process shown in FIG. It is explanatory drawing for doing.

  Reference numeral 1 shown in FIG. 8 is a base. A wiring pattern (not shown) is provided on the base 1. An anisotropic conductive film 2 having a predetermined thickness is provided on the entire surface of the base 1. The sheet member 3 is an insulating resin film, and a spiral contact 4 is attached to the sheet member 3. As shown in FIG. 8, the spiral contactor 4 includes a fixed portion 4a having a mounting surface for the sheet member 3, and a deformed portion 4b that extends from the fixed portion 4a and protrudes in a spiral shape in the upward direction in the figure. And is configured. As shown in FIG. 8, a through hole 3 a is formed in the sheet member 3, and the spiral contact 4 is joined to the lower surface 3 b of the sheet member 3 by a fixing portion 3 b, and a deformed portion of the spiral contact 4 is formed. A part of 4b protrudes from the upper surface 3c of the sheet member 3 through the through hole 3a.

  As shown in FIG. 8, the base 1 is placed on the lower plate 5, and the sheet member 3 is placed on the anisotropic conductive film 2. Further, the upper plate 6 provided with a recessed portion 6a at a position facing the deforming portion 4b of the spiral contactor 4 in the height direction is opposed to the sheet member 3, and the upper plate 6 is directed to the lower plate 5 direction. Heat press towards

  The anisotropic conductive film 2 is crushed by hot pressing and the thermosetting binder resin is cured. As a result, the sheet member 3 and the base 1 are firmly bonded, and the anisotropic conductive film 2 includes a conductive portion 2a between the fixed portion 4a of the spiral contact 4 and the wiring pattern on the base 1. Conducted by particles.

  However, as shown in FIG. 9, the anisotropic conductive film 2 that has been crushed during the hot pressing is formed in a through hole 3 a formed in the sheet member 3 and a recess 6 a formed in the upper plate 6. , Protrude (run away). At this time, the amount of the anisotropic conductive film 2a accumulated in the through hole 3a is adjusted by the hot press according to the anisotropic conductive film originally disposed under the through hole 3a in the process of FIG. By being crushed, the anisotropic conductive film that protrudes into the through-hole 3a is added and increases, and the anisotropic conductive film 2a rises as shown in FIG. Then, the anisotropic conductive film 2a accumulated in the through hole 3a may be adhered to the deformed portion 4b of the spiral contact 4 to hinder the elastic force of the deformed portion 4b as an elastic contact. . As a result, when the connection board is used for an electrical test or the like for an electronic component, the contact state between the terminal of the electronic component and the deformed portion 4b is deteriorated, and good electrical stability cannot be obtained.

  Therefore, the present invention is for solving the above-described conventional problems, and in particular, by improving the form of the anisotropic conductive film, it is an object to provide a connection substrate excellent in electrical stability and a method for manufacturing the same. It is said.

The connection board in the present invention is
A contact having a deformable portion and a fixed portion; a sheet member for fixing and holding the contact; a base; and an anisotropic conductive film for joining the sheet member and the base. ,
The sheet member is provided with a through hole, the fixed portion of the contact is joined to the sheet member, and the deforming portion is provided at a position facing the through hole in the height direction,
The anisotropic conductive film is characterized in that a first through hole is provided at a position facing the through hole formed in the sheet member in the height direction.

  In the above, the deformed portion of the contact, the through hole formed in the sheet member, and the first through hole formed in the anisotropic conductive film are all in a positional relationship facing each other in the height direction. As a result, the amount of protrusion of the anisotropic conductive film to the through-hole formed in the sheet member can be reduced as compared with the prior art, and a contact having excellent electrical stability can be provided.

  In the present invention, it is preferable that the first through hole is larger than the through hole formed in the sheet member. In this form, since the anisotropic conductive film does not protrude into the through hole of the sheet member, it is possible to provide a contactor that is more excellent in electrical stability.

  Moreover, in this invention, it is preferable that the said 2nd through-hole is provided in the said anisotropic conductive film in the side of the said 1st through-hole. Thereby, the protrusion amount of the anisotropic conductive film into the through-hole formed in the sheet member can be further reduced.

The manufacturing method of the connection board in the present invention is as follows.
A contact having a deformable portion and a fixed portion; a sheet member for fixing and holding the contact; a base; and an anisotropic conductive film for joining the sheet member and the base. ,
A through hole is provided in the sheet member, the fixing portion of the contact is joined to the sheet member, and the deforming portion is opposed to the through hole in the height direction,
Forming the first through hole in the anisotropic conductive film, and the sheet member and the base so that the first through hole is opposed to the through hole formed in the sheet member in the height direction. Interposing the anisotropic conductive film between,
The sheet member and the base are thermocompression bonded.

  In the present invention, as described above, a first through hole is formed in the anisotropic conductive film, and the first through hole is opposed to the through hole formed in the sheet member in the height direction. Since the anisotropic conductive film is interposed between the sheet member and the base, even if the crushed anisotropic conductive film protrudes into the through-hole of the sheet member at the time of thermocompression bonding, the protrusion does not occur. The amount can be reduced as compared with the conventional case.

  In the present invention, it is preferable that the first through hole is formed larger than the through hole formed in the sheet member. As a result, the amount of protrusion of the anisotropic conductive film into the through hole of the sheet member can be reduced, and an optimum form in which the anisotropic conductive film does not protrude into the through hole of the sheet member can be created. I can do it.

  In the present invention, it is preferable to form a second through hole on the side of the first through hole. By forming the second through hole, the anisotropic conductive film crushed by the thermocompression bonding not only flows so as to reduce the hole diameter of the first through hole, but also the hole diameter of the second through hole. Therefore, the amount of flow in the direction of the first through hole can be reduced. As a result, the protruding amount of the crushed anisotropic conductive film into the through hole of the sheet member can be further reduced.

  In the present invention, the amount of protrusion of the anisotropic conductive film into the through-hole formed in the sheet member can be reduced as compared with the prior art, and a contact having excellent electrical stability can be provided.

  1 is a perspective view showing an inspection apparatus used in a test for confirming the operation of an electronic component, FIG. 2 is a plan view showing a spiral contact, FIG. 3 is a plan view of a connection board, and FIG. 4 is anisotropic. 5 is a partially enlarged plan view of the conductive conductive film, FIG. 5 is a partially enlarged cross-sectional view of the connection board cut from the line I-I shown in FIG. 3 and viewed from the direction of the arrow, and FIG. FIG. 7 is a process diagram (partially enlarged sectional view) showing a process performed after the process of FIG. 6.

  The inspection apparatus 10 shown in FIG. 1 is intended for inspection of an electronic component (contacted body) 20 such as a semiconductor having a plurality of external connection portions made of BGA, LGA, or the like provided on a connection surface.

  As shown in FIG. 1, the inspection apparatus 10 includes a socket 11 and a cover 12 that is rotatably supported via a hinge 13 provided at one edge of the socket 11. The socket 11 and the cover 12 are formed of an insulating resin material or the like. A locked portion 14 is formed on the other edge portion of the socket 11, and a lock portion 15 is formed on the edge portion of the cover 12.

  At the center of the socket 11, a loading portion 11A formed in a concave shape in the Z direction is provided, and an electronic component 20 such as a semiconductor is mounted in the loading portion 11A. A convex pressing portion 12a that presses the electronic component 20 downward in the figure is provided at the center position of the inner surface of the cover 12 so as to face the loading portion 11A.

  A connection board 16 shown in FIG. 5 is provided in the loading portion 11A of the inspection apparatus 10. The connection board 16 includes a base 30, a sheet member 31, and a spiral contact 32. The base 30 is made of, for example, glass epoxy or PWB, the sheet member 31 is a resin sheet such as polyimide, and the spiral contact 32 is formed of a single layer structure or a multilayer structure of a conductive material such as Ni, Au, or Cu. Has been.

  As shown in FIG. 2, the spiral contact 32 has a fixed portion 32 a and a deformed portion 32 b that extends from the fixed portion 32 a and is formed in a spiral shape. The deformable portion 32b is provided with a winding start end portion 32b1 on the outer peripheral side and a winding end portion 32b2 on the inner peripheral side which is the center of the spiral.

  2 and 5, the fixing portion 32a of the spiral contact 32 is joined to the lower surface 31a of the sheet member 31 via a conductive adhesive or the like. As shown in FIG. 5, the sheet member 31 has a through hole 31b. When the sheet member 31 is viewed from directly above, at least a part of the deformed portion 32b is exposed from the through hole 31b. . As shown in FIG. 5, the deforming portion 32 b of the spiral contact 32 is three-dimensionally formed in a spiral staircase shape, and a part of the deforming portion 32 b passes through the through hole 31 b of the sheet member 31. It protrudes upward from the upper surface 31c.

  When the electronic component 20 is incorporated in the loading portion 11A of the inspection apparatus 10, the connection terminal of the electronic component 20 abuts on the deformable portion 32b and presses the deformable portion 32b downward in the figure. Since the deformable portion 32b has an elastic force, it can be elastically deformed downward by the pressing. At this time, since the deformable portion 32b can be deformed so as to enclose the connection terminal of the electronic component 20, the conductive connection between the connection terminal of the electronic component 20 and the deformable portion 32b becomes good.

  As shown in FIG. 5, an anisotropic conductive film 35 is provided between the sheet member 31 and the base 30. The anisotropic conductive film 35 is provided to join the sheet member 31 and the base 30, and the anisotropic conductive film 35 is provided between the sheet member 31 and the base 30. It is thermocompression-bonded through.

  As shown in FIG. 5, an electrode portion 33 is provided on the base 30 at a position facing the fixed portion 32 a of the spiral contactor 32 in the height direction (Z1-Z2 direction in the drawing). A resin layer 34 having a film thickness approximately the same as that of the electrode portion 33 is provided around the electrode portion 33, and the upper surface 33 a of the electrode portion 33 and the upper surface 34 a of the resin layer 34 are substantially flattened. It is a surface. Although not shown, the upper surface of the wiring portion extending from the electrode portion 33 and the upper surface 34a of the resin layer 34 are substantially the same flat surface. Further, as shown in FIG. 2, the electrode portion 33 faces the lower portion 32a of the spiral contactor 32 in the height direction (Z1-Z2 direction in the drawing) and protrudes from at least a part of the side surface of the fixed portion 32a. It is formed with a size of about. As shown in FIG. 5, an anisotropic conductive film 35 is interposed between the electrode portion 33 and the fixed portion 32 a of the spiral contact 32, and conductive particles contained in the anisotropic conductive film 35. Thus, the fixed portion 32a and the electrode portion 33 are in a conductive state. By forming the electrode part 33 with a size that protrudes at least from a part of the side surface of the fixing part 32a, the fixing part 32a of the spiral contactor 32 can be easily overlapped and placed on the electrode part 33, The electrical connection between the electrode part 33 and the fixed part 32a can be made favorable.

  FIG. 3 is a plan view of the connection board 16 as viewed from directly above, but the deformed portion 32b of the spiral contactor 32 that is originally visible from the through hole 31b formed in the sheet member 31 is omitted in the drawing. As shown in FIG. 3, the sheet member 31 is provided with a number of through holes 31b. A large number of the through holes 31b are formed in a matrix in the width direction (X1-X2 direction in the drawing) and the length direction (Y1-Y2 direction). Accordingly, a large number of deformed portions 32b of the spiral contactor 32 are provided in a matrix at positions facing the through holes 31b in the height direction.

  As shown in FIGS. 2, 3, and 5, the anisotropic conductive film 35 is positioned at a position facing the through hole 31 b formed in the sheet member 31 in the height direction (Z1-Z2 direction in the drawing). A first through hole 35a is formed. The first through hole 35a is preferably larger than the through hole 31b formed in the sheet member 31 as shown in FIGS. In the embodiment of FIGS. 2, 3, and 5, since the through hole 31b and the first through hole 35a are both formed in a circular shape, the diameter of the first through hole 35a is the diameter of the through hole 31b. Is bigger than. As shown in FIGS. 2 and 3, since the through hole 31b of the sheet member 31 is accommodated in the first through hole 35a when viewed from directly above, the anisotropy passes through the through hole 31b of the sheet member 31. The conductive film 35 cannot be seen, and the surface of the resin layer 34 formed on the base 30 can be seen instead. The first through hole 35a is not limited to a circular shape, and may have another shape, for example, a square shape.

  Thus, in this embodiment, the anisotropic conductive film 35 does not protrude from the through hole 31b of the sheet member 31.

  Further, a second through hole 35 b is formed in the anisotropic conductive film 35. As shown in FIG. 3, the second through hole 35b is formed on the side of the first through hole 35a. Therefore, the second through hole 35 b is provided on the side of the through hole 31 b formed in the sheet member 31. In the embodiment shown in FIG. 3, there is a predetermined gap between the first through hole 35a and the second through hole 35b, but the first through hole 35a and the second through hole 35b It does not matter if there is some connection between

  In the embodiment shown in FIG. 3, the second through hole 35 b has through holes 31 b and 31 b (first through holes) of the sheet member 31 aligned in an oblique direction (for example, an intermediate direction between the X1 direction and the Y1 direction). The through holes 31b (first through holes 35a) except for the through holes 31b (first through holes 35a, 35a) provided between the holes 35a, 35a) and provided on the outermost periphery of the sheet member 31. In the periphery, exactly four second through holes 35b are provided close to each other. The arrangement of the second through holes 35b is not limited to the embodiment of FIG. As shown in FIG. 4, a second through hole 35b may be provided between the first through holes 35a arranged in the width direction (X1-X2 direction), or the length direction (Y1-Y2 direction). A second through hole 35b may be provided between the first through holes 35a lined up in the direction of. However, it is preferable that the second through holes 35b are provided one at a time on both sides of the through hole 31b (first through hole 35a). Thereby, especially the effect mentioned later (the effect of suppressing the protrusion of the anisotropic conductive film 35 into the through hole 31b) can be more appropriately exhibited. Further, as in the case where the second through holes 35b are provided one by one on both sides of the through hole 31b (the first through hole 35a), the second through holes 35b are formed in the through holes. In the case where a plurality of holes are provided around 31b (first through hole 35a), the center of each of the plurality of second through holes 35b is connected to the center of the through hole 31b (first through hole 35a). It is preferable that the lengths of the lines are all the same because the effects of the present invention can be more appropriately exhibited.

  The second through-hole 35b is circular in the embodiment of FIG. 3, but may be a slit-shaped through-hole 35c (hereinafter referred to as a slit-shaped hole) as shown in FIG. The shape is not particularly limited. When the lengths in the length direction (Y1-Y2 direction) and the width direction (X1-X2 direction) are different as in the slit-shaped hole 35c, for example, in the length direction (Y1-Y2 direction) as shown in FIG. On the side of the first through hole 35a (through hole 31b) along the width direction (X1-X2 direction), the longer one of the slit-shaped holes 35c in the length direction (Y1-Y2 direction in the drawing) When arranged so as to face, the slit-shaped hole 35c can be efficiently arranged in a limited region.

  Since the first through hole 35a formed in the anisotropic conductive film 35 is formed larger than the through hole 31b formed in the sheet member 31, the anisotropic conductive film 35 is formed from the through hole 31b. As a result, the deformed portion 32b of the spiral contact 32 is not adhered by the anisotropic conductive film 35. Accordingly, the deformable portion 32b appropriately exhibits an elastic force as an elastic contact, and the deformable portion 32b is appropriately elastically deformed so as to wrap around the connection terminal of the electronic component 20 by the downward pressing of the electronic component 20. Thus, the conductive connection between the deformable portion 32b and the connection terminal is good.

  The first through hole 35 a formed in the anisotropic conductive film 35 may be smaller than the through hole 31 b formed in the sheet member 31. As a result, a part of the anisotropic conductive film 35 protrudes directly under the through-hole 31b. However, even if it protrudes, the film thickness of the protruding anisotropic conductive film 35 is the same as that of the sheet member 31. The thickness of the anisotropic conductive film 35 sandwiched between the bases 30 is almost the same as that of the base 30. As shown in FIG. 9, the protruding anisotropic conductive film swells and accumulates in the through hole. Compared with the prior art, the problem that the deformed portion 32b of the spiral contact 32 is bonded by the anisotropic conductive film 35 can be avoided.

  In particular, the second through hole 35b formed in the anisotropic conductive film 35 prevents the anisotropic conductive film 35 from protruding into the through hole 31b formed in the sheet member 31 as much as possible during thermocompression bonding. Therefore, by providing the second through hole 35b, the anisotropic conductive film 35 more appropriately protrudes into the through hole 31b formed in the sheet member 31. This can be suppressed.

A method for manufacturing a connection substrate according to the present invention will be described with reference to FIGS.
As shown in FIG. 6, the base 30 is installed on the lower plate 40. An electrode portion 33 is formed on the surface of the base 30, the periphery of the electrode portion 33 is filled with a resin layer 34, and the upper surface 33 a of the electrode portion 33 and the upper surface 34 a of the resin layer 34 are flush with each other. ing.

  As shown in FIG. 6, an anisotropic conductive film 35 is attached on the electrode portion 33 and the resin layer 34. The anisotropic conductive film 35 is provided with a first through hole 35a and a second through hole 35b in advance. A predetermined interval is provided between the first through hole 35a and the second through hole 35b. The diameter of the first through hole 35a shown in FIG. 6 (the maximum dimension in the X1-X2 direction) is the size of the diameter of the first through hole 35a of the anisotropic conductive film 35 shown in FIG. It is larger than (the maximum dimension in the X1-X2 direction). This is because FIG. 6 is before hot pressing the anisotropic conductive film 35. Similarly, the diameter of the second through-hole 35b of the anisotropic conductive film 35 shown in FIG. 6 (the maximum dimension in the X1-X2 direction) is the second size of the anisotropic conductive film 35 shown in FIG. This is larger than the diameter of the through hole 35b (the maximum dimension in the X1-X2 direction).

  As shown in FIG. 6, a through hole 31 b is formed in the sheet member 31, and the fixed portion 32 a of the spiral contact 32 having a fixed portion 32 a and a deformable portion 32 b is the lower surface of the sheet member 31. While being joined to 31 a, a part of the deforming portion 32 b protrudes upward from the upper surface 31 c of the sheet member 31 through a through hole 31 b formed in the sheet member 31.

  The sheet member 31 is placed on the anisotropic conductive film 35. At this time, the sheet is so formed that the through hole 31b formed in the front sheet member 31 faces the first through hole 35a formed in the anisotropic conductive film 35 in the height direction (Z1-Z2 direction in the drawing). The position of the arrangement of the member 31 is regulated.

  The size of the first through hole 35 a formed in the anisotropic conductive film 35 is larger than the size of the through hole 31 b formed in the sheet member 31. For this reason, when the through hole 31b of the sheet member 31 is overlapped on the first through hole 35a of the anisotropic conductive film 35 as shown in FIG. It will be in the state where it fits in one through-hole 35a.

  Then, the upper plate 41 is disposed on the sheet member 31. The upper plate 41 has a recess 41 a at the position of the first through hole 31 b formed in the sheet member 31. The depth of the recess 41a (the length in the Z1-Z2 direction) must be at least larger than the height of the deformed portion 32b of the spiral contact 32.

  Then, the upper plate 41 is pressed toward the lower plate 40. The plates 40 and 41 are heating plates, and pressurization and heating are performed simultaneously.

  As shown in FIG. 7, the anisotropic conductive film 35 is crushed by the hot press and flows in a direction to reduce the diameter of the first through hole 35 a as indicated by an arrow A. At the same time, the anisotropic conductive film 35 also flows in the direction of reducing the diameter of the second through hole 35b as indicated by an arrow B.

  The diameter of the first through-hole 35a formed in the anisotropic conductive film 35 by the above flow is smaller than that before the hot press in FIG. 6, but in the case of FIG. The anisotropic conductive film 35 can be prevented from protruding into the through-hole 31b formed in the sheet member 31 by appropriately adjusting the diameter of the hole 35a, the pressing force at the time of hot pressing, and the like. . In particular, the anisotropic conductive film 35 is provided with the second through hole 35b as shown in FIG. 6 so that the anisotropic conductive film 35 reduces the diameter of the second through hole 35b (arrow B direction). Accordingly, the anisotropic conductive film 35 expands in the direction (arrow A direction) in which the diameter of the first through hole 35a is reduced as compared with the case where the second through hole 35b is not provided. It is possible to appropriately suppress the anisotropic conductive film 35 from protruding into the through hole 31b formed in the sheet member 31.

  However, the anisotropic conductive film 35 may slightly protrude into the through hole 31b of the sheet member 31 after the process of FIG. That is, at this time, the diameter of the first through hole 35 a of the anisotropic conductive film 35 is smaller than the diameter of the through hole 31 b of the sheet member 31. However, even if the anisotropic conductive film 35 slightly protrudes into the through hole 31b of the sheet member 31, the film thickness of the protruding anisotropic conductive film 35 is between the sheet member 31 and the base 30 shown in FIG. The thickness of the anisotropic conductive film 35 in a state of being sandwiched between the films is almost the same. Moreover, even if the anisotropic conductive film 35 protrudes, the anisotropic conductive film 35 still has the first through hole 35a remaining therein, and the anisotropic conductive film is entirely formed under the through hole 31b of the sheet member 31. The film 35 does not extend. Therefore, the problem that the anisotropic conductive film 35 protruding to the deformed portion 32b of the spiral contactor 32 is less likely to occur than in the prior art, and it is possible to manufacture a connection board having superior electrical characteristics as compared with the prior art. It is possible.

  The anisotropic conductive film 35 is cured by the hot pressing, and the fixed portion 32a and the electrode portion 33 are conductively connected via conductive particles.

  After the above-described hot pressing is completed, the lower plate 40 and the upper plate 41 are removed from the connection board.

  The upper surface 33a of the electrode part 33 and the upper surface 34a of the resin layer 34 formed on the surface of the base 30 are flush with each other, but this makes the entire surface of the base 30 uniform during hot pressing. A pressing force can be applied. That is, if the resin layer 34 is not provided, the pressing force on the electrode portion 33 protruding from the surface of the base 30 is likely to be stronger than in other places. The conductive film 35 is easy to spread, and as a result, the anisotropic conductive film 35 easily protrudes directly under the through hole 31b of the sheet member 31, but the pressing force is increased by making the surface of the base 30 flat. Appropriately dispersed, the anisotropic conductive film 35 easily spreads in the direction of arrow B, and it is possible to suppress the anisotropic conductive film 35 from protruding directly below the through hole 31b of the sheet member 31 as much as possible. .

  The connection board 16 described above is incorporated in, for example, the inspection apparatus 10 shown in FIG. 1, but the connection board 16 of the present invention can be used for various applications of electronic devices other than the inspection apparatus 10 shown in FIG. Can be used.

The perspective view which shows the test | inspection apparatus used for the test for confirming operation | movement of an electronic component, A plan view showing a spiral contact, Plan view of connection board, Partial enlarged plan view of anisotropic conductive film, The partial expanded sectional view of the said connection board | substrate cut | disconnected from the II line | wire shown in FIG. 1 process drawing (partial expanded sectional view) for demonstrating the manufacturing method of the connection board in this invention, FIG. 6 is a process diagram (partially enlarged sectional view) showing a process performed after the process of FIG. Partial sectional view of the connection board showing the manufacturing process of the conventional connection board, FIG. 9 is a partial cross-sectional view of a connection substrate formed through the manufacturing process shown in FIG. 8, and is an explanatory diagram for explaining a conventional problem,

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Inspection apparatus 16 Connection board 30 Base 31 Sheet member 31b Through-hole 32 Spiral contact 32a Fixing part 32b Deformation part 33 Electrode part 35 Anisotropic conductive film 35a First through-hole 35b Second through-hole 40 Lower plate 41 Upper plate

Claims (6)

A contact having a deformable portion and a fixed portion; a sheet member for fixing and holding the contact; a base; and an anisotropic conductive film for joining the sheet member and the base. ,
The sheet member is provided with a through hole, the fixed portion of the contact is joined to the sheet member, and the deforming portion is provided at a position facing the through hole in the height direction,
A connection substrate, wherein the anisotropic conductive film is provided with a first through hole at a position facing a through hole formed in the sheet member in a height direction.   The connection board according to claim 1, wherein the first through hole is larger than a through hole formed in the sheet member.   The connection substrate according to claim 1, wherein the anisotropic conductive film is provided with a second through hole on a side of the first through hole. A contact having a deformable portion and a fixed portion; a sheet member for fixing and holding the contact; a base; and an anisotropic conductive film for joining the sheet member and the base. ,
A through hole is provided in the sheet member, the fixing portion of the contact is joined to the sheet member, and the deforming portion is opposed to the through hole in the height direction,
Forming the first through hole in the anisotropic conductive film, and the sheet member and the base so that the first through hole is opposed to the through hole formed in the sheet member in the height direction. Interposing the anisotropic conductive film between,
A method for manufacturing a connection board, comprising: thermocompression bonding between the sheet member and a base.   The method for manufacturing a connection board according to claim 4, wherein the first through hole is formed larger than the through hole formed in the sheet member.   The method for manufacturing a connection substrate according to claim 4 or 5, wherein a second through hole is formed on a side of the first through hole.