JP2003344309A - Method of setting parameter for inspection equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To set parameters optimal for inspection readily. <P>SOLUTION: Any one of an over detection-suppressing mode or a detection mode of not yet detected defects is specified, and when the over detection- suppressing mode is specified, parameters corresponding to the feature amount at false defect parts, not required to be detected, among candidates of defect part are determined and candidates of defect part other than those being detected by these parameters are then extracted. On the other hand, when the detection mode of not yet detected defects is specified, parameters corresponding to the feature amount at defect parts, required to be detected, among candidates of defect part are determined and all defect parts being detected by these parameters are extracted. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a parameter setting method for an inspection apparatus, which sets parameters for detecting a defect candidate portion according to a feature amount of a defect candidate portion to be inspected such as a printed circuit board.

[0002]

2. Description of the Related Art A printed circuit board visual inspection apparatus illuminates a printed circuit board so that the contrast of a defective portion is emphasized, and an image of the printed circuit board is acquired by, for example, a line sensor camera while transporting the printed circuit board. Then, the image data is subjected to image processing to detect a defective portion.

This defect inspection is based on, for example, a threshold method for detecting a defective portion by setting a threshold value for luminance on image data, an area method for detecting a defective portion by setting a threshold value for the area of the defective portion, and a shape. This is performed by various inspection methods such as a chip inspection method for detecting a defective portion and detecting it as a defective portion.

In these defect inspections, it is necessary to set a threshold value (generally referred to as a parameter hereinafter) for the feature amount of the defective portion such as brightness and area. The setting of this parameter is performed in a temporary inspection before the defect inspection of the printed circuit board.

In this temporary inspection, a plurality of defect candidate portions are detected on the surface of the printed board. These defect candidate parts include
Pseudo-defects such as defect candidate parts that can be resolved by wiping off dust or the like and defect candidate parts that do not affect the operation of the printed circuit board are also included.

Therefore, in the parameter setting, a parameter value is set so that these pseudo defects are not detected, and in order to detect this defect candidate portion for the defect candidate portion that affects the operation of the printed circuit board. A parameter value is set according to the feature amount of the defect candidate portion.

[0007]

However, the parameters are set by setting the parameters for each of a plurality of inspection methods for detecting defect candidate portions on the surface of the printed circuit board, and by setting each area on the surface of the printed circuit board. You have to set each parameter separately, and also set multiple parameters for each inspection method,
The parameter setting work is complicated.

Moreover, the operator who sets the parameter cannot set the parameter without knowing what kind of parameter is used by what inspection method.

Therefore, an object of the present invention is to provide a parameter setting method for an inspection apparatus, which can easily set optimum parameters for inspection.

[0010]

According to the present invention, there is provided a parameter setting method for an inspection apparatus for setting a parameter for detecting a defect candidate portion of an inspection target detected by the inspection apparatus according to a feature amount of the defect candidate portion. In step 1, the first step of designating a mode for setting a parameter corresponding to the feature amount of the pseudo defect portion which does not need to be detected among the defect candidate portions detected by the inspection apparatus, and this mode is designated. At this time, when a pseudo defect portion is selected and instructed on the display screen on which the inspection target is displayed, a second step of determining a parameter corresponding to the feature amount of the pseudo defect portion and detection by the determined parameter are performed. And a third step of extracting a defect candidate portion excluding the pseudo-defect portion, the parameter setting method of the inspection apparatus.

The present invention provides a parameter setting method for an inspection apparatus, which sets a parameter for detecting the defect candidate portion according to the feature amount of the defect candidate portion of the inspection target detected by the inspection apparatus. The first step of designating the mode for setting the parameter corresponding to the feature amount of the main defective portion to be detected among the defect candidate portions to be detected, and the inspection target is displayed when the mode is designated. When a main defect portion is selected and instructed on the display screen, a second step of determining a parameter corresponding to the feature amount of the main defect portion and a third step of extracting all the main defective portions detected by the determined parameter And a parameter setting method for the inspection apparatus.

The present invention provides a parameter setting method for an inspection apparatus, which sets a parameter for detecting the defect candidate portion in accordance with the feature amount of the defect candidate portion of the inspection target detected by the inspection apparatus. A first mode for setting a parameter corresponding to a feature amount of a pseudo defect portion that does not have to be detected among the defect candidate portions to be detected,
Alternatively, the first step of designating any one of the second modes for setting the parameter corresponding to the feature amount of the main defect portion to be detected among the defect candidate portions, and when the first mode is designated, When a pseudo defect portion is selected and instructed on the display screen on which the inspection target is displayed, a second step of determining a parameter corresponding to the feature amount of the pseudo defect portion, and a pseudo defect detected by the determined parameter. When the third step of extracting the defect candidate portion excluding the parts and the second mode is designated and the main defect portion is selected and instructed on the display screen on which the inspection target is displayed, The method has a fourth step of determining a parameter corresponding to the feature amount and a fifth step of extracting all the defective portions detected by the determined parameter. A parameter setting method for inspecting device according to.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is an overall configuration diagram of a printed circuit board appearance automatic inspection device to which the parameter setting method of the inspection device of the present invention is applied. The inspection unit 1 has a loader unit 2 and an unloader unit 3 arranged in parallel.

The loader section 2 has an uninspected printed circuit board 4
A cassette 5 for accommodating a number of 1 in a rod unit and a loader transport unit 6 are provided. The loader carrying unit 6 has a function of taking out the printed circuit boards 4 housed in the cassette 5 one by one and carrying the printed circuit boards 4 into the inspection unit 1 for setting. The loader transport unit 6
Is sucked and conveyed by the head portion 6a.

As shown in FIG. 2, the printed circuit board 4 has a plurality of pieces 4a, for example, 20 to 50 pieces, and is multi-chambered. Each of these pieces 4a is provided with a plurality of bonding pads 4b.

In the unloader section 3, a non-defective cassette 7 for accommodating the printed circuit board 4 determined to be non-defective according to the inspection result of the inspection section 1 and a defective product cassette for accommodating the printed circuit board 4 determined to be defective. 8 and an unloader transport unit 9 are provided. The unloader transport unit 9 discharges the printed circuit board 4 that has been inspected by the inspection unit 1 from the inspection unit 1,
According to the inspection result of the inspection unit 1, the good printed circuit board 4 is stored in the good product cassette 7, and the defective printed circuit board 4 is stored.
Is stored in the defective product cassette 8. The unloader transport unit 9 sucks and transports the printed circuit board 4 by the head unit 9a.

The inspection unit 1 is provided with a position detection sensor 10 for detecting the posture of the printed circuit board 4 conveyed into the inspection unit 1 by the loader conveyance unit 6.

The XYθ stage 11, on which the printed circuit board 4 is mounted, is movable in the X and Y directions and rotatable in the θ direction. Further, when the printed circuit board 4 carried by the loader carrying section 6 is placed on the XYθ stage 11, the XYθ stage 11 receives the attitude signal output from the position detection sensor 10 to change the attitude of the printed circuit board 4. It has a function of correcting the posture by moving in the X direction, the Y direction and the θ direction so as to have a predetermined posture.

An illumination device 12 and an image pickup device 13 are provided above the XYθ stage 11. Lighting device 12
The ring illumination is performed so as to emphasize the contrast of the defective portion of the printed circuit board 4. The imaging device 13 images the illuminated printed circuit board 4 and outputs the image signal. An image processing unit 14 is connected to the imaging device 13.

The operation of the inspection unit 1 is controlled by a personal computer (transport PC) not shown.

A user interface personal computer (hereinafter abbreviated as user computer) 15 is connected to the image processing unit 14. The image processing unit 14 receives an instruction from the user computer 15 and inputs an image signal output from the image pickup device 13 and stores the image signal as image data. The image data is image-processed to detect a defective portion on the printed circuit board 4. Have the function to

This defect inspection is based on, for example, a threshold method for detecting a defective portion by setting a threshold value for luminance on image data, an area method for detecting a defective portion by setting a threshold value for the area of the defective portion, and a shape. This is performed by various inspection methods such as a chip inspection method for detecting a defective portion and detecting it as a defective portion.

A display 16 is connected to the user computer 15. This user computer 15
Has a function of setting a parameter for detecting the defect candidate portion according to the feature amount of the defect candidate portion of the printed circuit board 4 detected by the image processing unit 14 in the temporary inspection. An over detection suppression mode unit 18, an undetected mode unit 19, and a feature amount extraction unit 2
Has 0 and.

The mode designation unit 17 is used in the image processing unit 1
4, an over detection suppression mode (first mode) for setting a parameter corresponding to a feature amount of a defect candidate portion (hereinafter, referred to as a pseudo defect portion) that may not be detected among the defect candidate portions detected by 4. Alternatively, one of the detection modes (second mode) of the undetected defect in which the parameter corresponding to the feature amount of the defect candidate portion to be detected (hereinafter referred to as the main defect portion) among the defect candidate portions is set is designated. Have the function of promoting

More specifically, the mode designating section 17 outputs the selection dialog W ₁ shown in FIG. 3 on the display screen of the display 16 and suppresses overdetection (clicking with the pointer P or operating the keyboard). When the button b ₁ of the detection suppression mode) or the button b ₂ of the detection of the undetected defect (detection mode of the undetected defect) is instructed, the over detection suppression mode or the detection mode of the undetected defect is designated.

The over detection suppression mode unit 18 has a function of determining a parameter corresponding to the feature amount of the pseudo defect portion when the mode specification unit 17 specifies the over detection suppression mode. The over-detection suppression mode unit 18 is a parameter corresponding to a characteristic amount of a pseudo defect portion that is not treated as a defect, for example, a problem that can be solved by wiping off dust or the like, or a pseudo defect portion that does not affect the operation of the printed circuit board. To decide.

Specifically, the over-detection suppression mode unit 18 is shown in FIG.
The image of one piece 4a on the printed circuit board 1 obtained by the temporary inspection is displayed on the display screen of the display 16 as shown in FIG. When the defect portion G ₁ is pointed by the pointer P or the like, the defect inspection method and the parameters at that time when the pseudo defect portion G ₁ is detected by the temporary inspection are known from the inspection data from the inspection portion 1. Then, the parameter corresponding to the feature amount of the pseudo defect portion G ₁ is determined.

The undetected defect detection mode unit 19 determines the parameter corresponding to the feature amount of the main defect portion to be detected among the defect candidate portions when the mode designation unit 17 designates the undetected defect detection mode. Have the function to

Specifically, the detection mode section 19 for undetected defects
Displays an image of one piece 4a on the printed circuit board 1 obtained by the preliminary inspection on the display screen of the display 16 as shown in FIG.
When a defect candidate portion observed as a main defect among them, for example, the main defect portion G ₂ is designated by the pointer P or the like, the defect inspection method and the parameters at that time when the main defect portion G ₂ is detected by the temporary inspection are inspected. Since it is known from the inspection data from the portion 1, the parameter corresponding to the feature amount of the main defective portion G ₂ is determined from this inspection data.

The feature quantity extraction unit 20 has a function of extracting the defect candidate portion excluding the pseudo defect portion by the parameter determined by the over detection suppression mode unit 18, and the parameter determined by the detection mode unit 19 of the undetected defect. And a function of extracting the main defective portion detected by. For example, for a defect candidate portion having an area of “50”, if the defect candidate portion is to be detected, the area parameter is determined to be “40”, and if not to be detected, the area parameter is determined to be “60”. Become.

Further, when the user computer 15 is instructed to select a plurality of pseudo defect parts which may not be detected from the defect candidate parts in the over detection suppression mode part 18, the feature amount extraction part 20 is instructed to select them. A function of determining a parameter having a value including the parameters of these pseudo defect portions from among the parameters corresponding to the pseudo defect portions and extracting a defect candidate portion excluding each pseudo defect portion selected and instructed according to the determined parameters. Have. For example, the areas of the three pseudo defect portions are "100" and "90", respectively.
It is "120", and its brightness is "30" and "2", respectively.
If the value is 0 or "10", the parameter that does not detect these pseudo defects is the area "130" and the brightness "40".

The user computer 15 marks on the display screen of the display 16 the defect candidate portion or the main defect portion extracted by either the over-detection suppression mode portion 18 or the undetected defect detection mode portion 19. It has a function to attach.

The user computer 15 adds the display output to the display screen of the display 16 of the defect candidate portion or the main defect portion extracted by either the over-detection suppression mode unit 18 or the detection mode unit 19 of the undetected defect. And has a function of displaying the feature amount of the defect candidate portion or the main defect portion.

Specifically, the user computer 15 is shown in FIG.
The defect portion feature amount dialog W ₂ as shown in (1) is displayed and output on the display screen of the display 16. The defect part feature amount dialog W ₂ has columns for displaying the number of defects, the number of adjusted defects, the defect area, the deviation coefficient, the average brightness, and the determination area. The defect area, the deviation coefficient, the average brightness, and the determination area in the defect portion feature amount dialog W ₂ are sorted in ascending order or descending order in each determination area, for example.

The user computer 15 adds a permissible value to the parameter determined by either the over-detection suppression mode section 18 or the undetected defect detection mode section 19, and the defect candidate section is extracted by this parameter. Have the function to do.

Next, the operation of the apparatus configured as described above will be described with reference to the parameter setting flowcharts shown in FIGS.

When the operator pushes the parameter adjustment tool button of the user computer 15, the user computer 15 receives the push operation of the parameter adjustment tool button in step # 1, and the next step # 2.
At, the selection dialog W ₁ shown in FIG. 3 is displayed on the display screen of the display 16.

The selection dialog W ₁ displays a button b _{1 in the} over detection suppression mode and a button b _{2 in} the detection mode for undetected defects.

When the operator designates the over detection suppression mode button b ₁ using the pointer P on the selection dialog W ₁ , the mode designating section 17 selects the over detection suppression mode in step # 3, and then continues. Then, the process proceeds to step # 4 shown in FIG. 7 to notify the inspection PC of the inspection unit 1 to perform the temporary inspection.

In this temporary inspection, several sheets from the cassette 5 are
For example, five printed circuit boards 4 are sequentially transported by the loader transporting section 6 into the inspection section 1 and placed on the XYθ stage 11. The position of the printed circuit board 4 placed on the XYθ stage 11 is detected by the position detection sensor 10. The XYθ stage 11 includes the position detection sensor 1
In response to the attitude signal output from 0, the attitude of the printed circuit board 4 is corrected by moving in the X direction, the Y direction and the θ direction so that the attitude of the printed circuit board 4 becomes a predetermined attitude.

The illumination device 12 performs ring illumination so that the contrast of the defective portion of the printed circuit board 4 is emphasized.

The image pickup device 13 sequentially picks up images of the respective pieces 4a on the illuminated printed circuit boards 4 and outputs the image signals. The image processing unit 14 receives an instruction from the user computer 15 and inputs each image signal output from the imaging device 13 and stores the image signal as image data.

The several printed circuit boards 4 conveyed from the cassette 5 during the temporary inspection are returned to the cassette 5 before the subsequent main inspection.

Next, the user computer 15 is
Stored in the image processing unit 14 in
The image data of the printed circuit board 4 is read out, for example, as shown in FIG.
As shown in 1, all defect candidates on the printed circuit board 4
On the other hand, each circular mark G₁~ G ₆With display 1
Display on the screen of 6. Note that FIG. 11 shows the printed circuit board 4
It is a partial image of each piece 4a above.

Next, in step # 6, the user computer 15 overlay-displays an adjustment dialog on the screen of the display 16 with the message "Please specify a defect candidate part (pseudo defect part) that you do not want to detect". .

The operator moves the pointer P on the screen of the display 16 to set the circular mark G ₁ attached to the defect candidate portion judged to be a pseudo defect among the defect candidate portions to 1
If one is selected, the over-detection suppression mode unit 18 of the user computer 15 displays the over-detection suppression adjustment dialog W ₄ shown in FIG.
Overlay display on the screen of 6.

This adjustment dialog W_FourThe inspection method
Block B of inspection mode selection for selection₁And pre
The inspection area is selected for each piece 4a on the printed circuit board 4.
Block B for inspection area selection for_TwoAnd save parameters
Confirm button B for performing _ThreeAnd are displayed.

The user computer 15 also detects the number of defects as shown in FIG. 5, the number of defects after adjustment, the defect detection method corresponding to the pseudo defect portion (mark G ₁ ) designated by the pointer P, and the feature amount (defect area, A defect part feature amount dialog W ₂ having a deviation coefficient, an average brightness) and a determination region is output as an overlay display on the display screen of the display 16.

Next, in step # 9, the over-detection suppression mode unit 18 determines the defect inspection method for detecting the pseudo defect portion with the circular mark G ₁ and the parameters at that time from the inspection data from the inspection unit 1. Therefore, the parameter corresponding to the feature amount of the pseudo defect portion of the circular mark G ₁ is determined from this inspection data.

Next, the feature quantity extraction unit 20 determines in step # 1.
0, the circular mark G is determined by the parameters determined by the over detection suppression mode unit 18 from all the defect candidate parts.
_The remaining defect candidate portions excluding the pseudo defect portion ₁ and the defect candidate portion having a parameter value of the pseudo defect portion or less are extracted. For example, when the area parameter “50” is determined, the defect candidate portions having the area parameter “50” or less are not extracted as pseudo defects, but the defect candidate portions having the area parameter “50” or more are extracted.

In step # 7, the pseudo defect portion of _one circular mark G ₁ is instructed to be selected. However, when a plurality of defect candidate portions are instructed to be selected as pseudo defects, the feature amount extraction unit 20 causes these to be selected. A parameter having a value including the parameters of these pseudo-defects is determined from among the parameters corresponding to the pseudo-defects instructed to be selected. For example, the areas of the three pseudo defect portions are “100”, “90”, and “1”, respectively.
20 "and the brightnesses thereof are" 30 "and" 20 ", respectively.
If the value is "10", the parameter that does not detect these pseudo defects is the area "130" and the brightness "40".

Then, the feature quantity extraction unit 20 extracts the remaining defect candidate portions excluding the pseudo defect portions selected and instructed according to the determined parameters and the defect candidate portions having the parameter value of the pseudo defect portion or less.

If the user computer 15 adds a permissible value to the parameters determined by the over-detection suppression mode section 18 and extracts a defect candidate section from the parameters to which the permissible values have been added, the image noise of the image can be reduced. Etc. will not be affected.

Next, the user computer 15 changes the display color of the circular mark attached to each defect candidate portion extracted by the parameter determined by the over detection suppression mode portion 18 to, for example, yellow or red.

Next, in steps # 12 and # 13,
The pointer P on the display screen of the display 16 is moved with the mouse to select the defect candidate portion in which the display color of the circular mark is changed, and subsequently, the confirmation button B ₃ of the adjustment dialog W ₄ shown in FIG. When pressed, the user computer 15 causes the defect candidate portion extracted by the parameter corresponding to the feature amount of the defect candidate portion G ₁ instructed by the over detection suppression mode portion 18, for example, the defect candidate portion as shown in FIG. Display G ₂ , G ₃ , G ₅ and G ₆ 16
Is displayed on the display screen of.

Here, the defect portion feature amount dialog W ₂ shown in FIG. 5 is displayed as an overlay on the defect display screen, and the number of defects for each of the extracted defect candidate portions G ₂ , G ₃ , G ₅ , and G ₆ , The number of adjusted defects, the defect detection method corresponding to the pseudo defect portion (mark G ₁ ) designated by the pointer P, the feature amount (defect area, deviation coefficient, average brightness) and the determination area are displayed and output.

Therefore, this defect portion feature quantity dialog W ₂
It is possible to determine the optimum parameter by changing the parameter in the over detection suppression mode while checking the data such as the number of defects displayed and output on the display.

Next, in step # 15, the user computer 15 judges whether or not one of the "OK" button and the "Cancel" button, which permits to proceed to the registration of the defective portion, has been pressed, If the "Cancel" button is pressed, the parameters are returned to the unadjusted state, and the state before the step # 1 is started.

If the "OK" button is pressed, the user computer 15 proceeds to step # 16 shown in FIG.
It is confirmed that the "cancel" button has been pressed, and that the "OK" button has been pressed in the next step # 17.

Then, the user computer 15 displays "O
If you confirm that the "K" button has been pressed, step # 1
At 8, the parameters are registered.

[OK] button or [Cancel]
If none of the buttons is pressed and the defect candidate portion of the pseudo defect is continuously selected and designated, the parameter corresponding to the pseudo defect portion can be adjusted.

On the other hand, when the detection mode of the undetected defect is instructed in step # 3 shown in FIG. 6, the user computer 15 moves to step # 19 shown in FIG.
Replace all the defect candidate parts with the detected parameters,
In the next step # 20, the inspection PC of the inspection unit 1 is notified to perform the temporary inspection.

At this time as well, similarly to the above, several, for example, five printed circuit boards 4 are successively transported from the cassette 5 into the inspection section 1 by the loader transportation section 6, and these printed circuit boards 4 are imaged by the imaging device 13. The respective image data are stored in the image processing unit 14.

Next, in step # 21, the user computer 15 reads the image data from the image processing unit 14 and, for example, as shown in FIG. 11, with respect to all the defect candidate portions on each piece 4a of the printed circuit board 4. The circular marks G _{1 to} G ₆ are attached and displayed on the screen of the display 16.

Next, in step # 22, the user computer 15 displays an overlay adjustment dialog on the screen of the display 16 with the message "Specify the defect candidate part (main defect part) to be detected".

When the operator moves the pointer P on the screen of the display 16 and designates one defect candidate portion to be detected, for example, a defect portion such as a chip and a defect candidate portion of the circular mark G ₂ to be observed, the user computer 15 The undetected defect detection mode unit 19 of
Similar to the adjustment dialog W ₄ for suppressing excessive detection shown in FIG. 12, an adjustment dialog for undetected defects in which an inspection mode selection block B ₁ , an inspection area selection block B _2, and an enter button B ₃ are displayed. Is overlaid on the screen of the display 16.

Further, the user computer 15 detects the number of defects as shown in FIG. 5, the number of defects after adjustment, the defect detection method according to the main defect portion (mark G ₂ ) designated by the pointer P, and the feature amount (defect area, A defect part feature amount dialog W ₂ having a deviation coefficient, an average brightness) and a determination region is output as an overlay display on the display screen of the display 16.

Next, the undetected defect detection mode section 19
In step # 25, since the parameters of a defect inspection method and the time corresponding to the defective portion of the mark G ₂ indicated by the pointer P and the like can be seen from the test data from the test unit 1, the mark G ₂ from the test data A parameter corresponding to the feature amount of the main defective portion is determined.

In step # 26, the feature quantity extraction unit 20 detects all the defect candidate portions detected by the parameter corresponding to the feature quantity of the main defect portion of the mark G ₂ determined by the detection mode portion 19 for the undetected defect. To extract. For example, when the area parameter "50" is determined, the defect candidate portions having the area parameter "50" or more are extracted as the main defect portion.

At this time, the user computer 15 adds the permissible value to the parameter determined by the detection mode unit 19 of the undetected defect, and extracts the defect candidate part by this parameter. As a result, it is not affected by image noise or the like.

Next, in step # 27, the user computer 15 sets the display color of the circular marks G ₂ of all the defective portions detected by the parameter determined by the detection mode portion 19 of the undetected defect to, for example, yellow. Turns red.

Next, in steps # 28 and # 29,
When the defective portion in which the display color of the circular mark is changed is selected by moving the pointer P on the display screen of the display 16 using the mouse, and then the confirm button B ₃ is pressed, the user computer 15 In step # 30, all the main defect portions detected by the parameters corresponding to the feature amount of the main defect portion of the mark G ₂ instructed by the detection mode portion 19 of the undetected defect, for example, as shown in FIG. Display the defective portions G ₂ , G ₅ , and G ₆ on the display 1
6 is displayed on the display screen.

Here, the defect feature amount dialog W ₂ shown in FIG. 5 is displayed in an overlay on the defect display screen, and the number of defects for each of the extracted defect candidate parts G ₂ , G ₅ , and G ₆ ,
The number of adjusted defects, the defect detection method corresponding to the pseudo defect portion (mark G ₁ ) designated by the pointer P, the feature amount (defect area, deviation coefficient, average brightness) and the determination area are displayed and output.

Therefore, this defect portion feature quantity dialog W ₂
The optimum parameter can be determined by changing the parameter in the detection mode of the undetected defect while confirming the data such as the number of defects displayed and output on the display.

Next, in step # 31, the user computer 15 determines whether or not one of the "OK" button and the "Cancel" button, which permits to proceed to the registration of the defective portion, has been pressed. , If the “Cancel” button is pressed, the parameters will be returned to the unadjusted state,
The start state before step # 1 is set.

If the "OK" button is pressed, the user computer 15 proceeds to step # 16 shown in FIG. 9 and confirms whether the "cancel" button has been pressed, and in the next step # 17. Confirm whether the "OK" button has been pressed.

Then, the user computer 15 displays "O
If you confirm that the "K" button has been pressed, step # 1
At 8, the parameters are registered.

[OK] button or "Cancel"
If none of the buttons is pressed and the defect candidate portion of the main defect is continuously selected and indicated, the parameter corresponding to the main defect portion can be adjusted.

Thereafter, parameters are set for each piece 4a of the printed circuit board 4 shown in FIG.

After that, when either one or both of the parameters of the over detection suppression mode and the undetected defect detection mode are set, the main inspection of the printed circuit board 4 is started.

As described above, in the above-mentioned one embodiment,
When either the over-detection suppression mode or the detection mode for undetected defects is designated, and the over-detection suppression mode is designated, it corresponds to the feature amount of the pseudo defect portion that does not need to be detected among the defect candidate portions. Determining the parameter and extracting the defect candidate part excluding the pseudo defect part by the parameter, while the detection mode of the undetected defect is specified, it corresponds to the feature amount of the main defect part to be detected among the defect candidate parts. Since all the defective parts detected by the parameter to be determined are extracted and the operator who sets the parameter does not need to know what inspection method and what kind of parameter is used, the display 16 On the screen of, the optimum parameters for inspection are automatically calculated by a simple operation of selecting and instructing a defect candidate part to be a pseudo defect part or a main defect part from a plurality of defect candidate parts. It can be set to.

That is, in the over-detection suppression mode, for example, a pseudo-defect portion that can be solved by wiping off dust or the like, or a pseudo-defect portion that does not affect the operation of the printed circuit board 4 and that does not need to be detected. The parameter corresponding to the feature amount can be set, and the parameter corresponding to the feature amount of the defective portion to be detected that affects the operation of the printed circuit board 4 can be automatically set.

In addition, each parameter in the over detection suppression mode or the undetected defect detection mode can be set only by pointing the defect candidate portion with the pointer P on the display screen of the display 16.

Also, the defect part feature amount dialog W shown in FIG.
₂ , the number of defects for the defect candidate portion displayed and output, the number of adjusted defects, the defect detection method according to the pseudo defect portion (mark G ₁ ) designated by the pointer P, and the feature amount (defect area, deviation coefficient, average brightness) The optimum parameters can be determined by changing the parameters in the over-detection suppression mode or the undetected defect detection mode while checking the judgment area and the judgment area.

Therefore, this defect portion feature quantity dialog W ₂
It is possible to determine the optimum parameter by changing the parameter in the over detection suppression mode while checking the data such as the number of defects displayed and output on the display.

Since the allowable value is added to each parameter determined by the over detection suppression mode or the undetected defect detection mode and the defect candidate portion is extracted by this parameter, the influence of image noise or the like is eliminated.

Further, it is possible to confirm and adjust the parameters while selectively changing a plurality of piece images captured in advance.

The present invention is not limited to the above-described one embodiment, and can be variously modified at the stage of implementation without departing from the spirit of the invention.

Further, the above embodiments include inventions at various stages, and various inventions can be extracted by appropriately combining a plurality of disclosed constituent elements. For example, even if some constituent elements are deleted from all the constituent elements shown in the embodiment, the problem described in the section of the problem to be solved by the invention can be solved, and it is described in the section of the effect of the invention. When the effect of being obtained is obtained, a configuration in which this constituent element is deleted can be extracted as an invention.

For example, in the above-described one embodiment, the case where the invention is applied to the inspection of the printed circuit board 4 has been described, but the invention is not limited to this, and various inspection objects that are multifaceted, for example, a plurality of liquid crystal substrates used for a mobile phone are used. It can also be applied to the inspection of arrayed glass substrates.

Further, in the above-described one embodiment, in the temporary inspection, several printed circuit boards 4 are sequentially conveyed from the cassette 5 into the inspection unit 1 to store the image data thereof, and the image data are used to set each parameter. However, the present invention is not limited to this, and each parameter may be set using the image data acquired at that time while the inspection unit 1 performs the inspection.

[0093]

As described in detail above, according to the present invention, it is possible to provide a parameter setting method for an inspection apparatus, which can easily set optimum parameters for inspection.

[Brief description of drawings]

FIG. 1 is an overall configuration diagram of a printed circuit board appearance automatic inspection device to which an embodiment of a parameter setting method for an inspection device according to the present invention is applied.

FIG. 2 is an external view of a printed circuit board in an embodiment of a parameter setting method for an inspection device according to the present invention.

FIG. 3 is a diagram showing a selection dialog in an embodiment of a parameter setting method for an inspection apparatus according to the present invention.

FIG. 4 is a diagram showing designation of defect candidate portions in an overdetection suppression mode or an undetected defect detection mode in an embodiment of a parameter setting method for an inspection apparatus according to the present invention.

FIG. 5 is a diagram showing a defect portion feature amount window in the embodiment of the parameter setting method of the inspection apparatus according to the present invention.

FIG. 6 is a parameter setting flowchart in the embodiment of the parameter setting method of the inspection device according to the present invention.

FIG. 7 is a parameter setting flowchart in one embodiment of the parameter setting method of the inspection device according to the present invention.

FIG. 8 is a parameter setting flowchart in one embodiment of the parameter setting method of the inspection device according to the present invention.

FIG. 9 is a parameter setting flowchart in the embodiment of the parameter setting method of the inspection device according to the present invention.

FIG. 10 is a diagram showing a shooting position dialog in the embodiment of the parameter setting method of the inspection apparatus according to the present invention.

FIG. 11 is a diagram on a display screen showing all the defect candidate portions detected by the temporary inspection in the embodiment of the parameter setting method of the inspection device according to the present invention.

FIG. 12 is a view showing an adjustment dialog for suppressing excessive detection in the embodiment of the parameter setting method for the inspection apparatus according to the present invention.

FIG. 13 is a diagram showing an image of a defect candidate portion obtained from the result of over-detection suppression in the embodiment of the parameter setting method for the inspection apparatus according to the present invention.

FIG. 14 is a diagram showing an image of a defect candidate portion obtained from the result of an undetected defect in the embodiment of the parameter setting method for the inspection apparatus according to the present invention.

[Explanation of symbols]

1: Inspection unit 2: Loader unit 3: Unloader unit 4: Printed circuit board 5: Cassette 6: Loader transport unit 7: Good product cassette 8: Defective product cassette 9: Unloader transport unit 10: Position detection sensor 11: XYθ stage 12 : Illumination device 13: Imaging device 14: Image processing unit 15: User interface personal computer (user computer) 16: Display 17: Mode designation unit 18: Over-detection suppression mode unit 19: Non-detection mode unit 20: Feature amount extraction unit

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 2F065 AA49 AA51 BB02 CC01 CC28                       DD06 FF04 GG17 JJ03 JJ26                       MM03 PP12 PP15 QQ21 QQ24                       QQ25 QQ28 QQ31 RR09 SS02                       SS03 SS13                 2G051 AA65 AB02 CA04 DA03 DA07                       DA08 EA12 EB01 EB02 EC01                       ED08 ED11 ED21                 4M106 AA01 AA02 CA38 DB04 DB19                       DB21 DG01 DG05 DJ04 DJ06                       DJ21 DJ23 DJ26

Claims (8)

[Claims] 1. A parameter setting method for an inspection apparatus, wherein a parameter for detecting a defect candidate portion of an inspection target detected by the inspection apparatus is set according to a feature amount of the defect candidate portion. A first step of designating a mode for setting the parameter corresponding to the characteristic amount of the pseudo defect portion which does not need to be detected among the defect candidate portions, and the inspection step when designated in this mode. When the pseudo defect portion is selected and instructed on the display screen on which the target is displayed, the second step of determining the parameter corresponding to the feature amount of the pseudo defect portion, and the detection by the determined parameter A third step of extracting the defect candidate portion excluding the pseudo defect portion, and a parameter setting method for an inspection device. . 2. A parameter setting method of an inspection device, wherein a parameter for detecting a defect candidate portion of an inspection target, which is detected by the inspection device, is set according to a feature amount of the defect candidate portion, which is detected by the inspection device. The first step of designating a mode for setting the parameters corresponding to the feature amount of the main defect portion to be detected among the defect candidate portions, and the inspection target is displayed when this mode is designated. When the main defect portion is selected and instructed on the display screen, the second step of determining the parameter corresponding to the feature amount of the main defect portion, and the main defect portion detected by the determined parameter. And a third step of extracting all of the above, and a parameter setting method for an inspection device, comprising: 3. A parameter setting method of an inspection device, wherein a parameter for detecting a defect candidate portion of an inspection target detected by the inspection device is set in accordance with a feature amount of the defect candidate portion, which is detected by the inspection device. A first mode for setting the parameter corresponding to the feature amount of the pseudo defect portion that does not need to be detected among the defect candidate portions, or the feature amount of the main defect portion that is desired to be detected among the defect candidate portions. A first step of designating any one of the second modes for setting the parameters corresponding to, and, on the display screen on which the inspection target is displayed, when the first mode is designated. When the pseudo defect portion is selected and instructed, the second step of determining the parameter corresponding to the characteristic amount of the pseudo defect portion, and the determined parameter The third step of extracting the defect candidate portion excluding the pseudo defect portion detected by the above, and the book on the display screen on which the inspection target is displayed when the second mode is designated. When a defective portion is selected and instructed, a fourth step of determining the parameter corresponding to the feature amount of the main defective portion, and a fifth step of extracting all the main defective portions detected by the determined parameter. And a parameter setting method for an inspection device. 4. When a plurality of the pseudo defect portions are selected and selected in the second step, a parameter having a value including the parameters of these pseudo defect portions is determined among the parameters corresponding to these pseudo defect portions, In the third step, the defect candidate part excluding the pseudo defect parts selected and instructed in the second step is extracted according to the parameter determined in the second step. Item 4. A parameter setting method for an inspection device according to item 1 or 3. 5. The inspection apparatus according to claim 1, 2 or 3, wherein the defect candidate portion extracted in the first or second mode is marked on the display screen. Parameter setting method. 6. The feature quantity of the defect candidate portion, in addition to the defect candidate portion extracted in the first or second mode, is displayed on the display screen. Alternatively, the parameter setting method of the inspection device according to the above item 3. 7. The defect candidate portion is extracted by adding an allowable value to the parameter determined by the first or second mode and extracting the defect candidate portion by this parameter. Alternatively, the parameter setting method of the inspection device according to the above item 3. 8. An inspection method when the inspection object is inspected by the inspection apparatus and the defect candidate portion is detected and parameters thereof are stored, and the inspection object is displayed when the first mode is designated. When the pseudo defect portion is selected and instructed on the displayed screen, the parameter corresponding to the feature amount of the pseudo defect portion instructed to be selected is determined from among the stored parameters, When the mode 2 is designated, if the main defect portion is selected and instructed on the display screen on which the inspection target is displayed, the main defect portion instructed to be selected from the stored parameters is selected. 4. The parameter corresponding to the feature amount of is determined.
Parameter setting method of the inspection device described.