JP2004193582A - Equipment for sealing with resin - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide equipment for sealing with resin, which does not need special processing before sealing with resin, simplifies a die structure and die maintenance, and improves the mold quality. <P>SOLUTION: Sealing with resin is carried out by carrying a cavity plate 11 in a pressing section 5, which has a bored cavity hole 13 defining the external form and thickness of a work 2 and a package 36 and is capable of repeatedly carrying in and out, and then aligning it a molded die 6 to clamp. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

  The present invention relates to a resin sealing device in which a work is carried into a mold and clamped to perform resin sealing.

  As an example of a resin sealing device for manufacturing a semiconductor device, a resin sealing device in which a resin sealing portion (package portion) is formed by transfer molding is used. In this resin sealing device, a work in which a semiconductor chip is mounted on a substrate such as a resin substrate or a lead frame or a work such as a semiconductor substrate is carried into a mold having a cavity recess formed therein, clamped, and potted. The resin material loaded into the cavity is transferred to the cavity recess through the runner gate by the plunger and is sealed with the resin.

  In recent years, as represented by a CSP (Chip Size Package or Chip Scale Package) type semiconductor device, a work in which a semiconductor chip is mounted in a matrix on one surface of a substrate is collectively sealed with a resin. The semiconductor device is manufactured by dicing the semiconductor chip into individual pieces by a dicing device after sealing and resin sealing.

The mold has an upper mold and a lower mold, and it is necessary to provide a runner gate through which the sealing resin passes over the substrate in order to fill the cavity with the semiconductor chip accommodated therein. In addition, special processing (for example, formation of gold plating for degate) is required on the substrate surface, which increases the manufacturing cost.
Further, when performing one-sided molding on the work, there is a possibility that resin burrs on the side surface of the substrate may occur, and die maintenance is required.

  On the other hand, a method has been proposed in which a cavity plate having cavities is superposed on a printed circuit board and resin-sealed in order to prevent the sealing resin from being brought into contact with a portion other than the resin sealing area of the circuit board ( See, for example, Patent Document 1.

JP-B-61-46049

  However, the resin sealing method of Patent Document 1 merely overlaps a cavity plate having substantially the same size as a printed circuit board and a printed circuit board by passing them through gauge pins of a mold. How to carry the cavity plate and printed circuit board into the mold, and remove the printed circuit board from the mold after molding, as well as gate break of unnecessary resin from the molded product and separation of the cavity plate and printed circuit board. It is not clear how it will be implemented. In addition, since the runner gate is formed on the mold clamping surface, it is necessary to perform cleaning and maintenance of the mold at any time, so that the operation efficiency of the apparatus is reduced and the production efficiency is reduced.

  An object of the present invention is to solve the above-mentioned problems of the prior art, eliminate the need for special processing on a work prior to resin sealing, simplify the mold structure and mold maintenance, and further improve molding quality and production efficiency. It is an object of the present invention to provide a resin sealing device capable of improving the performance.

The present invention has the following configuration to achieve the above object.
That is, in a resin sealing device in which a work is carried into a press section and clamped by a mold die to perform resin sealing, the work and a cavity hole that defines the outer shape and thickness of the resin sealing section are perforated and repeatedly formed. A carry-in / carry-out cavity plate is carried into a press section, and is resin-sealed by being positioned and clamped with a mold.

Specifically, the cavity plate is formed in a metal belt shape that circulates or reciprocates on the clamp surface of the mold, and cavity holes are formed at a plurality of locations at a predetermined pitch. .
In addition, the cavity plate is wound between the feed rollers and pitch-fed, and after the resin is sealed, the cavity plate is separated and fed from the mold clamping surface that is opened, so that the molded workpiece is taken out of the mold. It is characterized by being.
Further, the cavity plate is cleaned along with the transport operation on the upstream side in the transport direction to the press section.

Alternatively, the cavity plate is a metal plate that orbits on a track surface substantially parallel to the clamp surface of the molding die with respect to the press portion, and that cavity holes are formed at a plurality of locations at a predetermined pitch. Features.
This cavity plate is characterized in that it is preheated on the upstream side in the conveying direction to the press section.
Further, the cavity plate is characterized in that the preheating section, the pressing section, the degate section, and the cleaning section are rotated around in synchronization with each other to perform resin sealing.
Further, the molded workpiece is transported from the press section to the degate section on the downstream side in the transport direction, and the resin sealing section and the unnecessary resin section are separated and collected on both sides of the cavity plate.
Further, the press section includes a transfer mold in which a mold clamp surface including a resin path is covered with a release film, or a work mounting section is formed in one mold, and a cavity is formed in the other mold. An overflow cavity capable of communicating with the cavity hole of the plate is formed, and a mold for compression molding covered with a release film is provided.
Further, a work mounting portion of the mold for receiving the substrate when clamping the work is provided with a plate thickness adjusting mechanism for adjusting a change in the plate thickness of the substrate.
In addition, instead of the cavity plate in which the cavity hole is perforated, a cavity concave portion which defines the outer shape and thickness of the resin sealing portion is formed in the press portion, and a vertical gate communicating with the cavity concave portion is perforated. Characterized in that the cavity plate is transported.

When the resin sealing device according to the present invention is used, the work and the cavity plate are carried into the press section, and are sealed with the resin by being positioned and clamped with the mold. No special processing such as gold plating is required, the production process can be simplified, and the mold structure and mold maintenance can be simplified.
In addition, a rectangular metal plate is used as a cavity plate, placed on a frame-shaped transfer arm, and orbitally moved by a predetermined amount on a track surface substantially parallel to a clamp surface of a mold relative to a press portion. Since resin sealing can be performed, flatness can be maintained without being affected by distortion or deformation of the plate surface due to repeated use, and high molding quality can be maintained even for a product having a thin package portion.
In addition, the molding time can be shortened by preheating the cavity plate having a relatively small heat capacity on the upstream side in the conveying direction to the press section, and the cavity plate is moved between the preheating section, the press section, the degate section and the cleaner section between each process. In this case, it is possible to improve the productivity by reducing the waiting time between the steps. Further, by changing to a cavity plate having a different plate thickness and a different cavity hole size, it is possible to cope with a type change of a molded product, and it is possible to produce without significant equipment modification.
In addition, the mold release of the molded workpiece can be performed by opening the mold or lifting or lowering the cavity plate. Since the molded workpiece is taken out of the press section together with the cavity plate, the ejector pins are omitted or By reducing the number, the mold structure can be simplified.
In addition, the cavity plate can uniformly mold the thickness and the outer dimension accuracy of the package portion, and can prevent the resin burrs and the sealing resin from flowing out of the substrate to the molded work, thereby improving the molding quality.
Further, when the release film is stretched on the mold clamping surface including the resin path, the resin path is formed between the release film and the cavity plate, so that the mold clamping surface is not stained as much as possible. Since the sealing resin can be used, the maintenance of the mold can be simplified.
Also, when the work placement part of the mold receiving the substrate when clamping the work is provided with a plate thickness adjusting mechanism for adjusting the change in the thickness of the substrate, the work thickness fluctuation may be reduced. The reliability and versatility of the resin sealing operation can be improved without absorbing and damaging the work or impairing the molding quality.
Further, when a cavity plate having a perforated vertical gate communicating with the cavity concave portion is used, the semiconductor chips arranged in a matrix on the work can be individually resin-sealed, thereby reducing a wasteful resin portion in a molded product. be able to.

Hereinafter, preferred embodiments of the resin sealing device according to the present invention will be described in detail with reference to the accompanying drawings.
[First embodiment]
1 to 7 are explanatory views of the resin sealing process, FIG. 8 is a front view showing an example of the resin sealing device, FIG. 9 is a plan view of the lower mold side of the resin sealing device in FIG. 8, and FIG. 11 (b) is a plan view and a partial sectional view of the cavity plate, and FIGS. 11 (a) and 11 (b) are a plan view and a perspective view of the cavity plate.

First, a schematic configuration of the resin sealing device will be described with reference to FIGS. In the present embodiment, a resin sealing device employing a transfer molding method will be exemplified.
8 and 9, a work supply unit 1 sends a work 2 having a semiconductor chip mounted on a resin substrate or a work 2 such as a semiconductor substrate to a loader 4 side from a supply magazine 3. The work 2 held by the loader 4 is carried into the press unit 5. The loader 4 is configured to move between the cavity plate 11 and the lower mold 8 in a state in which a later-described cavity plate 11 is separated from the lower mold surface. The loader 4 may transfer the work 2 and hold the resin material (such as a resin tablet) to transfer it to the lower mold 8, and supply only the resin material to the lower mold 8 separately from the work 2. You may do it.

  The press unit 5 includes an upper die 7 that is a fixed die and a lower die 8 that is a movable die that constitute the mold 6. The lower die 8 is moved up and down by a clamping mechanism using, for example, an electric motor or the like, and the upper die base 7a is provided with a film transport mechanism 10 for supplying a long release film 9 to the upper die clamping surface. Is provided. The film transport mechanism 10 sends the release film 9 at a predetermined pitch in synchronization with the supply reel to the take-up reel.

  The release film 9 covers a portion that comes into contact with the sealing resin. In this embodiment, the release film 9 is sucked and stretched on the clamp surface of the upper die 7. The release film 9 has heat resistance enough to withstand the heating temperature of the mold, and is easily peeled from the upper mold surface, and has flexibility and extensibility. For example, PTFE, ETFE, PET, FEP, fluorine impregnated glass cloth, polypropylene, polyvinylidene chloride and the like are preferably used. By using the release film 9, there is no need to provide an ejector pin for the resin sealing portion of the mold and a cleaner for cleaning the mold surface after the resin sealing. When the release film 9 is not used, an ejector pin and a cleaner may be provided as appropriate.

On both sides of the press section 5, a plate transport mechanism 12 for transporting the cavity plate 11 between the upper die 7 and the lower die 8 is provided. As shown in FIGS. 10A and 10B, the cavity plate 11 is provided with a cavity hole 13 and a pot hole 14 (both through holes) for defining the outer shape and thickness of the resin sealing portion. The cavity hole 13 defines the outer shape of the resin sealing portion (package portion), and is formed on the hole wall surface having an inclination such that the outer diameter increases toward the substrate side. The pot hole 14 is formed on a hole wall surface having an inclination such that the outer diameter increases toward the upper die clamping surface. The work 2 is loaded into the lower die 8 of the press unit 5 with the semiconductor chip positioned so as to be accommodated in the cavity hole 13, and the upper die in contact with the sealing resin is covered with a release film 9. 7, the work 2 and the cavity plate 11 are clamped and resin-sealed.
The cavity hole 13 may have a strip shape (a type in which sealing is performed at a plurality of locations) shown in FIG. 10A or an elongated hole shape (a type in which sealing is performed at a time) as shown in FIG. FIGS. 10A and 11A illustrate the layout of the cavity holes 13 in one molding area. In the figure, the two-dot chain line indicates the work outline (board outline). The mold cull 29 may be omitted, and a concave groove communicating from the pot hole 14 to the cavity hole 13 may be formed.

The cavity plate 11 is, for example, a long belt made of metal such as stainless steel, titanium, and nickel alloy, and has a thickness of 0.05 to 1.5 mm depending on the thickness of the resin sealing portion (package portion). The degree is used. The cavity plate 11 is not limited to metal, but may be another member as long as it has heat resistance, abrasion resistance, and flexibility enough to withstand conveyance, and may be a resin belt such as a polyimide resin.
Teflon (registered trademark) resin or fluorine resin may be provided on the plate surface (both surfaces or one surface) of the cavity plate 11 and the hole wall surfaces of the cavity hole 13 and the pot hole 14 in consideration of mold releasability from a molded product. A resin or the like may be coated.

  In this embodiment, as shown in FIG. 11B, the cavity plate 11 is formed in an endless belt shape so as to circulate on the clamp surface of the mold. Sprocket wheels 15a and 15b, which are feed rollers, are rotatably supported by support bases 16a and 16b on the upstream and downstream sides of the press unit 5 in the plate transport direction. Feed holes (pitch holes) 17 are formed in both side edges of the cavity plate 11, and feed teeth protruding from the outer circumferences of the sprocket wheels 15 a and 15 b are fitted into the feed holes 17, and the cavity plate 11 is formed. Is pitch-fed. Note that, instead of the endless belt-shaped cavity plate 11, a band-shaped cavity plate 11 that reciprocates with respect to the press unit 5 may be used.

  8 and 9, the support bases 16a and 16b provided on the upstream and downstream sides of the press unit 5 in the plate transport direction are vertically moved by a vertical movement mechanism (for example, a cylinder drive mechanism or a drive mechanism using a servo motor). It works. By moving the cavity plate 11 away from the lower mold clamp surface opened after the resin is sealed by the vertical movement mechanism, the molded workpiece 2 is taken out of the mold 6 together with the cavity plate 11. The plate transport mechanism 12 moves up and down together with the lower die base 8a of the lower die 8, which is a movable die.

  A cleaner section 18 for cleaning the cavity plate 11 is provided upstream of the press section 5 in the transport direction. The cleaner section 18 includes, for example, a cleaning brush 19, an adhesive rubber roller 20a, a cleaning belt 20b, etc., which rotate in contact with the plate surface, and air suction sections 21 above and below the cavity plate 11 are provided further downstream. It is optional to provide the cleaning brush 19, the adhesive rubber roller 20a, and the cleaning belt 20b, and only the air suction unit 21 may be provided.

  A degate section 22 is provided downstream of the press section 5 to separate the molded workpiece 2 taken out together with the cavity plate 11 from unnecessary resin (scrap). That is, in the degate portion 22, the resin sealing portion (package portion) and the unnecessary resin portion are separated and collected from the work 2 after molding on the upper and lower sides of the cavity plate 11.

As an example of the degate portion 22, a molded article holding device 23 is provided above the cavity plate 11, and a degate pallet 24 is provided below the cavity plate 11. The molded article holding device 23 projects, for example, a push-down rod and collects only the molded work 2 on the degate pallet 24 waiting below the cavity hole 13. Further, the scrap remaining around the pot hole 14 is pushed up from below the cavity plate 11 by the push-up mechanism, and the scrap released from the mold is sucked by the molded article holding mechanism 23 and dropped into the collection box 25 to be collected.
The work 2 collected on the degate pallet 24 is transferred from a position below the cavity plate 11 to a delivery position where the degate pallet 24 does not intersect with the cavity plate 11, and is sucked and held by, for example, the molded article holding mechanism 23. It is designed to be stored in the molded product storage section 26. The mechanism for storing the molded product released from the cavity plate 11 from the degate pallet 24 into the molded product storage section 26 and the mechanism for collecting the scrap released from the cavity plate 11 into the collection box 25 are respectively dedicated. It is also possible to perform by setting the hand.

Next, a resin sealing process using the above-described resin sealing device will be specifically described with reference to FIGS.
Prior to the description of the operation, the configuration of the transfer mold 6 provided in the press section 5 will be specifically described. The lower die 8 is provided with a pot 27, a plunger 28 and a uniform pressure unit (not shown) which constitute a known transfer mechanism, and a work placing portion 8b on which the work 2 is set is formed on the lower die clamping surface. I have.
Further, a mold cull 29 and a mold runner gate 30 are formed on the upper mold 7. A release film 9 is stretched on the upper clamp surface including the resin path. The mold runner gate 30 is formed between the upper mold clamping surface covered with the release film 9 and the cavity plate 11.

  FIG. 1 shows a state in which the work 2 is carried into the lower mold 8 of the opened mold 6. The release film 9 is held by suction on the clamp surface of the upper die 7. The release film 9 is sucked from a suction hole 31 provided in the upper die 7 by an air suction mechanism (not shown) and stretched on the clamp surface of the upper die. Further, a suction hole 32 is formed in the work placing portion 8b of the lower die 8. The substrate surface of the work 2 is suction-held by the air suction mechanism (not shown) from the suction hole 32 and is suction-held by the work mounting portion 8b. The pot 27 is loaded with a resin material 33 (a resin tablet, a powder resin, a granular resin, a liquid resin, a plate-like resin, etc.). still. The cavity plate 11 has been cleaned by the cleaner unit 18 in advance, and stands by in a state where the cavity plate 11 is separated from the lower die 8 (lifted up state) by a vertical movement mechanism (not shown).

  In FIG. 2, when the work 2 is set on the lower mold 8, the cavity plate 11 is lifted down (moves to the lower mold clamping surface side), the semiconductor chip of the work 2 is accommodated in the cavity hole 13, and the pot hole 14 is formed. Are positioned so as to face the opening of the pot 27 and are superposed. The movement of the cavity plate 11 is performed by moving the support bases 16a and 16b by the vertical movement mechanism (cylinder drive mechanism, servo motor drive mechanism, etc.) as described above (see FIG. 8).

Next, in FIG. 3, the mold 6 is closed. The lower mold 8 is moved upward by activating a mold clamping mechanism (not shown), and the workpiece 2 and the cavity plate 11 are clamped between the upper mold 7 and the work 2.
In FIG. 4, the transfer mechanism is operated to inject the sealing resin 34 into the cavity 13. That is, the sealing resin 34 melted by the heated mold 6 moves the plunger 28 upward to fill the cavity 13 through the mold cull 29 and the mold runner gate 30. Since the sealing resin 34 is fed through a resin path formed between the cavity plate 11 and the release film 9, the sealing resin 34 is injected into the cavity 13 without contacting the clamp surfaces of the upper die 7 and the lower die 8. . Then, heat curing (curing) of the sealing resin 34 is performed while the mold 6 is in the clamped state.

  In FIG. 5, the mold clamping mechanism is activated again to open the mold 6. When the lower die 8 is moved downward together with the plate transport mechanism 12, the molded product and the upper die 7 are released. That is, since the lower die 8 is moved downward while the release film 9 is being sucked and held by the upper die 7, an unnecessary resin portion (scrap) 35 including a molded product cull and a resin sealing portion (package portion) 36 are included. It can be more easily released from the molded part. The work 2 is adsorbed to the work placing portion 8b, and the lower die 8 moves while the cavity plate 11 is lifted down to the lower die clamping surface.

  In FIG. 6, when the mold opening is completed, the suction of the work 2 is stopped, the cavity plate 11 is lifted up from the lower mold clamp surface, and the mold is released from the lower mold 8 while holding the work 2 and the molded part integrally. . Then, by rotating the sprocket wheels 15a and 15b of the plate transport mechanism 12 to feed the cavity plate 11 by a predetermined pitch in the direction of the arrow, the formed workpiece 2 is taken out from the mold 6 to the degate section 22. At this time, a new cavity plate 11 in which cavity holes 13 and pot holes 14 used for resin sealing of the next work 2 are perforated is continuously conveyed to the press unit 5.

  In FIG. 7, a molded product holding device 23 is on standby above the cavity plate 11 in the degate section 22, and a degate pallet 24 is moved and arranged below the cavity plate 11. In the molded article holding device 23, the push-down rod 37 abuts against the upper surface of the package portion 36 exposed in the cavity hole 13, and the gate break from the scrap 35 and the mold release from the cavity plate 11 are simultaneously performed, so that only the work 2 is formed. Is collected on the degate pallet 24. Further, the scrap 35 remaining on the pot hole 14 and the cavity plate 11 is inserted through the relief hole of the degate pallet 24, is hit by the push-up rod 38, is released from the cavity plate 11, and is released from the cavity holding device 23. Is held by the suction pad 39.

  The degate pallet 24 moves to a delivery position that does not intersect with the cavity plate 11 with the formed work 2 placed thereon. After collecting the scrap 35 sucked and held on the suction pad 39 into the collection box 25, the molded article holding device 23 transfers the work 2 from the degate pallet 24 at the delivery position, and forms the work 2 while sucking and holding the work 2. It is transferred to the article storage section 26 and stored.

  The cavity plate 11 from which the molded workpiece 2 and the scrap 35 have been released is transported to the cleaner section 18 by the plate transport mechanism 12, and the cleaning brush 19, the adhesive rubber roller 20 a, and the air suction section 21 remove dust and resin. The residue is removed to prepare for the next resin sealing. Specifically, after the surface of the cavity plate 11 is rubbed with the cleaning brush 19, a thin burr or the like is adhered and removed with the adhesive rubber roller 20a. Finally, air is suctioned from both sides by the air suction unit 21 to complete the cleaning.

  Since the adhesive rubber roller 20a is in contact with the cleaning belt 20b, thin burrs and the like are transferred to the cleaning belt 20b and cleaned. In other words, a long adhesive belt is used for the cleaning belt 20b, and the cleaning belt 20b is fed from the supply reel, the adhesive surface is pressed by the rubber roller 20a, and the thin burrs and the like are transferred to the take-up reel. I have. The cleaning belt 20b needs to be replaced when the remaining amount becomes small. The cleaning belt 20b keeps the surface of the adhesive rubber roller 20a clean at all times. Although the case where the cleaning unit 18 cleans the upper surface side (outer surface side) of the cavity plate 11 has been described, the cleaning unit 18 may also be provided on the lower surface side (inner surface side) to clean both surfaces.

  When the cavity plate 11 is transported to the cleaner section 18, the resin-sealed work 2 is then taken out to the degate section 22, and at the same time, a new cavity plate 11 is continuously transported to the press section 5, and the same operation is performed. Is repeatedly performed. In a product in which semiconductor chips are arranged in a matrix and sealed together, the work 2 is diced by a dicing device and separated into individual pieces.

If the above-described resin sealing device is used, the sealing resin 34 does not pass over the work 2, so that a special processing such as gold plating is not required for the work 2 prior to resin sealing, and the production process is simplified. it can.
Further, since the sealing resin 34 is filled in the cavity 13 through the mold runner gate 30 having the release film 9 and the cavity plate 11 interposed therebetween, the maintenance of the mold can be simplified. The mold 2 can be released from the mold by opening the mold 6 and lifting up the cavity plate 11. Since the molded work 2 can be taken out of the press section 5 together with the cavity plate 11, the ejector pins can be removed. It can be omitted to simplify the mold structure.
In addition, the cavity plate 11 can uniformly mold the thickness and the outer dimension accuracy of the package portion 36, and the molding work 2 does not have resin burrs or the sealing resin 34 sneaking out of the substrate, thereby improving molding quality. Can be.

[Second embodiment]
Next, another example of the resin sealing device will be described with reference to FIGS. 12 is a plan view showing a layout of the entire resin sealing device, FIG. 13 is a front view of the resin sealing device viewed from the direction of arrow F in FIG. 12, and FIG. 15 is a cross-sectional explanatory view as viewed from the direction of arrow B in FIG. 13, and FIGS. 16A and 16B are explanatory views of a cavity plate and a support frame. It is to be noted that the same members as those of the first embodiment are denoted by the same reference numerals, and the description will be referred to, and the description will focus on different mechanisms.
In FIG. 12, the cavity plate 11 is adapted to move around the track surface 83 substantially parallel to the clamp surface of the mold relative to the press section 5. Specifically, a preheat portion 84, a press portion 5, a degate portion 22, and a cleaner portion 85 are provided along the track surface 83, and four cavity plates 11 corresponding to the processes of each portion are provided. . The cavity plate 11 is rotated around the preheating section 84, the press section 5, the degate section 22, and the cleaner section 85 in synchronization with each other, and resin sealing is performed. The number of the cavity plates 11 may be increased or decreased, and it is possible to operate with only one.

  In FIG. 16A, a rectangular metal plate is used as the cavity plate 11 as an example. A plurality of pot holes 14 and cavity holes 13 are formed in the cavity plate 11 at a predetermined pitch. Positioning holes 101 for positioning the upper die 7 and the lower die 8 when clamped to the mold die are formed in, for example, four places in the peripheral edge of the cavity plate 11. The positioning hole 101 is formed in a long hole formed toward the center of the cavity plate 11. For the cavity plate 11, the same steel material as the mold, for example, stainless steel, titanium, a nickel alloy, or the like is used, and the plate thickness is 0.3 to 1.0 mm depending on the thickness of the resin sealing portion (package portion). The degree is used. The cavity plate 11 is not limited to metal, but may be another member as long as it has heat resistance, abrasion resistance, and rigidity enough to withstand conveyance, and may be a resin plate material such as a polyimide resin. Teflon (registered trademark) resin or fluorine resin may be provided on the plate surface (both surfaces or one surface) of the cavity plate 11 and the hole wall surfaces of the pot hole 14 and the cavity hole 13 in consideration of the releasability from a molded product. A resin or the like may be coated.

  The cavity plate 11 is positioned and supported by being fitted to a pin or the like provided on a peripheral portion of the support frame 86 shown in FIG. In FIG. 16C, the cavity plate 11 and the support frame 86 are fitted to pins, protrusions, and the like provided on the transfer arm 88, and are transferred while being positioned and overlapped. Hollow holes 87 are formed in the support frame 86 and the transfer arm 88 so as to include a stage area R corresponding to the mold clamping surface of the cavity plate 11. The hollow holes 87 are provided so as not to interfere when the mold plate clamps the cavity plate 11 as described later. The transfer arm 88 works in each stage area R formed in the hollow hole 87 without retreating into and out of the track surface 83 while being positioned in the preheating section 84, the press section 5, the degate section 22, and the cleaner section 85. Is to be performed. In FIG. 16B, the transfer arm 88 is connected to the orbiting guide block 93 by the connecting portion 102 and moves integrally. The support frame 86 and the cavity plate 11 superimposed on the transfer arm 88 are mounted so as to be liftable by lifters 95 and 100 described later.

  The revolving mechanism of the transfer arm 88 will be described. 12, an endless belt (chain) 91 is wound between pulleys (sprocket wheels) 89 and 90 at the center of the track surface 83. The belt 91 is driven to rotate by a circling motor 92 via a motor-side pulley 89 in FIG. A guide block 93 is connected to the belt 91 at four points. A transport arm 88 is supported by each guide block 93 in a cantilever manner. The guide block 93 is configured to move around in conjunction with a guide rail 94 provided along the belt 91. A transfer arm 88 is connected to the guide block 93 via a connecting portion 102.

  Next, the configuration of each component disposed on the track surface 83 will be described together with the operation. The preheating section 84 is provided upstream of the press section 5 in the transport direction, and preheats the cavity plate 11. Since the cavity plate 11 is thin and has a small heat capacity, in order to shorten the molding cycle and maintain the molding quality, the cavity plate 11 is preheated to about 120 ° to 130 ° before being loaded into the press unit 5. It is desirable.

  In FIG. 13, when the cavity plate 11 is transported to the preheating unit 84 while being placed on the transport arm 88 together with the support frame 86, both sides of the support frame 86 are held by the lift arm 104 of the lifter device 95. The cavity plate 11 is lifted up while being pressed against the preheat mold plate 84a.

  In FIG. 15, in a lifter device 95, a lift arm 104 moves up and down by, for example, driving a cylinder (air cylinder 103). The lift arms 104 are provided at both side positions orthogonal to the transfer direction of the transfer arm 88. The lift arm 104 is connected by a connection shaft 105 through which the preheat mold 84a is inserted. The lift arm 104 moves up and down synchronously on both sides through meshing between a pinion gear and a rack provided on both sides through a shaft, for example. Thus, the cavity plate 11 moves up and down while maintaining the parallelism with the mold surface. The cavity plate 11 carried into the preheating section 84 is lifted up by the hand 106 provided at the tip of the lift arm 104 while holding both sides of the support frame 86, and the cavity plate 11 is pressed against the preheating mold 84a. .

  13, a resin supply section 96 is provided below the preheating section 84. The resin supply unit 96 accommodates, for example, a resin material 33 (eg, a resin tablet) sent out of alignment from the parts feeder in a cassette or the like, and moves the cassette up and down between the tablet replenishment position and the delivery position to the loader. It is designed to reciprocate.

  In FIG. 12, a substrate preheating unit 97 is provided on the upstream side of the resin supply unit 96 in the work transfer direction. In the present embodiment, a work 2 on which a semiconductor chip is mounted on a substrate is accommodated in a supply magazine 3, and in the present embodiment, two works are simultaneously sent out to a substrate preheating unit 97 by a pusher 98. The substrate preheating unit 97 is provided to reduce the temperature difference between the substrate temperature and the mold temperature to shorten the molding time.

  In FIG. 13, the loader 99 reciprocates between the substrate preheating unit 97 and the press unit 5. The loader 99 moves to the substrate preheating unit 97 to hold the preheated work 2, moves to the resin supply unit 96 to hold the resin material 33, and carries them into the lower die of the press unit 5. Further, the cavity plate 11 preheated by the transfer arm 88 is carried into the upper mold side of the press unit 5 in synchronization with the operation of loading the work into the press unit 5 by the loader 99 or individually.

  Next, as in the first embodiment, the configuration of the press section 5 includes an upper die 7 that is a fixed die and a lower die 8 that is a movable die. The upper die 7 is provided with a film transport mechanism 10 for supplying a release film 9 to the upper die clamping surface. The release film 9 is sucked and stretched on the upper mold clamping surface. The upper die 7 is provided with a lifter device 100. The configuration of the lifter device 100 is the same as that of the lifter device 95 shown in FIG. That is, the cavity plate 11 carried into the press unit 5 by the transfer arm 88 is lifted up by the hand 106 provided at the lower end of the lift arm 104 while both sides of the support frame 86 are held, and the cavity plate 11 is released. The film 9 is pressed against the stretched upper clamp surface.

  In FIG. 13, the lower mold 8 is moved up and down by a known mold clamping mechanism. When closing the mold, the lower mold 8 moves upward, enters the transfer arm 88 and the hollow hole 87 of the support frame 86, and clamps the cavity plate 11 lifted up to the upper mold clamping surface. At this time, the semiconductor chip of the work 2 enters the cavity hole 13 and the substrate 2a is pressed against the cavity plate surface. Further, the pot of the lower die 8 is clamped by being aligned with the pot hole 14 of the cavity plate 11.

  The lower die 8 is provided with a known transfer mechanism 101 having a plunger for pushing the resin material 33 loaded in the pot. When the transfer mechanism 101 is operated with the workpiece 2 clamped, the plunger feeds the melted sealing resin 34 into the cavity 13 through a resin path formed between the cavity plate 11 and the release film 9. It is sealed with resin.

  When the resin sealing is completed, the lower mold 8 is moved downward to separate from the cavity plate 11 and then the lifter device 100 is operated to lift down the lift arm. The cavity plate 11 is placed on the transfer arm 88 by separating from the release film 9. The formed cavity plate 11 is conveyed to the degate section 22 by activating the orbiting motor 92. Further, the release film 9 is advanced by a predetermined pitch in preparation for the next molding operation. If the release film 9 is not used for the upper mold 7, a known ejector pin mechanism may be provided, and the ejector pins may be released from the mold by abutting the ejector pins against the package simultaneously with opening the mold.

  In FIG. 14, when the transfer arm 88 is rotated and the cavity plate 11 is transferred into the degate section 22, the degate pallet 24 enters from below through the support frame 86 and the hollow hole 87 of the transfer arm 88 and stands by. A push-down rod is pressed against the package portion exposed in the cavity hole 13, and a push-up rod is pressed against the scrap 35, so that the work 2 and the scrap 35 are gate-breaked from the cavity plate 11. The workpiece 2 after release is once moved downward from the transfer arm 88 while being placed on the degate pallet 24, and is transferred to the molded article storage section 26 shown in FIG. Further, the scrap 35 is sucked and held by the suction conveyance unit 81 and collected in a collection box (not shown).

  In FIG. 14, the cavity plate 11 after degate is transported to the cleaner 85 while being placed on the transport arm 88. The cleaning portion 85 is provided with cleaning brushes 85 a and 85 b that can move toward and away from the upper and lower surfaces of the cavity plate 11. The cleaning brushes 85a and 85b are covered by a hood cover 85d, and a suction duct 85c connected to a suction device (not shown) is connected to the hood cover 85d. The cavity plate 11 is cleaned by reciprocating the cleaner portion 85 in the direction of the arrow in FIG. 14 while brushing the upper and lower plate surfaces with the cleaning brushes 85a and 85b. Since this cleaning step can be repeated through the molding operation of the cavity plate 11, sufficient cleaning can be performed.

As described above, a metal plate is used as the cavity plate 11, the cavity plate 11 is placed on the frame-shaped transfer arm 88, and the track surface 83 substantially parallel to the clamp surface of the mold is placed on the press unit 5. The resin can be sealed while moving around the upper portion by a predetermined amount. For this reason, since the flatness can be maintained without being affected by the distortion or deformation of the plate surface due to repeated use, a high molding quality can be maintained even for a thin product having a package portion of about 0.5 mm.
In addition, the molding time can be shortened by preheating the cavity plate having a relatively small heat capacity on the upstream side in the conveying direction to the press unit 5, and the cavity plate 11 can be replaced with the preheat unit 84, the press unit 5, the degate unit 22, and the cleaner. By rotating the unit 85 in synchronization with each process, the waiting time between processes can be reduced and the productivity can be improved. In addition, by changing to a cavity plate 11 having a different plate thickness or cavity hole size, it is possible to cope with a type change of a molded product, and it is possible to produce without significant equipment modification.
In addition, by using the cavity plate 11, the structure of the mold can be simplified, and the mold clamping surface can be sealed with the sealing resin as little as possible with the sealing resin, so that the mold maintenance can be simplified. In addition, the cavity plate 11 can uniformly mold the thickness and the external dimension accuracy of the package portion, and can prevent molding burrs and the sealing resin from flowing out of the substrate into the work 2 after molding, thereby improving molding quality. .

[Third embodiment]
Next, another example of the resin sealing device will be described with reference to FIGS. Since the schematic configuration of the resin sealing device is the same as that of the first and second embodiments, the different points will be mainly described below. The present embodiment is characterized in that a molding die 40 for compression molding is used in the press section 5. Note that the liquid resin 47 is used as the resin material, and the upper mold 41 is described as a movable mold (or a fixed mold), and the lower mold 42 is described as a fixed mold (or a movable mold). In addition, the same members as those in the above-described embodiment are denoted by the same reference numerals, and the description is referred to.
In FIG. 17, the mold cull and the mold runner gate are omitted from the clamp surface of the upper mold 41, and an overflow cavity 43 that can communicate with the cavity hole 13 of the cavity plate 11 is formed. Further, a suction hole 44 communicating with an air suction mechanism (not shown) is formed in the upper die 41. The suction hole 44 is also formed at the bottom of the overflow cavity 43. The release film 9 is sucked by the air suction mechanism from the suction hole 44 and stretched on the clamp surface of the upper die.

  Further, the transfer mechanism is omitted in the lower die 42, and a work placing portion 42b on which the work 2 is set is formed on the lower die clamp surface. Further, a suction hole 45 is formed in the work placing portion 42b of the lower die 42. The substrate surface of the work 2 is sucked and held by the work mounting portion 8b by being sucked by an air suction mechanism (not shown) from the suction hole 45.

  In the cavity plate 11, an overflow gate (concave groove) 46 that connects the cavity hole 13 and the overflow cavity 43 is formed. Further, the pot hole 14 is omitted since it is unnecessary. Note that the overflow gate 46 can be omitted. In this case, the cavity plate 11 needs to be clamped by the upper mold 41 and the lower mold 42 so that the cavity hole 13 and the overflow cavity 43 communicate with each other. Further, the overflow gate 46 may be provided so as to communicate the overflow cavity 43 with the clamp surface of the upper die 41, and further provided, for example, on two or four opposing sides of the peripheral portion of the cavity hole 13. May be.

Hereinafter, the resin sealing operation will be described with reference to FIGS. 17 to 19, focusing on steps different from those of the first and second embodiments.
FIG. 17 shows a state where the work 2 is carried into the lower mold 42 of the opened mold 40. The release film 9 is held by suction on the clamp surface of the upper die 41. The release film 9 is sucked from a suction hole 44 provided in the upper die 41 by an air suction mechanism (not shown) and stretched on the clamp surface of the upper die. The work 2 placed on the work placement portion 42b of the lower die 42 is sucked from the suction hole 45 by an air suction mechanism (not shown) and is held by suction. The cavity plate 11 has been cleaned by the cleaner unit 18 (or the cleaner unit 85) in advance, and stands by (or is lifted up) from the lower mold 42 by a vertical movement mechanism (not shown) (or the transfer arm 88). While moving around to the press section 5 while being placed on the stand).

  In FIG. 18, when the work 2 is set on the lower mold 42, the cavity plate 11 is lifted down and moves to the lower mold clamping surface side (or moves up to a position where the lower mold 42 supports the cavity plate 11). Then, the semiconductor chip of the work 2 is accommodated in the cavity hole 13, and is aligned and overlapped so that the overflow gate 46 faces the overflow cavity 43 covered with the release film 9. The movement of the cavity plate 11 is performed by moving the support bases 16a and 16b by the vertical movement mechanism (cylinder drive mechanism, servo motor drive mechanism, etc.) as described above (see FIG. 8). Alternatively, this is performed by activating the orbiting motor 92 and moving the transport arm 88 along the track surface 83 (see FIG. 12).

  Next, the liquid resin 47 is supplied to the cavity hole 13 by a resin supply mechanism (not shown) such as a dispenser. The supply amount of the liquid resin 47 may be determined in advance in accordance with the volume of the cavity hole 13, or in the work 2 in which the semiconductor chips are arranged in a matrix, the defective portion and the variation in the resin amount are taken into consideration. The liquid resin 47 may be measured in advance before resin sealing and then supplied to the cavity 13. Further, by applying the liquid resin 47 on the semiconductor chip (at the center of the cavity hole 13) higher than the peripheral portion, the amount of movement of the liquid resin 47 can be reduced and uniform sealing can be performed.

Next, in FIG. 19, the mold 40 is closed. By activating a mold clamping mechanism (not shown), the upper mold 41 is moved downward (or the lower mold 42 is moved upward), and the work 2 and the cavity plate 11 are clamped between the lower mold 42 (or the upper mold 41). You.
At this time, the liquid resin 47 is uniformly heated and pressurized and filled in the cavity hole 13, and the liquid resin 47 and air overflowing from the cavity hole 13 are absorbed by the overflow cavity 43 through the overflow gate 46. Also in this case, the sealing resin is injected into the cavity 13 without contacting the clamp surfaces of the upper mold 41 and the lower mold 42. Then, the liquid sealing 47 is heated and cured (cured) while the mold 40 is clamped.

The releasing operation of the workpiece 2 after molding and the unloading operation from the press section 5 to the degate section 22 are the same as those in the first and second embodiments. In the case of this embodiment, the overflow of the liquid resin 47 is considered to be slight even if it overflows. Therefore, in the degate operation, for example, a gate break is performed only by abutting the push-down rod 37 of the molded article holding device 23 against the upper surface of the package portion 36 exposed in the cavity hole 13, and only the workpiece 2 after molding is degated. Collected on the pallet 24. The scrap 35 remaining on the cavity plate 11 is collected by the collection box 25 while being held by the hand (or the suction conveyance unit 81) of the molded article holding device 23 or the like. The operation of accommodating the work 2 in the molded article accommodating portion 26 and the operation of cleaning the cavity plate 11 are performed in the same manner as in the first and second embodiments.
Further, as shown by a two-dot chain line in FIG. 19, the lower die 42 may be a transfer molding die (a pot, a die with a plunger). Further, a granular resin or the like may be used instead of the liquid resin 47. When the release film 9 is not used, an ejector pin may be provided.

  Even if the above-described resin sealing device is used, the work 2 does not require special processing such as gold plating prior to resin sealing, so that the production process can be simplified, mold maintenance can be simplified, and the ejector pins can be used. By omitting it, the mold structure can be simplified, the thickness and the external dimension accuracy of the package portion 36 can be uniformly formed, and the molding quality can be improved. In particular, since the supply amount of the resin material 33 is set or measured in advance and can be quantitatively supplied directly to the cavity hole 13, waste of the sealing resin is eliminated, yield is improved, and the amount of scrap 35 generated can be reduced. .

[Fourth embodiment]
Next, another example of the resin sealing device will be described with reference to FIGS. Since the schematic configuration of the resin sealing device is the same as that of the first and second embodiments, the different points will be mainly described below. It is to be noted that the same members as those in the above-described embodiment are denoted by the same reference numerals, and the description is referred to. In the present embodiment, a molding die 48 for transfer molding is used in the press section 5. Hereinafter, description will be made on the assumption that the upper mold 49 is a fixed mold and the lower mold 50 is a movable mold.
In FIG. 20, a cavity 50 is formed in a lower mold 50 and includes a pot 27 and a plunger 28. Further, as the work 2, a lead frame on which a semiconductor chip is mounted is used. As the resin material 33, a granular resin, a liquid resin, or the like is used in addition to the resin tablet.

Since the release film 9 is not easily supplied to the clamp surface of the lower die 50 due to the arrangement of the cavity plate 11, the ejector pins 52 and a known ejector pin driving mechanism (shown in FIG. Z) is provided. When the lower mold 50 is opened after the resin sealing, the ejector pins 52 push up the package portion 36 from the bottom of the cavity concave portion 51 to release the work 2 from the lower mold 50.
The upper die 49 has a suction hole 57 communicating with an air suction mechanism (not shown). The release film 9 is sucked by the air suction mechanism from the suction hole 57 and stretched on the clamp surface of the upper die. In FIG. 21, a side gate (concave groove) 53 communicating from the pot hole 14 to the cavity hole 13 may be formed in the cavity plate 11.

  In the resin sealing operation, the sealing resin 34 melted by the heated mold 48 moves the plunger 28 upward to fill the cavity 13 through the mold cull 29 and the mold runner gate 30. Since the sealing resin 34 is fed through a resin path formed between the cavity plate 11 and the release film 9, the sealing resin 34 is injected into the cavity 13 without contacting the clamp surfaces of the upper die 7 and the lower die 8. . Then, the cavity concave portion 51 is filled from the cavity hole 13 through the gap between the leads of the lead frame. While the mold 48 is clamped, the sealing resin 34 is cured by heating (curing), and the package portions 36 are formed on both surfaces of the lead frame. The lower mold 50 needs to be cleaned before the next resin sealing is started. Cleaning may be performed by a loader 4 or the like prior to loading of a dedicated machine or a work.

Even with the use of the above-described resin sealing device, the work 2 does not require special processing such as gold plating prior to resin sealing, and the production process can be simplified. Although the ejector pins 52 on the lower mold 50 side cannot be omitted, the upper mold 49 can be omitted using the release film 9, so that mold maintenance can be simplified and the mold structure can be simplified by reducing the ejector pins 52. it can.
When the release film 9 is not used for the upper die 49, an ejector pin may be provided similarly to the lower die 50. In addition, the mold 48 can have versatility such that not only the work 2 of the double-sided mold type but also the work 2 of the single-sided mold type can be shared.

[Fifth embodiment]
Next, another example of the resin sealing device will be described with reference to FIG. Since the schematic configuration of the resin sealing device is the same as that of the first and second embodiments, the different points will be mainly described below. It is to be noted that the same members as those in the above-described embodiment are denoted by the same reference numerals, and the description is referred to.
In the present embodiment, a molding die 59 for transfer molding is used in the press section 5, the upper die 54 is a fixed die, and the lower die 55 is a movable die. In this embodiment, a case where the cavity plate 11 and the work 2 are set upside down on the lower mold 55 will be described.

  A work receiving portion (recess) 54 a is formed on the clamp surface of the upper die 54. The upper mold 54 has a suction hole 56 communicating with an air suction mechanism (not shown). The release film 9 is sucked by the air suction mechanism from the suction hole 56 and stretched on the upper die clamping surface including the work receiving portion 54a.

The lower die 55 is provided with a transfer mechanism including the pot 27 and the plunger 28. The lower mold 55 has a mold cull 29 and a mold runner gate 30 formed thereon. When the release film 9 is not stretched on the clamp surface of the lower mold 55 due to the arrangement of the cavity plate 11, the position of the cavity hole 13 of the cavity plate 11, the mold cull 29 and the mold runner gate are not provided. An ejector pin 52 and a known ejector pin driving mechanism (not shown) are provided at the position 30. When the lower mold 55 is opened after the resin sealing, the ejector pins 52 push up the package portion 36 and the scrap 35 from the bottom of the cavity concave portion 51 to be released from the lower mold 55.
When the release film 9 is also stretched on the clamp surface of the lower mold 55 as shown by the broken line in FIG. 22, the ejector pins 52 and a known ejector pin driving mechanism (not shown) can be omitted.

  The cavity plate 11 is provided with a cavity hole 13 and a cull hole 58 (both are through holes). The cavity hole 13 defines the outer shape of the resin sealing portion (package portion) 36, and is formed on a hole wall surface having an inclination such that the outer diameter increases toward the substrate side. The cull hole 58 is formed as a tapered hole having an inclination such that the outer diameter decreases toward the upper die clamping surface. The taper angle of the cull hole 58 is adjusted so that the scrap 35 does not drop off from the cavity plate 11 during conveyance.

  In the present embodiment, after the cavity plate 11 is lifted down on the clamp surface of the lower die 55, the work 2 is carried in such that the semiconductor chip mounting surface faces downward. At this time, the semiconductor chip of the work 2 is aligned and overlapped so as to be accommodated in the cavity hole 13, and the cavity plate 11 and the work 2 are clamped by the upper mold 54 on which the release film 9 is stretched, and the resin sealing is performed. Is done. When a resin tablet is used as the resin material 33, the pot 27 needs to be loaded with the resin material 33 before the cavity plate 11 is lifted down to the clamp surface of the lower die 55.

  Further, after the resin is sealed, the work 2 transported to the degate section 22 is subjected to a gate break, for example, in a configuration reverse to that of the first and second embodiments. That is, the molded article holding device stands by above the cavity plate 11, and a collection box for collecting scraps is arranged below the cavity plate 11. The push-up rod is abutted against the lower surface of the package portion 36 exposed from the cavity hole 13 from the collection box side, and is released from the cavity plate 11. On the other hand, the push-down rod is abutted against the upper surface of the scrap 35 exposed in the cull hole 58 from the molded product holding device, and is released from the cavity plate 11. The scrap 35 falls down as it is and is collected in the collection box. The work 2 is sucked and held by the suction pad of the molded product holding device, and stored in the molded product storage section.

Even with the use of the above-described resin sealing device, the work 2 does not require special processing such as gold plating prior to resin sealing, and the production process can be simplified. Although the ejector pins 52 on the lower mold 55 side cannot be omitted, the upper mold 54 can be omitted using the release film 9, so that mold maintenance can be simplified, and the mold structure can be simplified by reducing the ejector pins 52. it can.
When the release film 9 is not used for the upper mold 54, an ejector pin may be provided similarly to the lower mold 55.

[Sixth embodiment]
Next, another example of the resin sealing device will be described with reference to FIG. Since the schematic configuration of the resin sealing device is the same as that of the first and second embodiments, the different points will be mainly described below. It is to be noted that the same members as those in the above-described embodiment are denoted by the same reference numerals, and the description is referred to.
In the present embodiment, a molding die 60 for transfer molding is used in the press section 5, and the upper die 61 is a fixed die and the lower die 62 is a movable die.

  The present embodiment is based on the fact that the work placement portion 65 of the mold 60 which receives the substrate 2a when clamping the work 2 is provided with a plate thickness adjusting mechanism for adjusting the change in the plate thickness of the work 2. Features. When the work 2 is clamped by the mold 60, an excessive clamping force is applied to the substrate 2a when the plate 2 is thick due to variation in the plate thickness of the substrate 2a, thereby causing scratches, deformation, and the like. Since it cannot contact with the clamp surface, the sealing resin may leak. When the thickness of the substrate 2a is small, a gap may be formed between the substrate 2a and the cavity plate 11, and the sealing resin may leak onto the substrate 2a. Thus, the thickness adjustment mechanism can absorb variations in the thickness of the substrate 2a.

  The lower mold 62 is provided with a pot 27, a plunger 28, and a not-shown uniform pressure unit which constitute a known transfer mechanism, and the lower mold chase block 63 supports a plate thickness adjusting block 64. The upper surface of the plate thickness adjustment block 64 forms the bottom of the work placement section 65 on which the work 2 is set. The suction hole 32 is formed in the plate thickness adjustment block 64. The suction hole 32 is sucked by an air suction mechanism (not shown) through a gap between the plate thickness adjustment block 64 and the lower die chase block 63, and the substrate 2 a of the work 2 is suction-held on the work mounting portion 65.

  The upper mold 61 is provided with a mold cull 29 and a mold runner gate 30. A release film 9 is stretched on the upper clamp surface including the resin path. The mold runner gate 30 is formed between the upper mold clamping surface covered with the release film 9 and the cavity plate 11. The resin sealing operation by the mold 60 is the same as in the first and second embodiments.

  Here, the plate thickness adjusting method of the plate thickness adjusting mechanism provided in the work mounting portion 65 will be exemplified and described. First, it is conceivable to replace the plate thickness adjusting block 64 according to the thickness of the work 2 to be resin-sealed. By exchanging the plate thickness adjustment block 64, the work 2 can absorb the fluctuation in thickness. Secondly, it is conceivable that an elastic body such as a coil spring is elastically provided between the plate thickness adjusting block 64 and the lower die chase block 63, and a variation in the thickness of the work 2 is absorbed by the elastic body. Third, it is conceivable that the thickness adjustment block 64 is moved up and down by a servomotor or the like to absorb the variation in the thickness of the work 2. Fourth, it is conceivable that the thickness adjustment block 64 itself is used as an elastic body to absorb the variation in the thickness of the work 2. Note that, even if the thickness adjustment block 64 is not made of an elastic body, the thickness variation of the work 2 can sometimes be absorbed by covering the thickness adjustment block 64 with the release film 9.

According to this embodiment, in addition to the same effects as those of the above-described first and second embodiments, the workpiece mounting portion 65 of the mold 60 that receives the substrate when clamping the workpiece 2 is attached to the substrate 2a. Since the thickness adjustment mechanism for adjusting the thickness variation is provided, the variation in the thickness of the work 2 is absorbed, and the reliability of the resin sealing operation is improved without damaging the substrate 2a or impairing the molding quality. Versatility can be improved.
In this embodiment, the case where the plate thickness adjusting mechanism is provided on the lower die 62 side is described. However, when the substrate receiving portion is the upper die 61, the plate thickness adjusting mechanism may be provided on the upper die 61 side. good. Although the mold 60 has been described as a transfer mold, the present invention is similarly applicable to a compression mold.

[Seventh embodiment]
Next, another example of the resin sealing device will be described with reference to FIG. Since the schematic configuration of the resin sealing device is the same as that of the first and second embodiments, the different points will be mainly described below. It is to be noted that the same members as those in the above-described embodiment are denoted by the same reference numerals, and the description is referred to.
In this embodiment, a molding die 70 for transfer molding is used for the press part 5, and the upper die 71 is a fixed die and the lower die 72 is a movable die.

  In the present embodiment, a circuit board of a BGA (Ball, Grid, Array) type is used as the work 2, and the configurations of a mold 70 and a cavity plate 11 for sealing the work 2 with resin will be described. In the BGA type substrate 2a, a semiconductor chip is mounted in an opening recess 2c, is electrically connected to a wiring pattern on the substrate 2a side, and external connection terminals are provided around a pad portion exposed from a protective film layer around the opening recess 2c. (Solder balls, metal bumps, etc.) 2b are joined. The cavity hole 13 of the cavity plate 11 is positioned and overlapped with the opening concave portion 2c, clamped by a mold 70 and sealed with resin. In addition, a terminal receiving concave portion 73 for avoiding interference with the external connection terminal 2b is formed on a lower surface portion where the cavity plate 11 is overlapped with the work 2. The external connection terminals 2b are not clamped in the terminal accommodating recess 73, but are accommodated in a gap with the concave surface portion.

  The lower mold 72 is provided with a pot 27, a plunger 28 and a uniform pressure unit (not shown) which constitute a known transfer mechanism, and a work mounting portion 72b on which the work 2 is set is formed on the lower mold clamping surface. I have.

  The upper mold 71 is provided with a mold cull 29 and a mold runner gate 30. The clamp surface of the upper die 71 facing the cavity hole 13 is formed in the protruding surface portion 71a. A release film 9 is stretched on the upper clamp surface including the resin path. The mold runner gate 30 is formed between the upper mold clamping surface covered with the release film 9 and the inner wall surfaces of the cavity plate 11 and the cavity hole 13. The resin sealing operation by the mold 70 is the same as in the first and second embodiments. The upper surface of the package portion 36 formed in the opening concave portion 2c is formed to have a height slightly protruding from the substrate 2a by adjusting the height of the protruding surface portion 71a formed on the clamp surface of the upper die 71. Or may be formed at the same height as the substrate 2a. Although the mold 70 has been described as a mold for transfer molding, a mold for compression molding can be similarly applied.

  According to this embodiment, in addition to the effects similar to those of the first and second embodiments, the semiconductor chip is mounted in the opening 2c of the substrate 2a, and the external connection terminal 2b is formed around the opening 2c. Resin sealing can also be performed on the BGA type work 2, that is, the work 2 in which the chip mounting portion and the external connection terminal forming portion are on the same side of the substrate 2a, without damaging the external connection terminals 2b.

[Eighth embodiment]
Next, another example of the resin sealing device will be described with reference to FIG. Since the schematic configuration of the resin sealing device is the same as that of the first and second embodiments, the different points will be mainly described below. It is to be noted that the same members as those in the above-described embodiment are denoted by the same reference numerals, and the description is referred to.
In this embodiment, as an example of the work 2, the case where the semiconductor chip 107 is wire-bonded and mounted on the substrate 2a in a map shape (FIG. 25 left half view), the case where the semiconductor chip 107 is flip-chip mounted on the substrate 2a in a map shape (The right half of FIG. 25). As the mold 6, a mold for transfer molding is used. The upper mold 7 is a fixed mold and the lower mold 8 is a movable mold. It should be noted that the map form as the arrangement form of the semiconductor chips 107 includes a matrix arrangement.

The cavity plate 11 has a cavity hole 13 perforated at one location per resin sealing area of the work 2, and the semiconductor chips 107 arranged in a map shape are collectively sealed. Note that the semiconductor chip 107 mounted on the flip chip needs to be underfill-molded before overmolding. In this case, for example, the movable die 108 is provided in the upper die 7 which is a fixed die so as to be movable up and down, and the movable die 108 is moved downward in the mold clamping state so as to contact the substrate 2 a through the cavity hole 13. Underfill molding is performed with both sides of the chip 107 covered. That is, the resin fed into the cavity enters the gap between the terminals (for example, between the solder balls) from the free side surface of the semiconductor chip 107 and is filled with directionality. Then, immediately before or after the end of the underfill molding, the movable mold 108 is moved upward and retracted to the upper mold 7, and overmolding is performed.
As described above, when the semiconductor chips 107 arranged in a map on the substrate 2a are collectively sealed with a resin, the semiconductor chips 107 can be formed in a map without the runner resin touching the substrate 2a.

[Ninth embodiment]
Next, another example of the resin sealing device will be described with reference to FIG. Since the schematic configuration of the resin sealing device is the same as that of the first and second embodiments, the different points will be mainly described below. It is to be noted that the same members as those in the above-described embodiment are denoted by the same reference numerals, and the description is referred to.
In the present embodiment, as an example of the work 2, a case where the semiconductor chip 107 is mounted by wire bonding in a matrix on the substrate 2a is illustrated. The mold 6 is a transfer mold, and the upper mold 7 is a fixed mold and the lower mold 8 is a movable mold.

  This embodiment illustrates a case where the semiconductor chips 107 arranged in a matrix on the substrate 2a are individually resin-sealed without being collectively resin-sealed. A cavity hole 13 is formed in the cavity plate 11 at a position corresponding to the semiconductor chip 107. Further, a side gate 110 is formed in the upper mold 7 so as to communicate with the mold runner 109 and connect to each cavity hole 13 (FIG. 26, left half view). When the plunger 28 is moved upward, the resin material 33 loaded in the pot 27 is individually filled into each cavity hole 13 from the side gate 110 through the pot hole 14 and the mold runner 109.

In the cavity plate 11, a cavity concave portion 112 and a vertical gate 113 communicating with the cavity concave portion 112 are formed at a portion facing each semiconductor chip 107. Each vertical gate 113 communicates with a mold runner 109 formed on the upper mold 7 (FIG. 26, right half view). When the plunger 28 is moved upward, the resin material 33 loaded in the pot 27 is filled in each cavity recess 112 from the vertical gate 113 through the pot hole 14 and the mold runner 109.
In this manner, the semiconductor chips 107 arranged in a matrix on the substrate 2a can be individually resin-sealed, and the substrate 2a can be molded in a matrix without the runner resin coming into contact with the substrate 2a. Resin portion can be reduced.

  In FIG. 27, when resin sealing is performed using the cavity plate 11, not only the same product but also different products may be sealed in one molding area. good. In other words, the work 2 can be resin-sealed even if there are a mixture of products that are formed in a map and are formed individually and are formed separately. In this case, resin sealing can be performed only by changing the pattern of the cavity hole or changing the shape of the mold runner gate.

As described above, various preferred embodiments of the present invention have been described. However, the resin sealing device is not limited to each of the above-described embodiments, and the cavity plate 11 is preferably a metal plate, but is not limited thereto. Any material can be used as long as it has heat resistance, abrasion resistance, flexibility, and does not easily adhere to the resin. Although the release film 9 covers one mold surface of the mold, it may cover the upper and lower clamp surfaces if possible.
Further, the case where the package portion 36 is formed on the substrate 2a on which the semiconductor chip is mounted has been described for the work W. However, as shown in FIG. Of course, many modifications can be made without departing from the spirit of the present invention, such as a case in which the ring-shaped resin sealing portion 116 is formed so as to surround the periphery of.

It is explanatory drawing of the resin sealing process which concerns on 1st Example. It is explanatory drawing of the resin sealing process which concerns on 1st Example. It is explanatory drawing of the resin sealing process which concerns on 1st Example. It is explanatory drawing of the resin sealing process which concerns on 1st Example. It is explanatory drawing of the resin sealing process which concerns on 1st Example. It is explanatory drawing of the resin sealing process which concerns on 1st Example. It is explanatory drawing of the resin sealing process which concerns on 1st Example. It is a front view of the resin sealing device concerning a 1st Example. FIG. 9 is a plan view of the lower mold side of the resin sealing device of FIG. 8. It is the top view and partial sectional drawing of a cavity plate. It is the top view and perspective view of a cavity plate. It is a top view showing the layout of the whole resin encapsulation device concerning a 2nd example. It is the front view which looked at the resin sealing device of FIG. 12 from the arrow F direction. It is explanatory drawing which looked at the resin sealing device of FIG. 12 from the arrow A direction. FIG. 14 is an explanatory diagram of the resin sealing device of FIG. 13 as viewed from the direction of arrow B. It is explanatory drawing of a cavity plate, a support frame, and a conveyance arm. It is explanatory drawing of the resin sealing process which concerns on 3rd Example. It is explanatory drawing of the resin sealing process which concerns on 3rd Example. It is explanatory drawing of the resin sealing process which concerns on 3rd Example. It is explanatory drawing of the mold of the resin sealing device concerning 4th Example. It is explanatory drawing of the mold of the resin sealing device concerning 4th Example. It is explanatory drawing of the mold of the resin sealing device concerning 5th Example. It is explanatory drawing of the mold of the resin sealing device concerning 6th Example. It is explanatory drawing of the mold of the resin sealing device concerning 7th Example. It is explanatory drawing of the mold of the resin sealing device concerning 8th Example. It is explanatory drawing of the mold of the resin sealing device concerning 9th Example. It is explanatory drawing which shows the other example of a cavity plate. It is sectional explanatory drawing which shows the other example of a workpiece | work.

Explanation of reference numerals

REFERENCE SIGNS LIST 1 work supply unit 2 work 2 a substrate 2 b external connection terminal 2 c opening concave portion 3 supply magazine 4, 99 loader 5 press unit 6, 40, 48, 59, 60, 70 mold 7, 41, 49, 54, 61, 71 Upper die 8, 42, 50, 55, 62, 72 Lower die 8b, 42b, 65, 72b Work placement part 9 Release film 10 Film transport mechanism 11 Cavity plate 12 Plate transport mechanism 13 Cavity hole 14 Pot hole 15a, 15b Sprocket Wheel 16a, 16b Support base 17 Feed hole 18, 85 Cleaner part 19, 85a, 85b Cleaning brush 20a Adhesive rubber roller 20b Cleaning belt 21 Air suction part 22 Degate part 23 Mold holding device 24 Digate pallet 25 Collection box 26 Shaped article storage part 27 Pot 28 Plunger 29 Mold cull 30 Mold runner gate 31, 32, 44, 45, 56, 57 Suction hole 33 Resin material 34 Sealing resin 35 Scrap 36 Package part 37 Push-down rod 38 Push-up rod 39 Suction pad 43 Overflow cavity 46 Overflow gate 47 Liquid resin 51, 112 Cavity recess 52 Ejector pin 53 Side gate 58 Cull hole 63 Lower die chase block 64 Plate thickness adjustment block 73 Terminal accommodation recess 81 Suction conveyance unit 83 Track surface 84 Preheating unit 84a Hot plate 85c Suction duct 85d Food cover 86 Support frame 87 Hollow hole 88 Transfer arm 89, 90 Pulley 91 Belt 92 Circular motor 93 Guide block 94 Guide rail 95, 100 Riff Device 96 Resin supply section 97 Substrate preheating section 98 Pusher 101 Positioning hole 102 Connecting section 103 Air cylinder 104 Lift arm 105 Connecting shaft 106 Hand 107 Semiconductor chip 108 Movable type 109 Mold runner 110 Side gate 113 Vertical gate 114 Semiconductor substrate 115 Chip mounting area 116 Resin sealing

Claims (16)

In a resin sealing device in which a work is carried into a press section and clamped by a mold die to perform resin sealing,
The work and the cavity plate that defines the outer shape and thickness of the resin sealing portion are punched, and the cavity plate that can be repeatedly loaded / unloaded are loaded into the press portion, and are aligned with the mold and clamped by resin. A resin sealing device characterized by being sealed.   The resin sealing device according to claim 1, wherein the cavity plate is formed in a metal belt shape circulating or reciprocating on a clamp surface of the mold.   The cavity plate is wound between feed rollers and pitch-fed, and the molded workpiece is removed from the mold by feeding the cavity plate away from the mold clamp surface opened after the resin sealing. The resin sealing device according to claim 1, wherein:   The resin sealing device according to claim 1, wherein the cavity plate is cleaned along with a transport operation on an upstream side in a transport direction to the press unit.   2. The resin sealing device according to claim 1, wherein the cavity plate is a metal plate that orbits on a track surface substantially parallel to a clamp surface of a mold die with respect to a press unit.   The resin sealing device according to claim 1, wherein the cavity plate is preheated on an upstream side in a conveying direction to a press unit.   2. The resin sealing device according to claim 1, wherein the cavity plate is wrapped around a preheat portion, a press portion, a degate portion, and a cleaner portion in synchronization with each process to perform resin sealing.   2. The molded workpiece is transported from the press section to the degate section on the downstream side in the transport direction, and the resin sealing section and the unnecessary resin section are separated and collected on both sides of the cavity plate. The resin sealing device as described in the above.   In the press section, a pot, a plunger and a work mounting section are formed in one mold, a mold cull and a mold runner gate are formed in the other mold, and a mold clamping surface including a resin path has a release film. 2. The resin sealing apparatus according to claim 1, further comprising a transfer mold covered by the mold.   The press unit includes a mold for transfer molding in which a mold clamping surface including a resin path is covered with a release film, and a mold runner gate is provided between the mold clamping surface covered with the release film and the cavity plate. The resin sealing device according to claim 1, wherein the resin sealing device is formed therebetween.   The press unit includes a mold for transfer molding in which a mold clamping surface including a resin path is covered with a release film, and a concave groove is formed on an end surface of a cavity hole provided in the cavity plate. The resin sealing device according to claim 1, wherein:   The press section is a compression mold mold in which a work mounting section is formed in one mold, and an overflow cavity that can communicate with the cavity hole of the cavity plate is formed in the other mold and covered with a release film. The resin sealing device according to claim 1, further comprising:   The press section is a compression mold mold in which a work mounting section is formed in one mold, and an overflow cavity that can communicate with the cavity hole of the cavity plate is formed in the other mold and covered with a release film. 2. The resin sealing device according to claim 1, wherein the sealing resin supplied to the cavity hole of the cavity plate is absorbed into the overflow cavity covered with the release film and compression molded.   The press section is a compression mold mold in which a work mounting section is formed in one mold, and an overflow cavity that can communicate with the cavity hole of the cavity plate is formed in the other mold and covered with a release film. 2. The resin sealing device according to claim 1, wherein a concave groove communicating with the overflow cavity from the cavity hole is formed in the cavity plate.   2. The work placement portion of the mold die that receives a substrate when clamping the work, the work placement portion is provided with a thickness adjustment mechanism that adjusts a variation in the thickness of the substrate. 3. Resin sealing device.   In the press section, a cavity recess is formed in place of a cavity plate having a cavity hole, which defines the outer shape and thickness of the resin sealing section, and a vertical gate communicating with the cavity recess is formed in the cavity. The resin sealing device according to claim 1, wherein the plate is carried in.

Images