JP2003311930A - Solder supply device and solder printing machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To automatically supply a fluid solder to an object to be soldered easily and at a low cost and improve the productivity of a solder printing process. <P>SOLUTION: This solder supply device 100 for supplying a cream solder to a squeegee block 75 comprises a pot 10 with an opening part for storing a cream solder H, a discharge adapter 20 with an oblong discharge aperture 21 inserted into the opening part of the pot 10, and a pressure applying means 30 which presses the pot 10 into which the discharge adapter 20 is inserted to the discharge adapter 20 side and supports the discharge adapter 20 against a pressurizing force. The pot 10 pressurized by the pressure applying means 30 is arranged right above the squeegee block 75, and the discharge adapter 20 supported against the pressurizing force is directed toward the squeegee block 75. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder supply apparatus and a solder printing machine suitable for application to a printing apparatus or the like for selectively applying cream solder to a printed board to form a solder pattern. Specifically, the storage container containing the cream solder is pressed toward the lid portion side having the discharge port, and the storage container including the lid portion is provided with pressure applying means for supporting the lid portion against the pressing force. By arranging the lid directly above the supply and directing the lid portion toward the supply target, the solder in the storage container can be discharged with a slight pressing force.

[0002]

2. Description of the Related Art In recent years, in a so-called solder printing process for forming a solder pattern on a printed circuit board, the supply of solder to a solder printer has been automated.

FIG. 18 shows a conventional solder printer 190.
Is. The solder printing machine 190 includes a semiconductor element 210
Is a device for forming a predetermined solder pattern on a printed circuit board 200 or the like on which is mounted.

As shown in FIG. 18, this solder printer 1
Reference numeral 90 denotes a conveyor belt 66 that supports the printed circuit board 200 and conveys the printed circuit board 200 in a predetermined direction, a mask plate 70 provided directly on the printed circuit board 200 placed on the conveyor belt 66, and the mask plate 70. It is composed of a container-shaped squeegee block 95 and the like for applying the cream solder H.

In FIG. 18, an opening is provided below the squeegee block 95, and the cream solder H is discharged from this opening. When the squeegee block 95 moves in the D1 or D2 direction in FIG. 18, the cream solder H in the squeegee block 95 is applied on the mask plate 70.

Further, needles 71 are provided at a plurality of predetermined positions of the mask plate 70, respectively. The cream solder H applied to the mask plate 70 passes through the needle 71 and drops onto the lower printed circuit board 200.

Further, the remaining amount of cream solder in the squeegee block 95 can be always checked by a sensor or the like (not shown). When the remaining amount of the cream solder H in the squeegee block 95 falls below a predetermined amount, the cream solder H is supplied to this squeegee block 95. Supply of the cream solder H to the squeegee block 95 is performed manually by the operator.

[0008]

By the way, according to the above-mentioned solder printing machine 190, the surface of the mask plate 70 is
Supply of the cream solder H to the squeegee block 95 moving in the 1 or D2 direction has been performed manually by the operator.

Therefore, when supplying the cream solder H into the squeegee block 95,
However, there is a problem that the production efficiency of the solder printing process is poor.

Further, in order to solve such a problem,
It was also considered to provide the solder supply device 90 shown in FIG. 19 adjacent to the above-described solder printing machine 190 and automatically supply the cream solder H to the squeegee block 95 at an arbitrary timing.

However, in such a solder supply device 90, in order to discharge the cream solder (hereinafter, also referred to as fluid-like solder) from the tip of the tube 98 on the squeegee block 95 side, a high level of about 20 kg / cm ² or more. There is a problem that pressure is required, the equipment becomes large, and the equipment investment cost increases.

Therefore, the present invention solves such a problem by making it possible to automatically and easily supply fluid-like solder to an object to be supplied and to improve the productivity of the solder printing process. An object of the present invention is to provide a solder supply device and a solder printing machine which are made possible.

[0013]

The above-mentioned problem is a solder supply device for supplying a fluid-like solder to an object to be supplied, and an accommodating container having an opening for accommodating the solder,
A lid having a discharge port of a predetermined shape and inserted into the opening of the storage container, and the storage container in which the lid is inserted are pressed toward the lid, and at the same time, the lid is pressed. Pressure receiving means for supporting against the pressure supplying means, the storage container pressed by the pressure applying means is disposed directly above the supply target, and the lid supported against the pressing force is directed toward the supply target. And a solder supply device.

According to the solder supply apparatus of the present invention, the storage container is arranged directly above the supply target to which the fluid-like solder is supplied, and the lid portion fitted in the opening of the storage container. Are directed at the supply. In this state, the storage container is pressed toward the lid portion by the pressure applying means, and the lid portion is supported against the pressing force by the pressure applying means.

Therefore, since both the weight of the fluid-like solder and the pressing force can be applied to the lid portion, the solder in the storage container can be ejected from the ejection port of the lid portion with a slight pressing force. . Further, the solder discharged from the discharge port of the lid can be dropped toward the supply target.

The solder printer according to the present invention comprises a printing device for selectively applying a fluid-like solder to an object to be printed to print a solder pattern, and a solder supply device for supplying the solder to the printing device. In the printing machine, the solder supply device includes an accommodating container having an opening for accommodating the solder, a lid having a discharge port of a predetermined shape and fitted into the opening of the accommodating container, The storage container having the lid portion inserted therein is pressed toward the lid portion side, and pressure applying means for supporting the lid portion against the pressing force is provided, and the storage container pressed by the pressure applying means is a printing device. The lid portion, which is arranged directly above and is supported against the pressing force, is directed toward the printing apparatus.

According to the solder printer according to the present invention, since the above-mentioned solder supply device is applied, the solder supply system of the solder printer can be inexpensively automated and the productivity of the solder printing process can be improved.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION A solder supply device and a solder printer according to the present invention will be described in detail below with reference to the drawings. (1) Embodiment FIG. 1 is a conceptual diagram showing a configuration example of a solder printer 100 according to an embodiment of the present invention. In this embodiment, the storage container in which the lid portion having the discharge port of a predetermined shape is inserted is pressed toward the lid portion side, and pressure applying means for supporting the lid portion against the pressing force is provided. The weight of the fluid-like solder and the pressing force are set by disposing the storage container pressed by the applying means directly above the supply target and by directing the lid supported against the pressing force toward the supply target. Both can be applied to the lid so that the solder in the storage container can be ejected from the ejection port of the lid with a slight pressing force, and the ejected solder is dropped toward the supply target. It was made possible.

First, the solder printer 100 will be described. The solder printing machine 100 shown in FIG. 1 selectively applies cream solder (an example of fluid-like solder) in a squeegee block to lands and the like of a printed circuit board 200 (an example of an object to be printed), and the printed circuit board 200 Is printed with a predetermined solder pattern (hereinafter, also referred to as a squeegee block method). This solder printing machine 100
Is composed of a solder supply device 50 and a printer main body (an example of a printer) 60. As shown in FIG. 1, the solder supply device 50 is provided directly above (immediately above) the printing press main body 60, and is connected to the squeegee guide 42 (actuator portion) of the printing press main body 60 by a connecting portion 45. There is. Further, by disconnecting the connecting portion 45,
The solder supply device 50 and the printer main body 60 are separable.

First, the printer body 60 will be described. As shown in FIG. 1, the main body 60 of the printing machine includes a substrate support portion 65 that supports the printed circuit board 200 and transports the printed circuit board 200 to the left or right direction in FIG. As shown in FIG. 1, this substrate support portion 65
Is composed of a conveyor belt 66, a substrate backup 67, and a substrate stopper 69.

The operation of the substrate supporting portion 65 is as follows. First, the printed circuit board 200 is mounted on the conveyor belt 6.
The sheet is placed on the sheet 6, and is conveyed from the right side in FIG. 1 to a position above the substrate backup 67. Then, when the printed circuit board 200 reaches a predetermined position below the mask plate, which will be described later, the substrate stopper 67 moves upward to stop the movement of the printed circuit board 200. Next, the printed circuit board 200 under the mask plate is
The substrate backup 67 separates it from the conveyor belt 66 and conveys it upward (that is, to the mask plate side).
Then, a predetermined solder printing process is performed on the printed circuit board 200 that has been transported to directly below the mask plate by the circuit board backup 67.

Returning to the description of the configuration example of the printer body 60. As shown in FIG. 1, the printing machine main body 60 includes a substrate supporting unit 6
A mask plate 70 is provided above 5. The mask plate 70 is used as a screen plate when cream solder is selectively applied to the lands of the printed circuit board 200.

Printed circuit board 2 of this mask plate 70
A needle 71 projecting downward is provided at a predetermined position corresponding to the land and the like of 00. These needles 7
Reference numeral 1 is a pipe structure capable of supplying the cream solder H from the mask plate 70 toward the land or the like of the printed circuit board 200. As shown in FIG. 1, the printed circuit board 200 includes
Since the semiconductor element 210 is mounted in advance,
A space larger than the thickness of the semiconductor element 210 has to be provided between the printed board 200 and the mask plate 70. Therefore, in order to absorb this space and form a solder pattern on the printed circuit board 200 with good reproducibility, a needle 71 is provided on the mask plate 70. Therefore, for the printed circuit board 200 on which the semiconductor element 210 is not mounted, the mask plate 70 without the needle 71 and selectively provided with only the opening is set in the printing machine main body 60. There is also. The mask plate 70 having various shapes can be used depending on the type of the material to be printed.

Further, the main body 60 of the printing machine is provided with a squeegee block (an example of an object to be supplied) 75. As shown in FIG. 2, the squeegee block 75 has a container shape, and the lower end portion thereof is squeezed into a substantially V shape. In addition, the lower end portion of the squeegee block 75 has a groove portion 7 for applying the cream solder H to the mask plate 70.
6 is provided.

This squeegee block 75 is shown in FIG.
Of the mask plate 70, and the length thereof corresponds to the dimension width of the mask plate 70 in the direction perpendicular to the paper surface. As shown in FIG. 2, the squeegee block 75 is provided with a remaining amount sensor 72. The remaining amount sensor 72 includes an elevating part 72A having buoyancy with respect to the cream solder H, and a switch 72B turned on / off by the elevating part 72A. In FIG. 2, when the surface of the cream solder H in the squeegee block 75 reaches a predetermined height (when the cream solder H reaches a predetermined amount), the elevating part 72A turns on or off the switch 75. Done

The detection signal of the remaining amount sensor 72 is supplied to the controller 51 of the solder supply device 50. The cream solder H is intermittently supplied into the squeegee block 75 by the detection signal of the remaining amount sensor 72. This squeegee block 75 is located on the mask plate 70 by D1 or D2.
It can be moved in any direction.

Returning to FIG. 1, the printing machine main body 60 includes a squeegee block 75 and a board backup 67.
In addition, a plurality of drive units are provided to operate the conveyor belt 66 and the like. For example, the first drive unit 77 shown in FIG.
Is for moving the conveyor belt 66 from the right side to the left side in FIG. Further, the second drive unit 78 moves the substrate backup 67 up and down. Further, the third drive unit 79 is configured to operate the squeegee block 7
The squeegee guide 42 to which 5 is connected (fixed) is moved to move the squeegee block 75 to the position P shown in FIG.
It is to be moved between 1 and the position P2.

Further, the printing machine main body 60 is provided with a sensor used for detecting the position of the squeegee block 75. For example, the printing machine main body 60 includes a first sensor 73 near the position P1 and a second sensor 73 near the position P2.
Sensor 74. In FIG. 1, when the squeegee block 75 moves in the D1 direction and reaches the position P1,
The arrival is detected by the sensor 73. Further, when the squeegee block 75 moves in the D2 direction and reaches the position P2, the arrival is detected by the sensor 74.

As shown in FIG. 1, the printing machine main body 60 is supplied with position detection signals from the above-mentioned sensors 73 and 74, and is controlled by the drive units 77, 78 and 79 and the substrate stopper 69. A control unit 80 for supplying a signal is provided.

In FIG. 1, the squeegee block 75 is moved in the direction D1 by the driving operation of the driving unit 79, and the position P is reached.
When it reaches 1, the sensor 73 detects the squeegee block 75 and supplies the detection signal to the control unit 80. In response to this, the control unit 80 supplies a predetermined control signal to the drive unit 79 to stop the moving operation thereof.

Conversely, in FIG. 1, the squeegee block 7
When 5 moves in the direction D2 and reaches the position P2, the sensor 7
4 detects the squeegee block 75 and supplies the detection signal to the controller 80. In response to this, the control unit 80 supplies a control signal to the drive unit 79 to stop the movement operation.

Next, the solder supply device 50 will be described. The solder supply device 50 shown in FIG. 2 is a device for automatically supplying the claim solder H to the squeegee block 75 of the printing machine body 60 described above.

As shown in FIG. 2, this solder supply device 5
Reference numeral 0 denotes a pot (an example of a storage container) 10 having an opening for storing cream solder, and an oval-shaped solder discharge port 2
A discharge adapter (an example of a lid) 20 having 1 and fitted into the opening of the pot 10, and pressing the pot 10 to the discharge adapter 20 side on the one hand and the discharge adapter 20 against the pressing force on the other hand And a pressure applying means 30 for supporting.
The pot 10 pressed by the pressure applying means 30 is arranged right above the squeegee 75 which constitutes the printing machine main body 60, and the discharge adapter 20 supported against the pressing force is directed toward the squeegee 75. There is.

FIG. 3 is a sectional view showing an example of the structure of the pot 10. As shown in FIG. 3, the pot 10 includes a pot body 11, a cover 12 for housing the pot body 11,
Ring 1 for engaging the cover 12 and the pot body 11
3 and 3.

The pot body 11 contains, for example, 500 g or 1 kg of cream solder. The pot body 11 is, for example, a cylindrical container and is made of metal or plastic. Further, as shown in FIG. 3, the peripheral edge 11A of the opening of the pot body 11 is adapted to project outward by, for example, about 5 mm.

The cover 12 shown in FIG.
It is used to store and is made of metal or plastic. The cover 12 is a cylindrical container that is slightly larger than the pot body 11 and has an opening that is slightly larger than the pot body 11. The cover 12 reinforces the strength of the outer peripheral side surface and the bottom of the pot 10. As shown in FIG. 3, a pair of lock claw portions 12A protruding outward by, for example, about 5 mm are provided on the peripheral edge of the opening of the cover 12 so as to face each other. The role of the lock claw portion 12A will be described later.

Further, the ring 13 shown in FIG. 3 has a U-shaped ring shape, and is composed of the pot body 11 and the cover 1.
It is an auxiliary tool that engages with 2. The ring 13 is provided with eaves portions 13A and 13B on the upper surface and the lower surface, respectively. As shown in FIG. 3, the inner diameter of the eaves portion 13A is larger than the outer diameter of the peripheral edge portion 11A of the pot body 11. In addition, this eaves portion 13A
The lock claw portion 12A of the cover 12 hangs on (locks)
It is done like this.

FIG. 4 is a perspective view showing an example of hooking the cover 12 and the ring 13. As shown in FIG. 4, the eaves portion 13A
Is provided with a pair of groove portions corresponding to the lock claw portions 12A. By inserting the lock claw portion 12A into this groove and turning the cover 12 clockwise, for example, the lock claw portion 12A can be hung on the eaves portion 13A. On the other hand, the inner diameter of the eaves portion 13B shown in FIG.
It is made smaller than the outer diameter of the peripheral portion 11A of No. 1.

Therefore, as shown in FIG. 3, the pot body 1
The pot main body 11 and the cover 12 can be engaged with each other by hooking the lock claw portion 12A of the cover 12 on the eaves portion 13A of the ring 13 in a state where the pot 1 is stored in the cover 12.

The pot body 11 shown in FIG. 3 may be a container that is delivered from a solder manufacturer in a state in which the cream solder H is stored. In this case, the pot body 11 is in a state in which its opening is closed by a lid member or the like when delivered from the manufacturer. The cream solder H in the pot body 11 is frozen and stored to prevent deterioration.

Therefore, the lid member is removed from the pot body 11, and the cream solder in the pot body 11 is mixed while the cream solder in the pot body 11 is returned to room temperature using a known kneader. As a result, the flux and the powder of the cream solder H can be prevented from being separated from each other, and both can be kneaded, and the pot body 11 accommodating the cream solder H having a predetermined thixotropic ratio can be prepared.

Therefore, by using the pot main body 11 delivered from the manufacturer, it is not necessary to prepare a dedicated pot main body 11, and the labor for storing the cream solder in the pot main body 11 can be saved. It can greatly contribute to the cost reduction of print processing.

5A and 5B are a plan view showing a structural example of the discharge adapter 20 and a sectional view taken along the line X1-X2. Figure 5A
As shown in, the discharge adapter 20 has a disc shape. The diameter of this discharge adapter 20 is, for example, 70 m.
It is about m. A discharge port (opening) 21 is provided at the center of the discharge adapter 20. The discharge port 21 has an oval shape with a width of about 3 mm and a length of about 12 mm, for example. By making the shape of the discharge port into an oval shape, breakage (separation) of the solder can be enhanced. This point will be described later based on experimental results.

Further, as shown in FIG. 5A, an O-ring (an example of a seal member) 22 is provided on the outer peripheral surface of the discharge adapter 20. This O-ring 22 is shown in FIG.
As shown in B, this is to improve the adhesion between the outer peripheral surface of the discharge adapter 20 and the inner peripheral surface of the pot body 11.

The O-ring 22 seals the space between the outer peripheral surface of the discharge adapter 20 and the inner peripheral surface of the pot main body 11 and prevents the cream solder from leaking between them. As shown in FIG. 5B, the O-ring 22 is, for example, doubly provided on the outer peripheral surface of the discharge adapter 20.
Further, as the number of the O-rings 22 is increased, the adhesion between the discharge adapter 20 and the pot 10 can be improved, so that the O-rings 22 may be triple layers, for example.

By the way, the surface of the discharge adapter 20 on the pot side (the upper surface in FIG. 5B) is curved (inclined) toward the discharge port 21 of the discharge adapter 20. Hereinafter, the curved surface of the discharge adapter 20 is also referred to as an R surface. When pressure is applied to the cream solder in the pot body 11, this cream solder can be collected at the discharge port 21 along the R surface of the discharge adapter 20, so that the cream solder discharge efficiency can be improved.
The inner surface of the discharge adapter 20 is not necessarily limited to the R surface.

Further, the discharge port 21 of the discharge adapter 20
Is not limited to one. For example, as shown in FIG. 6, this discharge port 21 may be two. In this case, since the cream solder is discharged in a finely divided state, the breakage of the cream solder can be increased.

Further, when the discharge adapter 20 is provided with the atmosphere opening portion 25 as shown in FIG. 7, when the discharge adapter 20 is detached from the pot body 11, the discharge adapter 20 is separated from the pot body 11 and the discharge adapter 20. It is convenient because air can be introduced into the air (open to the atmosphere).

As shown in FIG. 7, this atmosphere opening portion 25
Is the disc-shaped operation portion 26 and the inside R of the discharge adapter 20.
A valve portion 27 having a curved surface along the surface and one end of the valve portion 27.
Shaft part 28 fitted to the operation part 26 at the other end
And an opening 29 provided in the discharge adapter 20 for accommodating the shaft portion 28 and the valve portion 27, and between the operation portion 26 and the outer surface of the discharge adapter 20 that are passed through the shaft portion 28. And a spring 24 disposed in the.

Among these, as shown in FIG. 8A, the opening 29 is composed of a short diameter portion 29A, a long diameter portion 29B and an air inlet 29C. Short-diameter portion 2 shown in FIG. 8B
The diameter of 9A is slightly larger than the diameter of the shaft portion 28 (see FIG. 7). Further, the long diameter portion 29B corresponds to the valve portion 27 (see FIG.
(See) and has substantially the same shape. Further, FIG. 8A
As shown in FIG.
It has a rectangular shape that follows A.

In FIG. 7, the operating portion 26 is lowered downward by the urging force of the spring 24, and the valve portion 27 is the long diameter portion 2.
It is stored in 9B. At this time, there is no step between the curved surface of the valve portion 27 and the R surface of the discharge adapter 20. In this state, when the operating portion 26 is pushed in the X direction, the valve portion 27 projects from the long diameter portion 29B. Accordingly, for example, air can be introduced (opened to the atmosphere) from the outside into the pot 10 that is sealed by the discharge adapter 20.

Returning to FIG. 2, the pressure applying means 30 of the solder supply device 50 is an air cylinder 33 that presses (pushes) the cover 12 (see FIG. 3) described above toward the squeegee block 75, and this air cylinder 33. Mounting arm (an example of a fixing aid) for fixing the discharge adapter 20 at a predetermined height from the squeegee block 75 against the pressing force (pushing force) of
4 and.

The air cylinder 33 has, for example, a pen type (so-called pen cylinder) structure. The air cylinder 33 is provided above the pot 10, and the protruding portion 32A of the air cylinder 33 is detachable from a cover that covers the pot body. Further, as shown in FIG. 2, the air cylinder 33 is provided with air supply means 35. The air supply means 35 includes a tube 35A connected to the air cylinder 33 and an air cylinder 33.
Regulator 35B for adjusting the pressure of the air supplied to the
And an electromagnetic valve 35C for turning on / off the supply of air to the air cylinder 33.

The solder supply apparatus 50 is equipped with a control section 51 for controlling the operation of the air cylinder 33 and the like. The control unit 51 includes the squeegee block 7 described above.
A predetermined detection signal is supplied from the remaining amount sensor 72 of No. 5.
Further, a control signal is supplied from the control unit 51 to the solenoid valve 35C in response to the detection signal and the like.

As shown in FIG. 9, the control section 51 has a control panel 52. A switch 52A for selecting a cream solder supply mode to the squeegee block is provided on the left side of the control panel 52.

By operating this switch 52A, it is possible to select whether to supply the cream solder off (OFF), automatically (automatic mode), or manually (manual mode).

On the right side of the control panel 52, there is provided a switch 52B for setting the supply time of the cream solder per time. This switch 52
By arbitrarily operating B, the opening time of the solenoid valve is determined. For example, by operating this switch 52B, the opening time of the solenoid valve is set to 1 minute, 2 minutes, 3 minutes, 4 minutes.
It can be set to either minutes, 5 minutes, or automatic mode. For example, if the switch 52B is used to select the automatic mode, the solenoid valve is automatically closed and the supply of the cream solder is stopped when the cream solder in the squeegee block reaches a predetermined amount.

Next, an example of use of the solder printing machine 100 will be described. 10 and 11 show the solder printer 10.
It is a conceptual diagram which shows the operation example (No. 1, 2) of 0. Figure 10
As shown in A, first, the pot main body 11 containing the kneaded cream solder H is prepared. As described above, as the pot main body 11, the standard type delivered from the manufacturer is used as it is. The kneading of the cream solder is performed using a known kneading machine.

Next, as shown in FIG. 10A, the pot body 11 is housed in a cover 12, and the pot body 11 is placed.
And the cover 12 are engaged with each other using the ring 13. At this time, as shown in FIG. 4, the eaves portion 13A of the ring 13 is
The lock claw portion 12A of the cover 12 is put in the groove portion provided in, and then the cover 12 is rotated with respect to the ring 13. As a result, the lock claw portion 12A becomes the eaves portion 13
It is made to hang on A.

Then, as shown in FIG. 10A, the discharge adapter 20 is fitted (fitted) into the opening side of the pot body 11. Around this, one of the mounting arms 34 is attached to the outer surface (the upper surface in FIG. 10A) of the discharge adapter 20.

In this state, as shown in FIG. 10B, the pot 10, the discharge adapter 20, and the mounting arm 34 are turned upside down, and the other side of the mounting arm 34 is mounted and fixed to the squeegee guide 42 on the printer body side. . The connection part 45 shown in FIG. 11A is used to fix the mounting arm.
Further, using this connecting portion 45, the squeegee block 75
To the squeegee guide 42. As a result,
As shown in FIG. 1A, the mounting arm 34, the squeegee guide 42, and the squeegee block 75 are integrated. Further, as shown in FIG. 11A, the protrusion 38 of the air cylinder 33 is attached to the bottom of the cover 12.

Next, the control panel 5 shown in FIG.
The second switch 52A is switched from OFF to the automatic mode to start the solder supply device 50. Further, the switch 52B is set to the automatic mode. Then, the control unit 51 shown in FIG. 2 confirms the remaining amount of the cream solder H in the squeegee block 75. If squeegee block 75
If the remaining amount of cream solder H in the inside is insufficient,
The solenoid valve 35C is opened by the control unit 51.

Then, as shown by the arrow in FIG. 11A, the projection 38 of the air cylinder 33 projects toward the squeegee block 75. As a result, the bottom portion of the pot body 11 (upper surface in FIG. 11A) is pushed by the bottom portion of the cover 12 (upper surface in FIG. 11A), and the pot body 11 also moves to the squeegee block 75 side.

On the other hand, the discharge adapter 20 shown in FIG.
Since the position (height) with respect to is fixed, the distance between the discharge adapter 20 and the bottom of the pot body 11 is shortened. Due to the reduction in the distance between the discharge adapter 20 and the bottom of the pot 10, the cream solder H in the pot 10 is pressed.

Then, as shown in FIG. 11B, the cream solder H in the pot 10 depends on the pressing force of the air cylinder 33 and the weight of the cream solder H itself.
The discharge adapter 20 discharges the squeegee block 75. The pressing force at this time is, for example, about 5 kg / cm ² .

In this manner, when the cream solder H is supplied from the pot 10 to the squeegee block 75 and the remaining amount of the cream solder H in the squeegee block 75 reaches a predetermined amount, the remaining amount sensor provided in the squeegee block 75. From 72 to the control unit 51 of the solder supply device 50 (see FIG. 2)
Is supplied with a predetermined detection signal. Then, in response to the detection signal, the control unit 51 performs a control operation to close the solenoid valve 35C (see FIG. 2). In this way, the cream solder H is automatically supplied to the squeegee block 75.

By repeating such automatic supply,
When the cream solder H in the pot 10 is exhausted, the mounting arm 34 is removed from the printer main body 60, and then the ejection adapter 20 and the pot 10 are manually separated. At this time, the operating portion 2 of the air releasing portion 25 shown in FIG.
By pressing 6 against the biasing force of the spring 24,
Since air can be introduced between the discharge adapter 20 and the pot body 11 (atmosphere can be opened to the atmosphere), the discharge adapter 20 can be easily removed.

As described above, according to the solder supply device 50 of the embodiment of the present invention, the oblong solder discharge port 21 is provided.
The pressure applying means 30 that presses the pot 10 into which the discharge adapter 20 having the above is inserted to the discharge adapter 20 side and supports the discharge adapter 20 against the pressing force.
The squeegee block 7 constituting the printing machine main body 60 is provided with the pot 10 that is provided with the pressure applying means 30.
The discharge adapter 20, which is arranged directly above 5 and is supported against the pressing force, is directed toward the squeegee block 75.

Therefore, since both the weight of the solder paste H and the pressing force can be applied (added) to the discharge adapter 20, the solder in the pot 10 is discharged from the discharge port of the discharge adapter 20 with a slight pressing force. be able to.
Further, the solder discharged from the discharge port of the discharge adapter 20 can be dropped toward the squeegee block 75. As a result, the cream solder H can be easily and automatically supplied to the squeegee block 75, which can greatly contribute to the automatic supply of the cream solder.

In this embodiment, the pressure applying means 30
The case where the air cylinder 33 is used has been described above.
A motor may be used instead of the air cylinder 33.

In this case, a power supply means is connected to this motor. Compared with the case where the air cylinder 33 is used,
Since the pot 10 can be pulled back to the opposite side (that is, the upper side) of the squeegee block 75, the discharge adapter 20 and the pot 10 can be automatically separated after the supply of the cream solder is completed.

The solder printing machine 100 is not limited to the squeegee block method described above. The solder printing machine 100 may be a general printing apparatus as shown in FIG. 12, for example. In this case, the supply target becomes the mask plate 70. As shown in FIG. 12, this solder printer 1
00 is not squeegee block 75, but squeegee 175
A and 175B. These squeegees 175
A and 175B are brushes for applying the cream solder H to the mask plate. As shown in FIG. 12, these squeegees 175A and 175B are fixed to the squeegee guide 42.

The solder printing machine 100 also includes actuators 180A and 180B for moving up and down the squeegees 175A and 175B, respectively. As shown in FIG. 12, these actuators 18
0A and 180B are fixed to the squeegee guide 42. These actuators 180A and 180B are
It is controlled by the control unit 80.

In the solder printing apparatus 100 shown in FIG. 12, the cream solder H discharged from the solder supply device 50 is supplied onto the mask plate 70. Then, for example, the cream solder H supplied on the mask plate 70 is D
When squeezing in one direction, squeegee 175A
Only are dropped onto the mask plate 70. On the contrary, the cream solder H supplied on the mask plate 70 is added to D2.
When applying in the direction, only the squeegee 175B is lowered onto the mask plate 70.

A solder printing apparatus 10 as shown in FIG.
Also in 0, the cream solder H can be automatically supplied onto the mask plate 70 by including the solder supply device 50 described above. Further, the air pressure required for automatically supplying the cream solder H can be as low as about 5 kg / cm ² .

(2) Embodiment Next, a solder supply device 150 according to an embodiment of the present invention will be described. FIG. 13 is a conceptual diagram showing a configuration example of the solder printer 150. Here, the above-mentioned discharge adapter 2
Assume a case where a short tube (an example of a pipe member) 110 extending from the discharge adapter 20 to the squeegee block 75 is provided at the discharge port 0 (hereinafter, also referred to as a first discharge port). Other conditions are the same as those in the above-described embodiment. Therefore, the same reference numerals as those in the embodiment have the same functions, and the description thereof will be omitted.

As shown in FIG. 13, this solder supply device 150 has one end fitted into the first discharge port 21 of the discharge adapter 20 and the second discharge port 11 having an oblong shape at the other end.
It has a short tube 110 with 0A. The discharge port 110A of this short tube 110 has a squeegee block 7
It is located within 5.

The short tube 110 is made of, for example, tetrafluoroethylene which is colorless and transparent or semitransparent and has flexibility. Since the short tube 110 is colorless and transparent or translucent, the delivery status of the cream solder in the short tube 110 can be confirmed. The length of the short tube 110 is, for example, about 50 mm, and the inner diameter is about 8 mm.

As shown in FIG. 13, this short tube 11
0, the discharge adapter 20, and the pot 10 are provided right above the squeegee block 75. Also in the solder supply device 150, the ejection adapter 20 is maintained at a predetermined height from the squeegee block 75 by the mounting arm 34, as in the solder supply device 100 described above.
When only the pot 10 is pressed against the discharge adapter 20 in the direction of the squeegee block 75, the cream solder H in the pot main body 11 is discharged from the discharge port 21 of the discharge adapter 20 by its own weight and pressing force. 1
10 is discharged.

Compared with the solder supply device 50 described in the embodiment, this solder supply device 150 can reduce the chances of contact between the cream solder H discharged from the discharge port and the air, and therefore lead-free solder can be squeegee-blocked in particular. 75, or when it is supplied onto the mask plate 70, it can contribute to the prevention of oxidation of the cream solder H.

Further, unlike the solder supply device 50, the pot 10 does not necessarily have to be located right above the squeegee block 75. For example, it is possible to dispose the pot 10 above the printing machine main body 60, which is separated from the squeegee block 75. Therefore, the mounting position of the solder supply device 150 can be set freely to some extent.

Furthermore, if the shape of the opening 110A at the tip of the short tube 110 is formed into a slit shape, the solder is cut off well at the tip of the short tube 110.
This point will be described later. As a means for forming the opening 110A of the short tube 110 into a slit shape, FIG.
As shown in FIG. 4A, using the metal fitting 155, the short tube 11
There is a method of crushing the tip of 0 to a certain width. The shape of the opening 110A shown in FIG. 14B is, for example, an oval shape having a length × width = 12 mm × 2 mm.

Further, as shown in FIG. 15A, an adapter 160 having a slit-shaped opening is attached to the short tube 1
You may attach to the front-end | tip part of 10. The shape of the opening 160A of the adapter 160 shown in FIG. 15B is, for example, an oval shape having a length × width = 12 mm × 3 mm.

The solder supply device 150 described in this embodiment may be attached to the printing machine main body 60 to form a solder printing machine. The solder printing machine provided with the solder supply device 150 can also obtain the same effects as the solder printing machine 100 described in the embodiment.

(3) Comparative Example By the way, the present inventor conducted the following experiments on the relationship between the shape of the discharge port of the discharge adapter and the breakage of the solder, and the relationship between the opening area of the discharge port and the solder discharge amount. The effect was verified.

(A) Relationship between ejection port shape and solder breakage FIGS. 16A and 16B are tables showing the relationship between the ejection port shape and solder breakage. The experimental results shown in FIGS. 16A and 16B show that the short tube A (inner diameter 8 m) has a round discharge port.
m, tube length 50 mm), and a short tube B (slit shape 12 m) having an oblong (slit) type discharge port.
m × 2 mm, tube length 50 mm) are respectively prepared, these short tubes are attached to the above-mentioned discharge adapters 20, these discharge adapters 20 are respectively inserted into pots (capacity 500 g), and the pots are lowered. It was obtained by pushing in the direction of 5 kg / cm ² for 2 seconds.

The cream solder used in the experiment of FIG. 16A is TCS-302-290S manufactured by Tarchinkester.
F (an example of leaded solder). The cream solder used in the experiment of FIG. 16B is SA-2515 (an example of lead-free solder) manufactured by Tarchinkester. FIG. 16A
The numerical data in 16B and 16B indicate the time (seconds) required for the cream solder to separate from the discharge port. According to this, in both the leaded solder and the lead-free solder, the short tube B is The time required for cutting was short.
In particular, in the experiment using the lead-free solder, the break time of the cream solder in the short tube B was 13.7 seconds on average, whereas the break time of the cream solder in the short tube A was all 2 minutes or more. there were.

From these results, it was confirmed that the breakage of the cream solder can be improved by forming the ejection port into an oblong (slit) shape instead of a round shape. In addition, with leaded solder (FIG. 16A) and lead-free solder (FIG. 16B),
The break times of the cream solder differ greatly, which is considered to be due to the difference in the thixotropy ratio and the viscosity of both cream solders.

(B) Relationship between Opening Area of Discharge Port and Solder Discharge Amount FIG. 17 is a table showing the relationship between the opening area of the discharge port and the solder discharge amount. The experimental result shown in FIG. 17 shows that an oblong (slit) type ejection port is divided into two ejection adapters A (each divided slit has a shape of length 4.5 mm × width 2).
mm) and an ejection adapter B having an oblong (slit) type ejection port (the shape of the slit is 10 mm in length × 2 m in width)
m) and the discharge adapters are set in a pot (capacity: 500 g), and then the pot is pushed downward with a force of 3 kg / cm ² for 2 seconds. The numerical data in FIG. 17 shows the amount (g) of cream solder discharged from the discharge port. The cream solder used in the experiment of FIG. 17 is SA-2515 manufactured by Tarchinkester.

According to this, both the discharge adapters A and B are 2 g under the pressing condition of 3 kg / cm ² and 2 sec (second).
It was found that a certain amount of discharge can be secured. Therefore, it was found that the solder supply devices 50 and 150 and the solder printer 100 described above can be sufficiently used in the production line having an air supply pressure of about 5 kg / cm ² .

The discharge amount of the discharge adapter B is larger than that of the discharge adapter A by about 0.3 g on average. Therefore, it was found that when the shape of the ejection port is the same, the ejection amount of the solder depends on the opening area of the ejection port.

[0092]

As described above, according to the solder supply apparatus of the present invention, the storage container, into which the lid having the discharge port of a predetermined shape is inserted, is pushed toward the lid and the lid is closed. A pressure-applying means for supporting the portion against the pressing force, the storage container pressed by the pressure-applying means is disposed right above the supply target, and the lid portion supported against the pressing force is the cover portion. It is directed towards supplies.

With this structure, both the weight of the fluid-like solder and the pressing force can be applied to the lid portion.
The solder in the storage container can be discharged from the discharge port of the lid with a slight pressing force. Further, the solder discharged from the discharge port of the lid can be dropped toward the supply target. Therefore, the fluid-like solder can be easily and automatically supplied to the supply target, which can greatly contribute to the automatic supply of solder.

Further, according to the solder printer according to the present invention, a printing device for selectively applying a fluid-like solder to an object to be printed to print a solder pattern, and a solder for supplying the solder to the printing device. This solder printing apparatus is composed of a supply device, and presses the storage container in which the lid having the discharge port of a predetermined shape is inserted into the lid and presses the lid against the pressing force. The storage container which is provided with the applying means and is pressed by the pressure applying means is arranged directly above the printing apparatus, and the lid portion which is supported against the pressing force is directed to the printing apparatus.

With this structure, both the weight of the fluid-like solder and the pressing force can be applied to the lid portion.
The solder in the storage container can be discharged from the discharge port of the lid with a slight pressing force. Further, the solder discharged from the discharge port of the lid can be dropped toward the printing device. Therefore, the solder supply system of the solder printing machine can be inexpensively automated, and the productivity (production efficiency) of the solder printing process can be improved.

The present invention is extremely suitable when applied to a printing machine or the like for selectively applying cream solder to a printed board to form a solder pattern.

[Brief description of drawings]

FIG. 1 is a conceptual diagram showing a configuration example of a solder printing machine 100.

FIG. 2 is a conceptual diagram showing a configuration example of a solder supply device 50.

FIG. 3 is a cross-sectional view showing a configuration example of a pot 10.

FIG. 4 is a perspective view showing an example of hooking a cover 12 and a ring 13.

5A and 5B are a plan view showing a configuration example of a discharge adapter 20 and a cross-sectional view taken along arrow X1-X2.

FIG. 6 is a plan view showing another example of the discharge port 21.

FIG. 7 is a cross-sectional view showing another example of the discharge adapter 20.

8A and 8B are a plan view and an X3-X4 arrow cross-sectional view showing a configuration example of an opening 29. FIG.

FIG. 9 is a plan view showing a configuration example of a control panel 52.

10A and 10B are process diagrams showing a usage example (1) of the solder printing machine 100.

11A and 11B are process diagrams showing a usage example (No. 2) of the solder printing machine 100.

FIG. 12 is a conceptual diagram showing another configuration example of the solder printing machine 100.

FIG. 13 is a cross-sectional view showing a configuration example of a solder supply device 150.

14A and 14B are a side view and a bottom view showing a configuration example of the short tube 110.

15A and 15B are a side view and a bottom view showing a configuration example of an adapter 160.

16A and 16B are tables showing the relationship between the shape of a discharge port and the breakage of solder.

FIG. 17 is a table showing a relationship between an opening area of a discharge port and a solder discharge amount.

FIG. 18 is a conceptual diagram showing a configuration example of a solder printer 190 according to a conventional example.

FIG. 19 is a conceptual diagram showing a configuration example of a solder supply machine 90 according to a conventional example.

[Explanation of symbols]

10 ... Pot (an example of a storage container), 20 ... Discharge adapter (an example of a lid part), 21 ... Discharge port, 30 ...
.Pressure applying means, 50, 150 ... Solder supply device,
100 ... Solder printer, 110 ... Short tube

Claims (10)

[Claims] 1. A solder supply device for supplying a fluid-like solder to an object to be supplied, comprising: an accommodating container having an opening for accommodating the solder; and an accommodating container having a discharge port of a predetermined shape. A lid fitted into the opening of the container, and a pressure applying means for pressing the storage container fitted with the lid toward the lid and supporting the lid against the pressing force. The storage container pressed by the pressure applying means is arranged directly above the supply target, and the lid portion supported against the pressing force is directed toward the supply target. Solder supply device. 2. The pressure applying means supports an air cylinder that presses the bottom of the storage container toward the supply target, and a lid part that is fitted into an opening of the storage container that is pressed by the air cylinder. The solder supply device according to claim 1, further comprising a fixing auxiliary tool that fixes the lid portion at a predetermined height from the supply target. 3. The solder supply device according to claim 1, wherein the surface of the lid portion on the storage container side is inclined toward the ejection port of the lid portion. 4. The solder supply device according to claim 1, wherein the lid portion has an atmosphere opening portion that selectively introduces air into a container into which the lid portion is fitted. 5. The solder supply device according to claim 1, wherein the ejection port of the lid has an oval shape. 6. The solder supply device according to claim 1, further comprising a seal member provided between the outer peripheral surface of the lid portion and the inner peripheral surface of the storage container to seal the gap therebetween. 7. A pipe member having one end fitted into the first discharge port and a second discharge port having a predetermined shape at the other end, when the discharge port of the lid portion is the first discharge port. The solder supply device according to claim 1, further comprising: a second discharge port of the pipe member, which is directed toward the supply target. 8. The solder supply device according to claim 7, wherein the pipe member is colorless and transparent or translucent and has flexibility. 9. The solder supply device according to claim 7, wherein the shape of the second discharge port of the pipe member is an oval shape. 10. A printing machine comprising a printing device for selectively applying a fluid-like solder to an object to be printed to print a solder pattern, and a solder supply device for supplying the solder to the printing device. The solder supply device includes an accommodating container having an opening for accommodating the solder, a lid having a discharge port of a predetermined shape and fitted into the opening of the accommodating container, and the lid fitted. The inserted storage container is provided with a pressure applying unit that presses the storage unit toward the lid and supports the lid against the pressing force, and the storage container pressed by the pressure applying unit is directly above the printing apparatus. The solder printing machine is characterized in that the lid portion, which is disposed on the printer and is supported against the pressing force, faces the printing apparatus.