JP2003292154A - Heat-treating apparatus for thick-film printed circuit board, and carrier roller - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat-treating apparatus for thick-film printed circuit boards and a carrier roller that can perform appropriate heat treatment on the front and rear of a substrate where a thick-film material paste is printed, and do not cause inconveniences such as the meandering of the substrate in transport. <P>SOLUTION: A pair of guide members 50 are provided on a plurality of transport rollers 32 that are arranged in parallel one another and are rotated and driven around each axis center by sharing the rotary axis center with the transport rollers 32. Therefore, the substrate 20 is supported on a rotor- shaped body section 52 in the pair of guide members 50 at the edge section for transportation without causing the rear to come into contact with the transport rollers 32. Additionally, the pair of guide members 50 are provided with an annular projection 54 for preventing the meandering of the substrate 20, so that an advance direction is corrected by the annular projection 54 when the substrate 20 nearly meanders. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of a heat treatment apparatus for a thick film printed substrate for heat treating a substrate such as a silicon wafer on which a thick film material paste is printed.

[0002]

2. Description of the Related Art In the process of supporting a plurality of objects to be fired and sequentially transporting them in one direction, the plurality of objects to be fired are arranged in parallel with each other as one of the tunnel type heat treatment devices. There is known a so-called roller hearth kiln (hereinafter, referred to as RHK) in which a plurality of objects to be fired are supported by a plurality of conveyor rollers each of which is rotatably driven about its axis, and sequentially heat-treated. Such RHK
In the above, since there is no sliding inside the furnace body as in the case of carrying by a mesh belt and dust accompanying it cannot be generated, there is an advantage that the object to be fired is unlikely to be contaminated.
In particular, when the transport roller is made of ceramics, the object to be fired cannot be brought into contact with the metal inside the furnace body, so that the contamination is further suppressed. Therefore, it is preferably used for heat treatment in which it is desired to keep the inside of the furnace clean due to the properties of the material to be fired. In addition, since the mesh belt has many parts that are inevitably exposed to the outside of the furnace body, the running cost is significantly increased due to heat loss due to heating and cooling. Furthermore, the material used for the mesh belt is easily deformed by heat. Therefore, it is relatively frequent (replacement cycle 1-2)
However, according to the above RHK, there is also an advantage that the adverse effect caused by such a mesh belt can be eliminated.

By the way, in the production of a solar cell substrate, for example, after a thick film material paste such as aluminum and silver is printed in different patterns on the front surface and the back surface of a substrate such as a silicon wafer, it is included in the thick film material paste. Heat treatment is performed in order to burn out the organic solvent and the like to be burnt out and to bake the material film having a predetermined function. During such heat treatment, the cleanliness in the furnace has a great influence on the characteristics of the solar cell substrate to be produced. Therefore, the present inventor described above in order to perform heat treatment on the substrate on which such a thick film material paste is printed. Considering the use of RHK, I have been engaged in earnest research.

[0004]

The present inventor, while developing a heat treatment apparatus for a thick film printed substrate, has a new problem in using a conventional RHK for heat treatment of a substrate on which a thick film material paste is printed. Found in. That is, (a) in most cases, the back surface of the solar cell substrate or the like is also printed with the thick film material paste, so that the back surface needs to be transported while being separated from the transport roller. And (b) the substrate may meander when being transported by the transport roller.
There are two points. If the back surface of the substrate is transported while being in contact with the transport roller, the heat treatment of the back surface is not favorably performed. Further, it is conceivable that the meandering substrate collides with the inner wall of the furnace and becomes defective.

The present invention has been made in view of the above circumstances, and it is an object of the present invention that suitable heat treatment can be applied to the front surface and the back surface of a substrate on which a thick film material paste is printed. It is an object of the present invention to provide a heat treatment apparatus for thick film printed substrates and a transport roller that do not cause a problem such as meandering of the substrate during transport.

[0006]

In order to achieve such an object, the gist of the first invention is that a plurality of conveyors are arranged in parallel with each other and are rotationally driven around their respective axes. A heat treatment device for a thick film printed substrate, comprising: a roller, for performing a heat treatment on a substrate on which a thick film material paste is conveyed, which is conveyed in one direction by a plurality of conveyance rollers. A rotating body-like main body portion for supporting the end portion of the substrate on the outer peripheral surface, and an annular projecting portion integrally provided with the rotating body-like main body portion to prevent meandering of the substrate are provided. It is characterized in that a pair of guide members are provided so as to share a rotation axis with the conveying roller.

[0007]

According to this structure, the pair of guide members are provided for each of the plurality of conveying rollers which are arranged parallel to each other and are driven to rotate about their respective axes. Since the substrate is supported by the rotating body-like main body portion of the pair of guide members at the end portions thereof, the substrate is transported without the back surface of the substrate contacting the transport roller. . Further, since the pair of guide members are respectively provided with the annular protrusions for preventing the substrate from meandering, when the substrates are about to meander, the annular protrusions cause a traveling direction. Is fixed. That is, it is possible to provide a heat treatment apparatus for a thick film printed substrate which can perform suitable heat treatment on the front surface and the back surface of the substrate on which the thick film material paste is printed and which does not cause troubles such as meandering of the substrate during transportation. it can.

[0008]

[Other Aspects of the First Aspect of the Invention] Here, it is preferable that each of the pair of guide members has a rotating body-like main body having a tapered outer peripheral surface whose diameter gradually decreases toward the other opposing guide member. Be prepared. In this way, the substrate is supported at the end portions by point contact with the rotating body-like main body of the pair of guide members, so that, for example, the thick film material paste is formed on the back surface of the substrate up to the vicinity of the end portion. There is an advantage that a suitable heat treatment can be performed even if is printed.

[0009]

In order to achieve the above-mentioned object, the gist of the second invention is that a thick film for applying heat treatment to a substrate on which a thick film material paste is printed. In a heat treatment apparatus for a printed board, the transfer rollers are arranged in parallel with each other and are driven to rotate in the direction of an axis, respectively, so as to transfer the board in one direction. A pair of guide members, each of which has a rotating body for moving the substrate and an annular projection integrally formed with the rotating body for preventing the substrate from meandering. It is characterized in that it is provided so as to share the axis of rotation with the roller.

[0010]

According to the second aspect of the invention, in the heat treatment apparatus for a thick film printed circuit board, the pair of conveying rollers arranged in parallel with each other and driven to rotate about their respective axes are provided with the pair of pairs. Since the guide member is provided so as to share the rotation axis center with the conveying roller, the back surface of the substrate is conveyed by being supported by the rotating body-like main body portion of the pair of guide members at the end portions thereof. Transport is performed without contacting the rollers. Further, since the pair of guide members are respectively provided with the annular protrusions for preventing the substrate from meandering, when the substrates are about to meander, the annular protrusions cause a traveling direction. Is fixed. That is, it is possible to provide a carrying roller which can perform suitable heat treatment on the front surface and the back surface of the substrate on which the thick film material paste is printed and which does not cause a trouble such as meandering of the substrate during carrying.

[0011]

According to another aspect of the second aspect of the present invention, preferably, the rotating body-like main body portions of the pair of guide members each have a tapered outer peripheral surface whose diameter gradually decreases toward the other opposing guide member. Be prepared. In this way, the substrate is supported at the end portions by point contact with the rotating body-like main body of the pair of guide members, so that, for example, the thick film material paste is formed on the back surface of the substrate up to the vicinity of the end portion. There is an advantage that a suitable heat treatment can be performed even if is printed.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described in detail below with reference to the drawings. In the drawings used in the following description, the dimensional ratio of each part is not necessarily drawn accurately.

FIG. 1 is a schematic view for explaining the structure of a heat treatment apparatus 10 for thick film printed circuit board which is an embodiment of the present invention.
As shown in FIG. 1, the heat treatment apparatus 10 for a thick film printed substrate of the present embodiment supports a plurality of substrates 20 on which a thick film material paste is printed and sequentially conveys them in one direction indicated by an arrow S in the figure. This is a tunnel type heat treatment apparatus of the type that heat-treats the plurality of substrates 20 in the process, and the long tunnel-shaped drying furnace 12 whose maximum temperature in the furnace is, for example, about 200 ° C. and the maximum temperature in the furnace are For example, a long tunnel-shaped baking furnace 14 at about 750 ° C., a cooling device 16 for cooling the temperature of the substrate 20 to near room temperature by indirect water cooling, the drying furnace 12, the baking furnace 14, and a cooling device. A frame 18 for supporting and fixing 16 is provided.

The drying furnace 12 and the firing furnace 14 are ceramic fiber boards (for example, a ceramic fiber having a silica-alumina composition and a thickness of 10 .mu.m or less) whose outside is wrapped with a heat insulating material such as a heat-resistant refractory or glass wool. It is composed of a core tube (muffle) made of a heat-insulating plate-like material containing a) and is supported by the frame 18 in a horizontal state. Further, the inner walls of the drying furnace 12 and the baking furnace 14 are further coated with, for example, a silica-based ceramic material, so that the cleanliness inside the furnace is further enhanced.

The drying furnace 12 is provided with, for example, a mid-infrared heater 22 and its normal temperature is about 150.
It is said to be about ℃. Further, in the firing furnace 14, for example, a near-infrared heater (halogen heater) 2 is provided in order to cope with a rapid heating profile required for firing the thick film material paste.
4 is provided, and its normal temperature is about 670 ° C. Further, the drying furnace 12 and the baking furnace 14 are provided with exhaust ports 26 and 28, respectively. The exhaust ports 26 and 28 are provided at positions where the exhaust is most efficiently performed according to the characteristics of the thick film material paste printed on the substrate 20, and the exhaust ports 26 and 28 are provided with the ejectors. It is carried out.
Here, since the low melting point organic solvent contained in the thick film material paste printed on the substrate 20 may be liquefied near the exhaust port 26 and dropped onto the substrate 20, preferably, A tray (not shown) for receiving the organic solvent thus dropped is provided. Also, the drying furnace 1
2 and the air supply pipe (not shown) for sending air to the firing furnace 14 are embedded in the furnace bodies of the drying furnace 12 and the firing furnace 14, respectively, and the air preheated in the process of passing through the tubes is supplied to the furnace. To be done.

The cooling device 16 comprises, for example, a cooling jacket 30 having a width dimension similar to that of the frame 18 provided vertically, and inside the cooling jacket 30, a cooling water pipe (not shown) is provided. As described above, the cooling water is circulated from the substrate 2 as described above.
In the process of 0 passing through the inside of the cooling device 16, the temperature is cooled to near room temperature by indirect water cooling.

Heat treatment apparatus 10 for thick film printed circuit board of this embodiment
Are arranged parallel to each other and are driven to rotate about their respective axes, so that the substrate 20 is moved in the direction of arrow S in FIG.
Is a so-called roller hearth kiln (hereinafter referred to as RHK) provided with a plurality of carrying rollers 32 for carrying in one direction. As the material of the transport roller 32, for example, the transport roller 32 whose temperature is assumed to be 400 ° C. or higher, that is, the transport roller 32 provided in the firing furnace 14 is, for example, a composite material of a heat-resistant ceramic material and a stainless material. For the other transport rollers 32, a stainless material is preferably used alone.

FIG. 2 is a sectional view taken along the line II--II in FIG. 1. As shown in FIG. 2, the conveying roller 32 is provided at both ends in the width direction of the frame 18 in the firing furnace 14, for example. The firing furnace 14 is disposed so as to penetrate through the firing furnace 14 in the width direction, with both ends thereof being supported by bearings 36 provided on the tops of a pair of fixed base members 34, respectively. FIG. 3 is a plan view showing how the substrate 20 is conveyed in the heat treatment apparatus 10 for thick film printed substrate of the present embodiment. As shown in FIG. 3, the substrate 20 has, for example, one side. The rectangular silicon wafer has a size of about 125 to 155 mm, and is supported by the plurality of transport rollers 32 in the heat treatment apparatus 10 for thick film printed boards. A sprocket 38 shares a rotation axis with the conveyance rollers 32 at one end (the end on the right side in FIG. 2) of the plurality of conveyance rollers 32 and relatively rotates about the common axis. When a servomotor 40 fixedly mounted on the frame 18 is driven to rotate the motor sprocket 42 in one direction, the rotation is transmitted to the sprocket 38 via a chain 44. . As a result, when the plurality of transport rollers 32 are rotated around their respective axes, the substrate 20 is transported in the one direction in accordance with the rotation.

The substrate 20 is heat-treated according to the temperature profile shown in FIG. 4, for example, in the process of being conveyed in the one direction in the heat treatment apparatus 10 for thick film printed substrate of the present embodiment. Is given. Mid-infrared heater 22 provided in the drying furnace 12, near-infrared heater 24 provided in the baking furnace 14, and the cooling device 16
The cooling jacket 30 provided in the electronic control unit 4 controls the output or the flow rate of the cooling water so that a temperature curve as shown in FIG.
6 is controlled. In FIG. 4, 1 minute after the start of the heat treatment corresponds to the drying furnace 12, 1.5 minutes to 3.2 minutes have elapsed correspond to the firing furnace 14, and 3.2 minutes have elapsed. The cooling device 16 corresponds to 4.2 minutes later. Here, the substrate 2
0 after passing through the drying furnace 12, the firing furnace 1
The reason why there is a time interval before being sent to the No. 4 is that they are physically separated from each other in order to keep the thermal interference between the drying furnace 12 and the baking furnace 14 as low as possible. .
By introducing cooling air at room temperature between the drying furnace 12 and the baking furnace 14, it is possible to more preferably prevent mutual thermal interference.

For example, as shown in FIG. 4, the substrate 20 is heated in the drying oven 12 to about 150 ° C., so that the organic solvent contained in the thick film material paste printed on the front and back surfaces of the substrate 20. Most of it is burnt out. Then, 670 ° C. in the firing furnace 14.
By raising the temperature to a certain degree and maintaining the temperature for a certain period of time, the thick film material paste is fired to form a material film having a predetermined function. After that, the temperature is lowered to about room temperature in the cooling device 16, and thus the substrate 20 is heat-treated. When the substrate 20 is, for example, a solar cell substrate, a thick film material paste such as aluminum and silver is printed on the front surface and the back surface of the substrate 20 in different patterns, and the thick film material paste is printed. Substrate 20
By repeating a series of steps in which the heat treatment is performed, the solar cell substrate provided with the material film having a predetermined function is manufactured.

For example, as shown in FIG. 3, the conveying roller 32 has a rotating body (for rotating about one straight line whose plane figure is on the same plane) for supporting the end portion of the substrate 20 on the outer peripheral surface. 3D) main body 52 and the rotor body 5 for preventing the substrate 20 from meandering.
2, a pair of guide members 50 each having an annular projection 54 integrally formed with the above-mentioned two, the transport roller 32 is inserted into a hole 56 provided at the axial center of the guide member 50, An unillustrated slotted set screw or the like is screwed into a screw hole 58 provided so as to penetrate the hole 56 from the outer peripheral surface of the portion 52 to share the rotation axis with the conveying roller 32 and mutually. It is fixed. Such guide member 5
For example, a heat-resistant resin material, a stainless steel material, a heat-resistant ceramic material, or the like is suitable as the material of No. 0, and the guide member 50, which is assumed to have a temperature of 400 ° C. or higher, is provided in the firing furnace 14. A heat-resistant ceramic material or a stainless material is preferably used for the guide member 50, and a heat-resistant resin material or the like is preferably used for the other guide members 50.

5A and 5B are views for explaining the guide member 50, FIG. 5A is a plan view seen from the axial direction, and FIG.
Is a front view. As shown in this figure, the rotary body portion 52 of the guide member 50 is preferably formed in a tapered shape with a tapered outer peripheral surface 60 whose diameter gradually decreases in the axial direction, The rotary body main body 52 is fixed to the conveying roller 32 so that the diameter thereof gradually decreases toward the other guide member 50 facing each other. FIG. 6 is a view of the state in which the guide member 50 fixed to the transport roller 32 and the substrate 20 are in contact with each other as seen from the traveling direction of the substrate 20, as shown in FIG. In addition, since the rotating body main body 52 is formed in the tapered shape with the tapered outer peripheral surface 60 as described above, the pair of guide members that the substrate 20 is applied at one point P at the end thereof. It is supported by point-contact with the rotary body portion 52 of 50.

As described above, according to this embodiment, the pair of guide members 50 are provided to each of the plurality of conveying rollers 32 which are arranged in parallel with each other and are driven to rotate about their respective axes. Since it is provided so as to share the rotation axis with
Since the pair of guide members 50 are supported by the rotating body 52, the back surface of the pair of guide members 50 can be conveyed without contacting the conveying rollers 32. In addition, since the pair of guide members 50 are respectively provided with the annular protrusions 54 for preventing the substrate 20 from meandering, when the substrate 20 tends to meander, the annular protrusions 54 are formed. The traveling direction is corrected by the unit 54. That is, the heat treatment apparatus 10 for a thick film printed substrate is provided which can perform suitable heat treatment on the front surface and the back surface of the substrate 20 on which the thick film material paste is printed and which does not cause a trouble such as meandering of the substrate 20 during transportation. can do.

Also, preferably, the pair of guide members 5
The rotating body main body 52 at 0 is provided with the tapered outer peripheral surfaces 60 each of which has a diameter gradually decreasing toward the other guide member 50 facing each other. Since the pair of guide members 50 are supported by the rotating body-like main body portion 52 by point contact, for example, the thick film material paste is printed on the back surface of the substrate 20 in the vicinity of the end portion, for example, a portion several mm from the outer edge. However, there is an advantage that suitable heat treatment can be performed.

The heat treatment apparatus 10 for the thick film printed circuit board
Is a so-called RHK. In addition to the fact that metal powder cannot be generated due to sliding of metal in the furnace, a ceramic material is coated on the inner wall of the furnace core tube made of a ceramic fiber board. The cleanliness is further enhanced, and the cleanliness of the heat treatment apparatus using the mesh belt is approximately 100,000, while the cleanliness can be dramatically increased to approximately 1,000. Further, the conveying roller 32 has a smaller exposed portion to the outside of the furnace body as compared with the mesh belt, and the heat loss due to heating / cooling is small. Therefore, the running cost is about 2/3 of that of the heat treatment apparatus using the mesh belt. Can be suppressed. Further, since the transport roller 32 is less likely to be deformed by heat and is slightly worn by the transport of the substrate 20, it does not need to be replaced so frequently, and the maintenance cost is 1/2 of that of the heat treatment apparatus using the mesh belt. It can be suppressed to a certain degree.

Next, another guide member provided on the transport roller 32 of the above-described embodiment will be illustrated. In the following description, the same parts as those in the above-described embodiment will be designated by the same reference numerals and the description thereof will be omitted.

FIG. 7 is a view for explaining another guide member 70 provided on the carrying roller 32 of the above-mentioned embodiment,
(A) is the top view seen from the axial center direction, (b) is a front view. As shown in this figure, the rotary body portion 72 of the guide member 70 has a first tapered outer peripheral surface 74 on the small diameter side where the diameter gradually decreases in the axial direction, a central step 76, and a diameter in the axial direction. And a second taper-shaped outer peripheral surface 78 on the large diameter side that gradually decreases, and the diameter of the rotary body-like main body portion 72 gradually decreases toward the other guide member 70 facing each other. It is fixed to the transport roller 32. By doing so, for example, when heat-treating two types of substrates 20 having different sizes, the edge of the substrate 20 is supported by the first tapered outer peripheral surface 74 when heat-treating a relatively small substrate 20. The center stage 7
6 prevents the substrate 20 from meandering, and when a relatively large substrate 20 is heat-treated, the end portion of the substrate 20 has the second
By being used so as to be supported by the tapered outer peripheral surface 78, the annular protrusion 54 prevents the substrate 20 from meandering. That is, there is an advantage that the meandering of each substrate 20 can be prevented more preferably.

FIG. 8 is a view for explaining yet another guide member 80 provided on the conveying roller 32 of the above-described embodiment, (a) is a plan view seen from the axial direction thereof,
(B) is a front view. As shown in this figure, the rotating body main body portion 82 of the guide member 80 has a first cylindrical outer peripheral surface 84 on the small diameter side formed in a cylindrical shape having a predetermined diameter.
And a central step 86 and a large-diameter second cylindrical outer peripheral surface 88 that is formed in a cylindrical shape and has a predetermined diameter. It is fixed to the transport roller 32. That is, the guide member of the present invention does not necessarily need to be provided with a tapered outer peripheral surface whose diameter gradually decreases in the axial direction, and even with such a configuration,
For example, when heat-treating two types of substrates 20 having different sizes, when heat-treating a relatively small substrate 20, the end of the substrate 20 is used so as to be supported by the first cylindrical outer peripheral surface 84. The central step 86 prevents the meandering of the substrate 20, and when the substrate 20 having a relatively large size is heat-treated, the end portion of the substrate 20 is used so as to be supported by the second cylindrical outer peripheral surface 88. The meandering of the substrate 20 caused by the annular protrusion 54 can be prevented.
In such a case, the substrate 20 and the guide member 80 come into line contact with each other, but the lengths in the axial direction of the first cylindrical outer peripheral surface 84 and the second cylindrical outer peripheral surface 88, and the facing each other. By appropriately setting the mutual spacing of the guide members 80 to be heated, it is possible to perform suitable heat treatment on the front surface and the back surface of the substrate 20 on which the thick film material paste is printed.

FIG. 9 is a view for explaining yet another guide member 90 provided on the carrying roller 32 of the above-mentioned embodiment, (a) is a plan view seen from the axial direction thereof,
(B) is a front view. As shown in this figure, the rotary body portion 92 of the guide member 90 is provided with a tapered outer peripheral surface 94 whose diameter decreases exponentially from the annular projection 54 in the axial direction. Is configured,
The conveying roller 3 is configured such that the diameter of the rotating body-like main body portion 92 gradually decreases toward the other guide member 90 facing each other.
It is fixed to 2. With this configuration, in the same manner as the guide member 50 described in the above-described embodiment, the traveling direction is corrected by the annular protrusion 54 when the substrate 20 is about to meander, and Since the substrate 20 is supported at the end portion P by point contact with the rotating body-like main body portion 92 of the pair of guide members 90 provided on the transport roller 32, for example, on the back surface of the substrate 20 in the vicinity of the end portion. For example, even if the thick film material paste is printed from the outer edge to a portion of several mm, a suitable heat treatment can be performed.

The preferred embodiment of the present invention has been described in detail with reference to the drawings. However, the present invention is not limited to this and can be carried out in another mode.

For example, in the embodiment described above, FIG.
Although the substrate 20 was heat-treated according to the temperature profile as shown in FIG. 5, this is only one example, and an optimal temperature profile is appropriately set and used according to the mode of the substrate to be fired. Is what is done.

Further, in the above-mentioned embodiment, the heat treatment apparatus 10 for a thick film printed substrate provided with the drying furnace 12, the baking furnace 14 and the cooling device 16 has been described. It may be used in a heat treatment apparatus including only the baking furnace 14 or a baking apparatus including only the baking furnace 14. That is, the form of heat treatment does not matter as long as it is so-called RHK in which the transport roller 32 is used.

Although the drying furnace 12 and the baking furnace 14 are provided with the intermediate infrared heater 22 and the near infrared heater 24, respectively, the heating device used in the present invention is not limited to the infrared heater, and for example, SiC. A heater or a sheath heater may be provided. Further, heating by hot air may be used.

Further, in the above-mentioned embodiment, the substrate 2
0 was conveyed only in one direction indicated by arrow S in FIG. 1, but once in the firing furnace 14, for example, arrow S
It may be conveyed in a direction opposite to the direction indicated by and is conveyed again in one direction indicated by arrow S. This has the advantage that the firing time in the firing furnace 14 can be lengthened or the furnace length of the firing furnace 14 can be shortened.

Although the substrate 20 is a solar cell substrate, the present invention is not limited to this, and is applicable to heat treatment of any substrate printed with a thick film material paste. For example, a hybrid integrated circuit (hybrid IC), which is a component often used in consumer and industrial electronic devices.
Thick film integrated circuit (thick filmI)
In C), a thick film material paste such as a conductor, a dielectric, and a resistor is formed into a circuit by screen printing on an insulating substrate such as alumina, and is manufactured through steps such as preliminary drying, firing, and resistance value trimming. The heat treatment apparatus for a thick film printed board of the present invention is also suitably used for such heat treatments such as preliminary drying and firing.

Further, in the above-mentioned embodiment, the conveying roller 32, the guide member 50 and the like are formed separately and fixed to each other. However, for example, the same heat resistant ceramic material is used. It may be formed as a conveying roller provided with a rotary-body-shaped protrusion corresponding to the guide member 50 or the like by integrally molding and firing.

Further, in the above-described embodiment, as shown in FIG. 2, a single substrate 20 is conveyed in the width direction of the furnace body, but, for example, three rows of the substrates 20 are conveyed in the width direction of the furnace body. Each of the transport rollers 32 may be provided with three pairs of guide members 50 so as to be transported. With this configuration, the plurality of pairs of the guide members 50 and the like are provided on the transport roller 32, so that the substrates 20 can be transported in parallel and the processing efficiency is further enhanced.

Although not illustrated one by one, the present invention is used with various modifications within a range not departing from its gist.

[Brief description of drawings]

FIG. 1 is a schematic diagram illustrating the configuration of a heat treatment apparatus for a thick film printed board that is an embodiment of the present invention.

FIG. 2 is a sectional view taken along line II-II in FIG.

FIG. 3 is a plan view showing a state where a substrate on which a thick film material paste is printed is conveyed in a heat treatment apparatus for a thick film printed substrate of the present embodiment.

FIG. 4 is a diagram showing a temperature profile of a substrate obtained by operating the heat treatment apparatus for a thick film printed substrate of the present embodiment.

5A and 5B are views for explaining a guide member provided on the conveying roller, FIG. 5A is a plan view seen from the axial center direction,
(B) is a front view.

FIG. 6 is a view of a state in which a guide member fixed to a conveying roller and a substrate are in contact with each other, as viewed from the traveling direction of the substrate.

FIG. 7 is a diagram illustrating another guide member provided on the transport roller, FIG. 7A is a plan view seen from the axial center direction thereof,
(B) is a front view.

8A and 8B are views for explaining still another guide member provided on the conveying roller, FIG. 8A is a plan view seen from the axial center direction, and FIG. 8B is a front view.

9A and 9B are views for explaining still another guide member provided on the conveying roller, FIG. 9A is a plan view seen from the axial center direction, and FIG. 9B is a front view.

[Explanation of symbols]

10: Heat treatment device for thick film printed circuit board 20: substrate 32: Conveyor roller 50, 70, 80, 90: guide member 52, 72, 82, 92: Rotating body 54: annular protrusion 60, 94: tapered outer peripheral surface 74: First tapered outer peripheral surface (tapered outer peripheral surface) 78: Second tapered outer peripheral surface (tapered outer peripheral surface) 84: First cylindrical outer peripheral surface (outer peripheral surface) 88: Second cylindrical outer peripheral surface (outer peripheral surface)

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Hidetaka Shimizu             Noritake Shincho 3-chome 1-36, Nishi-ku, Nagoya-shi, Aichi             Noritake Co., Ltd. Limited             Within F term (reference) 3F033 BA03 BA06 BB02 BC03 GA06                       GB08 GC01 GC08 GD03 GD07                       GE02                 5F031 CA02 FA01 GA53                 5F051 BA14 CB24 CB30 GA04 GA20

Claims (4)

[Claims] 1. A substrate on which a thick film material paste is printed, which is provided with a plurality of conveying rollers which are arranged in parallel with each other and are driven to rotate about their respective axes, and which is conveyed in one direction by the plurality of conveying rollers. A heat treatment device for a thick film printed substrate for performing heat treatment on a substrate, wherein the transport roller prevents a meandering of the substrate and a rotor body for supporting an end portion of the substrate on an outer peripheral surface. For this purpose, a pair of guide members, each of which has an annular projection integrally formed with the rotating body, are provided so as to share a rotation axis with the conveying roller. Heat treatment device for thick film printed circuit board. 2. The thick film according to claim 1, wherein each of the rotating body-like main body portions of the pair of guide members is provided with a tapered outer peripheral surface whose diameter gradually decreases toward the other opposing guide member. Heat treatment equipment for printed circuit boards. 3. A heat treatment apparatus for a thick film printed substrate for performing a heat treatment on a substrate on which a thick film material paste is printed, wherein the substrates are arranged in parallel with each other and are driven to rotate about their respective axial centers. A transport roller for transporting the substrate in the direction, the rotor body for supporting the end portion of the substrate on the outer peripheral surface, and the rotor body for preventing the substrate from meandering. A pair of guide members, each of which has an annular projection provided in the pair, is provided so as to share a rotation axis with the transport roller. 4. The transport roller according to claim 3, wherein the rotating body-like main body portions of the pair of guide members each have a tapered outer peripheral surface whose diameter gradually decreases toward the other opposing guide member. .