JP2004170360A - Stack-type probe and contact - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe, which can surely and easily establish Kelvin connection on an electrode surface, even if an object to be measured becomes minute, and which can accurately and easily perform four-terminal measurement, even if it is on-board. <P>SOLUTION: A contactor is formed of stacked thin plates having a spring properties, in which abutment parts on the object to be measured are inclined so that the inclination parts cross, and it is constituted so that the thin plate inclination parts to the crossing point are deformed independently and elastically, when it abuts on the object to be measured so as to be capable of elastically abutting on the object to be measured. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a probe used for electrical inspection of an object to be inspected such as a semiconductor wafer or an electronic component. More specifically, the present invention relates to a laminated probe capable of easily inspecting a small chip component with four terminals, and a probe used for the probe. Regarding contacts.
[0002]
[Prior art]
Conventionally, a tweezer-type probe 1 as shown in FIG. 1 has been known as a probe for measuring an electrical characteristic value of a chip component. In this method, electric characteristics are measured at four terminals ((1) to (4)) with both sides of the tip of the probe having electrodes of the chip component 2 interposed therebetween. Incidentally, a two-terminal probe was also known.
[0003]
Therefore, chip components are minimized to 2.0 × 1.0 mm, 1.6 × 0.8 mm, 1.2 × 0.6 mm, 1.0 × 0.5 mm, 0.6 × 0.3 mm. However, in the case of such an extremely small chip part, there has been a problem that the conventional tweezers type probe is extremely difficult to measure or cannot measure. This is because stable contact cannot be maintained and troubles such as flipping of chip components have occurred. In addition, since it is sandwiched from both sides, it is difficult to measure in a narrow space, and therefore, it is impossible or extremely difficult to measure on-board (the mounting state of chip components).
For this reason, in the case of a microchip component, a two-terminal measurement in which a wire probe is applied from both sides is conventionally performed. However, this method has a problem that only two-terminal measurement accuracy can be obtained. Although four-wire measurement is performed by attaching two wires at each side from both sides, the operation becomes extremely complicated, and thus practically cannot be adopted at all.
[0004]
[Problems to be solved by the invention]
The present invention has been made in view of such problems, and even if the device under test is minimized, Kelvin connection can be reliably and easily performed on the electrode surface thereof, and even if the device is on-board, It is an object of the present invention to provide a probe capable of easily and accurately performing four-terminal measurement.
[0005]
[Means for Solving the Problems]
The invention according to claim 1 of the present invention according to the above object is configured by laminating a contact formed of a thin plate having a spring property with an inclined tip so that the inclined portions intersect with each other. When the thin plate inclined portion hits the object to be measured, the thin plate is elastically deformed independently and can elastically contact the object to be measured.
[0006]
In essence, the present invention is to reduce the thickness of a thin plate so that a micro chip component can be inspected without hindrance, and to configure the thin plate so as to elastically move in all directions, thereby providing a contact to a crossing portion of the thin plate. The gist of the present invention is to ensure that the line can contact the chip component, and to enable the line to be pressed from above to reduce the contact space, thereby enabling on-board four-terminal measurement.
[0007]
It is preferable that a plurality of contacts are laminated via an insulator, and that the contacts formed so as to intersect are formed as one set, and one or more sets of contacts are laminated.
[0008]
The contact is formed by integrally connecting a bent band-shaped object to a head plate body having a slanted tip, and the band-shaped object is elastically deformed, so that the tip of the contact head can move in contact with the object to be measured. It is preferable to configure as follows (claim 3).
[0009]
The thickness of the thin plate is 2 mm or less, preferably 0.02 mm to 0.5 mm.
[0010]
The thin plate is preferably made of a conductive material having a spring property, for example, copper, copper alloy, tungsten or a quenched steel plate. When formed of copper or a copper alloy, the resistance R of the contact itself can be minimized. In addition, a material having spring properties (which may not have conductivity) may be coated with a conductive powdery substance.
[0011]
It is particularly preferable that two sets of contacts are laminated to form a four-terminal Kelvin probe contact (claim 6).
[0012]
A three-terminal probe can also be provided by disposing a thin plate contact whose tip is inclined at an angle at the intersection of a set of contacts (claim 7).
[0013]
The contact of the present invention can measure signals such as current and voltage, and can flow and apply signals.However, in order to use a Kelvin probe, one contact is a current applying electrode and the other is a current applying electrode. It is preferable that the contact is a voltage detection electrode, and the two contacts are one set, and one or more sets are provided. Even when a Kelvin probe is used, a thin plate serving as a ground or a guard may be provided in addition to the electrodes.
[0014]
The contact of the present invention is formed by integrally connecting a bent band-shaped object to a head plate body having an inclined tip, and the band-shaped object is elastically deformed, so that the contact head comes into contact with the object to be measured. It is configured to be movable (claim 8).
[0015]
The band-shaped object has a bent portion protruding on both sides in the connection direction, so that the head can elastically move at any angle with the object to be measured, and can return to the original position when the pressure is released. Preferably, it is constituted (claim 9).
[0016]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings.
[0017]
FIG. 2 shows an embodiment of the present invention, in which probes P1, P2, P3 and P4 formed of ultra-thin plates having inclined lower ends are arranged so that P1 and P2 and P3 and P4 intersect in an X-shape. 1 shows an example in which the layers are laminated via insulators 3a, 3b and 3c, respectively. One of P1 and P2 and one of P3 and P4 are voltage application contacts, and the other is a voltage detection contact.
[0018]
When the contacts P1 and P2 hit the chip component 2 which is an object to be measured, they can be independently deformed elastically in all directions of vertical, horizontal and oblique directions as indicated by arrows (a to e) in FIG. It consists of That is, the probes P1, P2, P3, and P4 have a contact function on the entire circumference of the probe, and are omnidirectionally movable.
[0019]
The current application contact and the voltage detection contact are respectively connected to lead wires, and are formed so as to be Kelvin-connected for applying a current and detecting a voltage.
[0020]
Since the two contacts 1 and 2 can move independently, the insulators 3a, 3b and 3c shown in FIG. 3 are not fixed, or are fixed to one or both of them by bonding or the like.
As the insulator, an insulator film such as a fluororesin (Teflon (registered trademark)), another polymer compound, or diamond compound may be formed on one or both contacts. When the insulator film is formed in this manner, two terminals (two contacts) can be arranged very close.
[0021]
FIG. 4 shows an example of the arrangement of the contacts P1 to P4. The contacts P1, P2, P3, and P4 are stacked in this order, but P1 to P4 in the figure indicate the positions where the contacts hit the object to be measured. Things. 4A, (A) is laminated so that P1 and P2 intersect with P3 and P4, (B) is laminated so that P1 and P2 and P3 and P4 intersect, and (C) is Although P1 and P2 and P3 and P4 are stacked so as to cross each other, it can be seen that P1 and P4 and P2 and P3 are located in the same direction. As described above, the crossing of the contacts in the present invention means that adjacent contacts may cross or non-adjacent contacts may cross.
[0022]
FIG. 5 shows an embodiment of the contactor of the present invention, in which a plate body 5 having a tip formed on an oblique side 4 and a rectangular plate body 6 are integrally connected by a bent spring-like material 7. An example is shown below. The bent strip 7 has rectangular protrusions (projected bent portions) 8, 8 'formed on both sides in the connection direction. When formed in this manner, the belt-shaped object 7 can be easily elastically deformed and moved regardless of the angle at which the plate body 5 hits the object to be measured. The shapes of the protrusions 8 and 8 'are not particularly limited, but the protrusions 8 and 8' are preferably symmetric or substantially symmetric.
[0023]
FIG. 6 shows another embodiment of the contact according to the present invention, in which a band-like material 7 having a spring property is formed in a sine curve (smooth S-shape). As shown in FIG. 7, the band 7 having spring properties may be formed so that the number and the size of the projecting portions 8, 8 ′ on both sides of the band 7 are different. However, in this case, it is preferable that the areas of the protruding portions 8 and 8 'on both sides are substantially the same.
[0024]
The shape of the head (contact) 5 may be any shape as long as it has a contact line 4 that is inclined (meaning including a hypotenuse and a step) and contacts the electrode at the intersection of the hypotenuse. No problem. For example, the shape shown in FIG.
[0025]
8A, 8B, and 8C are examples in which the angle of the hypotenuse is changed, and in the present invention, the angle of the hypotenuse is not particularly limited. The hypotenuse may be a convex R surface (D) or a concave R surface (E). In addition, as shown in FIGS. 8A to 8C, the oblique side may be a step. The number of steps is not particularly limited, and the shape of the lowermost end of the cut portion may be the same shape as the above-mentioned a to o, or may be flat. Further, the shape of the cut portion may be a right angle (K), an obtuse angle (U), or an obtuse R-shaped surface.
[0026]
Alternatively, as shown in FIG. 8 (c), the tip may have a mountain shape inclined toward the center. The probe shown in FIG. 8 (c) is particularly suitable for being disposed at the intersection of the contacts to form a three-terminal probe.
[0027]
The probe contact of the present invention is, as shown in FIGS. 2 to 4, a typical example of a four-terminal probe contact in which four sheets are stacked, and is effective for measuring chip components. Not something. It can also be used to measure various electronic components other than chip components.
[0028]
FIG. 9 shows an example in which a two-terminal probe is used. A probe P1 shown in FIG. 8A and a probe P2 symmetrical to FIG. 8A are laminated via an insulating material so as to cross each other. An example is shown below. By using this probe, two-terminal chip components that are commonly used can be easily measured at two terminals.
[0029]
FIG. 10 shows an example in which a three-terminal probe is used. The probe P1 shown in FIG. 8A and the probe P2 symmetrical to FIG. 8A are arranged such that the tip of FIG. An example is shown in which the layers are stacked via an angled probe P3 inclined toward the front. The order in which the probes P1 to P3 are stacked is not particularly limited, and an insulating material is interposed between the probes.
[0030]
By using this probe, the three-terminal chip device 2a having three electrodes (1) to (3) can be measured without any trouble.
[0031]
According to the present invention, a probe having two to any number of poles can be configured by arranging a combination of contacts corresponding to the device electrodes to be measured.
[0032]
FIG. 11 shows an example of a multi-pole (6-pole) probe for measuring a multi-pole (6-terminal) chip device. The probe P × 3 (P3, P2, P1) shown in FIG. An example is shown in which the symmetrical probes P × 3 (P4, P5, P6) are alternately stacked via an insulating material.
[0033]
By selecting the thickness of the contact thin plate and the thickness of the insulating material according to the dimensions between the electrodes (1, 2, 3) and (4, 5, 6), various electronic component measuring probes can be obtained. It can be.
[0034]
As described above, the probe of the present invention, in a state in which the contacts are stacked, is preferably sandwiched between the plates so that the tips of the contacts protrude and can move independently, and are fitted and fixed to the uniaxial probe holder. And use it.
[0035]
According to the present invention, it is possible to easily and reliably apply a single probe fixed to a holder lightly from above the chip component to the "micro chip component", which has been miniaturized year by year. To four terminals (not particularly limited as long as there are two terminals or more). In measurement, only a contact space corresponding to the area of a fine chip component is required.
[0036]
As shown in FIG. 12A, in order to inspect the chip components 2 on the printed circuit board 9 with the conventional tweezers type probe 1, since a portion where narrow chip components are gathered has a large probe terminal block, Measurement was impossible or extremely difficult. On the other hand, if the probe according to the present invention is used, as shown in FIG.
[0037]
In the probe of the present invention, when the probe head 5 is pressed against the DUT 2, each contact moves independently and vertically and horizontally as shown by arrows a to e in FIG. Therefore, any position of the contact line 4 on the oblique side reliably contacts the chip component 2 electrode, and a highly reliable inspection result can be obtained.
[0038]
In addition, since the thickness of the contact can be made extremely thin, even small chip components come into contact with the chip component electrodes by sliding while slightly rubbing, so that four points (four poles) are surely contacted. Measurement and inspection can be performed without trouble even for a micro chip component that cannot be obtained.
[0039]
Since the contact of the present invention has a spring property, the contact can be contacted not only when it is vertically pressed against the object to be measured but also in a wide range of angles. This is because one contact moves upward against the force of the spring until the other contact comes into contact.
[0040]
Further, since the contact of the present invention can be formed in a simple plate shape from a material that can easily obtain a constant plate thickness, the outer shape accuracy required by press working or the like can be obtained with high uniformity.
[0041]
【The invention's effect】
As described above, according to the present invention, by reducing the thickness of a thin plate, it is possible to inspect a micro chip component which could not be easily measured conventionally without any trouble, and to elastically move the thin plate in all directions. With such a configuration, the contact line up to the crossing portion of the thin plate can surely come into contact with the chip component, and can be pressed from above to reduce the contact space, which has not been conventionally easily inspected. It has many tremendous advantages, such as enabling on-board four-terminal measurement.
[0042]
[Brief description of the drawings]
FIG. 1 is a perspective view of a conventional tweezers type probe.
FIG. 2 is a front view showing an embodiment of the four-terminal probe of the present invention.
FIG. 3 is a side view of FIG. 2;
FIG. 4 is an explanatory diagram showing an example of lamination in a state where the contact of the present invention is in contact with a chip component.
FIG. 5 is a side view showing an embodiment of the contact of the present invention.
FIG. 6 is a side view showing another embodiment of the contact of the present invention.
FIG. 7 is a side view showing another embodiment of the contact of the present invention.
FIG. 8 is a side view showing an example of a head shape of a contact according to the present invention.
FIG. 9 is a front view showing an embodiment of the two-terminal probe of the present invention.
FIG. 10 is a front view showing an embodiment of the three-terminal probe of the present invention.
FIG. 11 is a front view showing an embodiment of the six-terminal probe of the present invention.
FIG. 12A is a front view showing a state where an on-board chip component is inspected by a conventional tweezers type probe.
FIG. 3B is a front view of a state in which an on-board chip component is inspected by the probe of the present invention.
[Explanation of symbols]
2, 2a, 2b Chip components 3a, 3b, 3c Insulator 4 Oblique side (contact line)
5 Plates 8, 8 'with tips formed on oblique sides Protrusions 9 of belt-like material 9 Printed circuit board

Claims (9)

A contact formed with a thin plate having a spring property in which an abutting portion to an object to be measured is formed by stacking so that the inclined portions intersect, and the thin plate inclined portion up to a crossing portion hits the object to be measured. A laminated probe characterized by being configured to be elastically deformed independently and to be able to elastically contact an object to be measured. 2. The probe according to claim 1, wherein a plurality of said contacts are laminated via an insulator, and one or a plurality of said contacts formed so as to cross each other are laminated. The contact is formed by integrally connecting a bent band-shaped object to a head plate body having an inclined front end, and the band-shaped object is elastically deformed so that the contact head end comes into contact with an object to be measured and moves. The probe according to claim 1 or 2, wherein the probe is configured so as to be able to perform the operation. The probe according to claim 1, wherein the thickness of the thin plate is 0.02 mm to 0.5 mm. The probe according to any one of claims 1 to 4, wherein the thin plate is formed of steel, a copper alloy, tungsten, or a quenched steel plate. The probe according to claim 1, wherein two sets of the contacts are stacked to form a four-terminal Kelvin probe contact. The probe according to any one of claims 1 to 5, wherein a thin plate contact whose tip is inclined in a mountain shape is disposed at a crossing portion of the pair of contacts. A bent band-shaped object is integrally connected to a head plate body having a slanted end, and the band-shaped object is elastically deformed so that the contact head end can move in contact with the object to be measured. A contact, characterized in that: The belt-shaped object has a bent portion protruding on both sides in the connection direction, so that the head can elastically move at any angle with the object to be measured and return to the original position when the pressure is released. The contact according to claim 8, wherein the contact is configured.

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