JP2005062628A - Display module and electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a display module whose manufacturing history can be easily traced with a nondestructive manner even if an electro-optical device for a flat display is covered with an exterior member and to provide an electronic device. <P>SOLUTION: The display module 1 is so constituted that the electro-optical device 100 and a backlight device 60 are disposed to be superposed on each other on the inner side of the exterior member 200 and an image displayed by the electro-optical device 100 can be viewed from an upper surface aperture 210 of the exterior member 200. A radio type ID tag chip 2 is mounted on a first substrate 10 in an overhanging region 11 overhanging from an outer peripheral edge of a second substrate 20 and a height dimension of the ID tag chip 2 is specified to be the thickness dimension of the second substrate 20 or lower, e.g. ≤1 mm. A flexible substrate 4 at which an antenna wiring 3 connected to the ID tag chip 2 is formed is connected to the first substrate 10 in the overhanging region 11. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a display module in which an electro-optical device for a flat display is covered with an exterior member, and an electronic apparatus using the display module. More specifically, the present invention relates to an ID tag attaching technique that enables tracking of a manufacturing history of an electro-optical device.

  In a display module mounted on a mobile phone, a mobile computer, or the like, generally, an electro-optical device 100 for a flat display such as a liquid crystal device is covered with an exterior member 200 as shown in FIGS. The electro-optical device 100 and the backlight device 60 are arranged inside the exterior member 200 having a structure, and an image displayed on the electro-optical device 100 is displayed on the upper surface opening 210 of the exterior member 200. Can be seen from.

  The electro-optical device 100 shown here includes a panel structure in which a transparent first substrate 10 and a second substrate 20 are bonded to face each other, and the first substrate 10 and the second substrate 20 are bonded to each other. An electro-optical material such as liquid crystal is held between them. In the first substrate 10 and the second substrate 20, electrodes for driving the electro-optic material are formed on surfaces (surfaces) facing each other, and a predetermined signal is applied to each electrode. As a result, the electro-optical material is driven for each pixel in the first substrate 10 and the second substrate 20 to display an image.

  The first substrate 10 and the second substrate 20 are bonded together so that the first substrate 10 projects from the outer peripheral edge of the second substrate 20, and the surface on which the second substrate 20 is located in the projecting region 11. On the side, flexible substrates 31, 32, 33 are connected. A driving IC chip (not shown) is mounted on the flexible substrates 31, 32, and 33, and signals are supplied from the driving IC to the electrodes.

  In some cases, a driving IC chip is mounted on the overhanging region 11 of the first substrate 10. Even in this case, the flexible substrate is used to supply power to the driving IC chip. Connected to the overhanging region 11 of the substrate 10. When a TFT (thin film transistor) is formed as a non-linear element for pixel switching with respect to the first substrate 10, a drive circuit may be formed on the first substrate 10 by the TFT. Even in such a case, the flexible substrate is connected to supply power to the drive circuit.

When manufacturing such a display module 1, it is necessary to be able to accurately track the manufacturing history even during manufacturing or when a defect occurs after shipment. Therefore, conventionally, for example, as shown in FIG. 8, when forming a pixel switching element, a wiring, an electrode, or the like using a semiconductor process in a large substrate 10a in which a large number of first substrates 10 can be obtained, photolithography is used. A two-dimensional bar code 50, a one-dimensional bar code, an OCR character, and the like are attached to a region cut out as the first substrate 10 by a technique or a laser marking technique (see, for example, Patent Document 1).
Japanese Patent Laid-Open No. 10-4040

  However, since the two-dimensional code 50 is configured to be read optically, when the electro-optical device 100 is covered with the exterior member 200 and assembled to the display module 1, the exterior member 200, the backlight device 60, and the flexibility The two-dimensional code 50 cannot be read unless the substrates 31, 32, 33, etc. are removed. In addition, in order to read a fine two-dimensional barcode 50, it is necessary to have equipment equipped with a magnifying optical system, and it takes time to read. Therefore, after assembling the display module 1, a specific history is selected. It is not suitable for uses such as. Moreover, since the electro-optical device 100 is required to narrow the outer peripheral portion 13 (frame) of the region 12 for displaying an image every year, it is becoming impossible to secure an area where the two-dimensional barcode 50 can be left.

  In view of the above problems, an object of the present invention is to provide a display module that can easily track its manufacturing history in a non-destructive manner even when an electro-optical device for a flat display is covered with an exterior member. Is to provide.

  In order to solve the above problems, in the present invention, in a display module having at least an electro-optical device for a flat display and an exterior member that covers the electro-optical device, a wireless ID tag function is provided inside the exterior member. The circuit which has is arrange | positioned. More specifically, an IC chip mounted with a circuit having an ID tag function (hereinafter referred to as an ID tag chip, but also referred to as an IC tag, a wireless tag, an electronic tag, etc.) is mounted inside the exterior member, Alternatively, a circuit having an ID tag function is formed on the electro-optical device by a thin film process.

  In the present invention, the electro-optical device may have a panel structure in which a first substrate and a second substrate are bonded to face each other. In such a case, in the first substrate, What is necessary is just to arrange | position the said ID tag chip | tip to the surface side in which the said 2nd board | substrate is located of the protrusion area | region from the outer periphery of a 2nd board | substrate.

  In the present invention, the electro-optical device includes a panel structure in which a first substrate and a second substrate are bonded to face each other, and the first substrate has an outer peripheral edge of the second substrate. When a flexible substrate is connected to the surface side of the overhanging region where the second substrate is located, the ID tag chip may be disposed on the surface side of the overhanging region of the first substrate.

  Here, the connecting portion between the flexible substrate and the first substrate and the ID tag chip are preferably covered with the same resin. That is, if the connecting portion between the flexible substrate and the first substrate is covered with a resin that covers the ID tag chip, the connecting portion between the flexible substrate and the first substrate is covered with a single resin coating. And the reliability of both of the ID tag chips can be improved.

  In the present invention, the electro-optical device includes a panel structure in which a first substrate and a second substrate are bonded to face each other, and the first substrate projects from an outer peripheral edge of the second substrate. When a flexible substrate is connected to the surface side of the region where the second substrate is located, the ID tag chip may be mounted on the flexible substrate.

  In the present invention, the electro-optical device includes a panel structure in which a first substrate and a second substrate are bonded to face each other, and the first substrate projects from an outer peripheral edge of the second substrate. When the driving IC chip is mounted on the surface side of the region where the second substrate is located, the ID tag chip may be disposed on the surface side of the projecting region of the first substrate.

  Here, the driving IC chip and the ID tag chip are preferably covered with the same resin. That is, if the driving IC chip is covered with the resin that covers the ID tag chip, the reliability of both the driving IC chip and the ID tag chip can be improved with a single resin coating.

  In the present invention, the ID tag chip may be disposed on the inner surface of the exterior member.

  In the present invention, the electro-optical device may include a panel structure in which a first substrate and a second substrate are bonded to face each other, and the ID tag chip may be formed on the surface of the first substrate.

  In any embodiment of the present invention, it is preferable that the ID tag chip is covered and protected with a resin.

  In the present invention, the electro-optical device includes a panel structure in which a first substrate and a second substrate are bonded to face each other, and the first substrate projects from an outer peripheral edge of the second substrate. When the ID tag chip is mounted on the surface side of the region, the height dimension of the ID tag chip is preferably equal to or less than the thickness dimension of the second substrate, for example, 0.7 mm. With this configuration, even when the ID tag chip is mounted on the first substrate, the thickness dimension does not increase when viewed as the entire electro-optical device.

  In the present invention, the electro-optical device is provided with a mark representing an identification number unique to the device, and at least a part of the identification number represented by the mark is recorded on the ID tag chip. Is preferred. That is, a conventional two-dimensional barcode or the like may be used in combination, and in this case, it is preferable to record at least a part of information included in the two-dimensional barcode on the ID tag chip. With this configuration, in the manufacturing process of the display module, the manufacturing history can be traced with a two-dimensional barcode until the ID tag chip is attached, and then stored in the ID tag chip after the ID tag chip is attached. It is preferable that the manufacturing history can be traced based on the information that is recorded.

  In the present invention, the antenna line connected to the ID tag chip can employ a configuration formed in the electro-optical device. In this case, the antenna line is disposed along the outer peripheral edge of the electro-optical device. It is preferable. If comprised in this way, antenna sensitivity can be improved.

  In the present invention, the antenna line connected to the ID tag chip may employ a configuration formed on a member different from the electro-optical device.

  In the present invention, at least a part of the portion of the exterior member that overlaps with the antenna line connected to the ID tag chip may be non-conductive. In addition, at least a part of the antenna line connected to the ID tag chip may be disposed outside the exterior member. With this configuration, the antenna sensitivity is not reduced by the shielding effect.

  In the present invention, the electro-optical device is, for example, a liquid crystal device using a liquid crystal as an electro-optical material, or an electroluminescent device using an organic electroluminescent material as an electro-optical material.

  A display module to which the present invention is applied is used in an electronic device such as a mobile phone or a mobile computer.

  In the present invention, a wireless ID tag chip is arranged inside the exterior member. According to this ID tag chip, the information stored in the ID tag chip is read wirelessly. Even in the assembled state, it is not necessary to remove the exterior member or the like when tracking the history of the electro-optical device. In addition, no equipment with a magnifying optical system is required, and information can be read in a short time. For this reason, after assembling the display module, it is possible to easily and efficiently perform a non-destructive operation such as selecting a specific history. In addition, the ID tag chip is not limited to the electro-optical device itself, and can be mounted on a flexible substrate connected to the electro-optical device. Therefore, even when the outer peripheral portion (frame) of the area for displaying the image of the electro-optical device is narrowed, the ID tag chip can be mounted in the display module.

  Embodiments of the present invention will be described with reference to the drawings. Note that the display module according to each embodiment described below has the same basic configuration as that described with reference to FIG. 8, and therefore, corresponding portions will be described with the same reference numerals. .

[Embodiment 1]
(overall structure)
1A and 1B are an explanatory diagram schematically showing a planar configuration of a display module according to Embodiment 1 of the present invention, and an explanatory diagram schematically showing a longitudinal section thereof. FIG. 2 is an equivalent circuit diagram of various elements, wirings, and the like in a plurality of pixels formed in a matrix to form an image display region of the electro-optical device (liquid crystal device) used in the display module of this embodiment.

  1A and 1B, the display module 1 of this embodiment has a structure in which an electro-optical device 100 (an electro-optical device for a flat display) is covered with an exterior member 200. The electro-optical device 100 and the backlight device 60 are disposed inside the exterior member 200 so that an image displayed on the electro-optical device 100 can be viewed from the upper surface opening 210 of the exterior member 200.

  Here, the electro-optical device 100 is a liquid crystal device having a panel structure in which a transparent first substrate 10 and a second substrate 20 are bonded to face each other, and the first substrate 10 and the second substrate are combined. A liquid crystal (electro-optical material) is held between the two. In the first substrate 10 and the second substrate 20, electrodes for driving the electro-optic material are formed on the surfaces (surfaces) facing each other, and a predetermined signal is sent to each electrode. By applying the electro-optical material, the electro-optical material is driven for each pixel in the first substrate 10 and the second substrate 20, and an image is displayed.

  That is, as shown in FIG. 2, in the first substrate 10 of the electro-optical device 100, the pixel electrode 9a and the pixel switching for controlling the pixel electrode 9a are controlled in each of the plurality of pixels 100a formed in a matrix. TFT 30 is formed, and a data line 6 a for supplying a pixel signal is electrically connected to the source of the TFT 30. Pixel signals S1, S2,... Sn written to the data line 6a are supplied line-sequentially in this order. Further, the scanning line 3a is electrically connected to the gate of the TFT 30, and the scanning signals G1, G2,... Gm are applied to the scanning line 3a in a pulse-sequential manner in this order at a predetermined timing. It is configured. The pixel electrode 9a is electrically connected to the drain of the TFT 30, and the pixel signal S1, S2,... Sn supplied from the data line 6a is turned on by turning on the TFT 30 as a switching element for a certain period. Are written in each pixel at a predetermined timing. In this way, pixel signals S1, S2,... Sn of a predetermined level written in the liquid crystal through the pixel electrode 9a are held for a certain period with the counter electrode formed on the second substrate 20. . Thereby, the liquid crystal is controlled to a predetermined alignment state, and the display light is optically modulated.

  Here, in order to prevent the held pixel signal from leaking, a storage capacitor 70 (capacitor) may be added in parallel with the liquid crystal capacitor formed between the pixel electrode 9a and the counter electrode. The storage capacitor 70 holds the voltage of the pixel electrode 9a for a time that is, for example, three orders of magnitude longer than the time when the source voltage is applied. As a result, the charge retention characteristics are improved, and an electro-optical device capable of performing display with a high contrast ratio can be realized. As a method of forming the storage capacitor 70, there is either a case where it is formed between the capacitor line 3b, which is a wiring for forming a capacitor, or a case where it is formed between the storage line 70 and the preceding scanning line 3a. Also good.

  1A and 1B again, the first substrate 10 and the second substrate 20 are bonded so that the first substrate 10 projects from the outer peripheral edge of the second substrate 20, and this projecting region 11, flexible substrates 31, 32, and 33 are connected to the surface side on which the second substrate 20 is located. A driving IC chip (not shown) is mounted on the flexible substrates 31, 32, and 33, and signals are supplied from the driving IC to the electrodes.

  In the present embodiment, when the display module 1 is manufactured, as described with reference to FIG. 8, the first substrate is used for the purpose of accurately tracking the manufacturing history even when a defect occurs during manufacturing. When forming a pixel switching TFT, wiring, electrode, etc. using a semiconductor process in a state of a large substrate 10a capable of obtaining a large number of substrates 10, a two-dimensional bar is formed in a region cut out as the first substrate 10 by photolithography. The code 50 etc. is attached. For this reason, in the electro-optical device 1, a two-dimensional barcode 50 is attached to the outside of the region 12 for displaying an image. The two-dimensional barcode 50 is covered with an exterior member 200.

  Further, in the display module 1 of the present embodiment, the first substrate 10 has a wireless ID on the surface side where the second substrate 20 is located in the protruding region 11 from the outer peripheral edge of the second substrate 20. A tag chip 2 (RFID tag chip) is mounted, and the height dimension of the ID tag chip 2 is equal to or less than the thickness dimension of the second substrate 20, for example, 0.7 mm. Therefore, even if the ID tag chip 2 is mounted on the first substrate 10, the thickness dimension does not increase when viewed from the entire electro-optical device 100.

  Here, at least a part of the information represented by the two-dimensional code 50 is also recorded on the ID tag chip 2. For example, the two-dimensional barcode 50 may be read in a process of mounting the ID tag chip 2 on the first substrate 10 and a part or all of the contents may be written into the ID tag chip 2.

  Further, a flexible substrate 4 on which an antenna wiring 3 connected to the ID tag chip 2 is formed is connected to the overhang region 11 of the first substrate 10. Further, it is desirable that at least a part of the material of the exterior member 200 in the portion overlapping the antenna wiring 3 is non-conductive. Alternatively, at least a part of the antenna wiring 3 may be configured not to be covered with the exterior member 200. With such a configuration, the sensitivity of the antenna is not reduced.

  Further, in this embodiment, as shown in the hatched area, the epoxy substrate protective resin 5 is applied to the connection region with the first substrate 10 in the flexible substrate 32. The resin 5 also covers the ID tag chip 2.

(Effect of this embodiment)
Thus, in the display module 1 of this embodiment, the wireless ID tag chip 2 is disposed inside the exterior member 200, and according to the ID tag chip 2, information stored therein can be read out wirelessly. . For this reason, even when the ID tag chip 2 is covered with the exterior member 200 in a state where the electro-optical device 100 is covered with the exterior member 200 and assembled to the display module 1, the history of the electro-optical device 1 is tracked. There is no need to remove the exterior member 200 or the like.

  In addition, the ID tag chip 2 does not require equipment equipped with a magnifying optical system, and can read information in a short time. For this reason, after assembling the display module 1, it is possible to easily and efficiently perform operations such as selecting a specific history.

  Further, in the case of the ID tag chip 2, the restriction on the arrangement location is small. Therefore, the ID tag chip 2 can be mounted in the display module 1 even when the outer peripheral portion 13 (frame) of the region for displaying the image of the electro-optical device 100 becomes narrow.

  Furthermore, depending on the type of the ID tag chip 2, information of each display module 1 can be read out with many display modules 1 being packed. Further, if information is written in the ID tag chip 2 during the distribution process, individual management regarding the manufacturing process and distribution can be performed. As a further application, for example, when sorting non-defective products / defective products in the pre-shipment inspection, the results are sorted into non-defective products or defective products into boxes without recording or inputting the results for each module, and ID tags are put together for each box. By reading, the inspection results can be recorded in a database in a batch.

  Here, a semiconductor process is used to manufacture the electro-optical device 100, and various film forming processes, etching, and heat treatment are performed. For this reason, the ID tag chip 2 is mounted after the electro-optical device 100 is assembled. In the present embodiment, the electro-optical device 100 (first substrate 10) is provided with the two-dimensional barcode 50 when the first substrate 10 is manufactured. Until the tag chip 2 is attached, the manufacturing history can be traced by the two-dimensional barcode 50.

  In addition, since part or all of the identification number represented by the two-dimensional code 50 is recorded in the ID tag chip 2, the information stored in the ID tag chip 2 is used after the ID tag chip 2 is attached. The manufacturing history of the first substrate 10 can also be tracked. Therefore, the two-dimensional barcode 50 may be formed at a position covered with the exterior member 200, or may be cut off to cut the frame size during the manufacturing process.

  In addition, when the ID tag chip 2 is molded with the epoxy-based protective resin 5, the connection region between the flexible substrate 32 and the first substrate 10 is also covered with the protective resin 5. Thus, the reliability of both the connection portion between the flexible substrate 32 and the first substrate 10 and the ID tag chip 2 can be improved.

[Embodiment 2]
3A and 3B are an explanatory diagram schematically showing a planar configuration of a display module according to Embodiment 2 of the present invention, and an explanatory diagram schematically showing a longitudinal section thereof.

  3A and 3B, the display module 1 of this embodiment also has a structure in which the electro-optical device 100 is covered with an exterior member 200, as in the first embodiment. The electro-optical device 100 and the backlight device 60 are disposed inside the exterior member 200 so that an image displayed on the electro-optical device 100 can be viewed from the upper surface opening 210 of the exterior member 200.

  The electro-optical device 100 has a panel structure in which a transparent first substrate 10 and a second substrate 20 are bonded to face each other, and a projecting region 11 of the first substrate 10 from the second substrate 20 is provided. The flexible substrates 31, 32, and 33 are connected to the surface side where the second substrate 20 is located. In addition, a two-dimensional barcode 50 representing the manufacturing history of the first substrate 10 is attached to the first substrate 10.

  In addition, the wireless ID tag chip 2 is mounted on the first substrate 10 on the surface side where the second substrate 20 is located in the overhanging region 11 from the outer peripheral edge of the second substrate 20. The height dimension of the tag chip 2 is not more than the thickness dimension of the second substrate 20, for example, not more than 1 mm. Therefore, even if the ID tag chip 2 is mounted on the first substrate 10, the thickness dimension does not increase when viewed from the entire electro-optical device 100.

  Here, at least a part of the identification number represented by the two-dimensional code 50 is also recorded in the ID tag chip 2.

  In addition, the antenna wiring 3 connected to the ID tag chip 2 is formed on the first substrate 10 along the outer peripheral edge thereof. Such an antenna wiring 3 is a metal film that is formed at the same time when a constituent element such as a thin film wiring is formed on the first substrate 10 using a photolithography process.

  Further, in this embodiment, as shown in the hatched area, the epoxy substrate protective resin 5 is applied to the connection region with the first substrate 10 in the flexible substrate 32. The resin 5 also covers the ID tag chip 2.

  In the display module 1 configured as described above, the wireless ID tag chip 2 is disposed inside the exterior member 200. According to the ID tag chip 2, information stored therein is read out wirelessly. For this reason, even when the ID tag chip 2 is covered with the exterior member 200 in a state where the electro-optical device 100 is covered with the exterior member 200 and assembled to the display module 1, the history of the electro-optical device 1 is tracked. The same effects as those of the first embodiment are obtained, such as the need to remove the exterior member 200 and the like.

  Furthermore, in this embodiment, since the antenna wiring 3 connected to the ID tag chip 2 is formed on the first substrate 10 along the outer peripheral edge thereof, a separate member for arranging the antenna is unnecessary. Therefore, the number of parts can be reduced. Moreover, since the antenna wiring 3 is arranged along the outer peripheral edge of the first substrate 10, it does not prevent other components such as wiring from being arranged. Further, since the antenna wiring 3 is disposed along the outer peripheral edge of the first substrate 10, the antenna sensitivity is high due to the large loop area. Furthermore, since the antenna wiring 3 is exposed from the second substrate 20 at the outer peripheral edge of the first substrate 10, it is not shielded by an electrode or the like formed on the second substrate 20. Further, it is desirable that at least a part of the material of the exterior member 200 in the portion overlapping the antenna wiring 3 is non-conductive. Alternatively, at least a part of the antenna wiring 3 may be configured not to be covered with the exterior member 200. With such a configuration, the sensitivity of the antenna is not reduced.

[Modification of Embodiment 2]
The antenna wiring 3 may be formed by patterning a metal film on the first substrate 10, but a wire rod may be disposed. Further, it may be arranged on the second substrate 20 side.

[Embodiment 3]
4A and 4B are an explanatory diagram schematically showing a planar configuration of a display module according to Embodiment 3 of the present invention, and an explanatory diagram schematically showing a longitudinal section thereof.

  4A and 4B, the display module 1 of this embodiment also has a structure in which the electro-optical device 100 is covered with an exterior member 200, as in the first embodiment. The electro-optical device 100 and the backlight device 60 are disposed inside the exterior member 200 so that an image displayed on the electro-optical device 100 can be viewed from the upper surface opening 210 of the exterior member 200.

  The electro-optical device 100 has a panel structure in which a transparent first substrate 10 and a second substrate 20 are bonded to face each other, and a projecting region 11 of the first substrate 10 from the second substrate 20 is provided. The flexible substrates 31, 32, and 33 are connected to the surface side where the second substrate 20 is located. In addition, a two-dimensional barcode 50 representing the manufacturing history of the first substrate 10 is attached to the first substrate 10.

  In this embodiment, the wireless ID tag chip 2 is mounted on the flexible substrate 31, and the antenna wiring 3 is formed on the flexible substrate 31. Here, in addition to the individual identification information as the display module 1, a part of the identification number represented by the two-dimensional code 50 is also recorded in the ID tag chip 2.

  In the display module 1 configured as described above, the wireless ID tag chip 2 is disposed inside the exterior member 200. According to the ID tag chip 2, information stored therein is read out wirelessly. For this reason, even when the ID tag chip 2 is covered with the exterior member 200 in a state where the electro-optical device 100 is covered with the exterior member 200 and assembled to the display module 1, the history of the electro-optical device 1 is tracked. The same effects as those of the first embodiment are obtained, such as the need to remove the exterior member 200 and the like.

  Furthermore, in this embodiment, since the antenna wiring 3 is formed on the flexible substrate 31 connected to the first substrate 10, a separate member dedicated for arranging the antenna is unnecessary. Therefore, the number of parts can be reduced.

  Moreover, since the antenna wiring 3 is positioned slightly on the back side of the electro-optical device 100 when the flexible substrate 31 is bent, the antenna wiring 3 can be arranged in a compact manner in the exterior member 200.

[Other embodiments]
In the above embodiment, the flexible substrate 31 (TAB) on which the driving IC chip is mounted is connected to the overhanging region 11 of the first substrate 10, but the TFT is attached to the first substrate 10. The present invention may be applied to an electro-optical device in which a drive circuit is formed.

  Further, the present invention may be applied to the electro-optical device 1 in which the driving IC chip is COG mounted on the overhanging region 11 of the first substrate 10. In this case, both the driving IC chip and the ID tag chip 2 may be covered and protected with the same resin.

  In addition, the electro-optical device 1 in which a driving circuit is formed with TFTs on the first substrate 10, or the electro-optical device 1 in which a driving IC chip is COG mounted on the overhanging region 11 of the first substrate 10. In either case, since the flexible substrate is connected, the ID tag chip 2 may be mounted on the flexible substrate.

  In the above embodiment, the TFT active matrix type liquid crystal device is used as the electro-optical device 100. However, the present invention may be applied to a display module using another liquid crystal device.

  In addition to the liquid crystal device, the present invention may be applied to a display module 1 using an electro-optical device such as a plasma display or a field emission display in addition to the electroluminescence display device described below with reference to FIG. Good.

  FIG. 5 is a block diagram of an active matrix type electro-optical device using a charge injection type organic thin film electroluminescent element.

  An electro-optical device 100p (electro-optical device for a flat display) shown in FIG. 5 is a TFT in which a light-emitting element such as an EL (electroluminescence) element or an LED (light-emitting diode) element emits light when a driving current flows through an organic semiconductor film. This is an active matrix type display device that is driven and controlled by this. All the light-emitting elements used in this type of electro-optical device are self-luminous, so there is no need for a backlight, and there are advantages such as little dependency on the viewing angle. There is.

  In the electro-optical device 100p shown here, on the TFT array substrate 10p, a plurality of scanning lines 3p, a plurality of data lines 6p extending in a direction intersecting with the extending direction of the scanning lines 3p, and these A plurality of common power supply lines 23p parallel to the data lines 6p and a pixel region 15p corresponding to the intersection of the data lines 6p and the scanning lines 3p are configured. For the data line 6p, a data side driving circuit 101p including a shift register, a level shifter, a video line, and an analog switch is configured. A scanning side drive circuit 104p including a shift register and a level shifter is configured for the scanning line 3p.

  Each pixel region 15p holds a first TFT 31p to which a scanning signal is supplied to the gate electrode via the scanning line 3p, and an image signal supplied from the data line 6p via the first TFT 31p. The storage capacitor 33p, the second TFT 32p to which the image signal held by the storage capacitor 33p is supplied to the gate electrode, and the common supply line 23p when electrically connected to the common power supply line 23p via the second TFT 32p. The light emitting element 40p into which a drive current flows from the electric wire 23p is comprised.

  In such an electro-optical device 100p, since the storage capacitor 33p holds the image signal supplied from the data line 6p via the first TFT 31p, even if the first TFT 31p is turned off, the second TFT 32p The gate electrode 31p is held at a potential corresponding to the image signal. Therefore, since the drive current continues to flow from the common power supply line 23p to the light emitting element 40p, the light emitting element 40p continues to emit light and displays an image.

  Furthermore, in particular, in the case of a liquid crystal device or an electroluminescence display device using a polysilicon TFT substrate for driving a pixel by forming a polysilicon thin film transistor on the first substrate, the circuit itself having the ID tag function is the first circuit. It may be formed on the substrate. In this case, an ID tag function can be added at a lower cost, and information can be read and written when the manufacturing process of the first substrate is completed.

[Application to electronic devices]
Next, an example of an electronic apparatus including the electro-optical devices 100 and 100p to which the present invention is applied and the display module 1 will be described with reference to FIGS.

  6A and 6B are an explanatory diagram of a mobile personal computer as an example of an electronic apparatus using the electro-optical device and the display module according to the present invention, and an explanatory diagram of a mobile phone, respectively.

  An electro-optical device and a display module to which the present invention is applied include a projection type liquid crystal display device (liquid crystal projector), a multimedia-compatible personal computer (PC), an engineering work station (EWS), a pager, or a display module. It is mounted on electronic devices such as mobile phones, word processors, televisions, viewfinder type or monitor direct view type video tape recorders, electronic notebooks, electronic desk calculators, car navigation devices, POS terminals, and touch panels. For example, as shown in FIG. 6A, the personal computer 180 includes a main body 182 provided with a keyboard 181 and a display unit 183. The display unit 183 includes the electro-optical devices 100 and 100p (display module 1) described above. As shown in FIG. 6B, the cellular phone 190 includes a plurality of operation buttons 191 and a display unit including the electro-optical devices 100 and 100p (display module 1) described above.

  In the present invention, a circuit having a wireless ID tag function is arranged inside the exterior member, and according to the circuit having the ID tag function, information stored therein is read out wirelessly. For this reason, even when the electro-optical device is covered with the exterior member and assembled into the display module, it is not necessary to remove the exterior member or the like when tracking the history of the electro-optical device. In addition, no equipment with a magnifying optical system is required, and information can be read in a short time. For this reason, after assembling the display module, it is possible to easily and efficiently perform an operation such as selecting a specific history. In addition, the ID tag chip is not limited to the electro-optical device itself, and can be mounted on a flexible substrate connected to the electro-optical device. Therefore, even when the outer peripheral portion (frame) of the area for displaying the image of the electro-optical device is narrowed, the ID tag chip can be mounted in the display module.

(A), (B) is explanatory drawing which shows typically the planar structure of the display module which concerns on Embodiment 1 of this invention, and explanatory drawing which shows the vertical cross section typically. FIG. 3 is an equivalent circuit diagram of various elements and wirings in a plurality of pixels formed in a matrix to constitute an image display region of an electro-optical device (liquid crystal device) used in the display module of the present embodiment. (A), (B) is explanatory drawing which shows typically the planar structure of the display module which concerns on Embodiment 2 of this invention, and explanatory drawing which shows the vertical cross section typically. (A), (B) is explanatory drawing which shows typically the planar structure of the display module which concerns on Embodiment 3 of this invention, and explanatory drawing which shows the vertical cross section typically. It is a block diagram of an active matrix type electro-optical device using a charge injection type organic thin film electroluminescence element. (A), (B) is explanatory drawing of the electronic device carrying the electro-optical apparatus to which this invention is applied. (A), (B) is explanatory drawing which shows typically the planar structure of the conventional display module, and explanatory drawing which shows the vertical cross section typically. It is explanatory drawing which shows the formation method of a two-dimensional barcode.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Display module, 2 ID tag chip, 3 Antenna wiring 4, 31, 32, 33 Flexible substrate, 5 Protection resin, 10 1st board | substrate, 20 2nd board | substrate, 50 Two-dimensional barcode, 60 Backlight Device, 100, 100p Electro-optical device (electro-optical device for flat display), 200 Exterior member

Claims (20)

In a display module having at least an electro-optical device for a flat display and an exterior member covering the electro-optical device,
A display module, wherein a circuit having a wireless ID tag function is disposed inside the exterior member. The electro-optical device according to claim 1, comprising a panel structure in which a first substrate and a second substrate are bonded to face each other.
In the first substrate, an IC chip on which the circuit having the ID tag function is mounted is disposed on the surface side where the second substrate is located in an overhanging region from the outer peripheral edge of the second substrate. Features display module. The electro-optical device according to claim 1, comprising a panel structure in which a first substrate and a second substrate are bonded to face each other.
In the first substrate, a flexible substrate is connected to a surface side where the second substrate is located in a projecting region from the outer peripheral edge of the second substrate, and the projecting of the first substrate is performed. A display module comprising an IC chip on which a circuit having the ID tag function is mounted on a surface side of the region. The electro-optical device according to claim 1, comprising a panel structure in which a first substrate and a second substrate are bonded to face each other.
In the first substrate, a flexible substrate is connected to a surface side where the second substrate is located in an overhanging region from an outer peripheral edge of the second substrate, and the flexible substrate is placed on the flexible substrate. A display module having an IC chip on which a circuit having an ID tag function is mounted. The electro-optical device according to claim 1, comprising a panel structure in which a first substrate and a second substrate are bonded to face each other.
In the first substrate, a driving IC chip is mounted on the surface side where the second substrate is located in a projecting region from the outer peripheral edge of the second substrate, and the projecting of the first substrate A display module comprising an IC chip on which a circuit having the ID tag function is mounted on a surface side of the region.   2. The display module according to claim 1, wherein an IC chip on which a circuit having the ID tag function is mounted is disposed on an inner surface of the exterior member.   7. The display module according to claim 1, wherein the IC chip on which the circuit having the ID tag function is mounted is covered with a resin.   4. The display according to claim 3, wherein the connection portion between the flexible substrate and the first substrate and the IC chip on which the circuit having the ID tag function is mounted are covered with the same resin. module.   6. The display module according to claim 5, wherein the driving IC chip and the IC chip on which the circuit having the ID tag function is mounted are coated with the same resin.   6. The display module according to claim 2, 3 or 5, wherein a height dimension of an IC chip on which the circuit having the ID tag function is mounted is equal to or less than a thickness dimension of the second substrate.   2. The electro-optical device according to claim 1, wherein the electro-optical device has a panel structure in which a first substrate and a second substrate are bonded to face each other, and the circuit having the ID function is formed on the first substrate. A display module characterized by that. In any one of Claims 1 thru | or 11, the mark showing the identification number intrinsic | native to this apparatus is attached | subjected to the said electro-optical apparatus,
A display module, wherein at least part of information represented by the mark is recorded in the circuit having the ID tag function.   The display module according to claim 1, wherein the electro-optical device includes an antenna line connected to the circuit having the ID tag function.   The display module according to claim 13, wherein the antenna line is disposed along an outer peripheral edge of the electro-optical device.   15. The display module according to claim 1, wherein the antenna line connected to the circuit having the ID tag function is formed on a member different from the electro-optical device.   16. The display module according to claim 13, wherein at least a part of the portion of the exterior member that overlaps with the portion where the antenna line is disposed is non-conductive.   16. The display module according to claim 15, wherein at least a part of the antenna line is not covered with an exterior member.   18. The display module according to claim 1, wherein the electro-optical device uses liquid crystal as an electro-optical material.   The display module according to claim 1, wherein an organic electroluminescent material is used as an electro-optical material in the electro-optical device.   An electronic apparatus using the display module defined in any one of claims 1 to 19.

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