JP2004063694A - Pattern transfer film, manufacture thereof, functional mask and manufacture of functional mask - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a functional mask or the like and the manufacturing method of the same, high in the adhesiveness to a surface to be worked and reduced in the manufacturing cost of the same. <P>SOLUTION: A matrix is formed, in which a pattern is formed on a substrate 11 by a plating film 14 (Fig.(d)). A resin is embedded into the matrix to cure and form a resin film 15 for bearing the pattern (Fig.(e)). A base film 16 having flexibility is bonded to the resin film 15 (Fig.(f)). The pattern film is separated from the matrix and is transferred to the side of the base film 16 to form a pattern transferring film 17. The resin film 15 is bonded from the pattern transferring film 17 onto a member to be worked to separate the same from the base film 16 whereby the functional mask is formed on the member to be worked. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
[Industrial applications]
The present invention relates to a functional mask used for manufacturing a fine wiring pattern and the like, a method for manufacturing the same, and a method for manufacturing a fine structure using the functional mask.
[0002]
[Prior art]
Metal masks and shadow masks have been produced and used as masks having through-holes used when producing fine wiring patterns and the like. Conventional examples of the metal mask are disclosed in, for example, Japanese Patent Application Laid-Open No. 2000-313179 and Japanese Patent No. 3061206. In the above-described metal masks and the like, in a process such as a pattern forming process by etching, a film forming process by a sputtering method or the like, tension is applied to the mask so that the mask does not wrinkle, and in this state, the mask is overlapped with the workpiece. Used.
[0003]
[Problems to be solved by the invention]
However, in the conventional various masks, it cannot be said that the adhesiveness between the mask and the surface to be processed of the workpiece is sufficiently secured, and a gap is formed between the two, so that a desired shape is patterned. Is difficult. In particular, when the surface to be processed is a curved surface (for example, a wavy surface, a spherical surface, or the like) or when the member to be processed is not a rigid body (for example, a plastic sheet or a very thin substrate), the adhesion is ensured. Becomes more difficult.
[0004]
On the other hand, there is also a method in which a pattern is formed directly on a surface to be processed of a member to be processed using an ultraviolet curable resin or the like, and a mask having high adhesion is obtained by using this resin film as a mask. Conceivable. However, in this method, a series of steps such as resin film formation, pattern exposure, and development (so-called photolithography process) are performed on each workpiece to form a mask. And the manufacturing cost increases.
[0005]
The present invention has been created by paying attention to such points, and provides a functional mask and the like which have high adhesion to a workpiece and can reduce the manufacturing cost, and a method for manufacturing the same. The purpose is to do.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, the present invention is a method for producing a pattern transfer film having a pattern film that bears a pattern to be transferred to another, embedding a resin in a matrix on which the pattern is formed, A pattern film forming step of forming a pattern film that bears a pattern by curing, a laminating step of bonding a flexible base film to the pattern film, and peeling the pattern film from the matrix, on the base film side And a transfer step of transferring.
[0007]
Since a pattern film is formed on a flexible base film, a functional mask with high adhesion is realized by using this pattern transfer film to transfer the pattern film in close contact with the workpiece. It is possible to do. In addition, since the pattern film is formed by embedding and curing the resin in the matrix, it is possible to form a pattern transfer film by repeatedly using one matrix to form a large number of pattern films. Become. This makes it possible to form a functional mask at a lower cost as compared with the conventional method of forming a pattern film by performing a photolithography process on each workpiece each time.
[0008]
Preferably, the bonding of the pattern film and the base film is performed via a bonding film.
[0009]
Preferably, the bonding film includes a thermosublimable organic dye film and a bonding film. With this, the bonding force of the bonding film can be reduced by sublimating the organic dye film by irradiating ultraviolet rays after bonding the workpiece and the pattern film, and thus the base after transferring the pattern film to the processing member. It is possible to easily peel the film.
[0010]
Preferably, the matrix includes a step of forming a conductive film on one surface of the substrate, forming a photosensitive resin film on the conductive film, and patterning the photosensitive resin film to partially form the conductive film. Forming a through-hole exposed on the substrate; performing electroplating using the conductive film as one electrode; and growing a plating film in the through-hole formed in the photosensitive resin film; Removing the resin film. Thus, it is possible to easily form a master having the unevenness formed by the plating film formed on the substrate.
[0011]
Preferably, the conductive film includes at least one of a chromium film and a stacked film of a chromium film and a nickel film.
[0012]
Preferably, the plating film includes at least one of a nickel film and a nickel-cobalt alloy film.
[0013]
Preferably, the matrix has a step of forming a photosensitive resin on one surface of the substrate, patterning the photosensitive resin to form a through hole that partially exposes the substrate, Etching using the etching mask to form an uneven shape on the substrate. As a result, a portion corresponding to the through hole formed in the photosensitive resin of the substrate is shaved in a concave shape, and a matrix having a portion covered with the photosensitive resin in a convex shape can be easily formed. It becomes.
[0014]
Preferably, the embedding of the resin in the pattern film forming step is performed by dropping a liquid resin material on the pattern forming surface formed on the matrix and then using a coating tool (for example, a spatula or a squeegee). The supply amount of the resin material is adjusted so that the thickness of the liquid resin material is equal to or less than the depth of the concave portion of the pattern. This makes it possible to more reliably isolate the resin buried in each concave portion, and to avoid a defective formation of the resin film.
[0015]
Preferably, the embedding of the resin in the pattern film forming step is performed by dropping the liquid resin material on the pattern forming surface formed in the matrix and then applying an air current from above the pattern forming surface to the liquid resin material. Is adjusted so that the thickness of the liquid resin material is equal to or less than the depth of the concave portion of the pattern. This makes it possible to more reliably isolate the resin buried in each concave portion, and to avoid a defective formation of the resin film. In particular, there is an advantage that the use of the airflow makes it easy to avoid contamination, breakage, and the like of the pattern forming surface.
[0016]
Preferably, in the pattern film forming step, prior to embedding the resin, a cleaning process for removing foreign substances attached to the matrix is performed. This makes it possible to avoid the intrusion of foreign matter into the resin film, and also to prevent the occurrence of defective formation of the resin film due to repelling of the liquid resin material on the substrate.
[0017]
Preferably, the cleaning treatment includes one of an ultraviolet irradiation treatment and an oxygen plasma ashing treatment.
[0018]
Preferably, the pattern film is an elastic body. As a result, even when physical stress such as bending is applied to the pattern film when the pattern film is separated from the matrix, the shape is restored to its original shape after removing the physical stress. Deformation, breakage, and the like can be avoided more reliably.
[0019]
Preferably, the base film has an alignment mark for positioning. This makes it possible to easily perform alignment when transferring the pattern film to a workpiece or the like.
[0020]
The present invention is also a pattern transfer film manufactured using the above-described manufacturing method. More specifically, the pattern transfer film of the present invention includes a pattern film that bears a pattern to be transferred to another, a base film having the pattern film on one surface, and an energy intervening between the pattern film and the base film. And a binding film that weakens the binding force in accordance with the application of the binder.
[0021]
Preferably, the pattern includes a mask pattern.
[0022]
Preferably, the pattern film includes a resin film.
[0023]
Preferably, the base film is in a sheet shape.
[0024]
Preferably, an alignment mark for positioning is formed on the base film.
[0025]
Preferably, the base film contains polyethylene terephthalate.
[0026]
Preferably, the binding film includes an organic dye film and a bonding film.
[0027]
Preferably, the bonding film weakens the bonding force by sublimating the organic dye film by ultraviolet irradiation.
[0028]
Further, the present invention provides a method for manufacturing a semiconductor device, comprising: attaching the pattern film included in the pattern transfer film manufactured by the above-described manufacturing method to a member to be processed; This is also a method of manufacturing a functional mask for forming a functional mask on the substrate. According to such a manufacturing method, it is possible to form a functional mask having excellent adhesion to a workpiece by utilizing the flexibility of the pattern transfer film. In particular, even when the surface to be processed of the member to be processed is a curved surface, it is possible to easily realize a functional mask with high adhesion.
[0029]
Preferably, the bonding of the pattern film, after bonding the member to be processed and the pattern film, weakens the bonding force of the bonding film by sublimating the organic dye film included in the bonding film by ultraviolet irradiation, from the pattern film This is performed by peeling the base film. This makes it possible to easily peel off the base film after transferring the pattern film to the workpiece.
[0030]
The present invention is also a functional mask formed by the above-described manufacturing method.
[0031]
The present invention is also a method for manufacturing a fine structure, wherein a fine structure is formed by processing a member to be processed using a functional mask manufactured by the above-described manufacturing method. Since a functional mask with high adhesion is used, it is possible to realize a fine structure with high shape processing accuracy.
[0032]
Preferably, the processing on the member to be processed includes at least any one of a plating method, a physical deposition method, and a spin coating method.
[0033]
Preferably, the processing on the member to be processed includes etching using the functional mask as an etching mask.
[0034]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0035]
(1st Embodiment)
In this embodiment, a resin film having a fine pattern is once formed on a film, and then the resin film is peeled from the film and transferred to a member to be processed, so that a function used for processing the member to be processed is provided. Forming a conductive mask. Hereinafter, the details will be described.
[0036]
FIG. 1 is an explanatory diagram illustrating a method for manufacturing a pattern transfer film according to the first embodiment.
[0037]
First, as shown in FIG. 1A, a conductive film (conductive film) 12 is formed on one surface of a substrate 11, and a photoresist film 13 is formed on the conductive film 12.
[0038]
As the substrate 11, a glass substrate, a silicon substrate, a metal substrate (for example, a stainless steel substrate or the like) can be used. The surface of the substrate 11 on which the conductive film 12 is formed is preferably polished so that the surface roughness Rmax is 0.1 μm or less and the flatness is 1 μm or less.
[0039]
As the conductor film 12, for example, it is preferable to form a chromium film having a thickness of about 1000 to 3000 ° by using a film forming method such as a sputtering method or an evaporation method. In addition, since the conductor film 12 is used as an electrode when a nickel film is formed by electroforming (electroforming) in a later step (details will be described later), about 100 to 1000 ° is formed on the chromium film described above. By continuously forming a nickel film having a thickness to form the conductor film 12 into a two-layer structure, the adhesion between the nickel film formed by electroforming and the conductor film 12 in a later step is further improved. It may be.
[0040]
The photoresist film 13 is preferably formed to a thickness of about 30 μm to 120 μm. Further, the photoresist film 13 is formed so as to be thicker than the thickness of the functional mask to be finally formed. According to the line width of the wiring circuit pattern, a dry film is used when the line width is relatively large, and a spin film is used when the line width is relatively small, according to the line width of the wiring circuit pattern. It is preferable to use a coat type resist material.
[0041]
Next, as shown in FIG. 1B, the photoresist film 13 is patterned into a desired shape. More specifically, the photoresist film 13 is exposed to a pattern to be formed (for example, a wiring pattern or the like), and then is developed using an alkaline developer to remove unexposed portions, thereby forming a pattern. A photoresist film 13 having a corresponding portion opened (that is, patterned) is formed. After the development, the substrate 11 is washed to remove the developing solution and the like. Here, first, the substrate 11 is sufficiently cleaned by pure water replacement cleaning until the alkali component is eliminated. Next, an ultraviolet irradiation process or ashing using oxygen plasma (oxygen plasma ashing process) is performed to ensure the cleanliness of the substrate surface exposed by the development. Since this ultraviolet irradiation treatment or oxygen plasma ashing treatment has an effect of also decomposing and removing the photoresist film 13, processing conditions are set so that the photoresist film 13 after patterning does not cause thermal deformation or decrease in film thickness. The adjustment is performed appropriately.
[0042]
When the photoresist film 13 is exposed, by setting the exposure intensity to be high so as to overexpose, the shape of the opening of the photoresist film 13 after development is changed from the substrate 11 side to the photoresist film. It is also possible to have a tapered shape that gradually narrows toward the upper surface side of 13.
[0043]
Next, as shown in FIG. 1C, electroforming is performed using the conductor film 12 on the substrate 11 as one electrode, and plating is performed so as to fill the opening (opening) of the photoresist film 13. The film 14 is grown. In the present embodiment, the plating film 14 is grown until the thickness becomes about 95% of the thickness of the photoresist film 13.
[0044]
In the above-mentioned electroforming, it is preferable to perform plating of low stress nickel or nickel cobalt alloy. As a specific example of the plating method, a nickel sulfamate plating solution is used as a plating solution, the solution temperature is set to about 55 ° C., and the plating initial current density is set to 3 A / m. ² After passing the current for about 10 minutes, the current density is increased to 15 A / m ² It is preferable that the plating time is appropriately adjusted until the plating film has a desired thickness. Prior to the start of plating energization, the substrate 11 is immersed in the plating solution for a short time and taken out, and after confirming that repelling of the plating solution does not occur on the surface of the conductor film 12 underlying the photoresist film 13, Start plating current. When the plating solution is repelled, the substrate 11 may be immersed in the plating solution until the repelling stops, or the substrate 11 may be subjected to ultraviolet irradiation treatment or oxygen plasma ashing again.
[0045]
Next, as shown in FIG. 1D, the photoresist film 13 on the substrate 11 is removed. Thereby, the substrate 11 on which the pattern (the uneven shape) by the plating film 14 is formed is obtained. This substrate 11 is used as a matrix for forming a large number of functional masks of the present embodiment, as will be described in detail later.
[0046]
In the treatment for removing the photoresist film 13 described above, it is preferable to use a sodium hydroxide solution having a concentration of 3% by weight or less and a liquid temperature of 30 to 50 ° C. as a removing solution. The processing time may be set as appropriate depending on the thickness of the photoresist film 13 and the shape of the formed pattern. However, while the substrate 11 is immersed in the removing solution, the removing solution is stirred or the substrate 11 is swung. , It is possible to reduce the processing time. More preferably, the removal treatment is performed in combination with the ultrasonic cleaning treatment. In this case, if an ultrasonic wave having a relatively low frequency (for example, 47 kHz or less) is used, a defect such as deformation of a plating film may occur, and therefore, an ultrasonic wave having a relatively high frequency (for example, 800 kHz or more) is used. Should be used.
[0047]
Next, ultraviolet irradiation treatment or oxygen plasma ashing treatment is performed on the substrate 11 to make the surface of the substrate 11 clean, and then a liquid resin material is applied onto the substrate 11. The liquid resin material is dropped while being spread almost uniformly to the concave portions (openings) of the pattern formed by the plating film 14 without unevenness. The liquid resin material is selected so that the cured resin film becomes an elastic body, and vacuum degassing (air bubble removal) is performed in advance.
[0048]
After a suitable amount of time (for example, about 10 to 60 seconds) has elapsed after filling and dropping the liquid resin material and filling the recess by its own weight, a plastic spatula or squeegee is used to cover the upper part of the plating film 14. The resin material is pressed down to a thickness equal to or less than the thickness of the plating film 14 by scraping. Alternatively, after the resin material is dropped, the height of the resin material is adjusted by applying an airflow having an appropriately adjusted wind speed (for example, about 0.4 to 1.0 m / sec) from the upper surface side of the plating film 14. The thickness may be adjusted. Thereafter, the resin material on the substrate 11 is subjected to a heat treatment (for example, at about 60 ° C. for about 3 hours) by using a hot air drier or the like, and is dried to solidify the liquid resin material. Thus, a resin film 15 is formed as shown in FIG.
[0049]
Next, a substantially transparent base film 16 having an adhesive layer (laminating film) on one side and having the same flexibility as paper or the like and transmitting at least visible light and ultraviolet light is prepared. As shown in (2), the surface of the base film 16 on the side having the adhesive layer is brought into contact with the resin film 15, and the two are adhered together while taking care not to introduce air bubbles.
[0050]
Here, the detailed structure of the base film 16 will be described. FIG. 2 is a diagram illustrating a detailed structure of the above-described base film 16. As shown in FIG. 2, the base film 16 of the present embodiment includes a resin layer 31 made of PET (polyethylene terephthalate) resin or the like and an organic dye (for example, cyanine-based) having a property of sublimating by irradiation with light in an ultraviolet wavelength region. (Dye) is applied to the resin layer 31 and dried to form a dye layer 32, and a cellulose-based adhesive is applied to the dye layer 32 and dried to form an adhesive layer 33.
[0051]
Further, in order to accurately align and transfer the resin film 15 to the workpiece, it is more preferable to form an alignment mark used for alignment at a predetermined position on the base film 16.
[0052]
FIG. 3 is an explanatory diagram for explaining a position where an alignment mark is formed on the base film 16. As shown in FIG. 3, the alignment mark 34 is appropriately selected at a position on the surface of the resin layer 31 where the dye layer 32 is not formed and does not overlap with the resin film 15 bonded to the base film 16. It is formed. By using the alignment mark 34 and an alignment mark (details will be described later) formed on the workpiece, alignment can be performed easily and accurately.
[0053]
When the above-described base film 16 is bonded to the resin film 15, the base film 16 is then separated from the substrate 11. Thus, as shown in FIG. 1G, the resin film 15 is transferred from the substrate 11 onto the base film 16 while the pattern is held, and the pattern transfer film 17 is formed. As will be described later in detail, in the present embodiment, only the resin film 15 is peeled from the pattern transfer film 17 and transferred to a workpiece, so that the resin film 15 is used for processing the workpiece. Form a mask.
[0054]
In addition, if necessary, a rigid backing plate (for example, a transparent acrylic plate or the like) may be attached to the back surface of the pattern transfer film 17 (the surface opposite to the surface on which the resin film 15 is formed) for reinforcement. .
[0055]
Further, by using the substrate 11 (see FIG. 1D) on which the pattern of the plating film 14 is formed as a matrix, the above-described steps of FIG. 1E to FIG. A large number of pattern transfer films 17 can be formed from one matrix.
[0056]
Next, a method of forming a functional mask on a workpiece using the above-described pattern transfer film 17 will be described in detail.
[0057]
FIG. 4 is an explanatory diagram for explaining a method of forming a functional mask using the pattern transfer film 17. First, a liquid material having an adhesive effect is spray-coated on the surface of the pattern transfer film 17 (the surface on which the resin film 15 is formed) and dried. Next, as shown in FIG. 4A, the pattern transfer film 17 is brought into contact with the surface of the workpiece 41 which needs patterning such as an electric circuit board while appropriately applying tension so as not to generate wrinkles. Then, the resin film 15 is attached to the workpiece 41. At this time, an alignment mark 42 for positioning is formed at a predetermined position of the workpiece 41 in advance, and the alignment mark 42 and the alignment mark 34 formed on one surface of the base film 16 are aligned. Alignment is performed using
[0058]
Next, as shown in FIG. 4B, irradiation light 43 including light having a wavelength in the ultraviolet region is irradiated from the back side of the pattern transfer film 17 to sublimate the dye layer 32 (see FIG. 2). The bonding force between the film 15 and the base film 16 is weakened, and the base film 16 is separated from the resin film 15. As a result, as shown in FIG. 4C, the workpiece 41 is brought into a state where the functional mask made of the resin film 15 is attached.
[0059]
Further, in the present embodiment, it is possible to easily attach a functional mask to a curved surface portion of a workpiece by utilizing the flexibility (flexibility) of the pattern transfer film 17.
[0060]
FIG. 5 is an explanatory diagram illustrating a method for forming a functional mask on a curved surface portion of a workpiece. First, a liquid material having an adhesive effect is spray-coated on the surface of the pattern transfer film 17 and dried. Next, as shown in FIG. 5A, the pattern transfer film 17 is appropriately tensioned so as not to generate wrinkles, and the pattern transfer film 17 is bent along the curved shape of the workpiece 41a while the surface of the workpiece 41a is curved (curved surface). ), And the resin film 15 is attached to the workpiece 41a.
[0061]
Next, as shown in FIG. 5B, irradiation light 43 including light having a wavelength in the ultraviolet region is irradiated from the back side of the pattern transfer film 17 to sublimate the dye layer 32 (see FIG. 2). The base film 16 is peeled from the resin film 15. As shown in FIG. 5C, the workpiece 41a is in a state where the resin film 15 having a fine pattern, that is, the functional mask is attached.
[0062]
In the state shown in FIG. 4 (c) or FIG. 5 (c), that is, in a state where the functional mask (resin film 15) is stuck, the member 41 (or the member 41a) is processed. By performing various processes, the workpiece 41 can be processed. For example, by performing etching using a functional mask as an etching mask, a desired shape can be patterned on the workpiece 41. Further, by performing a sputtering process, a spin coating process, a baking process, or the like on the workpiece 41, a thin film having a pattern opposite to the pattern of the functional mask can be formed on the surface of the workpiece 41. . Further, if a functional mask is not required after the formation of the thin film, the functional mask can be easily peeled off from one location near the edge portion by utilizing the elasticity of the functional mask. Furthermore, the functional mask can be left as it is without being peeled and used as an insulating layer between circuit patterns, or used as an intermediate insulating layer in a multilayer structure.
[0063]
As described above, in the first embodiment, the pattern transfer film 17 is formed by forming the resin film (pattern film) 15 on the base film 16 having flexibility. Thereby, the resin film 15 is closely adhered to the workpiece 41 and transferred, and a functional mask having high adhesion can be realized. Further, since the resin film 15 is formed by embedding and curing the resin in the matrix, it is possible to form a large number of pattern transfer films by repeatedly using one matrix and form a functional mask. Become. This makes it possible to realize a significant reduction in the cost of the functional mask as compared with the conventional method of forming a functional mask by performing a photolithography process on each member to be processed each time. The pattern transfer film 17 of the present embodiment can be effectively used particularly when a functional mask is formed on a curved surface of a workpiece.
[0064]
(Second embodiment)
FIG. 6 is an explanatory diagram illustrating a method for manufacturing the pattern transfer film of the second embodiment.
[0065]
First, as shown in FIG. 6A, a photoresist film 13 is formed on one surface of a substrate 21. As the substrate 21, a glass substrate, a silicon substrate, or the like can be used. The surface of the substrate 21 on which the photoresist film 13 is formed is preferably polished so that the surface roughness Rmax is 0.1 μm or less and the flatness is 1 μm or less.
[0066]
Further, the photoresist film 13 is preferably formed to a thickness of about 30 μm to 120 μm. Further, the photoresist film 13 is formed so as to be thicker than the thickness of the functional mask to be finally formed. According to the line width of the pattern to be formed, a dry film is used when the line width is relatively large, and a spin film is used when the line width is relatively small. It is preferable to use a coat type resist material.
[0067]
Next, as shown in FIG. 6B, the photoresist film 13 is patterned into a desired shape. Specifically, the photoresist film 13 is exposed to light corresponding to the pattern to be formed, and then developed using an alkaline developer to remove unexposed portions, thereby opening portions corresponding to the patterns ( That is, a (patterned) photoresist film 13 is formed. After the development, the substrate 11 is washed to remove the developing solution and the like. The cleaning method is the same as in the case of the first embodiment described above, and a detailed description is omitted here.
[0068]
Next, the substrate 21 is etched using the photoresist film 13 as an etching mask to form an uneven shape on the substrate 21. Here, for example, when the substrate 21 is a silicon substrate, it is preferable to perform dry etching using a Freon gas. If the removal rate of the photoresist film 13 and the etching rate of the substrate 21 are not the same, the etching may be completed before the photoresist film 13 is removed. Thereafter, the etching depth (depth of the concave portion 22) is measured, and it is confirmed that the depth has a desired value (for example, 30 μm or more), and etching is performed again as necessary. As a result, as shown in FIG. 6C, the pattern formed on the photoresist film 13 is transferred to the substrate 21, and the concave portion 22 is formed on the substrate 21.
[0069]
Next, an ultraviolet irradiation treatment or an oxygen plasma ashing treatment is performed on the substrate 21 to clean the surface of the substrate 21, and then a liquid resin material is applied onto the substrate 21. The liquid resin material is dropped onto the concave portion 22 formed on the substrate 21 while being spread almost uniformly without unevenness. Subsequent processing is performed in the same manner as in the above-described first embodiment. Thus, the resin film 15 is formed as shown in FIG.
[0070]
Next, a base film 16 similar to that of the above-described first embodiment is prepared, and the surface of the base film 16 having the adhesive layer is brought into contact with the resin film 15 as shown in FIG. Then, be careful not to introduce air bubbles between them.
[0071]
Next, the base film 16 is peeled off from one location on the periphery of the substrate 21. Thus, as shown in FIG. 6F, the resin film 15 is transferred from the substrate 11 onto the base film 16 while maintaining the pattern, and the pattern transfer film 17 is formed.
[0072]
By using the pattern transfer film 17 and transferring the resin film 15 to the member to be processed in the same manner as in the first embodiment, a functional mask having high adhesion can be formed at low cost. It becomes possible. Since the specific method is the same as that of the first embodiment, the description is omitted here.
[0073]
It should be noted that the present invention is not limited to the contents of the above-described embodiments, and various modifications can be made within the scope of the present invention. For example, in the above description, the formation of a substrate to be a master was performed by a method using plating or a method by etching. However, if the required pattern size is relatively large, mechanical The matrix may be formed using any suitable method (for example, forming an uneven shape on the substrate using a cutting tool such as a diamond tool).
[0074]
【The invention's effect】
As described above, according to the present invention, since the pattern film is formed on the flexible base film, the pattern film is closely adhered to the workpiece and transferred using this pattern transfer film. This makes it possible to realize a functional mask having high adhesion. In addition, since the pattern film is formed by embedding and curing the resin in the matrix, it is possible to form a pattern transfer film by repeatedly using one matrix to form a large number of pattern films. Become. This makes it possible to form a functional mask at a lower cost as compared with the conventional method of forming a pattern film by performing a photolithography process on each workpiece each time.
[Brief description of the drawings]
FIG. 1 is an explanatory diagram illustrating a method for manufacturing a pattern transfer film according to a first embodiment.
FIG. 2 is a diagram illustrating a detailed structure of a base film.
FIG. 3 is an explanatory diagram illustrating a position where an alignment mark is formed on a base film.
FIG. 4 is an explanatory diagram illustrating a method of forming a functional mask using a pattern transfer film.
FIG. 5 is an explanatory diagram for explaining a method for forming a functional mask on a curved surface portion of a workpiece;
FIG. 6 is an explanatory diagram illustrating a method for manufacturing a pattern transfer film of a second embodiment.
[Explanation of symbols]
11, 21 Substrate
12 Conductive film
13 Photoresist
14 Plating film
15 Resin film
16 Base film
17 Pattern transfer film
31 resin layer
32 dye layer
33 Adhesive layer
41, 41a Workpiece

Claims (27)

A method for producing a pattern transfer film having a pattern film that bears a pattern to be transferred to another,
A pattern film forming step of embedding a resin in the matrix on which the pattern is formed, curing the resin, and forming a pattern film bearing the pattern,
A bonding step of bonding a flexible base film to the pattern film,
A transfer step of peeling the pattern film from the matrix and transferring the pattern film to the base film side,
A method for producing a pattern transfer film, comprising: The method for manufacturing a pattern transfer film according to claim 1, wherein the bonding of the pattern film and the base film is performed via a bonding film. The method for producing a pattern transfer film according to claim 2, wherein the bonding film includes an ultraviolet dye sublimable organic dye film and a bonding film. The matrix is
Forming a conductive film on one side of the substrate;
Forming a photosensitive resin film on the conductive film, forming a through hole that partially exposes the conductive film by patterning the photosensitive resin film;
Performing electroplating using the conductive film as one electrode, and growing a plating film in the through-hole formed in the photosensitive resin film;
Removing the photosensitive resin film on the substrate;
The method for producing a pattern transfer film according to any one of claims 1 to 3, wherein the method is formed including: The method for producing a pattern transfer film according to claim 4, wherein the conductive film includes at least one of a chromium film and a laminated film of a chromium film and a nickel film. The method according to claim 4, wherein the plating film includes at least one of a nickel film and a nickel-cobalt alloy film. The matrix is
Forming a photosensitive resin on one surface of the substrate, forming a through hole that partially exposes the substrate by patterning the photosensitive resin,
Performing etching using the patterned photosensitive resin as an etching mask, forming a concave and convex shape on the substrate;
The method for producing a pattern transfer film according to any one of claims 1 to 3, wherein the method is formed including: The embedding of the resin in the pattern film forming step,
After dropping the liquid resin material on the pattern forming surface formed in the matrix, the supply amount of the liquid resin material is adjusted using an applicator, and the thickness of the liquid resin material is reduced. The method for producing a pattern transfer film according to any one of claims 1 to 7, wherein the method is performed so that the depth is equal to or less than the depth of the concave portion of the pattern. The embedding of the resin in the pattern film forming step,
After dropping the liquid resin material on the pattern forming surface formed on the matrix, applying an airflow from above the pattern forming surface to adjust the supply amount of the liquid resin material, The method for producing a pattern transfer film according to claim 1, wherein the thickness of the resin material is set to be equal to or less than the depth of the concave portion of the pattern. The method of manufacturing a pattern transfer film according to any one of claims 1 to 9, wherein the pattern film forming step performs a cleaning process for removing foreign substances attached to the matrix before embedding the resin. The method for manufacturing a pattern transfer film according to claim 10, wherein the cleaning treatment includes one of an ultraviolet irradiation treatment and an oxygen plasma ashing treatment. The method of manufacturing a pattern transfer film according to claim 1, wherein the pattern film is an elastic body. The method according to claim 1, wherein the base film has an alignment mark for positioning. A pattern film that carries a pattern to be transferred to another,
A base film having the pattern film on one surface,
A bonding film interposed between the pattern film and the base film, and weakening a bonding force according to application of energy;
Including, pattern transfer film The pattern transfer film according to claim 14, wherein the pattern includes a mask pattern. The pattern transfer film according to claim 14, wherein the pattern film includes a resin film. The pattern transfer film according to claim 14, wherein the base film is in a sheet shape. 18. The pattern transfer film according to claim 14, wherein an alignment mark for positioning is formed on the base film. The pattern transfer film according to claim 14, wherein the base film includes polyethylene terephthalate. 20. The pattern transfer film according to claim 14, wherein the bonding film includes an organic dye film and a bonding film. 21. The pattern transfer film according to claim 14, wherein the bonding film weakens the bonding force by sublimating the organic dye film by ultraviolet irradiation. 14. Affixing the pattern film included in the pattern transfer film according to any one of claims 1 to 13 to a member to be processed, and peeling the base film from the pattern film, thereby forming a pattern on the surface to be processed of the member to be processed. A method for manufacturing a functional mask, which forms a functional mask. The bonding of the pattern film, after bonding the workpiece and the pattern film, weakens the bonding force of the bonding film by sublimating the organic dye film included in the bonding film by irradiation with ultraviolet light, The method for manufacturing a functional mask according to claim 22, wherein the method is performed by peeling the base film from a film. A functional mask formed by the manufacturing method according to claim 22. A method for manufacturing a fine structure, comprising forming a fine structure by processing the workpiece using a functional mask manufactured by the manufacturing method according to claim 22. 26. The method for manufacturing a microstructure according to claim 25, wherein the processing on the workpiece includes at least any one of a plating method, a physical deposition method, and a spin coating method. 26. The method for manufacturing a microstructure according to claim 25, wherein the processing of the workpiece includes etching using the functional mask as an etching mask.

Images