JP2006080003A - Reflector for illumination device, its manufacturing method, illumination device using this, and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a reflector for an illumination device, its manufacturing method, an illumination device using this, and its manufacturing method, wherein adhesiveness with the substrate is enhanced, while deterioration of a light emitting element caused by irradiated light and a short circuit to a wiring pattern formed on the substrate can be prevented. <P>SOLUTION: This is the reflector (1) for the illumination device that has an electrically insulated basic material (10) including a resinous material and has through holes (11) formed on the electrically insulated basic material (10) for housing the light emitting elements, wherein the through holes (11) have first apertures (12) and second apertures (13) that are a little smaller than the first apertures (12), and inner wall faces (14) of the through holes (11) are formed in a conical shape that are narrowed from the first apertures (12) toward the second apertures (13), parts (14a) which are covered with the plated films (15), while a constituting material of the electrically insulated basic material (10) is exposed as for the main face (1b) on the side of the second apertures (13) and as for the edges (13a) of the second apertures (13). <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a reflector for an illuminating device and a manufacturing method thereof, and an illuminating device using the same and a manufacturing method thereof.

  Conventionally, incandescent bulbs, fluorescent lamps, high-pressure discharge lamps, and the like have been used as light sources for lighting fixtures and signboards. As new illumination light sources that replace these light sources, research on light-emitting elements such as light-emitting diodes (LEDs) and electroluminescence (EL) elements is underway. In addition, research is also being conducted on lighting devices using these light-emitting elements. Among them, lighting devices using LEDs (hereinafter also referred to as “LED lighting devices”) have a longer lifetime than conventional lighting devices. Therefore, various LED lighting devices have been proposed (see, for example, Patent Document 1).

  7 shows the configuration of the LED lighting device proposed in Patent Document 1, in which FIG. 7A shows an overall perspective view of the LED lighting device, and FIG. 7B shows a cross-sectional view taken along the line I-I in FIG. 7A.

  As illustrated in FIG. 7A, the LED lighting device 100 proposed in Patent Document 1 includes a substrate 101, a plurality of LEDs 102 mounted on the substrate 101, and a plurality of through holes 103 that accommodate each of the plurality of LEDs 102. And a reflection plate 104. Further, the substrate 101 and the reflection plate 104 are bonded to each other with an adhesive layer 105 interposed therebetween.

  As illustrated in FIG. 7B, the substrate 101 includes a base layer 110, an electrical insulating layer 111 including a resin material stacked on the base layer 110, and a wiring pattern 112 formed on the electrical insulating layer 111. The LED 102 is mounted on the wiring pattern 112 via bumps 113 and sealed with, for example, a sealing resin (not shown). Further, the inner wall surface 103a of the through hole 103 is formed in a mortar shape that narrows toward the substrate 101 side.

  In the LED lighting device 100 configured as described above, light generated from the LED 102 is directly emitted to the outside (arrow II in FIG. 7B), or reflected by the inner wall surface 103a of the through hole 103 and emitted to the outside. (Arrow III in FIG. 7B) is used as illumination light.

  In the conventional LED illumination device including the LED illumination device 100 described above, a metal reflector such as an aluminum plate is usually used as the reflector. However, the use of a metal reflector causes the following problems. That is, since the electrical insulating layer of the substrate to which the metallic reflector is bonded is mainly composed of a resin material such as epoxy resin, the difference between the linear expansion coefficient of the reflector and the linear expansion coefficient of the electrical insulating layer is If it is too large, cracks are likely to occur at the interface between the reflector and the substrate. As a result, the adhesion between the reflector and the substrate is deteriorated, and there is a possibility that peeling occurs at the interface.

On the other hand, Patent Document 2 proposes an LED lighting device using a plastic material as a constituent material of a reflector. According to the LED illumination device of Patent Document 2, the difference between the linear expansion coefficient of the reflection plate and the linear expansion coefficient of the electrical insulating layer can be reduced, so that the adhesion between the reflection plate and the substrate is improved. Further, Patent Document 2 also proposes an LED lighting device in which the reflecting surface of the reflecting plate is covered with an electroless Ni plating film. According to this structure, it can prevent that the plastic material which comprises a reflecting plate deteriorates with the irradiation light of LED. Therefore, for example, it is possible to prevent color deviation of illumination light caused by discoloration of the reflector.
JP 2003-124528 A JP 2002-76443 A

  However, when the reflecting surface of the reflecting plate is covered with a plating film such as an electroless Ni plating film, the plating film and the wiring pattern on which the LED is mounted are short-circuited. That is, there is a risk of short circuit through the plating film provided on the reflector.

  The present invention solves the above-mentioned conventional problems, and can improve the adhesion to the substrate, and can prevent deterioration of the light emitting element due to irradiation light and short circuit with the wiring pattern formed on the substrate. Provided are a reflector for light and a method for manufacturing the same, and an illumination device using the same and a method for manufacturing the same.

The reflector for an illuminating device of the present invention is a reflector for an illuminating device having an electrically insulating base material containing a resin material, and a through hole formed in the electrically insulating base material for accommodating a light emitting element,
The through hole has a first opening and a second opening that is slightly smaller than the first opening,
The inner wall surface of the through hole is formed in a mortar shape that narrows from the first opening toward the second opening, and a part thereof is covered with a plating film,
The constituent material of the electrically insulating base material is exposed on the main surface on the second opening side of the reflector for lighting device and the edge of the second opening.

The lighting device of the present invention is
A substrate including a base layer, an electric insulating layer including a resin material laminated on the base layer, and a wiring pattern formed on the electric insulating layer, a light emitting element mounted on the wiring pattern, and the illumination Including a reflector for the device,
The reflector for an illuminating device is an illuminating device in which the light emitting element is accommodated in the through-hole and is bonded onto the substrate so that a main surface on the second opening side is located on the substrate side. .

The manufacturing method of the reflector for lighting device of the present invention is as follows.
Forming a mortar-shaped bottomed hole that narrows from the opening toward the bottom on one main surface of the electrically insulating base material containing the resin material,
Cover the inner wall surface of the bottomed hole with a plating film,
A through hole for receiving the light emitting element is formed through the bottom portion of the bottomed hole.

The manufacturing method of the 1st illuminating device of this invention is the following.
A light emitting element is mounted on the wiring pattern of a substrate including a base layer, an electric insulating layer including a resin material laminated on the base layer, and a wiring pattern formed on the electric insulating layer,
The illumination is provided on the substrate such that the light emitting element is accommodated in the through-hole of the reflector for the illumination device, and a main surface on the second opening side of the reflector for the illumination device is located on the substrate side. Bond the reflector for the device.

The manufacturing method of the 2nd illuminating device of this invention is the following.
Forming a mortar-shaped bottomed hole that narrows from the opening toward the bottom on one main surface of the electrically insulating base material containing the resin material,
Cover the inner wall surface of the bottomed hole with a plating film,
Adhering an adhesive sheet to the back surface of the electrical insulating substrate relative to the one main surface,
A laminate in which the reflector for lighting device and the adhesive sheet are bonded together by forming a through hole for accommodating the light emitting element through the bottom portion of the bottomed hole and the adhesive sheet facing the bottom portion Form the body,
Separately, a light emitting element is mounted on the wiring pattern of a substrate including a base layer, an electric insulating layer including a resin material laminated on the base layer, and a wiring pattern formed on the electric insulating layer,
The laminated body is bonded onto the substrate so that the light emitting element is accommodated in the through hole of the reflector for lighting device and the adhesive sheet is positioned on the substrate side.

  According to the reflector for an illuminating device of the present invention, since a part of the inner wall surface of the through hole formed in the electrically insulating base material including the resin material is covered with the plating film, the substrate is formed when the illuminating device is configured. In addition, it is possible to prevent deterioration of the light emitting element due to irradiation light. The main surface on the second opening side of the reflector for lighting device, that is, the main surface of the reflector for lighting device located on the substrate side when the lighting device is configured, and the edge of the second opening are electrically insulating base materials. Therefore, the short circuit with the wiring pattern formed on the substrate can be prevented. According to the illuminating device of the present invention, since the illuminating device reflection plate is provided, as described above, the adhesion between the illuminating device reflection plate and the substrate is improved, and illumination by the irradiation light of the light emitting element is performed. Deterioration of the reflection plate for the device and short circuit between the reflection plate for the lighting device and the wiring pattern formed on the substrate can be prevented. Moreover, according to the manufacturing method of the reflecting plate for illuminating devices of this invention, the reflecting plate for illuminating devices of this invention can be manufactured easily. Furthermore, according to the manufacturing method of the illuminating device of this invention, the illuminating device of this invention can be manufactured easily.

  The reflector for lighting device of the present invention (hereinafter simply referred to as “reflector”) is an electrically insulating base material containing a resin material, and is formed on the electrically insulating base material and penetrates to accommodate light emitting elements such as LEDs. A reflector having a hole. Since an electrically insulating base material containing a resin material is used as a constituent material of the reflector, the difference between the coefficient of linear expansion of the reflector and the coefficient of linear expansion of the electrical insulating layer of the substrate on which the light emitting element is mounted can be reduced. it can. Therefore, when the lighting device is configured, the adhesion between the reflector and the substrate is improved. As the resin material, a material containing a melt type liquid crystal polymer such as an aromatic polyester resin, a polyphthalamide resin, or the like can be used. Since these resin materials have a small coefficient of linear expansion, they can maintain good adhesion with a plating film described later, and have high moldability, so that they are suitable as constituent materials for the reflector of the present invention. In addition to the resin material, the electrically insulating base material may contain 5 to 60% by volume of an inorganic filler such as alumina in order to improve the heat dissipation, for example. In addition, what is necessary is just to set the thickness of an electrically insulating base material suitably according to the light emitting element to be used, for example, when using LED with a thickness of 80-100 micrometers as a light emitting element, the thickness of an electrically insulating base material is set. What is necessary is just to be 0.4-0.6 mm.

The through hole has a first opening and a second opening that is slightly smaller than the first opening. The diameters of the first and second openings may be appropriately set according to the light emitting element to be used. For example, when an LED having an area of 0.07 to 0.11 mm ² is used as the light emitting element, the first opening is used. And the diameter of the second opening may be 2.0 to 3.0 mm and 1.5 to 2.0 mm, respectively. Note that the number of through holes is not particularly limited, and may be formed according to the number of light emitting elements to be used.

  The inner wall surface of the through hole is formed in a mortar shape that narrows from the first opening toward the second opening, and a part thereof is covered with a plating film. Thereby, when an illuminating device is comprised, deterioration by the irradiated light of a light emitting element can be prevented. Examples of the plating film include an electroless copper plating film, an electroless nickel plating film, and the like. For example, a film having a thickness of 3 to 30 μm can be used. These plating films can be easily formed on an electrically insulating substrate containing a resin material. The inner wall surface of the through hole may be a curved surface or an inclined surface. Further, the plating film can be formed not only on the inner wall surface of the through-hole but also on the main surface on the first opening side of the electrically insulating substrate.

  The main surface of the reflecting plate on the second opening side, that is, the main surface located on the substrate side when the lighting device is configured, and the edge of the second opening expose the constituent material of the electrically insulating base material. ing. Thereby, the reflector of this invention can prevent a short circuit with the wiring pattern formed in the board | substrate, when comprising an illuminating device.

  Moreover, the reflecting plate of this invention is good also as a reflecting plate whose distance of the edge part nearest to the edge of the said 2nd opening among the said plating films, and the ridgeline of the edge of the said 2nd opening is 100 micrometers or more. This is because when the lighting device is configured, a short circuit with the wiring pattern formed on the substrate can be prevented more reliably.

Further, in the reflector of the present invention, the inner wall surface of the through hole is located on the first opening side, and is located on the first inclined surface covered with the plating film, and on the second opening side, The second inclined surface from which the constituent material of the electrically insulating substrate is exposed, and the inclination angle (θ ₂ ) of the second inclined surface with respect to the main surface on the second opening side of the reflector is the main surface. It may be a reflector larger than the inclination angle (θ ₁ ) of the first inclined surface with respect to. Thereby, since the diameter of 2nd opening expands, when comprising an illuminating device, interference with a light emitting element and 2nd opening can be prevented easily. The inclination angles θ ₁ and θ ₂ may be, for example, 30 to 70 ° and 40 to 80 °, respectively.

  An illumination device of the present invention is mounted on a substrate including a base layer, an electric insulating layer including a resin material laminated on the base layer, and a wiring pattern formed on the electric insulating layer, and the wiring pattern. And the reflector of the present invention described above, wherein the reflector is configured such that the light-emitting element is accommodated in the through hole and the main surface on the second opening side is located on the substrate side. Are attached to the substrate. According to the illuminating device of the present invention, since the reflector is provided, as described above, the adhesion between the reflector and the substrate is improved, and the reflector is deteriorated and reflected by the light emitted from the light emitting element. A short circuit between the board and the wiring pattern formed on the substrate can be prevented.

As a constituent material of the base layer, a material having a high thermal conductivity (for example, 10 W / mK or more) including a metal material such as aluminum or copper or a ceramic material such as AlN or Al ₂ O ₃ is preferable. Moreover, the suitable thickness of a base layer is 50-150 micrometers.

  As the constituent material of the electrical insulating layer, for example, a material containing 40 to 95% by volume of inorganic filler such as alumina, silica, or magnesia and 5 to 60% by volume of thermosetting resin such as epoxy resin can be used. Moreover, the suitable thickness of an electrical insulating layer is 100-250 micrometers. The electrical insulating layer may be composed of one layer of electrical insulating base material, or may be composed of a plurality of layers of electrically insulating base material. In the case of a plurality of layers of electrically insulating substrates, a wiring pattern may be formed between each electrically insulating substrate.

  The wiring pattern can be formed by a known method. For example, the wiring pattern can be obtained by patterning a metal foil such as a copper foil bonded to the electrical insulating layer by hot pressing by photolithography and etching. In this case, the height, width, and minimum pitch of the wiring in the wiring pattern may be, for example, 10 to 50 μm, 50 to 300 μm, and 30 to 100 μm, respectively.

  As the light emitting element, an LED, an EL element, or the like can be used. Among these, an LED is preferable because it can obtain a sufficient amount of light as a light source of an illumination device and has a long lifetime.

  As the reflection plate, the reflection plate of the present invention described above is used, and is bonded to the substrate via, for example, a liquid adhesive or an adhesive sheet. In addition, when bonding a reflecting plate and a board | substrate using a liquid adhesive agent, an adhesive sheet, etc., polyolefin resin, an epoxy resin, an acrylic resin etc. are used as a material of the said liquid adhesive agent or the said adhesive sheet. be able to. In this case, the thickness of the adhesive layer between the reflector and the substrate may be, for example, 30 to 130 μm.

  The manufacturing method of the reflector of this invention is a suitable manufacturing method for manufacturing the reflector of this invention mentioned above. Therefore, the material of each component described below is the same as that of the reflector of the present invention described above.

  In the method for producing a reflector according to the present invention, first, a mortar-shaped bottomed hole that narrows from the opening toward the bottom is formed on one main surface of the electrically insulating substrate containing a resin material. The bottomed hole may be drilled in the electrically insulating base material by means of laser processing or the like, or molded from the constituent material of the electrically insulating base material using a mold simulating the shape of the bottomed hole. You may shape | mold and form with the said electrical insulation base material. The opening diameter of the bottomed hole, the diameter of the bottom portion, and the depth of the bottomed hole are, for example, 2.0 to 3.0 mm, 1.6 to 2.1 mm, and 0.2 to 0.55 mm, respectively. And it is sufficient. Moreover, what is necessary is just to let the thickness of the said bottom part be 0.05-0.2 mm, for example.

  Next, the inner wall surface of the bottomed hole is covered with a plating film. For example, a masking sheet such as a polyethylene sheet is first bonded to the back surface of the electrical insulating substrate with respect to the one main surface, and then a predetermined catalyst is applied to the inner wall surface of the bottomed hole. Subsequently, the plating film can be formed by immersing the electrically insulating base material in which the bottomed hole is formed in an electroless plating bath. Next, a through hole for accommodating the light emitting element is formed through the bottom of the bottomed hole by means such as press working, and the reflector of the present invention is obtained.

  The manufacturing method of the 1st illuminating device of this invention is a suitable manufacturing method for manufacturing the illuminating device of this invention mentioned above. Therefore, the material of each component described below is the same as that of the lighting device of the present invention described above.

  According to the first method of manufacturing the lighting device of the present invention, first, a substrate including a base layer, an electrical insulating layer including a resin material laminated on the base layer, and a wiring pattern formed on the electrical insulating layer. A light emitting element is mounted on the wiring pattern. For example, a wiring pattern is formed on the electrical insulating layer, and a separately prepared base layer and the electrical insulating layer are pressure-bonded by hot pressing or the like, and then a light emitting element is mounted on the wiring pattern. At this time, the mounting method is not particularly limited, and it can be mounted by a flip chip bonding method, a wire bonding method, or the like.

  Next, the light emitting element is accommodated in the through hole of the reflector of the present invention described above, and the main surface of the reflector on the second opening side is positioned on the substrate so as to be on the substrate. Affix the reflector. The said reflecting plate can be manufactured by the manufacturing method of the reflecting plate of this invention mentioned above, for example. Moreover, the said reflecting plate and the said board | substrate can be bonded together through a liquid adhesive agent, an adhesive sheet, etc., for example. Thereby, the illuminating device of this invention mentioned above can be manufactured easily. In the case where the reflector and the substrate are bonded together by an adhesive sheet, a through-hole having a shape matching the diameter of the second opening is formed in the adhesive sheet in advance by, for example, punching or the like, and then the adhesive sheet is The reflector and the substrate may be bonded together.

  The manufacturing method of the 2nd illuminating device of this invention is a suitable manufacturing method for manufacturing the illuminating device of this invention mentioned above. Therefore, the material of each component described below is the same as that of the lighting device of the present invention described above.

  The manufacturing method of the 2nd illuminating device of this invention narrows toward the bottom part from the opening to the one main surface of the electrically insulating base material containing a resin material first like the manufacturing method of the reflecting plate of this invention mentioned above. A mortar-shaped bottomed hole is formed, and the inner wall surface of the bottomed hole is covered with a plating film.

  Next, an adhesive sheet is bonded to the back surface of the main surface of the electrically insulating base material, and the through hole for accommodating the light emitting element through the bottom portion of the bottomed hole and the adhesive sheet facing the bottom portion By forming, a laminated body in which the reflector and the adhesive sheet are bonded together is formed. Thereby, the process of forming the through-hole of the shape matched with the diameter of the said 2nd opening in an adhesive sheet can be skipped.

  Separately, as in the above-described manufacturing method of the first lighting device of the present invention, a base layer, an electrical insulating layer containing a resin material laminated on the base layer, and a wiring formed on the electrical insulating layer A light emitting element is mounted on the wiring pattern of the substrate including the pattern.

  Next, the laminate is bonded onto the substrate so that the light emitting element is accommodated in the through hole of the reflector and the adhesive sheet is positioned on the substrate side. Thereby, the illuminating device of this invention mentioned above can be manufactured easily. Hereinafter, embodiments of the present invention will be described in detail.

[First Embodiment]
First, the reflecting plate according to the first embodiment of the present invention will be described with reference to the drawings as appropriate. FIG. 1 to be referred to is a cross-sectional view of the reflector according to the first embodiment.

  As shown in FIG. 1, the reflector 1 according to the first embodiment is formed on an electrically insulating substrate 10 containing a resin material and an electrically insulating substrate 10 to accommodate an LED 35 (see FIG. 3) described later. Through-holes 11.

  The through hole 11 has a first opening 12 and a second opening 13 that is slightly smaller than the first opening 12, and the inner wall surface 14 of the through hole 11 narrows from the first opening 12 toward the second opening 13. It is formed in a mortar shape. The inner wall surface 14 is located on the first opening 12 side, is located on the first inclined surface 14a covered with the plating film 15 and the second opening 13 side, and the constituent material of the electrical insulating base material 10 is exposed. The second inclined surface 14b. Further, the main surface 1 a on the first opening 12 side of the reflector 1 is covered with the plating film 15, but the main surface 1 b on the second opening 13 side of the reflector 1 is covered with the plating film 15. The constituent material of the electrically insulating base material 10 is exposed.

  In the reflection plate 1 configured as described above, a part of the inner wall surface 14 (the first inclined surface 14a) of the through hole 11 formed in the electrically insulating base material 10 including the resin material is covered with the plating film 15. Therefore, when the lighting device 2 (see FIG. 3) described later is configured, the LED 35 (see FIG. 3), which is a light emitting element, is deteriorated by irradiation light after improving the adhesion with the substrate 33 (see FIG. 3). Can be prevented. Further, the main surface 1b on the second opening 13 side of the reflector 1 and the edge 13a of the second opening 13 are formed on the substrate 33 (see FIG. 3) because the constituent material of the electrical insulating base material 10 is exposed. A short circuit with the wiring pattern 32 (see FIG. 3) can be prevented.

In addition, the inclination angle θ ₂ of the second inclined surface 14 b with respect to the main surface 1 b on the second opening 13 side of the reflector ₁ is larger than the inclination angle θ ₁ of the first inclined surface 14 a with respect to the main surface 1 b. Thereby, since the diameter of the 2nd opening 13 expands, when the illuminating device 2 (refer FIG. 3) is comprised, interference with LED35 (refer FIG. 3) and the 2nd opening 13 can be prevented easily.

  The distance D between the end 15a closest to the edge 13a of the second opening 13 in the plating film 15 covering the first inclined surface 14a and the ridge line 131a of the edge 13a of the second opening 13 is 100 μm or more. Is preferred. This is because when the lighting device 2 (see FIG. 3) is configured, a short circuit with the wiring pattern 32 (see FIG. 3) formed on the substrate 33 (see FIG. 3) can be prevented more reliably.

  Next, the manufacturing method of the reflecting plate 1 according to the first embodiment of the present invention will be described with reference to the drawings as appropriate. 2A to 2D to be referred to are cross-sectional views showing respective steps of the manufacturing method of the reflector 1 according to the first embodiment. The same components as those in FIG. 1 are denoted by the same reference numerals, and the description thereof is omitted.

  First, a mortar-shaped bottomed hole 20 that narrows from the opening 20a toward the bottom 20b as shown in FIG. 2B is formed on the main surface 10a of the electrical insulating base material 10 shown in FIG. 2A.

  Next, as shown in FIG. 2C, after a masking sheet 21 such as a polyethylene sheet is bonded to the main surface 10 b which is the back surface of the main surface 10 a of the electrical insulating base material 10, the inner wall surface 20 c of the bottomed hole 20. The main surface 10 a of the electrical insulating substrate 10 is covered with the plating film 15. Subsequently, after the masking sheet 21 is peeled off, the through hole 11 for accommodating the LED 35 (see FIG. 3) is formed by penetrating the plating film 15 on the bottom portion 20b and the bottom portion 20b by means such as press working ( 2D), the reflecting plate 1 is obtained.

[Second Embodiment]
Next, a lighting apparatus according to a second embodiment of the present invention will be described with reference to the drawings as appropriate. FIG. 3 to be referred to is a cross-sectional view of the illumination device according to the second embodiment. The same components as those in FIG. 1 are denoted by the same reference numerals, and the description thereof is omitted.

  As illustrated in FIG. 3, the lighting device 2 according to the second embodiment includes a base layer 30, an electric insulating layer 31 including a resin material laminated on the base layer 30, and a wiring pattern formed on the electric insulating layer 31. 32, the LED 35 mounted on the wiring pattern 32 via the bumps 34, and the reflector 1 according to the first embodiment described above. The reflector 1 is bonded to the substrate 33 via the adhesive layer 36 so that the LED 35 is accommodated in the through hole 11 and the main surface 1b on the second opening 13 side is located on the substrate 33 side. Yes. Since the illuminating device 2 includes the reflecting plate 1, as described above, the adhesion between the reflecting plate 1 and the substrate 33 is improved, and the reflecting plate 1 is deteriorated due to light emitted from the LED 35 that is a light emitting element. And the short circuit with the wiring pattern 32 formed in the reflecting plate 1 and the board | substrate 33 can be prevented.

  Next, the manufacturing method of the illuminating device 2 which concerns on 2nd Embodiment of this invention is demonstrated with reference to drawings suitably. 4A and 4B to be referred to are cross-sectional views showing respective steps of the method for manufacturing the lighting device 2 according to the second embodiment. In addition, the same code | symbol is attached | subjected to the component same as FIG. 3, and the description is abbreviate | omitted. Moreover, the manufacturing method of the illuminating device 2 demonstrated below is one Embodiment which concerns on the manufacturing method of the 1st illuminating device of this invention mentioned above.

  First, as shown in FIG. 4A, the LED 35 is mounted on the wiring pattern 32 of the substrate 33 via the bumps 34.

  Next, an adhesive sheet 40 (see FIG. 4A) is prepared in which a through hole 41 having a shape matching the diameter of the second opening 13 of the through hole 11 is provided in advance by punching or the like. Then, as shown in FIG. 4B, the LED 35 is accommodated in the through-hole 11 and the substrate 1 through the adhesive sheet 40 so that the main surface 1b on the second opening 13 side of the reflector 1 is located on the substrate 33 side. The reflecting plate 1 is pasted on 33. For example, by heating at a temperature at which the adhesive sheet 40 is cured, the adhesive sheet 40 is cured to become the adhesive layer 36 (see FIG. 3), and the lighting device 2 (see FIG. 3) is obtained.

  Next, another method for manufacturing the illumination device 2 according to the second embodiment of the present invention will be described with reference to the drawings as appropriate. FIGS. 5A to 5C and FIGS. 6A and 6B to be referred to are cross-sectional views showing respective steps of another manufacturing method of the lighting device 2 according to the second embodiment. In addition, the same code | symbol is attached | subjected to the same component as FIGS. 1-4, and the description is abbreviate | omitted. Moreover, another manufacturing method of the illuminating device 2 demonstrated below is one Embodiment which concerns on the manufacturing method of the 2nd illuminating device of this invention mentioned above.

  FIG. 5A shows a state in which the steps up to FIGS. 2A to 2C of the manufacturing method of the reflector 1 according to the first embodiment described above are performed. After peeling the masking sheet 21 from this state, as shown in FIG. 5B, the adhesive sheet 40 is bonded to the main surface 10 b of the electrical insulating base material 10. Next, a through-hole 11 for accommodating the LED 35 (see FIG. 3) is formed through the plating film 15 on the bottom portion 20b, the bottom portion 20b, and the adhesive sheet 40 facing the bottom portion 20b by means such as press working. (See FIG. 5C). At this time, a through hole 41 having a shape matching the diameter of the second opening 13 (see FIG. 4A) of the through hole 11 is formed in the adhesive sheet 40. Thereby, as shown to FIG. 5C, the laminated body 50 by which the reflecting plate 1 and the adhesive sheet 40 were bonded together is obtained.

  Next, as shown in FIG. 6A, the LED 35 is separately mounted on the wiring pattern 32 of the substrate 33 via the bumps 34.

  Subsequently, as illustrated in FIG. 6B, the stacked body 50 is bonded onto the substrate 33 so that the LEDs 35 are accommodated in the through holes 11 of the reflecting plate 1 and the adhesive sheet 40 is positioned on the substrate 33 side. For example, by heating at a temperature at which the adhesive sheet 40 is cured, the adhesive sheet 40 is cured to become the adhesive layer 36 (see FIG. 3), and the lighting device 2 (see FIG. 3) is obtained.

It is sectional drawing of the reflecting plate which concerns on 1st Embodiment of this invention. AD is sectional drawing which shows each process of the manufacturing method of the reflecting plate which concerns on 1st Embodiment of this invention. It is sectional drawing of the illuminating device which concerns on 2nd Embodiment of this invention. A and B are sectional views showing each step of the manufacturing method of the lighting device according to the second embodiment of the present invention. AC is sectional drawing which shows the one part process in another manufacturing method of the illuminating device which concerns on 2nd Embodiment of this invention. A and B are sectional views showing a part of steps in another method for manufacturing a lighting device according to the second embodiment of the present invention. The structure of the conventional LED illuminating device is shown, among these, A shows the whole perspective view of the conventional LED illuminating device, B shows the II sectional view taken on the line of A.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Reflector for illuminating devices 1a, 1b, 10a, 10b Main surface 2 Illuminating device 10 Electrical insulating base material 11, 41 Through-hole 12 1st opening 13 2nd opening 13a Edge 14, 20c Inner wall surface 14a 1st inclined surface 14b 1st 2 inclined surface 15 plated film 15a end 20 bottomed hole 20a opening 20b bottom 21 masking sheet 30 base layer 31 electrical insulating layer 32 wiring pattern 33 substrate 34 bump 35 LED (light emitting element)
36 Adhesive layer 40 Adhesive sheet 50 Laminate 131a Ridge line

Claims (9)

A reflector for an illuminating device comprising an electrically insulating base material containing a resin material, and a through hole formed in the electrically insulating base material for accommodating a light emitting element,
The through hole has a first opening and a second opening that is slightly smaller than the first opening,
The inner wall surface of the through hole is formed in a mortar shape that narrows from the first opening toward the second opening, and a part thereof is covered with a plating film,
The constituent material of the electrically insulating base material is exposed at the main surface on the second opening side of the reflector for lighting device and the edge of the second opening.   2. The illumination according to claim 1, wherein a distance between an end portion closest to the edge of the second opening in the plating film covering the inner wall surface of the through hole and a ridge line of the edge of the second opening is 100 μm or more. Reflector for equipment. An inner wall surface of the through hole is located on the first opening side, is located on the first inclined surface covered with the plating film, and on the second opening side, and the constituent material of the electrically insulating base material is exposed. The second inclined surface,
2. The illumination device according to claim 1, wherein an inclination angle of the second inclined surface with respect to the main surface on the second opening side of the reflector for the illumination device is larger than an inclination angle of the first inclined surface with respect to the main surface. a reflector.   The reflector for lighting device according to claim 1, wherein the resin material includes at least one selected from a melt-type liquid crystal polymer and a polyphthalamide resin.   The said plating film is a reflector for lighting apparatuses of Claim 1 containing at least 1 chosen from an electroless copper plating film and an electroless nickel plating film. A substrate including a base layer, an electric insulating layer including a resin material laminated on the base layer, and a wiring pattern formed on the electric insulating layer, and a light emitting element mounted on the wiring pattern, And the reflector for lighting device according to 1.
The illuminating device reflecting plate is an illuminating device in which the light emitting element is accommodated in the through hole, and is bonded to the substrate so that a main surface on the second opening side is located on the substrate side. Forming a mortar-shaped bottomed hole that narrows from the opening toward the bottom on one main surface of the electrically insulating base material containing the resin material,
Cover the inner wall surface of the bottomed hole with a plating film,
The manufacturing method of the reflector for illumination devices which forms the through-hole for penetrating the said bottom part of the said bottomed hole, and accommodates a light emitting element. A light emitting element is mounted on the wiring pattern of a substrate including a base layer, an electric insulating layer including a resin material laminated on the base layer, and a wiring pattern formed on the electric insulating layer,
The said light emitting element is accommodated in the said through-hole of the reflecting plate for illuminating devices of Claim 1, and the said main surface by the side of the said 2nd opening of the reflecting plate for illuminating devices is located in the said board | substrate side. The manufacturing method of the illuminating device which bonds the said reflecting plate for illuminating devices on a board | substrate. Forming a mortar-shaped bottomed hole that narrows from the opening toward the bottom on one main surface of the electrically insulating base material containing the resin material,
Cover the inner wall surface of the bottomed hole with a plating film,
Adhering an adhesive sheet to the back surface of the electrical insulating substrate relative to the one main surface,
A laminate in which the reflector for lighting device and the adhesive sheet are bonded together by forming a through hole for accommodating the light emitting element through the bottom portion of the bottomed hole and the adhesive sheet facing the bottom portion Form the body,
Separately, a light emitting element is mounted on the wiring pattern of a substrate including a base layer, an electric insulating layer including a resin material laminated on the base layer, and a wiring pattern formed on the electric insulating layer,
The manufacturing method of the illuminating device which bonds the said laminated body on the said board | substrate so that the said light emitting element is accommodated in the said through-hole of the said reflecting plate for illuminating devices, and the said adhesive sheet is located in the said board | substrate side.

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