JP2005108471A - Contact mechanism device and method for manufacturing it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a contact mechanism device with a thin package, and a method for manufacturing the contact mechanism device. <P>SOLUTION: This device comprises the package formed by connecting an element forming substrate 35 having a contact element (switch element 25) formed thereon to an element protecting substrate 21 for protecting the contact element (switch element 25). The contact element (switch element 25) has magnetic bodies 26a and 28a, and the switching is performed by applying a magnetic field to the magnetic bodies 26a, 28a. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a contact mechanism device and a manufacturing method thereof, and more particularly to a contact mechanism device having a thin package and a method of manufacturing the contact mechanism device.

FIG. 9 is a diagram illustrating a packaging process of a mold-type package such as a general electronic component. A conventional mold type package is one in which the periphery of a functional element is hardened with an epoxy resin or the like in order to protect the functional element that becomes the heart of electronic parts and mechanical parts.
First, the element 2 is formed on the substrate 1 made of a silicon wafer or the like (FIG. 9A), and the element 2 is divided into individual pieces by scribing (scratching and dividing) (FIG. 9B). Then, the element 2 divided into pieces on the lead frame 3 made of metal or the like is die-bonded (also called die bonding) (FIG. 9C). The lead frame 3 may be a tape carrier made of resin, copper foil, or the like. Next, the element electrode pad 4 formed on the element 2 and the external connection terminal 5 formed on the lead frame 3 are connected by a wire 6 made of gold or the like (FIG. 9D). Then, the lead frame 3 is set in the mold 8 and the epoxy resin 9 is injected into the mold 8 (FIG. 9E). After the epoxy resin 9 is cured, the mold 8 is removed and the mold package 10 is removed. Form. Thereafter, the external connection terminal 5 is pressed into a predetermined shape to complete a mold package (FIG. 9F).

FIG. 10 is a diagram illustrating a packaging process of a ceramic type package such as a general electronic component. A conventional ceramic package protects a functional element with a ceramic package and a lid.
First, similarly to the above-described mold type package, the element 12 is formed on the substrate 11 made of a silicon wafer or the like (FIG. 10A), and the element 12 is divided into individual pieces by scribing (FIG. 10B). Then, the element 12 divided into individual pieces is die-bonded to the ceramic package 13 (FIG. 10C). Next, the element electrode pad 14 formed in the element 12 and the internal electrode 15 formed in the ceramic package and connected to the external connection terminal are connected by a wire 16 (FIG. 10D). Then, the lid 17 made of ceramic or the like is adhered with the adhesive 18 (FIG. 10E), and the ceramic type package is completed (FIG. 10F).

  In the conventional mold type package, since the resin is sealed with the epoxy resin 9 using the mold 8, the thickness of the epoxy resin 9 above and below the lead frame 3 and the thickness of the three layers of the lead frame 3 is required. There is a problem that it is difficult to reduce the thickness of the package. In addition, when this mold type package is applied to a contact mechanism device according to the present invention described later, it is necessary to prevent the periphery of the beam 28 from being resin-sealed. Therefore, there is a problem that it is difficult to reduce the thickness.

  Further, in the conventional ceramic type package, it is necessary to have a thickness capable of accommodating the element 12 and the wire 16 in the cavity portion for accommodating the element 12 of the ceramic package 13. There was a problem that it was difficult to reduce the thickness. In addition, when this ceramic type package is applied to a contact mechanism device according to the present invention to be described later, there is a problem that it is difficult to reduce the thickness because a sufficient thickness is required to accommodate the wire.

The contact mechanism device according to the present invention is such that a package is formed by joining an element forming substrate on which a contact element is formed and an element protection substrate for protecting the contact element.
In order to form a package by bonding an element formation substrate on which contact elements are formed and an element protection substrate for protecting the contact elements, the package is formed with a thickness corresponding to two layers of the element formation substrate and the element protection substrate. It can be formed, and a thickness of 1 mm or less can be achieved.

In the contact mechanism device according to the present invention, the contact element has a magnetic body, and switching is performed by applying a magnetic field to the magnetic body.
By applying a magnetic field to the magnetic body provided in the contact element and making the two electrodes of the contact element conductive, highly sensitive switching can be performed with a very small magnetic field.

Embodiment 1. FIG.
1 and 2 are perspective views showing manufacturing steps of the contact mechanism device according to Embodiment 1 of the present invention. 1 and FIG. 2 show a portion (a portion surrounded by a dotted line) that becomes one contact mechanism device and its peripheral portion, but in general, a set of element forming substrate 21 and element protection A plurality of contact element devices are created from the substrate 30 (described later).
As shown in FIG. 1A, through holes 22 that penetrate from the front surface to the back surface are formed in the element forming substrate 21, and metal is formed on the front and back surfaces of the element forming substrate 21 and the side surfaces of the through holes 22. The membrane is stretched. Next, a resist pattern is formed on the element forming substrate 21 by photolithography, plating is performed at a predetermined position, and other unnecessary portions are removed by etching. By repeating the plating process and the etching process, the metal films are laminated to form the switch element 25 as shown in FIG.

  The switch element 25 includes an element electrode 26, an element electrode 27, and a beam 28. The element electrode 26 and the element electrode 27 are connected to separate through holes 22 by a metal film or metal plating. Further, during the plating process and the etching process, the external connection electrode 29 is formed on the back surface of the element forming substrate 21 and the metal film on the other part of the back surface of the element forming substrate 21 is removed. To do. The external connection electrode 29 is electrically connected to the metal film stretched on the side surface of the through hole 22, and as a result, each external connection electrode 29 is electrically connected to the element electrode 26 and the element electrode 27. The Rukoto. When forming the switch element 25 described above, a magnetic body 26a and a magnetic body 28a described later are incorporated in the element electrode 26 and the beam 28 (see FIG. 3).

FIG. 2 is a view showing a manufacturing process subsequent to the manufacturing process of the contact mechanism device of FIG. As shown in FIG. 2A, a recess 31 is formed in the element protection substrate 30. By storing the switch element 25 in the recess 31, the switch element 25 is protected from the external environment. The recess 31 is formed, for example, by etching the element protection substrate 30. An adhesive is applied to the surface of the element protection substrate 30 on which the concave portion 31 is formed, and is bonded to the element formation substrate 21 on which the switch element 25 is formed to form a bonded substrate 32 (FIG. 2 ( b)). In FIG. 2B, the element protection substrate 30 is shown transparent. This adhesive is insulative and is applied to the contact surface of the element protection substrate 21 with a thickness of several tens of μm to several hundreds of μm. Further, this adhesive is not applied to the concave portion 31.
The element forming substrate 21 and the element protecting substrate 30 may be bonded by anodic bonding or the like instead of bonding by an adhesive.

Next, the bonding substrate 32 bonded so that the switch element 25 is covered with the recess 25 is separated into individual pieces by scribing (scratching and cleaving) to complete the package of the contact mechanism device (see FIG. 3).
It is possible to prevent the adhesive from being applied to the portion of the scribe line 33 when applying the adhesive, and not to scribe the adhesive layer during the scribing process. The portion where the adhesive is not applied may be about 100 μm which is a general scribe line width. Thereby, it can prevent that a chipping (scattering of a fragment) and a crack (defect of a board | substrate) generate | occur | produce in the adhesive bond layer after hardening. This method of preventing the adhesive from being applied to the scribe line portion can be similarly applied to the second embodiment.

FIG. 3 is a longitudinal sectional view of the completed contact mechanism device (packaging completed). In the first embodiment, a substrate on which a plurality of switch elements 25 are formed is referred to as an element forming substrate 21, and a substrate on which one switch element 25 is mounted by scribing or the like is referred to as an element forming substrate 35. ing. This designation is also used in the second and third embodiments later.
The contact mechanism device created in the above manufacturing process has a package structure in which the element forming substrate 35 on which the switch element 25 (contact element) is formed and the element protection substrate 21 are joined. A magnetic body 26a made of nickel or the like is built in the element electrode 26 or on the upper surface, and a magnetic body 28a made of nickel or the like is also built in or on the lower surface of the beam 28.

  The element electrode 26, the element electrode 27, and the beam 28 are made of a metal such as gold except for the magnetic body 26a and the magnetic body 28a. The beam 28 is attached to the element electrode 27, and is arranged in a state of maintaining a slight gap from the element electrode 26. When a magnetic field is applied to the switch element 25 from the outside, for example, the magnetic body 26a becomes an N pole and the magnetic body 28a becomes an S pole, and attracts each other. The beam 28 is curved and comes into contact with the element electrode 26, whereby the element electrode 26 and the element electrode 27 become conductive. At this time, if a voltage is applied between the element electrode 26 and the element electrode 27, a current flows between these electrodes, and as a result, the external connection electrode 29 connected to the element electrode 26 and the element electrode 27. Current will flow between them.

  When the magnetic field applied to the switch element 25 is removed, the magnetization of the magnetic body 26a and the magnetic body 28a disappears, and the magnetic body 26a and the magnetic body 28a do not attract each other. For this reason, the beam 28 returns to the original state, the element electrode 26 and the beam 28 do not conduct, and no current flows between the external connection electrodes 29. In this manner, the switching element 25 is switched (ON / OFF operation) by the magnetic field from the outside.

In the first embodiment, the element formation substrate 21 on which the switch element 25 is formed and the element protection substrate 30 for protecting the switch element 25 are joined to form a package. The package can be formed with a thickness corresponding to two layers of the substrate 30 for use, and the contact mechanism device can be thinned to 1 mm or less.
Further, by applying a magnetic field to the magnetic body 26a and the magnetic body 28a provided in the switch element 25 and making the two electrodes of the switch element 25 conductive, highly sensitive switching can be performed with a very small magnetic field.

Furthermore, since the switch element 25 is formed by laminating metal films, it can be easily formed. In addition, since the external connection electrode 29 is formed on the back surface of the element formation substrate 21 and is electrically connected by the through hole 22, it is not necessary to provide a wire or the like, and the contact mechanism device can be made thinner.
In addition, when the contact mechanism device is separated into individual pieces by the scribing process, the through hole 22 forms a concave recess in the external connection electrode 29. When mounting, the joint strength can be improved by the anchor hole effect.

  The element forming substrate 21 and the element protecting substrate 30 can be formed from a glass substrate such as borosilicate glass, a ceramic substrate, or a silicon substrate. For example, if the element forming substrate 21 and the element protecting substrate 30 are formed from a ceramic substrate, the same strength as the above ceramic package can be obtained. Further, if the element forming substrate 21 is formed from a silicon substrate and the element protecting substrate 30 is formed from a glass substrate made of borosilicate glass, both substrates can be easily bonded by anodic bonding. The material of the element formation substrate 21 and the element protection substrate 30 is the same in the second and third embodiments described later.

Embodiment 2. FIG.
4 and 5 are perspective views showing manufacturing steps of the contact mechanism device according to the second embodiment of the present invention. In the method for manufacturing the contact mechanism device according to the second embodiment, the through hole 40 is formed in the element protection substrate 30, and the through hole is not provided in the element formation substrate 21. Instead, an additional electrode 26a and an additional electrode 27a are provided in a portion where the through hole 22 is formed in the first embodiment (described later). Other parts are the same as those in the method of manufacturing the contact mechanism device of the first embodiment, and the same parts are described with the same reference numerals as those of the first embodiment.

  As shown in FIG. 4A, the element protection substrate 30 is provided with a through hole 40 penetrating from the front surface to the back surface, and a recess 31 for protecting the switch element 25 is formed as in the first embodiment. Has been. A metal film is stretched around the through hole 40 and on the side surface of the through hole. External connection electrodes 41 are formed on the opposite surface of the element protection substrate 30 where the recesses 31 are formed by plating or the like. Then, the peripheral portion 40a of the through hole 40 on the surface where the concave portion 31 of the element protection substrate 30 is formed is plated with metal plating or the like, and the peripheral portion 40a is electrically connected to the external connection electrode 41. Put it in a state. Further, a conductive adhesive 42 is applied around the peripheral portion 40a, and an insulating adhesive 43 is applied to the other portions (FIG. 4B). The conductive adhesive 42 and the insulating adhesive 43 are applied with a thickness of several tens to several hundreds of μm, as in the first embodiment.

  FIG. 5 is a view showing a manufacturing process subsequent to the manufacturing process of the contact mechanism device of FIG. As in the first embodiment, the switch element 25 is formed on the element forming substrate 21 by plating and etching. However, the additional electrode 26a and the additional electrode 27a are formed in the portion where the through hole 22 is present in the first embodiment, and are electrically connected to the element electrode 26 and the element electrode 27, respectively. Then, both the substrates are joined so that the recess 31 covers the switch element 25 and the through hole 40 and the additional electrode 26a and the additional electrode 27a are connected (FIG. 5A). Thereby, the bonding substrate 32 is formed (FIG. 5B), and the bonding mechanism device is completed by scribing the bonding substrate 32. In FIG. 5B, the element protection substrate 30 is shown transparent.

  The operation of the contact mechanism device according to the second embodiment is the same as that of the contact mechanism device according to the first embodiment. The effects of the contact mechanism device and the manufacturing method thereof according to the second embodiment are the same as those of the first embodiment.

Embodiment 3. FIG.
6 and 7 are perspective views showing manufacturing steps of the contact mechanism device according to Embodiment 2 of the present invention. The completed contact mechanism device according to the third embodiment is the same as that of the second embodiment, but the manufacturing method is different. The same parts as those in the second embodiment will be described with the same reference numerals as those in the second embodiment.
First, as shown in FIG. 6A, an element protection substrate 30 that has been processed in the same manner as in FIG. 4B of the second embodiment is prepared. In addition, the adhesive agent is not apply | coated at the time of Fig.6 (a). Further, as shown in FIG. 6B, an element forming substrate 21 on which the same switch element 25 as that of FIG. 5A of the second embodiment is formed is prepared.

  Next, the element protection substrate 30 is cut with a dicing saw, laser light, or the like, and divided into individual pieces corresponding to one contact mechanism device. The element forming substrate 21 is also cut with a dicing saw, laser light, or the like, and divided into element forming substrates 50 corresponding to one contact mechanism device. In the same manner as in the second embodiment, the conductive adhesive 51 is applied around the through hole 40 on the bonding surface of the element protection substrate 30 separated into individual pieces, and the insulating adhesive 52 is applied to other portions. To do. Thereafter, the element protection substrate 30 and the element formation substrate 50 separated into individual pieces are bonded in the same manner as in the second embodiment (FIG. 7). Then, the contact mechanism device as shown in FIG. 8 is completed. In FIG. 8, the element protection substrate 30 separated into individual pieces is shown transparent.

The operation of the contact mechanism device according to the third embodiment is the same as that of the contact mechanism device according to the second embodiment. The effect of the contact mechanism device according to the third embodiment is the same as that of the second embodiment.
In the manufacturing method of the contact mechanism device according to the third embodiment, the element protection substrate 30 is used by being separated into individual pieces, so that it is not affected by the yield of the switch elements 25 of the element formation substrate 21. It is possible to reduce the waste of the element protection substrate 30.

Embodiment 4 FIG.
In the first embodiment, the second embodiment, or the third embodiment, when a glass substrate made of borosilicate glass or the like is used for the element forming substrate 21 or the element protecting substrate 30, the element forming substrate 21 or the element forming substrate 50 is used. When the element protection substrate 30 is bonded, it can be heat-sealed using a laser beam or an infrared lamp. Thereby, the adhesion degree of both board | substrates improves and joining strength can be raised.
When manufacturing the contact mechanism device as in the first embodiment, the element forming substrate 21 and the element protection substrate 30 may be separated after being separated into individual pieces corresponding to one contact mechanism device.

The perspective view which shows the manufacturing process of the contact mechanism device which concerns on Embodiment 1 of this invention. The figure which showed the manufacturing process of the continuation of the manufacturing process of the contact mechanism device of FIG. The longitudinal cross-sectional view of the contact mechanism device which concerns on Embodiment 1 of this invention. The perspective view which shows the manufacturing process of the contact mechanism device which concerns on Embodiment 2 of this invention. The figure which showed the manufacturing process of the continuation of the manufacturing process of the contact mechanism device of FIG. The perspective view which shows the manufacturing process of the contact mechanism device which concerns on Embodiment 2 of this invention. The figure which showed the manufacturing process of the continuation of the manufacturing process of the contact mechanism device of FIG. The perspective view of the contact mechanism device which concerns on Embodiment 3 of this invention. The figure which shows the packaging process of the conventional mold type package. The figure which shows the packaging process of the conventional ceramic type package.

Explanation of symbols

1 substrate, 2 elements, 3 lead frame, 4 element electrode pad, 5 external connection electrode, 6 wire, 8 mold, 9 epoxy resin, 10 mold package, 11 substrate, 12 element, 14 element electrode pad, 15 internal electrode , 16 wire, 17 lid, 18 adhesive, 21 element forming substrate, 22 through hole, 25 switch element, 26 element electrode, 27 element electrode, 28 beam, 29 external connection electrode, 30 element protecting substrate, 31 recess, 32 bonding substrate, 33 scribe line, 35 element forming substrate, 40 through hole, 41 external connection electrode, 42 conductive adhesive, 43 insulating adhesive, 50 element forming substrate.

Claims (16)

  A contact mechanism device, wherein a package is formed by bonding an element forming substrate on which a contact element is formed and an element protection substrate for protecting the contact element.   The contact mechanism device according to claim 1, wherein the contact element has a magnetic body, and switching is performed by applying a magnetic field to the magnetic body.   The contact mechanism device according to claim 1, wherein the contact element is formed by laminating metal films.   The contact mechanism device according to claim 1, wherein an external connection electrode is formed on a surface of the element forming substrate opposite to a surface on which the contact element is formed.   The contact mechanism device according to claim 4, wherein a through hole electrically connected to the external connection electrode is formed in the element formation substrate.   The contact mechanism device according to claim 1, wherein an external connection electrode is formed on the element protection substrate.   The contact mechanism device according to claim 6, wherein a through hole electrically connected to the external connection electrode is formed in the element protection substrate.   The contact mechanism device according to claim 4, wherein the external connection electrode is formed by plating.   The contact mechanism device according to claim 1, wherein the element formation substrate and / or the element protection substrate is formed from a glass substrate.   The contact mechanism device according to claim 1, wherein the element formation substrate and / or the element protection substrate is formed from a ceramic substrate.   The contact mechanism device according to claim 1, wherein the element formation substrate and / or the element protection substrate is formed from a silicon substrate.   Bonding an element forming substrate on which one or a plurality of contact elements are formed and an element protecting substrate for protecting the contact elements to form a bonded substrate, and cutting the bonded substrate to form a package; A method of manufacturing a contact mechanism device characterized by the above.   13. The method for manufacturing a contact mechanism device according to claim 12, wherein the element forming substrate and the element protecting substrate are bonded by heat fusion.   A device forming substrate on which one or a plurality of contact elements are formed is cut to cut out the element forming substrate, and a package is formed by joining the element protecting substrate and an element protecting substrate for protecting the contact elements. A method for manufacturing a contact mechanism device.   The method for manufacturing a contact mechanism device according to claim 14, wherein the element forming substrate and the element protection substrate are bonded by heat fusion. The method of manufacturing a contact mechanism device according to claim 12, wherein the contact element includes a magnetic body, and switching is performed by applying a magnetic field to the magnetic body.

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