JP2005141934A - Image display device, its manufacturing method, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an image display device formed by disposing a plurality of electroluminescent elements on a transparent substrate, the power loss of which is reduced as far as possible by providing a fuel cell for every luminescent element as a power supply source, a manufacturing method of the image display device, and an electronic apparatus provided with the image display device. <P>SOLUTION: In this image display device, a plurality of the electroluminescent elements are formed on the transparent substrate, and an image is displayed by luminescence of the luminescent element, and at least one of a plurality of the luminescent elements is provided with a fuel cell as a power supply source. In this manufacturing method of the image display device, the fuel cell of the image display device is formed by a forming method including a process using a discharge device, and this electronic apparatus is provided with the image display device. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an image display apparatus in which a plurality of light-emitting elements are formed on a substrate, and the light-emitting element includes a fuel cell as a power supply source.

  In recent years, as a self-luminous display, an organic EL display including a light emitting element (organic EL element) having a structure in which a light emitting layer made of an organic material is provided between an anode and a cathode corresponding to a pixel has been attracting attention as a next generation display. I'm bathing. In this organic EL display, a display panel is constructed using a matrix of a plurality of organic EL elements formed on a transparent substrate, and a driving circuit using a thin film transistor (TFT) is integrally provided on the panel. . As an organic EL element driving method, an active matrix method in which a switching circuit including a thin film transistor (TFT) is provided in each pixel is known.

  Further, as a method for producing an organic EL display, there is known a method in which a hole injection layer and a light emitting layer of an organic EL display are formed using an ink jet type ejection device (see Patent Documents 1 to 3, etc.).

  An example of a conventional active matrix type organic EL element pixel drive circuit is shown in FIG. In FIG. 19, Vdd is a power supply, Vd is a signal line for sending a data voltage signal, Vs is a scanning line for sending a selection voltage signal, Cst is a storage capacitor element, T1 and T2 are thin film transistors (TFTs), and OELD is Each of the organic EL elements is shown. In this drive circuit, a pixel is selected by an electrical signal from Vd and Vs at T1, and a data voltage signal from T1 is converted into a drive current for causing the organic EL element to emit light with a specified luminance at T2. . When no pixel is selected from the data voltage signal Vd, it is stored in the storage capacitor element Cst. The driver circuit shown in FIG. 19 shows one pixel driver circuit, but Vdd, Vd, and Vs are electrically connected to other pixels in a matrix, and a wiring layer is formed in a matrix.

By the way, in recent organic EL displays, a higher-definition display function is required. For this purpose, it is necessary to increase the number of pixels.
However, in the organic EL display of the active matrix system or the like, when the number of pixels is increased, there is a problem that wiring for connecting the pixels becomes complicated, wiring capacity increases, and power loss increases.

Japanese Patent Laid-Open No. 10-12377 JP-A-10-153967 JP 2003-260396 A

  The present invention has been made in view of the above-described problems of the prior art, and is an image display device in which a plurality of electroluminescent elements are formed on a substrate, each of which is a fuel cell as a power supply source for each light emitting element. It is an object of the present invention to provide an image display device that reduces power loss as much as possible, a method for manufacturing the image display device, and an electronic device including the image display device.

  The inventor has intensively studied an image display device in which a plurality of electroluminescent elements are formed on a substrate and an image is displayed by light emission of the light emitting elements. As a result, by disposing a fuel cell as a power supply source in each of the plurality of light emitting elements, it is possible to reduce the number of wirings connecting the pixels and to obtain an image display device with low power consumption. In addition, the present inventors have found that an image display device having such a structure can be efficiently manufactured by using a discharge device, and has completed the present invention.

Thus, according to the first aspect of the present invention, there is provided an image display device in which a plurality of electroluminescent elements are formed on a substrate, wherein at least one of the plurality of light emitting elements includes a fuel cell as a power supply source. An image display device is provided.
In the image display device of the present invention, the light emitting element is preferably an organic electroluminescence element having a pixel electrode, a reflective electrode, and a light emitting layer provided between the pixel electrode and the reflective electrode.

The image display device of the present invention is an image display device in which a plurality of electroluminescent elements are formed on a substrate, the pixel electrode formed on the substrate, and the hole injection layer formed on the pixel electrode And a light emitting layer formed on the hole injection layer, a reflective electrode formed at a position facing the pixel electrode across the light emitting layer, and electrically connected to the pixel electrode and the reflective electrode It is preferable that the image display device is provided with a fuel cell.
In the image display device of the present invention, the fuel cell is provided with a fuel cell for each light emitting element as a power supply source above the pixel electrode and the reflective electrode. preferable.

According to a second aspect of the present invention, there is provided an image display device manufacturing method according to the present invention, wherein the fuel cell of the image display device is formed by a forming method including a step of using a discharge device. A method of manufacturing a device is provided.
According to a third aspect of the present invention, there is provided an electronic apparatus comprising the image display device according to the present invention.

Since the image display apparatus of the present invention includes a fuel cell as a power supply source for causing the electroluminescent element to emit light, a complicated wiring for supplying electric power to the electroluminescent element becomes unnecessary. Therefore, even if the number of pixels increases, the number of wirings connecting the pixels can be reduced, wiring capacity can be reduced, and as a result, power loss can be reduced.
According to the method for manufacturing an image display device of the present invention, since the fuel cell is formed using the discharge device, an image display device including a fuel cell that is uniform between the fuel cells and has no output unevenness is manufactured at low cost. Can do.
Since the electronic device of the present invention includes the image display device of the present invention, the electronic device includes the display device that consumes less power and can obtain a high-definition image.

1) Image Display Device An image display device according to the present invention is an image display device in which a plurality of electroluminescent elements are formed on a substrate, and at least one of the plurality of light emitting elements includes a fuel cell as a power supply source. It is characterized by providing.

  The image display device of the present invention may be any device as long as at least one of the plurality of light emitting elements includes a fuel cell as a power supply source. For example, (i) the entire image display device includes one fuel cell. And (ii) three types of electroluminescent elements each having a certain number of the light emitting elements (for example, a red (R) coloring layer, a green (G) coloring layer, and a blue (B) coloring layer). And (iii) those having a fuel cell for each of the plurality of light emitting elements. Among these, the image display device of the type (ii) or (iii) is preferable because an image display device with low power consumption can be obtained by reducing the wiring capacity by reducing the number of wires.

  An example of the image display apparatus of the present invention is shown in FIG. The image display apparatus shown in FIG. 1 has a plurality of light emitting areas (EA). Each light emitting area (EA) is connected to a signal line (Vd) and a scanning line (Vs), and is connected to a fuel cell (FC) through a thin film transistor (TFT) that serves as a switch. The light emitting area (EA) is an area formed by light emitting elements arranged on a matrix, and is also referred to as an effective display area. In the image display device shown in FIG. 1, when the thin film transistor (TFT) is turned on based on signals from the signal line (Vd) and the scanning line (Vs), the light emitting element emits light by the power generated by the fuel cell (FC). Image is displayed.

  An electroluminescent element is also called an electroluminescence (EL) element. The light-emitting element has a structure in which a light-emitting layer coated with an electroluminescent light-emitting body (EL light-emitting body) is provided between a transparent electrode and a metal electrode formed on a substrate. This light-emitting element utilizes a phenomenon (electroluminescence) that emits light when an emission center in an excited EL light-emitting element returns to its original state by applying an electric field by electrodes formed above and below the light-emitting layer. To do.

  Examples of the electroluminescent element include an inorganic EL element using a metal compound such as zinc sulfide as a light emitter, an organic EL element using an organic compound as a light emitter, and the like from the viewpoints of availability, diversity, and lightness. Organic EL elements are preferred.

  FIG. 2 shows a pixel drive circuit diagram of the image display apparatus shown in FIG. In the circuit shown in FIG. 2, when both the first thin film transistor (T1) and the second thin film transistor (T2) are turned on by signals from the signal line (Vd) and the scanning line (Vs), the fuel cell (FC). Current flows through the organic EL element (OELD), and the organic EL element (OELD) emits light. Further, when the first thin film transistor (T1) is ON and the second thin film transistor (T2) is OFF, the current is stored in the storage capacitor element (Cst).

FIG. 3 shows a sectional view of the structure of the image display device shown in FIG. In FIG. 3, only a single pixel is shown for the sake of simplicity.
3 includes a thin film transistor 2 formed on a substrate 1, a pixel electrode (anode) 4 connected to the thin film transistor 2, a hole injection layer 6 formed on the pixel electrode 4, and a positive electrode. It has a light emitting layer 8 formed on the hole injection layer 6 and a reflective electrode (cathode) 9 formed on the light emitting layer 8. A fuel cell (FC) is disposed above the reflective electrode 9. One of the fuel cells is connected to the reflective electrode 9 through the wiring 13, and the other is connected to the pixel electrode 4 through the wiring 11. Yes.

2) Manufacturing method of image display device The manufacturing method of the image display device of the present invention is a method of manufacturing the image display device of the present invention, and the fuel cell of the image display device includes a step of using a discharge device. It is formed by a method.

  FIG. 4 shows an outline of the configuration of an ink jet type ejection device 20a used when manufacturing the image display device of the present invention. The ejection device 20a includes an inkjet head 22 that ejects an ejected material onto a substrate. The ink jet head 22 includes a head main body 24 and a nozzle forming surface 26 on which a large number of nozzles for discharging discharged matter are formed. Further, the ejection device 20a includes a table 28 on which a substrate is placed. The table 28 is installed to be movable in a predetermined direction, for example, the X-axis direction, the Y-axis direction, and the Z-axis direction. Further, the table 28 moves in the direction along the X axis as indicated by an arrow in the drawing, whereby the substrate to be conveyed is placed on the table 28 and taken into the discharge device 20a.

  The inkjet head 22 is connected to a tank 30 that stores the discharge material discharged from the nozzles formed on the nozzle forming surface 26. In other words, the tank 30 and the inkjet head 22 are connected by a discharge material transport pipe 32 that transports the discharge material. In addition, the discharge material transport pipe 32 includes a discharge material flow path portion ground joint 32a and a head portion bubble elimination valve 32b for preventing charging in the flow path of the discharge material transport pipe 32.

  The head part bubble elimination valve 32b is used when suctioning the discharged material in the inkjet head 22 by the suction cap 40 described later. That is, when sucking the discharged material in the ink jet head 22 by the suction cap 40, the head part bubble elimination valve 32b is closed so that the discharged material does not flow from the tank 30 side. Then, when suction is performed with the suction cap 40, the flow rate of the suctioned product is increased, and the bubbles in the inkjet head 22 are quickly discharged.

  The discharge device 20 a includes a liquid level control sensor 36 for controlling the amount of discharge material stored in the tank 30, that is, the height of the liquid level 34 a of the discharge material stored in the tank 30. ing. The liquid level control sensor 36 keeps the height difference h (hereinafter referred to as the water head value) between the tip end portion 26a of the nozzle forming surface 26 of the inkjet head 22 and the liquid level 34a in the tank 30 within a predetermined range. Take control. By controlling the height of the liquid level 34a, the discharge 34 in the tank 30 is sent to the inkjet head 22 with a pressure within a predetermined range. Then, the ejected material 34 can be stably ejected from the inkjet head 22 by sending the ejected material 34 at a pressure within a predetermined range.

  A suction cap 40 that sucks the discharged material in the nozzles of the inkjet head 22 is disposed at a certain distance from the nozzle formation surface 26 of the inkjet head 22. The suction cap 40 is configured to be movable in the direction along the Z-axis indicated by an arrow in FIG. 4, and is in close contact with the nozzle forming surface 26 so as to surround a plurality of nozzles formed on the nozzle forming surface 26. In addition, a sealed space is formed between the nozzle forming surface 26 and the nozzle can be blocked from outside air. In addition, the suction of the ejected matter in the nozzle of the inkjet head 22 by the suction cap 40 is in a state where the inkjet head 22 is not ejecting the ejected material 34, for example, the inkjet head 22 is retracted to a retracted position or the like. This is performed when the table 28 is retracted to a position indicated by a broken line.

  A flow path is provided below the suction cap 40, and a suction valve 42, a suction pressure detection sensor 44 for detecting a suction abnormality, and a suction pump 46 including a tube pump are disposed in the flow path. Has been. Further, the discharge 34 sucked by the suction pump 46 and transported through the flow path is accommodated in a waste liquid tank 48.

A method for manufacturing the image display device shown in FIG. 3 will be described below with reference to the drawings.
The image display device manufacturing method described below includes (1) a step of manufacturing an image display device body, (2) a step of manufacturing a fuel cell, and (3) incorporating the obtained fuel cell into the image display device body. In any of (1) the step of manufacturing the image display device and (2) the step of manufacturing the fuel cell, an ink jet type discharge device is used.

(1) Step of manufacturing image display device main body First, a substrate is prepared. Here, light emitted from a light emitting layer to be described later can be extracted from the substrate side, and can be configured to be extracted from the side opposite to the substrate.
In the case where the emitted light is extracted from the substrate side, a transparent or translucent material such as glass, quartz, or resin is used as the substrate material, but a particularly inexpensive glass substrate is preferably used.

In the case where the emitted light is extracted from the opposite side of the substrate, the substrate may be opaque. In that case, a ceramic sheet such as alumina, a metal sheet such as stainless steel that has been subjected to insulation treatment such as surface oxidation, thermosetting Resins, thermoplastic resins, and the like can be used. Alternatively, a color filter film, a color conversion film containing a fluorescent material, or a dielectric reflection film may be disposed on the substrate to control the emission color.
In the present embodiment, the transparent glass substrate 1 is used as the substrate.

Next, as shown in FIG. 5A, a thin film transistor (TFT) 2 is formed at a predetermined position on the transparent glass substrate 1 by a known method using polysilicon.
Next, after forming an interlayer insulating film (not shown), contact holes are formed, and a conductive material is embedded in these contact holes. Further, signal lines and scanning lines (not shown) are formed on the interlayer insulating film.

  Then, an interlayer insulating film 3 is formed so as to cover the upper surface of each wiring, an ITO film is formed so as to be electrically connected to the thin film transistor (TFT) 2, and the ITO film is patterned, and illustration is omitted. A pixel electrode (also referred to as an anode) 4 is formed at a predetermined position surrounded by the signal line and the scanning line. Furthermore, the insulating layer 5 is formed in a portion other than a place where a hole injection layer and a light emitting layer to be described later are formed. The state shown in FIG. 5B is obtained as described above.

Next, the partition wall 7 is formed so as to surround the formation site of the hole injection layer and the light emitting layer. The partition 7 functions as a partition member and is preferably formed of an insulating organic material such as polyimide. The partition wall 7 is formed to have a height of 1 to 2 μm, for example. Further, as will be described later, the hole injection layer and the light emitting layer are formed by using a discharge device, and the partition wall 7 is preferably one that exhibits non-affinity with respect to the liquid material discharged from the discharge device. In order to make the partition wall 7 have non-affinity, for example, a method of surface-treating the surface of the partition wall 7 with a fluorine compound or the like is employed. As the fluorine compound, for example, CF ₄ , SF ₅ , CHF ₃ or the like can be used. Further, as the surface treatment method of the partition walls 7, plasma treatment, UV irradiation treatment, or the like can be adopted. Under such a configuration, a sufficiently high step is formed between the hole injection layer and the light emitting layer forming place, that is, between the application position of these forming materials and the surrounding partition wall 7. .

Next, with the upper surface of the substrate 1 facing upward, the hole injection layer forming material is selectively applied to a portion surrounded by the partition walls 7 by a discharge device.
As a material for forming the hole injection layer, polyphenylene vinylene whose polymer precursor is polytetrahydrothiophenylphenylene, 1,1-bis- (4-N, N-ditolylaminophenyl) cyclohexane, tris (8-hydroxyquinolinol) ) Aluminum and the like. At this time, the liquid forming material tends to spread in the horizontal direction because of its high fluidity. However, since the partition wall 7 is formed so as to surround the applied position, the forming material passes over the partition wall 7 and outside of the partition wall 7. Spreading is prevented.

  Next, the solvent of the liquid precursor is evaporated by heating or light irradiation, and the hole injection layer 6 is formed on the pixel electrode 4. Further, a light emitting layer forming material (light emitting material) is selectively applied onto the hole injection layer 6 as ink from the discharge device with the upper surface of the substrate 1 facing upward.

  As a material for forming the light emitting layer, for example, a material containing a precursor of a conjugated polymer organic compound and a fluorescent dye for changing the light emitting characteristics of the light emitting layer to be obtained is preferably used. The precursor of the conjugated polymer organic compound is a material that can form a light emitting layer that becomes a conjugated polymer organic EL layer by being heated and cured after being discharged from a discharge device together with a fluorescent dye or the like into a thin film. Say. For example, in the case of a sulfonium salt as a precursor, there may be mentioned those in which a sulfonium group is eliminated by heat treatment to become a conjugated polymer organic compound.

  Such a conjugated polymer organic compound is solid and has strong fluorescence, and can form a homogeneous solid ultrathin film. In addition, it has high forming ability and high adhesion to the transparent electrode. Furthermore, since the precursor of such a compound forms a strong conjugated polymer film after curing, the precursor solution has a desired viscosity applicable to inkjet patterning described later before heat curing. The film can be formed under optimum conditions easily and in a short time.

  As such a precursor, for example, a precursor of PPV (poly (para-phenylene vinylene)) or a derivative thereof is preferable. A precursor of PPV or a derivative thereof is soluble in water or an organic solvent, and can be polymerized, so that a high-quality thin film can be obtained optically. Furthermore, since PPV has strong fluorescence and is also a conductive polymer in which double bond π electrons are non-polarized on the polymer chain, a high-performance organic EL device can be obtained.

  As precursors of such PPV or PPV derivatives, for example, PPV (poly (para-phenylene vinylene)) precursor, MO-PPV (poly (2,5-dimethoxy-1,4-phenylene vinylene)) precursor, CN-PPV (poly (2,5-bishexyloxy-1,4-phenylene- (1-cyanovinylene))) precursor, MEH-PPV (poly [2-methoxy-5- (2′-ethylhexyloxy)] -Para-phenylene vinylene) precursor and the like.

  The precursor of the PPV or PPV derivative is soluble in water as described above, and is polymerized by heating after film formation to form a PPV layer. The content of a precursor represented by the PPV precursor is preferably 0.01 to 10.0% by weight, more preferably 0.1 to 5.0% by weight, based on the entire composition. If the amount of the precursor added is too small, it will be insufficient to form a conjugated polymer film. If the amount is too large, the composition will have a high viscosity, which will result in high-precision patterning by a method using an ejection device (inkjet method). It may not be suitable.

  Moreover, it is preferable that the material for forming the light emitting layer contains at least one fluorescent dye. Thereby, the light emission characteristics of the light emitting layer can be changed. For example, it is effective as a means for improving the light emission efficiency of the light emitting layer or changing the light absorption maximum wavelength (light emission color). That is, the fluorescent dye can be used not only as a light emitting layer material but also as a dye material having a light emitting function itself. For example, most of the exciton energy generated by carrier recombination on the conjugated macromolecular organic compound molecule can be transferred onto the fluorescent dye molecule. In this case, since light emission occurs only from fluorescent dye molecules having high fluorescence quantum efficiency, the current quantum efficiency of the light emitting layer is also increased. Therefore, by adding a fluorescent dye to the material for forming the light emitting layer, the emission spectrum of the light emitting layer simultaneously becomes that of the fluorescent molecule, which is effective as a means for changing the emission color.

  Here, the current quantum efficiency is a scale for considering the light emission performance based on the light emission function, and is defined by the formula: ηE = (energy of photon emitted / input electric energy). Then, by converting the light absorption maximum wavelength by doping the fluorescent dye, for example, three primary colors of red, blue, and green can be emitted, and as a result, a full color display can be obtained. Furthermore, the luminous efficiency of the EL element can be greatly improved by doping with a fluorescent dye.

  As the fluorescent dye, when forming a light emitting layer that emits red colored light, it is preferable to use rhodamine or a rhodamine derivative having red colored light. Since these fluorescent dyes are low in molecular weight, they are soluble in an aqueous solution, have good compatibility with PPV, and can easily form a uniform and stable light emitting layer. Specific examples of such fluorescent dyes include rhodamine B, rhodamine B base, rhodamine 6G, rhodamine 101 perchlorate and the like, and a mixture of two or more thereof may be used.

  Moreover, when forming the light emitting layer which emits green colored light, it is preferable to use quinacridone and its derivatives having green colored light. These fluorescent dyes, like the red fluorescent dyes, are low in molecular weight and therefore soluble in aqueous solutions, and are compatible with PPV and can easily form a light emitting layer.

  Furthermore, when forming a light emitting layer that emits blue colored light, it is preferable to use distyrylbiphenyl having a blue colored light and derivatives thereof. These fluorescent dyes, like the red fluorescent dyes, are low in molecular weight, so are soluble in a water / alcohol mixed solution, have good compatibility with PPV, and facilitate the formation of a light emitting layer.

  In addition, examples of other fluorescent dyes having blue colored light include coumarin and derivatives thereof. These fluorescent dyes, like the above-mentioned red fluorescent dyes, are low in molecular weight and therefore are soluble in aqueous solutions, and have good compatibility with PPV and facilitate the formation of a light emitting layer.

  Specific examples of such fluorescent dyes include coumarin, coumarin-1, coumarin-6, coumarin-7, coumarin 120, coumarin 138 and the like. The fluorescent dye is preferably added in an amount of 0.5 to 10% by weight, more preferably 1.0 to 5.0% by weight, based on the solid precursor of the conjugated polymer organic compound. If the amount of fluorescent dye added is too large, it will be difficult to maintain the weather resistance and durability of the light-emitting layer. On the other hand, if the amount added is too small, the effects of adding the fluorescent dye as described above cannot be obtained sufficiently. It is.

  The precursor and the fluorescent dye are preferably dissolved or dispersed in a polar solvent to form an ink, and the ink is preferably discharged from a discharge device. Since the polar solvent can easily dissolve or uniformly disperse the precursor, the fluorescent dye, etc., the solid component in the light emitting layer forming material in the nozzle hole of the discharge device may adhere or become clogged. Can be prevented.

  Specific examples of such polar solvents include water; alcohols compatible with water such as methanol and ethanol; N, N-dimethylformamide (DMF), N-methylpyrrolidone (NMP), dimethylimidazoline (DMI), An organic solvent or an inorganic solvent such as dimethyl sulfoxide (DMSO) may be used, and two or more of these solvents may be appropriately mixed.

  Furthermore, it is preferable to add a wetting agent to the forming material. Thereby, it can prevent effectively that a forming material dries and solidifies in the nozzle hole of a discharge device. Examples of the wetting agent include polyhydric alcohols such as glycerin and diethylene glycol, and a mixture of two or more of these may be used. The amount of the wetting agent added is preferably about 5 to 20% by weight with respect to the total amount of the forming material. In addition, you may add another additive and a film stabilization material, For example, a stabilizer, a viscosity modifier, an anti-aging agent, a pH adjuster, an antiseptic | preservative, a resin emulsion, a leveling agent etc. can be used.

  When such a light emitting layer forming material is discharged using a discharge device, the forming material is applied onto the hole injection layer 6 in the partition wall 7. Here, the formation of the light emitting layer by discharging the forming material includes the formation material of the light emitting layer that emits red colored light, the material of the light emitting layer that emits green colored light, and the light emitting layer that emits blue colored light. The forming material is discharged and applied to the corresponding pixels. Note that the pixels corresponding to each color are determined in advance so that they are regularly arranged.

  When the light emitting layer forming material of each color is discharged and applied, the solid light emitting layer 8 is formed on the hole injection layer 6 by evaporating the solvent in the light emitting layer forming material. Here, with respect to the evaporation of the solvent in the light emitting layer forming material, treatment such as heating or decompression is performed as necessary. However, since the light emitting layer forming material usually has good drying properties and quick drying properties, Therefore, the light emitting layer 8 of each color can be formed in the order of application by sequentially discharging and applying the light emitting layer forming material of each color without performing such a process.

  Thereafter, the reflective electrode (also referred to as a cathode) 9 is formed on the entire surface of the transparent glass substrate 1 or in a stripe shape to obtain an organic EL element. The state shown in FIG. 6D is obtained as described above.

  According to the method of the present embodiment, since the thin film which is a constituent element of the organic EL element such as the hole injection layer 6 and the light emitting layer 8 is formed by the discharge device, the formation of the hole injection layer 6 and the light emitting layer 8 is performed. It is possible to reduce the loss of ink as a material and to prevent ejection failure due to bubbles.

Next, after the insulating layer 10 is formed on the entire surface, the lead-out line 11 for electrically connecting the pixel electrode 4 and the fuel cell is formed, thereby obtaining the state shown in FIG.
Next, the insulating layer 12 having the opening A is formed in the portion that accommodates the fuel cell, and the lead wire 13 for electrically connecting the reflective electrode 9 and the fuel cell is formed, so that FIG. The state shown in is obtained.

(2) Step of Manufacturing Fuel Cell Next, a fuel cell to be incorporated into the image display device main body shown in FIG.
FIG. 7 is a diagram illustrating an example of a configuration of a fuel cell production line that performs a fuel cell production process according to an embodiment. As shown in FIG. 7, the fuel cell production line includes a discharge device 20a to 20m used in each process, a belt conveyor BC1 connecting the discharge devices 20a to 20k, a belt conveyor BC2 connecting the discharge devices 20l and 20m, and a belt. The driving device 70 drives the conveyors BC1 and BC2, the assembling device 72 for assembling the fuel cell, and the control device 71 for controlling the entire fuel cell production line.

  The configuration of the ejection devices 20b to 20m is the same as that of the ejection device 20a, and thus the description thereof will be omitted. However, in the following description, each configuration of the ejection devices 20b to 20m is different in the description of the ejection device 20a. The description will be made using the same reference numerals as those used in the configuration. In addition, in the tank 30 provided in each of the discharge devices 20b to 20m, a discharge material necessary for a predetermined process performed in each of the discharge devices 20b to 20m is accommodated. For example, the discharge material for etching performed when forming the gas flow path is formed in the tank 30 of the discharge device 20b and the discharge device 20m, and the supporting carbon is formed in the tank 30 of the discharge device 20c and the discharge device 20k. In the discharge device 20d and the tank 30 of the discharge device 20j, discharge materials for forming a current collecting layer are respectively stored. Further, the discharge material for forming the gas diffusion layer is in the tank 30 of the discharge device 20e and the discharge device 20i, and the discharge material for forming the reaction layer is in the tank 30 of the discharge device 20f and the discharge device 20h. In the tank 30 of the discharge device 20g, discharge materials for forming the electrolyte membrane are respectively stored. Further, in the tank 30 of the discharge device 20l, the same discharge material as the discharge material for forming a gas flow path with respect to the substrate stored in the tank 30 of the discharge device 20a is stored.

  The discharge devices 20a to 20k are arranged in a line at a predetermined interval along the belt conveyor BC1, and the discharge devices 20l and 20m are arranged in a line at a predetermined interval along the belt conveyor BC2. The control device 71 is connected to each of the discharge devices 20a to 20k, the drive device 70, and the assembly device 72. The belt conveyor BC1 is driven based on a control signal from the control device 71, and a substrate of the fuel cell (hereinafter simply referred to as “substrate”) is conveyed to each of the discharge devices 20a to 20k, and in each of the discharge devices 20a to 20k. Process. Similarly, the belt conveyor BC2 is driven based on a control signal from the control device 71, the substrate is conveyed to the discharge devices 20l and 20m, and processing in the discharge devices 20l and 20m is performed. Further, in the assembling apparatus 72, the fuel cell is assembled by the substrates carried in via the belt conveyor BC1 and the belt conveyor BC2 based on the control signal from the control apparatus 71.

  In this fuel cell production line, a process of applying a resist solution for forming a gas flow path to the substrate is performed in the discharge device 20a, and an etching process for forming the gas flow path is performed in the discharge device 20b. In the discharge device 20c, a process of applying a supporting carbon for supporting the current collecting layer is performed. The discharge device 20d performs a process for forming a current collecting layer, the discharge device 20e performs a process for forming a gas diffusion layer, the discharge device 20f performs a process for forming a reaction layer, and the discharge device 20g. In FIG. 5, a process for forming an electrolyte membrane is performed. Further, a process for forming a reaction layer is performed in the discharge device 20h, a process for forming a gas diffusion layer is performed in the discharge device 20i, and a process for forming a current collecting layer is performed in the discharge device 20j. In the apparatus 20k, a process of applying the supporting carbon is performed. Further, in the discharge device 20l, a process of applying a resist solution for forming a gas flow path to the substrate is performed, and in the discharge apparatus 20m, an etching process for forming the gas flow path is performed. When processing is performed on the first substrate in the discharge devices 20a to 20k, in the discharge devices 20l and 20m, processing for forming a gas flow path is performed on the second substrate.

Next, a method for manufacturing a fuel cell using the discharge devices 20a to 20m will be described.
First, a gas flow path for supplying a reaction gas to the substrate is formed. That is, first, a rectangular flat plate shape as shown in FIG. 8A, for example, a silicon substrate (first substrate) 52 is conveyed to the discharge device 20a by the belt conveyor BC1. The board | substrate 52 conveyed by belt conveyor BC1 is mounted on the table 28 of the discharge apparatus 20a, and is taken in in the discharge apparatus 20a. In the discharge device 20 a, the resist solution stored in the tank 30 is discharged through the nozzles of the nozzle formation surface 26 and applied to a predetermined position on the upper surface of the substrate 52 placed on the table 28. Here, as shown in FIG. 8B, the resist solution is applied linearly at a predetermined interval from the front direction to the back side in the figure. That is, in the substrate 52, for example, a portion for forming a gas flow path (first gas flow path) for supplying a first reaction gas containing hydrogen is left, and only the other portions are resisted. The solution is applied.

  Next, the substrate 52 (see FIG. 8B) on which the resist solution is applied at a predetermined position is conveyed to the discharge device 20b by the belt conveyor BC1, and is placed on the table 28 of the discharge device 20b to be discharged. 20b. In the discharge device 20b, an etching solvent, for example, a hydrofluoric acid aqueous solution, which is used to form a gas flow path accommodated in the tank 30, is discharged through the nozzles of the nozzle forming surface 26, and is then placed on the table It is applied to the entire top surface of the substrate 52 placed on the substrate.

  Here, since the resist solution is applied to the substrate 52 in a portion other than the portion that forms the gas flow path, the portion where the resist solution is not applied is etched with the hydrofluoric acid aqueous solution, as shown in FIG. As shown, a gas flow path is formed. That is, a gas flow path having a U-shaped cross section extending from one side surface of the substrate 52 to the other side surface is formed. Further, as shown in FIG. 9A, the substrate 52 on which the gas flow path is formed is subjected to resist cleaning in a cleaning apparatus (not shown). Then, as shown in FIG. 9B, the substrate 52 on which the gas flow path is formed is transferred from the table 28 to the belt conveyor BC1, and is conveyed to the discharge device 20c by the belt conveyor BC1.

  Next, in order to prevent the gas flow path formed in the substrate 52 from being blocked by the current collection layer, support carbon (first support member) that supports the current collection layer is applied to the gas flow path. . That is, first, the substrate 52 conveyed to the discharge device 20c by the belt conveyor BC1 is placed on the table 28 and taken into the discharge device 20c. In the discharge device 20 c, the support carbon 54 accommodated in the tank 30 is discharged through the nozzles of the nozzle forming surface 26 and applied to the gas flow path formed in the substrate 52. Here, as the supporting carbon 54, porous carbon having a predetermined size, for example, a particle diameter of about 1 to 5 microns in diameter is used. That is, a porous carbon having a predetermined size is used as the supporting carbon 54 so that the gas flow path is prevented from being blocked by the current collecting layer, and the reaction gas can surely flow in the gas flow path. Used.

  FIG. 10 is an end view of the substrate 52 coated with the supporting carbon 54. As shown in FIG. 10, the supporting carbon 54 is applied in the gas flow path, so that the current collecting layer formed on the substrate 52 is prevented from falling into the gas flow path. The substrate 52 coated with the supporting carbon 54 is transferred from the table 28 to the belt conveyor BC1, and is conveyed to the discharge device 20d by the belt conveyor BC1.

  Next, a current collecting layer (first current collecting layer) for collecting electrons generated by the reaction of the reaction gas is formed on the substrate 52. That is, first, the substrate 52 transported to the discharge device 20d by the belt conveyor BC1 is placed on the table 28 and taken into the discharge device 20d. In the discharge device 20 d, a material for forming the current collecting layer 56 accommodated in the tank 30, for example, a conductive substance such as copper, is placed on the table 28 through the nozzles of the nozzle forming surface 26. Discharge onto the substrate 52. At this time, the conductive material is discharged into a shape that does not hinder diffusion of the reaction gas supplied to the gas flow path, for example, a mesh shape, and the current collection layer 56 is formed.

  FIG. 11 is an end view of the substrate 52 on which the current collecting layer 56 is formed. As shown in FIG. 11, the current collecting layer 56 is supported by the supporting carbon 54 in the gas channel formed on the substrate 52, and is prevented from falling into the gas channel. In addition, the board | substrate 52 with which the current collection layer 56 was formed is moved to the belt conveyor BC1 from the table 28, and is conveyed by the belt conveyor BC1 to the discharge apparatus 20e.

  Next, a gas diffusion layer for diffusing the reaction gas supplied through the gas flow path formed in the substrate 52 is formed on the current collecting layer 56. That is, first, the substrate 52 transported to the discharge device 20e by the belt conveyor BC1 is placed on the table 28 and taken into the discharge device 20e. In the discharge device 20e, a material for forming the gas diffusion layer 58 accommodated in the tank 30, for example, carbon is discharged onto the current collecting layer 56 through the nozzles of the nozzle forming surface 26, and the gas flow path. A gas diffusion layer 58 for diffusing the reaction gas (first reaction gas) supplied via the gas is formed.

  FIG. 12 is an end view of the substrate 52 on which the gas diffusion layer 58 is formed. As shown in FIG. 12, for example, carbon that also functions as an electrode is discharged onto the current collecting layer 56 to form a gas diffusion layer 58 for diffusing the reaction gas. Here, as the carbon constituting the gas diffusion layer 58, porous carbon having such a size that the reaction gas supplied through the gas flow path can be sufficiently diffused is used. . For example, porous carbon which is smaller than the supporting carbon 54 and has a particle diameter of about 0.1 to 1 micron is used. The substrate 52 on which the gas diffusion layer 58 is formed is transferred from the table 28 to the belt conveyor BC1, and is conveyed to the discharge device 20f by the belt conveyor BC1.

  Next, a reaction layer (first reaction layer) that reacts based on the reaction gas supplied via the gas flow path formed in the substrate 52 is formed on the gas diffusion layer 58. That is, the board | substrate 52 conveyed by the belt conveyor BC1 to the discharge apparatus 20f is mounted on the table 28, and is taken in in the discharge apparatus 20f. In the discharge device 20f, a material for forming a reaction layer accommodated in the tank 30, for example, carbon carrying platinum fine particles for a catalyst having a particle diameter of several nanometers to several tens of nanometers is discharged onto the gas diffusion layer 58. Thus, the reaction layer 60 is formed. Here, the carbon carrying the platinum fine particles is the same carbon as the carbon constituting the gas diffusion layer 58, that is, the same particle size and the porous carbon. In addition, after dispersing platinum fine particles by adding a dispersant to the solvent and applying the dispersion onto the gas diffusion layer 58, for example, by heating the substrate 52 to 200 ° C. in a nitrogen atmosphere, the dispersant is removed, The reaction layer 60 may be formed. In this case, the reaction layer 60 is formed by depositing platinum fine particles as a catalyst on the surface of carbon constituting the gas diffusion layer 58.

  FIG. 13 is an end view of the substrate 52 on which the reaction layer 60 is formed. As shown in FIG. 13, the reaction layer 60 is formed by applying carbon carrying platinum fine particles as a catalyst onto the gas diffusion layer 58. In FIG. 13, only the platinum fine particles are shown as the reaction layer 60 so that the reaction layer 60 and the gas diffusion layer 58 can be easily identified. In the following figures, the reaction layer is shown in the same manner as in FIG. The substrate 52 on which the reaction layer 60 is formed is transferred from the table 28 to the belt conveyor BC1, and is conveyed to the discharge device 20g by the Belcoton bear BC1.

  Next, an electrolyte membrane such as an ion exchange membrane is formed on the reaction layer 60. That is, first, the substrate 52 conveyed to the discharge device 20g by the belt conveyor BC1 is placed on the table 28 and taken into the discharge device 20g. In the discharge device 20g, a material for forming an electrolyte membrane accommodated in the tank 30, for example, a material in which a ceramic solid electrolyte such as Nafion (registered trademark), tungstophosphoric acid, molybdophosphoric acid, etc. is adjusted to a predetermined viscosity, The electrolyte membrane 62 is formed by discharging onto the reaction layer 60 through the nozzle of the nozzle forming surface 26.

  FIG. 14 is an end view of the substrate 52 on which the electrolyte membrane 62 is formed. As shown in FIG. 14, an electrolyte membrane 62 having a predetermined thickness is formed on the reaction layer 60. The substrate 52 on which the electrolyte membrane 62 is formed is transferred from the table 28 to the belt conveyor BC1, and is conveyed to the discharge device 20h by the belt conveyor BC1.

  Next, a reaction layer (second reaction layer) is formed on the electrolyte membrane 62. That is, the substrate 52 transported to the discharge device 20h by the belt conveyor BC1 is placed on the table 28 and taken into the discharge device 20h. In the discharge device 20h, carbon carrying platinum fine particles as a catalyst is discharged by a process similar to the process performed in the discharge device 20f to form a reaction layer 60 '.

  FIG. 15 is an end view of the substrate 52 in which the reaction layer 60 ′ is formed on the electrolyte membrane 62. As shown in FIG. 15, a reaction layer 60 ′ is formed by applying carbon carrying platinum fine particles as a catalyst onto the electrolyte membrane 62. Here, the reaction layer 60 ′ is a layer that reacts based on a second reaction gas, for example, a reaction gas containing oxygen.

  Next, a gas diffusion layer for diffusing the reaction gas (second reaction gas) is formed on the reaction layer 60 '. That is, the substrate 52 on which the reaction layer 60 ′ is formed is conveyed to the discharge device 20i by the belt conveyor BC1, and the discharge device 20i is a porous member having a predetermined particle diameter by the same process as the process performed in the discharge device 20e. The carbon is applied to form a gas diffusion layer 58 ′.

  FIG. 16 is an end view of the substrate 52 in which a gas diffusion layer is formed on the reaction layer 60 ′. As shown in FIG. 16, by applying porous carbon on the reaction layer 60 ', a gas diffusion layer 58' is formed.

  Next, a current collecting layer (second current collecting layer) is formed on the gas diffusion layer 58 ′, and supporting carbon (second supporting member) for supporting the current collecting layer is formed on the current collecting layer. Apply. That is, the substrate 52 transported to the discharge device 20j by the belt conveyor BC1 is placed on the table 28 and taken into the discharge device 20j, and the current collecting layer 56 is processed by the same processing as that performed in the discharge device 20d. 'Is formed on the gas diffusion layer 58'. Further, the substrate 52 transported to the discharge device 20k by the belt conveyor BC1 is placed on the table 28 and taken into the discharge device 20k, and the supporting carbon 54 is obtained by the same processing as that performed in the discharge device 20c. 'Is applied. The substrate 52 coated with the supporting carbon 54 ′ is transferred from the table 28 to the belt conveyor BC 1 and conveyed to the assembling apparatus 72.

  FIG. 17 is an end view of the substrate 52 in which the current collecting layer 56 ′ and the supporting carbon 54 ′ are coated on the gas diffusion layer 58 ′. As shown in FIG. 17, the current collecting layer 56 'is formed by the above-described process, and the supporting carbon 54' is applied by the above-described process. Here, the supporting carbon 54 ′ is applied in the same manner as the supporting carbon 54, that is, along the gas flow path formed in the substrate 52.

  Next, the fuel cell is assembled by disposing a substrate (second substrate) on which a gas flow path is formed on a substrate (first substrate) coated with supporting carbon. That is, in the assembling apparatus 72, by placing the substrate 52 ′ (second substrate) carried in via the belt conveyor BC2 on the substrate 52 (first substrate) carried in via the belt conveyor BC1, Assemble the fuel cell. Here, a second gas flow path is formed in the substrate 52 ′ separately from the above processing. That is, in the discharge device 20l and the discharge device 20m, the second gas flow path is formed by the same process as the process performed by the discharge device 20a and the discharge device 20b. Therefore, the U-shaped gas channel extending from one side surface to the other side surface formed on the substrate 52 and the U-shaped gas channel formed on the substrate 52 ′ are parallel to each other. Thus, the fuel cell is assembled by arranging the substrate 52 ′.

  FIG. 18 is an end view of the manufactured fuel cell. As shown in FIG. 18, the substrate 52 ′ having the second gas flow path is disposed at a predetermined position on the substrate 52, and the first gas flow path formed on the first substrate is then passed through the first gas flow path. The production of a fuel cell that supplies one reactive gas and supplies the second reactive gas via the second gas flow path formed on the second substrate is completed.

  According to this embodiment, a fuel cell is manufactured by forming a gas flow path on a substrate using an ink jet type ejection device. Therefore, since a fine gas flow path can be formed on the substrate without using a microfabrication technique such as MEMS used in a semiconductor process, a high-performance fuel cell can be manufactured at a low cost.

  According to this embodiment, a fuel cell is manufactured by forming a reaction layer using an ink jet type discharge device. Therefore, even when an expensive substance such as platinum is used as the material of the catalyst, the necessary amount can be accurately discharged to a predetermined position, and the usage amount of the catalyst is unnecessarily increased. Thus, the fuel cell can be manufactured at a low cost. Further, by applying the catalyst using an ink jet type discharge device, the catalyst can be uniformly applied on the gas diffusion layer, and the performance of the fuel cell can be improved.

  Further, according to the fuel cell of this embodiment, the fuel cell is manufactured by forming the electrolyte membrane using the ink jet type discharge device. Therefore, it is not necessary to pressure-bond the electrolyte membrane, and damage to the electrolyte membrane can be prevented. Further, since the electrolyte membrane is formed by applying a material for forming the electrolyte membrane on the reaction layer, the fuel cell can be manufactured by a simple work process.

  In the above-described embodiment, the inkjet discharge device is used in all the steps. However, the fuel cell may be manufactured using the inkjet discharge device in any step of manufacturing the fuel cell. . For example, the gas flow path may be formed using an ink jet type discharge device, and the fuel cell may be manufactured by the same process as the conventional process in other processes. Even in this case, since the gas flow path can be formed without using MEMS, the manufacturing cost of the fuel cell can be kept low.

  In the manufacturing method of the fuel cell according to the above-described embodiment, the manufacturing is performed from the first substrate side to which the first reaction gas is supplied, but the second substrate to which the second reaction gas is supplied. You may make it manufacture from the side. That is, the production of the fuel cell may be started from the substrate on the side supplied with the second reaction gas containing oxygen.

  In the fuel cell manufacturing method according to the above-described embodiment, the second gas flow path is formed on the second substrate in the same manner as the first gas flow path formed on the first substrate. Alternatively, it may be formed in a direction that intersects the first gas flow path. That is, the resist solution is applied, for example, in a direction extending from the right side surface to the left side surface in FIG. 8B so as to intersect the gas flow path formed on the first substrate at a right angle. You may do it. In this case, the second substrate so that the second gas channel formed in the second substrate and the first gas channel formed in the first substrate intersect at right angles. Is placed.

  In the fuel cell manufacturing method according to the above-described embodiment, the current collection layer, the reaction layer, the electrolyte membrane, the reaction layer, and the current collection layer are formed on the first substrate on which the gas flow path is formed. The current collecting layer, the reaction layer, and the electrolyte film may be formed on each of the first substrate and the second substrate. That is, first, a first gas flow path for supplying a first reaction gas is formed on the first substrate, and the first collection channel is formed on the first substrate on which the first gas flow path is formed. An electric layer is formed. Next, a first reaction layer is formed on the first current collection layer, and an electrolyte membrane is formed on the first reaction layer. Further, for the second substrate, the second gas flow path is formed to form the second current collecting layer, the second reaction layer is formed on the second current collecting layer, and the second substrate An electrolyte membrane is formed on the reaction layer. The first substrate on which the first gas flow path, the first current collecting layer, the first reaction layer, and the electrolyte film are formed, the second gas flow path, the second current collecting layer, the second The fuel cell may be manufactured by bonding the reaction layer and the second substrate on which the electrolyte membrane is formed with the electrolyte membrane formed therebetween. Here, a first manufacturing line for processing the first substrate and a second manufacturing line for processing the second substrate may be provided, and the processes in the respective manufacturing lines may be performed in parallel. In this case, since the process for the first substrate and the process for the second substrate can be performed in parallel, the fuel cell can be rapidly manufactured.

(3) Step of incorporating fuel cell Next, the fuel cell manufactured as described above is incorporated into the main body of the image display device shown in FIG. The fuel cell is assembled by housing the fuel cell in the opening A, connecting one electrode of the fuel cell to the lead wire 11, and connecting the other electrode to the lead wire 13.
As described above, the fuel cell-equipped image display device having the structure shown in FIG. 3 can be manufactured.

  In the image display device manufacturing method according to the above-described embodiment, the image display device main body and the fuel cell shown in FIG. 6F are manufactured separately, and the fuel cell is incorporated in the image display device main body. The first substrate 52 in which a gas flow path is formed is installed in the opening A of the image display device body, and a current collecting layer, a reaction layer, and an electrolyte are formed on the first substrate. A film, a reaction layer, and a current collecting layer may be sequentially formed, and as a result, an image display device incorporating a fuel cell may be manufactured. According to this method, a discharge device for forming a hole injection layer and a light emitting layer of a main body of an image display device and a discharge device for manufacturing a fuel cell are arranged on the same production line, and a desired image display is performed. Equipment can be produced continuously.

3) Electronic device The electronic device of the present invention includes the image display device of the present invention. Examples of the electronic device include a mobile phone, a PHS, a mobile, a notebook personal computer, a PDA (personal digital assistant), and a mobile video phone. The electronic device of the present invention may have other functions such as a game function, a data communication function, a recording / playback function, and a dictionary function. According to the electronic device of the present invention, it is possible to provide clean energy appropriately taking into account the global environment as a power supply source.

It is a figure which shows an example of the image display apparatus which concerns on embodiment. It is a pixel drive circuit diagram of the image display device according to the embodiment. 1 is an end view of an image display device according to an embodiment. 1 is a schematic view of an ink jet type ejection device according to an embodiment. It is an end view of the board | substrate in the manufacture process of the image display apparatus which concerns on embodiment. It is an end view of the board | substrate in the manufacture process of the image display apparatus which concerns on embodiment. It is a figure which shows an example of the manufacturing line of the fuel cell integrated in an image display apparatus. It is an end view of the board | substrate of the manufacture process of the fuel cell integrated in an image display apparatus. It is an end view of the board | substrate of the manufacture process of the fuel cell integrated in an image display apparatus. It is an end view of the board | substrate of the manufacture process of the fuel cell integrated in an image display apparatus. It is an end view of the board | substrate of the manufacture process of the fuel cell integrated in an image display apparatus. It is an end view of the board | substrate of the manufacture process of the fuel cell integrated in an image display apparatus. It is an end view of the board | substrate of the manufacture process of the fuel cell integrated in an image display apparatus. It is an end view of the board | substrate of the manufacture process of the fuel cell integrated in an image display apparatus. It is an end view of the board | substrate of the manufacture process of the fuel cell integrated in an image display apparatus. It is an end view of the board | substrate of the manufacture process of the fuel cell integrated in an image display apparatus. It is an end view of the board | substrate of the manufacture process of the fuel cell integrated in an image display apparatus. It is an end view of the board | substrate of the manufacture process of the fuel cell integrated in an image display apparatus. It is a pixel drive circuit diagram of a conventional image display device.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Transparent glass substrate, 2 ... Thin-film transistor (TFT), 3, 5, 10, 12 ... Insulating layer, 4 ... Pixel electrode (transparent electrode), 6 ... Hole injection layer, 7 ... Partition, 8 ... Light emitting layer, 9 ... reflective electrode (cathode) 11, 13, ... lead wire, 52, 52 '... substrate, 54, 54' ... support carbon, 56, 56 '... current collecting layer, 58, 58' ... gas diffusion layer, 60, 60 '... reaction layer, 62 ... electrolyte membrane, 20a-20m ... discharge device, BC1, BC2 ... belt conveyor, EA ... light emitting area, Vd ... signal line, Vs ... scanning line, Vdd ... power source, T1, T2 ... thin film transistor, FC ... Fuel cell, OELD ... Organic EL element, Cst ... Storage capacitor element

Claims (6)

  An image display device in which a plurality of electroluminescent elements are formed on a substrate, wherein at least one of the plurality of light emitting elements includes a fuel cell as a power supply source.   The image display device according to claim 1, wherein the light emitting element is an organic electroluminescence element having a pixel electrode, a reflective electrode, and a light emitting layer provided between the pixel electrode and the reflective electrode. An image display device in which a plurality of electroluminescent elements are formed on a substrate,
A pixel electrode formed on the substrate;
A hole injection layer formed on the pixel electrode;
A light emitting layer formed on the hole injection layer;
A reflective electrode formed at a position facing the pixel electrode across the light emitting layer;
An image display device comprising: a fuel cell electrically connected to the pixel electrode and the reflective electrode.   The image display apparatus according to claim 1, wherein the fuel cell is provided on each of the light emitting elements as a power supply source above the pixel electrode and the reflective electrode.   5. The method of manufacturing an image display device according to claim 1, wherein the fuel cell of the image display device is formed by a forming method including a step of using a discharge device. Manufacturing method.   An electronic apparatus comprising the image display device according to claim 1.

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