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JP2005217348A - Three-dimensional electronic circuit device, its intermediate substrate, and intermediate frame - Google Patents

Three-dimensional electronic circuit device, its intermediate substrate, and intermediate frame Download PDF

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Publication number
JP2005217348A
JP2005217348A JP2004025238A JP2004025238A JP2005217348A JP 2005217348 A JP2005217348 A JP 2005217348A JP 2004025238 A JP2004025238 A JP 2004025238A JP 2004025238 A JP2004025238 A JP 2004025238A JP 2005217348 A JP2005217348 A JP 2005217348A
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relay
board
circuit board
circuit device
electronic component
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JP4046088B2 (en
Inventor
Masahiro Ono
正浩 小野
Shigeru Kondo
繁 近藤
Kazuhiro Nishikawa
和宏 西川
Takahiko Yagi
能彦 八木
Kazuto Nishida
一人 西田
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Priority to JP2004025238A priority Critical patent/JP4046088B2/en
Priority to US10/985,325 priority patent/US7613010B2/en
Priority to CNB2004101007061A priority patent/CN100563405C/en
Publication of JP2005217348A publication Critical patent/JP2005217348A/en
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Publication of JP4046088B2 publication Critical patent/JP4046088B2/en
Priority to US12/562,444 priority patent/US20100008056A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
    • H01L2924/15156—Side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/1627—Disposition stacked type assemblies, e.g. stacked multi-cavities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that the improvement of planar mounting density by the miniaturization of the pitch of an electrode pad and wiring pattern and the like has limitation and an area occupied with a connecting member increases even in the case where mounting density is improved by laminating a circuit substrate in a three dimensional manner. <P>SOLUTION: The device comprises a first circuit substrate 20 and a second circuit substrate 30 on which other electronic parts 110 and 120 are mounted, and an intermediate substrate 10 which has a hollow portion 16 and a frame portion and in which an electronic part 50 is mounted. A drawer wiring 60 from the other electronic parts 110 and 120 is provided in the hollow portion 16, and a land portion 70 for connecting the first circuit substrate 20 with the second circuit substrate 30 is formed on the top and bottom surfaces 17 of the frame portion. The device has a structure in which the first circuit substrate 20 is connected with the second circuit substrate 30 via the intermediate substrate 10 in a three dimensional manner. Therefore, since the connection between the substrates and the mounting of the electronic part 50 is possible using the intermediate substrate 10, high density mounting is possible. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、電子部品を実装した回路モジュール等をベース回路基板上に中継する立体的電子回路装置に関する。   The present invention relates to a three-dimensional electronic circuit device that relays a circuit module or the like on which electronic components are mounted on a base circuit board.

近年、絶縁回路基板上に抵抗、コンデンサや半導体素子等を実装する電子回路装置においては、機器の軽薄短小化に伴い、実装の高密度化が強く求められている。   In recent years, in an electronic circuit device in which a resistor, a capacitor, a semiconductor element, and the like are mounted on an insulating circuit board, as the equipment becomes lighter and thinner, there is a strong demand for higher mounting density.

従来、この種の電子回路装置において、部品実装の高密度化は、配線ピッチの微細化や複数枚の電子回路基板を積み重ね構成により実現していた。   Conventionally, in this type of electronic circuit device, the high density of component mounting has been realized by reducing the wiring pitch and stacking a plurality of electronic circuit boards.

例えば、下記の特許文献１に記載された電子回路装置は、図１４に示すように、上下両面にビアホール３２０で導通する球状半田３８０、３９０で仮止めしたスペーサ３６０をベースプリント回路基板３１０およびモジュール回路基板３５０間に仮固定した状態で一括リフロー半田付けし、スペーサ３６０を介してベースプリント回路基板３１０に表面実装部品３３０や半導体ベアチップ３４０等が実装されたモジュール回路基板３５０を積層した構造である。   For example, as shown in FIG. 14, an electronic circuit device described in Patent Document 1 below includes a base printed circuit board 310 and a module in which spacers 360 temporarily fixed by spherical solders 380 and 390 that are conducted through via holes 320 on both upper and lower surfaces are provided. In this structure, reflow soldering is performed in a state of being temporarily fixed between the circuit boards 350, and the module circuit board 350 on which the surface mount component 330, the semiconductor bare chip 340, and the like are mounted on the base printed circuit board 310 via the spacer 360 is laminated. .

また、下記の特許文献２に記載の電子回路装置は、図１５に示すように、外周囲を導電性の物質でコーティングされた耐熱性弾性体４００を一方の電子回路基板４１０の接続用ランド４２０に半田付けし、他方の電子回路基板４３０の接続用ランド４４０にクリップやボルト４７０等で圧着するものである。それにより、表面実装部品４５０や半導体ベアチップ４６０等が実装された両電子回路基板４１０、４３０を上下に積層した構造である。   Further, as shown in FIG. 15, the electronic circuit device described in Patent Document 2 below includes a heat-resistant elastic body 400 whose outer periphery is coated with a conductive substance, and a connection land 420 for one electronic circuit board 410. And soldered to the connection land 440 of the other electronic circuit board 430 with a clip, a bolt 470, or the like. As a result, the electronic circuit boards 410 and 430 on which the surface mount component 450 and the semiconductor bare chip 460 are mounted are stacked vertically.

さらに、下記の特許文献３に記載された電子回路装置は、図１６に示すように、モジュール用回路基板５００にＩＣパッケージ５１０と受動部品５２０、５３０を実装したＩＣモジュールと、マザーボード５４０とを、接続用チップ５５０を１介して機械的および電気的に接続した構造である。   Further, as shown in FIG. 16, the electronic circuit device described in Patent Document 3 below includes an IC module in which an IC package 510 and passive components 520 and 530 are mounted on a module circuit board 500, and a motherboard 540. In this structure, the connecting chip 550 is mechanically and electrically connected through 1.

また、上記以外にも一般的な接続部品であるコネクタを用いて接合する方法等もある。
特開２００１−１７７２３５号公報 特開２００１−２６７７１５号公報 特開平６−２６０７３６号公報 In addition to the above, there is a method of joining using a connector which is a general connection component.
JP 2001-177235 A JP 2001-267715 A Japanese Patent Laid-Open No. 6-260736

モバイル機器の高機能化と軽薄短小化が進む中で、平面的な電子回路装置では、接続ピッチの微細化や隣接の部品間の間隔縮小等により実装密度の向上をはかるには限界がある。そのために３次元的にモジュール回路基板を積層して高密度化がはかられている。特許文献１のスペーサ３６０および特許文献３の接続用チップ５５０は、ガラスエポキシ回路基板の上下面に形成されたランドと対応するランド間を接続する導電性ビアまたはビアホール３２０を介して３次元的に接続するものである。しかし、スペーサ３６０または接続用チップ５５０は対向するモジュール回路基板間を電気的、機械的に接続するものであり、それらには半導体素子等の電子部品は実装されていない。また、特許文献２の積層されたモジュール回路基板間の固定にクリップやボルト等を用いた場合、固定や接続部材の占有する面積が増加するため実装面積が減少する。また、モジュール回路基板間の接続端子数の増加により、モジュール回路基板の接続に占める接続コネクタの面積が増大している。   As mobile devices become more advanced and lighter, thinner, and smaller, planar electronic circuit devices have limitations in improving mounting density by reducing the connection pitch and reducing the spacing between adjacent components. For this purpose, module circuit boards are three-dimensionally stacked to increase the density. The spacer 360 of Patent Document 1 and the connecting chip 550 of Patent Document 3 are three-dimensionally formed through conductive vias or via holes 320 that connect lands formed on the upper and lower surfaces of the glass epoxy circuit board and corresponding lands. To connect. However, the spacer 360 or the connecting chip 550 electrically and mechanically connects the opposing module circuit boards, and electronic components such as semiconductor elements are not mounted on them. In addition, when a clip, a bolt, or the like is used for fixing between the stacked module circuit boards described in Patent Document 2, the area occupied by the fixing and connecting member increases, so that the mounting area decreases. Moreover, the area of the connection connector which occupies for the connection of a module circuit board is increasing by the increase in the number of connection terminals between module circuit boards.

従って、モジュール回路基板間の接続面積の増大により実装密度を上げることができないという課題がある。   Therefore, there is a problem that the mounting density cannot be increased due to an increase in the connection area between the module circuit boards.

本発明は、上記従来の課題を解決し、高密度実装を実現できる立体的電子回路装置を提供することを目的とする。   An object of the present invention is to provide a three-dimensional electronic circuit device capable of solving the above-described conventional problems and realizing high-density mounting.

上記課題を解決するために、本発明の立体的電子回路装置は、第１の回路基板と、第２の回路基板と、窪み部を備え、窪み部に電子部品を搭載すると共に電子部品からの引き出し配線を設け、引き出し配線と第１の回路基板と第２の回路基板とを接続するためのランド部が上下面に形成された中継基板とからなり、第１の回路基板と第２の回路基板が中継基板を介して３次元的に接続される構成とするものである。この構成により、第１の回路基板と第２の回路基板を接続する中継基板の窪み部にも電子部品を実装できるため実装密度を向上させた立体的電子回路装置を実現できる。   In order to solve the above-described problems, a three-dimensional electronic circuit device of the present invention includes a first circuit board, a second circuit board, and a recess, and an electronic component is mounted on the recess and the electronic component is mounted on the recess. The first circuit board and the second circuit are formed of a relay board provided with a lead line and having land portions for connecting the lead line, the first circuit board, and the second circuit board formed on the upper and lower surfaces. The board is configured to be connected three-dimensionally via a relay board. With this configuration, an electronic component can be mounted in the recess of the relay board that connects the first circuit board and the second circuit board, so that a three-dimensional electronic circuit device with improved mounting density can be realized.

また、第１の回路基板と第２の回路基板の少なくとも一方に他の電子部品が実装される構成としてもよい。   Further, another electronic component may be mounted on at least one of the first circuit board and the second circuit board.

また、窪み部を中継基板の上下面や側面の少なくとも一部に設け電子部品を搭載する構成としてもよい。この構成により、さらなる高密度実装ができる。   Moreover, it is good also as a structure which mounts an electronic component by providing a hollow part in at least one part of the upper-lower surface and side surface of a relay board | substrate. With this configuration, further high-density mounting can be performed.

また、電子部品をモールド樹脂で封止する構成としてもよい。この構成により、信頼性を向上させることができる。   Moreover, it is good also as a structure which seals an electronic component with mold resin. With this configuration, reliability can be improved.

また、第１の回路基板と第２の回路基板に搭載された他の電子部品と、対向する窪み部に搭載された電子部品とが、互いに重ならない位置に搭載される構成としてもよい。この構成により、立体的電子回路装置の低背化を実現できる。   Moreover, it is good also as a structure mounted in the position where the other electronic components mounted in the 1st circuit board and the 2nd circuit board, and the electronic components mounted in the opposing hollow part do not mutually overlap. With this configuration, it is possible to reduce the height of the three-dimensional electronic circuit device.

また、中継基板を複数個連結する構成としてもよい。この構成により、さらに実装密度の向上がはかられる。   Further, a plurality of relay boards may be connected. With this configuration, the mounting density can be further improved.

また、第１の回路基板と第２の回路基板と、側面に電子部品を搭載すると共に電子部品からの引き出し配線を設け、引き出し配線と第１の回路基板と第２の回路基板とを接続するためのランド部が上下面に形成された中継枠とを有し、第１の回路基板と第２の回路基板が中継枠を介して３次元的に接続される構成としてもよい。   The first circuit board, the second circuit board, and electronic components are mounted on the side surfaces and lead wires are provided from the electronic components to connect the lead wires, the first circuit board, and the second circuit board. For example, the first circuit board and the second circuit board may be three-dimensionally connected via the relay frame.

また、中継基板や中継枠の側面に設けた基板接続配線や内部に設けられたビアホールと中継基板や中継枠の上下面の設けた基板接続ランドを介して第１の回路基板と第２の回路基板を接続する構成としてもよい。   Further, the first circuit board and the second circuit are provided via the board connection wiring provided on the side surface of the relay board or the relay frame, the via hole provided in the inside, and the board connection land provided on the upper and lower surfaces of the relay board or the relay frame. It is good also as a structure which connects a board | substrate.

また、中継基板や中継枠の側面にインダクタやアンテナを形成してもよい。これにより、小型で、かつ多機能化した立体的電子回路装置を実現できる。   Moreover, you may form an inductor and an antenna in the side surface of a relay board | substrate or a relay frame. Thereby, a small-sized and multifunctional three-dimensional electronic circuit device can be realized.

また、中継基板、または中継枠の側面にシールド電極、またはシールド層を設ける構成としてもよい。この構成により、電子部品の不要輻射や外来ノイズの影響を低減できる。   Further, a shield electrode or a shield layer may be provided on the side surface of the relay substrate or the relay frame. With this configuration, it is possible to reduce the influence of unnecessary radiation of electronic components and external noise.

また、第１の回路基板と第２の回路基板の少なくとも一方をフレキシブル回路基板としてもよい。この構成により、別の電子回路装置と配置上の制約もなく接続できる。   Further, at least one of the first circuit board and the second circuit board may be a flexible circuit board. With this configuration, it can be connected to another electronic circuit device without any restrictions on arrangement.

本発明の立体的電子回路装置は、第１の回路基板と第２の回路基板を中継する中継基板の窪み部や中継枠の側面に電子部品を搭載することにより、回路基板間の接続面積を確保しながら高密度実装を実現できる。また、第１の回路基板または第２の回路基板に実装した他の電子部品と中継基板や中継枠に搭載した電子部品とを最短距離で電気的に接続することができ、立体的電子回路装置の周波数特性が向上する。   The three-dimensional electronic circuit device of the present invention has a connection area between the circuit boards by mounting electronic components on the recesses of the relay board that relays the first circuit board and the second circuit board or on the side surfaces of the relay frame. High-density mounting can be realized while ensuring. In addition, it is possible to electrically connect other electronic components mounted on the first circuit board or the second circuit board and electronic components mounted on the relay board or the relay frame at the shortest distance, and a three-dimensional electronic circuit device Improves the frequency characteristics.

さらに、中継基板または中継枠の側面にシールド電極またはシールド層を設けることにより不要輻射ノイズを減らすことができる。   Furthermore, unnecessary radiation noise can be reduced by providing shield electrodes or shield layers on the side surfaces of the relay substrate or relay frame.

以下、本発明の実施の形態について、図面を参照しながら説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

（第１の実施の形態）
図１は、本発明の第１の実施の形態に係る立体的電子回路装置の構造図である。図１（ａ）は図１（ｂ）のＡ−Ａ’からみた断面図、図１（ｂ）は図１（ａ）中の中継基板１０の斜視図である。なお、図１（ａ）の中継基板１０は、内部を詳細に示すために誇張して示しているが、基本的に図１（ｂ）の中継基板１０と異なるものではない。また、以下の各実施の形態においても同様である。 (First embodiment)
FIG. 1 is a structural diagram of a three-dimensional electronic circuit device according to the first embodiment of the present invention. 1A is a cross-sectional view taken along line AA ′ in FIG. 1B, and FIG. 1B is a perspective view of the relay board 10 in FIG. 1A. The relay board 10 in FIG. 1A is exaggerated to show the inside in detail, but is basically not different from the relay board 10 in FIG. The same applies to the following embodiments.

この立体的電子回路装置は第１の回路基板２０と第２の回路基板３０が中継基板１０を介して、接続部材４０により電気的、機械的に接続される３次元接続構造である。そして、第１の回路基板２０は、他の回路基板と接続される接続配線基板の一部であってもよく、また第２の回路基板３０は、いわゆるマザーボードの一部であってもよい。つまり、中継基板１０は、第１の回路基板２０と第２の回路基板３０を接続するコネクタ機能を有するものである。ここで、接続部材４０は、半田ボール、マイクロコネクタ、ヒートシールコネクタ、異方導電性フィルムや半田バンプ等の各種バンプが用いられる。そして、接続部材４０を介して、中継基板１０と第１の回路基板２０や第２の回路基板３０とが圧接により接続される。また、図１（ｂ）に示すように、中継基板１０は窪み部１６を有する。窪み部１６には、電子部品５０が搭載されるとともに電子部品５０からの引き出し配線６０が設けられる。中継基板１０の上下面１７には引き出し配線６０と第１の回路基板２０または第２の回路基板３０とを接続するためのランド部７０が設けられる。また、ランド部７０を有する側面とは別の側面には、第１の回路基板２０と第２の回路基板３０を接続するための基板接続配線１４０を備え、基板接続配線１４０は、上下面１７の基板接続ランド８０に接続されている。   This three-dimensional electronic circuit device has a three-dimensional connection structure in which the first circuit board 20 and the second circuit board 30 are electrically and mechanically connected by the connection member 40 via the relay board 10. The first circuit board 20 may be a part of a connection wiring board connected to another circuit board, and the second circuit board 30 may be a part of a so-called mother board. That is, the relay board 10 has a connector function for connecting the first circuit board 20 and the second circuit board 30. Here, as the connection member 40, various kinds of bumps such as solder balls, microconnectors, heat seal connectors, anisotropic conductive films and solder bumps are used. Then, the relay board 10 and the first circuit board 20 and the second circuit board 30 are connected by pressure contact via the connection member 40. Further, as shown in FIG. 1B, the relay substrate 10 has a recess 16. In the recess 16, the electronic component 50 is mounted and a lead-out wiring 60 from the electronic component 50 is provided. On the upper and lower surfaces 17 of the relay substrate 10, land portions 70 for connecting the lead wiring 60 and the first circuit substrate 20 or the second circuit substrate 30 are provided. In addition, a board connection wiring 140 for connecting the first circuit board 20 and the second circuit board 30 is provided on a side surface different from the side surface having the land portion 70. Connected to the board connection land 80.

第１の回路基板２０と第２の回路基板３０は、電極９０、導電性ビア１００と絶縁基材９５から構成される、または、さらに他の電子部品１１０、１２０を実装して構成される両面基板または多層配線基板である。各電子部品５０、１１０、１２０の電極は半田または導電性接着剤等の接続部材１３０により、それぞれの対応する電極と電気的に接続されている。ここで、各電子部品５０、１１０、１２０は、ＩＣ、ＬＳＩ等の半導体素子や抵抗、コンデンサ、インダクタ等の一般の受動部品である。また、ベアチップ形状の電子部品をフリップチップ実装またはワイヤボンディング接続で実装することも可能である。   The first circuit board 20 and the second circuit board 30 are composed of electrodes 90, conductive vias 100 and an insulating base 95, or double-sided by mounting other electronic components 110 and 120. It is a board | substrate or a multilayer wiring board. The electrodes of the electronic components 50, 110, and 120 are electrically connected to the corresponding electrodes by connecting members 130 such as solder or conductive adhesive. Here, each of the electronic components 50, 110, and 120 is a general passive component such as a semiconductor element such as an IC or LSI, a resistor, a capacitor, or an inductor. It is also possible to mount a bare chip-shaped electronic component by flip chip mounting or wire bonding connection.

なお、第１の回路基板２０や第２の回路基板３０には、一般の樹脂基板や無機基板を用いることができる。特に、ガラスエポキシ基板やアラミド基材を用いた基板やビルドアップ基板、ガラスセラミック基板、アルミナ基板等が好ましい。中継基板１０は、一般の熱可塑性樹脂や熱硬化性樹脂等を用いる。熱可塑性樹脂の場合、射出成形や加工によって所望の形状に成型することが可能である。また、熱硬化性樹脂の場合、硬化物を切削加工することで所望の形状にすることができる。熱可塑性樹脂としてはＰＰＡ（ポリフタルアミド）、ＰＰＳ（エンプラ）、ＰＢＴ、エステル系樹脂、ＬＣＰ（液晶ポリマー）、熱硬化性樹脂としては通常のエポキシ樹脂等を用いることが好ましい。中継基板１０にヤング率の小さい樹脂材料を用いることにより、第１の回路基板２０と第２の回路基板３０の間の熱膨張係数の差によって生じる応力を緩和することができる。   Note that a general resin substrate or an inorganic substrate can be used as the first circuit board 20 or the second circuit board 30. In particular, a glass epoxy substrate, a substrate using an aramid base material, a build-up substrate, a glass ceramic substrate, an alumina substrate, or the like is preferable. The relay substrate 10 uses a general thermoplastic resin, a thermosetting resin, or the like. In the case of a thermoplastic resin, it can be molded into a desired shape by injection molding or processing. Moreover, in the case of a thermosetting resin, it can be made into a desired shape by cutting the cured product. As the thermoplastic resin, PPA (polyphthalamide), PPS (engineering plastic), PBT, ester resin, LCP (liquid crystal polymer), and as the thermosetting resin, it is preferable to use a normal epoxy resin or the like. By using a resin material having a low Young's modulus for the relay substrate 10, it is possible to relieve stress caused by a difference in thermal expansion coefficient between the first circuit board 20 and the second circuit board 30.

また、中継基板１０の立体配線は、導電性ペーストを用いた印刷法や基板面に貼り付けられた金属箔または基板面に析出させたメッキ層をレーザー加工する等の方法で作製される。立体配線材料としてはＡｇ、Ｓｎ、Ｚｎ、Ｐｄ、Ｂｉ、Ｎｉ、Ａｕ、Ｃｕ、Ｃ、Ｐｔ、Ｆｅ、Ｔｉ、Ｐｂの金属が用いられる。   The three-dimensional wiring of the relay substrate 10 is manufactured by a printing method using a conductive paste, a metal foil attached to the substrate surface, or a method of laser processing a plating layer deposited on the substrate surface. As the three-dimensional wiring material, metals such as Ag, Sn, Zn, Pd, Bi, Ni, Au, Cu, C, Pt, Fe, Ti, and Pb are used.

上記の３次元接続構造の立体的電子回路装置により、中継基板１０に電子部品５０を実装できるため回路基板間の接続面積を確保しながら高密度実装を実現できる。また、第１の回路基板２０または第２の回路基板３０に実装した他の電子部品１１０、１２０と中継基板１０に搭載した電子部品５０とを最短距離で接続することにより、立体的電子回路装置の周波数特性が向上し、機器の高速動作を実現できる。   With the above-described three-dimensional electronic circuit device having a three-dimensional connection structure, the electronic component 50 can be mounted on the relay substrate 10, so that high-density mounting can be realized while securing the connection area between the circuit substrates. In addition, by connecting the other electronic components 110 and 120 mounted on the first circuit board 20 or the second circuit board 30 and the electronic component 50 mounted on the relay board 10 at the shortest distance, a three-dimensional electronic circuit device is provided. The frequency characteristics of the device can be improved, and high-speed operation of the device can be realized.

なお、中継基板１０の上下面１７にビアホール（図示せず）を設け、基板接続ランド８０を介して第１の回路基板２０と第２の回路基板３０とを接続する構成としてもよい。さらに、中継基板１０の上下の窪み部１６の電子部品５０間を接続するために、窪み部１６にビアホールを設け、引き出し配線６０等と接続することもできる。さらに、第１の回路基板２０と第２の回路基板３０を接続する必要がなければ、基板接続配線１４０、ビアホールや基板接続ランド８０を形成しなくてもよい。   Note that via holes (not shown) may be provided in the upper and lower surfaces 17 of the relay substrate 10 so that the first circuit board 20 and the second circuit board 30 are connected via the substrate connection land 80. Furthermore, in order to connect between the electronic components 50 in the upper and lower depressions 16 of the relay substrate 10, via holes can be provided in the depressions 16 and connected to the lead-out wiring 60 and the like. Furthermore, if it is not necessary to connect the first circuit board 20 and the second circuit board 30, the board connection wiring 140, the via hole, and the board connection land 80 may not be formed.

なお、第１の回路基板２０には、他の電子部品１１０を実装せず、配線基板だけであってもよい。   Note that the first circuit board 20 may be only the wiring board without mounting the other electronic components 110.

また、接続強度や信頼性確保のために、各電子部品５０、１１０、１２０や窪み部１６をモールド樹脂でモールドする構成としてもよい。   Further, in order to secure connection strength and reliability, the electronic components 50, 110, 120 and the recess 16 may be molded with a mold resin.

さらに、同一の窪み部１６に複数の電子部品を搭載することもできる。   Furthermore, a plurality of electronic components can be mounted in the same recess 16.

図２は、本発明の第１の実施の形態の別の例に係る立体的電子回路装置の構造図である。図２（ａ）は図２（ｂ）のＡ−Ａ’からみた断面図、図２（ｂ）は図２（ａ）中の中継基板１０の斜視図である。図１と同じ構成要素については、同一の符号をつけて、説明は省略する。図２では、電子部品１２５を中継基板１０の側面にも搭載する構成である。この場合、側面のサイズより小さい電子部品であれば、どんな電子部品でも搭載することが可能であるが、特にチップコンデンサやチップ抵抗の実装に適している。   FIG. 2 is a structural diagram of a three-dimensional electronic circuit device according to another example of the first embodiment of the present invention. 2A is a cross-sectional view taken along line A-A ′ in FIG. 2B, and FIG. 2B is a perspective view of the relay substrate 10 in FIG. 2A. The same components as those in FIG. 1 are denoted by the same reference numerals and description thereof is omitted. In FIG. 2, the electronic component 125 is also mounted on the side surface of the relay substrate 10. In this case, any electronic component smaller than the size of the side surface can be mounted, but is particularly suitable for mounting a chip capacitor or a chip resistor.

また、図３は本発明の第１の実施の形態の別の例に係る立体的電子回路装置の構造図である。図３（ａ）は図３（ｂ）のＡ−Ａ’からみた断面図、図３（ｂ）は図３（ａ）中の中継基板１０の斜視図である。図１と同じ構成要素については同一の符号をつけて、説明は省略する。中継基板１０の同じ窪み部１６の中に薄板状またはチップ状の電子部品５０を積み重ねて搭載する構成である。   FIG. 3 is a structural diagram of a three-dimensional electronic circuit device according to another example of the first embodiment of the present invention. 3A is a cross-sectional view taken along line A-A ′ in FIG. 3B, and FIG. 3B is a perspective view of the relay board 10 in FIG. 3A. The same components as those in FIG. 1 are denoted by the same reference numerals and description thereof is omitted. In this configuration, the thin plate-like or chip-like electronic components 50 are stacked and mounted in the same recess 16 of the relay substrate 10.

図４は、本発明の第１の実施の形態の別の例に係る立体的電子回路装置の構造図である。図４（ａ）は図４（ｂ）のＡ−Ａ’からみた断面図、図４（ｂ）および図４（ｃ）は、図４（ａ）中の中継基板１１のモールド樹脂１５０で封止する前後の状態を示す斜視図である。中継基板１１の窪み部１６に貫通孔１６０を設け、電子部品５０を樹脂モールドした際、下側の窪み部１６をモールド樹脂１５０でほぼ完全に充填するものである。これにより、中継基板１１と第２の回路基板３０との付着強度の向上と共に、電子部品５０をモールド樹脂１５０で封止することにより、信頼性が向上する。   FIG. 4 is a structural diagram of a three-dimensional electronic circuit device according to another example of the first embodiment of the present invention. 4A is a cross-sectional view taken along line AA ′ of FIG. 4B, and FIGS. 4B and 4C are sealed with the mold resin 150 of the relay substrate 11 in FIG. 4A. It is a perspective view which shows the state before and behind to stop. When the through hole 160 is provided in the recess 16 of the relay substrate 11 and the electronic component 50 is resin-molded, the lower recess 16 is almost completely filled with the mold resin 150. As a result, the adhesion strength between the relay substrate 11 and the second circuit board 30 is improved, and the electronic component 50 is sealed with the mold resin 150, thereby improving the reliability.

また、図５は本発明の第１の実施の形態の別の例に係る立体的電子回路装置の構造図である。図５（ａ）は図５（ｂ）のＡ−Ａ’からみた断面図、図５（ｂ）は図５（ａ）中の中継基板１０の斜視図である。中継基板１０は、その側面に電磁的シールド効果を果たすシールド電極１７０を備えている点で、上記の他の実施の形態の立体的電子回路装置とは異なる。シールド電極１７０は、電子部品５０からの引き出し配線６０の内のグランド（接地）配線だけを側面まで延長して形成したり、第１の回路基板２０と第２の回路基板３０を接続する基板接続配線１４０のうち、グランド（接地）配線を束ねることにより形成される。この構成により、電子部品５０からの不要輻射の低減や外来ノイズによる回路の誤動作を防止できる。   FIG. 5 is a structural diagram of a three-dimensional electronic circuit device according to another example of the first embodiment of the present invention. 5A is a cross-sectional view taken along line A-A ′ of FIG. 5B, and FIG. 5B is a perspective view of the relay substrate 10 in FIG. 5A. The relay substrate 10 is different from the three-dimensional electronic circuit device of the other embodiments described above in that a shield electrode 170 having an electromagnetic shielding effect is provided on a side surface thereof. The shield electrode 170 is formed by extending only the ground (ground) wiring in the lead-out wiring 60 from the electronic component 50 to the side surface, or connecting the first circuit board 20 and the second circuit board 30. The wiring 140 is formed by bundling ground (grounding) wiring. With this configuration, it is possible to reduce unnecessary radiation from the electronic component 50 and prevent malfunction of the circuit due to external noise.

また、図６の中継基板の斜視図に示すように、引き出し配線６０のうち、グランド（接地）につながる配線を側面で面状にしてシールド電極１７２にすることもできる。このようにすることで、電子部品５０等からの不要輻射を抑制する効果が一層高められる。   In addition, as shown in the perspective view of the relay board in FIG. 6, the wiring connected to the ground (grounding) of the lead-out wiring 60 can be formed into a shield electrode 172 with a planar shape on the side surface. By doing in this way, the effect which suppresses unnecessary radiation from electronic parts 50 grade is further heightened.

（第２の実施の形態）
図７は、本発明の第２の実施の形態に係る立体的電子回路装置の構造図である。図７（ａ）は図７（ｂ）のＡ−Ａ’からみた断面図、図７（ｂ）は図７（ａ）中の中継基板１２の斜視図である。図１と同じ構成要素については同じ符号をつけて、説明は省略する。図７において、中継基板１２の左側側面の窪み部１８に電子部品５０が搭載され、側面に電子部品５０からの引き出し配線６０および第１の回路基板２０と第２の回路基板３０とを接続する基板接続配線１４０が形成されている。さらに、中継基板１２の上下面１７には、引き出し配線６０と接続するランド部７０および基板接続配線１４０と接続する基板接続ランド８０が設けられている。また、中継基板１２の右側側面の窪み部１９にも電子部品５５が搭載され、モールド樹脂１５０でモールドされている。そして、モールド樹脂１５０の表面を平坦化し、その表面にグランド（接地）電極に接続されるシールド電極１７４を形成している。 (Second Embodiment)
FIG. 7 is a structural diagram of a three-dimensional electronic circuit device according to the second embodiment of the present invention. 7A is a cross-sectional view taken along line AA ′ of FIG. 7B, and FIG. 7B is a perspective view of the relay board 12 in FIG. 7A. The same components as those in FIG. 1 are denoted by the same reference numerals and description thereof is omitted. In FIG. 7, the electronic component 50 is mounted in the recess 18 on the left side surface of the relay substrate 12, and the lead-out wiring 60 from the electronic component 50 and the first circuit board 20 and the second circuit board 30 are connected to the side surface. Substrate connection wiring 140 is formed. Further, on the upper and lower surfaces 17 of the relay substrate 12, land portions 70 connected to the lead-out wiring 60 and substrate connection lands 80 connected to the substrate connection wiring 140 are provided. In addition, an electronic component 55 is mounted on the recess 19 on the right side surface of the relay substrate 12 and is molded with a mold resin 150. Then, the surface of the mold resin 150 is flattened, and a shield electrode 174 connected to the ground (ground) electrode is formed on the surface.

この構成により、ノイズ源や外来ノイズに弱い電子部品５５等を分離してシールドすることができるため、信頼性が向上する。また、この構成の中継基板１２により、第１の回路基板２０と第２の回路基板３０を接続すると共に、電子部品５０、５５を側面に実装することができる。   With this configuration, it is possible to separate and shield the electronic component 55 and the like that are vulnerable to noise sources and external noise, so that reliability is improved. In addition, the first circuit board 20 and the second circuit board 30 can be connected and the electronic components 50 and 55 can be mounted on the side surfaces by the relay board 12 having this configuration.

なお、図７では、第１の回路基板２０、第２の回路基板３０は共に電極９０、導電性ビア１００と絶縁基材９５を備えた多層回路基板としているが、両面回路基板でもよい。   In FIG. 7, the first circuit board 20 and the second circuit board 30 are both multilayer circuit boards including the electrodes 90, the conductive vias 100, and the insulating base material 95, but they may be double-sided circuit boards.

また、図８（ａ）の中継基板の斜視図に示すように、中継基板１２の対向する側面の基板接続配線１４０のグランド電極を相互に接続する側面接続配線８５を上下面１７に形成することも可能である。これによって、複数のグランド（接地）電極につながる配線間を接続してグランドを強化して電気的なノイズをシールドすることができる。さらに図８（ｂ）の斜視図に示すように、中継基板１２の上面または下面にベタ（面状）のシールド電極１８０を形成することで、グランド（接地）電極を強化したり、例えば電子部品５０等からの電気的なノイズをシールドすることも可能である。なお、第１の回路基板２０、第２の回路基板３０、および中継基板１２の構造、材料や形成法および接続部材４０は第１の実施の形態と同じである。   Further, as shown in the perspective view of the relay substrate in FIG. 8A, the side surface connection wiring 85 that connects the ground electrodes of the substrate connection wirings 140 on the opposite side surface of the relay substrate 12 is formed on the upper and lower surfaces 17. Is also possible. As a result, wirings connected to a plurality of ground (ground) electrodes can be connected to strengthen the ground and shield electrical noise. Further, as shown in the perspective view of FIG. 8B, a solid (planar) shield electrode 180 is formed on the upper surface or the lower surface of the relay substrate 12, thereby strengthening the ground (ground) electrode, for example, an electronic component. It is also possible to shield electrical noise from 50 etc. The structures, materials, forming methods, and connection members 40 of the first circuit board 20, the second circuit board 30, and the relay board 12 are the same as those in the first embodiment.

（第３の実施の形態）
図９は、本発明の第３の実施の形態に係る立体的電子回路装置の構造図である。図９（ａ）は図９（ｂ）のＡ−Ａ’からみた断面図、図９（ｂ）は図９（ａ）中の中継基板１３の斜視図である。図１と同じ構成要素については同じ符号をつけて、説明は省略する。この立体的電子回路装置は第１の回路基板２０と第２の回路基板３０が中継基板１３を介して、接続部材４０により電気的、機械的に接続された３次元接続構造になっている。中継基板１３は、上下面１７および側面にも窪み部１６を有し、それらの窪み部１６に電子部品５０、５７を搭載する構成である。また、電子部品５０からの引き出し配線６０と接続されるランド部７０ａ、側面に実装された電子部品５７からの引き出し配線６５と接続されるランド部７０ｂ、第１の回路基板２０と第２の回路基板３０とを接続するための基板接続ランド８０が中継基板１３の上下面１７に形成されている。 (Third embodiment)
FIG. 9 is a structural diagram of a three-dimensional electronic circuit device according to the third embodiment of the present invention. 9A is a cross-sectional view taken along line AA ′ of FIG. 9B, and FIG. 9B is a perspective view of the relay board 13 in FIG. 9A. The same components as those in FIG. 1 are denoted by the same reference numerals and description thereof is omitted. This three-dimensional electronic circuit device has a three-dimensional connection structure in which a first circuit board 20 and a second circuit board 30 are electrically and mechanically connected by a connecting member 40 via a relay board 13. The relay substrate 13 has the depressions 16 on the upper and lower surfaces 17 and the side surfaces, and the electronic components 50 and 57 are mounted on the depressions 16. Further, a land portion 70a connected to the lead-out wiring 60 from the electronic component 50, a land portion 70b connected to the lead-out wiring 65 from the electronic component 57 mounted on the side surface, the first circuit board 20 and the second circuit. Substrate connection lands 80 for connecting the substrate 30 are formed on the upper and lower surfaces 17 of the relay substrate 13.

上記の３次元接続構造より、他の電子部品１２０を実装した第１の回路基板２０、第２の回路基板３０と共に、中継基板１３の上下の窪み部１６および側面の窪み部１６にも電子部品５０、５７を実装することにより、さらなる高密度実装を同時に達成できる。   In addition to the first circuit board 20 and the second circuit board 30 on which other electronic components 120 are mounted, the upper and lower dents 16 and the side dents 16 on the relay board 13 have the electronic components. By mounting 50 and 57, higher density mounting can be achieved simultaneously.

なお、第１の回路基板２０、第２の回路基板３０および中継基板１３の構造、材料や形成法および接続部材４０は第１の実施の形態と同じである。   The structures, materials, forming methods, and connection members 40 of the first circuit board 20, the second circuit board 30, and the relay board 13 are the same as those in the first embodiment.

（第４の実施の形態）
図１０は、本発明の第４の実施の形態に係る立体電子回路装置の構造図である。図１０（ａ）は図１０（ｂ）のＡ−Ａ’からみた断面図である。本実施の形態に係る中継基板は、第１の実施の形態の中継基板１０を上下に２段に積み重ねて連結した構造である。各窪み部１６には、電子部品５０が搭載される。また、中継基板１０の上下面１７には、電子部品５０からの引き出し配線６０と第１の回路基板２０と第２の回路基板３０とを接続するためのランド部７０および中継基板１０間を接続するための接続端子１９０が設けられている。図１０（ｂ）は、中継基板１０の斜視図であって、電子部品５０の引き出し配線６０と上下面１７に第１の回路基板２０または第２の回路基板３０と接続するためのランド部７０および基板接続配線１４０を介して接続するための基板接続ランド８０が設けられている。そして、接続端子１９０は、図１０（ａ）のように、端面で互いに凹凸形状に成型されていて、これらを嵌め合わせることにより連結されている。なお、中継基板１０間の連結方法は、これに限らず、半田で接合してもよいし、電極どうしの圧接接合あるいは接触、導電性樹脂で接合してもよい。 (Fourth embodiment)
FIG. 10 is a structural diagram of a three-dimensional electronic circuit device according to the fourth embodiment of the present invention. FIG. 10A is a cross-sectional view taken along line AA ′ of FIG. The relay board according to the present embodiment has a structure in which the relay boards 10 of the first embodiment are stacked and connected in two stages in the vertical direction. An electronic component 50 is mounted in each recess 16. In addition, the upper and lower surfaces 17 of the relay board 10 are connected between the lead wiring 60 from the electronic component 50, the land portion 70 for connecting the first circuit board 20 and the second circuit board 30, and the relay board 10. A connection terminal 190 is provided. FIG. 10B is a perspective view of the relay substrate 10, and a land portion 70 for connecting the lead wiring 60 and the upper and lower surfaces 17 of the electronic component 50 to the first circuit board 20 or the second circuit board 30. A substrate connection land 80 for connection via the substrate connection wiring 140 is also provided. And the connection terminal 190 is mutually shape | molded by the uneven | corrugated shape by the end surface like Fig.10 (a), It is connected by fitting these. In addition, the connection method between the relay substrates 10 is not limited to this, and may be joined by solder, or may be joined by pressure welding or contact between electrodes or conductive resin.

本実施の形態では、中継基板１０が２段に積み重ねられているが、必要に応じてさらに多くの中継基板１０を積み重ねることもできる。さらに、中継基板を平面的に連結する構成や離散的に配置する構成としてもよい。これにより、第１の回路基板と第２の回路基板を安定して接続できる。   In this embodiment, the relay boards 10 are stacked in two stages, but more relay boards 10 can be stacked as necessary. Furthermore, it is good also as a structure which connects a relay board | substrate planarly, or arrange | positions discretely. Thereby, the first circuit board and the second circuit board can be stably connected.

上記構成により、複数の中継基板１０を介して、第１の回路基板２０と第２の回路基板３０が接続される。また、窪み部１６に電子部品５０を多層に実装できるので、さらに高密度実装を実現できる。ここでは、第１の回路基板２０、第２の回路基板３０とも電極９０、導電性ビア１００と絶縁基材９５を備えた多層回路基板としているが、両面回路基板でもよい。   With the above configuration, the first circuit board 20 and the second circuit board 30 are connected via the plurality of relay boards 10. In addition, since the electronic components 50 can be mounted in the recess 16 in multiple layers, higher density mounting can be realized. Here, both the first circuit board 20 and the second circuit board 30 are multi-layer circuit boards including the electrodes 90, the conductive vias 100, and the insulating base material 95, but they may be double-sided circuit boards.

なお、第１の回路基板２０、第２の回路基板３０、および中継基板１０の構造、材料や形成法および接続部材４０は第１の実施の形態と同じである。   The structures, materials, forming methods, and connection members 40 of the first circuit board 20, the second circuit board 30, and the relay board 10 are the same as those in the first embodiment.

（第５の実施の形態）
図１１は、本発明の第５の実施の形態に係る立体的電子回路装置の断面図であり、第１の回路基板２０と第２の回路基板３０が中継基板１０を介して、接続部材４０により電気的、機械的に接続されている。図１と同じ構成要素については同じ符号をつけて、説明は省略する。中継基板１０の上下の窪み部１６には電子部品５０が接続部材１３０を用いて実装され、上下面１７の端部には電子部品５０からの引き出し配線６０に接続されるランド部７０および第１の回路基板２０と第２の回路基板３０とを接続する基板接続ランド（図示せず）が形成されている。中継基板１０の少なくとも一方の窪み部１６に実装された電子部品５０と第２の回路基板３０の上面または第１の回路基板３０の下面に実装された他の電子部品１１０、１２０とは、厚み方向または高さ方向からの投影で互いに重ならない位置に実装されている。 (Fifth embodiment)
FIG. 11 is a cross-sectional view of the three-dimensional electronic circuit device according to the fifth embodiment of the present invention, in which the first circuit board 20 and the second circuit board 30 are connected to the connecting member 40 via the relay board 10. Are electrically and mechanically connected. The same components as those in FIG. 1 are denoted by the same reference numerals and description thereof is omitted. An electronic component 50 is mounted on the upper and lower recess portions 16 of the relay substrate 10 using a connection member 130, and a land portion 70 and a first portion connected to the lead-out wiring 60 from the electronic component 50 are provided on the end portions of the upper and lower surfaces 17. A board connection land (not shown) for connecting the circuit board 20 and the second circuit board 30 is formed. The electronic component 50 mounted in at least one recess 16 of the relay substrate 10 and the other electronic components 110 and 120 mounted on the upper surface of the second circuit board 30 or the lower surface of the first circuit board 30 have a thickness. It is mounted at a position that does not overlap each other when projected from the direction or height.

この構成により、立体的電子回路装置の高さ、または厚さを削減することができる。また、第１の回路基板２０と第２の回路基板３０とを接続し、電子部品５０も立体的に実装した中継基板１０により、立体的回路装置の低背化と高密度実装を同時に実現できる。   With this configuration, the height or thickness of the three-dimensional electronic circuit device can be reduced. In addition, the relay board 10 in which the first circuit board 20 and the second circuit board 30 are connected and the electronic component 50 is three-dimensionally mounted can simultaneously realize low-profile and high-density mounting of the three-dimensional circuit device. .

本実施の形態では、第１の回路基板２０、第２の回路基板３０とも電極９０、導電性ビア１００と絶縁基材９５とを備えた多層回路基板としているが、両面回路基板でもよい。   In the present embodiment, both the first circuit board 20 and the second circuit board 30 are multi-layer circuit boards including the electrodes 90, the conductive vias 100, and the insulating base material 95, but they may be double-sided circuit boards.

なお、第１の回路基板２０、第２の回路基板３０、および中継基板１０の構造、材料や形成法および接続部材４０は第１の実施の形態と同じである。   The structures, materials, forming methods, and connection members 40 of the first circuit board 20, the second circuit board 30, and the relay board 10 are the same as those in the first embodiment.

（第６の実施の形態）
図１２は、本発明の第６の実施の形態に係る立体的電子回路装置の断面図である。図１と同じ構成要素については同じ符号をつけて、説明は省略する。この立体的電子回路装置は、第１の回路基板２０と第２の回路基板３０とが中継枠２００を介して、接続部材４０により電気的、機械的に接続された構造である。 (Sixth embodiment)
FIG. 12 is a sectional view of a three-dimensional electronic circuit device according to the sixth embodiment of the present invention. The same components as those in FIG. 1 are denoted by the same reference numerals and description thereof is omitted. This three-dimensional electronic circuit device has a structure in which a first circuit board 20 and a second circuit board 30 are electrically and mechanically connected by a connecting member 40 via a relay frame 200.

中継枠２００には第１の回路基板２０および第２の回路基板３０と接続するためのビアホール２１０が設けられている。中継枠２００の内側側面にはチップ状の電子部品５０が実装され、外側側面にはノイズ防止のための導電性のシールド層２２０が形成されている。第１の回路基板２０の電極と第２の回路基板３０の電極は接続部材４０、ビアホール２１０、接続部材４０を介して電気的、機械的に接続される。   The relay frame 200 is provided with a via hole 210 for connecting to the first circuit board 20 and the second circuit board 30. A chip-shaped electronic component 50 is mounted on the inner side surface of the relay frame 200, and a conductive shield layer 220 for preventing noise is formed on the outer side surface. The electrode of the first circuit board 20 and the electrode of the second circuit board 30 are electrically and mechanically connected via the connection member 40, the via hole 210, and the connection member 40.

また、中継枠２００の内側側面に実装された電子部品５０の電極は、引き出し配線（図示せず）と接続するランド部（図示せず）で接続部材４０を介して第１の回路基板２０または第２の回路基板３０の電極と接続される。   Further, the electrodes of the electronic component 50 mounted on the inner side surface of the relay frame 200 are connected to the first circuit board 20 via the connection member 40 at the land portion (not shown) connected to the lead-out wiring (not shown). It is connected to the electrode of the second circuit board 30.

なお、中継枠２００の高さは、第１の回路基板２０の下面と第２の回路基板３０の上面に実装される他の電子部品１１０、１２０の高さと接続部材１３０の高さの和よりも高くしている。この構成により、中継枠２００は単なるスペーサとしての機能と共に、内側側面に電子部品５０を実装することによって実装密度を上げることができる。また、第１の回路基板２０または第２の回路基板３０に搭載した他の電子部品１１０、１２０と中継枠２００に搭載した電子部品５０とを最短距離で接続することにより、立体的電子回路装置の周波数特性が向上し、機器の高速化を実現できる。   The height of the relay frame 200 is based on the sum of the heights of the other electronic components 110 and 120 mounted on the lower surface of the first circuit board 20 and the upper surface of the second circuit board 30 and the height of the connection member 130. Is also high. With this configuration, the relay frame 200 can increase the mounting density by mounting the electronic component 50 on the inner side surface as well as functioning as a simple spacer. In addition, by connecting the other electronic components 110 and 120 mounted on the first circuit board 20 or the second circuit board 30 and the electronic component 50 mounted on the relay frame 200 at the shortest distance, a three-dimensional electronic circuit device is provided. The frequency characteristics of the device can be improved, and the speed of the equipment can be increased.

図１３は、第６の実施の形態に係る立体的電子回路装置の中継枠２００の外側側面に巻き線等により、インダクタやループアンテナを形成した立体的電子回路装置の断面図である。一般的に、インダクタやループアンテナは大きなスペースが必要である。そこで、中継枠２００を周回形状を有するインダクタやループアンテナ２３０のボビンとして用いることにより、立体的電子回路装置のサイズを小型化するものである。   FIG. 13 is a cross-sectional view of a three-dimensional electronic circuit device in which inductors and loop antennas are formed on the outer side surface of the relay frame 200 of the three-dimensional electronic circuit device according to the sixth embodiment by windings or the like. In general, inductors and loop antennas require a large space. Therefore, the size of the three-dimensional electronic circuit device is reduced by using the relay frame 200 as an inductor having a circular shape or a bobbin of the loop antenna 230.

なお、巻き線の代わりに、中継枠２００の側面に金属膜を形成した後、これをコイル状にパターン化することによって、インダクタやループアンテナ２３０を形成することもできる。   Instead of winding, an inductor or a loop antenna 230 can be formed by forming a metal film on the side surface of the relay frame 200 and then patterning it in a coil shape.

上記構成により、この立体的電子回路装置は、無線で情報の授受をするＩＣチップ、つまりＩＣタグ等の実装に用いることができる。   With the above configuration, the three-dimensional electronic circuit device can be used for mounting an IC chip that wirelessly exchanges information, that is, an IC tag or the like.

また、中継枠２００は射出成形可能な樹脂材料を用いることにより、枠状で、かつ外側側面に巻き線用の溝を形成することも容易である。   Further, the relay frame 200 is frame-shaped by using a resin material that can be injection-molded, and it is easy to form a winding groove on the outer side surface.

また、第１の回路基板２０がセラミック基板で、第２の回路基板３０がガラスエポキシ基板である場合、中継枠２００にヤング率の小さい樹脂材料を用いることにより、セラミック基板とガラスエポキシ基板間の熱膨張係数の差によって生じる応力を緩和することができる。   In addition, when the first circuit board 20 is a ceramic board and the second circuit board 30 is a glass epoxy board, a resin material having a low Young's modulus is used for the relay frame 200, so that the gap between the ceramic board and the glass epoxy board is used. The stress caused by the difference in thermal expansion coefficient can be relaxed.

なお、本発明の各実施の形態では、中継基板や中継枠の上下面に第１の回路基板と第２の回路基板を配置する構成で述べたが、これに限られず、第１の回路基板と第２の回路基板が略Ｌ字形状等に中継基板や中継枠で中継する構成としてもよい。   In each embodiment of the present invention, the first circuit board and the second circuit board are arranged on the upper and lower surfaces of the relay board and the relay frame. However, the present invention is not limited to this, and the first circuit board is not limited thereto. The second circuit board may be relayed in a substantially L shape or the like with a relay board or a relay frame.

また、本発明で述べた各実施の形態は、相互に適用できることはいうまでもなく、また、これらの実施の形態に限定されるものでもない。   Further, it goes without saying that the embodiments described in the present invention can be applied to each other, and are not limited to these embodiments.

本発明の立体的電子回路装置は、第１の回路基板と第２の回路基板を中継基板または中継枠を介して接続する３次元接続構造であり、回路基板間を接合すると共に高密度実装を実現できる。そのため、高機能、多機能でコンパクト化が要望される携帯電話機等をはじめとする各種のモバイル機器に広く利用できる。   The three-dimensional electronic circuit device of the present invention has a three-dimensional connection structure in which a first circuit board and a second circuit board are connected via a relay board or a relay frame. realizable. Therefore, it can be widely used for various mobile devices such as mobile phones and the like that are required to be compact with high functionality and multiple functions.

（ａ）本発明の第１の実施の形態に係る立体的電子回路装置の断面図（ｂ）同立体的電子回路装置の中継基板の斜視図(A) Sectional view of the three-dimensional electronic circuit device according to the first embodiment of the present invention (b) Perspective view of the relay board of the three-dimensional electronic circuit device （ａ）本発明の第１の実施の形態の別の例に係る立体的電子回路装置の断面図（ｂ）同立体的電子回路装置の中継基板の斜視図(A) Sectional view of a three-dimensional electronic circuit device according to another example of the first embodiment of the present invention (b) Perspective view of a relay board of the three-dimensional electronic circuit device （ａ）本発明の第１の実施の形態の別の例に係る立体的電子回路装置の断面図（ｂ）同立体的電子回路装置の中継基板の斜視図(A) Sectional view of a three-dimensional electronic circuit device according to another example of the first embodiment of the present invention (b) Perspective view of a relay board of the three-dimensional electronic circuit device （ａ）本発明の第１の実施の形態の別の例に係る立体的電子回路装置の断面図（ｂ）同立体的電子回路装置の中継基板のモールド前の斜視図（ｃ）同立体的電子回路装置の中継基板のモールド後の斜視図(A) Sectional view of a three-dimensional electronic circuit device according to another example of the first embodiment of the present invention (b) Perspective view before molding of a relay board of the three-dimensional electronic circuit device (c) Three-dimensional Perspective view after molding of relay board of electronic circuit device （ａ）本発明の第１の実施の形態の別の例に係る立体的電子回路装置の断面図（ｂ）同立体的電子回路装置の中継基板の斜視図(A) Sectional view of a three-dimensional electronic circuit device according to another example of the first embodiment of the present invention (b) Perspective view of a relay board of the three-dimensional electronic circuit device （ａ）本発明の第１の実施の形態の別の例に係るシールド電極を備えた中継基板の斜視図（ｂ）同別のシールド電極を備えた中継基板の斜視図(A) Perspective view of a relay board provided with a shield electrode according to another example of the first embodiment of the present invention (b) Perspective view of a relay board provided with the same shield electrode （ａ）本発明の第２の実施の形態に係る立体的電子回路装置の断面図（ｂ）同立体的電子回路装置の中継基板の斜視図(A) Sectional drawing of the three-dimensional electronic circuit device which concerns on the 2nd Embodiment of this invention (b) The perspective view of the relay board | substrate of the three-dimensional electronic circuit device （ａ）本発明の第２の実施の形態の別の例に係るシールド電極を備えた中継基板の斜視図（ｂ）同別のシールド電極を備えた中継基板の斜視図(A) Perspective view of a relay board provided with a shield electrode according to another example of the second embodiment of the present invention (b) Perspective view of a relay board provided with the same shield electrode （ａ）本発明の第３の実施の形態に係る立体的電子回路装置の断面図（ｂ）同立体的電子回路装置の中継基板の斜視図(A) Cross-sectional view of a three-dimensional electronic circuit device according to the third embodiment of the present invention (b) Perspective view of a relay board of the three-dimensional electronic circuit device （ａ）本発明の第４の実施の形態に係る立体的電子回路装置の断面図（ｂ）同立体的電子回路装置の中継基板の斜視図(A) Sectional drawing of the three-dimensional electronic circuit device which concerns on the 4th Embodiment of this invention (b) The perspective view of the relay board | substrate of the three-dimensional electronic circuit device 本発明の第５の実施の形態に係る立体的電子回路装置の断面図Sectional drawing of the three-dimensional electronic circuit device based on the 5th Embodiment of this invention 本発明の第６の実施の形態に係る立体的電子回路装置の断面図Sectional drawing of the three-dimensional electronic circuit device based on the 6th Embodiment of this invention 本発明の第６の実施の形態の別の例に係る立体的電子回路装置の断面図Sectional drawing of the three-dimensional electronic circuit device which concerns on another example of the 6th Embodiment of this invention. 従来（特許文献１）の電子回路装置の断面図Sectional view of a conventional electronic circuit device (Patent Document 1) 従来（特許文献２）の電子回路装置の断面図Sectional view of a conventional electronic circuit device (Patent Document 2) 従来（特許文献３）の電子回路装置の断面図Sectional view of a conventional electronic circuit device (Patent Document 3)

符号の説明Explanation of symbols

１０，１１，１２，１３ 中継基板
１６，１８，１９ 窪み部
１７ 上下面
２０ 第１の回路基板
３０ 第２の回路基板
４０，１３０ 接続部材
５０，５５，５７，１２５ 電子部品
６０，６５ 引き出し配線
７０，７０ａ，７０ｂ ランド部
８０ 基板接続ランド
８５ 側面接続配線
９０ （第１の回路基板または第２の回路基板の）電極
９５ 絶縁基材
１００ （第１の回路基板または第２の回路基板の）導電性ビア
１１０，１２０ 他の電子部品
１４０ 基板接続配線
１５０ モールド樹脂
１６０ 貫通孔
１７０，１７２，１７４，１８０ シールド電極
１９０ 接続端子
２００ 中継枠
２１０ ビアホール
２２０ シールド層
２３０ インダクタやループアンテナ 10, 11, 12, 13 Relay board 16, 18, 19 Recessed portion 17 Upper and lower surfaces 20 First circuit board 30 Second circuit board 40, 130 Connection member 50, 55, 57, 125 Electronic component 60, 65 Lead-out wiring 70, 70a, 70b Land portion 80 Substrate connection land 85 Side connection wiring 90 Electrode (of first circuit board or second circuit board) 95 Insulating base material 100 (of first circuit board or second circuit board) Conductive vias 110 and 120 Other electronic components 140 Substrate connection wiring 150 Mold resin 160 Through hole 170, 172, 174, 180 Shield electrode 190 Connection terminal 200 Relay frame 210 Via hole 220 Shield layer 230 Inductor and loop antenna

Claims (34)

第１の回路基板と、
第２の回路基板と、
窪み部を有し、前記窪み部に電子部品が搭載されると共に、前記電子部品からの引き出し配線が設けられ、上下面に前記引き出し配線と前記第１の回路基板と前記第２の回路基板とを接続するためのランド部が形成された中継基板とを有し、
前記第１の回路基板と前記第２の回路基板が前記中継基板を介して３次元的に接続されていることを特徴とする立体的電子回路装置。 A first circuit board;
A second circuit board;
An electronic component is mounted on the recess, and a lead-out wiring from the electronic component is provided, and the lead-out wiring, the first circuit board, and the second circuit board are provided on upper and lower surfaces. And a relay board formed with a land portion for connecting the
The three-dimensional electronic circuit device, wherein the first circuit board and the second circuit board are three-dimensionally connected via the relay board. 前記第１の回路基板と前記第２の回路基板の少なくとも一方に他の電子部品が実装されていることを特徴とする請求項１に記載の立体的電子回路装置。 The three-dimensional electronic circuit device according to claim 1, wherein another electronic component is mounted on at least one of the first circuit board and the second circuit board. 前記窪み部が前記中継基板の上下面の少なくとも一方の面に設けられ、前記窪み部に前記電子部品が実装されていることを特徴とする請求項１または請求項２に記載の立体的電子回路装置。 The three-dimensional electronic circuit according to claim 1, wherein the hollow portion is provided on at least one surface of the upper and lower surfaces of the relay substrate, and the electronic component is mounted on the hollow portion. apparatus. 前記窪み部が前記中継基板の側面に設けられ、前記窪み部に前記電子部品が実装されていることを特徴とする請求項１または請求項２に記載の立体的電子回路装置。 The three-dimensional electronic circuit device according to claim 1, wherein the hollow portion is provided on a side surface of the relay substrate, and the electronic component is mounted on the hollow portion. 前記窪み部が前記中継基板の側面の少なくとも一部および上下面の少なくとも一部に設けられ、前記電子部品が前記窪み部に搭載されていることを特徴とする請求項１または請求項２に記載の立体的電子回路装置。 The said hollow part is provided in at least one part of the side surface of the said relay substrate, and at least one part of the upper and lower surfaces, The said electronic component is mounted in the said hollow part, The Claim 1 or Claim 2 characterized by the above-mentioned. Three-dimensional electronic circuit device. 前記窪み部に搭載されている前記電子部品が複数であることを特徴とする請求項１から請求項４までのいずれかに記載の立体的電子回路装置。 The three-dimensional electronic circuit device according to any one of claims 1 to 4, wherein a plurality of the electronic components are mounted in the hollow portion. 前記中継基板の側面に電気的ノイズを遮蔽するためのシールド電極が形成されていることを特徴とする請求項１から請求項６までのいずれかに記載の立体的電子回路装置。 The three-dimensional electronic circuit device according to any one of claims 1 to 6, wherein a shield electrode for shielding electrical noise is formed on a side surface of the relay substrate. 前記窪み部に搭載された前記電子部品がモールド樹脂により樹脂封止されていることを特徴とする請求項１から請求項７までのいずれかに記載の立体的電子回路装置。 The three-dimensional electronic circuit device according to any one of claims 1 to 7, wherein the electronic component mounted in the hollow portion is resin-sealed with a mold resin. 前記第１の回路基板あるいは前記第２の回路基板に実装された前記他の電子部品と、対向する前記窪み部の前記電子部品とが、互いに重ならない位置に搭載されていることを特徴とする請求項２から請求項６までのいずれかに記載の立体的電子回路装置。 The other electronic component mounted on the first circuit board or the second circuit board and the electronic component in the recess portion facing each other are mounted at positions where they do not overlap each other. The three-dimensional electronic circuit device according to any one of claims 2 to 6. 前記中継基板の側面にインダクタまたはループアンテナが形成されていることを特徴とする請求項１から請求項６までのいずれかに記載の立体的電子回路装置。 The three-dimensional electronic circuit device according to any one of claims 1 to 6, wherein an inductor or a loop antenna is formed on a side surface of the relay substrate. 前記中継基板が複数個連結されて、前記第１の回路基板および前記第２の回路基板とが３次元的に接続されていることを特徴とする請求項１から請求項６までのいずれかに記載の立体的電子回路装置。 7. The relay board according to claim 1, wherein a plurality of the relay boards are connected, and the first circuit board and the second circuit board are three-dimensionally connected. The three-dimensional electronic circuit device described. 前記中継基板の側面に基板接続配線が設けられ、前記中継基板の上下面に前記基板接続配線と接続される基板接続ランドが設けられて、前記第１の回路基板と前記第２の回路基板とが接続されていることを特徴とする請求項１から請求項１１までのいずれかに記載の立体的電子回路装置。 A board connection wiring is provided on a side surface of the relay board, and board connection lands connected to the board connection wiring are provided on the upper and lower surfaces of the relay board, and the first circuit board, the second circuit board, Are connected, The three-dimensional electronic circuit apparatus in any one of Claim 1-11 characterized by the above-mentioned. 前記基板接続配線が、前記中継基板の上下面に貫通するビアホールからなることを特徴とする請求項１２に記載の立体的電子回路装置。 The three-dimensional electronic circuit device according to claim 12, wherein the substrate connection wiring includes via holes penetrating the upper and lower surfaces of the relay substrate. 第１の回路基板と、
第２の回路基板と、
側面に電子部品を実装すると共に前記電子部品からの引き出し配線が設けられ、上下面に前記引き出し配線と前記第１の回路基板と前記第２の回路基板とを接続するためのランド部が形成された中継枠とを有し、
前記第１の回路基板と前記第２の回路基板が前記中継枠を介して３次元的に接続されていることを特徴とする立体的電子回路装置。 A first circuit board;
A second circuit board;
An electronic component is mounted on the side surface and a lead-out wiring from the electronic component is provided, and land portions for connecting the lead-out wiring, the first circuit board, and the second circuit board are formed on the upper and lower surfaces. A relay frame,
The three-dimensional electronic circuit device, wherein the first circuit board and the second circuit board are three-dimensionally connected via the relay frame. 前記中継枠の側面に電磁ノイズ抑制のためのシールド層が形成されていることを特徴とする請求項１４に記載の立体的電子回路装置。 The three-dimensional electronic circuit device according to claim 14, wherein a shield layer for suppressing electromagnetic noise is formed on a side surface of the relay frame. 前記中継枠の側面にインダクタまたはループアンテナが形成されていることを特徴とする請求項１４に記載の立体的電子回路装置。 The three-dimensional electronic circuit device according to claim 14, wherein an inductor or a loop antenna is formed on a side surface of the relay frame. 前記中継枠の側面に基板接続配線が設けられ、前記中継枠の上下面に前記基板接続配線と接続される基板接続ランドが設けられて、前記第１の回路基板と前記第２の回路基板とが接続されていることを特徴とする請求項１４から請求項１６までのいずれかに記載の立体的電子回路装置。 A board connection wiring is provided on a side surface of the relay frame, and board connection lands connected to the board connection wiring are provided on the upper and lower surfaces of the relay frame, and the first circuit board and the second circuit board are provided. The three-dimensional electronic circuit device according to claim 14, wherein the three-dimensional electronic circuit device is connected. 前記基板接続配線が、前記中継枠の上下面に貫通するビアホールからなることを特徴とする請求項１７に記載の立体的電子回路装置。 The three-dimensional electronic circuit device according to claim 17, wherein the substrate connection wiring includes via holes penetrating the upper and lower surfaces of the relay frame. 前記第１の回路基板と前記第２の回路基板の少なくとも一方に他の電子部品が実装されていることを特徴とする請求項１４に記載の立体的電子回路装置。 The three-dimensional electronic circuit device according to claim 14, wherein another electronic component is mounted on at least one of the first circuit board and the second circuit board. 前記第１の回路基板と前記第２の回路基板の少なくとも一方が、フレキシブル回路基板からなることを特徴とする請求項１から請求項１９までのいずれかに記載の立体的電子回路装置。 The three-dimensional electronic circuit device according to any one of claims 1 to 19, wherein at least one of the first circuit board and the second circuit board is a flexible circuit board. 窪み部を有し、前記窪み部に電子部品が搭載されると共に、前記電子部品からの引き出し配線が設けられ、上下面に他の回路基板と接続するための前記引き出し配線と接続されるランド部が形成されたことを特徴とする中継基板。 A land portion having a recess portion, in which an electronic component is mounted in the recess portion, a lead-out wiring from the electronic component is provided, and is connected to the lead-out wiring for connecting to another circuit board on the upper and lower surfaces A relay board characterized in that is formed. 前記窪み部が前記中継基板の上下面の少なくとも一方の面に設けられ、前記窪み部に前記電子部品が実装されていることを特徴とする請求項２１に記載の中継基板。 The relay substrate according to claim 21, wherein the recess is provided on at least one of upper and lower surfaces of the relay substrate, and the electronic component is mounted on the recess. 前記窪み部が前記中継基板の側面に設けられ、前記窪み部に前記電子部品が実装されていることを特徴とする請求項２１に記載の中継基板。 The relay substrate according to claim 21, wherein the recess is provided on a side surface of the relay substrate, and the electronic component is mounted in the recess. 前記窪み部が前記中継基板の側面の少なくとも一部および上下面の少なくとも一部に設けられ、前記電子部品が前記窪み部に搭載されていることを特徴とする請求項２１に記載の中継基板。 The relay substrate according to claim 21, wherein the recess is provided on at least a part of a side surface of the relay substrate and at least a part of an upper and lower surface, and the electronic component is mounted on the recess. 前記窪み部に搭載されている前記電子部品が複数であることを特徴とする請求項２１から請求項２４までのいずれかに記載の中継基板。 The relay board according to any one of claims 21 to 24, wherein a plurality of the electronic components are mounted in the recess. 前記中継基板の側面に電気的ノイズを遮蔽するためのシールド電極が形成されていることを特徴とする請求項２１から請求項２５までのいずれかに記載の中継基板。 The relay board according to any one of claims 21 to 25, wherein a shield electrode for shielding electrical noise is formed on a side surface of the relay board. 前記窪み部に搭載された前記電子部品がモールド樹脂により樹脂封止されていることを特徴とする請求項２１から請求項２６までのいずれかに記載の中継基板。 The relay board according to any one of claims 21 to 26, wherein the electronic component mounted in the hollow portion is resin-sealed with a mold resin. 前記中継基板の側面に基板接続配線が設けられ、前記中継基板の上下面に前記基板接続配線と接続される基板接続ランドが設けられていることを特徴とする請求項２１から請求項２７までのいずれかに記載の中継基板。 28. The board connection wiring is provided on a side surface of the relay board, and board connection lands connected to the board connection wiring are provided on upper and lower surfaces of the relay board. The relay board | substrate in any one. 前記基板接続配線が、前記中継基板の上下面に貫通するビアホールからなることを特徴とする請求項２８に記載の中継基板。 29. The relay board according to claim 28, wherein the board connection wiring includes via holes penetrating the upper and lower surfaces of the relay board. 少なくとも１つの側面に電子部品が実装されると共に、前記電子部品からの引き出し配線が設けられ、上下面に他の回路基板と接続するための前記引き出し配線と接続されるランド部が形成されたことを特徴とする中継枠。 An electronic component is mounted on at least one side surface, a lead wiring from the electronic component is provided, and a land portion connected to the lead wiring for connecting to another circuit board is formed on the upper and lower surfaces. A relay frame characterized by 前記少なくとも１つの側面に複数の前記電子部品が搭載されていることを特徴とする請求項３０に記載の中継枠。 The relay frame according to claim 30, wherein a plurality of the electronic components are mounted on the at least one side surface. 前記中継枠の側面に電磁ノイズ抑制のためのシールド層が形成されていることを特徴とする請求項３０または請求項３１に記載の中継枠。 32. The relay frame according to claim 30, wherein a shield layer for suppressing electromagnetic noise is formed on a side surface of the relay frame. 前記中継枠の側面に基板接続配線が設けられ、前記中継枠の上下面に前記基板接続配線と接続される基板接続ランドが設けられていることを特徴とする請求項３０から請求項３２までのいずれかに記載の中継枠。 A board connection wiring is provided on a side surface of the relay frame, and board connection lands connected to the board connection wiring are provided on upper and lower surfaces of the relay frame. A relay frame according to any one of the above. 前記基板接続配線が、前記中継枠の上下面に貫通するビアホールからなることを特徴とする請求項３３に記載の中継枠。 34. The relay frame according to claim 33, wherein the board connection wiring includes via holes penetrating the upper and lower surfaces of the relay frame.
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