JP2003203769A - Linear pattern, method of forming linear pattern, image display device, and method of manufacturing image display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To form a highly accurate linear pattern (for example, cathode line). <P>SOLUTION: When linear patterns arranged at specified intervals are formed through a mask, a plurality of divided patterns divided in longitudinal direction are sequentially formed, and these divided patterns are joined to each other to form the linear patterns. The divided patterns comprises, for example, dot-like first divided patterns arranged at specified intervals and second divided patterns for joining these first divided patterns to each other. In an image display device, light emitting parts, for example, organic EL layers are formed against the first divided patterns. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a linear pattern such as a wiring line of a passive matrix type display panel and a method of forming the same, and further, an image display device to which the same is applied and a method of manufacturing the same. Regarding

[0002]

2. Description of the Related Art In general, an organic EL element has a transparent electrode layer as an anode, an organic light emitting layer made of an organic EL material formed on the transparent electrode layer, and a transparent electrode layer which is formed on the transparent substrate having light transparency. It is composed by sequentially stacking a metal electrode layer formed on an organic light emitting layer and functioning as a cathode, and since it has characteristics such as high visibility due to its self-luminous type, it is used as a light emitting element in various display devices. It is getting attention. In this organic EL element, holes and electrons injected from the respective electrodes are recombined in the organic light emitting layer by energizing (applying a DC voltage) to the transparent electrode layer as the anode and the metal electrode layer as the cathode. However, the energy at this time causes a light emission phenomenon. Since the light emission phenomenon is injection light emission similar to that of a light emitting diode, the light emission voltage is low at 10 V or less.

A display panel using the above organic EL element has a structure in which an anode line and a cathode line sandwiching the organic EL layer are orthogonal to each other. For example, a data signal is supplied to the anode line and a scan signal is supplied to the cathode line. There is known a so-called passive matrix method in which an image is displayed by inputting.

[0004]

By the way, in the case of manufacturing the above-mentioned passive matrix type display panel, a general wet process in a semiconductor process is used for patterning an anode line (for example, indium tin oxide) on a glass substrate. Can be used. On the other hand, wet etching cannot be used for patterning after forming the organic EL layer, for example, patterning of the cathode line, and patterning using, for example, a shadow mask is performed.

The shadow mask used here is, for example, a metal sheet having a thickness of about 0.1 mm processed into a desired pattern by etching, laser, or the like. Usually, slits, which are linear openings, are formed in parallel with each other. Therefore, depending on the pattern, the metal-remaining portion (rib) becomes thin, and if the length is increased to some extent, the rigidity is lowered, and it becomes difficult to maintain the pattern with high accuracy. In particular, since the mask for the cathode line pattern is a pattern in which the ribs are thin and long, the rigidity is extremely low, and accurate patterning is impossible. To secure the rigidity of the metal sheet, it is conceivable to increase the plate thickness, but this is disadvantageous from the viewpoint of pattern accuracy. In order to improve the pattern accuracy of the mask, the plate thickness of the mask is preferably thin.

Further, as a method for ensuring the thickness of the rib,
As shown in FIG. 10, half length slits 101, 1
It is also conceivable that a pattern in which 02 are arranged alternately on the left and right, that is, a so-called one skip pattern, is formed, and this is divided into two portions as shown by an arrow in the figure and the film is formed. However,
In this case, if the first process and the second process are not performed under exactly the same conditions, unevenness occurs in device characteristics, and a significant difference occurs when the organic EL layer emits light, for example. .

The present invention has been proposed in view of such a conventional situation, and an object thereof is to provide a linear pattern and a pattern forming method capable of forming a pattern with high accuracy. It is another object of the present invention to provide an image display device in which the element characteristics do not have unevenness and a manufacturing method thereof.

[0008]

In order to achieve the above-mentioned object, the linear pattern of the present invention is formed by sequentially forming a plurality of division patterns divided in the longitudinal direction and connecting these division patterns. It is characterized by being linear. Further, the pattern forming method of the present invention is a pattern forming method of forming a linear pattern arranged at a predetermined interval through a mask, and sequentially forming a plurality of divided patterns divided in the longitudinal direction,
It is characterized by forming a linear pattern by connecting these.

On the other hand, in the image display device of the present invention, a plurality of division patterns divided in the longitudinal direction are sequentially formed, and the linear patterns formed by connecting these division patterns are formed into wiring lines. It is characterized by doing. Further, the image display device manufacturing method of the present invention is a method of manufacturing an image display device in which wiring lines arranged at a predetermined interval are formed through a mask, and a plurality of division patterns divided in the longitudinal direction are sequentially formed. Film formation,
The above-mentioned wiring line is characterized by forming a linear pattern by connecting these.

By dividing a pattern having a long length into a plurality of divided patterns, forming a partial portion into a plurality of divided portions, and connecting the divided portions, it is possible to perform highly precise patterning. That is, by dividing a pattern having a long length into a plurality of divided patterns, a decrease in rigidity of the mask is suppressed, and the rigidity is secured without increasing the thickness of the mask. As a result, deterioration in patterning accuracy due to a decrease in rigidity and an increase in mask plate thickness is suppressed, and the pattern is maintained with high accuracy.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION A linear pattern and a pattern forming method to which the present invention is applied, an image display device and a manufacturing method thereof will be described below.

FIG. 1 is a schematic view of wiring of a passive matrix panel, in which an anode line 1 and a cathode line 2 are formed so as to be orthogonal to each other. The present invention can be applied as a linear line, for example, to this cathode line.

The cathode lines are usually patterned using a shadow mask. At this time, if the ribs of the shadow mask are thin but short in length, the rigidity and accuracy of the entire shadow mask are maintained. Therefore, if a method of forming a single line by forming a film with a mask that divides the cathode line into several dots and then forming a film with a mask having a pattern that fills the spaces between dots is used, it is highly accurate and long. A cathode line can be formed.

In the case of patterning as described above, it is preferable that the dot portion formed for the first time covers the entire light emitting portion in order to avoid unevenness in device characteristics due to process variations. Then, if the pattern is formed so as to connect the dots formed on the light emitting portion for the second time, the light emitting characteristics may change depending on the parts in the panel due to the process variations of the first time and the second time. The phenomenon is resolved.

FIG. 2 shows an example of patterning of cathode lines of a passive matrix panel having an organic EL element as a light emitting portion. In this example, after forming the anode line, first, as shown in FIG. 2A, a strip-shaped organic EL layer 11 which functions as a light emitting portion and constitutes each pixel is formed.

The organic EL layer 11 has, for example, a three-layer structure as shown in FIG. 3, and has a hole transporting layer 11a, an organic light emitting layer 11b, and a hole transporting layer 11a arranged on the side in contact with the anode line 1.
And an electron transport layer 11c arranged on the side in contact with the cathode line 2. In the above structure, a buffer layer may be formed between the organic EL layer 11 and the cathode line 2. This buffer layer is formed by depositing, for example, Li ₂ O in a film thickness of about several angstroms, and the light emission starting voltage can be lowered by this buffer layer.

Of the organic EL layer 11, the hole transport layer 11a
Plays a role of transporting holes injected from the anode line 1 to the organic light emitting layer 11b. As the hole-transporting material used for the hole-transporting layer 11a, any known material can be used.
Styrylamine, triphenylamine, porphyrin,
Triazole, imidazole, oxadiazole, polyarylalkane, phenylenediamine, arylamine, oxazole, anthracene, fluorenone, hydrazone, stilbene, or derivatives thereof, and polysilane compounds, vinylcarbazole compounds, thiophene compounds, aniline compounds Heterocyclic conjugated system monomers, oligomers, polymers and the like can be used. Specific compounds include α-naphthylphenyldiamine, porphyrin, metal tetraphenylporphyrin, metal naphthalocyanine, 4,4,4-tris (3-
Methylphenylphenylamino) triphenylamine,
N, N, N, N-tetrakis (p-tolyl) p-phenylenediamine, N, N, N, N-tetraphenyl 4,4
-Diaminobiphenyl, N-phenylcarbazole, 4
Examples thereof include, but are not limited to, -di-p-tolylaminostilbene, poly (paraphenylene vinylene), poly (thiophenvinylene), and poly (2,2-thienylpyrrole).

The material used for the organic light-emitting layer 22b is capable of injecting holes from the anode side and electrons from the cathode side when a voltage is applied, and moves the injected charges, that is, holes and electrons, and Any material may be used so long as it can provide a field where electrons can be recombined, high luminous efficiency, and the like. For example, an organic material such as a low-molecular fluorescent dye, a fluorescent polymer, or a metal complex. Etc. Specific examples of such a material include anthracene, naphthalene, phenanthrene, pyrene, chrysene, perylene, butadiene, coumarin, acridine, stilbene, tris (8-quinolinolato) aluminum complex, and bis (benzoquinolinolato) beryllium complex. , Tri (dibenzoylmethyl) phenanthroline europium complex, ditoluylvinylbiphenyl, α-naphthylphenyldiamine, and the like.

The electron transport layer 11c transports the electrons injected from the cathode line 2 to the organic light emitting layer 11b. Examples of the electron transport material that can be used for the electron transport layer 11c include quinoline, perylene, bisstyryl, pyrazine, and derivatives thereof. Specific examples of the compound include 8-hydroxyquinoline aluminum, anthracene, naphthalene, phenanthrene, pyrene, chrysene, perylene, butadiene, coumarin, acridine, stilbene, (8-quinolinolato) aluminum complex, and derivatives thereof. it can.

After forming the organic EL layer 11 described above, FIG.
As shown in (b), the first part becomes a part of the cathode line.
The dot-shaped division pattern 12 is formed. The dot-shaped divided pattern 12 may be formed by using a shadow mask provided with dot-shaped slits, and since the rigidity of the shadow mask is maintained, highly precise patterning is possible. The formed dot-shaped division pattern 12 is formed so as to completely cover the organic EL layer 11, and
The strip-shaped pattern has a larger area than the organic EL layer 11.

Here, in order to efficiently inject electrons, it is preferable to use an electrode material (metal) having a small work function from the vacuum level for the first dot-shaped divided pattern 12 which constitutes the cathode line. . Specifically, aluminum, indium, magnesium, silver, calcium,
A metal having a low work function such as barium or lithium is used alone. Alternatively, these metals may be used as alloys with other metals with increased stability.

Finally, as shown in FIG. 2C, a second dot-shaped divided pattern 13 that connects the first dot-shaped divided patterns 12 is formed. The dot-shaped divided pattern 13 may be formed by using a shadow mask provided with dot-shaped slits. Since the rigidity of the shadow mask is maintained, highly precise patterning is possible. The electrode material used for the second dot-shaped division pattern 13 is also the same as that of the first dot-shaped division pattern 12.

As described above, a linear pattern in which the first dot-shaped division pattern 12 and the second dot-shaped division pattern 13 are linearly connected is formed, and this functions as a cathode line. Here, each dot-shaped division pattern 12,
Since 13 is formed with high precision, the entire cathode line is also formed with high precision.

In the above-mentioned pattern formation, it is not always necessary to divide the pattern corresponding to each light emitting portion in the first film formation (film formation of the first dot-shaped divided pattern 12). Patterns corresponding to a plurality of light emitting units may be collectively formed into a film within a range permitted by accuracy, and then the patterns may be connected.

FIG. 4 shows an example of such pattern formation. In this case, the patterning of the organic EL element 11 shown in FIG. 4A is the same as that shown in FIG. 2 above, but as shown in FIG. 4B, a plurality of first dot-shaped division patterns 12 are formed. It is formed so as to cover the organic EL layers 11 (here, three). After that, as shown in FIG. 4C, a second dot-shaped division pattern 13 that connects these first dot-shaped division patterns 12 is formed.

Alternatively, one mask may be prepared without preparing separate shadow masks for the first time (for forming the first dot-shaped divided pattern 12) and the second time (for formed the second dot-shaped divided pattern). It is also possible to shift and use it twice. An example of such a process is shown in FIGS. 5 (a) to 5 (c). In this example, the first dot-shaped divided pattern 12 shown in FIG. 5B and the second dot-shaped divided pattern 13 shown in FIG. 5C are formed by shifting the same mask. Therefore, the shape of the first dot-shaped divided pattern 12 and the shape of the second dot-shaped divided pattern 13
Have the same shape.

Further, as described above, the organic E which is the light emitting portion is used.
Since the film formation of the first dot-shaped divided pattern 12 corresponding to the L layer 11 and the film formation of the second dot-shaped divided pattern 13 for wiring connecting them are made different, a material suitable for each is selected. It is also possible to improve the characteristics by using it. For example, in the first dot-shaped division pattern 12 corresponding to the organic EL layer 11 which is a light emitting portion, the organic EL layer 1
A material having the best electrical characteristics by contact with 1 is selected and formed into a film, and a material having the smallest electric resistance is formed on the second dot-shaped division pattern 13 connecting them.

Further, in the above example, the cathode line is formed in two times, but it is also possible to form one cathode line in two or more times such as three times or four times. Is.

In the above example, after forming the organic EL layer 11,
Although the first dot-shaped divided pattern 12 and the second dot-shaped divided pattern 13 are formed, the second divided pattern for connecting the two is formed in advance before the organic EL layer is formed, and then the organic EL is formed. It is also possible to sequentially form layers and dot-shaped first division patterns. By forming the second division pattern before forming the organic EL layer, a wet etching process or the like can be used for forming the second division pattern, and high definition can be achieved. It is also possible to reduce the wiring resistance by forming the second divided pattern as a thick film by a plating process or the like.

FIG. 6 shows the procedure of the process in this case. In this process, first, as shown in FIG.
The anode line 22 is formed on the substrate 21. The anode line 22 is formed, for example, by patterning ITO in a line shape. As a method of patterning the anode line 22, wet etching may be performed after forming ITO on the entire surface of the substrate 21.
The ITO film may be formed in a linear shape from the beginning by using a metal mask having a linear opening.

Next, as shown in FIG. 6B, the insulating layer 2
3 is formed in a predetermined pattern. The insulating layer 23 prevents short circuit between the anode line 22 and a cathode line described later, and is patterned to cover the anode line 22 except for a region corresponding to an organic EL layer described later. The opening 23 is provided in the region corresponding to the organic EL layer.
a is formed.

The insulating layer 23 may be formed of an inorganic insulating material such as SiN _x or a polymer insulating material such as photoresist. However,
It is preferable that the opening wall of the insulating layer 23 that faces the opening 23a has a forward tapered shape. If the taper has a reverse taper shape or an almost vertical surface, the divided patterns may not be contacted when the cathode line is formed in a later step.

Subsequently, as shown in FIG. 6C, a second connecting pattern is formed between the dot-shaped division patterns (first division patterns) formed corresponding to the organic EL layer in the cathode line.
The divided pattern 24 is formed. The second division pattern 24 is formed on the upper surface of the insulating layer 23, and is patterned as, for example, a dot pattern connecting the first division patterns.

The second division pattern 24 is made up of the insulating layer 2
It is formed by depositing a metal layer on the metal layer 3. The metal layer is generally formed by a vacuum process such as a sputtering method. However, since the metal layer is formed before forming the organic EL layer which is an organic film, it is formed as a thick film by a method such as plating. It is also possible. If the metal layer forming the second divided pattern 24 can be formed as a thick film, the electric resistance can be reduced. Further, when the metal layer is patterned to form the second divided pattern 24, a wet etching process can be used as a patterning method, whereby a high-definition pattern can be formed.

Finally, as shown in FIG. 6 (d), organic E
The L layer 25 and the first division pattern 26 are formed. The organic EL layer 25 is formed in a dot shape corresponding to the opening 23a of the insulating layer 23, and is formed so as to cover the anode line 22 so as to close the opening 23a. The first divided pattern 26 is also formed so as to cover the organic EL layer 25 corresponding to the opening 23a of the insulating layer 23.
It is formed slightly larger than 5, and both side edges are formed so as to overlap with the second divided pattern 24. As a result, the first division pattern 26 and the second division pattern 24
And are electrically connected, and the cathode line is connected to one.

FIG. 7 shows a plan view of the procedure for forming the second to first divided patterns. Although it is basically the same as that shown in FIG. 2, the order of film formation is different.
That is, as shown in FIG. 7A, first, the second divided pattern 24 is formed in a dot shape (a strip shape) on the insulating layer,
As shown in FIG. 7B, the organic EL is formed in the region between these.
The layer 25 is deposited. Finally, as shown in FIG. 7 (c),
A first division pattern 26 that covers the organic EL layer 25 and is connected to the second division pattern 24 is formed.

In the above example, the second divided pattern 24 is a dot-shaped pattern, but the present invention is not limited to this.
It is also possible to use a ladder-shaped pattern or a comb-shaped pattern. FIG. 8 shows a process when the second division pattern 24 is a "ladder-like" pattern. In this case, as shown in FIG. 8A, a ladder-shaped second divided pattern 24 is formed, and as shown in FIG. As shown in (c), the first divided pattern 26 is formed.

The same applies to the case of the "comb-tooth" pattern. As shown in FIG. 9 (a), a second comb-tooth-shaped divided pattern 24 is formed, and as shown in FIG. 9 (b). Then, after forming the organic EL layer 25, as shown in FIG.
The first divided pattern 26 is formed.

Also in the process examples shown in FIGS. 6 to 9, the first dot-shaped division pattern 26 corresponding to the organic EL layer 25 as the light emitting portion and the second division for wiring connecting them. It is possible to improve the characteristics by using a material suitable for each of the patterns 24.
For example, for the first dot-shaped division pattern 26 corresponding to the organic EL layer 25 that is the light emitting portion, a material having the best electrical characteristics by contact with the organic EL layer 25 is selected and formed.
A material having the smallest electric resistance is formed on the second divided pattern 24 connecting them. Especially the second
The divided pattern 24 is formed before the organic EL layer 25 is formed, and therefore, there is a lot of choice in terms of material, film thickness, patterning method, and the like.

The ladder-shaped pattern and the comb-shaped pattern described above are also applicable to the previous process examples (process examples shown in FIGS. 2, 3, and 4), and in these processes as well, The pattern shape of the two divided patterns may be "ladder-like" or "comb-like".

Although various embodiments of the present invention have been described above, the present invention can be applied not only to the cathode lines of the above passive matrix panel but also to linear patterns in general and applied to a wide range of fields. It is possible.

[0042]

As is apparent from the above description, according to the present invention, it is possible to form a pattern with high accuracy, and it is possible to eliminate, for example, unevenness of element characteristics in an image display device or the like. Also, the optimum material for each division pattern,
Since the film thickness can be selected, it is possible to improve the characteristics also in this respect.

[Brief description of drawings]

FIG. 1 is a schematic plan view showing an example of wiring in a passive matrix panel.

FIG. 2 is a schematic plan view showing an example of patterning of cathode lines, (a) being an organic EL layer forming step, (b)
Is the first dot-shaped divided pattern film forming step, and (c) is the second
The dot-shaped divided pattern film forming step is shown.

FIG. 3 is a schematic diagram showing an example of a film configuration of an organic EL layer.

FIG. 4 is a schematic plan view showing another example of patterning of a cathode line, in which (a) is an organic EL layer forming step,
(B) is a first dot-shaped divided pattern film forming step, (c)
Shows a second dot-shaped divided pattern film forming step.

FIG. 5 is a schematic plan view showing still another example of patterning of cathode lines, (a) is an organic EL layer forming step, (b) is a first dot-shaped divided pattern film forming step,
(C) shows a second dot-shaped divided pattern film forming step.

6A and 6B are schematic cross-sectional views showing a process example of forming a wiring portion (second divided pattern) before forming an organic EL layer, in which (a) is an anode line forming step and (b) is an insulating layer. Forming step, (c) second dividing pattern forming step,
(D) shows an organic EL layer and a 1st division | segmentation pattern formation process.

FIG. 7 is a schematic plan view showing a patterning procedure for forming a wiring portion (second divided pattern) before forming an organic EL layer, wherein (a) is a dot-shaped second divided pattern forming step; b) shows an organic EL layer forming step, and (c) shows a first divided pattern forming step.

FIG. 8 is a schematic plan view showing another example of a patterning procedure for forming a wiring portion (second divided pattern) before forming an organic EL layer, and (a) is a ladder-shaped second divided pattern. Forming step, (b) is an organic EL layer forming step, and (c) is the first
The division pattern formation process of is shown.

FIG. 9 is a schematic plan view showing still another example of a patterning procedure for forming a wiring portion (second division pattern) before forming an organic EL layer, (a) a second comb-like division; Pattern forming step, (b) organic EL layer forming step, (c)
Shows the first divided pattern forming step.

FIG. 10 is a schematic plan view showing an example of patterning of cathode lines by one skip pattern.

[Explanation of symbols]

1,21 Anode line, 2 Cathode line, 1
1, 25 organic EL layer, 12, 26 first dot-shaped division pattern, 13, 24 second dot-shaped division pattern, 23 insulating layer

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05B 33/22 H05B 33/22 Z 33/26 33/26

Claims (37)

[Claims] 1. A linear pattern, wherein a plurality of division patterns divided in the longitudinal direction are sequentially formed, and these division patterns are connected to form a linear shape. 2. A dot-shaped first array arranged at a predetermined interval.
2. A division pattern of 1 and a second division pattern connecting these first division patterns.
The described linear pattern. 3. The linear pattern according to claim 2, wherein the second divided pattern is a dot-shaped pattern. 4. The linear pattern according to claim 2, wherein the second division pattern is a ladder pattern. 5. The linear pattern according to claim 2, wherein the second division pattern is a comb-shaped pattern. 6. The linear pattern according to claim 1, which is a wiring pattern. 7. The linear pattern according to claim 6, which is a cathode line of an organic electroluminescence device. 8. A pattern forming method for forming a linear pattern arranged at a predetermined interval, wherein a plurality of division patterns divided in the longitudinal direction are sequentially formed, and these are connected to form a linear pattern. And a pattern forming method. 9. A dot-shaped first array arranged at a predetermined interval.
9. The pattern forming method according to claim 8, further comprising forming a second divided pattern that connects the first divided patterns after forming the divided pattern. 10. The pattern forming method according to claim 9, wherein the first divided pattern and the second divided pattern are formed by respectively forming films through a mask. 11. The dot-shaped first divided pattern arranged at a predetermined interval after forming the second divided pattern connecting the first divided patterns. The described pattern forming method. 12. The method according to claim 11, wherein the second division pattern is formed by patterning by wet etching, and the first division pattern is formed by forming a film through a mask. Pattern formation method. 13. An image display, characterized in that a plurality of division patterns divided in the longitudinal direction are sequentially formed, and a linear pattern formed by joining these division patterns is made into a wiring line. apparatus. 14. The light emitting section is constituted by an organic electroluminescence layer.
The image display device described. 15. The linear pattern includes dot-shaped first divided patterns arranged at a predetermined interval, and the first divided patterns.
15. The image display device according to claim 14, wherein the organic electroluminescence layer is arranged corresponding to the first division pattern, and the second division pattern connects the division patterns. . 16. The image display device according to claim 15, wherein in the first division pattern, a plurality of organic electroluminescence layers are arranged for each division pattern. 17. The image display device according to claim 15, wherein the second division pattern is a dot pattern. 18. The image display device according to claim 15, wherein the second division pattern is a ladder pattern. 19. The image display device according to claim 15, wherein the second division pattern is a comb-shaped pattern. 20. The image display device according to claim 15, wherein the first division pattern and the second division pattern are made of different constituent materials. 21. The first divided pattern and the second divided pattern have different film thicknesses.
The image display device described. 22. The image display device according to claim 13, wherein the linear pattern is a cathode line and is formed so as to cover the organic electroluminescent layer. 23. The image display device according to claim 13, wherein an anode line is formed below the organic electroluminescence layer. 24. A method of manufacturing an image display device, wherein wiring lines arranged at a predetermined interval are formed through a mask, wherein a plurality of divided patterns divided in the longitudinal direction are sequentially formed, and these are joined together. Thus, a method for manufacturing an image display device is characterized in that a linear pattern is formed and the wiring line is formed. 25. A dot-shaped first division pattern arranged at a predetermined interval is formed, and then a second division pattern for connecting the first division patterns is formed. 24. The method for manufacturing the image display device according to 24. 26. The method of manufacturing an image display device according to claim 25, wherein the first division pattern and the second division pattern are formed by respectively forming films through a mask. 27. The method of manufacturing an image display device according to claim 25, wherein the organic electroluminescence layer is formed in an array corresponding to the first division pattern. 28. The method of manufacturing an image display device according to claim 27, wherein in the first divided pattern, a plurality of organic electroluminescent layers are formed for each divided pattern. 29. The linear pattern is a cathode line, and the first divided pattern is formed so as to cover the organic electroluminescent layer.
7. The method for manufacturing the image display device according to 7. 30. The dot-shaped first division pattern arranged at a predetermined interval is formed after forming the second division pattern connecting the first division patterns. A method for manufacturing the image display device described. 31. The method according to claim 30, wherein the second divisional pattern is formed by patterning by wet etching, and the first divisional pattern is formed through a mask. Image display device manufacturing method. 32. The method of manufacturing an image display device according to claim 30, wherein the organic electroluminescent layers are formed in an array corresponding to the first division pattern. 33. The linear pattern is a cathode line, and the first divided pattern is formed so as to cover the organic electroluminescent layer.
0. The method for manufacturing the image display device according to 0. 34. An anode line is formed under the electroluminescent layer.
3. The method for manufacturing the image display device according to 3. 35. The method of manufacturing an image display device according to claim 34, wherein an insulating layer is formed between the anode line and the cathode line. 36. The method of manufacturing an image display device according to claim 35, wherein the second division pattern is formed on the insulating layer. 37. The method of manufacturing an image display device according to claim 35, wherein the insulating layer has a forward tapered shape.