JP2004256384A5 - - Google Patents
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- JP2004256384A5 JP2004256384A5 JP2004014627A JP2004014627A JP2004256384A5 JP 2004256384 A5 JP2004256384 A5 JP 2004256384A5 JP 2004014627 A JP2004014627 A JP 2004014627A JP 2004014627 A JP2004014627 A JP 2004014627A JP 2004256384 A5 JP2004256384 A5 JP 2004256384A5
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- oxide
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- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 claims description 30
- 229910052574 oxide ceramic Inorganic materials 0.000 claims description 24
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 17
- 239000005751 Copper oxide Substances 0.000 claims description 17
- 229910000431 copper oxide Inorganic materials 0.000 claims description 17
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 15
- 229910001923 silver oxide Inorganic materials 0.000 claims description 15
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 15
- 229910000484 niobium oxide Inorganic materials 0.000 claims description 11
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 claims description 11
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims 4
- 239000004020 conductor Substances 0.000 claims 3
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910044991 metal oxide Inorganic materials 0.000 claims 2
- 150000004706 metal oxides Chemical class 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000001354 calcination Methods 0.000 claims 1
- 229910010293 ceramic material Inorganic materials 0.000 claims 1
- 238000010304 firing Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 239000011224 oxide ceramic Substances 0.000 claims 1
- PCGDDKBKPXANNY-UHFFFAOYSA-N oxocopper Chemical compound O=[Cu].O=[Cu] PCGDDKBKPXANNY-UHFFFAOYSA-N 0.000 claims 1
- 238000010298 pulverizing process Methods 0.000 claims 1
Description
40質量%≦ 酸化ニオブ ≦70質量%
30質量%≦ 酸化銅 ≦60質量%
前記副成分がAの場合、さらに酸化チタン、酸化銀から選ばれた少なくとも一種類を含むことが好ましい。特に酸化チタンと酸化銀は、同時に含むことが望ましい。
40% by mass ≦ Niobium oxide ≦ 70% by mass
30 mass% ≤ copper oxide ≤ 60 mass%
Wherein when subcomponent is A, then further titanium oxide preferably contains at least one member selected et or silver oxide. In particular, it is desirable that titanium oxide and silver oxide are simultaneously contained.
また、前記副成分を構成する酸化ニオブ、酸化銅、酸化チタン、酸化銀の比率が、副成分合計量全体を100質量%とした時に、それぞれ下記の範囲であることが好ましい。
Further, the ratio of niobium oxide, copper oxide, titanium oxide, and silver oxide constituting the subcomponents is preferably in the following range, when the total amount of the subcomponents is 100% by mass.
30質量%≦ 酸化ニオブ ≦70質量%
10質量%≦ 酸化銅 ≦60質量%
0質量%≦ 酸化チタン ≦30質量%
0質量%≦ 酸化銀 ≦30質量%
また、酸化アルミニウムを主成分として含み、副成分として少なくとも酸化銅と酸化チタンと酸化銀を含む酸化物セラミックス材料の場合は、前記副成分を構成する酸化銅、酸化チタン、酸化銀の比率が、副成分合計量全体を100質量%とした時に、それぞれ下記の範囲であることが好ましい。
30% by mass ≦ Niobium oxide ≦ 70% by mass
10 mass% ≤ copper oxide ≤ 60 mass%
0 mass% ≤ titanium oxide ≤ 30 mass%
0% by mass ≦ Silver oxide ≦ 30 % by mass
In addition, in the case of an oxide ceramic material containing aluminum oxide as a main component and at least copper oxide, titanium oxide, and silver oxide as subcomponents, the ratio of copper oxide, titanium oxide, and silver oxide constituting the subcomponent is as follows: When the total amount of the subcomponents is 100% by mass, the respective ranges are preferably in the following ranges.
Claims (17)
A.酸化ニオブ及び酸化銅
B.酸化銅、酸化チタン及び酸化銀 An oxide ceramic material containing aluminum oxide as a main component and at least one selected from the following A and B as a subcomponent.
A. Niobium oxide and copper oxide Copper oxide, titanium oxide and silver oxide
残りの成分が前記副成分のみの場合は前記副成分が2質量%以上20質量%以下、
前記副成分に加えて他の第三成分を含む場合は、前記副成分と第三成分の合計が、2質量%以上20質量%以下である請求項1に記載の酸化物セラミックス材料。 The content of the main component in the whole oxide is 80% by mass or more and 98% by mass or less;
When the remaining component is only the subcomponent, the subcomponent is 2% by mass or more and 20% by mass or less,
2. The oxide ceramic material according to claim 1, wherein when another third component is contained in addition to the subcomponent, the total of the subcomponent and the third component is 2% by mass or more and 20% by mass or less.
40質量%≦ 酸化ニオブ ≦70質量%
30質量%≦ 酸化銅 ≦60質量% 2. The oxide ceramic material according to claim 1, wherein when the subcomponent is A, the ratio of niobium oxide and copper oxide is in the following ranges, respectively, when the total amount of the subcomponents is 100% by mass. 3.
40% by mass ≦ Niobium oxide ≦ 70% by mass
30 mass% ≤ copper oxide ≤ 60 mass%
30質量%≦ 酸化ニオブ ≦70質量%
10質量%≦ 酸化銅 ≦60質量%
0質量%≦ 酸化チタン ≦30質量%
0質量%≦ 酸化銀 ≦30質量% The oxide ceramic material according to claim 4, wherein the ratio of niobium oxide, copper oxide, titanium oxide, and silver oxide is in the following ranges, respectively, when the total amount of the subcomponents is 100% by mass.
30% by mass ≦ Niobium oxide ≦ 70% by mass
10 mass% ≤ copper oxide ≤ 60 mass%
0 mass% ≤ titanium oxide ≤ 30 mass%
0% by mass ≦ Silver oxide ≦ 30 % by mass
10質量%≦ 酸化銅 ≦90質量%
5質量%≦ 酸化チタン ≦60質量%
5質量%≦ 酸化銀 ≦40質量% The ratio of copper oxide, titanium oxide, and silver oxide constituting the sub-component when the sub-component is B is in the following range, respectively, when the total amount of the sub-components is 100% by mass. Oxide ceramic materials.
10 mass% ≤ copper oxide ≤ 90 mass%
5 mass% ≤ titanium oxide ≤ 60 mass%
5% by mass ≦ Silver oxide ≦ 40% by mass
A.酸化ニオブ及び酸化銅
B.酸化銅、酸化チタン及び酸化銀
銀を主成分とする導体を少なくともその内層に有することを特徴とするセラミック基板。 An insulating layer made of an oxide ceramic material containing aluminum oxide as a main component and at least one selected from the following A and B as subcomponents,
A. Niobium oxide and copper oxide A ceramic substrate having a conductor containing copper oxide, titanium oxide and silver oxide as main components at least in its inner layer.
A.酸化ニオブ及び酸化銅
B.酸化銅、酸化チタン及び酸化銀
銀を主成分とする導体を少なくともその内層に有することを特徴とするセラミック積層デバイス。 An insulating layer made of an oxide ceramic material containing aluminum oxide as a main component and at least one selected from the following A and B as subcomponents,
A. Niobium oxide and copper oxide A multilayer ceramic device comprising at least an inner layer of a conductor mainly composed of copper oxide, titanium oxide and silver oxide.
A.酸化ニオブ及び酸化銅
B.酸化銅、酸化チタン及び酸化銀
銀を主成分とする導体を少なくともその内層に有するセラミック基板又はセラミック積層デバイス上にパワーアンプ素子を実装したパワーアンプモジュール。
An insulating layer made of an oxide ceramic material containing aluminum oxide as a main component and at least one selected from the following A and B as subcomponents,
A. Niobium oxide and copper oxide A power amplifier module in which a power amplifier element is mounted on a ceramic substrate or a multilayer ceramic device having at least an inner layer of a conductor mainly composed of copper oxide, titanium oxide, and silver oxide.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004014627A JP2004256384A (en) | 2003-02-05 | 2004-01-22 | Oxide ceramic material, and ceramic substrate, laminated ceramic device, and power amplifier module using the material |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003028810 | 2003-02-05 | ||
JP2004014627A JP2004256384A (en) | 2003-02-05 | 2004-01-22 | Oxide ceramic material, and ceramic substrate, laminated ceramic device, and power amplifier module using the material |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004256384A JP2004256384A (en) | 2004-09-16 |
JP2004256384A5 true JP2004256384A5 (en) | 2006-08-24 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004014627A Withdrawn JP2004256384A (en) | 2003-02-05 | 2004-01-22 | Oxide ceramic material, and ceramic substrate, laminated ceramic device, and power amplifier module using the material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2004256384A (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006151775A (en) * | 2004-12-01 | 2006-06-15 | Matsushita Electric Ind Co Ltd | Method for manufacturing low-temperature firing oxide ceramic material, low-temperature firing oxide ceramic material, low-temperature firing oxide ceramic material electronic component, and method for manufacturing the same |
JP4701761B2 (en) * | 2005-03-15 | 2011-06-15 | パナソニック株式会社 | Ceramic multilayer substrate and power amplifier module using the same |
JP4986594B2 (en) * | 2005-12-20 | 2012-07-25 | 三洋電機株式会社 | Ceramic green sheet and ceramic substrate |
JP4965276B2 (en) * | 2007-02-16 | 2012-07-04 | 日本特殊陶業株式会社 | Wiring board |
JP2011153066A (en) * | 2009-12-28 | 2011-08-11 | Sumitomo Chemical Co Ltd | Method for producing aluminum titanate ceramic |
JP2013170106A (en) * | 2012-02-22 | 2013-09-02 | Kuraray Co Ltd | Slurry composition for ceramic green sheet |
JP6724273B2 (en) * | 2016-07-11 | 2020-07-15 | 茂野 交市 | Dielectric ceramic material and dielectric ceramic composition |
JP6777525B2 (en) * | 2016-12-21 | 2020-10-28 | 日本碍子株式会社 | Heat resistant element for current detection |
JP7215028B2 (en) * | 2018-06-28 | 2023-01-31 | 東ソー株式会社 | Colored alumina sintered body |
JP7206156B2 (en) * | 2019-05-31 | 2023-01-17 | 京セラ株式会社 | Alumina sintered body and wiring board |
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2004
- 2004-01-22 JP JP2004014627A patent/JP2004256384A/en not_active Withdrawn
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