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JP2005123459A - Semiconductor cooling apparatus - Google Patents

Semiconductor cooling apparatus Download PDF

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Publication number
JP2005123459A
JP2005123459A JP2003357970A JP2003357970A JP2005123459A JP 2005123459 A JP2005123459 A JP 2005123459A JP 2003357970 A JP2003357970 A JP 2003357970A JP 2003357970 A JP2003357970 A JP 2003357970A JP 2005123459 A JP2005123459 A JP 2005123459A
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heat
cooler
semiconductor
cooling device
semiconductor cooling
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JP2003357970A
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JP4202887B2 (en
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Takashi Hashimoto
隆 橋本
Masaki Miyairi
正樹 宮入
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Toshiba Corp
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Toshiba Corp
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Priority to JP2003357970A priority Critical patent/JP4202887B2/en
Priority to CNA2004100104030A priority patent/CN1625030A/en
Priority to KR1020040082501A priority patent/KR100619490B1/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20936—Liquid coolant with phase change
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
    • H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
    • H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L9/00—Electric propulsion with power supply external to the vehicle
    • B60L9/16—Electric propulsion with power supply external to the vehicle using ac induction motors
    • B60L9/18—Electric propulsion with power supply external to the vehicle using ac induction motors fed from dc supply lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Transportation (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Energy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Inverter Devices (AREA)
  • Electric Propulsion And Braking For Vehicles (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Power Conversion In General (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor cooling apparatus capable of improving the reliability of a semiconductor element by suppressing the rise of temperature of the semiconductor element and of downsizing and making light weight the apparatus by downsizing a condenser. <P>SOLUTION: In the semiconductor cooling apparatus housed in a power conversion apparatus installed below the floor of a railroad vehicle, an electric power conversion circuit corresponding to one phase includes semiconductor elements connected in series, has a DC terminal at opposite ends thereof, and has an AC terminal at an intermediate connection point thereof. The semiconductor elements constituting the upper arm side of the electric power conversion circuit is attached to one face of a heat reception part of one condenser, and the semiconductor elements constituting a lower arm side are attached to one face of a heat reception part of another condenser. The two condensers are arranged vertically. Heat radiators of these condensers are disposed on the body side of an apparatus casing, opened to fresh air with an interval between the upper and lower heat radiators. This ensures fresh traveling wind even on the rear side of a plurality of the condensers to suppress the temperature rise of the semiconductor elements on the rear side. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は半導体冷却装置に係り、特に鉄道車両床下に設置される電力変換装置内に収納される半導体冷却装置に関する。   The present invention relates to a semiconductor cooling device, and more particularly to a semiconductor cooling device housed in a power conversion device installed under the floor of a railway vehicle.

鉄道車両の床下に設置される電力変換装置は、半導体素子を用いて電力変換を行うが半導体素子より発生する熱損失を大気に効率良く放散し半導体素子の温度上昇を抑えるための冷却器が必要になる。電動送風機を用いて強制的に送風冷却を行うものもあるが、無保守性のメリットから電動送風機を用いない自然通風方式の冷却器を用いるものも多い。この場合、大気への熱放散性が良好となるよう冷却器の放熱部を車体側方側に向けて設置するのが一般的である。   The power conversion device installed under the floor of a railway vehicle performs power conversion using semiconductor elements, but requires a cooler to efficiently dissipate heat loss generated from the semiconductor elements to the atmosphere and suppress the temperature rise of the semiconductor elements become. There are some that forcibly cool the air using an electric blower, but many use a natural ventilation type cooler that does not use an electric blower because of the merit of non-maintenance. In this case, it is common to install the heat dissipating part of the cooler toward the side of the vehicle body so that the heat dissipation to the atmosphere is good.

以下、従来の電力変換装置の半導体冷却装置を図５及び図６を参照して説明する。
図５は、特許文献１において、車体床下に取付けられた電力変換装置の構成図であり、同図（ａ）は鳥瞰図、同図（ｂ）は同図（ａ）のＸ−Ｘ断面図、図６（ａ）は図５（ｂ）の部分拡大図、図６（ｂ）は図６（ａ）の車体を取り除いた部分図である。 Hereinafter, a conventional semiconductor cooling device for a power conversion device will be described with reference to FIGS.
FIG. 5 is a configuration diagram of a power conversion device attached under the vehicle body floor in Patent Document 1, wherein FIG. 5 (a) is a bird's eye view, FIG. 5 (b) is an XX cross-sectional view of FIG. 6 (a) is a partially enlarged view of FIG. 5 (b), and FIG. 6 (b) is a partial view with the vehicle body of FIG. 6 (a) removed.

車体１の床下に設置される電力変換装置２は、半導体素子３を冷却するための冷却器４が収納されており、冷却器４は電力変換装置２の筐体内部に半導体素子３の取り付く受熱部５が、車体側方側となる筐体外部の外気に晒される部分に多数枚の放熱フィン６が配置されるよう構成されている。受熱部５と放熱フィン６との間は複数本のヒートパイプ７で接続されるが、ヒートパイプ７の一方の端部は受熱部５へ挿入接続され、もう一方の端部は放熱フィン６に貫通接続される。又、床下に設置される機器は設置スペース限界８内に収納する必要があり、この設置スペース限界８内に収まるよう放熱フィン６が多数枚設けられることになる。   The power conversion device 2 installed under the floor of the vehicle body 1 houses a cooler 4 for cooling the semiconductor element 3, and the cooler 4 receives heat received by the semiconductor element 3 in the casing of the power conversion device 2. The part 5 is configured such that a large number of radiating fins 6 are arranged in a portion exposed to the outside air outside the casing on the side of the vehicle body. The heat receiving portion 5 and the heat radiating fin 6 are connected by a plurality of heat pipes 7, but one end of the heat pipe 7 is inserted and connected to the heat receiving portion 5, and the other end is connected to the radiating fin 6. Through-connection. Moreover, it is necessary to store the equipment installed under the floor within the installation space limit 8, and a large number of radiating fins 6 are provided so as to be within the installation space limit 8.

このように構成された電力変換装置２では、半導体素子３より発生する熱損失は冷却器４の受熱部５へ伝熱され、ヒートパイプ７を介して放熱フィン６へと伝わり放熱フィン６より大気へ熱放散されることになる。放熱フィン６は車体側方側にあるため、排出された熱が車体１の床下にこもりにくいメリットがあり、かつ車両走行時に床下機器群周辺を流れる走行風が放熱フィン６を流れやすいため、放熱性能も向上する。このように走行風を効率良く利用することは、半導体素子温度上昇の低減により充分なマージンが確保でき信頼性向上につながり、また、冷却器小形化による装置の小形軽量化にとって重要である。
特開平６−２２５５４８号公報 In the power conversion device 2 configured as described above, the heat loss generated from the semiconductor element 3 is transferred to the heat receiving portion 5 of the cooler 4 and is transferred to the heat radiating fins 6 through the heat pipes 7. Heat will be dissipated. Since the radiating fins 6 are located on the side of the vehicle body, there is an advantage that the discharged heat is less likely to be trapped under the floor of the vehicle body 1, and the traveling wind that flows around the underfloor equipment group tends to flow through the radiating fins 6 when the vehicle is traveling. Performance is also improved. The efficient use of traveling wind in this way is sufficient for securing a sufficient margin by reducing the increase in the temperature of the semiconductor element, leading to improved reliability, and also important for reducing the size and weight of the apparatus by downsizing the cooler.
JP-A-6-225548

上述のように放熱フィン６部分を車体側方へ突出させ走行風を受けやすく構成しているが、電力変換装置では１相分のみの電力変換回路だけから構成されるものはほとんど無く、半導体冷却装置が複数個で構成される。それら半導体冷却装置の放熱フィン部分が装置の車体側方側に突出して複数個、車両進行方向に並ぶわけである。   As described above, the radiating fins 6 are protruded to the side of the vehicle body so that they can easily receive traveling wind. However, there are almost no power conversion devices composed of only one phase power conversion circuit, and semiconductor cooling A plurality of devices are configured. A plurality of radiating fin portions of these semiconductor cooling devices protrude in the side of the vehicle body of the device and are arranged in the vehicle traveling direction.

車両走行時の走行風はこれら放熱フィン部分の何れにも同等にあたるものでは当然無く、進行方向後位ではその前位にある放熱フィンに阻害され、充分な走行風が得られないということになる。充分な走行風が得られないと後位の放熱フィン部分での通過風速が低いことで放熱フィン表面からの熱伝達が悪くなるだけでなく、その前位側の放熱フィンから放熱された熱量により空気温度も上昇し、後位の放熱フィンへの入風温度も高くなるので冷却上は更に条件が悪くなる。   Of course, the running wind when the vehicle is running is not equivalent to any of these radiating fins, and at the rear of the traveling direction, it is obstructed by the radiating fin in the front, and sufficient running wind cannot be obtained. . If sufficient running wind is not obtained, the passing air speed at the rear radiating fin part is low, which not only deteriorates heat transfer from the surface of the radiating fin, but also due to the amount of heat radiated from the radiating fin on the front side. The air temperature also rises, and the temperature of the incoming air to the rear radiating fins also rises, so that the conditions for cooling become worse.

最も冷却条件の悪い後位の放熱フィン部分で冷却器性能が決まってしまうため、前位側では充分すぎるマージンがあることになる。進行方向は何れの方向にも入れ替わるため、その時の前位側冷却器を小形化して最適化することもできない。さらに、走行風を利用した冷却では進行方向に複数個並んだ放熱フィン部分の前位側から後位側へ走行風の低下を少なくすることが肝要である。   Since the cooler performance is determined at the rear heat dissipating fin portion having the worst cooling conditions, there is an excessive margin on the front side. Since the traveling direction is switched to any direction, the front cooler at that time cannot be miniaturized and optimized. Further, in cooling using traveling wind, it is important to reduce the decrease in traveling wind from the front side to the rear side of a plurality of radiating fin portions arranged in the traveling direction.

本発明は、上記情況に対処するためになされたもので、その課題は、車両進行方向に複数個並んだ冷却器の後位側でも充分な走行風が得られるようにすることで、半導体素子の温度上昇を抑え信頼性を向上させると共に、冷却器の小形化により装置小形軽量化することを可能とする半導体冷却装置を提供することにある。   The present invention has been made to cope with the above situation, and the problem is that a sufficient amount of running wind can be obtained even on the rear side of the coolers arranged in the vehicle traveling direction. It is an object of the present invention to provide a semiconductor cooling device that can suppress the temperature rise and improve the reliability and reduce the size and weight of the device by reducing the size of the cooler.

上記課題を解決するために、請求項１に記載の発明は、鉄道車両床下に設置される電力変換装置内に収納される半導体冷却装置において、直列に半導体素子が接続され、その両端が直流端子、中間接続点が交流端子となる１相分の電力変換回路の上アーム側を構成する半導体素子を１個の冷却器の受熱部の一面に取付け、下アーム側を構成する半導体素子を別の１個の冷却器の受熱部の一面に取付け、これら２個の冷却器を上下方向に並べて配置すると共に、これら冷却器の放熱部分は装置筐体の車体側方側に外気に開放されて設置され、上下の放熱部分間に間隔を設けたことを特徴とする。   In order to solve the above-mentioned problem, the invention according to claim 1 is a semiconductor cooling device housed in a power conversion device installed under the floor of a railway vehicle, wherein semiconductor elements are connected in series, and both ends thereof are DC terminals. The semiconductor element constituting the upper arm side of the power conversion circuit for one phase whose intermediate connection point is the AC terminal is attached to one surface of the heat receiving part of one cooler, and the semiconductor element constituting the lower arm side is attached to another Attached to one surface of the heat receiving part of one cooler, these two coolers are arranged side by side in the vertical direction, and the heat dissipating part of these coolers is installed open to the outside of the body side of the device housing. In addition, an interval is provided between the upper and lower heat radiation portions.

請求項１に記載の発明によると、上下の放熱部間に間隔を設けているので、複数個並んだ冷却器の後位側でも新鮮な走行風が得られ、後位側の半導体素子の温度上昇を抑制することができるので、従来のように、進行方向前位の冷却器放熱部には走行風が充分あたるが後位側の冷却器になるにつれ走行風の風量、風速は極端に低下しなくなる。   According to the first aspect of the present invention, since the space is provided between the upper and lower heat dissipating portions, fresh running air can be obtained even on the rear side of the plurality of arranged coolers, and the temperature of the semiconductor element on the rear side can be obtained. Since the rise can be suppressed, as in the past, the cooler heat radiation part at the front in the direction of travel has sufficient running wind, but the air volume and wind speed of the running wind are extremely reduced as the rear cooler is used. No longer.

請求項２に記載の発明は、鉄道車両床下に設置され、独立して運転可能な複数群の電力変換回路を有する電力変換装置内に収納される半導体冷却装置において、直列に半導体素子が接続され、その両端が直流端子、中間接続点が交流端子となる１相分の電力変換回路の上アーム側を構成する半導体素子を１個の冷却器の受熱部の一面に取付け、下アーム側を構成する半導体素子を別の１個の冷却器の受熱部の一面に取付け、さらにこの面の反対側の面に、異なる群の１相分の半導体素子を上アーム側半導体素子と下アーム側半導体素子を別個の冷却器に取付け、これら２個の冷却器を上下方向に並べて配置すると共に、これら冷却器の放熱部分は装置筐体の車体側方側に外気に開放されて設置され、上下の放熱部分間に間隔を設けたことを特徴とする。   According to a second aspect of the present invention, there is provided a semiconductor cooling device that is installed under the floor of a railway vehicle and housed in a power conversion device having a plurality of groups of power conversion circuits that can be operated independently, wherein semiconductor elements are connected in series. A semiconductor element constituting the upper arm side of the power conversion circuit for one phase whose both ends are DC terminals and the intermediate connection point is an AC terminal is mounted on one surface of the heat receiving part of one cooler, and the lower arm side is constituted A semiconductor element to be mounted is attached to one surface of the heat receiving part of another cooler, and further, a semiconductor element for one phase of a different group is provided on the surface opposite to this surface, the upper arm side semiconductor element and the lower arm side semiconductor element Are attached to separate coolers, and these two coolers are arranged side by side in the vertical direction, and the heat dissipating parts of these coolers are installed open to the outside on the side of the vehicle body of the device housing, Special feature is that there is a space between the parts. To.

請求項３に記載の発明は、請求項１または請求項２に記載の半導体冷却装置において、電力変換回路は２個の半導体素子を直列に接続した２レベル回路であり、１個の冷却器の受熱部の１個の面には１個の半導体素子が取り付けられることを特徴とする。   According to a third aspect of the present invention, in the semiconductor cooling device according to the first or second aspect, the power conversion circuit is a two-level circuit in which two semiconductor elements are connected in series. One semiconductor element is attached to one surface of the heat receiving unit.

請求項４に記載の発明は、請求項１ないし請求項３のいずれかに記載の半導体冷却装置において、半導体素子の取付けられた冷却器受熱部の面が、２個の冷却器間で同一平面状となるよう、２個の冷却器を上下方向に並べて配置したことを特徴とする。   According to a fourth aspect of the present invention, in the semiconductor cooling device according to any one of the first to third aspects, the surface of the cooler heat receiving portion to which the semiconductor element is attached is the same plane between the two coolers. The two coolers are arranged side by side in the vertical direction so as to have a shape.

請求項５に記載の発明は、請求項１ないし請求項４のいずれかに記載の半導体冷却装置において、冷却器は複数本の直管状のヒートパイプが上下方向に並び、それぞれのヒートパイプの一方の端部は冷却器の受熱部に挿入接続され、他方の端部は多数枚の板状の放熱フィンに貫通接続され、受熱部側が下方となるよう水平から５〜２０度傾斜して設置されるヒートパイプ式冷却器であって、放熱フィン部分が鉄道車両床下の車体側方側となるよう電力変換装置の外気と通ずる突出部分に収納され、上下方向に並べられた２つの放熱フィン部分の間は間隔が設けられていることを特徴とする。   According to a fifth aspect of the present invention, in the semiconductor cooling device according to any one of the first to fourth aspects, the cooler includes a plurality of straight tubular heat pipes arranged in the vertical direction, and one of the heat pipes. The other end is inserted and connected to the heat receiving part of the cooler, and the other end is penetrated and connected to a large number of plate-like heat radiating fins. A heat pipe type cooler that is housed in a projecting portion that communicates with the outside air of the power converter so that the heat radiating fin portion is on the side of the vehicle body under the floor of the railway vehicle, and two heat radiating fin portions arranged vertically An interval is provided between the gaps.

請求項６に記載の発明は、請求項５に記載の半導体冷却装置において、上下方向に並べた２個の冷却器は同一ではなく、ヒートパイプ長さ、ヒートパイプ本数、放熱フィン外形、放熱フィン枚数、放熱フィンピッチのいずれかが異なっていることを特徴とする。   According to a sixth aspect of the present invention, in the semiconductor cooling device according to the fifth aspect, the two coolers arranged in the vertical direction are not the same, and the heat pipe length, the number of heat pipes, the radiating fin outer shape, the radiating fin Either the number of sheets or the pitch of the radiating fins is different.

請求項７に記載の発明は、請求項５に記載の半導体冷却装置において、上下方向に並べた２個の冷却器の水平からの傾斜角度は同一ではなく、上方に設置される冷却器の方が、傾斜角度が大きいことを特徴とする。   According to a seventh aspect of the present invention, in the semiconductor cooling device according to the fifth aspect, the two coolers arranged in the vertical direction do not have the same inclination angle from the horizontal, and the cooler installed above is not the same. Is characterized by a large inclination angle.

本発明によれば、車両方向に複数個並んだ冷却器の後位側でも充分な走行風が得られ、上方の冷却器の下方からのあおりを少なくすることにより、半導体素子の温度上昇を抑制し信頼性を向上できる。後位側の冷却条件が向上することにより、放熱フィンの小形化が図れ、電力変換装置の小形・軽量化を図れる。   According to the present invention, sufficient running wind is obtained even on the rear side of a plurality of coolers arranged in the vehicle direction, and the temperature rise of the semiconductor element is suppressed by reducing the tilt from the lower side of the upper cooler. Reliability can be improved. By improving the cooling conditions on the rear side, the size of the heat dissipating fin can be reduced, and the power converter can be reduced in size and weight.

本発明では半導体冷却装置内の冷却器を上下に分離し、電力変換回路の上アーム側の半導体素子用の冷却器と下アーム側の半導体素子用の冷却器とを別個の冷却器で分離した構成とし、上下の放熱フィン群間に間隔を設けることで、この間隔部分を走行風の流路とし後位側冷却器の放熱フィンへも充分な走行風が流れるように構成している。   In the present invention, the cooler in the semiconductor cooling device is separated into upper and lower parts, and the cooler for the semiconductor element on the upper arm side and the cooler for the semiconductor element on the lower arm side are separated by separate coolers. By providing a space between the upper and lower radiating fin groups, this space is used as a flow path for the traveling air so that sufficient traveling air flows to the radiating fins of the rear cooler.

本発明の実施例１（請求項１，３，４，５に対応）の電力変換装置を図１（ａ），（ｂ），（ｃ）を用いて説明する。図１（ａ）は従来の図６（ａ）に対応する図、図１（ｂ）は従来の図６（ｂ）に対する図、図１（ｃ）は同図（ａ）の車体を取り除いた状態の平面図である。   A power conversion apparatus according to Embodiment 1 (corresponding to claims 1, 3, 4 and 5) of the present invention will be described with reference to FIGS. 1 (a), (b) and (c). FIG. 1 (a) is a view corresponding to FIG. 6 (a), FIG. 1 (b) is a view corresponding to FIG. 6 (b), and FIG. 1 (c) is the vehicle body of FIG. It is a top view of a state.

図に示すように、本実施例は上アームを構成する半導体素子３を１個の冷却器４の受熱部５に取付け、素子と冷却器の１対の構成となるものを図のユニットの上方に配置し、もう一方の半導体素子を他の１個の受熱部に取付け１対の構成となるものを図のユニットの下方に配置し、上下の位置関係となる半導体素子は同一平面状の位置関係となり、それぞれの半導体素子を直列に接続することにより２レベル回路構成となる。そして、上方に配置する冷却器の放熱部と下方に配置する冷却器の放熱部との間に図のように間隔を有する構成としている。   As shown in the figure, in this embodiment, the semiconductor element 3 constituting the upper arm is attached to the heat receiving portion 5 of one cooler 4, and a pair of elements and cooler is arranged above the unit in the figure. The other semiconductor element is attached to the other one heat receiving part, and a pair of components is arranged below the unit in the figure, and the semiconductor elements in the upper and lower positional relationship are located on the same plane. A two-level circuit configuration is obtained by connecting the respective semiconductor elements in series. And it is set as the structure which has a space | interval like a figure between the thermal radiation part of the cooler arrange | positioned above, and the thermal radiation part of the cooler arrange | positioned below.

各半導体素子に電気を印加し、ゲートアンプからの信号により電気が流れ、スイッチングし素子は発熱する。発熱した熱は、半導体素子を取付けている冷却器の受熱部５→ヒートパイプ７→フィン６へと熱伝導し、フィン６より大気へ放熱される。   Electricity is applied to each semiconductor element, and electricity flows according to a signal from the gate amplifier, and the element is heated by switching. The generated heat is thermally conducted from the heat receiving portion 5 to the heat pipe 7 to the fin 6 of the cooler to which the semiconductor element is attached, and is radiated from the fin 6 to the atmosphere.

本実施例によると、フィン６から大気への放熱に当たり、一般的に進行方向前位の冷却器は外気の新鮮な走行風を受け効率良く放熱するが、進行方向後位の冷却器は前位からの放熱により入熱温度が高くなり冷却条件が悪くなるが、本実施例によれば上下の冷却器の間隙に新鮮な外気が通過し、前位の放熱の影響が少なくなることから、後位側の温度上昇を抑制することができる。   According to the present embodiment, when the heat is dissipated from the fins 6 to the atmosphere, the cooler at the front in the traveling direction generally receives fresh traveling wind of the outside air and efficiently radiates the heat, but the cooler at the rear in the traveling direction is the front. However, according to this embodiment, fresh outside air passes through the gap between the upper and lower coolers and the influence of the previous heat dissipation is reduced. The temperature rise on the rear side can be suppressed.

本発明の実施例２（請求項２に対応）の電力変換装置を図２（ａ），（ｂ），（ｃ）を用いて説明する。
図２（ａ）は半導体冷却ユニットが電力変換装置に組み込まれた状態を示す図１（ａ）に対応し、図２（ｂ）は、図１（ｂ）に対応し、図２（ｃ）は図１（ｃ）に対応する図である。 A power conversion apparatus according to Embodiment 2 (corresponding to claim 2) of the present invention will be described with reference to FIGS.
2 (a) corresponds to FIG. 1 (a) showing a state in which the semiconductor cooling unit is incorporated in the power converter, FIG. 2 (b) corresponds to FIG. 1 (b), and FIG. These are figures corresponding to FIG.1 (c).

本実施例は実施例１と同様に冷却器に半導体素子を取付けるが、冷却器受熱ブロックの反対面には他の相の半導体素子を取付ける。つまり、１つの冷却器に異なる２つの相の半導体素子を取付けた構成とする。上方に配置する冷却器の放熱部と下方に配置する冷却器の放熱部との間に間隔を設けた構成であることは、実施例１と同様であり、また半導体素子から放熱までの作用も実施例１と同様であるが、パイプへの入熱が両面からの為効率は実施例１より向上する。上下の冷却器の間には間隙を設けているので、後位側の温度上昇を抑制する効果がある他、２相を１つにまとめていることで、小形・軽量化が図れるという効果もある。   In the present embodiment, semiconductor elements are attached to the cooler in the same manner as in the first embodiment, but semiconductor elements of other phases are attached to the opposite surface of the cooler heat receiving block. That is, it is set as the structure which attached the semiconductor element of two different phases to one cooler. The configuration in which a space is provided between the heat dissipating part of the cooler disposed above and the heat dissipating part of the cooler disposed below is the same as that of the first embodiment, and the operation from the semiconductor element to heat dissipation is also the same. Although it is the same as that of Example 1, since the heat input into a pipe is from both sides, efficiency improves from Example 1. Since there is a gap between the upper and lower coolers, it has the effect of suppressing the temperature rise on the rear side, and by combining the two phases into one, it can also be reduced in size and weight. is there.

本発明の実施例３（請求項６に対応）の電力変換装置を図３を用いて説明する。
図３は半導体冷却ユニットが電力変換装置に組み込まれた状態を示す図１（ａ）に対応する図である。 A power converter according to a third embodiment (corresponding to claim 6) of the present invention will be described with reference to FIG.
FIG. 3 is a view corresponding to FIG. 1A showing a state in which the semiconductor cooling unit is incorporated in the power conversion device.

本実施例は実施例１と同様に、冷却器に半導体素子を取付け、冷却器放熱部上下に間隙を設けた構成であるが、上方の冷却器の放熱部の長さを設置スペース限界に合わせて下方より長くし、下方の冷却器よりパイプ長は長く、フィン枚数が多い構成である。   As in Example 1, this example has a structure in which a semiconductor element is attached to a cooler and a gap is provided above and below the cooler heat dissipating part, but the length of the heat dissipating part of the upper cooler is adjusted to the installation space limit. The pipe length is longer than the lower cooler, and the number of fins is larger.

半導体素子から放熱までの作用は実施例１と同様であるが、上方の放熱部が長くなり、フィン枚数が多いことから、放熱面積は実施例１より増加する。一般的に上方の冷却器は、下方からの放熱の影響などもあり、下方の冷却器より温度条件的に厳しいが、放熱面積の増加により上方の冷却器の温度上昇を抑制する効果がある。   Although the operation from the semiconductor element to heat radiation is the same as that in the first embodiment, the heat radiation area on the upper side becomes longer and the number of fins is larger, so that the heat radiation area is larger than that in the first embodiment. In general, the upper cooler is affected by heat radiation from the lower side and is stricter in terms of temperature than the lower cooler, but has an effect of suppressing the temperature rise of the upper cooler by increasing the heat radiation area.

本発明の実施例４（請求項７に対応）の電力変換装置を図４を用いて説明する。
図４は半導体冷却ユニットが電力変換装置に組み込まれた状態を示す図１（ａ）に対応する図である。 A power conversion apparatus according to Embodiment 4 (corresponding to claim 7) of the present invention will be described with reference to FIG.
FIG. 4 is a view corresponding to FIG. 1A showing a state in which the semiconductor cooling unit is incorporated in the power conversion device.

本実施例は実施例１と同様に、冷却器に半導体素子を取付け、冷却器放熱部上下に間隙を設けた構成であるが、上方の冷却器の取付け角度が下方の冷却器より大きくなるように設置されている。   In the present embodiment, as in the first embodiment, a semiconductor element is attached to the cooler and a gap is provided above and below the cooler heat radiation part, but the upper cooler is attached at a larger angle than the lower cooler. Is installed.

半導体素子から放熱までの作用は実施例１と同様である他に、上方の冷却器の取付け角度が大きいことからパイプの最大熱輸送量が大きくなり、放熱部上下の間隙の寸法が大きくなることから走行風の通風効率が向上し、また上下の半導体素子が接近している。一般的に上方の冷却器は、下方からの放熱の影響などもあり、下方の冷却器より温度条件的に厳しいが、本実施例では最大熱輸送量が大きくなるので上方の冷却器の温度上昇を抑制する効果があり、走行風が受熱部寄りにも効率良く入風するので、後位側の冷却器の温度上昇抑制する効果があり、また半導体素子間の主回路配線距離が短縮するので低インダクタンス化より電気品の削減又は小形化の効果がある。   The operation from the semiconductor element to the heat dissipation is the same as that of the first embodiment, and the maximum heat transport amount of the pipe is increased due to the large mounting angle of the upper cooler, and the size of the gap above and below the heat dissipation portion is increased. Therefore, the ventilation efficiency of the traveling wind is improved, and the upper and lower semiconductor elements are close to each other. Generally, the upper cooler is more severe in terms of temperature than the lower cooler due to heat radiation from the lower side, etc., but in this embodiment, the maximum heat transport amount is large, so the temperature rise of the upper cooler Since the running wind also enters the heat receiving part efficiently, it has the effect of suppressing the temperature rise of the rear cooler, and the main circuit wiring distance between the semiconductor elements is shortened. There is an effect of reduction or downsizing of electrical products than low inductance.

本発明の実施例１の電力変換装置で、同図（ａ）は、半導体冷却ユニットが電力変換装置に組み込まれた状態を示した図、同図（ｂ）は、同図（ａ）を車側より見た部分図、同図（ｃ）は、同図（ａ）の車体を取り除いた状態の平面図。1A is a diagram illustrating a state in which a semiconductor cooling unit is incorporated in a power conversion device, and FIG. 1B is a diagram illustrating the power conversion device according to the first embodiment of the present invention. The partial figure seen from the side and the figure (c) are the top views of the state which removed the vehicle body of the figure (a). 本発明の実施例２の電力変換装置で、同図（ａ）は、半導体冷却ユニットが電力変換装置に組み込まれた状態を示した図、同図（ｂ）は、同図（ａ）の車側より見た部分図、同図（ｃ）は、同図（ａ）の車体を取り除いた状態の平面図。FIG. 5A is a diagram showing a state where a semiconductor cooling unit is incorporated in a power conversion device, and FIG. 5B is a vehicle in FIG. The partial figure seen from the side and the figure (c) are the top views of the state which removed the vehicle body of the figure (a). 本発明の実施例３の電力変換装置で、半導体冷却ユニットが電力変換装置に組み込まれた状態を示した図。The figure which showed the state by which the semiconductor cooling unit was integrated in the power converter device by the power converter device of Example 3 of this invention. 本発明の実施例４の電力変換装置で、半導体冷却ユニットが電力変換装置に組み込まれた状態を示した図。The figure which showed the state by which the semiconductor cooling unit was integrated in the power converter device by the power converter device of Example 4 of this invention. 車体床下に取付けた従来の電力変換装置を示し、同図（ａ）は鳥瞰図、同図（ｂ）は同図（ａ）のＸ−Ｘ断面図。The conventional power converter attached to the underbody floor is shown, the figure (a) is a bird's-eye view, the figure (b) is the XX sectional view of the figure (a). 従来の電力変換装置を示し、同図（ａ）は、半導体冷却ユニットが電力変換装置に組み込まれた状態を示した図、同図（ｂ）は、同図（ａ）を車側より見た部分図。The conventional power converter is shown, The figure (a) is the figure which showed the state in which the semiconductor cooling unit was integrated in the power converter, The figure (b) looked at the figure (a) from the vehicle side. Partial view.

符号の説明Explanation of symbols

１…車体、２…電力変換装置、３…半導体素子、４…冷却器、５…受熱部、６…放熱フィン、７…ヒートパイプ、８…設置スペース限界、９…フィルタコンデンサ、１０…ゲートアンプ、１１…車側保護カバー。   DESCRIPTION OF SYMBOLS 1 ... Car body, 2 ... Power converter device, 3 ... Semiconductor element, 4 ... Cooler, 5 ... Heat receiving part, 6 ... Radiation fin, 7 ... Heat pipe, 8 ... Installation space limit, 9 ... Filter capacitor, 10 ... Gate amplifier 11 ... Car side protective cover.

Claims (7)

鉄道車両床下に設置される電力変換装置内に収納される半導体冷却装置において、直列に半導体素子が接続され、その両端が直流端子、中間接続点が交流端子となる１相分の電力変換回路の上アーム側を構成する半導体素子を１個の冷却器の受熱部の一面に取付け、下アーム側を構成する半導体素子を別の１個の冷却器の受熱部の一面に取付け、これら２個の冷却器を上下方向に並べて配置すると共に、これら冷却器の放熱部分は装置筐体の車体側方側に外気に開放されて設置され、上下の放熱部分間に間隔を設けたことを特徴とする半導体冷却装置。   In a semiconductor cooling device housed in a power conversion device installed under the floor of a railway vehicle, a power conversion circuit for one phase in which semiconductor elements are connected in series, both ends of which are a DC terminal and an intermediate connection point is an AC terminal A semiconductor element constituting the upper arm side is attached to one surface of the heat receiving portion of one cooler, and a semiconductor element constituting the lower arm side is attached to one surface of the heat receiving portion of another one cooler. The coolers are arranged side by side in the vertical direction, and the heat dissipating parts of these coolers are installed open to the outside on the side of the body of the apparatus housing, and a space is provided between the upper and lower heat dissipating parts. Semiconductor cooling device. 鉄道車両床下に設置され、独立して運転可能な複数群の電力変換回路を有する電力変換装置内に収納される半導体冷却装置において、直列に半導体素子が接続され、その両端が直流端子、中間接続点が交流端子となる１相分の電力変換回路の上アーム側を構成する半導体素子を１個の冷却器の受熱部の一面に取付け、下アーム側を構成する半導体素子を別の１個の冷却器の受熱部の一面に取付け、さらにこの面の反対側の面に、異なる群の1相分の半導体素子を上アーム側半導体素子と下アーム側半導体素子を別個の冷却器に取付け、これら２個の冷却器を上下方向に並べて配置すると共に、これら冷却器の放熱部分は装置筐体の車体側方側に外気に開放されて設置され、上下の放熱部分間に間隔を設けたことを特徴とする半導体冷却装置。   In a semiconductor cooling device housed in a power conversion device having a plurality of groups of power conversion circuits that can be operated independently and installed under the floor of a railway vehicle, semiconductor elements are connected in series, both ends of which are DC terminals and intermediate connections A semiconductor element constituting the upper arm side of the power conversion circuit for one phase whose point is an AC terminal is attached to one surface of the heat receiving part of one cooler, and another semiconductor element constituting the lower arm side is attached to another one Attach to one side of the heat receiving part of the cooler, and attach the semiconductor elements for one phase of different groups on the opposite side of this side to the separate cooler with the upper arm side semiconductor element and the lower arm side semiconductor element. Two coolers are arranged side by side in the vertical direction, and the heat dissipating parts of these coolers are installed open to the outside of the vehicle body side of the device housing, and a space is provided between the upper and lower heat dissipating parts. A semiconductor cooling device. 請求項１または請求項２に記載の半導体冷却装置において、電力変換回路は２個の半導体素子を直列に接続した２レベル回路であり、１個の冷却器の受熱部の１個の面には１個の半導体素子が取り付けられることを特徴とする半導体冷却装置。   3. The semiconductor cooling device according to claim 1, wherein the power conversion circuit is a two-level circuit in which two semiconductor elements are connected in series, and is provided on one surface of the heat receiving portion of one cooler. A semiconductor cooling device to which one semiconductor element is attached. 請求項１ないし請求項３のいずれかに記載の半導体冷却装置において、半導体素子の取付けられた冷却器受熱部の面が、２個の冷却器間で同一平面状となるよう、２個の冷却器を上下方向に並べて配置したことを特徴とする半導体冷却装置。   4. The semiconductor cooling device according to claim 1, wherein the surface of the cooler heat receiving portion to which the semiconductor element is attached is in the same plane between the two coolers. Semiconductor cooling device characterized in that the vessel is arranged in the vertical direction. 請求項１ないし請求項４のいずれかに記載の半導体冷却装置において、冷却器は複数本の直管状のヒートパイプが上下方向に並び、それぞれのヒートパイプの一方の端部は冷却器の受熱部に挿入接続され、他方の端部は多数枚の板状の放熱フィンに貫通接続され、受熱部側が下方となるよう水平から５〜２０度傾斜して設置されるヒートパイプ式冷却器であって、放熱フィン部分が鉄道車両床下の車体側方側となるよう電力変換装置の外気と通ずる突出部分に収納され、上下方向に並べられた２つの放熱フィン部分の間は間隔が設けられていることを特徴とする半導体冷却装置。   5. The semiconductor cooling device according to claim 1, wherein the cooler includes a plurality of straight tubular heat pipes arranged in a vertical direction, and one end portion of each heat pipe is a heat receiving portion of the cooler. A heat pipe type cooler installed at an angle of 5 to 20 degrees with respect to the horizontal so that the heat receiving portion side is downward, with the other end portion being penetrated and connected to a plurality of plate-like heat radiation fins. The heat radiating fin portion is housed in a protruding portion that communicates with the outside air of the power converter so that the heat radiating fin portion is on the side of the vehicle body under the railcar floor, and there is a gap between the two heat radiating fin portions arranged in the vertical direction. A semiconductor cooling device. 請求項５に記載の半導体冷却装置において、上下方向に並べた２個の冷却器は同一ではなく、ヒートパイプ長さ、ヒートパイプ本数、放熱フィン外形、放熱フィン枚数、放熱フィンピッチのいずれかが異なっていることを特徴とする半導体冷却装置。   6. The semiconductor cooling device according to claim 5, wherein the two coolers arranged in the vertical direction are not the same, and any one of the heat pipe length, the number of heat pipes, the shape of the heat radiating fins, the number of heat radiating fins, and the heat radiating fin pitch is selected. A semiconductor cooling device characterized by being different. 請求項５に記載の半導体冷却装置において、上下方向に並べた２個の冷却器の水平からの傾斜角度は同一ではなく、上方に設置される冷却器の方が、傾斜角度が大きいことを特徴とする半導体冷却装置。

6. The semiconductor cooling device according to claim 5, wherein the two inclined coolers arranged in the vertical direction have the same inclination angle from the horizontal, and the cooler installed above has a larger inclination angle. A semiconductor cooling device.

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CN1625030A (en) 2005-06-08
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JP4202887B2 (en) 2008-12-24

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