JP2004146859A - Method of manufacturing resistor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method by which the conventional step of exchanging masks in accordance with the dimensional rank of a singulated substrate can be eliminated, because the dimensional classification of the singulated substrates becomes unnecessary, and, at the same time, an inexpensive fine resistor can be manufactured easily. <P>SOLUTION: This method includes a step of forming a plurality of slit-like first split sections 28 in a sheet-like substrate 21 for dividing the substrate 21 into a plurality of strip-like substrates by separating a plurality of pairs of upper-surface electrode layers 22, and a step of forming side-face electrode layers 29 on the rear surface of the insulating substrate 21 in which the first split sections 28 are formed and the internal surfaces of the first split sections 28 by sputtering. This method also includes a step of patterning the side-face electrode layers 29 by peeling a resist layer 27 formed on the rear surface of the insulating substrate 21 from the substrate 21. <P>COPYRIGHT: (C)2004,JPO

Description

The present invention relates to a method of manufacturing a resistor, and more particularly to a method of manufacturing a fine resistor.

Hereinafter, a conventional resistor and a method of manufacturing the same will be described with reference to the drawings.

FIG. 12 is a sectional view of a conventional resistor.

に お い て In FIG. 12, reference numeral 1 denotes an insulating individual substrate made of porcelain such as alumina. Reference numeral 2 denotes a pair of first upper electrode layers provided on both right and left ends of the upper surface of the individual substrate 1. Reference numeral 3 denotes a resistance layer provided on the upper surface of the individual substrate 1 so as to partially overlap the pair of first upper electrode layers 2. Reference numeral 4 denotes a first protective layer provided so as to cover only the entire resistive layer 3. Reference numeral 5 denotes a trimming groove provided in the resistance layer 3 and the first protection layer 4 for correcting the resistance value. Reference numeral 6 denotes a second protective layer provided only on the upper surface of the first protective layer 4. Reference numeral 7 denotes a pair of second upper electrode layers provided on the upper surfaces of the pair of first upper electrode layers 2 so as to extend to the full width of the individual substrate 1. Reference numeral 8 denotes a pair of side electrode layers provided on both side surfaces of the individual substrate 1. Reference numerals 9 and 10 denote a pair of nickel plating layers and a pair of solder plating layers provided on the surfaces of the pair of second upper electrode layers 7 and the pair of side electrode layers 8, respectively. In this case, the solder plating layer 10 is provided lower than the second protective layer 6.

Next, a method of manufacturing the conventional resistor having the above-described structure will be described with reference to the drawings.

FIGS. 13A to 13F are process diagrams showing a conventional method for manufacturing a resistor.

First, as shown in FIG. 13 (a), a pair of first upper electrode layers 2 is formed by coating on the left and right ends of the upper surface of the individual substrate 1 having insulating properties.

Next, as shown in FIG. 13B, a resistive layer 3 is applied on the upper surface of the individual substrate 1 so as to partially overlap the pair of first upper electrode layers 2.

Next, as shown in FIG. 13C, after forming the first protective layer 4 by coating so as to cover only the whole of the resistance layer 3, the total resistance value of the resistance layer 3 is within a predetermined resistance value range. A trimming groove 5 is formed in the resistance layer 3 and the first protection layer 4 by a laser or the like so as to enter the inside.

Next, as shown in FIG. 13D, the second protective layer 6 is formed by coating only on the upper surface of the first protective layer 4.

Next, as shown in FIG. 13E, the pair of second upper electrode layers 7 are located on the upper surfaces of the pair of first upper electrode layers 2 and extend to the full width of the individual substrate 1. To form a coating.

Next, as shown in FIG. 13F, a pair of first and second upper electrode layers 2 and 7 are provided on the side surfaces of the pair of first upper electrode layers 2 and the left and right ends of the individual substrate 1. A pair of side electrode layers 8 are formed by coating so as to be electrically connected.

Finally, after nickel plating is performed on the surfaces of the pair of second upper electrode layers 7 and the pair of side electrode layers 8, solder plating is performed to form a pair of nickel plating layers 9 and a pair of solder plating layers 10. To manufacture a conventional resistor.

Also, the above-mentioned resistors have been extremely miniaturized, and in recent years, very small resistors having a length of 0.6 mm × a width of 0.3 mm × a thickness of 0.25 mm have been manufactured.

As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP-A-4-102302

A description will be given of a problem when a very small resistor of 0.6 mm long × 0.3 mm wide × 0.25 mm thick is manufactured by the above-described conventional configuration and manufacturing method.

に お け る A conventional sheet-shaped insulating substrate made of porcelain such as alumina is manufactured by forming a substrate dividing groove in advance before firing the sheet-shaped insulating substrate, and firing the insulating substrate. For this reason, the substrate dividing grooves formed in advance on the sheet-shaped insulating substrate may have dimensional variations due to subtle variations in the composition of the sheet-shaped insulating substrate or subtle variations in the temperature during firing of the sheet-shaped insulating substrate. (This dimensional variation reaches about 0.5 mm for a sheet-shaped insulating substrate of about 100 mm × 100 mm).

When manufacturing a very fine resistor using a sheet-shaped insulating substrate having such a dimensional variation, the dimensions of the individual substrate are set to very fine dimensional ranks in each of the vertical and horizontal directions. It is necessary to categorize and arrange screen printing masks such as the upper electrode layer 2, the resistance layer 3, and the protective layer 4 corresponding to the respective dimensional ranks, and it is necessary to replace the masks according to the dimensional ranks of the individual substrates. However, as a result, there is a problem that the process becomes very complicated (when the dimensional rank is classified in 0.05 mm increments, the total of 25 ranks in the vertical direction and the horizontal direction is totaled vertically and horizontally). Dimension classification of about 600 ranks or more is required.)

The present invention solves the above-mentioned conventional problems, and eliminates the need for the step of replacing the mask according to the dimensional rank of the singular substrate, which eliminates the need for dimensional classification of the singular substrate. It is an object of the present invention to provide a method of manufacturing a resistor which can be manufactured at a low cost and easily obtain a fine resistor.

た め In order to achieve the above object, the present invention has the following configuration.

The invention according to claim 1 of the present invention includes a step of forming a plurality of pairs of upper electrode layers and a plurality of resistance layers on the upper surface of a sheet-shaped insulating substrate so that both are electrically connected to each other; A step of performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the resistance layer, a step of forming a protective layer so as to cover at least the plurality of resistance layers, and a back surface of the sheet-shaped insulating substrate Forming a resist layer on the substrate, and forming a plurality of slit-shaped first divided portions for separating the plurality of pairs of upper electrode layers and dividing into a plurality of strip-shaped substrates on the sheet-shaped insulating substrate. Forming a side electrode layer by a sputtering method on the back surface of the sheet-like insulating substrate having the plurality of slit-shaped first divided portions formed thereon and on the inner surface of the plurality of slit-shaped first divided portions. And the Regis A step of patterning a plurality of pairs of side electrode layers by peeling off layers; a step of forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers; and a plurality of strips in the sheet-shaped insulating substrate. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions so that the plurality of resistance layers are individually separated from each other and divided into individual substrates on the substrate According to this manufacturing method, a slit-shaped first dividing portion for separating a plurality of pairs of upper electrode layers and dividing the same into a plurality of strip-shaped substrates is provided on the sheet-shaped insulating substrate. Forming a plurality of slit-shaped first divided portions, and forming a side surface electrode layer on the back surface of the sheet-shaped insulating substrate having the plurality of formed slit-shaped first divided portions and inner surfaces of the plurality of slit-shaped first divided portions by a sputtering method. Forming step and the sheet-like insulation Since the method includes a step of patterning a plurality of pairs of side electrode layers by peeling the resist layer formed on the back surface of the plate, this side electrode layer is not formed for each of a plurality of strip-shaped substrates as in the related art. This has the effect of being able to be formed collectively in the state of a sheet-shaped insulating substrate.

The invention according to claim 2 of the present invention includes a step of forming a plurality of pairs of upper electrode layers or a plurality of resistance layers on an upper surface of a sheet-shaped insulating substrate, and forming the plurality of pairs of upper electrode layers or the plurality of resistance layers. Forming a plurality of slit-shaped first divided portions for separating the plurality of pairs of upper electrode layers or the plurality of resistance layers into a plurality of strip-shaped substrates on the formed sheet-shaped insulating substrate; Forming a plurality of resistance layers or a plurality of pairs of upper electrode layers such that a part thereof overlaps the plurality of pairs of upper electrode layers or the plurality of resistance layers; and a step of forming the plurality of pairs of upper electrode layers in the plurality of resistance layers. Performing trimming to adjust the resistance value, forming a protective layer so as to cover at least the plurality of resistance layers, forming a resist layer on the back surface of the sheet-shaped insulating substrate, and forming the slit. First Forming a side electrode layer by a sputtering method on the back surface of the sheet-shaped insulating substrate in which a plurality of split portions are formed and on the inner surface of the plurality of slit-shaped first divided portions; Patterning a pair of side electrode layers, and forming the slit-shaped substrate on a plurality of strip-shaped substrates in the sheet-shaped insulating substrate such that the plurality of resistance layers are individually separated and divided into individual substrates. Forming a plurality of second divisions in a direction orthogonal to the first divisions. According to this manufacturing method, a plurality of pairs of upper surface electrode layers or a plurality of resistance layers are formed. Forming a plurality of slit-shaped first divided portions for separating a plurality of pairs of upper electrode layers into a plurality of strip-shaped substrates on a sheet-shaped insulating substrate; and forming the slit-shaped first divided portions. With multiple parts formed Forming side electrode layers on the back surface of the insulating substrate in the shape of a substrate and the inner surfaces of the plurality of slit-shaped first divided portions by a sputtering method, and removing the resist layer formed on the back surface of the insulating substrate in the form of a sheet. Patterning a plurality of pairs of side-surface electrode layers, so that the side-surface electrode layers are not formed for each of a plurality of strip-shaped substrates as in the related art, but are collectively formed in the state of a sheet-shaped insulating substrate. It has the effect of being able to form.

According to a third aspect of the present invention, there is provided a method for forming a plurality of pairs of upper electrode layers and a plurality of resistance layers on an upper surface of a sheet-shaped insulating substrate so that both are electrically connected to each other; A plurality of slit-shaped first divisions for separating the plurality of pairs of upper electrode layers and dividing the plurality of pairs of upper electrode layers into a plurality of strip-shaped substrates on a sheet-shaped insulating substrate formed with a plurality of upper electrode layers and a plurality of resistance layers. Forming, trimming to adjust the resistance between the plurality of pairs of upper electrode layers in the plurality of resistance layers, and forming a protective layer so as to cover at least the plurality of resistance layers, Forming a resist layer on the back surface of the sheet-shaped insulating substrate; and forming the plurality of slit-shaped first divided portions on the back surface of the sheet-shaped insulating substrate and a plurality of slit-shaped first divisions. Spattering on the inner surface of the part Forming a side electrode layer, patterning a plurality of pairs of side electrode layers by peeling off the resist layer, and forming the plurality of resistance layers on a plurality of strip-shaped substrates in the sheet-shaped insulating substrate. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions so as to be separated into individual pieces and divided into individual substrates. According to the first aspect, a plurality of pairs of upper surface electrode layers and a plurality of resistance layers are formed on a sheet-shaped insulating substrate, and a plurality of slit-shaped first substrates for separating the plurality of pairs of upper surface electrode layers and dividing into a plurality of strip-shaped substrates. Forming a plurality of divided portions, and forming the plurality of slit-shaped first divided portions on the back surface of the sheet-shaped insulating substrate and the inner surface of the plurality of slit-shaped first divided portions by a sputtering method. Nickel or nickel Forming a side electrode layer of an alloy, and a step of patterning a plurality of pairs of side electrode layers by peeling off a resist layer formed on the back surface of the sheet-shaped insulating substrate. Has an effect that it can be formed collectively in the state of a sheet-shaped insulating substrate, instead of being formed for each of a plurality of strip-shaped substrates as in the related art.

According to a fourth aspect of the present invention, a plurality of pairs of upper surface electrode layers and a plurality of resistance layers are formed on the upper surface of a sheet-shaped insulating substrate so that both are electrically connected to each other, and the plurality of resistance layers are formed. Performing trimming to adjust the resistance value between the plurality of pairs of upper electrode layers in a layer; and separating the plurality of pairs of upper electrode layers into a plurality of strips on the trimmed sheet-shaped insulating substrate. Forming a plurality of slit-shaped first divided portions for dividing the substrate, forming a protective layer so as to cover at least the plurality of resistance layers, and forming a resist layer on a back surface of the sheet-shaped insulating substrate Forming a side electrode layer by sputtering on the back surface of the sheet-like insulating substrate in which the plurality of slit-shaped first divided portions are formed and on the inner surface of the plurality of slit-shaped first divided portions. Form A step of patterning a plurality of pairs of side electrode layers by peeling the resist layer; and forming a plurality of strip-shaped substrates in the sheet-shaped insulating substrate, wherein the plurality of resistance layers are individually separated from each other. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions so as to be divided into a substrate having a plurality of resistors. On a sheet-shaped insulating substrate that has been trimmed to adjust the resistance value between a plurality of pairs of upper electrode layers in the layer, a slit-shaped separator for separating a plurality of pairs of upper electrode layers and dividing the plurality of strip electrode substrates into a plurality of strip-shaped substrates. A step of forming a plurality of first divided portions; and sputtering on the back surface of the sheet-shaped insulating substrate in a state where the plurality of slit-shaped first divided portions are formed and on the inner surface of the plurality of slit-shaped first divided portions. Side electrode layer by construction method And a step of patterning a plurality of pairs of side electrode layers by peeling a resist layer formed on the back surface of the sheet-shaped insulating substrate. It is possible to form the insulating substrate in the form of a sheet without forming it on each strip-shaped substrate.

As described above, the resistor manufacturing method of the present invention can eliminate the step of replacing the mask according to the dimensional rank of the individual substrate as in the related art, and is inexpensive and has a fine resistor. Can be provided.

(Embodiment 1)
Hereinafter, the first to fourth aspects of the present invention will be described with reference to the first embodiment.

FIG. 1 is a sectional view of the resistor according to the first embodiment of the present invention.

In FIG. 1, reference numeral 11 denotes a sheet-like insulating substrate made of fired 96% -purity alumina divided into a slit-shaped first divided portion and a second divided portion orthogonal to the first divided portion. In this way, the substrate is singulated. Reference numeral 12 denotes a pair of upper electrode layers mainly formed of silver and formed on the upper surface of the individual substrate 11. Reference numeral 13 denotes a ruthenium oxide-based resistance layer formed on the upper surface of the individual substrate 11 so as to partially overlap the pair of upper electrode layers 12. Reference numeral 14 denotes a first protective layer formed of a pre-coated glass layer formed on the upper surface of the resistance layer 13. Reference numeral 15 denotes a trimming groove provided for correcting the resistance value of the resistance layer 13 between the pair of upper electrode layers 12. Reference numeral 16 denotes a second protective layer mainly composed of resin and formed so as to cover the first protective layer 14 made of a precoated glass layer. Reference numeral 17 denotes a pair of side electrode layers made of nickel formed so as to overlap a part of the pair of upper electrode layers 12 and to cover both side surfaces of the individual substrate 11 and both end portions of the back surface. Reference numeral 18 denotes a solder layer made of tin formed so as to cover a part of the pair of side electrode layers 17 and a part of the pair of upper electrode layers 12.

Next, a method of manufacturing the resistor configured as described above according to the first embodiment of the present invention will be described with reference to the drawings.

FIG. 2 is a top view showing a state in which an unnecessary region is formed on the entire peripheral edge of a sheet-like insulating substrate used in manufacturing the resistor according to the first embodiment of the present invention, and FIGS. (E), FIGS. 4 (a) to (e), FIGS. 5 (a) to (d), FIGS. 6 (a) to (d), FIGS. 7 (a) to (c), and FIGS. FIG. 3C is a process drawing illustrating the method for manufacturing the resistor in the first embodiment of the present invention.

First, as shown in FIG. 2, FIG. 3 (a), and FIG. 4 (a), a 0.2 mm thick sheet-like insulating substrate 21 made of fired 96% purity alumina is prepared. In this case, as shown in FIG. 2, the sheet-shaped insulating substrate 21 has an unnecessary area portion 21a which does not eventually become a product at all peripheral edges. The unnecessary area 21a is formed in a substantially rectangular shape.

Next, as shown in FIGS. 2, 3B and 4B, a plurality of pairs of upper electrode layers 22 mainly composed of silver are formed on the upper surface of the sheet-like insulating substrate 21 by screen printing. By baking with a baking profile with a peak temperature of 850 ° C., the upper electrode layer 22 was made a stable film.

Next, as shown in FIGS. 2, 3C, and 4C, a plurality of ruthenium oxide-based resistance layers 23 are formed by a screen printing method so as to straddle a plurality of pairs of upper electrode layers 22. By baking with a baking profile with a peak temperature of 850 ° C., the resistance layer 23 was made a stable film.

Next, as shown in FIGS. 3D and 4D, a first protective layer 24 including a plurality of pre-coated glass layers is formed by a screen printing method so as to cover the plurality of resistance layers 23. By baking with a baking profile having a peak temperature of 600 ° C., the first protective layer 24 made of a precoated glass layer was made a stable film.

Next, as shown in FIGS. 3E and 4E, trimming is performed by a laser trimming method in order to adjust the resistance value of the resistance layer 23 between the plurality of pairs of upper electrode layers 22 to a constant value. Then, a plurality of trimming grooves 25 were formed.

Next, as shown in FIGS. 5A and 6A, resin is applied by a screen printing method so as to cover the first protective layer 24 including a plurality of pre-coated glass layers arranged in the vertical direction on the drawing. A plurality of second protective layers 26 as a main component were formed and cured with a curing profile at a peak temperature of 200 ° C., thereby forming the second protective layer 26 as a stable film.

Next, as shown in FIGS. 5B and 6B, a plurality of resist layers 27 are formed on the back surface of the sheet-shaped insulating substrate 21 by a screen printing method, and the resist layers 27 are cured by ultraviolet light. A stable film was obtained.

Next, as shown in FIG. 2, FIG. 5C and FIG. 6C, an unnecessary area portion 21a formed on the entire periphery of the sheet-shaped insulating substrate 21 on which the resist layer 27 is formed is removed. Then, a plurality of slit-shaped first divided portions 28 for separating a plurality of pairs of upper electrode layers 22 and dividing the plurality of strip-shaped substrates 21b into a plurality of strip-shaped substrates 21b are formed by a dicing method. In this case, the plurality of slit-shaped first divided portions 28 are formed at a pitch of 700 μm, and the width of the slit-shaped first divided portions 28 is 120 μm. The plurality of slit-shaped first divided portions 28 are formed by through holes penetrating the sheet-shaped insulating substrate 21 in the vertical direction. Further, since the sheet-shaped insulating substrate 21 has a plurality of slit-shaped first divided portions 28 formed by dicing except for the unnecessary region portion 21a, the slit-shaped first divided portions 28 are formed. After that, since the plurality of strip-shaped substrates 21b are connected to the unnecessary area portion 21a, they are in a sheet state.

Next, as shown in FIGS. 5D and 6D, nickel or nickel is formed on the back surface of the sheet-shaped insulating substrate 21 and the inner surface of the plurality of slit-shaped first divided portions 28 by using a sputtering method. A side electrode layer 29 having a thickness of about 0.1 to 1 μm is formed of a nickel-based alloy, for example, a nickel-chromium alloy. In this case, the side surface electrode layer 29 formed on the inner surface of the plurality of slit-shaped first divided portions 28 is in contact with and electrically connected to the upper surface electrode layer 22 formed on the upper surface of the sheet-shaped insulating substrate 21. Things.

Next, as shown in FIGS. 7A and 8A, a plurality of resist layers (not shown) are peeled off, and a plurality of pairs of side electrode layers 29 are patterned.

Next, as shown in FIGS. 7B and 8B, the exposed plural pairs of the side electrode layers 29 and the plural resist layers (not shown) were peeled off by using an electroplating method. A plurality of pairs of nickel layers 30 made of nickel having a thickness of about 4 to 6 μm and a plurality of pairs of solder made of tin having a thickness of about 4 to 6 μm so as to cover a part of the plurality of pairs of upper electrode layers 22 that are exposed. The layer 31 is formed.

The thickness of the side electrode layer 29 formed by the above-mentioned sputtering method is about 0.1 to 1 μm, but is not limited to this range, and the thickness including the nickel layer 30 and the solder layer 31 is not limited to this range. A thickness of 1 to 15 μm is appropriate.

The solder layer 31 is made of tin, but is not limited to tin. The solder layer 31 may be made of a tin alloy-based material. You can do it.

Further, since the upper electrode layer 22 is made of a silver-based material and the resistance layer 23 is made of a ruthenium oxide-based material, resistance characteristics excellent in heat resistance and durability can be secured. .

Further, the protective layer covering the resistance layer 23 and the like mainly includes a first protective layer 24 made of a pre-coated glass layer that covers the resistance layer 23, and a resin that covers the first protective layer 24 and covers the trimming groove 25. Since the first protective layer 24 is composed of two layers, the first protective layer 24 can prevent the occurrence of cracks at the time of laser trimming and reduce the current noise. By covering the entire resistive layer 23 with the second protective layer 26 described above, it is possible to secure resistance characteristics excellent in moisture resistance.

Finally, as shown in FIG. 2, FIG. 7 (c), and FIG. 8 (c), a sheet-like insulating substrate 21 is formed except for an unnecessary area portion 21a formed on the entire peripheral edge of the sheet-like insulating substrate 21. A dicing method is applied to a plurality of strip-shaped substrates 21b of the substrate 21 in a direction orthogonal to the slit-shaped first division 28 so that a plurality of resistance layers 23 are individually separated and divided into individual substrates 21c. Are used to form a plurality of second divisions 32. In this case, the plurality of second divisions 32 are formed at a pitch of 400 μm, and the width of the second divisions 32 is 100 μm. Since the plurality of second divided portions 32 are formed on the plurality of strip-shaped substrates 21b by a dicing method except for the unnecessary region portion 21a, each time the plurality of second divided portions 32 are formed. The product that is cut and divided into the individual pieces of the substrate 21c and separated into individual pieces is separated from the unnecessary area portion 21a.

抵抗 Through the steps described above, the resistor according to the embodiment of the present invention is manufactured.

In the length and width dimensions of the resistor manufactured by the above process, the interval between the slit-shaped first divided portion 28 and the second divided portion 32 formed by the dicing method is accurate (within ± 0.005 mm). At the same time, since the thicknesses of the side electrode layer 29, the nickel layer 30, and the solder layer 31 are also accurate, the total length and total width of the product resistor are exactly 0.6 mm long × 0.3 mm wide. . In addition, the pattern accuracy of the upper electrode layer 22 and the resistance layer 23 does not need to be classified into dimensional ranks of the individual substrates, and it is not necessary to consider a dimensional variation within the dimensional rank of the same individual substrate. The effective area of 23 can be made larger than that of the conventional product. That is, the resistance layer in the conventional product has a length of about 0.20 mm × width 0.19 mm, whereas the resistance layer 23 of the resistor according to the embodiment of the present invention has a length of about 0.25 mm × width 0. .24 mm, which is about 1.6 times or more in area.

The plurality of slit-shaped first divided portions 29 and the plurality of second divided portions 32 are formed by using a dicing method, and the plurality of slit-shaped first divided portions 29 and the plurality of second divided portions 29 are formed. Since the two divided portions 32 are formed by dicing on the sheet-shaped insulating substrate 21 which does not require the dimensional classification of the individual substrates, the conventional dimensional classification of the individual substrates becomes unnecessary. In addition, it is possible to eliminate the complexity of the process due to the conventional mask replacement, and to easily perform dicing using a semiconductor or other general dicing equipment.

Further, the sheet-shaped insulating substrate 21 has an unnecessary area 21a which is not finally formed as a product at the entire peripheral end, and has a plurality of slit-shaped first divided portions 28 and a plurality of second divided portions. Since the portion 32 is not formed in the unnecessary area portion 21a, the plurality of strip-shaped substrates 21b are connected to the unnecessary area portion 21a even after forming the plurality of slit-shaped first divided portions 28, Therefore, the sheet-shaped insulating substrate 21 is not finely divided into the plurality of strip-shaped substrates 21b, and therefore, even after the plurality of slit-shaped first divided portions 28 are formed, the unnecessary region portion 21a is provided. Since the post-process can be performed in the state of the sheet-shaped insulating substrate 21, the design of the method can be simplified. When a plurality of second divisions 32 are formed, each time the plurality of second divisions 32 are formed, they are cut and divided into individual substrates 21c, and the individualized products are removed from the unnecessary area 21a. Since the separation is performed, the method of separating the unnecessary area portion 21a and the product later is unnecessary.

Further, since the plurality of pairs of side electrode layers 29, the nickel layer 30, and the plurality of pairs of solder layers 31 are formed in the state of the sheet-like insulating substrate 21, the side-surface electrode layer 29 is formed of the sheet-like insulating substrate 21. And the potential difference can be reduced when the nickel layer 30 and the solder layer 31 are formed by the electroplating method, whereby the stable nickel layer 30 and the solder layer 31 can be formed. You can do it.

In the first embodiment of the present invention, the unnecessary region 21a, which is not finally formed as a product, is formed at the entire peripheral edge of the sheet-shaped insulating substrate 21 to form a substantially rectangular shape. As described above, the unnecessary area portion 21a does not necessarily need to be formed on the entire peripheral edge of the sheet-like insulating substrate 21. For example, as shown in FIG. When the portion 21d is formed, as shown in FIG. 10, when the unnecessary region portions 21e are formed at both ends of the sheet-shaped insulating substrate 21, as shown in FIG. Even when the unnecessary area portion 21f is formed, the same operation and effect as those of the first embodiment of the present invention are exerted.

Further, in the first embodiment of the present invention, the case where the plurality of second divided portions 32 are formed by the dicing method has been described. In addition, for example, the plurality of second divided portions 32 may be formed of a sheet. Any one of the upper surface, the lower surface, and the center of the sheet-shaped insulating substrate 21 is cut by a laser method, a dicing method, or the like while leaving a thin portion on any of the back surface, the upper surface, and the center of the insulating substrate 21 having the shape. In these cases, individual pieces are formed in two stages instead of being individualized each time the second divided portion 32 is formed.

In the first embodiment of the present invention, the slit-shaped first division 28 is formed after the resist layer 27 is formed. It may be formed after forming. However, when the resist layer 27 is screen-printed after the formation of the slit-shaped first divided portion 28, the strength of the sheet-shaped insulating substrate 21 is reduced, so that the printing pressure during screen printing is reduced. There is a need to.

{Circle around (4)} Even if the resist layer 27 is formed immediately after forming the first protective layer 24 made of a pre-coated glass layer, the same effect as in the first embodiment of the present invention can be obtained.

Furthermore, in the first embodiment of the present invention, the resist layer 27 is stripped before the formation of the nickel layer 30 and the solder layer 31, but this can be performed after the formation of the nickel layer 30 and the solder layer 31. It is.

In the first embodiment of the present invention, a silver-based material is used for the upper electrode layer 22 and a ruthenium oxide-based material is used for the resistance layer 23. However, these may be used in other material systems. An effect similar to that of the first embodiment can be obtained.

In the first embodiment of the present invention, the slit-shaped first divided portion 28 and the second divided portion 32 are formed using the dicing method. However, other than the dicing method, Even when the slit-shaped first divided portion 28 and the second divided portion 32 are formed by using a dividing means such as a laser or a water jet, the same operation and effect as those of the first embodiment of the present invention can be obtained. To play.

Further, in the first embodiment of the present invention, when a plurality of slit-shaped first divisions 28 for dividing into a plurality of strip-shaped substrates 21b are formed, a plurality of pairs of upper surface electrode layers 22 and a plurality of resistances are formed. A slit-like first division on a sheet-like insulating substrate 21 on which a layer 23, a plurality of first protective layers 24, a plurality of trimming grooves 25, a plurality of second protective layers 26, and a plurality of resist layers 27 are formed; Although a description has been given of the case where a plurality of the first divided portions 28 are formed, the present invention is not limited to this. For example, first, a plurality of first slit-shaped divided portions 28 may be formed on the sheet-shaped insulating substrate 21. In the case where a plurality of pairs of upper surface electrode layers 22 are formed on the sheet-like insulating substrate 21 when the sheet-like insulating substrate 21 in which a plurality of slit-like first divisions 28 are formed in advance is used. This In the case where a plurality of slit-shaped first divided portions 28 are formed on the sheet-shaped insulating substrate 21, after forming the plurality of resistance layers 23 on the sheet-shaped insulating substrate 21, When a plurality of slit-shaped first divided portions 28 are formed, a plurality of pairs of upper surface electrode layers 22 are formed on a sheet-shaped insulating substrate 21 and partially overlap the plurality of pairs of upper surface electrode layers 22. After the plurality of resistance layers 23 are formed as described above, when a plurality of slit-shaped first divided portions 28 are formed on the sheet-shaped insulating substrate 21, the plurality of resistance layers 23 are formed on the sheet-shaped insulating substrate 21. Are formed, and a plurality of pairs of upper surface electrode layers 22 are formed so as to partially overlap the plurality of resistance layers 23, and then a plurality of slit-shaped first divided portions 28 are formed on the sheet-shaped insulating substrate 21. If you choose to A plurality of pairs of upper surface electrode layers 22 and a plurality of resistance layers 23 are formed on an insulating substrate 21 having a shape of a triangle, and trimming is performed to adjust the resistance between the plurality of pairs of upper surface electrode layers 22 in the plurality of resistance layers 23. After performing the above, even if the slit-shaped first divided portion 28 is formed in the sheet-shaped insulating substrate 21, the same effect as that of the first embodiment of the present invention can be obtained.

Sectional view of the resistor according to the first embodiment of the present invention. Top view showing a state in which an unnecessary region is formed at the entire peripheral edge of a sheet-shaped insulating substrate used in manufacturing the resistor. (A)-(e) Sectional drawing which shows the manufacturing process of the same resistor. (A)-(e) The top view which shows the manufacturing process of the same resistor. (A)-(d) Sectional drawing which shows the manufacturing process of the same resistor. (A)-(d) The top view which shows the manufacturing process of the same resistor. (A)-(c) Sectional drawing which shows the manufacturing process of the same resistor. (A)-(c) The top view which shows the manufacturing process of the same resistor. Top view showing a state where an unnecessary region is formed at one end of a sheet-shaped insulating substrate used in manufacturing the resistor. Top view showing a state in which unnecessary regions are formed at both ends of a sheet-shaped insulating substrate used in manufacturing the resistor. Top view showing a state where unnecessary regions are formed at three ends of a sheet-shaped insulating substrate used for manufacturing the resistor. Cross section of conventional resistor (A)-(f) Perspective view showing a manufacturing process of a conventional resistor.

Explanation of reference numerals

DESCRIPTION OF SYMBOLS 21 Sheet-shaped insulating board 21a, 21d-21f Unnecessary area | region 21b Strip-shaped board 21c Individual piece board 22 Upper surface electrode layer 23 Resistance layer 24 1st protective layer 25 Trimming groove 26 2nd protective layer 27 Resist layer 28 Slit Shaped first division 29 side electrode layer 30 nickel layer 31 solder layer 32 second division

Claims (4)

Forming a plurality of pairs of upper electrode layers and a plurality of resistance layers on the upper surface of the sheet-shaped insulating substrate so that they are electrically connected to each other; and forming a resistance between the plurality of pairs of upper electrode layers in the plurality of resistance layers. Performing trimming to adjust the value, forming a protective layer so as to cover at least the plurality of resistance layers, forming a resist layer on the back surface of the sheet-shaped insulating substrate, and forming the resist layer Forming a plurality of slit-shaped first divided portions for separating the plurality of pairs of upper surface electrode layers into a plurality of strip-shaped substrates on the sheet-shaped insulating substrate formed with Forming a plurality of pairs of side electrode layers by a sputtering method on the back surface of the sheet-shaped insulating substrate having a plurality of first divided portions formed therein and on the inner surface of the plurality of slit-shaped first divided portions; Layers Patterning the plurality of pairs of side surface electrode layers apart from each other, and forming a plurality of strip-shaped substrates in the sheet-shaped insulating substrate so that the plurality of resistance layers are individually separated and divided into individual-shaped substrates. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions. Forming a plurality of pairs of upper surface electrode layers or a plurality of resistance layers on the upper surface of the sheet-shaped insulating substrate; and forming the plurality of pairs on the sheet-shaped insulating substrate formed with the plurality of pairs of the upper surface electrode layers or the plurality of resistance layers. Forming a plurality of slit-shaped first divided portions for separating the upper electrode layer or the plurality of resistance layers into a plurality of strip-shaped substrates, and the plurality of pairs of upper electrode layers or the plurality of resistance layers Forming a plurality of resistive layers or a plurality of pairs of upper electrode layers so as to partially overlap with each other, and performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistive layers. Forming a protective layer so as to cover at least the plurality of resistance layers, forming a resist layer on the back surface of the sheet-shaped insulating substrate, and forming the plurality of slit-shaped first divided portions. State sheet Forming a side electrode layer by a sputtering method on the back surface of the insulating substrate and the inner surface of the plurality of slit-shaped first divided portions, and patterning a plurality of pairs of side electrode layers by peeling the resist layer. A plurality of strip-shaped substrates in the sheet-shaped insulating substrate, in a direction orthogonal to the slit-shaped first divided portion such that the plurality of resistance layers are individually separated and divided into individual substrates. Forming a plurality of second divided portions. Forming a plurality of pairs of upper electrode layers and a plurality of resistance layers on the upper surface of the sheet-shaped insulating substrate so that both are electrically connected to each other; and forming the plurality of pairs of upper electrode layers and the plurality of resistance layers. Forming a plurality of slit-shaped first divided portions for separating the plurality of pairs of upper electrode layers into a plurality of strip-shaped substrates on a sheet-shaped insulating substrate; and forming the plurality of slit-shaped first divided portions on the plurality of resistance layers. A step of performing trimming to adjust a resistance value between a plurality of pairs of upper electrode layers, a step of forming a protective layer so as to cover at least the plurality of resistance layers, and forming a resist layer on the back surface of the sheet-shaped insulating substrate. Forming and forming a side electrode layer by a sputtering method on the back surface of the sheet-shaped insulating substrate having the plurality of slit-shaped first divided portions formed therein and on the inner surface of the plurality of slit-shaped first divided portions. Process and A step of patterning a plurality of pairs of side electrode layers by peeling the resist layer, and a plurality of strip-shaped substrates in the sheet-shaped insulating substrate, the plurality of resistance layers are individually separated into individual pieces. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions so as to be divided. A plurality of pairs of upper electrode layers and a plurality of resistance layers are formed on the upper surface of the sheet-shaped insulating substrate so that they are electrically connected to each other, and a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers. Performing a trimming process to adjust the thickness, and forming a first slit-shaped substrate for separating the plurality of pairs of upper surface electrode layers into a plurality of strip-shaped substrates on the trimmed sheet-shaped insulating substrate. Forming a plurality of divided portions; forming a protective layer so as to cover at least the plurality of resistance layers; forming a resist layer on the back surface of the sheet-shaped insulating substrate; Forming side electrode layers on the back surface of the sheet-shaped insulating substrate in a state where a plurality of divided portions are formed and the inner surfaces of the plurality of slit-shaped first divided portions by a sputtering method, and peeling the resist layer. Patterning several pairs of side electrode layers; and forming the slits on a plurality of strip-shaped substrates in the sheet-shaped insulating substrate such that the plurality of resistance layers are individually separated and divided into individual substrates. Forming a plurality of second divided portions in a direction orthogonal to the first divided portions.

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