JP2005310174A - Ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable an IC card to be highly integrated and mount highly heat-generative electronic components such as a CPU by highly efficiently cooling the IC card. <P>SOLUTION: The IC card to be freely attachably and detachably inserted to a slot of a device in which the IC card is packaged, comprises a card casing which is formed like an approximately rectangular card so as to have an internal space, a metal block accommodated inside the card casing, a metal wiring board accommodated inside the card casing while forming a wiring layer on one side of a metal plate via an insulating layer and adhering another side of the metal plate with another side of the metal block, and a plurality of electronic components packaged on the wiring layer of the metal wiring board. A portion of the metal block is protruded outside the card casing. Furthermore, a heat pipe is buried in the metal block or a fan is mounted near the protruding portion. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a technique for cooling an IC card that is detachably inserted into a slot of an IC card mounted device such as a portable personal computer.

  In a portable computer such as a notebook personal computer, it is necessary to satisfy the conflicting demands of high-performance and multi-functionality of the device and reduction in size and weight. Therefore, a structure is adopted in which an IC card based on a standard such as PCMCIA is detachably inserted into a slot included in these IC card mounted devices.

  The IC card is configured for each of various extension functions (extended memory, communication modem, hard disk unit, etc.), and is used by being inserted into the slot of the IC card mounted device by the user as needed.

  An IC card is formed by covering a printed wiring board on which electronic components such as LSI are mounted with resin by resin molding and forming it into a card shape, or by housing it in a box-shaped metal housing. Yes.

  Such IC cards have been increasingly integrated in recent years, and the amount of heat generation has increased, and mounting of a CPU having a very large amount of heat generation has also been studied.

  However, since no special cooling measures have been taken in the past, there is a problem that the IC card malfunctions or fails due to a temperature rise due to its own heat generation, which hinders further high integration, as well as a CPU or the like. There has been a problem that electronic components having a large amount of heat generation cannot be mounted.

  In addition to the heat generation of the IC card itself, the temperature of the IC card rises due to the influence of heat from other heat generating parts of the IC card mounted device into which the IC card is inserted, which may cause similar problems. It was.

  Therefore, an object of the present invention is to provide a technology for cooling the IC card with high efficiency, to enable high integration of the IC card and to mount a highly heat-generating electronic component such as a CPU on the IC card. It is to make it equal.

  Of the inventions disclosed in this application, the outline of typical ones will be briefly described as follows.

  According to one aspect of the present invention, there is provided an IC card that is detachably inserted into a slot of an IC card mounted device, and is formed in a substantially rectangular card shape so as to have a space therein, and the card A metal block housed inside the card housing in a state where one surface is in close contact with the inner surface of the housing, and a wiring layer is formed on one surface of the metal plate via an insulating layer. A plurality of electrons mounted on the wiring layer of the metal wiring board and a metal wiring board housed inside the card housing with the other surface of the metal block in close contact with the other surface of the metal block There is provided an IC card comprising: a part; and a part of the metal block protruding outside the card housing.

  Preferably, a heat pipe is embedded in the metal block from a portion of the metal block located inside the card housing to a portion protruding outside the card housing.

  More preferably, a fan that generates an air flow in the vicinity of the protruding portion is attached to a portion of the metal block protruding outside the card housing.

  According to the present invention, an IC card with improved heat dissipation is provided. Accordingly, it becomes possible to cope with further higher integration of the IC card, and it is possible to mount a highly heat-generating electronic component such as a CPU on the IC card.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1, 2 and 3 are views showing the basic configuration of the embodiment of the present invention. FIG. 1 is an exploded perspective view of the IC card, FIG. 2 is a sectional view of the IC card, FIG. It is a perspective view of the socket which comprises the slot of the IC card mounting apparatus in which an IC card is inserted.

  As shown in FIGS. 1 and 2, the IC card 1 is configured based on a standard such as PCMCIA, and has a card case 2 formed in a substantially rectangular card shape and having a space inside. A printed wiring board 3 is provided.

  The card housing 2 includes a pair of covers 4 and 4 and a frame 5 made of thin plates. These covers 4 and 4 are formed of a highly heat conductive metal material such as copper (Cu) or a high heat conductivity non-metal material such as carbon fiber. Similarly, the frame 5 is made of a highly heat conductive material.

  The printed wiring board 3 is composed of, for example, an epoxy board in which a wiring layer and an insulating layer are laminated, and a plurality of electronic components (CPU chip, memory chip, etc.) 6 including heat generating components are mounted thereon.

  In the following description, the printed wiring board means an epoxy board unless otherwise specified. A first connector 7 is attached to the front edge of the printed wiring board 3 along the front edge. The first connector 7 may be attached to the front end surface portion of the card housing 2.

  The printed wiring board 3 is accommodated in the card housing 2 by being integrated with being sandwiched between the covers 4 and 4 and the frame 5.

  An IC card mounted device (such as a notebook computer) on which such an IC card 1 is mounted has a slot into which the IC card 1 is inserted. As shown in FIG. 3, the slot includes a socket 8 having guide portions facing each other for guiding both side edges of the IC card 1 and a second connector 9 fitted to the first connector 7. Has been.

  Although not shown, the socket 8 has a card introduction side (opposite side to the second connector 9) of the socket 8 in an opening penetrating the inside and outside formed in the wall surface of the housing of the IC card mounted device. And the second connector 9 side is attached in a state where it is positioned on the back side of the IC card mounted device.

  The socket 8 shown in FIG. 3 is of a type that can accommodate two IC cards 1 vertically, but there is a type that can accommodate one IC card 1.

  Since the covers 4 and 4 and the frame 5 constituting the card housing 2 are made of a highly heat conductive material, the heat generated by the electronic component 6 is efficiently dissipated to the outside through the card housing 2. Is done.

  Hereinafter, various embodiments will be specifically described on the premise of the above basic configuration.

[First Embodiment]
FIG. 4 is a side view of the IC card according to the first embodiment of the present invention. In the card housing 2 of the IC card 1, a plurality of openings 11 that penetrates the space inside the card housing 2 and the space outside the card housing 2 are formed in an array.

  The outside air passes through the opening 11 of the card housing 2 and flows into the space inside the card housing 2, passes through the other opening 11 together with the heat generated by the electronic component 6, and flows out of the card housing 2. Therefore, the internal heat is radiated with high efficiency.

  A plurality of openings 11 can be formed on other side surfaces (side surfaces of the frame 5) and / or upper and lower surfaces (covers 4, 4) except for the side surface to which the first connector 7 of the card housing 2 is attached. The openings 11 do not have to be arranged, and can be formed in a concentrated manner at a portion corresponding to the highly heat-generating electronic component 6.

[Second Embodiment]
FIG. 5 is a side view of an IC card according to the second embodiment of the present invention. A plurality of convex members 12 are attached to the surface of the card housing 2 of the IC card 1 in an array. Since the surface area in contact with the space outside the card housing 2 is larger than that without the convex member 12, the heat dissipation is improved.

  A plurality of the convex members 12 can be formed on the other side surface (side surface of the frame 5) and / or the upper and lower surfaces (covers 4, 4) excluding the side surface to which the first connector 7 of the card housing 2 is attached.

  The convex member 12 is integrated by bonding a member different from the card housing 2 to the card housing 2. The same effect can be obtained by forming a concave portion and / or a convex portion on the card housing 2 by embossing or the like instead of such a separate member.

[Third Embodiment]
FIG. 6 is a sectional view of an IC card according to the third embodiment of the present invention. A highly exothermic electronic component 6 (LSI or the like) mounted on a printed wiring board 3 housed inside the card housing 2 is in close contact with the inner surface of the card housing 2 (cover 4).

  The heat generated by the electronic component 6 is directly transferred from the upper surface of the electronic component 6 (the surface on the opposite side to the bonding surface with the printed wiring board 3) to the cover 4 made of a highly heat conductive material. Heat dissipation with high efficiency.

[Fourth Embodiment]
FIG. 7 is a sectional view of an IC card according to the fourth embodiment of the present invention. A flexible sheet-like flexible printed wiring board 3 a having flexibility is used as a printed wiring board accommodated in the card housing 2.

  The electronic component 6 is mounted on one surface of the flexible printed wiring board 3a. The flexible printed wiring board 3a is accommodated inside the card housing 2 in a state of being bent into a substantially U shape.

  The upper surface of the highly heat-generating electronic component 6 mounted on the flexible printed wiring board 3a (the surface opposite to the bonding surface with the printed wiring board 3) is in close contact with the inner surface of the card housing 2 (cover 4). Has been.

  By appropriately disposing the elastic member 13 made of a plate-like rubber or the like, the adhesiveness between the highly exothermic electronic component 6 and the card housing 2 is improved, and high heat dissipation is realized. By forming the elastic member 13 from a material having high thermal conductivity, heat dissipation through this can be expected.

[Fifth Embodiment]
FIG. 8 is a cross-sectional view of an IC card according to the fifth embodiment of the present invention. A metal wiring board (metal printed wiring board) 3b in which a wiring layer is formed on one surface of a metal plate via an insulating layer is used as a printed wiring board housed inside the card housing 2. The electronic component 6 is mounted on the wiring layer.

  The metal wiring board 3b is housed inside the card housing 2 with the other surface of the metal plate being in close contact with the inner surface of the card housing 2 (cover 4). The metal plate used for the metal wiring board 3b is made of a metal material having high thermal conductivity such as copper (Cu). Since the heat generated by the electronic component 6 is transferred to the card housing 2 through the metal plate with high efficiency, the heat dissipation is improved.

[Sixth Embodiment]
FIG. 9 is a sectional view of an IC card according to the sixth embodiment of the present invention. A metal wiring board (metal printed wiring board) 3b in which a wiring layer is formed on one surface of a metal plate via an insulating layer is used as a printed wiring board housed inside the card housing 2. Electronic components including the heat generating component 6 are mounted on the wiring layer. The metal plate used for the metal wiring board 3b is formed of a metal material having high thermal conductivity such as copper (Cu).

  Reference numeral 14 denotes a plate-like metal block made of a material having high thermal conductivity such as copper (Cu), and the metal block 14 is in close contact with the inner surface of the card housing 2 (cover 4). Is housed in.

  The metal wiring board 3b is housed inside the card housing 2 with the other surface of the metal wiring board 3b being in close contact with the other surface of the metal block.

  Since the heat generated by the electronic component 6 is transferred to the card housing 2 with high efficiency through the metal plate and the metal block 14 constituting the metal wiring board 3, heat dissipation is improved.

[Seventh Embodiment]
FIG. 10 is a cross-sectional view of an IC card according to the seventh embodiment of the present invention. Since the seventh embodiment relates to the improvement of the sixth embodiment, only the improved part will be described.

  A rear end portion (end portion opposite to the first connector 7) 15 of the plate-shaped metal block 14 made of a material having high thermal conductivity such as copper (Cu) is attached to the card housing 2 (frame 5). It is configured such that it is pulled out and protrudes laterally and exposed to the outside of the card housing 2.

  The heat generated by the electronic component 6 is exposed to the outside of the metal block 14 in addition to being transferred to the card housing 2 (cover 4) through the metal plate and the metal block 14 constituting the metal wiring board 3. Since heat is radiated directly from the rear end portion 15, heat dissipation is improved.

[Eighth Embodiment]
FIG. 11 is a sectional view of an IC card according to the eighth embodiment of the present invention. Since the eighth embodiment relates to the improvement of the seventh embodiment, only the improved part will be described.

  A single or a plurality of heat pipes 16 are embedded so as to extend from a portion existing inside the card housing 2 of the metal block 14 to the rear end portion 15 exposed to the outside. The heat pipe 16 is a heat transport device that moves heat from the high temperature side to the low temperature side by evaporation and condensation of the working fluid sealed inside the metal sealed tube.

  The heat generated by the electronic component 6 is positively transferred to the exposed rear end 15 of the metal block 14 by the action of the heat pipe 16, so that the heat dissipation is further improved.

[Ninth Embodiment]
FIG. 12 is a cross-sectional view of an IC card according to the ninth embodiment of the present invention. Since the ninth embodiment relates to the improvement of the eighth embodiment, only the improved part will be described.

  A fan 17 is attached to a rear end portion 15 of the metal block 14 exposed to the outside of the card housing 2 to generate an air flow in the vicinity of the rear end portion 15.

  The heat generated by the electronic component 6 is actively transferred to the exposed rear end 15 of the metal block 14 by the action of the heat pipe 16, and the rear end 15 is actively cooled by the fan 17. Therefore, heat dissipation is further improved.

[Tenth embodiment]
FIG. 13 is a cross-sectional view of an IC card according to the tenth embodiment of the present invention. In the first to ninth embodiments described above, the printed wiring board 3 (the flexible printed wiring board 3a and the metal printed wiring board 3b) configured independently has been a constituent requirement. In the tenth embodiment, a wiring layer is formed on the inner surface of the card housing 2 (cover 4) via an insulating layer, and a plurality of electronic components 6 are mounted on the wiring layer.

  Since the electronic component 6 is mounted on the inner surface of the card housing 2 and the outer surface corresponding to the mounting portion of the card housing 2 is exposed, highly efficient heat dissipation can be achieved. When the card housing 2 (cover 4) is made of an insulating material, the wiring layer can be formed directly without interposing the insulating layer.

[Eleventh embodiment]
FIG. 14 is a cross-sectional view of an IC card according to the eleventh embodiment of the present invention. Since the eleventh embodiment relates to the improvement of the tenth embodiment, only the improved part will be described.

  A plurality of convex members 18 are attached to the outer surface of the card housing 2 (cover 4) opposite to the surface on which the electronic component 6 is mounted. Since these convex members 18 increase the surface area of the card housing 2, the heat radiation efficiency can be made higher than that of the tenth embodiment.

[Twelfth embodiment]
FIG. 15 is a cross-sectional view of an IC card according to the twelfth embodiment of the present invention. The card housing 2 of the IC card 1 is inserted into the slot of the IC card mounting device so that the rear end 2a protrudes outside the slot (the wall surface 19 of the housing of the IC card mounting device). The dimension in the insertion direction into the slot is set.

  The printed wiring board 3 is accommodated inside the card housing 2 so as to extend inside and outside the slot in a state of being inserted into the slot.

  Since the rear end 2a of the card housing 2 protrudes from the slot, the card casing 2 is exposed to the outside of the IC card mounted device, so that heat radiation from this portion is high.

  Of the electronic components 6 mounted on the printed wiring board 3, the highly heat-generating electronic component 6 a is a portion (rear end portion 2 a) existing outside the slot of the printed wiring board 3 in a state of being inserted into the slot. In this way, heat dissipation can be further improved.

[Thirteenth embodiment]
FIG. 16 is a cross-sectional view of an IC card according to a thirteenth embodiment of the present invention. Since the thirteenth embodiment relates to the improvement of the twelfth embodiment, only the improved part will be described.

  The card case 2 of the IC card 1 is inserted into the slot of the IC card mounted device, and the rear end 2a protrudes outward from the slot (the wall surface 19 of the case of the IC card mounted device). The rear end portion 2a is formed in a shape that is bent at a substantially right angle with respect to a portion existing in the slot.

  The printed wiring board 3 is also formed in a shape corresponding to the card housing 2 such that the vicinity of the rear end thereof is bent at a substantially right angle with respect to the portion existing inside the slot.

  Of the electronic components 6 mounted on the printed wiring board 3, the highly heat-generating electronic component 6 a is mounted on the bent rear end of the printed wiring board 3. By doing in this way, heat dissipation efficiency can be made high.

  Further, in the state where the IC card 1 is inserted into the slot, the rear end portion 2a is in a state along the wall surface 19 of the housing of the IC card mounted device. Therefore, the rear end portion of the IC card 1 is obstructive. There is little to be.

[Fourteenth embodiment]
FIG. 17 is a sectional view of an IC card according to the fourteenth embodiment of the present invention. Since the fourteenth embodiment relates to the improvement of the thirteenth embodiment, only the improved part will be described.

  A plurality of slits (cut grooves) 20a and 20b are formed on the upper and lower surfaces of the rear end 2a of the card housing 2 so as to penetrate inside and outside, respectively.

  The highly exothermic electronic component 6a is located inside the rear end 2a of the card housing 2, and outside air flows in from the lower slit 20a to cool the highly exothermic electronic component 6a and Since it flows out from the slit 20b, heat dissipation is high.

[Fifteenth embodiment]
FIG. 18 is a partially cutaway side view of an IC card according to the fifteenth embodiment of the present invention. This embodiment relates to an improvement of the twelfth embodiment or the thirteenth embodiment.

  The card housing 2 of the IC card 1 is inserted into the slot of the IC card mounting device so that the rear end 2a protrudes outside the slot (the wall surface 19 of the housing of the IC card mounting device). The dimension in the insertion direction into the slot is set.

  The protruding rear end 2a of the card housing 2 is rotated in a range of approximately 90 degrees from the flat state to the upper side and / or the lower side with respect to the portion existing inside the slot of the card housing 2. It is supported by a shaft 21 so that it can move.

  When the IC card 1 is not inserted into the slot, it can be handled flat by keeping it flat. By inserting the IC card 1 into the slot and rotating it upward or downward, the housing of the IC card mounted device can be obtained. Therefore, the rear end of the IC card 1 is less likely to get in the way.

  As the printed wiring board 3 housed inside the card housing 2, a flexible sheet-like flexible printed wiring board 3a is used so that the card housing 2 does not interfere with rotation. An electronic component having high heat generation is mounted on a corresponding rear end portion of the flexible printed wiring board 3a.

[Sixteenth embodiment]
FIG. 19 is a sectional view of an IC card according to the sixteenth embodiment of the present invention. The card housing 2 of the IC card 1 is inserted into the slot of the IC card mounting device so that the rear end 2a protrudes outside the slot (the wall surface 19 of the housing of the IC card mounting device). The dimension in the insertion direction into the slot is set.

  A space inside the card housing 2 is divided into two in the thickness direction (up and down) by the inner wall 22, and a first space 23a and a second space 23b are defined. A first opening 24a is formed in the vicinity of the front end portion of the card housing 2 so as to penetrate the external space and the first space 23a, and is penetrated across the external space and the first space 23a in the vicinity of the rear end portion. A second opening 24b is formed.

  A wiring layer is formed on the surface of the inner wall 22 of the card housing 2 on the second space 23b side, and a plurality of electronic components 6 are mounted on the wiring layer. A fan 25 that generates an air flow from the first space 23a to the external space is attached in the vicinity of the second opening 24b of the card housing 2.

  With the IC card 1 inserted into the slot of the IC card mounting device, the fan 25 is operated, so that air in the IC card mounting device flows from the first opening 24a of the card housing 2, Since the inner wall 22 on which the electronic component 6 is mounted is cooled and actively flows out of the IC card mounted device from the second opening 24b, the inner wall 22 on which the electronic component 6 is mounted is efficiently cooled. This structure contributes to cooling of other devices in the IC card mounted device.

[Seventeenth embodiment]
FIG. 20 is a cross-sectional view of an IC card according to the seventeenth embodiment of the present invention. Since the seventeenth embodiment relates to the improvement of the sixteenth embodiment, only the improved part will be described.

  A plurality of convex portions 26 (and / or concave portions) are integrally formed on the surface of the inner wall 22 of the card housing 2 on the first space 23a side. Since the surface area of the inner wall 22 on the first space 23a side is larger than that in the sixteenth embodiment, the cooling efficiency of the electronic component 6 mounted on the surface of the inner wall 22 on the second space 23b side is further improved.

[Eighteenth Embodiment]
FIG. 21 is a perspective view of an IC card cooling tray on which an IC card according to an eighteenth embodiment of the present invention is mounted.

  The IC card cooling tray 31 is integrally formed with inverted L-shaped holding members 32 at both corners of the rear end portion of the tray body formed in a substantially rectangular thin plate shape so as to correspond to the IC card 1. It is comprised by doing.

  The IC card 1 is integrated with the IC card cooling tray 31 by holding the rear end portion of the IC card 1 in a reverse L-shaped holding member 32 in a state of being in close contact with the tray body.

  The IC card cooling tray 31 holding the IC card 1 is inserted into the slot of the IC card mounted device. The IC card cooling tray 31 is formed using a highly heat conductive material such as copper (Cu).

Since the IC card 1 is integrated in close contact with the IC card cooling tray 31 and inserted into the slot, the heat of the IC card 1 is highly efficient through the IC card cooling tray 31 having a large heat capacity and surface area. Heat is dissipated.

[Nineteenth embodiment]
FIG. 22 is a perspective view of an IC card cooling tray on which an IC card according to a nineteenth embodiment of the present invention is mounted.

  In the eighteenth embodiment, the holding member 32 is formed at both corners of the rear end portion of the IC card cooling tray 31. In this embodiment, both side edges of the IC card 1 are guided. Guides (holding members) 33 are integrally formed on both side edges of the tray body.

  By inserting the IC card 1 along the guide 33 of the IC card cooling tray 31, the IC card 1 is held in close contact with the tray body, and is inserted into the slot in this state. The rest is the same as in the eighteenth embodiment, and a description thereof will be omitted.

[20th embodiment]
FIG. 23 is a side view of an IC card cooling tray on which an IC card according to a twentieth embodiment of the present invention is mounted. This embodiment relates to the improvement of the eighteenth embodiment.

  The main body tray of the IC card cooling tray 31 has the IC card cooling tray 31 inserted in the slot so that the rear end portion 31a protrudes outward from the wall surface 19 of the housing of the IC card mounted device. The dimension in the direction of insertion into the slot is set. The inverted L-shaped holding members 32 are formed on both sides of the position corresponding to the wall surface 19 in a state where the IC card cooling tray 31 is inserted into the slot.

  The IC card 1 is integrated by holding the rear end portion of the IC card 1 on an L-shaped holding member 32 in a state of being in close contact with the tray body, and the IC card cooling tray 31 holding the IC card 1 is Then, it is inserted into the slot of the IC card mounted device. The IC card cooling tray 31 is formed using a highly heat conductive material such as copper (Cu).

  Since the rear end portion 31a of the IC card cooling tray 31 is exposed to the outside of the IC card mounted device, the heat of the IC card 1 is radiated with high efficiency through the rear end portion 31a.

[Twenty-first embodiment]
FIG. 24 is a side view of an IC card cooling tray on which an IC card according to a twenty-first embodiment of the present invention is mounted. This embodiment relates to the improvement of the twentieth embodiment, and except for the improved part, is the same as the twentieth embodiment, and therefore the description thereof is omitted.

  The rear end portion 31 a of the IC card cooling tray 31 is formed in a shape that is bent substantially at a right angle with respect to a portion of the IC card cooling tray 31 that is present inside the slot.

  Since the rear end portion 31a of the IC card cooling tray 31 is exposed to the outside of the IC card mounted device, the heat of the IC card 1 is radiated with high efficiency through the rear end portion 31a.

  In the state where the IC card cooling tray 31 is inserted into the slot, the rear end portion 31a is in a state along the wall surface 19 of the housing of the IC card mounted device. Is less likely to get in the way.

[Twenty-second embodiment]
FIG. 25 is a side view of an IC card cooling tray on which an IC card according to a twenty-second embodiment of the present invention is mounted. This embodiment relates to the improvement of the twentieth embodiment, and except for the improved part, is the same as the twentieth embodiment, and therefore the description thereof is omitted.

  A plurality of concave and convex portions 34 are formed on the rear end portion 31 a exposed to the outside of the IC card cooling tray 31.

  Since the surface area of the rear end portion 31a of the IC card cooling tray 31 exposed to the outside of the IC card mounted device is enlarged by the concavo-convex portion 34, the heat radiation efficiency becomes higher than that of the twentieth embodiment.

[Twenty-third Embodiment]
FIG. 26 is a side view of an IC card cooling tray on which an IC card according to a twenty-third embodiment of the present invention is mounted. This embodiment relates to the improvement of the twentieth embodiment, and except for the improved part, is the same as the twentieth embodiment, and therefore the description thereof is omitted.

  The rear end portion 31a of the IC card cooling tray 31 is formed in a shape that is bent a plurality of times into a plurality of irregularities.

  Since the rear end portion 31a of the IC card cooling tray 31 exposed to the outside of the IC card mounted device is formed in a shape that is bent into an uneven shape, the surface area is increased. The heat dissipation efficiency is higher than that of the embodiment.

[Twenty-fourth embodiment]
FIG. 27 is a side view of an IC card cooling tray on which an IC card according to a twenty-fourth embodiment of the present invention is mounted. This embodiment relates to the improvement of the twenty-first embodiment. Except for the improved part, this embodiment is the same as the twenty-first embodiment, and the description thereof will be omitted.

  A plurality of concavo-convex portions 34 are formed on the rear end portion 31a that is exposed to the outside of the IC card cooling tray 31 and is bent substantially at a right angle.

  Since the surface area of the rear end portion 31a of the IC card cooling tray 31 exposed to the outside of the IC card mounted device is enlarged by the uneven portion 34, the heat radiation efficiency is higher than that of the twenty-first embodiment.

[Twenty-fifth embodiment]
FIG. 28 is a sectional view of an IC card cooling tray on which an IC card according to a twenty-fifth embodiment of the present invention is mounted. This embodiment relates to the improvement of the twentieth embodiment, and except for the improved part, is the same as the twentieth embodiment, and therefore the description thereof is omitted.

  In a state where the IC card cooling tray 31 is inserted into the slot, the IC card cooling tray 31 extends from the portion existing inside the slot to the rear end portion 31a protruding outside the slot. A plurality of heat pipes 35 are embedded. The heat pipe 35 is a heat transport device that moves heat from the high temperature side to the low temperature side by evaporation and condensation of the working fluid sealed inside the metal sealed tube.

  Since the heat conducted from the IC card 1 to the IC card cooling tray 31 is positively transmitted to the rear end portion 31a exposed to the outside by these heat pipes 35, from the twentieth embodiment described above. In addition, the cooling efficiency of the IC card 1 can be increased.

[Twenty-sixth embodiment]
FIG. 29 is a sectional view of an IC card cooling tray on which an IC card according to a twenty-sixth embodiment of the present invention is mounted. This embodiment relates to the improvement of the twenty-second embodiment. Except for the improved part, this embodiment is the same as the twenty-second embodiment, and the description thereof will be omitted.

  In a state where the IC card cooling tray 31 is inserted into the slot, the IC card cooling tray 31 extends from the portion existing inside the slot to the rear end portion 31a protruding outward from the slot. A plurality of heat pipes 35 are embedded. The heat pipe 35 is a heat transport device that moves heat from the high temperature side to the low temperature side by evaporation and condensation of the working fluid sealed inside the metal sealed tube.

  Since the heat conducted from the IC card 1 to the IC card cooling tray 31 is positively transmitted to the rear end portion 31a exposed to the outside by these heat pipes 35, from the twenty-second embodiment. In addition, the cooling efficiency of the IC card 1 can be increased.

[Twenty-seventh embodiment]
FIG. 30 is a sectional view of an IC card cooling tray on which an IC card according to a twenty-seventh embodiment of the present invention is mounted. This embodiment relates to the improvement of the twenty-sixth embodiment. Except for the improved part, this embodiment is the same as the twenty-sixth embodiment, and a description thereof will be omitted.

  A fan (axial fan) 36 for generating an air flow is attached to the uneven portion of the rear end portion 31a of the IC card cooling tray 31.

  Since the uneven portion of the rear end portion 31a of the IC card cooling tray 31 is actively cooled by the air flow by the fan 36, the cooling efficiency of the IC card 1 can be made higher than that in the twenty-sixth embodiment. it can.

[Twenty-eighth embodiment]
FIG. 31 is a side view of an IC card cooling tray on which an IC card according to a twenty-eighth embodiment of the present invention is mounted. This embodiment relates to the improvement of the twenty-second embodiment. Except for the improved part, this embodiment is the same as the twenty-second embodiment, and the description thereof will be omitted.

  A fan (axial fan) 36 for generating an air flow is attached to the uneven portion of the rear end portion 31a of the IC card cooling tray 31.

  Since the uneven portion of the rear end portion 31a of the IC card cooling tray 31 is actively cooled by the air flow by the fan 36, the cooling efficiency of the IC card 1 can be made higher than that of the twenty-second embodiment. it can.

[Twenty-ninth embodiment]
FIG. 32 is a sectional view of an IC card cooling tray on which an IC card according to a 29th embodiment of the present invention is mounted. This embodiment relates to the improvement of the twentieth embodiment, and except for the improved part, is the same as the twentieth embodiment, and therefore the description thereof is omitted.

  An internal space 37 is defined in the tray body of the IC card cooling tray 31 so as to extend from the front end side to the rear end side. A first opening 37a penetrating the internal space 37 and the external space is formed on the front end surface of the tray body of the IC card cooling tray 31, and the internal space 37 and the external space are formed on the upper surface of the rear end portion 31a. A second opening 37b penetrating therethrough is formed.

  On the second opening 37b of the rear end portion 31a of the tray body, a fan (axial fan) 36 that generates an air flow from the internal space 37 toward the external space is attached.

  When the IC card cooling tray 31 holding the IC card 1 integrally is inserted in the slot of the IC card mounting device, the fan 36 is operated, so that the inside of the IC card mounting device is opened from the first opening 37a. The air flows in and cools the portion where the IC card 1 is in close contact and actively flows out of the IC card mounted device through the second opening 37b, so that the IC card 1 is efficiently cooled. This structure contributes to cooling of other devices in the IC card mounted device.

[Thirty Embodiment]
FIG. 33 is a sectional view of an IC card cooling tray on which an IC card according to a thirtieth embodiment of the present invention is mounted. This embodiment relates to the improvement of the twenty-ninth embodiment. Except for the improved part, this embodiment is the same as the twenty-ninth embodiment, and the description thereof will be omitted.

  In the twenty-ninth embodiment, the axial flow fan 36 is used as a fan. However, as in the thirty-third embodiment, a cross flow fan 38 can be used.

  In the twenty-ninth embodiment, the fan 36 is attached to the upper side of the rear end portion 31a of the IC card cooling tray 31 so as to exhaust air. As in the thirty-third embodiment, The IC card cooling tray 31 can be configured to discharge air below the rear end portion 31a. Reference numeral 38a denotes an air outlet.

[Thirty-first embodiment]
FIG. 34 is a perspective view of an IC card cooling tray according to a thirty-first embodiment of the present invention. This embodiment relates to the improvement of the twenty-ninth embodiment. Except for the improved part, this embodiment is the same as the twenty-ninth embodiment, and the description thereof will be omitted.

  The first opening 37a of the IC card cooling tray 31 is abolished, and an upper surface opening 39 penetrating the internal space 37 is formed on the surface of the IC card cooling tray 31 on which the IC card 1 is closely attached.

  The upper surface opening 39 is closed when the IC card 1 is mounted on the IC card cooling tray 31. In addition, a lower surface opening penetrating the internal space 37 is formed on the surface of the IC card cooling tray 31 opposite to the surface to which the IC card 1 of the tray body is in close contact.

  Since the surface on the IC card cooling tray 31 side of the IC card 1 is directly cooled by the air flow by the fan 36, the cooling efficiency of the IC card 1 can be increased.

[Thirty-second embodiment]
FIG. 35 is an enlarged cross-sectional view of the main part of the IC card cooling tray according to the thirty-second embodiment of the present invention. This embodiment relates to the improvement of the twenty-ninth embodiment or the thirtieth embodiment. Except for the improved part, this embodiment is the same as these embodiments, and the description thereof is omitted. To do.

  A plurality of concavo-convex portions 40 are formed on the surface of the IC card cooling tray 31 on the inner space 37 side of the wall surface to which the IC card 1 is closely attached. Since the surface area of this portion is larger than that of the twenty-ninth embodiment, the cooling efficiency of the IC card 1 that is in close contact with the opposite surface is further improved.

1 is an exploded perspective view of an IC card showing a basic configuration of an embodiment of the present invention. It is sectional drawing of the IC card which shows the basic composition of embodiment of this invention. 1 is a perspective view of an IC card showing a basic configuration of an embodiment of the present invention and a socket constituting a slot of an IC card mounted device into which the IC card is inserted. It is a side view which shows the IC card of the 1st Embodiment of this invention. It is a side view which shows the IC card of the 2nd Embodiment of this invention. It is sectional drawing which shows the IC card of the 3rd Embodiment of this invention. It is sectional drawing which shows the IC card of the 4th Embodiment of this invention. It is sectional drawing which shows the IC card of the 5th Embodiment of this invention. It is sectional drawing which shows the IC card of the 6th Embodiment of this invention. It is sectional drawing which shows the IC card of the 7th Embodiment of this invention. It is sectional drawing which shows the IC card of the 8th Embodiment of this invention. It is sectional drawing which shows the IC card of the 9th Embodiment of this invention. It is sectional drawing which shows the IC card of the 10th Embodiment of this invention. It is sectional drawing which shows the IC card of the 11th Embodiment of this invention. It is sectional drawing which shows the IC card of the 12th Embodiment of this invention. It is sectional drawing which shows the IC card of the 13th Embodiment of this invention. It is sectional drawing which shows the IC card of the 14th Embodiment of this invention. It is a partially broken side view which shows the IC card of 15th Embodiment of this invention. It is sectional drawing which shows the IC card of the 16th Embodiment of this invention. It is sectional drawing which shows the IC card of the 17th Embodiment of this invention. It is a perspective view which shows the IC card cooling tray of the 18th Embodiment of this invention. It is a perspective view which shows the IC card cooling tray of the 19th Embodiment of this invention. It is a side view which shows the IC card cooling tray of the 20th Embodiment of this invention. It is a side view which shows the IC card cooling tray of the 21st Embodiment of this invention. It is a side view which shows the IC card cooling tray of the 22nd Embodiment of this invention. It is a side view which shows the IC card cooling tray of the 23rd Embodiment of this invention. It is a side view which shows the IC card cooling tray of the 24th Embodiment of this invention. It is sectional drawing which shows the IC card cooling tray of the 25th Embodiment of this invention. It is sectional drawing which shows the IC card cooling tray of the 26th Embodiment of this invention. It is sectional drawing which shows the IC card cooling tray of the 27th Embodiment of this invention. It is a side view which shows the IC card cooling tray of the 28th Embodiment of this invention. It is sectional drawing which shows the IC card cooling tray of the 29th Embodiment of this invention. It is sectional drawing which shows the IC card cooling tray of 30th Embodiment of this invention. It is a perspective view which shows the IC card cooling tray of the 31st Embodiment of this invention. It is sectional drawing to which the principal part of the IC card cooling tray of the 32nd Embodiment of this invention was expanded.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 IC card 2 Card housing 3 Printed wiring board 4 Cover 5 Frame 6 Electronic component 7 1st connector 8 Socket 9 2nd connector 11 Opening 12 Convex member 14 Metal block 16 Heat pipe 17 Fan 19 Case of IC card mounting apparatus Wall surface 21 shaft 22 inner wall 23a, 23b inner space 24a, 24b opening 31 IC card cooling tray 32 holding member 34 uneven portion 35 heat pipe 36 fan

Claims (3)

An IC card that is detachably inserted into a slot of an IC card mounted device,
A card case formed in a substantially rectangular card shape with a space inside,
A metal block housed inside the card housing, with one surface in close contact with the inner surface of the card housing;
A wiring layer is formed on one surface of the metal plate via an insulating layer, and the other surface of the metal plate is in close contact with the other surface of the metal block and is accommodated inside the card casing. A metal wiring board;
A plurality of electronic components mounted on the wiring layer of the metal wiring board,
An IC card, wherein a part of the metal block protrudes outside the card housing. In the IC card according to claim 1,
An IC card in which a heat pipe is embedded in the metal block from a portion of the metal block inside the card housing to a portion protruding to the outside of the card housing. In the IC card according to claim 2,
An IC card in which a fan that generates an air flow in the vicinity of the protruding portion is attached to a portion of the metal block protruding outside the card housing.

Images