JP2005108934A - Aligner and exposure method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide aligner or the like which is equipped with blind (proximity blind), capable of restraining generation of contamination from blind drive mechanism. <P>SOLUTION: Blind mechanism 30 is fixed to a reticle stage 3 and is provided with two Y-direction blind boards 31 movable to scanning direction (Y direction) of exposure region CP, and two X-direction blind boards 33 movable to direction (X direction) which intersects perpendicularly the scanning direction. Each of the blind boards is driven by drive mechanism 41, 43 so that shadow of each edge settled in pin hole defect-free region PFA. During exposure, the blind mechanism 30 moves together with the reticle stage 3, while being fixed to the reticle 2, so that generation of contamination from the driving mechanism 41, 43 can be prevented. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an exposure apparatus and an exposure method using energy rays such as EUV light (Extreme Ultra Violet light, extreme ultraviolet light), an ultraviolet laser, and a charged particle beam. In particular, the present invention relates to an exposure apparatus equipped with a proximity blind mechanism for drawing a pattern area of an original.

An EUV exposure apparatus will be described as an example.
The illumination optical system and the projection optical system of the EUV exposure apparatus are composed of optical elements composed of reflection mirrors. For example, in a reflection mirror coated with a Mo / Si multilayer film, the vertical reflectance of EUV light is 70% at the maximum. In an oblique incidence mirror that is being considered for use as a mirror constituting an illumination optical system, the reflectance is assumed to be 80 to 90%. In the illumination optical system and the projection optical system, a plurality of mirrors (for example, 4, 6, or 8 in the projection optical system) are used, and even when an oblique incidence mirror having a high reflectance is used, The reflectivity of the entire optical system becomes considerably low.
For this reason, it is required to minimize the number of reflection mirrors used in the illumination optical system and the projection optical system.

  By the way, the exposure apparatus is provided with a blind mechanism in order to prevent illumination light from hitting outside the pattern area on the reticle. The portion outside the pattern region on the reticle is covered with an absorption film, and ideally is a portion that does not reflect illumination light, but there may be pinhole defects or the like in the absorption film. When the illumination light hits such a defect, the illumination light may be reflected by the defect, guided to the wafer through the projection optical system, and transferred as a defect pattern on the wafer. This phenomenon is called “fogging”. In order to prevent this fogging, the exposure area of the original is limited (covering or hiding the outside of the exposure area with a blind) by a blind mechanism to prevent the illumination light from hitting outside the pattern area.

  As described above, an area (pinhole defect free area) in which no pinhole defect is guaranteed is provided around the pattern area of the reticle. In this region, a film that does not allow exposure light to pass through with a conventional light exposure machine and does not reflect EUV light with an EUV exposure machine is formed. In order to ensure that there are no pinhole defects in this area, it is necessary to carefully inspect the area and correct any defects found. In consideration of such inspection and correction work, it is preferable that the size of the region is small. Naturally, if the pinhole defect free region is widened, the cost of reticle fabrication increases.

A typical example of the blind mechanism of the exposure apparatus will be described.
In mainstream light exposure machines (using i-line, KrF, ArF, etc. as exposure light), generally a surface optically conjugate with the reticle surface, that is, an intermediate imaging surface is provided in the middle of the illumination optical system. The blind mechanism is arranged in The blind mechanism includes a fixed blind that determines the outer shape of the illumination beam (illumination beam) and a movable or scanning movable blind that limits the exposure area on the reticle.

  The fixed blind is for determining the shape of the illumination beam irradiated on the reticle. Dynamic illuminance uniformity can be obtained by adjusting in advance the length of the illumination beam in the short direction (width in the exposure scanning direction).

  The movable blind can be moved in accordance with the pattern area of the reticle or as the dimension of the exposure area of the reticle to be used changes. A typical movable blind in the case of scanning exposure is synchronized with a reticle in the X direction and two X direction blind members that are movable in the non-scanning direction (direction orthogonal to the scanning direction, X direction). It consists of two Y-direction blind members that move.

The X-direction blind member moves relative to the reticle when exchanging the reticle in accordance with the size (width) of the exposure area of various reticles. Then, the position is adjusted so that the shadow of the edge of the blind member falls within the pinhole defect free area outside the exposure area. Once the position of the X-direction blind member is determined in accordance with the size of the exposure area of the reticle used for exposure, the X-direction blind member does not move until it is replaced with another reticle.
The position of the Y-direction blind member is also adjusted so that the shadow of the edge of the blind member falls within the pinhole defect free region. The Y-direction blind member moves in synchronization with the movement of the reticle.
By providing such a movable blind, the pinhole defect free area is made the minimum necessary size.

Japanese Patent Laid-Open No. 11-219900

  In an EUV exposure machine, if a blind mechanism similar to that of a conventional light exposure machine is to be provided, at least three mirrors are required for the minimum mirror configuration in order to create a plane conjugate with the reticle in the illumination optical system. Need to add. If a mirror is added in this way, the reflectivity of the entire optical system is further reduced, and the throughput is greatly reduced. For this reason, it is not realistic to provide an EUV exposure machine with an intermediate imaging point installation type blind mechanism similar to the light exposure machine.

  Accordingly, it is considered promising to adopt a proximity blind that can be arranged near the reticle of the exposure apparatus as the blind mechanism (see, for example, Patent Document 1). This proximity blind includes a fixed blind fixed with respect to the projection optical system and a movable blind that moves in accordance with the movement and dimension change of the reticle. When the movable blind is scanned in synchronization with the reticle, foreign matter from the drive system for driving the blind tends to be generated. The blinds are arranged in close proximity to the reticle, and the reticle for EUV exposure does not have a pellicle that protects the pattern surface like the reticle for optical exposure. This makes it easier for foreign matter to adhere to the reticle. If foreign matter adheres to the reticle, pattern transfer defects or the like may occur. Therefore, it is necessary to reduce the generation of foreign matter as much as possible.

  The present invention has been made in view of the above problems, and an object thereof is to provide an exposure apparatus provided with a blind (proximity blind) capable of suppressing the generation of foreign matter from the blind drive mechanism.

In order to solve the above problems, a first exposure apparatus of the present invention includes a mask stage that moves by mounting a mask (including a reticle) on which a pattern to be transferred is mounted on a sensitive substrate; An exposure apparatus comprising: a sensitive substrate stage that is mounted and moved; and an exposure optical system that transfers the pattern, wherein the exposure is performed while scanning the mask and the sensitive substrate with respect to the optical system. And a movable blind mounted on the mask stage for limiting the exposure area.
In the present invention, the blind can be moved together with the mask stage while being fixed to the mask during exposure.

  Since the blind does not move during exposure, the generation of foreign matter from the blind drive system can be prevented. Further, during exposure, the illumination beam scans an exposure area previously limited by a blind mechanism, so that the illumination beam does not irradiate an area where a pinhole may exist, and improper exposure does not occur. Further, since the blind is moved in accordance with the size of the exposure area, it is possible to deal with various masks having different exposure area sizes.

  In the present invention, the blinds are two Y-direction blind plates movable in the scanning direction (Y direction) of the exposure area, and two sheets movable in a direction (X direction) orthogonal to the scanning direction of the exposure area. X-direction blind plate, a mechanism for driving the Y-direction blind plate, and a mechanism for driving the X-direction blind plate, whereby both Y-direction end edges and X-direction end edges of exposure regions of various sizes are provided. A border can be drawn.

  In the present invention, on the mask stage, the Y-direction blind plate and the X-direction blind plate are partially overlapped, and the Y-direction blind plate drive mechanism and the X-direction blind plate drive mechanism are not overlapped. If this is done, the two blind plates can be driven without causing interference. Further, both blind plates can be arranged at relatively close positions (at substantially the same height position in the optical axis direction), which is preferable from the viewpoint of optical performance.

  A second exposure apparatus of the present invention includes a mask stage that moves by mounting a mask (including a reticle) on which a pattern to be transferred is transferred on a sensitive substrate, a sensitive substrate stage that moves by mounting the sensitive substrate, An exposure optical system for transferring the pattern, and exposing the optical system while scanning the mask and a sensitive substrate with respect to the optical system, wherein an opening for limiting an exposure area of the mask is provided. In addition, a blind that can be attached to and detached from the mask stage is provided.

  Moving the blind to limit the exposure area at the time of exposure by providing an opening in the blind that matches the size of the exposure area of the mask, that is, by making the blind tailored to the mask. There is no need to do. Further, if the blind can be attached to and removed from the mask stage, the blind will not be an obstacle when performing pre-exposure operations such as mask positioning using alignment marks provided on the mask. Note that a transfer robot that transfers the mask can be used to attach and remove the blinds.

A third exposure apparatus of the present invention includes a mask stage that moves by mounting a mask (including a reticle) on which a pattern to be transferred is mounted on a sensitive substrate, a sensitive substrate stage that moves by mounting the sensitive substrate, An exposure optical system for transferring the pattern, and exposing the optical system while scanning the mask and a sensitive substrate with respect to the optical system, wherein the exposure area on the mask is limited to the mask. The mask-specific blind provided with an opening is fixed.
In the present invention, the blind preferably does not cover a portion of a mark (alignment mark, identification ID mark, etc.) formed on the mask for positioning or identifying the mask.

  In this example as well, it is not necessary to move the blind to limit the exposure area during exposure. In addition, if marks for positioning and identifying the mask are exposed from the blinds, pre-exposure operations such as mask positioning can be performed after the mask on which the blinds are fixed is placed on the mask stage. it can.

  The first exposure method of the present invention is a method in which a pattern to be transferred is formed on a sensitive substrate, and exposure is performed while scanning a mask (including a reticle) mounted on a mask stage and the sensitive substrate. And after performing pre-exposure operations such as positioning of the mask on the mask stage, the exposure area on the mask is limited by a movable blind mounted on the mask stage, and then exposure is performed. Features.

  The second exposure method of the present invention is a method in which a pattern to be transferred is formed on a sensitive substrate, and exposure is performed while scanning a mask (including a reticle) mounted on a mask stage and the sensitive substrate. After performing pre-exposure operations such as positioning of the mask on the mask stage, the mask-specific blind provided with an opening for limiting the exposure area of the mask is mounted on the mask, and thereafter It is characterized by exposing.

  The third exposure method of the present invention is a method in which a pattern to be transferred is formed on a sensitive substrate, and exposure is performed while scanning a mask (including a reticle) mounted on a mask stage and the sensitive substrate. The mask is exposed in a state where a mask-specific blind provided with an opening for limiting an exposure region on the mask is fixed.

  As is apparent from the above description, according to the present invention, since the blind is fixed to the reticle stage or the reticle, it moves together with the reticle stage during exposure of the reticle, and the blind member is not driven. For this reason, generation | occurrence | production of the foreign material from a blind drive system can be prevented.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
First, an example of an EUV exposure apparatus will be described.
FIG. 3 is a diagram schematically showing a configuration of an EUV exposure apparatus (four-projection system) according to the embodiment of the present invention.
The EUV exposure apparatus includes an illumination system IL including a light source. EUV light radiated from the illumination system IL (generally, light having a wavelength of 5 to 20 nm is used, specifically, light having a wavelength of 13.5 nm is used) is reflected by the folding mirror 1 to be reticle ( (Mask) 2 is irradiated.

  The reflective reticle 2 is held by suction on a reticle stage (mask stage) 3 with the pattern surface facing downward in the direction of gravity. The reticle stage 3 has a stroke of 100 mm or more in the scanning direction (Y direction), has a minute stroke in a direction orthogonal to the scanning direction (X direction), and also has a minute stroke in the optical axis direction (Z direction). . The position in the XY direction is monitored with high accuracy by a laser interferometer (not shown), and the position in the Z direction is monitored by a reticle focus sensor including a reticle focus light transmission system 4 and a reticle focus light reception system 5.

  A blind mechanism 30 is disposed on the lower surface of the reticle stage 3. The configuration of the blind mechanism 30 will be described later.

  The EUV light reflected by the reticle 2 enters the lower projection optical column 14 in the drawing. This EUV light includes information on a circuit pattern drawn on the reticle 2. The reticle 2 is formed with a multilayer film (for example, Mo / Si or Mo / Be) that reflects EUV light, and is patterned on the multilayer film with or without an adsorption layer (for example, Ni or Al). .

  The EUV light that has entered the optical barrel 14 is reflected by the first mirror 6, then sequentially reflected by the second mirror 7, the third mirror 8, and the fourth mirror 9, and finally perpendicular to the wafer 10. Is incident on. The reduction magnification of the projection optical system including these mirrors is, for example, 1/4 or 1/5. In this figure, there are four mirrors. A. It is effective to increase the number of mirrors to 6 or 8 in order to further increase. An alignment off-axis microscope 15 is disposed in the vicinity of the lens barrel 14.

  The wafer 10 is placed on the wafer stage 11. The wafer stage 11 can move in a plane (XY plane) orthogonal to the optical axis, and the movement stroke is, for example, 300 to 400 mm. The wafer stage 11 can move up and down with a minute stroke in the optical axis direction, and the position in the optical axis direction (Z direction position) is monitored by a wafer autofocus sensor comprising a wafer autofocus light transmission system 12 and a wafer autofocus light reception system 13. Has been. The position in the XY direction of the wafer stage 11 is monitored with high accuracy by a laser interferometer (not shown). In the exposure operation, the reticle stage 3 and the wafer stage 11 are synchronously scanned at the same speed ratio as the reduction magnification of the projection optical system, that is, 4: 1 or 5: 1.

Next, the blind mechanism 30 mounted on the exposure apparatus in FIG. 1 will be described.
FIG. 1 is a view showing the shape of a blind mechanism mounted on an exposure apparatus according to an embodiment of the present invention. FIG. 1 (A) is a plan view and FIG. 1 (B) is a side view.
First, the configuration of the reticle 2 will be described.
The reticle 2 is adsorbed to a chuck 21 (see FIG. 1B) provided on the wafer stage 3 so that the pattern surface faces downward. At the center of the pattern surface of the reticle 2, a rectangular pattern region CP (lattice hatched portion) is provided. Around the pattern region CP, a pinhole defect free region PFA (an oblique hatched portion) is provided in a frame shape. The pinhole defect free area PFA is an area that is guaranteed not to have pinhole defects as described above. The pattern area CP is scan-exposed with an illumination beam IB shaped like a ring with a pattern shaping opening (not shown). The illumination beam IB is fixed with respect to the optical axis of the projection optical system of the exposure apparatus, but is scanned on the pattern region CP when the reticle 2 scans in the Y direction. The wafer 10 is also scanned in synchronization with the reticle 2, and the pattern of the pattern area CP of the reticle 2 is projected onto the wafer 10.

Next, the blind mechanism 30 will be described.
The blind mechanism 30 includes a pair of Y-direction blind plates 31A and 31B movable in the scanning direction (Y direction) and a pair of X-direction blind plates 33A and 33B movable in a direction orthogonal to the scanning direction (X direction). . Both ends in the Y direction of the pattern area CP of the reticle 2 are defined by the Y direction blind plates 31, and both ends in the X direction are defined by the X direction blind plates 33. Each blind plate 31, 33 is made of a metal plate having a thickness of about 0.5 mm.

  The X-direction blind plate 33 and the Y-direction blind plate 31 are arranged apart from each other in the Z direction. In this example, as shown in FIG. 1B, the X-direction blind plate 33 is arranged immediately below the reticle 2, A Y-direction blind plate 31 is disposed below the X-direction blind plate 33. The distance between the pattern surface (lower surface) of the reticle 2 and the X-direction blind plate 33 is, for example, 1 to 2 mm.

  Each Y-direction blind plate 31 is moved in a direction approaching and separating from each other in the Y direction by drive mechanisms 41A and 41B provided on both side edges in the X direction on the lower surface of the reticle stage 3. Each X-direction blind plate 33 is moved in a direction approaching and separating from each other in the X direction by drive mechanisms 43A and 43B provided on both side edges in the Y direction on the lower surface of the reticle stage 3. As shown in FIG. 1A, each X-direction blind plate 33 and each Y-direction blind plate 31 overlap at four corners of the reticle stage 3. However, the drive mechanisms 43 and 41 of each blind plate are arranged along each side of the lower surface of the stage 3 and do not overlap.

2A and 2B are diagrams illustrating an example of a blind plate driving mechanism, in which FIG. 2A is a plan view and FIG. 2B is a side view. Here, the drive mechanism 43 of the X direction blind board 33 is demonstrated. The drive mechanism 41 of the Y-direction blind plate 31 has the same configuration.
The drive mechanism 43 includes, for example, two actuator stators 47 and four actuator movers 45. As the actuator, for example, an electromagnetic linear motor, an ultrasonic linear motor, or the like can be used. Each actuator stator 47 is made of, for example, a metal plate having a thickness of 0.1 mm, and is fixed to both side edges in the Y direction on the lower surface of the reticle stage 3. One actuator stator 47-1 is provided with two actuator movers 45-1 and 45-2, and the other actuator stator 47-2 is also provided with two actuator movers 45-3 and 45-. 4 is arranged.

Each blind plate 33 is arranged so as to span between the two stators 47-1 and 47-2. Then, both end portions of one blind plate 33A are fixed to a mover 45-1 on the stator 47-1 and a mover 45-3 on the stator 47-2. Both ends of the other blind plate 33B are fixed to a mover 45-2 on the stator 47-1 and a mover 45-4 on the stator 47-2. When the actuator is actuated, each moving element 45 moves along the stator 47, and each blind plate 33 moves in the length direction (X direction) of the stator 47.
With such a configuration, both blind plates can be arranged at substantially the same height with respect to the optical axis direction. For this reason, when the blind plates described later are positioned, the shadows of the edges of both blind plates are substantially the same, and positioning is easy.

Next, the operation of the blind mechanism 30 will be described.
When the reticle 2 is mounted on the reticle stage 3 or when the reticle 2 is exchanged, the blind plates 31 and 33 move in the farthest direction so that the reticle 2 is placed on the chuck 21 below the chuck 21 of the reticle stage 2. Leave a space for transportation. Then, after the reticle 2 is mounted on the chuck 21, the alignment of the reticle 2 and the measurement of the flatness of the reticle surface are performed while the blind plates 31 and 33 are moved in the farthest direction.

  Thereafter, as shown in FIG. 1, the X-direction blind plate driving mechanism 43 is driven, and the shadows of the edges of the X-direction blind plates 33 are pinholes at both ends in the X direction of the pattern region CP of the reticle 2. It is moved so as to be within the defect free area PFA. Further, the Y-direction blind plate driving mechanism 41 is driven so that the shadows of the edges of the Y-direction blind plates 31 also fall within the pinhole defect free areas PFA at both ends of the pattern area CP of the reticle 2 in the Y direction. Move to.

  In this state, scanning exposure is performed. At the time of scanning exposure, the reticle stage 3 moves in the Y direction, and the illumination beam IB scans the pattern region CP. Since the blind mechanism 30 is fixed to the reticle stage 3, it moves together with the reticle stage 3 in the Y direction. That is, since the blind mechanism 30 is not driven during scanning, the generation of foreign matter from the blind plate driving mechanisms 41 and 43 can be prevented. Further, during exposure, the illumination beam IB scans the pattern area CP limited by the blind mechanism 30, so that an area without a pinhole is reliably exposed.

Next, another embodiment of the present invention will be described.
4A and 4B are diagrams showing the configuration of the blind mechanism of the exposure apparatus according to the second embodiment of the present invention. FIG. 4A is a plan view and FIG. 4B is a side view.
The blind mechanism 50 in this example includes a frame-shaped blind plate 51. The size of the blind plate 51 is substantially equal to the size of the reticle 2. A rectangular opening 53 is formed at the center of the blind plate 51. The size of the opening 53 is determined in advance according to the size of the pattern region CP of the reticle 2. In other words, the blind plate 51 having the opening 53 that matches the size of the pattern region CP of the reticle 2 is made to order. Specifically, the size of the opening 53 is such that when the blind plate 51 is attached to the reticle stage 3, the edge of the opening 53 of the plate is a pinhole around the pattern region CP of the reticle 2 to be exposed. It is a dimension that fits in the defect-free area PFA.

  The blind plate 51 is detachably mounted on the reticle stage 3. When attached, the blind plate 51 and the reticle 2 are not in direct contact. Examples of means for fixing the plate 51 to the reticle stage 2 include an electrostatic chuck and a mechanical chuck.

  At the time of exposure, first, the reticle 2 is mounted on the chuck 21 of the stage 3 to perform alignment of the reticle 2 and measurement of the flatness of the reticle surface. Thereafter, the blind plate 51 is attached to the reticle stage 3 by using a reticle transfer robot. Thereafter, exposure is performed in the same manner as in the above example.

  By making tailored to the reticle that uses the blind mechanism 50, it is not necessary to perform the work of moving the blind plate to limit the pattern area CP during exposure.

FIG. 5 is a view showing the structure of the blind mechanism of the exposure apparatus according to the third embodiment of the present invention. The figure shown on the upper side is a plan view, and the figure shown on the lower side is a side view.
As in the second example, the blind mechanism 60 of this example is also composed of a frame-shaped blind plate 61 having a rectangular opening 63 formed in the center. However, the size of the blind plate 61 is small, and the blind plate 61 It is fixed to the reticle 2 in advance. As a means for fixing the blind plate 61 to the reticle 2, for example, attachment with an adhesive can be used. The dimension of the opening 63 is a dimension in which the edge of the opening 63 fits in the pinhole defect free area PFA around the pattern area CP of the reticle 2.

  In general, an ID such as an alignment mark AM or a reticle identification ID mark is formed on the pattern surface of the reticle 2. In this example, the alignment marks AM are arranged outside the pinhole defect free area PFA of the reticle 2 and aligned in the Y direction. Further, the identification ID mark ID is arranged near the center of the right side of the reticle 2 in the figure.

  Both sides of the blind plate 61 in the X direction are located inside the alignment mark AM and outside the pinhole defect free area PFA. That is, the alignment mark AM and the identification ID mark ID are not covered with the blind plate.

  In this example, first, the blind plate 61 is attached to the reticle 2. Thereafter, the reticle 2 is mounted on the chuck 21 of the stage 3, and the reticle 2 is positioned and identified, and the flatness of the reticle surface is measured. At this time, since the alignment mark AM and the identification ID mark ID are not covered with the blind plate 51, normal alignment and identification work can be performed. Then, exposure is performed in the same manner as in the above example.

  Also in this example, it is not necessary to move the blind to limit the pattern area CP during exposure. In addition, since marks for positioning and identifying the reticle are exposed from the blind plate 61, after the reticle on which the blind plate 61 is fixed is placed on the reticle stage 3, before the exposure such as reticle positioning. Work can be done.

FIG. 1A is a plan view and FIG. 1B is a side view showing a shape of a blind mechanism mounted on an exposure apparatus according to an embodiment of the present invention. It is a figure which shows an example of the drive mechanism of a blind board, FIG. 2 (A) is a top view, FIG.2 (B) is a side view. It is a figure which shows schematically the structure of the EUV exposure apparatus (4 sheet projection system) which concerns on embodiment of this invention. It is a figure which shows the structure of the blind mechanism of the exposure apparatus which concerns on the 2nd Embodiment of this invention, FIG. 4 (A) is a top view, FIG.4 (B) is a side view. It is a figure which shows the structure of the blind mechanism of the exposure apparatus which concerns on the 3rd Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Folding mirror 2 Reticle 3 Reticle stage 4 Reticle focus light transmission system 5 Reticle focus light reception system 6 First mirror 7 Second mirror 8 Third mirror 9 Fourth mirror 10 Wafer 11 Wafer stage 14 Optical barrel 15 Off-axis microscope 12 Wafer Autofocus light transmission system 13 Wafer autofocus light reception system 21 Chuck 30 Blind mechanism 31 Y direction blind plate 33 X direction blind plate 41 Drive mechanism 43 Drive mechanism 45 Mover 47 Stator 50 Blind mechanism 51 Blind plate 53 Opening 60 Blind mechanism 61 Blind plate 63 Opening

Claims (10)

A mask stage that moves by mounting a mask (including a reticle) on which a pattern to be transferred is mounted on a sensitive substrate;
A sensitive substrate stage that carries and moves the sensitive substrate;
An exposure optical system for transferring the pattern,
An exposure apparatus that exposes the optical system while scanning the mask and the sensitive substrate,
An exposure apparatus comprising a movable blind mounted on the mask stage for limiting an exposure area on the mask.   2. The exposure apparatus according to claim 1, wherein the blind moves with the mask stage while being fixed to the mask during exposure. The blind is
Two Y-direction blind plates movable in the scanning direction (Y direction) of the exposure area;
Two X-direction blind plates movable in a direction (X direction) orthogonal to the scanning direction of the exposure area;
A mechanism for driving the Y-direction blind plate;
A mechanism for driving the X-direction blind plate;
The exposure apparatus according to claim 1, further comprising: On the mask stage,
The Y-direction blind plate and the X-direction blind plate are partially overlapped,
4. The exposure apparatus according to claim 3, wherein the Y-direction blind plate driving mechanism and the X-direction blind plate driving mechanism are arranged without overlapping. A mask stage that moves by mounting a mask (including a reticle) on which a pattern to be transferred is mounted on a sensitive substrate;
A sensitive substrate stage that carries and moves the sensitive substrate;
An exposure optical system for transferring the pattern,
An exposure apparatus that exposes the optical system while scanning the mask and the sensitive substrate,
An exposure apparatus comprising: a blind that can be attached to and detached from the mask stage, provided with an opening for limiting an exposure area of the mask. A mask stage that moves by mounting a mask (including a reticle) on which a pattern to be transferred is mounted on a sensitive substrate;
A sensitive substrate stage that carries and moves the sensitive substrate;
An exposure optical system for transferring the pattern,
An exposure apparatus that exposes the optical system while scanning the mask and the sensitive substrate,
An exposure apparatus, wherein a mask-specific blind provided with an opening for limiting an exposure area on the mask is fixed to the mask.   7. The blind according to claim 5, wherein the blind does not cover a portion of a mark (alignment mark, identification ID mark, etc.) formed on the mask for positioning and identifying the mask. Exposure device. A pattern in which a pattern to be transferred is formed on a sensitive substrate, and a mask (including a reticle) mounted on a mask stage and the sensitive substrate are exposed while scanning,
After performing pre-exposure operations such as positioning of the mask on the mask stage, the exposure area on the mask is limited by a movable blind mounted on the mask stage, and then exposed. Exposure method. A pattern in which a pattern to be transferred is formed on a sensitive substrate, and a mask (including a reticle) mounted on a mask stage and the sensitive substrate are exposed while scanning,
After performing pre-exposure operations such as positioning of the mask to the mask stage, the mask-specific blind provided with an opening for limiting the exposure area of the mask is mounted on the mask and then exposed. An exposure method characterized by the above. A pattern in which a pattern to be transferred is formed on a sensitive substrate, and a mask (including a reticle) mounted on a mask stage and the sensitive substrate are exposed while scanning,
An exposure method comprising exposing the mask with a blind specific to the mask provided with an opening for limiting an exposure area on the mask.

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