JP2004228597A - Xyステージ - Google Patents
Xyステージ Download PDFInfo
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- JP2004228597A JP2004228597A JP2004111630A JP2004111630A JP2004228597A JP 2004228597 A JP2004228597 A JP 2004228597A JP 2004111630 A JP2004111630 A JP 2004111630A JP 2004111630 A JP2004111630 A JP 2004111630A JP 2004228597 A JP2004228597 A JP 2004228597A
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- axis
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/788—Means for moving parts
- H01L2224/78801—Lower part of the bonding apparatus, e.g. XY table
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
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- H01L2924/01004—Beryllium [Be]
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- H01L2924/11—Device type
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
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- Power Engineering (AREA)
- Control Of Position Or Direction (AREA)
- Details Of Measuring And Other Instruments (AREA)
- Wire Bonding (AREA)
Abstract
【解決手段】 可動テーブル5のX軸方向の側方にX軸VCM6が配置され、可動テーブル5のY軸方向の側方には、Y軸VCM7が配置されている。ている。X軸VCM6には、土台に固定され可動テーブル5側に開口部を有するヨーク部6cが設けられている。そして、可動テーブル5の側面に連結されたX軸可動子6a及びこのX軸可動子6aに巻き付けられたコイル6bがヨーク部6c内にその開口部から挿入されている。開口部の大きさは可動テーブル5のY軸方向における可動範囲と同程度又はそれ以上であり、可動子6a及びコイル6bはY軸方向で拘束されることなく移動可能である。Y軸VCM7は、X軸VCM6と同様の構成を有する。
【選択図】 図1
Description
2、102;X軸ガイド
3、103;X軸テーブル
4、104;Y軸ガイド
5、105;可動テーブル
6、56、106;X軸VCM
6a、56a、106a;X軸可動子
6b、56b、106b;X軸コイル
6c、56c、106c;ヨーク部
6d、6e、6f、6g;磁石
7、57、107;Y軸VCM
7a、57a、107a;Y軸可動子
7b、57b、107b;Y軸コイル
7c、107c;磁気回路
8、108;上段部
9、109;中段部
10、110;ボンディングヘッド
21;部材
22;中段部
23;ベース
31;ヨーク部
32、106d;鉄芯
33;可動子
33a;固定部
33b;連結部
34;コイル
35、36;磁石
51、52;カムフォロワガイド
56f、56g、57f、57g;カムフォロワ
56h、57h;コイルガイド
61a、62a;レール
61b、62b;スライダ
G、g;重心
Claims (1)
- ベースと、このベース上にX−Y平面内でX方向及びY方向に移動可能に配置された可動テーブルと、この可動テーブル上に設けられた作業部材と、前記可動テーブル及び作業部材からなる可動部の重心位置と同一の高さ位置にて前記可動テーブルに夫々X方向及びY方向の駆動力を与える第1及び第2のリニアモータと、を有することを特徴とするXYステージ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004111630A JP4036207B2 (ja) | 1999-09-10 | 2004-04-05 | Xyステージ |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25668999 | 1999-09-10 | ||
JP2004111630A JP4036207B2 (ja) | 1999-09-10 | 2004-04-05 | Xyステージ |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP36534399A Division JP3616543B2 (ja) | 1999-09-10 | 1999-12-22 | Xyステージ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004228597A true JP2004228597A (ja) | 2004-08-12 |
JP4036207B2 JP4036207B2 (ja) | 2008-01-23 |
Family
ID=32910608
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004111630A Expired - Lifetime JP4036207B2 (ja) | 1999-09-10 | 2004-04-05 | Xyステージ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4036207B2 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103226342A (zh) * | 2013-04-28 | 2013-07-31 | 清华大学 | 高刚度并联双驱运动解耦伺服控制平台 |
WO2015078287A1 (zh) * | 2013-11-26 | 2015-06-04 | 上海微电子装备有限公司 | 平板音圈电机 |
CN106926206A (zh) * | 2017-01-19 | 2017-07-07 | 中国科学院自动化研究所 | 基于重心驱动原理的并联xy运动平台 |
JPWO2022176182A1 (ja) * | 2021-02-22 | 2022-08-25 |
-
2004
- 2004-04-05 JP JP2004111630A patent/JP4036207B2/ja not_active Expired - Lifetime
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103226342A (zh) * | 2013-04-28 | 2013-07-31 | 清华大学 | 高刚度并联双驱运动解耦伺服控制平台 |
WO2015078287A1 (zh) * | 2013-11-26 | 2015-06-04 | 上海微电子装备有限公司 | 平板音圈电机 |
CN106926206A (zh) * | 2017-01-19 | 2017-07-07 | 中国科学院自动化研究所 | 基于重心驱动原理的并联xy运动平台 |
JPWO2022176182A1 (ja) * | 2021-02-22 | 2022-08-25 | ||
WO2022176182A1 (ja) * | 2021-02-22 | 2022-08-25 | 株式会社新川 | ワイヤボンディング装置 |
JP7236782B2 (ja) | 2021-02-22 | 2023-03-10 | 株式会社新川 | ワイヤボンディング装置 |
US12057427B2 (en) | 2021-02-22 | 2024-08-06 | Shinkawa Ltd. | Wire bonding apparatus |
Also Published As
Publication number | Publication date |
---|---|
JP4036207B2 (ja) | 2008-01-23 |
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