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JP2004256384A5
JP2004256384A5 JP2004014627A JP2004014627A JP2004256384A5 JP 2004256384 A5 JP2004256384 A5 JP 2004256384A5 JP 2004014627 A JP2004014627 A JP 2004014627A JP 2004014627 A JP2004014627 A JP 2004014627A JP 2004256384 A5 JP2004256384 A5 JP 2004256384A5
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oxide
mass
ceramic material
copper
material according
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JP2004014627A
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JP2004256384A (en
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40質量%≦ 酸化ニオブ ≦70質量%
30質量%≦ 酸化銅 ≦60質量%
前記副成分がAの場合、さらに酸化チタン、酸化銀から選ばれた少なくとも一種類を含むことが好ましい。特に酸化チタンと酸化銀は、同時に含むことが望ましい。
40% by mass ≦ Niobium oxide ≦ 70% by mass
30 mass% ≤ copper oxide ≤ 60 mass%
Wherein when subcomponent is A, then further titanium oxide preferably contains at least one member selected et or silver oxide. In particular, it is desirable that titanium oxide and silver oxide are simultaneously contained.

また、前記副成分を構成する酸化ニオブ、酸化銅、酸化チタン、酸化銀の比率が、副成分合計量全体を100質量%とした時に、それぞれ下記の範囲であることが好ましい。
Further, the ratio of niobium oxide, copper oxide, titanium oxide, and silver oxide constituting the subcomponents is preferably in the following range, when the total amount of the subcomponents is 100% by mass.

30質量%≦ 酸化ニオブ ≦70質量%
10質量%≦ 酸化銅 ≦60質量%
0質量%≦ 酸化チタン ≦30質量%
0質量%≦ 酸化銀 ≦30質量
また、酸化アルミニウムを主成分として含み、副成分として少なくとも酸化銅と酸化チタンと酸化銀を含む酸化物セラミックス材料の場合は、前記副成分を構成する酸化銅、酸化チタン、酸化銀の比率が、副成分合計量全体を100質量%とした時に、それぞれ下記の範囲であることが好ましい。
30% by mass ≦ Niobium oxide ≦ 70% by mass
10 mass% ≤ copper oxide ≤ 60 mass%
0 mass% ≤ titanium oxide ≤ 30 mass%
0% by mass ≦ Silver oxide ≦ 30 % by mass
In addition, in the case of an oxide ceramic material containing aluminum oxide as a main component and at least copper oxide, titanium oxide, and silver oxide as subcomponents, the ratio of copper oxide, titanium oxide, and silver oxide constituting the subcomponent is as follows: When the total amount of the subcomponents is 100% by mass, the respective ranges are preferably in the following ranges.

Claims (17)

酸化アルミニウムを主成分として含み、副成分として下記A及びBから選ばれる少なくとも一つを含むことを特徴とする酸化物セラミックス材料。
A.酸化ニオブ及び酸化銅
B.酸化銅、酸化チタン及び酸化銀
An oxide ceramic material containing aluminum oxide as a main component and at least one selected from the following A and B as a subcomponent.
A. Niobium oxide and copper oxide Copper oxide, titanium oxide and silver oxide
前記主成分の酸化物全体に占める含有率が、80質量%以上98質量%以下であり、
残りの成分が前記副成分のみの場合は前記副成分が2質量%以上20質量%以下、
前記副成分に加えて他の第三成分を含む場合は、前記副成分と第三成分の合計が、2質量%以上20質量%以下である請求項1に記載の酸化物セラミックス材料。
The content of the main component in the whole oxide is 80% by mass or more and 98% by mass or less;
When the remaining component is only the subcomponent, the subcomponent is 2% by mass or more and 20% by mass or less,
2. The oxide ceramic material according to claim 1, wherein when another third component is contained in addition to the subcomponent, the total of the subcomponent and the third component is 2% by mass or more and 20% by mass or less.
前記副成分がAの場合、前記副成分合計量全体を100質量%としたときに、酸化ニオブ及び酸化銅の比率が、それぞれ下記の範囲である請求項1に記載の酸化物セラミックス材料。
40質量%≦ 酸化ニオブ ≦70質量%
30質量%≦ 酸化銅 ≦60質量%
2. The oxide ceramic material according to claim 1, wherein when the subcomponent is A, the ratio of niobium oxide and copper oxide is in the following ranges, respectively, when the total amount of the subcomponents is 100% by mass. 3.
40% by mass ≦ Niobium oxide ≦ 70% by mass
30 mass% ≤ copper oxide ≤ 60 mass%
前記副成分がAの場合、さらに酸化チタン、酸化銀から選ばれた少なくとも一種類を含む請求項1に記載の酸化物セラミックス材料。 Wherein when subcomponent is A, then further oxidized titanium oxide ceramic material according to claim 1 comprising at least one selected et or silver oxide. 前記副成分合計量全体を100質量%としたとき、酸化ニオブ、酸化銅、酸化チタン、酸化銀の比率が、それぞれ下記の範囲である請求項4に記載の酸化物セラミックス材料。
30質量%≦ 酸化ニオブ ≦70質量%
10質量%≦ 酸化銅 ≦60質量%
0質量%≦ 酸化チタン ≦30質量%
0質量%≦ 酸化銀 ≦30質量
The oxide ceramic material according to claim 4, wherein the ratio of niobium oxide, copper oxide, titanium oxide, and silver oxide is in the following ranges, respectively, when the total amount of the subcomponents is 100% by mass.
30% by mass ≦ Niobium oxide ≦ 70% by mass
10 mass% ≤ copper oxide ≤ 60 mass%
0 mass% ≤ titanium oxide ≤ 30 mass%
0% by mass ≦ Silver oxide ≦ 30 % by mass
前記副成分がBの場合、前記副成分を構成する酸化銅、酸化チタン、酸化銀の比率が、副成分合計量全体を100質量%としたとき、それぞれ下記の範囲である請求項1に記載の酸化物セラミックス材料。
10質量%≦ 酸化銅 ≦90質量%
5質量%≦ 酸化チタン ≦60質量%
5質量%≦ 酸化銀 ≦40質量%
The ratio of copper oxide, titanium oxide, and silver oxide constituting the sub-component when the sub-component is B is in the following range, respectively, when the total amount of the sub-components is 100% by mass. Oxide ceramic materials.
10 mass% ≤ copper oxide ≤ 90 mass%
5 mass% ≤ titanium oxide ≤ 60 mass%
5% by mass ≦ Silver oxide ≦ 40% by mass
前記酸化物全体を100質量%としたとき、さらに、酸化マンガンを、0.1〜2.0質量%含む請求項1に記載の酸化物セラミックス材料。   2. The oxide ceramic material according to claim 1, further comprising 0.1 to 2.0 mass% of manganese oxide, when the whole oxide is 100 mass%. 3. 前記酸化物セラミックス材料が、相対密度90%以上で焼結されている請求項1に記載の酸化物セラミックス材料。   The oxide ceramic material according to claim 1, wherein the oxide ceramic material is sintered at a relative density of 90% or more. 前記酸化物セラミックス材料の熱伝導率が、5W/m・k以上である請求項1に記載の酸化物セラミックス材料。   The oxide ceramic material according to claim 1, wherein the thermal conductivity of the oxide ceramic material is 5 W / m · k or more. 前記酸化物セラミックス材料の熱伝導率が、10W/m・k以上である請求項1に記載の酸化物セラミックス材料。   The oxide ceramic material according to claim 1, wherein the thermal conductivity of the oxide ceramic material is 10 W / mk or more. 前記酸化物セラミックス材料の1MHzにおける誘電損失が、0.05以下である請求項1に記載の酸化物セラミックス材料。   2. The oxide ceramic material according to claim 1, wherein a dielectric loss at 1 MHz of the oxide ceramic material is 0.05 or less. 前記酸化物セラミックス材料の1MHzにおける誘電損失が、0.01以下である請求項1に記載の酸化物セラミックス材料。   The oxide ceramic material according to claim 1, wherein the dielectric loss of the oxide ceramic material at 1 MHz is 0.01 or less. 前記酸化物セラミックス材料が、金属又は金属酸化物材料粒子を混合し、成形し、950℃以下の温度で焼成されている請求項1に記載の酸化物セラミックス材料。   2. The oxide ceramic material according to claim 1, wherein the oxide ceramic material is a mixture of metal or metal oxide material particles, molded, and fired at a temperature of 950 ° C. or less. 前記酸化物セラミックス材料が、金属又は金属酸化物材料粒子を混合した後、仮焼して粉砕し、その後成形し、950℃以下の温度で焼成されている請求項1に記載の酸化物セラミックス材料。   2. The oxide ceramic material according to claim 1, wherein the oxide ceramic material is obtained by mixing a metal or metal oxide material particles, calcining and pulverizing, then molding and firing at a temperature of 950 ° C. or lower. . 酸化アルミニウムを主成分として含み、副成分として少なくとも下記A及びBから選ばれる少なくとも一つを含む酸化物セラミックス材料からなる絶縁層と、
A.酸化ニオブ及び酸化銅
B.酸化銅、酸化チタン及び酸化銀
銀を主成分とする導体を少なくともその内層に有することを特徴とするセラミック基板。
An insulating layer made of an oxide ceramic material containing aluminum oxide as a main component and at least one selected from the following A and B as subcomponents,
A. Niobium oxide and copper oxide A ceramic substrate having a conductor containing copper oxide, titanium oxide and silver oxide as main components at least in its inner layer.
酸化アルミニウムを主成分として含み、副成分として少なくとも下記A及びBから選ばれる少なくとも一つを含む酸化物セラミックス材料からなる絶縁層と、
A.酸化ニオブ及び酸化銅
B.酸化銅、酸化チタン及び酸化銀
銀を主成分とする導体を少なくともその内層に有することを特徴とするセラミック積層デバイス。
An insulating layer made of an oxide ceramic material containing aluminum oxide as a main component and at least one selected from the following A and B as subcomponents,
A. Niobium oxide and copper oxide A multilayer ceramic device comprising at least an inner layer of a conductor mainly composed of copper oxide, titanium oxide and silver oxide.
酸化アルミニウムを主成分として含み、副成分として少なくとも下記A及びBから選ばれる少なくとも一つを含む酸化物セラミックス材料からなる絶縁層と、
A.酸化ニオブ及び酸化銅
B.酸化銅、酸化チタン及び酸化銀
銀を主成分とする導体を少なくともその内層に有するセラミック基板又はセラミック積層デバイス上にパワーアンプ素子を実装したパワーアンプモジュール。
An insulating layer made of an oxide ceramic material containing aluminum oxide as a main component and at least one selected from the following A and B as subcomponents,
A. Niobium oxide and copper oxide A power amplifier module in which a power amplifier element is mounted on a ceramic substrate or a multilayer ceramic device having at least an inner layer of a conductor mainly composed of copper oxide, titanium oxide, and silver oxide.
JP2004014627A 2003-02-05 2004-01-22 Oxide ceramic material, and ceramic substrate, laminated ceramic device, and power amplifier module using the material Withdrawn JP2004256384A (en)

Priority Applications (1)

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JP2004014627A JP2004256384A (en) 2003-02-05 2004-01-22 Oxide ceramic material, and ceramic substrate, laminated ceramic device, and power amplifier module using the material

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003028810 2003-02-05
JP2004014627A JP2004256384A (en) 2003-02-05 2004-01-22 Oxide ceramic material, and ceramic substrate, laminated ceramic device, and power amplifier module using the material

Publications (2)

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JP2004256384A JP2004256384A (en) 2004-09-16
JP2004256384A5 true JP2004256384A5 (en) 2006-08-24

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Families Citing this family (10)

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Publication number Priority date Publication date Assignee Title
JP2006151775A (en) * 2004-12-01 2006-06-15 Matsushita Electric Ind Co Ltd Method for manufacturing low-temperature firing oxide ceramic material, low-temperature firing oxide ceramic material, low-temperature firing oxide ceramic material electronic component, and method for manufacturing the same
JP4701761B2 (en) * 2005-03-15 2011-06-15 パナソニック株式会社 Ceramic multilayer substrate and power amplifier module using the same
JP4986594B2 (en) * 2005-12-20 2012-07-25 三洋電機株式会社 Ceramic green sheet and ceramic substrate
JP4965276B2 (en) * 2007-02-16 2012-07-04 日本特殊陶業株式会社 Wiring board
JP2011153066A (en) * 2009-12-28 2011-08-11 Sumitomo Chemical Co Ltd Method for producing aluminum titanate ceramic
JP2013170106A (en) * 2012-02-22 2013-09-02 Kuraray Co Ltd Slurry composition for ceramic green sheet
JP6724273B2 (en) * 2016-07-11 2020-07-15 茂野 交市 Dielectric ceramic material and dielectric ceramic composition
JP6777525B2 (en) * 2016-12-21 2020-10-28 日本碍子株式会社 Heat resistant element for current detection
JP7215028B2 (en) * 2018-06-28 2023-01-31 東ソー株式会社 Colored alumina sintered body
JP7206156B2 (en) * 2019-05-31 2023-01-17 京セラ株式会社 Alumina sintered body and wiring board

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