JP2005101572A - Substrate washing method and its equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate treatment method and its equipment which can improve throughput and reduce the consumption of deionized water by shortening deionized water treatment time before the last deionized water treatment. <P>SOLUTION: In the last deionized water treatment (step S4), treatment is finished by whether the resistivity of treatment liquid containing deionized water reached reference resistivity (step S5). In deionized water treatment (step S3) before the last deionized water treatment, treatment is finished by shortened deionized water treatment time, so that deionized water treatment time is shortened while a good device performance is maintained, and throughput can be improved. Further, since deionized water treatment is finished for a short time, consumption of deionized water can be also reduced, and loading of waste water treatment can be reduced. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  In the present invention, after a chemical treatment is performed on a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display device, a substrate for an optical disk (hereinafter simply referred to as a substrate), a treatment containing pure water The present invention relates to a substrate processing method and apparatus for performing pure water treatment with a liquid.

  As a conventional apparatus for carrying out this type of method, a first treatment tank for storing a chemical solution, a first pure water treatment tank for storing pure water, a second treatment tank for storing a chemical solution, What was provided with the 2nd pure water processing tank which stores water, and the measuring device which each measures the specific resistance value in a 1st and 2nd pure water processing tank is mentioned.

  In the apparatus having such a configuration, the substrate that has been treated with the chemical solution in the first or second treatment tank is moved to the first or second pure water treatment tank and washed with pure water. Then, when the measured value of the specific resistance value by the measuring instrument reaches a predetermined reference specific resistance value, it is determined that the cleaning is completed, and the substrate is moved to the second processing tank to be processed with the next processing liquid. Examples are those that perform or end a series of processing on the substrate (see, for example, Patent Document 1). The reference specific resistance value is very close to the specific resistance value of pure water.

In addition, even in the case of a substrate processing apparatus that performs processing while alternately switching the chemical solution and pure water in one processing tank, the chemical solution is replaced with pure water, and the specific resistance of the processing solution containing pure water at that time is the same as described above. After performing pure water cleaning until the value reaches the reference specific resistance value, the process proceeds to the next process.
JP 2001-210616 A

  However, the conventional example having such a configuration has the following problems.

  In other words, since the conventional method continues with pure water cleaning until the reference specific resistance value is reached, there is a problem that the cleaning time with pure water is prolonged, throughput decreases, and the consumption of pure water becomes very large. There is. In addition, the pure water used for cleaning contains other chemicals in an extremely small amount, so that it cannot be drained as it is, and it must be drained after purification. Therefore, reducing the consumption of pure water used for cleaning is a major issue.

  The present invention has been made in view of such circumstances, and by reducing the pure water treatment time prior to the final pure water treatment, the throughput can be increased and the consumption of pure water. An object of the present invention is to provide a substrate processing method and apparatus capable of reducing the above.

  In order to achieve such an object, the present invention has the following configuration.

  That is, the invention described in claim 1 is a substrate processing method in which a pure water treatment is performed with a treatment liquid containing pure water after the chemical treatment is performed on the substrate, and the pure water is supplied after the chemical treatment. The pure water treatment uses a treatment liquid lower than the reference specific resistance value of pure water, and the pure water treatment is completed in a shorter pure water treatment time than the reference specific resistance value is obtained. .

  (Function / Effect) Pure water is supplied after chemical solution treatment and pure water cleaning is performed. At that time, pure water treatment is not performed until the specific resistance value of the treatment solution containing pure water reaches the reference specific resistance value of pure water. In other words, even if the specific resistance value is restored only to a value lower than the specific resistance value of pure water, a short cleaning time is allowed as long as the device performance can be maintained satisfactorily. be able to.

  Accordingly, the treatment liquid containing pure water has a specific resistance value lower than the reference specific resistance value of pure water in advance, and the pure water by the treatment liquid is used in various times shorter than pure water treatment using pure water having the reference specific resistance value. After water treatment, performance is evaluated with devices on the substrate. As a result, it is only necessary to find a cleaning processing time that can exhibit the required performance, set it as a shortened pure water processing time, and perform pure water processing on the substrate at that time. In this way, by completing the pure water treatment with a shortened pure water treatment time, while maintaining good device performance, the cleaning treatment time can be shortened to increase the throughput, and the consumption of pure water is also reduced. can do.

  Further, the invention according to claim 2 is the substrate processing method according to claim 1, wherein the pure water treatment includes at least two times of pure water treatment, and the final pure water treatment is the final pure water treatment. In the pure water treatment performed prior to the water treatment, a treatment liquid lower than the reference specific resistance value of pure water is used, and the pure water treatment is completed in a shorter pure water treatment time than the reference specific resistance value is obtained. It is characterized by.

  The final pure water treatment here refers to the final pure water treatment in the pure water treatment after the chemical treatment.

  According to a third aspect of the present invention, there is provided a substrate processing method for performing pure water treatment with a treatment liquid containing pure water after performing a chemical treatment on the substrate, and the chemical solution stored in the treatment tank is used for the substrate. Performs chemical treatment, supplies pure water to the treatment tank, performs pure water treatment with the treatment liquid while substituting the inside of the treatment tank from chemical liquid to pure water, and replaces the treatment liquid with pure water. The pure water treatment is completed in a shorter pure water treatment time than the specific resistance value becomes the reference specific resistance value of pure water.

  (Function / Effect) After the chemical treatment, pure water is supplied and the treatment tank is replaced with the pure water by replacing the chemical tank with the pure water. At that time, the specific resistance value of the treatment liquid containing pure water Device performance even if pure water treatment is not performed until the specific resistance value of pure water reaches the standard specific resistance value, that is, even if the specific resistance value is restored to a value lower than the specific resistance value of pure water. Can be tolerated even with a short pure water treatment time.

  Accordingly, the treatment liquid containing pure water has a specific resistance value lower than the reference specific resistance value of pure water in advance, and the pure water by the treatment liquid is used in various times shorter than pure water treatment using pure water having the reference specific resistance value. After water treatment, performance is evaluated with devices on the substrate. As a result, it is only necessary to find a cleaning processing time that can exhibit the required performance, set it as a shortened pure water processing time, and perform pure water processing on the substrate at that time. By completing the pure water treatment with the shortened pure water treatment time in this way, it is possible to shorten the pure water treatment time and increase the throughput while maintaining good device performance, and also reduce the consumption of pure water. it can.

  According to a fourth aspect of the present invention, there is provided the substrate processing method according to the third aspect, wherein the pure water treatment includes at least two times of pure water treatment. In pure water treatment performed prior to water treatment, pure water treatment is performed with the treatment liquid while replacing the inside of the treatment tank from chemical liquid to pure water, and the specific resistance value of the treatment liquid is reduced by substitution from the chemical liquid to pure water. The pure water treatment is completed in a pure water treatment time shorter than the reference specific resistance value of pure water.

  Further, the invention according to claim 5 is the substrate processing method according to any one of claims 1 to 4, wherein the pure water treatment time is a particle adhesion state, metal contamination state, and etching after the pure water treatment. It is characterized in that it is set in advance based on any one of the uniformity.

  (Action / Effect) Evaluating any of the particle adhesion state, metal contamination state, and etching uniformity after pure water cleaning reduces the amount of time for pure water treatment to achieve the required device performance. Can be determined.

  Further, the invention according to claim 6 is a substrate processing apparatus for performing pure water treatment with a treatment liquid containing pure water after performing a chemical treatment on the substrate, and a treatment tank for storing the chemical liquid and the treatment liquid; In the state where the holding mechanism for holding the substrate in the treatment tank and the substrate held in the holding mechanism are immersed in the chemical solution in the treatment tank, the inside of the treatment tank is replaced with the pure liquid from the chemical solution, A pure water supply unit that supplies pure water; a storage unit that stores a pure water treatment time shorter than the specific resistance value of the treatment liquid becomes a reference specific resistance value of pure water by replacing the chemical liquid with pure water; and And a control unit that performs pure water treatment according to the pure water treatment time stored in the storage unit.

  (Action / Effect) After the chemical treatment, pure water is supplied from the pure water supply unit, and the treatment tank is replaced with the pure water by replacing the chemical with pure water. Even if the pure water treatment is not performed until the specific resistance value of the liquid reaches the reference specific resistance value of pure water, that is, the specific resistance value has recovered only to a value lower than the specific resistance value of pure water. However, if the device performance can be maintained satisfactorily, even a short pure water treatment time can be tolerated.

  Accordingly, the treatment liquid containing pure water has a specific resistance value lower than the reference specific resistance value of pure water in advance, and the pure water by the treatment liquid is used in various times shorter than pure water treatment using pure water having the reference specific resistance value. After water treatment, performance is evaluated with devices on the substrate. As a result, a cleaning processing time capable of exhibiting the required performance is found, stored as a shortened pure water processing time in the storage unit, and the control unit performs the pure water processing on the substrate at that time. In this way, by completing the pure water treatment with the shortened pure water treatment time, while maintaining the device performance well, the pure water treatment time can be shortened to increase the throughput, and the consumption of pure water is also increased. Can be reduced.

  Moreover, it is preferable to further include a measuring unit that measures the specific resistance value of the processing liquid stored in the processing tank.

  According to an eighth aspect of the present invention, there is provided a substrate processing apparatus for performing pure water treatment with a treatment liquid containing pure water after performing chemical treatment on the substrate, and performing pure water treatment with the treatment liquid on the substrate. A first treatment tank to be performed, a second treatment tank for performing chemical treatment with a chemical solution on a substrate that has been subjected to pure water treatment in the first treatment tank, and a substrate subjected to chemical treatment in the second treatment tank. A third treatment tank that performs pure water treatment with a treatment liquid, and a conveyance mechanism that conveys the substrate from the first treatment tank to the second treatment tank and also conveys the substrate from the second treatment tank to the third treatment tank. And a storage unit for storing a pure water treatment time shorter than the specific resistance value of the treatment liquid becomes a reference specific resistance value of pure water by replacing the chemical liquid with pure water in the first treatment tank, and the first treatment Pure water treatment is performed in the tank by the pure water treatment time stored in the storage unit. It is characterized in that comprises a control unit that, the.

  Further, the control unit causes the transport mechanism to unload the substrate from the third processing tank based on the fact that the specific resistance value of the processing liquid has reached the reference specific resistance value of pure water in the third processing tank. (Claim 9).

  Further, the invention described in claim 10 is the substrate processing apparatus according to any one of claims 6 to 9, wherein the pure water treatment time is a particle adhesion state, metal contamination state, and etching after the pure water treatment. It is characterized in that it is set in advance based on any one of the uniformity.

  (Action / Effect) Evaluating any of the particle adhesion state, metal contamination state, and etching uniformity after pure water cleaning reduces the amount of time for pure water treatment to achieve the required device performance. Can be determined.

  As is clear from the above description, according to the present invention, the pure water treatment is performed on the substrate with the treatment liquid containing pure water after the chemical treatment, and at that time, the pure water treatment is performed until the reference specific resistance value of the treatment liquid is reached. Even if it is not necessary, a short pure water treatment time is acceptable as long as the device performance can be maintained satisfactorily. Therefore, in the pure water treatment prior to the final pure water treatment, the pure water cleaning is completed in a shortened pure water treatment time, so that the pure water treatment time is shortened and the throughput is increased while maintaining the device performance satisfactorily. And consumption of pure water can also be reduced.

  An embodiment of the present invention will be described below with reference to the drawings.

<Substrate processing method>
1 to 3 show examples of data for determining the shortened pure water treatment time in the present invention. FIG. 1 is a graph showing the specific resistance value according to the elapsed time after opening the measurement valve, and FIG. FIG. 3 is a table showing the evaluation for each pure water treatment time.

  The graph of FIG. 1 shows the specific resistance value when the measurement valve is opened after various times from the time when the chemical solution in the treatment tank is replaced with pure water after the substrate is treated with a certain chemical solution for a certain period of time. It shows a change. The specific resistance value is measured by a specific resistance meter attached to the treatment tank. In this graph, “Pure water only” (indicated by the solid line in the figure) means that the same substrate was originally immersed in pure water, and the substitution started with new pure water. The change from when the valve is released is shown. The reason why the specific resistance value does not immediately increase is due to the existence of a delay time for the measurement sample to reach the specific resistance meter after the measurement valve is opened, the specific characteristics of the specific resistance meter, and the like.

  In general, the term “standard pure water treatment time” refers to the time required for cleaning until the specific resistance value of pure water only is reached. Specifically, “standard pure water treatment 10 min” is shown in the figure. Here, the specific resistance value at this time is referred to as a “reference specific resistance value”. Examples of the shortened pure water treatment time shorter than the standard pure water treatment time are 2 minutes for “shortened pure water treatment 1”, 4 minutes for “shortened pure water treatment 2”, and “shortened pure water treatment”. 6 minutes of “water treatment 3”. Therefore, the time from the start of replacement with pure water to the start of measurement is shortened according to “shortened pure water treatment 3” to “shortened pure water treatment 1”.

  If the graph shows a change in specific resistance value below the curve of “pure water only” or “standard pure water treatment time”, it is considered that the cleaning is performed with insufficient pure water according to the conventional criteria. Is. However, the present invention is characterized in that the determination is made according to whether or not the performance of the device can be maintained. Examples of the determination include in-plane uniformity after etching and pure water treatment (FIG. 2), particle adhesion and metal removal after pure water treatment (FIG. 3), and the like.

"In-plane uniformity after etching"
FIG. 2 is a plot of the uniformity of etching within the surface after etching the film on the substrate surface to a thickness of 100 mm with 200: 1 hydrofluoric acid and then performing the various pure water treatments described above. It is. In this graph, the pure water treatment time of “0” means that after the substrate was immersed in hydrofluoric acid and etched, hydrofluoric acid was discharged and no pure water treatment was performed. . In the case of 10 minutes, which is the “standard pure water treatment time”, the in-plane uniformity of etching obtained after conventional cleaning is shown. On the other hand, it can be seen that even with shortened pure water treatments 1 to 3 shorter than 10 minutes of the standard pure water treatment time, the same etching uniformity can be obtained.

"Particle adhesion and metal removal"
FIG. 3 shows the measurement of the number of adhered particles, the removal rate, and the metal removal for each of the various pure water treatment times described above. The number of adhering particles indicates the difference between the adhering number counted by the particle counter before and after the pure water treatment. Further, the particle removal rate indicates a ratio corresponding to the difference. Metal removal shows the result of measuring the attached metals.

  According to this, it is clear that the number of adhered particles, the removal rate, and the metal removal in the standard pure water treatment and the shortened pure water treatments 1 to 3 are substantially the same level. In addition, the undetectable level in metal removal indicates that there is no contamination by metals so that metals cannot be detected by the measuring device.

  In the present invention, based on these results, a treatment liquid (including pure water) having a specific resistance value lower than a standard specific resistance value of pure water by standard pure water treatment by replacing the chemical liquid with pure water is used. The cleaning time is shorter than the standard pure water processing time, and the substrate W is cleaned in a shortened pure water processing time that can maintain good device performance. However, for the final cleaning, it is preferable to perform the cleaning until the reference specific resistance value is obtained as usual, just in case, and the cleaning with the “reduced pure water processing time” is performed for the pure water treatment cleaning before the final cleaning. We will do the processing.

  Appropriate “shortened pure water treatment time” includes the type of substrate, the type of film applied, the process applied to the substrate, the type of chemical used and the treatment time, and the structure and purity of the treatment tank. Since it differs depending on the water supply mode, it is preferable to conduct an experiment in advance for each of them and determine the shortened pure water treatment time depending on whether or not the device performance can be maintained satisfactorily.

<Substrate processing equipment>
A substrate processing apparatus using the above-described substrate processing method will be described with reference to FIG. FIG. 4 is a block diagram illustrating a schematic configuration of the substrate processing apparatus according to the embodiment.

  The substrate processing apparatus includes a processing tank 5 including an inner tank 1 and an outer tank 3. The inner tank 1 stores a processing solution such as pure water or a chemical solution as a rinsing solution, and performs processing on the immersed substrate W. The outer tub 3 has a function of collecting and draining the processing liquid overflowing from the inner tub 1. The holding arm 7 corresponding to the holding mechanism in the present invention is configured to be movable up and down in the inner tank 1 and above, and holds an edge of the substrate W to hold a plurality of substrates W in an upright posture. . A specific resistance meter 8 for measuring the specific resistance value in the outer tub 3 is attached to the outer tub 3.

  The specific resistance meter 8 corresponds to the measurement unit in the present invention.

  An injection pipe 9 for supplying a processing liquid to the inner tank 1 is provided at the bottom of the inner tank 1. One end of a supply pipe 11 is connected to the injection pipe 9 in communication. A pure water supply source 13 is communicated with the other end side of the supply pipe 11. A mixing valve 17, an inline heater 19, a filter 21, and a control valve 23 are attached to the downstream side of the pure water supply source 13.

  The mixing valve 17 is connected to a supply pipe 25 that communicates with a chemical supply source. The flow rate is adjusted by a control valve 27 attached to the supply pipe 25. Further, a supply pipe 29 communicating with a chemical solution supply source for supplying a chemical solution different from the chemical solution is also connected to the mixing valve 17. The flow rate of the supply pipe 29 is adjusted by the control valve 31.

  The above-described lifting and lowering of the holding arm 7, temperature adjustment by the in-line heater 19, flow rate adjustment by the control valves 23, 27, and 31 are comprehensively controlled by the control unit 33. A storage unit 35 is connected to the control unit 33, and a recipe that defines the processing procedure of the substrate W and the like is registered therein. The control unit 33 controls each of the above units with reference to the recipe, and when the process is the final pure water cleaning, determines the completion of the process with reference to the specific resistance value. On the other hand, in the case of pure water cleaning performed before the final pure water cleaning, control is performed so that the cleaning process is completed and the process proceeds to the next process according to the “shortened pure water processing time” defined in the recipe. I do.

  The control unit 33 corresponds to the control unit in the present invention, and the storage unit 35 corresponds to the storage unit in the present invention.

  Next, processing performed by the substrate processing apparatus configured as described above will be described with reference to FIG. FIG. 5 is a flowchart showing the flow of processing.

Step S1
The control unit 33 refers to the recipe in the storage unit 35, controls the control valves 23, 27, 31 and further the in-line heater 17 as necessary, and supplies a predetermined chemical solution to the inner tank 1. An example of the chemical solution to be supplied is hydrofluoric acid for etching. next. The holding arm 7 supporting the substrate W is lowered into the inner tank 1 and is held for the time specified in the recipe. By this chemical treatment, for example, an oxide film formed on the substrate W is etched by a predetermined thickness.

Step S2
Referring to the recipe, pure water having a reference specific resistance value is supplied to the inner tank 1 and pure water treatment is performed on the substrate W with a treatment liquid containing pure water. Is this the final pure water treatment cleaning? Processing branches depending on whether or not.

Step S3
If it is determined in step S2 that it is not the final pure water treatment, when the chemical solution treatment for a predetermined time is completed, the control unit 33 controls the control valves 27 and 31 while maintaining the holding arm 7 in that position. At the same time, the control valve 23 is adjusted to supply pure water at a predetermined flow rate from the pure water supply source 13 to the inner tank 1. As a result, the chemical solution in the inner tank 1 is replaced with pure water, and the pure water treatment is performed on the substrate W with the treatment liquid containing pure water. The treatment time is the above-described shortened pure water treatment time, and the shortened pure water treatment time (shortened pure water treatment 1 to 3) is stored in the storage unit 35 in advance, and is controlled by the control unit 33. A pure water treatment is performed on the substrate W.

  After this process, the process returns to step S1 and, for example, a chemical process using another chemical is performed.

Step S4
When it is determined in step S2 that it is the final pure water treatment, the standard pure water treatment is performed instead of the above-described shortened pure water treatment time.

Step S5
In the case of the final pure water treatment, the specific resistance value output from the specific resistance meter 8 is monitored, and depending on whether or not the treatment value including pure water has reached the reference specific resistance value defined in the recipe. Determine completion of processing. Therefore, step S4 is executed until the reference specific resistance value is reached, and if the reference specific resistance value is reached, the final pure water treatment is finished.

  As described above, in the pure water treatment prior to the final pure water treatment (for example, 10 minutes), the pure water treatment (for example, 2 minutes, 4 minutes, and 6 minutes) is completed in a shortened pure water treatment time, whereby the device While maintaining good performance, it is possible to shorten the processing time and increase the throughput. Furthermore, since the pure water treatment is completed in a short time, the consumption of pure water can be reduced and the load of waste water treatment can be reduced.

  In addition, although said board | substrate processing apparatus was a type which performs a chemical | medical solution process and a pure water process by the one processing tank 5, even if it is a case where a several processing tank is provided, this invention can be applied. . This will be described with reference to FIG. FIG. 6 is a diagram for explaining the operation in the substrate processing apparatus including a plurality of processing tanks.

  The substrate processing apparatus includes a first chemical treatment tank 51, a pure water treatment tank 53, a second chemical treatment tank 55, and a final pure water treatment tank 57. It has. In this substrate processing apparatus, the substrate W is sequentially transferred to the processing tanks 51, 53, 55, 57 by the transfer mechanism 59 for processing. In FIG. 6, only the inner tank is shown, and the outer tank is omitted.

  In the apparatus having such a configuration, the substrate W is sequentially transferred to each of the processing tanks 51, 53, 55, and 57 in accordance with the recipe. Of the pure water treatment, the pure water before the final pure water treatment is used. In the water treatment, the cleaning process is performed according to the “shortened pure water processing time”, and in the final pure water process, the cleaning is performed until the reference specific resistance value is reached while monitoring the specific resistance meter 8 or the cleaning process is performed in the standard time.

  The substrate W that has been subjected to the final pure water treatment as described above is unloaded from the treatment tank 51 by the transport mechanism 59 and subjected to a drying treatment or the like, and then stored or subjected to the following series of treatments.

  Even in a configuration including a plurality of treatment tanks as described above, by performing the pure water treatment before the final pure water treatment in the “shortened pure water treatment time”, it is possible to maintain good device performance. The processing time can be shortened and the throughput can be increased. Furthermore, since the pure water treatment is completed in a short time, the consumption of pure water can also be reduced.

  In addition, this invention is not limited to the said Example, A deformation | transformation implementation is possible as follows.

  For example, two treatment tanks for pure water treatment and two treatment tanks for chemical solution treatment are provided, and the substrate is alternately conveyed between these treatment tanks to perform at least twice pure water cleaning and chemical solution treatment. The present invention can be applied even to an apparatus.

It is a graph which shows the specific resistance value according to the elapsed time after opening a measurement valve. It is a graph which shows the in-plane uniformity according to the pure water processing time after the etching process by hydrofluoric acid. It is a table | surface which shows the evaluation for every pure water processing time. It is a block diagram which shows schematic structure of the substrate processing apparatus which concerns on an Example. It is a flowchart which shows the flow of a process. It is a figure where it uses for description of operation | movement in the substrate processing apparatus provided with two or more processing tanks.

Explanation of symbols

W ... Substrate 1 ... Inner tank 3 ... Outer tank 5 ... Processing tank 7 ... Holding arm 8 ... Resistivity meter 11 ... Supply pipe 33 ... Control unit 35 ... Storage unit

Claims (10)

In the substrate processing method of performing pure water treatment with a treatment liquid containing pure water after performing chemical treatment on the substrate,
Pure water is supplied after the chemical treatment, and the pure water treatment uses a treatment solution lower than the reference specific resistance value of pure water, and the pure water treatment takes less time than the reference specific resistance value is obtained. And ending the process. The substrate processing method according to claim 1,
The pure water treatment includes at least two times of pure water treatment,
In the pure water treatment performed before the final pure water treatment among the pure water treatments, a pure water treatment using a treatment liquid lower than a reference specific resistance value of pure water and having a reference specific resistance value shorter than that is obtained. A substrate processing method characterized in that the pure water treatment is completed in time. In the substrate processing method of performing pure water treatment with a treatment liquid containing pure water after performing chemical treatment on the substrate,
Perform chemical treatment on the substrate with the chemical stored in the treatment tank,
Pure water is supplied to the treatment tank, and pure water treatment is performed with the treatment liquid while replacing the inside of the treatment tank from the chemical liquid to the pure water, and the specific resistance value of the treatment liquid is reduced by the substitution from the chemical liquid to the pure water. A substrate processing method characterized in that the pure water treatment is completed in a pure water treatment time shorter than the reference specific resistance value of water. The substrate processing method according to claim 3,
The pure water treatment includes at least two times of pure water treatment,
In the pure water treatment performed before the final pure water treatment in the pure water treatment, the pure water treatment is performed with the treatment liquid while replacing the inside of the treatment tank from the chemical liquid to the pure water, and from the chemical liquid to the pure water. A substrate processing method, wherein the pure water treatment is completed in a shorter pure water treatment time than the specific resistance value of the treatment liquid becomes a reference specific resistance value of pure water by the replacement. In the substrate processing method in any one of Claim 1 to 4,
2. The substrate processing method according to claim 1, wherein the pure water treatment time is set in advance based on any of a particle adhesion state, a metal contamination state, and etching uniformity after the pure water treatment. In a substrate processing apparatus for performing pure water treatment with a treatment liquid containing pure water after performing chemical treatment on the substrate,
A treatment tank for storing a chemical solution and a treatment solution;
A holding mechanism for holding the substrate in the processing tank;
In a state where the substrate held in the holding mechanism is immersed in the chemical solution in the processing tank, a pure water supply unit that supplies pure water so as to replace the inside of the processing tank with chemical water from the chemical liquid;
A storage unit for storing a pure water treatment time shorter than the specific resistance value of the treatment liquid becomes a reference specific resistance value of pure water by replacing the chemical liquid with pure water;
A control unit that performs pure water treatment by the pure water treatment time stored in the storage unit;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 6,
A substrate processing apparatus, further comprising a measuring unit that measures a specific resistance value of the processing liquid stored in the processing tank. In a substrate processing apparatus for performing pure water treatment with a treatment liquid containing pure water after performing chemical treatment on the substrate,
A first treatment tank that performs pure water treatment on a substrate with a treatment liquid;
A second treatment tank that performs chemical treatment with a chemical solution on a substrate that has been subjected to pure water treatment in the first treatment tank;
A third treatment tank that performs pure water treatment with a treatment liquid on a substrate that has been subjected to chemical treatment in the second treatment tank;
A transport mechanism for transporting the substrate from the first processing tank to the second processing tank and transporting the substrate from the second processing tank to the third processing tank;
A storage unit for storing a pure water treatment time shorter than the specific resistance value of the treatment liquid becomes a reference specific resistance value of pure water by replacing the chemical liquid with pure water in the first treatment tank;
A control unit for performing pure water treatment in the first treatment tank by the pure water treatment time stored in the storage unit;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 8,
The controller causes the substrate to be unloaded from the third processing tank by the transport mechanism based on the fact that the specific resistance value of the processing liquid has reached the reference specific resistance value of pure water in the third processing tank. A substrate processing apparatus. The substrate processing apparatus according to any one of claims 6 to 9,
The substrate processing apparatus is characterized in that the pure water treatment time is set in advance based on any of a particle adhesion state, a metal contamination state, and etching uniformity after the pure water treatment.

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