JP2004119992A5 - - Google Patents
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- Publication number
- JP2004119992A5 JP2004119992A5 JP2003418496A JP2003418496A JP2004119992A5 JP 2004119992 A5 JP2004119992 A5 JP 2004119992A5 JP 2003418496 A JP2003418496 A JP 2003418496A JP 2003418496 A JP2003418496 A JP 2003418496A JP 2004119992 A5 JP2004119992 A5 JP 2004119992A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003418496A JP4757442B2 (en) | 1997-02-10 | 2003-12-16 | Chip body adhesive sheet |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2657197 | 1997-02-10 | ||
| JP1997026571 | 1997-02-10 | ||
| JP2003418496A JP4757442B2 (en) | 1997-02-10 | 2003-12-16 | Chip body adhesive sheet |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2865398A Division JP3535968B2 (en) | 1997-02-10 | 1998-02-10 | Method for manufacturing chip body and pressure-sensitive adhesive sheet for manufacturing chip body |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004119992A JP2004119992A (en) | 2004-04-15 |
| JP2004119992A5 true JP2004119992A5 (en) | 2005-07-14 |
| JP4757442B2 JP4757442B2 (en) | 2011-08-24 |
Family
ID=32299867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003418496A Expired - Lifetime JP4757442B2 (en) | 1997-02-10 | 2003-12-16 | Chip body adhesive sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4757442B2 (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006319233A (en) * | 2005-05-16 | 2006-11-24 | Lintec Corp | Brittle member treatment apparatus |
| JP2007294748A (en) * | 2006-04-26 | 2007-11-08 | Tokyo Seimitsu Co Ltd | Wafer transporting method |
| US7910206B2 (en) | 2006-11-10 | 2011-03-22 | Nitto Denko Corporation | Self-rolling laminated sheet and self-rolling pressure-sensitive adhesive sheet |
| JP5323779B2 (en) * | 2010-07-26 | 2013-10-23 | 古河電気工業株式会社 | Wafer processing tape |
| JP5636266B2 (en) * | 2010-11-16 | 2014-12-03 | 株式会社ディスコ | Workpiece processing method and dicing tape |
| JP5554351B2 (en) * | 2012-01-25 | 2014-07-23 | 古河電気工業株式会社 | Wafer processing tape |
| JP6535118B1 (en) * | 2018-03-28 | 2019-06-26 | 古河電気工業株式会社 | Semiconductor processing tape |
| KR102112771B1 (en) * | 2018-03-28 | 2020-05-19 | 후루카와 덴키 고교 가부시키가이샤 | Semiconductor processing tape |
| JP6535119B1 (en) * | 2018-03-28 | 2019-06-26 | 古河電気工業株式会社 | Semiconductor processing tape |
| JP6535138B1 (en) * | 2018-03-28 | 2019-06-26 | 古河電気工業株式会社 | Semiconductor processing tape |
| JP6535117B1 (en) * | 2018-03-28 | 2019-06-26 | 古河電気工業株式会社 | Semiconductor processing tape |
| KR102351045B1 (en) * | 2019-12-19 | 2022-01-14 | 한국기계연구원 | Transfer printing method of adjusting spacing of micro device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6181652A (en) * | 1984-09-28 | 1986-04-25 | Shin Etsu Polymer Co Ltd | Dicing film |
| JP2521459B2 (en) * | 1987-02-23 | 1996-08-07 | 日東電工株式会社 | Method of manufacturing semiconductor chip |
| JPH01116606A (en) * | 1987-10-30 | 1989-05-09 | Nec Corp | Photodetecting module having light controlling function |
| JPH07273173A (en) * | 1994-03-28 | 1995-10-20 | Furukawa Electric Co Ltd:The | Adhesive tape for securing semiconductor wafer |
| JPH08302293A (en) * | 1995-05-10 | 1996-11-19 | Lintec Corp | Heat-shrinkable type surface protective sheet |
| JP3408894B2 (en) * | 1995-05-17 | 2003-05-19 | 日東電工株式会社 | Manufacturing method of semiconductor chip |
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2003
- 2003-12-16 JP JP2003418496A patent/JP4757442B2/en not_active Expired - Lifetime