JP2004261987A - Film laminate and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a good film laminate reduced in water vapor permeability. <P>SOLUTION: The measured data of the surface unevenness of a base material layer made of a plastic film is subjected to Fourier transform for wavenumber separation and further subjected to inverse Fourier transform to obtain an auto-correlation coefficient. Then, the surface unevenness is evaluated using this auto-correlation coefficient to calculate a height ratio of a zero order peak and a primary peak [(primary peak)/(zero order peak)]. An inorganic compound layer is laminated on the surface of the base material layer made of the plastic film with the height ratio of (primary peak)/(zero order peak)<1/10. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【００５６】
【発明の効果】
水蒸気透過率を低減させた良好なフィルム積層体が得られる。また、水蒸気透過率を低減させた良好なフィルム積層体を確実に製造できる。
【図面の簡単な説明】
【図１】第１ピーク／第０ピーク比＜１／１０を示す表面の計算結果の一例である。
【図２】第１ピーク／第０ピーク比＞１／１０を示す表面の計算結果の他の一例である。[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a film laminate having an improved water vapor barrier property.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a film laminate having a plastic film as a base material layer and an inorganic compound layer such as silicon oxide and aluminum oxide formed on the surface thereof is used as a gas barrier film that blocks water vapor and oxygen. Widely used for applications. In addition to packaging, it is also used as a part of a transparent conductive substrate used for a liquid crystal display device, a touch panel, an electroluminescence display device and the like.
[0003]
With respect to these film laminates, various improvements have been studied for the purpose of improving gas barrier properties. For example, one that defines the hardness of the base film (for example, see Patent Document 1), one that defines the granularity of the inorganic compound layer (for example, see Patent Document 2), one that defines the surface roughness of the base film (See, for example, Patent Document 3), those specifying the specific gravity of the inorganic compound layer (see, for example, Patent Document 4), and those specifying the ratio of the surface irregularities of the base film to the surface irregularities after the surface treatment (for example, Patent Documents). 5), and those having an anchor coat for improving the adhesion between the base film and the thin film (for example, see Patent Document 6).
[0004]
Methods to improve the gas barrier properties by laminating an inorganic compound layer on the surface of a plastic film base layer have been studied to improve the inorganic thin film production process and optimize the composition of the film base resin. As a result, it has been widely recognized that unevenness existing on the film surface is a problem.
[0005]
Therefore, more studies have been made on the method of producing a film with less unevenness than before, and various improvements have been made, such as reducing the pulsating flow during film formation, smoothing the winding drum, stretching the film, and introducing a solution casting method. It has been suggested that this can improve gas barrier properties.
[0006]
However, there are various measurement methods and various data description methods for the surface characteristics of the film and the like to be used, and these have been mentioned many times so far. In fact, it has not been clarified yet whether the film laminate will be excellent.
[0007]
[Patent Document 1]
Japanese Patent Application Laid-Open No. 2001-096661 (Claims)
[0008]
[Patent Document 2]
JP-A-9-076400 (Claims)
[0009]
[Patent Document 3]
JP-A-3-176123 (claims)
[0010]
[Patent Document 4]
JP-A-5-186622 (Claims)
[0011]
[Patent Document 5]
JP-A-10-244601 (Claims)
[0012]
[Patent Document 6]
Japanese Patent Application Laid-Open No. Hei 3-086538 (Claims)
[0013]
[Problems to be solved by the invention]
An object of the present invention is to solve the above problems and to provide a good film laminate having a reduced water vapor transmission rate.
[0014]
[Means for Solving the Problems]
According to an embodiment of the present invention, when performing a Fourier transform on the measured data of the surface unevenness and performing wave number separation, and evaluating the surface unevenness using an autocorrelation coefficient obtained by performing an inverse Fourier transform thereof, A film laminate in which an inorganic compound layer is laminated on the surface of a plastic film substrate layer in which substantially no periodic structure is observed, or Fourier transform is performed on measurement data of surface unevenness to perform wave number separation, and this is reversed. When the surface unevenness is evaluated using the autocorrelation coefficient obtained by Fourier transform, the height ratio between the 0th and 1st peaks is (first peak) / (0th peak) <1. / 10
And a film laminate obtained by laminating an inorganic compound layer on the surface of a plastic film base material layer.
[0015]
According to the embodiment of the present invention, a good film laminate having reduced water vapor transmission rate can be obtained.
[0016]
It is preferable that the inorganic compound layer be formed of at least one selected from the group consisting of simple substances of Al, Si, In, Sn, Ti and Ta, oxides, nitrides and oxynitrides.
[0017]
According to another aspect of the present invention, in a method for producing a film laminate obtained by laminating an inorganic compound layer on the surface of a plastic film base material layer, a wave number separation is performed by performing a Fourier transform on measurement data of surface irregularities. A base material made of a plastic film having a height ratio between the 0th order peak and the 1st order peak when the surface unevenness is evaluated using an autocorrelation coefficient obtained by performing an inverse Fourier transform thereof within a predetermined range. In the method for producing a film laminate in which an inorganic compound layer is laminated on a layer surface, or in the method for producing a film laminate in which a flattening layer and an inorganic compound layer are laminated on a plastic film base layer surface, measurement of surface irregularities Fourier transform is performed on the data to separate the wave numbers, and the height ratio between the 0th and 1st order peaks when the surface unevenness is evaluated using the autocorrelation coefficient obtained by inverse Fourier transform of the data. Place Laminating the inorganic compound layer on the planarizing layer plane which is within the range of, method of producing a film laminate is provided.
[0018]
According to the aspect of the present invention, it is possible to reliably manufacture a good film laminate in which the water vapor transmission rate is reduced.
[0019]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings, tables, formulas, examples, and the like. It should be noted that these drawings, tables, formulas, examples and the like, and the description are only illustrative of the present invention, and do not limit the scope of the present invention. It goes without saying that other embodiments can also belong to the category of the present invention as long as they conform to the gist of the present invention.
[0020]
The surface unevenness in the present invention generally refers to an arbitrary shape measured by a measuring device capable of measuring the surface shape. Although the measured value may include components such as undulation and warpage of the measured object, these are separately evaluated in the method described in the present invention. In the present invention, such undulations and warpages are collectively grasped as “undulations”.
[0021]
The present invention does not stack a flattening layer in contact with a plastic film base material layer or a film laminate in which an inorganic compound layer is stacked on the flattening layer in contact with the plastic film base layer, The present invention relates to a film laminate in which an inorganic compound layer is directly laminated.
[0022]
It is very preferable that the plastic film used for the base layer of the film laminate according to the present invention is substantially transparent. Further, as long as the transparency of the film laminate is not impaired, additives such as a plasticizer, a filler, an ultraviolet absorber, an antioxidant, an easy adhesive, an easy lubricant, and a coloring agent can be added. The functions exhibited by these additives may be realized by laminating another layer on the film laminate according to the present invention.
[0023]
The method for producing the substrate layer is not particularly limited, and it can be produced by a known method such as a melt extrusion film forming method, a solution cast film forming method, and an inflation film forming method. Further, a non-stretched film or a stretched film may be used. It should be noted that, depending on the application, the material may not be transparent, and in such a case, there is no need to limit the transparency of the additives and the like.
[0024]
The material that can be used as the plastic film is not particularly limited, and examples thereof include polycarbonate, polyethylene terephthalate, polyethylene naphthalate, polyarylate, polycycloolefin, polyether sulfone, and a photocurable acrylic polymer. As the polycarbonate, a polycarbonate having a 2,2-bis (4-hydroxyphenyl) propane structure (bisphenol A structure) as a skeleton structure, and particularly a polycarbonate having a biscresol fluorene structure and a bisphenol A structure as a skeleton structure are preferable. Polycarbonate having a biscresol fluorene structure and a bisphenol A structure as a skeleton structure has a high glass transition temperature and thus has excellent heat resistance of a plastic film, and is more preferably used in applications such as a transparent conductive substrate. Note that the biscresol fluorene structure and the 2,2-bis (4-hydroxyphenyl) propane structure mean that -OH at both ends of biscresol fluorene or 2,2-bis (4-hydroxyphenyl) propane is -O-. Means the structure. The lamination side face of the plastic film base layer according to the present invention may be either one or both sides of the plastic film base layer.
[0025]
It was found that the surface roughness measurement data of the plastic film base layer can be roughly classified into three based on its origin. The first is a so-called "undulation", the second is a specific concavo-convex structure which is a problem in the present invention, and the third is an abnormality which is suddenly generated due to noise of a measuring instrument or the like. The first data, "undulation", is characterized by a relatively large in-plane period on the order of micrometers. This is derived from the fact that the laminate is a resin, and when producing a base film, when a resin layer is caused by shrinkage that occurs in the process of solidification, or when applying a coating layer for flattening, The non-uniformity of the film thickness caused by unevenness of coating caused by insufficient malleability due to the viscousness of the solution, or stripe unevenness generated by a roll coater extending in the coating direction corresponds to this. In the case of the polyester film produced in connection with the present invention, an undulation having an in-plane period of about 50 μm and a height direction of about 30 nm was observed. This undulation is not derived from the film cast surface.
[0026]
As will be described later, the wave number is separated by performing a Fourier transform on the measured data of the surface unevenness, and the evaluation of the surface unevenness using an autocorrelation coefficient obtained by performing an inverse Fourier transform on the measured data is a method of removing this waviness. In addition, the swell can be considered to be a factor unrelated to the steam barrier property, because of its excellent evaluation of the steam barrier property.
[0027]
The second data is the specific uneven structure according to the present invention. These are caused by polishing marks on the casting surface of the film forming machine, or irregularities on the film surface due to minute scratches caused by foreign substances generated in the film production. The height is 5 nm or 30 nm, and the height in the film surface direction is It was found to be streaky irregularities having a size of 5 μm to 20 μm in width and 50 μm to 150 μm in length. In the case of laminating the inorganic compound layer, if there is a surface unevenness derived from the film cast surface in the production process of this film, since a shadow effect is caused in the film formation, the inorganic compound layer cannot be formed uniformly. It was found that the laminate had poor water vapor barrier properties. Therefore, by using a plastic film base layer surface that does not substantially retain the surface uneven structure derived from the film cast surface in the film manufacturing process, it is possible to obtain a good film laminate with reduced water vapor transmission rate. Becomes possible. Whether or not the surface unevenness derived from the film cast surface in the film manufacturing process is substantially not retained can be determined based on whether or not there is a surface unevenness having a pattern. As a specific method, an evaluation method described later can be cited.
[0028]
The third data, that is, sudden abnormal components such as noise, has no influence on the water vapor barrier property of the present invention.
[0029]
The measurement data of the surface irregularities of the base film is classified into three types: undulation, specific irregularity structure, and sudden abnormal component from the larger spatial period. Since the combined data was evaluated without being separated from each other, it was found that, despite the surfaces having the same measured values, some satisfying the object of the invention and some not satisfying the object of the invention were mixed. More specifically, values such as Ra, Rq, and Rms, which indicate average numerical values of the surface roughness, strongly reflect the “undulation” in this specification, and values indicating the maximum numerical values, such as Rz and Rp, indicate sudden abnormalities. It turned out that it strongly reflected the components. Therefore, it has been found that the surface parameters used so far are not suitable for evaluating the specific uneven structure according to the present invention.
[0030]
As a result of examining the method of separating the specific uneven structure, it was found that the measurement data of the surface unevenness can be separated by performing wave number decomposition by Fourier transform and extracting only necessary components. This Fourier transform can be performed by commercially available analysis software or analysis software attached to a measuring instrument. For example, if the measurement is performed with an optical interference microscope Wyco® NT3300 manufactured by Veeco, the attached analysis software can be used as it is. Further, in the embodiment of the present invention, the measurement of the surface unevenness was performed by using an optical interference microscope. However, even when an AFM (atomic force microscope) generally used for measuring the unevenness of a minute area is used, The measurement data and the analysis result can be used as they are.
[0031]
Although the principle of measurement is different between the optical interference microscope and the AFM, and the interface recognized as the film surface is different, in the range of surface irregularities referred to in the present invention, differences in the measurement method may cause inconsistencies in the scope of the invention. It has been found that it will not occur.
[0032]
In the measurement of surface irregularities, for example, after performing a two-dimensional inclination correction process on an irregularity image measuring an area of about 190 μm × about 250 μm, “undulations” can be removed from the measured values using a High Pass Filter. Although the cut-off frequency of this High Pass Filter can be set arbitrarily, it has been found that it is preferable to set the cut-off frequency to 40.00 / mm for the purpose of the present invention. That is, it has been found that it is effective to remove undulations composed of components having a spatial period larger than 40.00 / mm. The remaining waves of the filtering are composed of a specific concavo-convex structure and a sudden abnormal component.
[0033]
A low pass filter can be used to remove sudden abnormal components such as noise, but since the proportion of the locations where the sudden abnormal components occur in the measurement area is small, the histogram of the height distribution of the irregularities is used. By using, processing can be performed with sufficient accuracy. For example, specifically, it was found that the histogram of the height distribution of the unevenness was cut within the upper 2.5% and lower 2.5%, and the data of the remaining 95% area could be used as the specific uneven structure. .
[0034]
As a result of intensive studies on the unevenness data of this specific unevenness structure, the periodic structure is retained in the unevenness data as a feature common to a film laminate having excellent gas barrier properties despite the lamination of the inorganic compound layer. It has been found. This periodic structure is derived from the fact that one of the origins of the specific concavo-convex structure is a polishing flaw on a casting surface of a film forming machine. That is, it is considered that the polishing surface is polished by using the abrasive particles having a granular distribution, so that a characteristic is generated in the depth and length of the polishing scratch. In addition, it is also caused by scratches on the film surface due to foreign matter generated in the film production process. That is, the cause of occurrence is limited to small pieces derived from the composition of the film, scratches caused by abrasion of the film-forming machine, and the like, and it is considered that the depth and length of the scratches exerted on the film are characteristic. The present invention has been made in view of these causes.
[0035]
There are many methods for expressing the periodic structure than before.For example, the Fourier transform is performed on the measured data of the surface unevenness to separate the wave numbers, and the inverse Fourier transform is performed to obtain the autocorrelation coefficient. Can be properly expressed by expressing the periodicity of the surface as data in real space. In this way, the Fourier transform is performed on the measured data of the surface unevenness to separate the wave numbers, and when the surface unevenness is evaluated using the autocorrelation coefficient obtained by performing the inverse Fourier transform, the periodicity is substantially reduced. When an inorganic compound layer is laminated on the surface of a plastic film base layer having no structure, a good film laminate having reduced water vapor transmission rate can be obtained. Whether or not a substantially periodic structure can be determined can be appropriately determined according to the actual situation.
[0036]
In the embodiment of the present invention, the analysis of the surface unevenness data was performed using the analysis software attached to the optical interference microscope Wyco (trademark) manufactured by Veeco, but the present invention is not limited to this method at all. Similar data can be obtained for the three-dimensional data of the surface unevenness by using a commercially available mathematical processing software or graph creation software, for example, S-PLUS and S + SpatialStats of Mathematical System Co., Ltd., and appropriately using a technique such as spatial analysis. is there.
[0037]
After extensive studies on the periodicity of the surface unevenness of the plastic film base layer, the Fourier transform was performed on the measured data of the surface unevenness distribution, the wave number was separated, and the self-phase relationship obtained by inverse Fourier transform of this was obtained. As shown in FIG. 1, the ratio of the height of the 0th peak to the height of the 1st peak when evaluating the surface unevenness using the numbers is (1st peak) / (0th peak) <1/10. In some cases, it has been found that a good film laminate having a sufficiently smooth surface and a reduced water vapor transmission rate can be provided. In contrast, when the height ratio between the 0th and 1st peaks is (1st peak) / (0th peak) ≧ 1/10 as shown in FIG. And the water vapor transmission rate could not be reduced. Here, the 0th order peak is a peak indicating the origin, and is always present in the autocorrelation coefficient. The first-order peak described here is a peak of the autocorrelation coefficient which is present closest to the origin, and has a period corresponding to a linear distance between the peak of the peak and the origin (that is, the 0th-order peak). This indicates that a periodic structure having is present on the surface. Further, the height of the first peak indicates the strength of the periodicity.
[0038]
Therefore, the smaller the ratio of the first-order peak / zero-order peak, the weaker the periodicity of the surface structure is. According to extensive studies, when the ratio of the plastic film base layer is smaller than 1/10, the periodicity of the surface is sufficiently weak, that is, the specific uneven structure described in the present invention is sufficiently small, It was found that the surface did not affect the lamination of the compound layer.
[0039]
It has been found that this surface periodicity holds not only for the surface smoothness of the film substrate but also for the surface smoothness of the film surface provided with the flattening layer. That is, using a polyester resin, a urethane resin, an acrylic resin, an ethylene vinyl alcohol resin, a vinyl resin, an epoxy resin, a styrene resin, a silicone resin, an alkyl titanate, a modified resin thereof, and the like, a roll coater, a gravure coater, a spin coater, and the like. It was also found that the method can be applied to the surface of a flattening layer produced by introducing a flattening layer by a known method.
[0040]
And the present invention forms an inorganic compound layer on the surface of the plastic film substrate layer or the flattening layer flattened under the conditions described above, but the water vapor transmittance, light transmittance, adhesion, wet heat durability, From the viewpoint of scratch resistance, it is preferable that the inorganic compound layer is formed of at least one selected from the group consisting of simple substances of Al, Si, In, Sn, Ti, and Ta, oxides, nitrides, and oxynitrides. Industrially desirable. These may consist of a plurality of layers.
[0041]
It was found that when an inorganic compound layer was formed on the surface of the plastic film base layer or the flattening layer, the inorganic compound layer was laminated so as to emphasize the unevenness of the base. As a result, when using a plastic film base layer having excellent surface flatness as described in the present invention, the flatness even on the surface of the inorganic compound layer, that is, the ratio of the peak height of the autocorrelation coefficient is increased. When the inorganic compound layer was formed on the surface where the surface flatness was insufficient but the surface flatness was insufficient, it was found that the ratio of the peak heights was larger than the value obtained when the base film was measured. Was.
[0042]
In the method for producing a film laminate in which an inorganic compound layer is laminated on the surface of a plastic film base material layer according to the present invention, a wave number separation is performed by performing a Fourier transform on the measured data of the surface unevenness, and this is subjected to an inverse Fourier transform. On the surface of the plastic film substrate layer or the surface of the flattening layer in which the ratio of the height of the 0th order peak to the height of the 1st order peak when the surface unevenness is evaluated using the autocorrelation coefficient obtained in the above is within a predetermined range. An inorganic compound layer is laminated thereon. In addition, for the surface of the inorganic compound layer after lamination, a Fourier transform was performed on the measured data of the surface unevenness to separate the wave numbers, and the surface unevenness was evaluated using an autocorrelation coefficient obtained by performing an inverse Fourier transform. The base layer made of a plastic film is selected such that the ratio of the heights of the 0th and 1st order peaks falls within a predetermined range. By doing so, a film laminate having an improved water vapor barrier property can be stably produced with good reproducibility. Note that the above “predetermined range” can be appropriately determined based on the required level of water vapor barrier property and the like. Specifically, regarding the surface of the plastic film base layer and the surface of the flattening layer,
(1st peak) / (0th peak) <1/10
It is preferable that
[0043]
【Example】
Next, examples and comparative examples of the present invention will be described in detail. The method of measuring and evaluating the film in the following examples is as follows.
[0044]
<Surface roughness: ratio of peak height>
As an optical interference microscope, an optical interference microscope WYCO (trademark) NT3300 manufactured by Veeco was used, and in the PSI mode, the sample surface in the example and the comparative example was measured for an uneven image having an area of about 190 μm × about 250 μm. After performing the dimensional tilt process, a high pass filter process was performed to remove the undulation component, and a histogram process was performed to remove sudden abnormal components. An autocorrelation coefficient was calculated for this value as data processing, and the height of the 0th peak and the height of the first peak were compared. In addition, an arbitrary point on the sample surface was selected for measurement.
[0045]
<Thickness of inorganic compound layer>
With respect to the laminates obtained in Examples and Comparative Examples, the amount of metal atoms laminated was measured by an X-ray fluorescence analyzer, and the amount was converted to the thickness of the silicon oxide film.
[0046]
<Water vapor transmission rate>
The measurement was carried out under the conditions of a temperature of 40 ° C. and a relative humidity of 100% using a water vapor transmission rate measuring apparatus, Permatran-W1 manufactured by MOCON. Water vapor transmission rate in this measurement is judged to water vapor barrier properties good for what became 0.1g ^/ (m 2 · 24h) or less.
[0047]
[Example 1]
Aminopropyltrimethoxysilane and organosilane were mixed, and butanol, acetic acid, 1-methyl-2-propanol, and distilled water were added as assistants to prepare a planarization solution.
[0048]
A polycarbonate having a bisphenol A skeleton is heated to 290 ° C. to be melted, extruded from a T-die, wound up by a drum cooled to 5 ° C. to form a film, and the film surface in contact with the cast surface is formed. Then, a flattening solution was applied by a spin coating method, and then heated in a 130 ° C. hot bath for 2 minutes to produce a flattened film surface. The thickness of the flattening layer was 300 nm. A silicon oxide film having a thickness of 30 nm was formed as an inorganic compound layer on the surface of the flattening layer by an argon sputtering method.
[0049]
[Example 2]
Polycarbonate having a skeleton of bisphenol A and biscresol fluorene was dissolved in dichloromethane and developed on a casting belt to produce a film. A silicon oxide film having a thickness of 30 nm was formed on the surface of the film that was not in contact with the casting belt by sputtering.
[0050]
[Example 3]
Using a mixture of a thermosetting urethane resin solution containing Coronate L manufactured by Nippon Polyurethane Industry Co., Ltd. diluted with 1-methoxy-2-propanol as a flattening liquid, on the surface of a biaxially stretched polyethylene terephthalate film (manufactured by Teijin DuPont) A flattening layer having a thickness of 1 μm was formed, and a silicon oxide film was formed on the flattened surface to a thickness of 30 nm by a vapor deposition method.
[0051]
[Example 4]
Film lamination was performed in the same manner as in Example 1 except that a film (manufactured by Teijin Dupont Film Co., Ltd.) obtained by forming a film of polyethylene naphthalate by a melt extrusion method and sequentially stretching the film by a biaxial stretching machine was used. Created body.
[0052]
[Comparative Example 1]
A laminate was obtained in the same manner as in Example 1 except that the thickness of the flattening layer was 70 nm.
[0053]
[Comparative Example 2]
Polycarbonate having bisphenol A as a skeleton was dissolved in dichloromethane and developed on a casting belt to prepare a film. A silicon oxide film having a thickness of 33 nm was formed on the surface of the film on the side in contact with the casting belt.
[0054]
Table 1 shows the results.
[0055]
[Table 1]

[0056]
【The invention's effect】
A good film laminate having a reduced water vapor transmission rate can be obtained. In addition, it is possible to reliably manufacture a good film laminate having a reduced water vapor transmission rate.
[Brief description of the drawings]
FIG. 1 is an example of a calculation result of a surface showing a first peak / 0th peak ratio <1/10.
FIG. 2 is another example of a calculation result of a surface showing a first peak / 0th peak ratio> 1/10.

Claims (5)

When Fourier transform is performed on the measured data of the surface unevenness to separate the wave numbers, and the surface unevenness is evaluated using an autocorrelation coefficient obtained by performing an inverse Fourier transform, substantially no periodic structure is observed. A film laminate obtained by laminating an inorganic compound layer on the surface of a plastic film substrate layer. The Fourier transform is performed on the measured data of the surface unevenness to separate the wave numbers, and the zeroth peak and the first peak when the surface unevenness is evaluated using the autocorrelation coefficient obtained by performing the inverse Fourier transform on the Fourier transform. The height ratio is (1st peak) / (0th peak) <1/10
A film laminate obtained by laminating an inorganic compound layer on the surface of a plastic film substrate layer. 3. The inorganic compound layer according to claim 1, wherein the inorganic compound layer is formed of at least one selected from the group consisting of a simple substance of Al, Si, In, Sn, Ti, and Ta, an oxide, a nitride, and an oxynitride. 4. Film laminate. In a method for producing a film laminate formed by laminating an inorganic compound layer on a plastic film base material layer surface,
The Fourier transform is performed on the measured data of the surface unevenness to separate the wave numbers, and the zeroth peak and the first peak when the surface unevenness is evaluated using the autocorrelation coefficient obtained by performing the inverse Fourier transform on the Fourier transform. Laminating the inorganic compound layer on the plastic film substrate layer surface, the height ratio of which is within a predetermined range,
A method for producing a film laminate. In a method for producing a film laminate obtained by laminating a flattening layer and an inorganic compound layer on a plastic film base material layer surface,
The Fourier transform is performed on the measured data of the surface unevenness to separate the wave numbers, and the zeroth peak and the first peak when the surface unevenness is evaluated using the autocorrelation coefficient obtained by performing the inverse Fourier transform on the Fourier transform. Laminating the inorganic compound layer on the planarizing layer surface where the height ratio is within a predetermined range,
A method for producing a film laminate.

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