JP2003218564A - Parts case and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a parts case having excellent efficiency of cooling heat- generating mounted parts. <P>SOLUTION: This parts case has a structure such that a plurality of partition walls 10b, 10c exist on a flat-finished bottom surface 10f for forming respective spaces for heat-generating parts, and when a shield cover of a prescribed size is capped, each space formed by the partition walls together with the inner face of the shield cover is shielded from the outside. A heat-radiation mechanism in which a plurality of radiator fins are arranged in the same direction is formed on the backside of the positions where the heat-generating parts are mounted. The partition wall 10b, which is thicker than other partition walls 10c and runs across the surface in total, is the main partition wall, and the arrangement direction of the plurality of the fins intersects normal to this main partition wall. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a casing structure for a power amplification unit arranged in a power amplification unit of a mobile phone base station, for example, to efficiently generate heat generated by heat-generating components in the power amplification unit. The present invention relates to a structure of a small, lightweight, and low-cost component housing that can be dissipated and cooled.

[0002]

BACKGROUND OF THE INVENTION A conventional power amplification unit arranged in a power amplification unit of a mobile phone base station is equipped with a plurality of electronic components including a module (heat generation component) that generates heat during operation. Most of these electronic components need to be electromagnetically shielded in order to prevent the influence of external electromagnetic waves.

Conventionally, as shown in FIG. 11, a metal module case 3 for shielding the module M is used.
The module M is mounted in the module 0, the heat dissipation mechanism 40 including a plurality of fins is attached to the outer bottom surface of the module case 20, and the heat dissipation mechanism 40 cools the module M.

However, since the heat dissipation mechanism (fin) 40 is a cast product or an extrusion molded product, the module case 3
There is a limit to how thin the plate thickness and the heat dissipation mechanism (fin) of the part where 0 is attached are. Therefore, there is a problem that the heat generated in the module M cannot be sufficiently dissipated into the air and the heat dissipation effect is not sufficient. Therefore, the transmission power could not be increased above a certain value.

Further, in general, a plurality of power amplification units are arranged to form a power amplification unit in order to secure a large amount of power, so that the device configuration of the entire mobile phone base station is inevitably increased in size, and the operating cost is reduced. There was a problem that I could not afford it. It is known that if the plate thickness of the heat dissipation mechanism 40 in the portion in contact with the module M can be reduced, the heat dissipation effect can be improved, and the power amplification unit and eventually the entire mobile phone base station can be downsized.

An object of the present invention is to provide a small and lightweight component housing capable of efficiently dissipating and cooling the heat generated by a heat generating component to be mounted. Another object of the present invention is to provide an efficient manufacturing method of such a component housing.

[0007]

A component housing of the present invention for solving the above-mentioned problems is a component housing made of metal for mounting a heat-generating component, for example, a component housing made of an aluminum material or its alloy material. A front surface portion and a back surface portion, and the front surface portion has a plurality of partition walls for forming a space for accommodating the heat-generating component on a bottom surface formed into a substantially flat shape, and a shield cover of a predetermined size. When the cover is covered, the accommodation space formed by the inner surface of the shield cover and the partition wall is shielded from the outside. Further, a heat dissipation mechanism in which a plurality of fins are arranged in the same direction is formed on at least the rear surface side of the rear surface portion where the heat generating component is mounted. At least one of the plurality of partition walls is a main partition wall that is thicker than the other partition walls and crosses or traverses the entire surface portion, and the arrangement direction of the plurality of fins is orthogonal to the main partition wall.
In the component housing having such a structure, since the main partition wall is formed in the direction orthogonal to the fin arrangement direction, the rigidity with respect to the force acting on the front and back surfaces is increased. In addition, since the rigidity of the portion to which the heat dissipation mechanism is attached is increased, the thickness of the housing of the surface portion can be reduced.

The plurality of partition walls on the front surface side and the plurality of fins on the back surface side may be integrally formed from one metal work. By doing so, the thermal resistance is reduced and the heat dissipation efficiency is improved.

All of the plurality of fins may be formed in a thin plate shape having notches at a predetermined fin pitch. The heat dissipation mechanism having such a fin structure can efficiently discharge scraps and the like during molding and can enhance heat dissipation efficiency during molding and during use.

A substrate support for supporting a substrate for electronic components may be integrally molded. In this case, the end portion on the front surface side of the substrate support is formed in a shape that is flush with the end portions of the plurality of partition walls and is in contact with the inner surface of the shield cover, and the back surface portion of the substrate support is formed. Side end is
The wiring portion of the substrate supported by the connector is molded to a height so as to come into contact with the core wire of the externally attached connector.

According to the manufacturing method of the present invention, a surface portion having a plurality of partition walls for forming a region for mounting a heat-generating component,
A method of manufacturing a component housing having at least a rear surface portion of a plurality of fins arranged in the same direction on the rear surface side of the heat generating component, the method comprising excavating the plurality of fins from one metal work. And while forming the plurality of partition walls by excavating the metal work while cooling the heat generated during processing with the plurality of fins, at least one partition wall is thicker than other partition walls and Forming so as to extend in a direction orthogonal to the arrangement direction of the plurality of fins.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below. In this embodiment, an integrally-molded component housing made of an aluminum material, which is an example of a lightweight metal having excellent heat conductivity, will be described. FIG. 1 is an external perspective view of the front surface portion of the component housing 1, and FIG. 2 is an external perspective view of the rear surface portion. Also,
FIG. 3A is a plan view of the surface of the component housing 1, and FIG.
Is a left side view, (c) is a right side view, (d) is a front view,
(E) is a rear view. FIG. 4 is a plan view of the back surface of the component housing 1.

<Structure of surface of casing> FIGS. 1 and 3 (a)
As shown in FIG.
a, the first partition wall 10b, the second partition wall 10c, and the substrate support 10d are left, and the bottom surface portion 10f thereof is hollowed out to be substantially flat, so that a plurality of modules (electronic components) each operating in a high frequency band are mounted. First section 101, second section 1
02 and the third section 103 are formed. One end of the second partition wall 10c is the outer peripheral frame 1 of the component housing 1.
0a is integrally molded with the other end and the first partition wall 1
A void 10i is formed between the void 0i and 0b. The void 10i is used for routing the wiring between the partition 101 and the partition 102. In each of the sections 101 to 103, a dent 1 for positioning when mounting a module that is a heat-generating component
0g, an auxiliary partition wall 10m described later, and a plurality of screw holes 10h for module mounting are formed.

The first partition wall 10b includes an outer peripheral frame 10a and a second partition wall 10a.
The partition wall 10c has a thickness almost double that of the substrate support 10d, and the component housing 1 is longitudinally cut in the longitudinal direction. This ensures the strength in the longitudinal direction.

The outer peripheral frame 10a has a two-stage frame structure including an inner frame and an outer frame which are formed by dropping. Inner frame 100a
The inner wall height of is the height to be included in the same plane as the surface side end of each of the first partition wall 10b, the second partition wall 10c, and the substrate support 10d, and the height of the outer frame ( The outer wall height) is higher than the height of the inner frame 100a by the thickness of the shield cover described later. Further, screw holes 10j for attaching a shield cover, which will be described later, are formed at predetermined intervals on the inner frame 100a, the first partition wall 10b, the second partition wall 10c, and the surface-side end of the substrate support 10d. . All of the end portions are thinner than the formation portion of the screw hole 10j except the formation portion of the screw hole 10j, so that the wall thickness of the component housing 1 is thoroughly reduced and the surface area is secured. .

A module is mounted in each of the sections 101 to 103, the substrate is supported by the substrate support 10d, and the wiring route of the signal line when the wiring is made by a cable or the like is as shown in FIG. In FIG. 6, a solid line is a signal line to be arranged inside the component housing 1, and a broken line is a signal line to be routed through the outside of the component housing 1 via a connector. As can be seen from FIG. 6, the substrate support 1
0d and the second section 102 and the first section 101, the first section 1
01, the second section 102, and the third section 103 are wired by external routing. This is to prevent the high-frequency signal used from wrapping around and to enhance the shield effect from external electromagnetic waves.

<Backside Structure> Next, the structure of the backside of the component housing 1 will be described. As shown in FIGS. 2 and 4, the rear surface of the component housing 1 has an opening at the portion where the substrate support 10d is formed. In addition, a plurality of fins 20 and 2 having the same shape are provided on the back side of the portion where the module is mounted.
A heat dissipation mechanism in which 1s are arranged in a direction orthogonal to the longitudinal direction has a structure integrally formed with the back surface main surface 10k (back surface of the bottom surface 10f).

All of the fins 20 and 21 are formed in a thin plate shape with a narrow fin pitch on all fin surfaces, and further, a plurality of notches are formed in the longitudinal direction. Molding with a narrow fin pitch ensures a certain strength or more even if the fin surface is thin. The notch portion of the fin is formed mainly for facilitating the flow of debris, cutting oil, etc. generated during molding. By using the heat dissipation mechanism having such a structure, it is possible to secure a sufficient heat dissipation area while keeping the height of the fins 20 and 21 low. Also,
Since the thermal resistance is small, sufficient heat transfer efficiency can be obtained.

The outer peripheral frame on the rear surface side of the substrate support 10d is processed by dropping to have a two-stage frame structure of an inner frame and an outer frame, and the inner wall height of the inner frame is the thickness of the shield cover for the rear surface part described later. Is lower than the main surface 10k of the back surface. Further, the height of the end portion on the back surface side of the substrate support 10d is lower than the middle of the height of the outer peripheral frame 10a by the thickness of the substrate. This is the core wire of the connector for connection and the substrate support 10 when the connector for connection is connected to the mounting hole 10l formed in the predetermined portion of the outer peripheral frame 10a.
This is for accurate positioning with respect to the printed wiring portion on the substrate placed on the end portion on the rear surface side of d. This will be described with reference to FIG.

FIG. 5 is a partial cross-sectional view of a side portion of the component housing 1 on which the substrate support 10d is formed. The printed circuit board B21 is placed on the end of the substrate support 10d on the rear surface side. The state is shown in which the connection connector CN is fixed and the connecting connector CN is screwed into the mounting hole 10l of the outer peripheral frame 10a. C
Reference numeral 11 denotes a front surface shield cover, and C21 denotes a rear surface shield cover, which are fixed to the inner frame of the outer peripheral frame of the component housing 1 with screws. Thus, the substrate support 10
The height of the rear end of d is the core wire CN of the connecting connector CN.
The height C is designed to be in contact with the printed wiring of the board B21.

<Unit Assembly> FIG. 7 shows a procedure for assembling a power amplification unit using the component housing 1 of this embodiment. The power amplification unit is arranged in the power amplification unit of the mobile phone base station, and includes the module, which is a heat-generating component, the board, and other unit components, as the component housing 1 of the present embodiment.
It is completed by simply screwing and fixing to, and finally attaching the front shield case and back shield case.

That is, as shown in FIG. 7, a connector CN for connecting to another unit or the like is attached to an end portion of the component housing 1, and each partition 101 on the surface portion of the component housing 1 is attached.
Nos. 103 to 103 are provided with auxiliary partition walls 10m, and a plurality of modules M11 are screwed to predetermined portions of the surface portion (bottom surface portion 10f) of the component housing 1 so as to support the wired module substrate B11 via metal fittings. Stop and fix. This completes the mounting work on the front surface side. As for the back surface of the component housing 1, the board B2 is opened from the opening of the board support 10d.
Insert 1 and fix it with screws.

FIG. 8 shows the appearance of the surface of the electronic equipment unit (unshielded state) in which the module M11 and the like are mounted in this manner. The auxiliary partition wall 10m is attached by cutting out the bottom surface side thereof as necessary. In this state, the entire front surface of the component housing 1 is covered with the front surface shield cover. As a result, all the spaces partitioned by the first partition wall 10b, the second partition wall 10c, the auxiliary partition wall 10m, and the end portion on the front surface side of the substrate support 10d and the inner surface of the front surface shield cover C11 are separated. It is electromagnetically shielded from the outside. Substrate support 10d can be formed by covering the openings on the back surface with shield shields for the back surface (not shown).
Is electromagnetically shielded from both sides. In this way, the assembly of the power amplification unit is completed.

FIG. 9 is an external perspective view of the power amplification unit after the assembly is completed. C11 is a front surface shield cover. As is clear from FIG. 9, the heat dissipation mechanism and the shielded module housing space are formed, but the thickness thereof is extremely thin. This is because the wall thickness of the component housing 1 is thin throughout, the component housing 1 is formed of an aluminum material having excellent heat conductivity, the fins 20 and 21 and the module M11.
This is because the part on which is mounted is integrally molded.
Therefore, it is possible to reduce the size and cost of the entire power amplification unit of the mobile phone base station in which a plurality of such power amplification units are arranged.

<Method for Manufacturing Component Housing 1> Next, a method for manufacturing the component housing 1 according to the present embodiment will be described. The component housing 1 is manufactured by excavating an aluminum workpiece (working material). The processing procedure in this case will be described with reference to FIG.

First, the work is positioned and formed into a predetermined shape and size (shape and size required for the unit to be used) (step S101), and then the relevant portion of the back surface is scraped off to form a plurality of fins 20, 21. Are formed (step S102). The cutout portions of the fins 20 and 21 also serve as guides for scraping off scraps generated during processing.

After excavating the back surface, the entire front surface is excavated (step S103). At this time,
The excavation process is performed so that the first partition wall 10b is in a direction orthogonal to the direction of the fins 20 and 21. As a result, it is possible to secure the work strength in the direction in which the fins 20 and 21 are relatively weakened during processing, and it is possible to suppress deformation due to the stress generated during excavation processing. Further, when the excavation process is performed, the work itself generates heat, but since the heat is radiated from the fins 20 and 21 formed first, the deformation due to the heat generated during the excavation process is suppressed. As a result, the bottom surface portion 10f of the component housing 1, the outer peripheral frame 1
0a, the first partition wall 10b, the second partition wall 10c, and the substrate support 10d can be processed accurately and thinly.

Thereafter, the recess 10g, the screw holes 10h, 10
j, the mounting hole 10l for the connector for connection is formed (step S104), and the manufacturing of the component housing 1 is completed. By molding the work in such a procedure, the component housing 1 can be manufactured with a good yield.

<Effects of the Present Embodiment> In the component housing 1 of the present embodiment, the thin plate-shaped fins 20 and 21 are centrally arranged at a narrow pitch in the portion where heat radiation is required locally, so that the cooling capacity is lowered. Without increasing the area of the heat dissipation mechanism.

Further, since the wall thickness of the component housing 1 is thin throughout, the unit using it can be made compact and lightweight.

Further, the mounting portion of the heat radiation mechanism and the partition wall 10
Since b, 10c, etc. are integrally molded, the rigidity of the portion to which the heat dissipation mechanism is attached is increased and deformation is suppressed.

Further, the first partition wall 10b is replaced with another partition wall 1
Since it is formed to be thicker than 0c or the like and to longitudinally cut the entire surface portion, that is, in the direction orthogonal to the arrangement direction of the fins 20 and 21, the rigidity of the front and back surfaces can be increased. Note that, in the present embodiment, an example in which the first partition wall 10b is formed in a direction that vertically cuts the entire surface portion has been shown, but when the arrangement direction of the fins 20 and 21 is displaced by 90 degrees, the first partition wall is formed. The wall 10b will be formed in a direction crossing the entire surface portion.

In this embodiment, as a preferred example, a component housing 1 integrally formed by excavation processing from an aluminum material.
However, if the structure of the component housing 1 as in the present embodiment is obtained as a result, the intended effect can be obtained, so the scope of the present invention is not limited to the example of the present embodiment. Absent. As for the material of the casing, not only an aluminum material but also an aluminum alloy material or another metal member having excellent heat conductivity can be substituted.

[0034]

As is apparent from the above description, according to the present invention, there is provided a small and lightweight component housing capable of efficiently dissipating and cooling the heat generated in the mounted heat generating component to the outside. can do.

[Brief description of drawings]

FIG. 1 is an external perspective view of a surface portion of a component housing according to an embodiment of the present invention.

FIG. 2 is an external perspective view of a back surface portion according to the embodiment.

3A is a plan view of a surface of a component housing according to the embodiment, FIG. 3B is a left side view, FIG. 3C is a right side view, FIG. 3D is a front view, and FIG.

FIG. 4 is a plan view of a back surface portion according to the embodiment.

FIG. 5 is a partial side sectional view of a component housing in which a substrate support is formed.

FIG. 6 is an explanatory diagram of a routing route of a signal line in a component housing.

FIG. 7 is an exploded perspective view showing an assembling procedure of an electronic device unit using the component housing according to the embodiment.

FIG. 8 is an external perspective view of a surface portion of an electronic device unit using the component housing according to the embodiment.

FIG. 9 is an external perspective view of the surface portion of the electronic device unit when completed.

FIG. 10 is an explanatory view of the manufacturing procedure of the component housing according to the present embodiment.

FIG. 11 is an external perspective view of a conventional electronic device unit.

[Explanation of symbols]

1 component housing 10a peripheral frame 10b, 10c, 10m partition wall 10d substrate support 10f Bottom part 10g hollow 101-103 Module mounting area 10i void 10h, 10j screw holes 100a inner frame C11, C21 shield cover 20,21 fins 10k Backside main surface 10l mounting hole B21, B11 substrate CN connection connector M, M11 module

Claims (6)

[Claims] 1. A metal component housing for mounting a heat-generating component, comprising a front surface portion and a rear surface portion, the front surface portion being formed on a bottom surface formed into a substantially flat shape, respectively. A structure in which there are a plurality of partition walls for forming an accommodation space, and when the shield cover of a predetermined size is covered, the accommodation space formed by the inner surface of the shield cover and the partition wall is shielded from the outside. And a heat dissipation mechanism in which a plurality of fins are arranged in the same direction is formed on at least the back surface side of the back surface part where the heat generating component is mounted, At least one is a main partition wall that is thicker than other partition walls and crosses or traverses the entire surface portion, and the arrangement direction of the plurality of fins is orthogonal to the main partition wall. . 2. The component housing according to claim 1, wherein the plurality of partition walls on the front surface side and the plurality of fins on the back surface side are integrally molded from one metal work. 3. The component housing according to claim 2, wherein all of the plurality of fins are formed in a thin plate shape having cutout portions at a predetermined fin pitch. 4. A substrate support for supporting a substrate for an electronic component is further integrally molded, and an end of the substrate support on the front surface side is flush with the ends of the plurality of partition walls. The upper end of the substrate support is formed in a shape that is in contact with the inner surface of the shield cover, and the wiring portion of the substrate supported by it is in contact with the core wire of the external connector. The component housing according to claim 2, wherein the component housing is formed to have a height. 5. The component housing according to claim 1, which is made of an aluminum material or an alloy material thereof. 6. A front surface portion having a plurality of partition walls for forming a region for mounting a heat-generating component, and a back surface portion in which a plurality of fins are arranged in the same direction on at least a rear surface side of the heat-generating component. A method of manufacturing a component housing, comprising the steps of excavating and processing the plurality of fins from one metal work, and excavating the metal work while cooling the heat generated during processing by the plurality of fins. Forming a plurality of partition walls, and forming at least one partition wall so as to be thicker than other partition walls and extend in a direction orthogonal to the direction in which the plurality of fins are arranged. A method for manufacturing a component housing.