JP2004022871A - Manipulator type probe equipment and method for positioning probes pin thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide manipulator type probe equipment by which a probe pin is precisely and simply positioned without damaging a semiconductor element when inspecting the electrical characteristic of various kinds of semiconductor elements of different sizes by using the manipulator-type probe equipment having an advantage of not requiring replacement of the probe pin. <P>SOLUTION: In addition to constitution of a tester 2, a ring plate 3, a manipulator 4, the probe 5 and a wafer stage 6; the manipulator-type probe equipment 1 newly comprises an adjusting plate 7 for adjusting the position of the probe pin, a first image fetching means 8 for fetching the image of the probe pin 5, a second image fetching means 9 for fetching the image of the semiconductor element 13, an image processor 10 for mixing the two images, and an image monitor 11 for displaying the mixed image. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a probe device for inspecting electrical characteristics by bringing a probe pin into contact with an electrode pad of a semiconductor element. When inspecting various semiconductor elements having different sizes, the probe can be easily probed without damaging the semiconductor element. The present invention relates to a manipulator-type probe device capable of adjusting the position of a pin and a method of adjusting the position of the probe pin.
[0002]
[Prior art]
In general, for example, when inspecting electrical characteristics of a semiconductor element formed on the surface of a wafer, a probe pin of a probe device is brought into contact with an electrode pad of the semiconductor element, and a test signal is input / output to determine whether the semiconductor element is good or bad. Is determined. This probe device includes a probe card type and a manipulator type.
[0003]
FIG. 4 is a plan view of a main part of the probe card type probe device 41 and a cross-sectional view along XX. As shown in FIG. 4, the probe card type probe device 41 includes a tester 42, a probe card 43, a probe pin 44, and a wafer stage 45.
[0004]
The tester 42 is connected to a probe pin 44 through a signal line 48 in order to analyze a signal from a semiconductor element 47 formed on a wafer 46 and make a quality judgment. The probe card 43 fixes the probe pins 44 by fixing means such as solder 49. The probe pins 44 are used to input and output signals by pressing against the electrode pads 50 of the semiconductor element 47, and are arranged in accordance with the electrode pads 50 of the semiconductor element 47. The wafer stage 45 holds the wafer 46 by vacuum suction and is configured to be movable in the X, Y, and θ directions by the drive unit 51. In the inspection method, the tester 42 inputs a pre-programmed input signal waveform from the input terminal of the electrode pad 50 of the semiconductor element 47 via the probe pin 44, and the tester 42 outputs a signal waveform output from the output terminal. It is for reading and determining pass / fail.
[0005]
On the other hand, FIG. 5 is a plan view and a YY cross-sectional view of a main part of the manipulator-type probe device 61. As shown in FIG. 5, the manipulator type probe device 61 includes a tester 62, a ring plate 63, a manipulator 64, a probe pin 65, and a wafer stage 66.
[0006]
The difference from the probe card type probe device 41 described above is that a three-axis moving means called a manipulator 64 is attached to each probe pin 65. The manipulator 64 performs adjustment so that the probe pin 65 is positioned substantially at the center of the electrode pad 69 of the semiconductor element 68. The ring plate 63 is made of an iron-based plate material and is configured to be able to attract a magnet, and a manipulator 64 having a built-in magnet is attached to an upper portion thereof. The manipulators 64 are arranged in a circle on a circular portion 63a indicated by a dotted line of the ring plate 63, and the X, Y, and Z axes of the manipulator 64 are pulse motors 64a, 64b for X, Y, and Z axes, respectively. , 64c so that the probe pin 65 can automatically move three-dimensionally to the electrode pad 69 of the desired semiconductor element 68. Other configurations are the same as those of the probe card type probe device 41 described above.
[0007]
In the inspection method, first, the probe pin 65 is attached to the manipulator 64, and the manipulator 64 is attached to the ring plate 63. Next, the semiconductor element 68 to be inspected is moved to below the probe pin 65 by the drive unit 70. Next, the manipulator 64 is adjusted in the X and Y directions to set the probe pins 65 so as to be in contact with the respective electrode pads 69 of the semiconductor element 68. Next, adjustment in the Z direction is performed, and the probe pin 65 is lowered by about 100 μm to apply overdrive. Thereafter, similarly to the probe card type probe device 41 described above, a pre-programmed input signal waveform is transmitted from the tester 62 to the input terminal of the electrode pad 69 of the semiconductor element 68 via the signal line 71 and the probe pin 65. The tester 62 reads a signal waveform inputted and outputted from an output terminal, and judges pass / fail.
[0008]
[Problems to be solved by the invention]
However, the prior art has the following problems. With the recent increase in the degree of integration of semiconductor integrated circuits, the number of elements per chip has increased, and the number of electrode pads for inputting and outputting signals has also tended to increase.
[0009]
When such a variety of semiconductor elements are to be inspected by the same probe device, the probe card type probe device 41 shown in FIG. The card 43 needs to be replaced. Therefore, expensive probe cards 43 must be prepared by the number of products, resulting in a large cost, and a large number of man-hours required for replacing the probe cards 43, which is inefficient.
[0010]
On the other hand, in the manipulator type probe device 61 shown in FIG. 5, since the position of the probe pin 65 is adjusted before the measurement according to the size of the product, even if the size of the semiconductor element 68 to be measured changes, the probe card needs to be replaced. It is unnecessary and has the advantage of being cheaper in cost. However, the operator adjusts the position of the probe pins 65 by setting a microscope on the probe pins 65 and the electrode pads 69 and observing the probe pins 65 and the electrode pads 69 with the microscope. At this time, since the position adjustment is performed using the actual semiconductor element 68, the probe pins 65 made of a metal material such as tungsten may damage the semiconductor element 68 and cause a defective product. In addition, since the operation itself is performed while looking through the microscope, it takes a long time to make adjustments, and the burden on the operator increases, resulting in poor operation efficiency.
[0011]
SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a manipulator-type probe device having an advantage that probe cards do not need to be replaced. The present invention provides a manipulator-type probe device that can accurately and easily adjust the position of a probe pin without damaging a semiconductor element when inspecting a semiconductor device.
[0012]
[Means for Solving the Problems]
In order to solve the above-mentioned problem, a manipulator-type probe device according to claim 1 of the present invention is a manipulator-type probe device for inspecting electrical characteristics of semiconductor elements arranged on a wafer, and adjusts the position of a probe pin. Plate, first image capturing means for capturing an image of the probe pins on the adjustment plate, second image capturing means for capturing an image of the semiconductor device to be inspected, and the first image and the second image capturing means. An image synthesizing means for synthesizing and displaying two images on the same screen is provided. With this configuration, the position of the probe pin can be adjusted while viewing the synthesized image, and there is no need to make contact with the actual semiconductor element, so that the semiconductor element is not damaged.
[0013]
The invention according to claim 2 is the manipulator-type probe device according to claim 1, wherein the first image capturing unit and the second image capturing unit include an optical microscope and a CCD camera. And With this configuration, the image can be arbitrarily enlarged by the optical microscope, and the enlarged image can be converted into an image signal by the CCD camera, thereby facilitating the processing of the enlarged image.
[0014]
According to a third aspect of the present invention, there is provided the manipulator-type probe device according to the first aspect, wherein the image synthesizing means includes an image processing device. With this configuration, an analog image signal of the first image and the second image output from the CCD camera can be converted into a digital image signal, synthesized by signal processing, and displayed on the same image monitor. And work efficiency is improved.
[0015]
According to a fourth aspect of the present invention, there is provided the manipulator-type probe device according to the first aspect, wherein the image synthesizing means comprises a magnifying projector. With this configuration, the analog signal captured by the CCD camera can be enlarged and projected as it is, and it is not necessary to use an image processing device.
[0016]
According to a fifth aspect of the present invention, there is provided the manipulator-type probe device according to the first aspect, wherein the adjustment plate is made of a metal material. With this configuration, it is possible to easily check whether or not the adjustment plate and the probe pins are normally in contact with each other by performing the energization check after the position adjustment of the probe pins.
[0017]
The invention according to claim 6 is a method for adjusting the position of a probe pin of a manipulator-type probe device, wherein the probe pin is moved on an adjustment plate, and an image of the probe pin on the adjustment plate is provided. The image of the semiconductor element to be inspected is synthesized, the position of the probe pin is adjusted by a manipulator while viewing the synthesized image, and after the position of the probe pin is adjusted, a current is applied to the probe pin to adjust the metallic property. It is characterized in that an energization check is performed to determine whether or not current flows normally through the plate. According to this method, the position of the probe pin can be adjusted while viewing the synthesized image, and there is no need to make contact with the actual semiconductor element, so that the semiconductor element is not damaged. In addition, work efficiency is improved, and the time for adjusting the position of the probe pin can be significantly reduced. In addition, it is possible to easily confirm whether or not the position adjustment of the probe pin has been normally performed by the energization check.
[0018]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a first embodiment of a manipulator-type probe device of the present invention will be described with reference to the drawings. FIG. 1 is a block diagram showing a schematic configuration of a manipulator probe device 1 of the present invention.
The manipulator probe apparatus 1 according to the present invention includes a tester 2, a ring plate 3, a manipulator 4, a probe pin 5, and a wafer stage 6, as well as a new adjustment plate 7, a first image capturing unit 8, and a second image capturing unit. And an image processing device 10 and an image monitor 11.
[0019]
The adjustment plate 7 adjusts the position of the probe pin 5 in accordance with the arrangement of the electrode pads 14 of the semiconductor element 13 before inspecting the electrical characteristics of the semiconductor element 13 formed on the wafer 12. And made of a metal material and can be replaced.
[0020]
The first image capturing means 8 includes an optical microscope 8a and a CCD camera 8b, and captures an image of the probe pins 5 on the adjustment plate 7. In the optical microscope 8a, an objective lens is attached to the tip, and the probe pin 5 is enlarged through the objective lens. The CCD camera 8b receives an image of the probe pin 5 observed by the optical microscope 8a and converts the image into an image signal.
[0021]
The second image capturing means 9 includes an optical microscope 9a and a CCD camera 9b, and captures an image of the semiconductor element 13 to be inspected. The optical microscope 9a enlarges the semiconductor element 13, and the CCD camera 9b converts the image into an image signal.
[0022]
The image processing device 10 converts the analog image signals output from the CCD cameras 8b and 9b into digital image signals, performs image enlargement or reduction processing, and synchronizes the images with each other. Are synthesized and output.
[0023]
The image monitor 11 is made of a CRT or a liquid crystal, and displays a processed image obtained by processing by the image processing device 10.
[0024]
The tester 2, ring plate 3, manipulator 4, probe pins 5, and wafer stage 6, which are other components, have the same functions as those of the conventional manipulator-type probe device 61 shown in FIG.
[0025]
Next, a method for adjusting the position of the probe pin 5 in the manipulator-type probe device 1 of the present invention will be described. FIG. 2 is a diagram illustrating the synthesis of images by the image processing apparatus 10.
[0026]
First, as shown in FIG. 1, the wafer 12 on which the semiconductor element 13 to be inspected is formed is fixed to the wafer stage 6 by vacuum suction. Next, the adjustment plate 7 attached to the wafer stage 6 is moved to below the probe pins 5 by the drive unit 15. Next, the first image capturing means 8 is moved above the probe pins 5 by another driving unit (not shown), and the objective lens of the optical microscope 8a is adjusted to obtain an enlarged image of the probe pins 5 (FIG. 2 (a)) is obtained. Next, the second image capturing unit 9 is moved above the semiconductor element 13 to be measured by another driving unit (not shown), and the objective lens of the optical microscope 9a is adjusted to enlarge the semiconductor element 13. An image (FIG. 2B) is obtained.
[0027]
The probe pin 5 and the semiconductor element 13 are enlarged to the same magnification by the optical microscopes 8a and 9a, respectively, and converted into image signals by CCD cameras 8b and 9b as inspection images in which one field of view corresponds to one element. Is supplied to the image processing apparatus 10.
[0028]
The image processing device 10 converts analog image signals output from both CCD cameras 8b and 9b into digital image signals and performs enlargement or reduction. Further, the two images are synchronized, the digital images are superimposed, and the combined images are output on the same image monitor 11 as a composite image (FIG. 2C).
[0029]
The operator operates the manipulator 4 so that the tip of the probe pin 5 is positioned substantially at the center of the electrode pad 14 of the semiconductor element 13 while watching the synthesized image on the image monitor 11 displayed in real time by the above steps. The position of the probe pin 5 is adjusted by the X, Y and Z axis pulse motors 4a, 4b and 4c. After the position of the probe pin 5 is adjusted, a current is supplied to the probe pin 5 to check whether the current flows normally through the metal adjustment plate 7. Thereby, it can be confirmed whether the probe pin 5 and the adjustment plate 7 are normally in contact with each other.
[0030]
Thereafter, the probe pin 5 whose position has been adjusted is moved to the position of the electrode pad 14 of the actual semiconductor element 13 to be inspected, and then the semiconductor is connected to the semiconductor via the signal line 16 and the probe pin 5 by the tester 2 as before. The electrical characteristics of the element 13 are inspected.
[0031]
As described above, in the manipulator probe device 1 of the present invention, the position adjustment of the probe pin 5 performed before inspecting the electrical characteristics of the semiconductor elements 13 having different sizes is performed not on the actual semiconductor element 13 but on a new one. Since the adjustment is performed on the adjustment plate 7 provided in the above, the semiconductor element 13 is not damaged. In addition, since the adjustment can be performed while viewing the composite image on the image monitor 11, the adjustment work becomes much faster.
[0032]
Next, a second embodiment of the manipulator-type probe device of the present invention will be described with reference to the drawings. FIG. 3 is a block diagram showing a schematic configuration of the manipulator-type probe device 21 of the present invention. A feature of the second embodiment is that an enlargement projector is provided on the output side of the two CCD cameras, and the analog images of the CCD cameras are projected onto the projection unit by the enlargement projector. Since the image processing apparatus is not used, the apparatus is inexpensive.
[0033]
The manipulator type probe device 21 of the present invention comprises a tester 22, a ring plate 23, a manipulator 24, a probe pin 25, a wafer stage 26, an adjustment plate 27, a first image capturing means 28, a second image capturing means 29, It is composed of a first enlargement projector 30, a second enlargement projector 31, and a projection unit 32.
[0034]
The adjustment plate 27 is for adjusting the position of the probe pin 25 in accordance with the arrangement of the electrode pads 35 of the semiconductor element 34 before measuring the electrical characteristics of the semiconductor element 34 formed on the wafer 33. And has a function similar to that of the first embodiment. It is made of a metal material and can be replaced.
[0035]
The first image capturing unit 28 includes an optical microscope 28a and a CCD camera 28b, and the second image capturing unit 29 includes an optical microscope 29a and a CCD camera 29b.
[0036]
The first magnifying projector 30 enlarges and projects the image output by the first image capturing means 28, and the second magnifying projector 31 enlarges the image output by the second image capturing means 29. It is to project. Both images are displayed as a combined image by the projection unit 32.
[0037]
The operator operates the manipulator 24 so that the tip of the probe pin 25 is positioned substantially at the center of the electrode pad 35 of the semiconductor element 34 while watching the synthesized image on the projection unit 32 displayed in real time by the above steps. The position of the probe pin 25 is adjusted by the X, Y and Z axis pulse motors 24a, 24b and 24c. After the position adjustment, a current is supplied to the probe pin 25 to check whether or not the current flows normally through the metallic adjustment plate 27, so that the probe pin 25 and the adjustment plate 27 come into normal contact. Check if it is. Thereafter, the probe pins 25 are moved to the positions of the electrode pads 35 of the actual semiconductor element 34 to be inspected, and the electrical characteristics of the semiconductor element 34 are inspected as in the related art.
[0038]
As described above, in the manipulator probe device 21 of the present invention, the position adjustment of the probe pins 25 performed before inspecting the electrical characteristics of the semiconductor elements 34 having different sizes is performed not on the actual semiconductor elements 34 but on a new position. Since the adjustment is performed on the adjustment plate 27 provided in the above, the semiconductor element is not damaged. In addition, since the analog images of the CCD cameras 28b and 29b can be directly enlarged and projected on the projection unit 32, the synthesized image can be more easily viewed and the apparatus can be inexpensive. The projection unit 32 includes a bead screen in which bead-like glass is sprayed on the screen surface, a white mat screen in which glass powder or shell powder is mixed with paint on the screen surface, and an aluminum film in which an aluminum thin film is deposited on a plastic board. A screen can be used.
[0039]
【The invention's effect】
As described above, the manipulator-type probe device of the present invention separately captures the image of the probe pin and the image of the semiconductor element to be inspected when adjusting the position of the probe pin, and combines the two to form an image monitor. The display allows the operator to adjust the position of the probe pins while looking at the image monitor. This eliminates the need to adjust the position of the probe pins using an actual semiconductor element, and prevents the semiconductor element from being erroneously damaged. Further, according to the method for adjusting the position of the probe pin in the manipulator-type probe device of the present invention, the position can be adjusted while looking at the synthesized enlarged image, so that visibility is improved and work efficiency is improved. In addition, by checking the energization after the position adjustment of the probe pins, it can be easily confirmed whether the position adjustment has been normally performed.
[Brief description of the drawings]
FIG. 1 is a block diagram showing a first embodiment of a manipulator-type probe device according to the present invention; FIG. 2 is a diagram illustrating image synthesis by an image processing device; FIG. FIG. 4 is a plan view of a main part of a conventional probe card type probe apparatus and a sectional view taken along line XX of FIG. 2. FIG. 5 is a plan view of a main part of a conventional manipulator type probe apparatus and YY. Cross-sectional view [Explanation of reference numerals]
DESCRIPTION OF SYMBOLS 1 Manipulator type probe apparatus 2 Tester 3 Ring plate 4 Manipulator 4a X-axis pulse motor 4b Y-axis pulse motor 4c Z-axis pulse motor 5 Probe pin 6 Wafer stage 7 Adjustment plate 8 First image capturing means 8a Optical microscope 8b CCD camera 9 Second image capturing means 9a Optical microscope 9b CCD camera 10 Image synthesizer 11 Image monitor 12 Wafer 13 Semiconductor device 14 Electrode pad 15 Driver 16 Signal line 21 Manipulator type probe device 22 Tester 23 Ring plate 24 Manipulator 24a X-axis pulse motor 24b Y-axis pulse motor 24c Z-axis pulse motor 25 Probe pin 26 Wafer stage 27 Adjustment plate 28 First image capturing means 28a Optical microscope 28b CCD camera 29 Second image capturing Means 29a Optical microscope 29b CCD camera 30 First magnifying projector 31 Second magnifying projector 32 Projecting unit 33 Wafer 34 Semiconductor element 35 Electrode pad 36 Driving unit 37 Signal line 41 Probe card type probe device 42 Tester 43 Probe card 44 Probe pin 45 Wafer stage 46 Wafer 47 Semiconductor element 48 Signal line 49 Solder 50 Electrode pad 51 Drive unit 61 Manipulator type probe device 62 Tester 63 Ring plate 64 Manipulator 64a X-axis pulse motor 64b Y-axis pulse motor 64c Z-axis pulse motor 65 Probe pin 66 Wafer stage 67 Wafer 68 Semiconductor element 69 Electrode pad 70 Drive unit 71 Signal line

Claims (6)

In a manipulator-type probe device for inspecting electrical characteristics of semiconductor elements arranged on a wafer, an adjustment plate for adjusting a position of a probe pin, and a first image capture for capturing an image of the probe pin on the adjustment plate Capturing means, a second image capturing means for capturing an image of the semiconductor device to be inspected, and an image combining means for combining and displaying the first image and the second image on the same screen. Manipulator type probe device. The manipulator-type probe device according to claim 1, wherein the first image capturing unit and the second image capturing unit include an optical microscope and a CCD camera. The manipulator-type probe device according to claim 1, wherein the image synthesizing means comprises an image processing device. The manipulator-type probe device according to claim 1, wherein the image synthesizing means comprises a magnifying projector. The manipulator-type probe device according to claim 1, wherein the adjustment plate is made of a metal material. In the method of adjusting the position of a probe pin of a manipulator-type probe device, the probe pin is moved onto an adjustment plate, and an image of the probe pin on the adjustment plate and an image of a semiconductor element to be inspected are synthesized, and the synthesis is performed. While observing the image, the position of the probe pin is adjusted by a manipulator, and after the position of the probe pin is adjusted, a current is applied to the probe pin to check whether the current flows normally through the metallic adjustment plate. A method of adjusting the position of the probe pin.

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