JP2005127750A - Semiconductor sensor and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor sensor miniaturizable compared with the conventional, and to provide its manufacturing method. <P>SOLUTION: This sensor is equipped with a semiconductor sensor chip 1 for detecting an acceleration, a rectangular plate-shaped signal processing IC chip 2, and a rectangular plate-shaped package chip 3. In the package chip 3, a recessed part 3a for storing the semiconductor sensor chip 1 is formed on one face in the thickness direction, and wiring 33 is penetratively disposed in the thickness direction. The signal processing IC chip 2 and the package chip 3 have the same chip size respectively, and the signal processing IC chip 2 is mounted on the package chip 3 in the form wherein the main surface where a pad 21 is formed is faced to one face of the package chip 3. The semiconductor sensor chip 1 is mounted on the signal processing IC chip 2 in the form wherein the main surface where a pad 15 is formed is faced to the main surface of the signal processing IC chip 2. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a semiconductor sensor and a manufacturing method thereof.

  Conventionally, as a physical quantity sensor that converts the magnitude of a mechanical physical quantity such as acceleration or angular velocity, which is a detection target, into an electrical signal and outputs it, it is formed by three-dimensionally processing a semiconductor substrate such as a silicon substrate by micromachining technology. A semiconductor sensor including the semiconductor sensor chip is known.

  As this type of semiconductor sensor, for example, as shown in FIG. 7, a semiconductor sensor chip 1 and a signal processing IC chip 2 for processing an output signal of the semiconductor sensor chip 1 are housed in a rectangular parallelepiped ceramic package 8. Some are provided in a can package (not shown). The signal processing IC chip 2 includes an amplifier circuit that amplifies the output signal of the semiconductor sensor chip 1, a temperature compensation circuit that corrects the sensitivity and offset voltage of the sensor and their temperature characteristics, a noise removal circuit that removes noise, and the like. Are integrated, it is possible to detect a mechanical physical quantity as a detection target with high accuracy. The ceramic package 8 includes a ceramic substrate 81 in which a recess 81a for accommodating the semiconductor sensor chip 1 and the signal processing IC chip 2 is formed on one surface, and a ceramic cap 82 that is covered on one surface side of the ceramic substrate 81. It consists of

  In the semiconductor sensor having the configuration shown in FIG. 7, the semiconductor sensor chip 1 and the signal processing IC chip 2 are mounted on the same plane, and an output pad (not shown) of the semiconductor sensor chip 1 and the signal processing are mounted. An input pad (not shown) of the IC chip 2 is electrically connected via a bonding wire W2 made of a thin metal wire (for example, an Au wire, an Al wire, etc.). In the semiconductor sensor described above, the external connection in which the input pad (not shown) of the semiconductor sensor chip 1 and the output pad (not shown) of the signal processing IC chip 2 are integrally provided in the ceramic package 8. The lead 83 is electrically connected via bonding wires W1 and W3, respectively, so that it can be controlled externally.

Further, conventionally, a semiconductor sensor chip is mounted on a signal processing IC chip mounted on one surface of a ceramic substrate, and the semiconductor sensor chip and the signal processing IC chip are electrically connected via a bonding wire, There has also been proposed a semiconductor sensor having a configuration in which a ceramic cap covering each chip is covered on one side of a ceramic substrate (see, for example, Patent Document 1).
JP-A-8-110351 (see paragraph numbers [0013], [0015], [0016], [0020], FIG. 1)

  By the way, the semiconductor sensor having the configuration shown in FIG. 7 is obtained by mounting the semiconductor sensor chip 1 and the signal processing IC chip 2 on the inner bottom surface of the recess 81a formed in the ceramic substrate 81. 2 and the signal processing IC chip 2 can be arranged two-dimensionally, the degree of freedom of layout of the semiconductor sensor chip 1 and the signal processing IC chip 2 is high, but the volume of the entire sensor is increased. It was difficult to reduce the size of the entire sensor. 7 is manufactured, the semiconductor sensor chip 1 and the signal processing IC chip 2 are mounted on the ceramic substrate 81 and wire bonded, and then the ceramic cap 82 is attached to the ceramic substrate 81. The manufacturing cost was relatively high.

  In addition, a semiconductor sensor chip is mounted on a signal processing IC chip mounted on one surface of a ceramic substrate as in the semiconductor sensor disclosed in Patent Document 1, and the semiconductor sensor chip and the signal processing IC chip are bonded. In the case of a configuration in which a ceramic cap that is electrically connected via a wire and covers each chip is covered on one surface side of the ceramic substrate, the thickness dimension of the entire sensor is increased. Also in the semiconductor sensor disclosed in Patent Document 1, after the signal processing IC chip is mounted on the ceramic substrate at the time of manufacture, the semiconductor sensor chip is mounted on the signal processing IC chip and wire bonding is performed. Since it is necessary to cover the ceramic cap on the ceramic substrate, the manufacturing cost becomes relatively high.

  The present invention has been made in view of the above reasons, and an object of the present invention is to provide a semiconductor sensor that can be miniaturized as compared with the prior art and a method for manufacturing the same.

  According to a first aspect of the present invention, there is provided a semiconductor sensor chip for detecting a mechanical physical quantity, a signal processing IC chip for signal processing of an output signal of the semiconductor sensor chip, and a semiconductor sensor chip accommodated in a plate-like surface in the thickness direction. A signal processing IC chip having a chip size larger than the opening of the recess, and the signal processing IC chip is formed with pads of the signal processing IC chip. The semiconductor sensor chip is mounted on the package chip so that the surface faces the one surface of the package chip, and the main surface on which the pads of the semiconductor sensor chip are formed is opposed to the main surface of the signal processing IC chip. It is mounted on a signal processing IC chip in a form.

  According to the present invention, the thickness of the entire sensor can be reduced as compared with the conventional case, and the size of the entire sensor in the plane orthogonal to the thickness direction of the signal processing IC chip is reduced to the chip of the signal processing IC chip. Since it becomes possible to make it a size level, the whole sensor can be reduced in size compared with the past.

  According to a second aspect of the present invention, in the first aspect of the invention, the package chip has an external connection electrode formed on the other surface in the thickness direction, and is electrically connected to the pad of the signal processing IC chip. A wiring for electrically connecting the electrode terminal and the external connection electrode is provided so as to penetrate in the thickness direction.

  According to this invention, it is possible to match the size of the entire sensor in the plane orthogonal to the thickness direction of the package chip with the chip size of the signal processing IC chip.

  According to a third aspect of the present invention, in the signal processing IC chip according to the first aspect of the present invention, an external connection electrode is formed on the back side of the signal processing IC chip, and the pad and the external connection electrode of the signal processing IC chip are electrically connected. The wiring to be connected is formed through the thickness direction.

  According to this invention, it is possible to match the size of the entire sensor in the plane orthogonal to the thickness direction of the package chip with the chip size of the signal processing IC chip.

  According to a fourth aspect of the present invention, in the first to third aspects of the present invention, the chip size of the signal processing IC chip is matched to the chip size of the package chip.

  According to this invention, the size of the entire sensor in a plane orthogonal to the thickness direction of the package chip can be defined by the chip size of the signal processing IC chip.

  According to a fifth aspect of the present invention, there is provided a method of manufacturing a semiconductor sensor according to the fourth aspect of the present invention, wherein an array pitch of signal processing IC chips and a plurality of package chips on a first wafer on which a large number of signal processing IC chips are formed The arrangement pitch of the package chips in the second wafer to be formed is the same pitch, and individual semiconductor sensor chips are mounted on each of the signal processing IC chips in the first wafer on which a large number of signal processing IC chips are formed. Mounting process, bonding process for forming a bonded wafer in which the first wafer and the second wafer are bonded after the mounting process, and the bonded wafer are each divided into individual chips to be semiconductor sensors. And a dividing step.

  According to the present invention, by adopting the mounting process of mounting individual semiconductor sensor chips on each signal processing IC chip in the first wafer on which a large number of signal processing IC chips are formed, As compared with the case where the semiconductor sensor chip is mounted on each of the divided signal processing IC chips, the mounting process of the semiconductor sensor chip onto the signal processing IC chip is facilitated, and the first wafer and the second wafer are mounted. By adopting a bonding process to form a bonded wafer that is bonded to the wafer, signal processing IC chips are mounted on each of a large number of package chips at the same time at the wafer level. The manufacturing cost can be reduced, and a semiconductor sensor that is smaller and less expensive than the conventional one can be provided.

  According to the first to fourth aspects of the present invention, the overall thickness of the sensor can be reduced as compared with the prior art, and the size of the entire sensor in the plane perpendicular to the thickness direction of the signal processing IC chip is signal processed. Therefore, it is possible to reduce the size of the entire sensor as compared with the prior art.

  In the invention of claim 5, by adopting a mounting step of mounting individual semiconductor sensor chips for each of the signal processing IC chips in the first wafer formed with a large number of signal processing IC chips, The mounting process of the semiconductor sensor chip on the signal processing IC chip is facilitated as compared with the case where the semiconductor sensor chip is mounted on each of the individually divided signal processing IC chips. By adopting a bonding process for forming a bonded wafer bonded to the wafer, signal processing IC chips are mounted on each of a large number of package chips at the same time at the wafer level. Therefore, the manufacturing cost can be reduced, and a semiconductor sensor that is smaller and less expensive than the conventional one can be provided. .

(Embodiment 1)
In the present embodiment, a semiconductor acceleration sensor A having the configuration shown in FIGS. 1 and 2 is illustrated as an example of the semiconductor sensor. The semiconductor acceleration sensor A according to the present embodiment includes a semiconductor sensor chip 1 that is formed by three-dimensionally processing a silicon substrate using micromachining technology and detects a mechanical physical quantity (acceleration in the present embodiment). A signal processing IC chip 2 for processing an output signal and a package chip 3 for a package made of an alkali glass substrate having an insulating property are provided.

  The semiconductor sensor chip 1 includes a frame portion 11 having a rectangular frame shape, and a weight portion 12 arranged inside the frame portion 11 is continuous to the frame portion 11 via four flexible portions 13 that are thinner than the frame portion 11. It has a structure connected together. The weight portion 12 is seen from the side of the main weight portion 12a having a rectangular parallelepiped shape supported by the frame portion 11 via the four flexure portions 13 and the main surface (the upper surface in FIG. 2A) of the semiconductor sensor chip 1. And four additional weights 12b in the shape of a rectangular parallelepiped continuously connected to each of the four corners of the main weight 12a. Here, in the semiconductor sensor chip 1, slits 14 are formed around each additional weight portion 12 b except for a connecting portion with the main weight portion 12 a, and the four bent portions 13 are centered on the main weight portion 12 a. It is arranged in a cross shape. The semiconductor sensor chip 1 is a three-axis acceleration sensor chip that detects acceleration in three directions, and is a piezoresistor as a resistor whose resistivity changes due to distortion generated in the bending portion 13 due to displacement of the weight portion 12 (see FIG. (Not shown) are formed at appropriate positions of the respective bending portions 13, and the plurality of piezoresistors are connected by diffusion layer wiring, metal wiring, etc. (not shown) so as to have three bridge circuits. In addition, the semiconductor sensor chip 1 includes eight pads 15 on the main surface of the frame portion 11, and the pads 15 that serve as output terminals of the bridge circuits described above are provided for each bridge circuit. The pad 15 serving as the input terminal of the bridge circuit is shared by the three bridge circuits.

  The semiconductor sensor chip 1 is formed using the silicon substrate as described above. However, the semiconductor sensor chip 1 is not limited to the silicon substrate, and is, for example, a so-called SOI having a buried oxide film made of a silicon oxide film at an intermediate portion in the thickness direction. You may form using a (Silicon on Insulator) board | substrate. Moreover, the shape and number of the weight part 12 and the bending part 13 in the semiconductor sensor chip 1 are not particularly limited.

  The package chip 3 has a plate shape (in this embodiment, a rectangular plate shape), and a recess 3a for housing the semiconductor sensor chip 1 is formed at the center of one surface in the thickness direction (the upper surface in FIG. 2A). Has been. Further, the package chip 3 has pads 31 and 32 formed on both surfaces in the thickness direction, and a wiring made of a conductive material (for example, a metal material) that electrically connects the pads 31 and 32 that overlap in the thickness direction. A (penetrating wiring) 33 is provided, and a bump 34 made of a metal material is formed on the pad 32 (the lower side in FIG. 2A) on the other surface in the thickness direction (the lower surface in FIG. 2A). Has been. Here, the wiring 33 is formed by embedding a conductive material in a through-hole formed in the package chip 3, and the signal processing IC chip 2 is electrically connected to the pad 32 formed on the other surface in the thickness direction. It is provided in order to connect. In the present embodiment, the plurality of pads 31 formed on one surface of the package chip 3 each constitute an electrode terminal, and the plurality of pads 32 formed on the other surface of the package chip 3 each configure an external connection electrode. However, since the package chip 3 is formed of an insulating alkaline glass substrate, the external connection electrodes can be electrically insulated without providing a special structure, and the reliability is improved. be able to.

  The signal processing IC chip 2 is formed by using a silicon substrate, and similarly to the prior art, an amplifier circuit that amplifies the output signal of the semiconductor sensor chip 1, a sensor sensitivity and offset voltage, and temperature compensation that corrects their temperature characteristics. Although a circuit, a noise removal circuit for removing noise, and the like are integrated, the circuit configuration and operation of these circuits are well known, and illustration and description thereof are omitted. The signal processing IC chip 2 is formed in a rectangular plate shape.

  By the way, in this embodiment, the chip size of the signal processing IC chip 2 is set larger than the opening surface of the recess 3 a in the package chip 3. In the present embodiment, the signal processing IC chip 2 is mounted on the package chip 3 with the main surface (the lower surface in FIG. 2A) on which the pads 21 are formed facing the one surface of the package chip 3. The pads 21 of the signal processing IC chip 2 and the pads 31 on the one surface of the package chip 3 are electrically connected. Here, the signal processing IC chip 2 and the package chip 3 are hermetically bonded by anodic bonding so that the semiconductor sensor chip 1 is not exposed to the outside air. In the present embodiment, the signal processing IC chip is formed such that the main surface (the upper surface in FIG. 2A) on which the semiconductor sensor chip 1 is formed with the pads 15 is opposed to the main surface of the signal processing IC chip 2. 2 (flip chip mounting), the pad 15 of the semiconductor sensor chip 1 and the pad 21 of the signal processing IC chip 2 are electrically connected. It should be noted that the depth dimension of the recess 3a of the package chip 3 is such that a gap that allows displacement of the weight 12 in the thickness direction of the package chip 3 is provided between the back surface of the weight 12 and the inner bottom surface of the recess 3a. It is set to be formed.

  Thus, in the semiconductor acceleration sensor A of the present embodiment, the chip size of the signal processing IC chip 2 is larger than the opening surface of the recess 3a of the package chip 3, and the signal processing IC chip 2 is formed with the pads 21. The semiconductor sensor chip 1 is mounted on the package chip 3 so that the main surface faces the one surface of the package chip 3, and the main surface on which the pads 15 are formed faces the main surface of the signal processing IC chip 2. Since the sensor is mounted on the signal processing IC chip 2, the thickness dimension of the entire sensor can be defined by the total dimension of the thickness dimension of the package chip 3 and the thickness dimension of the signal processing IC chip 2. The overall thickness of the sensor can be made smaller than that of the sensor, and the entire sensor in the plane perpendicular to the thickness direction of the package chip 3 Since it is possible to make noise and signal processing IC chip 2 of the chip size level, it is possible to reduce the overall size of the sensor as compared with the prior art. The package chip 3 has a pad 32 as an external connection electrode formed on the other surface in the thickness direction, and a wiring 33 that electrically connects the signal processing IC chip 2 and the pad 32 is provided in the thickness direction. Therefore, the size of the entire sensor in the plane orthogonal to the thickness direction can be matched with the chip size of the signal processing IC chip 2.

  Hereinafter, a method for manufacturing the semiconductor acceleration sensor A of the present embodiment will be described with reference to FIG.

  First, a sensor pre-process (S1) for forming a large number of semiconductor sensor chips 1 on a silicon wafer 10 using a micromachining technique, and a large number of signal processing IC chips 2 on a silicon wafer 20 using a silicon process. An IC pre-process (S2) and a pre-package process (S3) for forming a large number of package chips 3 on a glass wafer 30 made of alkali glass are performed. Here, the arrangement pitch of the signal processing IC chips 2 on the silicon wafer 20 on which a large number of signal processing IC chips 2 are formed and the arrangement pitch of the package chips 3 on the glass wafer 30 on which a large number of package chips 3 are formed are the same pitch. It is as. In the present embodiment, the silicon wafer 20 constitutes the first wafer, and the glass wafer 30 constitutes the second wafer.

  The time series relationship of each of the preceding processes is not particularly limited, but the first dicing process in which the silicon wafer 10 after the sensor pre-process (S1) is divided into individual semiconductor sensor chips 1 by the dicing saw 4 is used. (S4) is performed.

  Then, after the first dicing step (S4) is completed, each of the semiconductor sensor chips 1 and the pads 21 are partially opposed to the pads 15 for each of the signal processing IC chips 2 on the silicon wafer 20. After performing the mounting step (S5) for mounting in a form, the other pad 21 and the pad 31 are opposed to each other so that the signal processing IC chip 2 and the package chip 3 overlap the silicon wafer 20 and the glass wafer 30. A bonding step (S6) for forming a bonded wafer 40 bonded in a form is performed, and then a dividing step (S7) for dividing the bonded wafer 40 into individual chips to be the semiconductor acceleration sensor A by the dicing saw 4. By performing the above, the semiconductor acceleration sensor A shown in FIGS. 1 and 2 is obtained. In the bonding step, the silicon wafer 20 and the glass wafer 30 are bonded by anodic bonding.

  In the manufacturing method described above, the arrangement pitch of the signal processing IC chips 2 on the silicon wafer 20 on which the large number of signal processing IC chips 2 are formed and the arrangement pitch of the package chips 3 on the glass wafer 30 on which the large number of package chips 3 are formed. Are mounted at the same pitch, and a mounting process of mounting each semiconductor sensor chip 1 on each of the signal processing IC chips 2 on the silicon wafer 20 on which a large number of signal processing IC chips 2 are formed, and after the mounting process Since there are a bonding process for forming a bonded wafer 40 in which the silicon wafer 20 and the glass wafer 30 are bonded, and a dividing process for dividing the bonded wafer 40 into individual chips to be the semiconductor acceleration sensors A, respectively. In a silicon wafer 20 on which a large number of signal processing IC chips 2 are formed By adopting a mounting process for mounting each semiconductor sensor chip 1 on each signal processing IC chip 2, the semiconductor sensor chip 1 is mounted on each individually divided signal processing IC chip 2. Compared to the case, the mounting process of the semiconductor sensor chip 1 to the signal processing IC chip 2 is facilitated, and the bonding process of forming the bonded wafer 40 by bonding the silicon wafer 20 and the glass wafer 30 is performed. As a result, the mounting of the signal processing IC chip 2 on each of a large number of package chips 3 is performed at the wafer level in a lump, so that the assembly process time can be greatly reduced. The manufacturing cost can be reduced, and the semiconductor acceleration sensor A that is smaller and less expensive than the conventional one can be provided.

  By the way, in the present embodiment, since the package chip 3 is formed by using an alkaline glass substrate having insulation properties, the pads 32 and the wirings 33 can be electrically insulated without providing a special structure. However, since the signal processing IC chip 2 and the semiconductor sensor chip 1 are formed using a silicon substrate, thermal stress due to the difference in thermal expansion coefficient between the alkaline glass and silicon is generated in the semiconductor sensor chip 1. The offset voltage of the output voltage of the bridge circuit may increase.

  In order to reduce the offset voltage, the package chip 3 may be formed of a silicon substrate. By forming the package chip 3 of the silicon substrate, it is possible to prevent the semiconductor sensor chip 1 from generating thermal stress. Can do. However, when the package chip 3 is formed of a silicon substrate, as shown in FIG. 4, insulating films (for example, silicon oxide films) 35 are formed on both surfaces in the thickness direction of the package chip 3 and the inner peripheral surface of the through hole. It is necessary to form and secure insulation between the pads 32 and between the wirings 33.

  Here, when the package chip 3 is formed of a silicon substrate, a large number of package chips 3 may be formed on a silicon wafer as the above-described pre-package process.

(Embodiment 2)
In the present embodiment, a semiconductor acceleration sensor A having the configuration shown in FIGS. 5 and 6 is illustrated as a semiconductor sensor. The basic configuration of the semiconductor acceleration sensor A of the present embodiment is substantially the same as that of the first embodiment. Instead of providing the pads 31 and 32 and the wiring 33 on the package chip 3, as shown in FIGS. A pad 22 as an external connection electrode is formed on the back surface (the lower surface in FIG. 6A) side of the IC chip 2, and the pad 21 formed on the main surface side and the pad 22 formed on the back surface side are electrically connected. A difference is that a wiring (through wiring) 23 made of a conductive material (for example, a metal material) to be connected is provided in the thickness direction. A bump 25 made of a metal material is formed on the pad 22 (the lower side of FIG. 6A). Here, in the signal processing IC chip 2, insulating films (for example, silicon oxide films) 24 are formed on both surfaces in the thickness direction and on the inner peripheral surface of the through-hole, and the wiring 23 and the pads 22 are electrically connected. Insulated. Further, the package chip 3 and the signal processing IC chip 2 are bonded by the anodic bonding method, but not limited to the anodic bonding method. For example, the package chip 3 and the signal processing IC chip 2 may be bonded using an adhesive or surface activated bonding. You may make it join by the law. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted.

  Thus, also in the semiconductor acceleration sensor A of the present embodiment, the chip size of the signal processing IC chip 2 is larger than the opening surface of the recess 3 a of the package chip 3, as in the first embodiment, and the signal processing IC chip 2. Is mounted on the package chip 3 with the main surface on which the pads 21 are formed facing the one surface of the package chip 3, and the main surface on which the semiconductor sensor chip 1 has the pads 15 is formed on the signal processing IC chip. 2 is mounted on the signal processing IC chip 2 so as to face the main surface of the sensor 2. Therefore, the thickness dimension of the entire sensor depends on the total dimension of the thickness dimension of the package chip 3 and the thickness dimension of the signal processing IC chip 2. The thickness of the entire sensor can be reduced as compared with the conventional sensor, and it is perpendicular to the thickness direction of the package chip 3. Since the overall size of the sensor becomes possible to a signal processing IC chip 2 of the chip size level in the inner it can reduce the overall size of the sensor as compared with the prior art. Further, in the semiconductor acceleration sensor A of the present embodiment, it is not necessary to provide the pads 31 and 32 and the wiring 33 on the package chip 3, and the number of electrical connection portions between the chips can be reduced. Since it is not used as an electric signal transmission medium, it is possible to reduce the material cost of the package chip 3 by reducing the restrictions on the material of the package chip 3, and as a result, it is possible to reduce the cost of the semiconductor acceleration sensor A. It becomes possible.

  The manufacturing method of the semiconductor acceleration sensor A of the present embodiment is basically the same as the manufacturing method described in the first embodiment, and an IC pre-process for forming a large number of signal processing IC chips 2 on the silicon wafer 20. Only the pre-package process for forming a large number of package chips 3 on the glass wafer 30 is different.

  In each of the above embodiments, the structure of the semiconductor sensor chip 1 is a double-supported beam structure, but a so-called cantilever structure may be used. In addition, the semiconductor acceleration sensor A of each of the embodiments described above is a piezoresistive detection method, but may be a capacitance type semiconductor acceleration sensor. When a capacitance type semiconductor acceleration sensor is used, The weight part 12 of the semiconductor sensor chip 1 may be provided with a movable electrode, and a fixed electrode facing the movable electrode in the thickness direction of the semiconductor sensor chip 1 may be provided on the signal processing IC chip 2 or the package chip 3. Moreover, in each said embodiment, although the semiconductor acceleration sensor A was illustrated as a semiconductor sensor, in the case of a semiconductor angular velocity sensor, what is necessary is just to change the shape etc. of the semiconductor sensor chip 1 suitably.

Embodiment 1 is shown, (a) is a schematic perspective view, (b) is a schematic exploded perspective view. The same as the above, (a) is a schematic sectional view, (b) is an enlarged view of the main part of (a). It is explanatory drawing of a manufacturing method same as the above. It is a principal part enlarged view in the other structural example same as the above. Embodiment 2 is shown, (a) is a schematic perspective view, (b) is a schematic exploded perspective view. The same as the above, (a) is a schematic sectional view, (b) is an enlarged view of the main part of (a). It is a schematic perspective view which showed the prior art example and was partly fractured.

Explanation of symbols

A semiconductor acceleration sensor 1 semiconductor sensor chip 2 signal processing IC chip 3 package chip 3a recess 15 pad 21 pad 33 wiring

Claims (5)

  A semiconductor sensor chip for detecting a physical physical quantity, a signal processing IC chip for signal processing of the output signal of the semiconductor sensor chip, and a recess for receiving the semiconductor sensor chip on one surface in the thickness direction are formed. A signal processing IC chip having a chip size larger than the opening of the recess, and the signal processing IC chip has the main surface on which the pads of the signal processing IC chip are formed as the one surface of the package chip. The signal processing IC chip is mounted on the package chip so as to face the semiconductor chip, and the semiconductor sensor chip has the main surface on which the pads of the semiconductor sensor chip are formed facing the main surface of the signal processing IC chip. A semiconductor sensor, which is mounted on the semiconductor sensor.   The package chip has an external connection electrode formed on the other surface in the thickness direction, and electrically connects the electrode terminal electrically connected to the pad of the signal processing IC chip and the external connection electrode. 2. The semiconductor sensor according to claim 1, wherein the wiring is formed so as to penetrate in the thickness direction.   The signal processing IC chip has an external connection electrode formed on the back side, and a wiring for electrically connecting the pad of the signal processing IC chip and the external connection electrode is provided in the thickness direction. The semiconductor sensor according to claim 1.   4. The semiconductor sensor according to claim 1, wherein a chip size of the signal processing IC chip is matched with a chip size of the package chip.   5. The method of manufacturing a semiconductor sensor according to claim 4, wherein the arrangement pitch of the signal processing IC chips in the first wafer on which a large number of signal processing IC chips are formed and the second wafer on which the large number of package chips are formed. A mounting step of mounting individual semiconductor sensor chips on each of the signal processing IC chips in the first wafer on which a plurality of signal processing IC chips are formed with the same arrangement pitch of the package chips; and a mounting step Thereafter, a bonding process for forming a bonded wafer in which the first wafer and the second wafer are bonded together, and a dividing process for dividing the bonded wafer into individual chips each serving as a semiconductor sensor are provided. A method for manufacturing a semiconductor sensor.

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