JP2004031732A5 - - Google Patents
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- Publication number
- JP2004031732A5 JP2004031732A5 JP2002187257A JP2002187257A JP2004031732A5 JP 2004031732 A5 JP2004031732 A5 JP 2004031732A5 JP 2002187257 A JP2002187257 A JP 2002187257A JP 2002187257 A JP2002187257 A JP 2002187257A JP 2004031732 A5 JP2004031732 A5 JP 2004031732A5
- Authority
- JP
- Japan
- Prior art keywords
- groove
- incidentally
- rolled
- shifting
- overlap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Description
なお、圧延アンバー板１２を上面１３側から見た場合、上面１３側に設けられた溝部１８と、下面１４側に設けられた溝部１９とが重なり合わないように、これらを基板面方向にずらした状態で配置している。 Incidentally, when viewed rolled amber plate 12 from the upper surface 13 side, the groove 18 provided on the upper surface 13 side, so as not to overlap and a groove 19 provided on the lower surface 14 side, shifting them to the substrate surface direction Are placed in the
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002187257A JP3953900B2 (en) | 2002-06-27 | 2002-06-27 | Multilayer resin wiring board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002187257A JP3953900B2 (en) | 2002-06-27 | 2002-06-27 | Multilayer resin wiring board and manufacturing method thereof |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004031732A JP2004031732A (en) | 2004-01-29 |
| JP2004031732A5 true JP2004031732A5 (en) | 2005-06-02 |
| JP3953900B2 JP3953900B2 (en) | 2007-08-08 |
Family
ID=31182345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002187257A Expired - Fee Related JP3953900B2 (en) | 2002-06-27 | 2002-06-27 | Multilayer resin wiring board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3953900B2 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7765691B2 (en) * | 2005-12-28 | 2010-08-03 | Intel Corporation | Method and apparatus for a printed circuit board using laser assisted metallization and patterning of a substrate |
| JP5183045B2 (en) * | 2006-07-20 | 2013-04-17 | 三洋電機株式会社 | Circuit equipment |
| JP2008060372A (en) * | 2006-08-31 | 2008-03-13 | Sanyo Electric Co Ltd | Circuit apparatus, method of manufacturing the same, wiring substrate, and method of manufacturing the same |
| WO2008069260A1 (en) * | 2006-11-30 | 2008-06-12 | Sanyo Electric Co., Ltd. | Circuit element mounting board, circuit device using the same, and air conditioner |
| JP2010278379A (en) * | 2009-06-01 | 2010-12-09 | Murata Mfg Co Ltd | Wiring board and method of manufacturing the same |
| US9024446B2 (en) | 2009-06-30 | 2015-05-05 | Panasonic Intellectual Property Management Co., Ltd. | Element mounting substrate and semiconductor module |
| KR101044127B1 (en) | 2009-11-16 | 2011-06-28 | 삼성전기주식회사 | Radiator plate and manufacturing method thereof |
| JP2012114217A (en) * | 2010-11-24 | 2012-06-14 | Nitto Denko Corp | Manufacturing method of wiring circuit board |
| KR101177651B1 (en) * | 2011-01-25 | 2012-08-27 | 삼성전기주식회사 | Printed circuit board and method of manufacturing the same |
| JP5178899B2 (en) * | 2011-05-27 | 2013-04-10 | 太陽誘電株式会社 | Multilayer board |
-
2002
- 2002-06-27 JP JP2002187257A patent/JP3953900B2/en not_active Expired - Fee Related
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