JP2003288567A - Rf-id media - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To connect both the ends in a coil shape of an coil-shaped antenna as to an RF-ID medium having the antenna without taking a time. <P>SOLUTION: Both the ends in the coil shape of the antenna 112 are connected by a connection member 113 which is made of metal and mounted on a resin sheet 115 while covering the IC module 111. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an RF-ID medium capable of writing and reading information in a non-contact state.

[0002]

2. Description of the Related Art In recent years, with the development of an information-oriented society, information is recorded on a card, and information management and payment using the card are performed. In addition, information is recorded on labels and tags attached to products and the like, and products and the like are managed using these labels and tags.

In the information management using such a card, label or tag, an IC equipped with an IC capable of writing and reading information to and from the card, label or tag in a non-contact state is mounted. Contact IC cards, non-contact labels, and non-contact IC tags are rapidly spreading due to their excellent convenience.

A non-contact type IC card or a non-contact type IC label capable of writing and reading information in a non-contact state,
The non-contact type IC tag uses an electromagnetic coupling method that uses mutual induction of coils by an alternating magnetic field, an electromagnetic induction method that uses induced power by the dielectric flux of two coils, and transmits / receives data by microwave. The microwave method, the electrostatic coupling method in which communication is performed by charging between the card or label side and the external information writing / reading side antenna by the capacitor principle, and near infrared light is transmitted at high speed. There is an optical method that uses the energy modulation of light by blinking with, but among these, the electromagnetic induction method that uses the induced power by the dielectric flux of two coils has excellent transparency and Most used because of its high reliability.

In a non-contact type IC card, a non-contact type IC label and a non-contact type IC tag by an electromagnetic induction method, a coil-shaped antenna is formed on a base material and the non-contact type is formed via this antenna. An IC module capable of writing and reading information in a state is mounted in a state of being connected to an antenna, and power is supplied to the IC module via this antenna, and
Information written in the IC module can be read or I
Information is written in the C module.

Here, in the non-contact type IC card, the non-contact type IC label, and the non-contact type IC tag based on the electromagnetic induction method as described above, the coil-shaped antenna generates a current by the electromagnetic induction. Therefore, it is necessary to have a structure in which one loop is formed via the IC module when the IC module is mounted.

6A and 6B are views showing the structure of a general non-contact type IC tag by an electromagnetic induction method, in which FIG. 6A shows the internal structure and FIG. 6B shows AA shown in FIG. It is sectional drawing in a'portion.

The non-contact type IC tag in this conventional example is shown in FIG.
As shown in FIG. 5, an IC module 511 capable of writing and reading information from the outside on the resin sheet 515.
Is mounted and is connected to the IC module 511 via a contact 514, and supplies current to the IC module 511 by electromagnetic induction from an information writing / reading device (not shown) provided outside. 51 with an electrically conductive antenna 512 for writing and reading information to and from the contactless state
0 and the surface of the inlet 510 on which the IC module 511 is mounted via an adhesive layer 550 to protect the IC module 511 and the antenna 512.
The surface sheet 520 has information printed on its surface. Further, the antenna 512 formed on the resin sheet 515 has the coil-shaped both ends of the resin sheet 5
15 are connected to each other on the surface opposite to the surface on which the antenna 512 is formed, so that when the IC module 511 is mounted, one loop is formed via the IC module 511. Has become.

In the non-contact type IC tag 500 constructed as described above, the antenna 512 is moved from the antenna 512 by electromagnetic induction from the information writing / reading device when it is brought close to the information writing / reading device provided outside. IC module 51
1 to supply current, so that in the non-contact state,
The information writing / reading device writes information to the IC module 511, and the information writing / reading device reads the information written in the IC module 511.

Here, in connection of both ends of the coil shape of the antenna 512 formed on the resin sheet 515,
Since the antenna 512 is formed in a coil shape on the resin sheet 515, both ends are connected so as to straddle another antenna portion. However, a pattern for connecting both ends and a pattern straddled by it Must be electrically isolated.

Therefore, as shown in FIG. 6, both ends are connected to each other on the surface of the resin sheet 515 opposite to the surface on which the antenna 512 is formed, or a resist is printed on a pattern portion across the antenna 512. By forming a pattern for connecting both ends on it, the pattern for connecting both ends and the pattern straddled by it are electrically insulated.

[0012]

However, in the conventional non-contact type IC tag as described above, when connecting both ends of the coil-shaped antenna, the surface of the resin sheet on which the antenna is formed is different from that of the resin sheet. By forming a pattern on the opposite surface, or by printing a resist on the antenna pattern and then printing a pattern on it, a pattern for connecting both ends of the coil-shaped antenna and it Since it is electrically insulated from the pattern straddled by, for example, when forming an antenna pattern by printing, the pattern of the part forming the coil shape and the pattern of the part straddling it are printed in separate steps. There is a problem that it takes time and effort to do so.

The present invention has been made in view of the problems of the above-described conventional technique, and in an RF-ID medium having an antenna formed in a coil shape, both ends of the coil shape are formed. It is an object of the present invention to provide an RF-ID medium that can be connected without any trouble and time.

[0014]

In order to achieve the above object, the present invention provides an antenna having a coil shape and is connected to the antenna so that writing and reading of information is not performed via the antenna. In an RF-ID medium having at least a base material on which an IC module is mounted in contact, a U-shape for covering the IC module is provided, and an end of the U-shape is provided. A connecting member made of a conductive material mounted on the base substrate so as to be connected to both ends of the coil shape of the antenna and to cover the IC module with the U-shape. To do.

In addition, an antenna having a coil shape is formed, and a base substrate mounted with an IC module which is connected to the antenna and in which writing and reading of information are performed in a non-contact state via the antenna. In at least an RF-ID medium having at least two sides of the IC module, having a shape along at least two sides of the IC module, connecting both ends of the coil shape of the antenna, and at least two sides of the IC module depending on the shape. And a connecting member made of a conductive material and mounted on the base substrate.

Further, the connection member is mounted on the base substrate along four sides of the IC module.

The height of the connecting member with respect to the base substrate when mounted on the base substrate is higher than that of the IC module when the IC module is mounted on the base substrate. It is characterized by having a thickness that is higher than the height.

Further, the connecting member has a shape such that a thickness of a portion adjacent to a side of the IC module is thicker than thicknesses of other portions.

(Operation) In the present invention configured as described above, both ends of the coil shape of the antenna are provided with U-shapes for covering the IC module, and the base substrate is covered so as to cover the IC module. Since they are connected by the connecting member made of a conductive material, the both ends of the coil shape of the antenna can be easily connected only by mounting the connecting member on the base substrate and the RF-I.
When an external force is applied to the D medium in the bending direction or a pressure is applied to the IC module, the RF-ID medium is damaged or the RF-ID medium is damaged.
The possibility that the ID medium and the antenna are disconnected may be reduced.

Further, both ends of the coil shape of the antenna are I
The antenna has a shape that extends along at least two sides of the C module and is connected by a connecting member made of a conductive material and mounted on the base substrate along at least two sides of the IC module. Both ends of the coil shape can be easily connected only by mounting the connecting member on the base material, and an external force is applied to the RF-ID medium in the bending direction, or the entire RF-ID medium is If pressure is applied to the RF-ID media,
-The possibility that the ID medium and the antenna are disconnected may be reduced.

Further, the thickness of the connecting member is the height of the connecting member with respect to the base substrate when the connecting member is mounted on the base substrate, and the IC when the IC module is mounted on the base substrate. If the height of the module is higher than the height of the module, this pressure will not be applied to the IC module when pressure is applied to the entire surface of the RF-ID medium, and the IC module can be protected more reliably. .

If the shape of the connecting member is such that the thickness of the portion adjacent to the side of the IC module is thicker than the thickness of the other portion, the region on which the connecting member is mounted is gently convex. Become a state.

[0023]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

(First Embodiment) FIG. 1 shows the R of the present invention.
Non-contact type I as the first embodiment of F-ID media
It is a figure which shows an example of a C tag, (a) is a figure which shows a structure,
(B) is a cross-sectional view taken along the line AA ′ shown in (a).

In this embodiment, as shown in FIG. 1, the resin sheet 1
An IC module 111 capable of writing and reading information from the outside is mounted on 15 via an adhesive 116, and the IC module 1 via a contact 114.
11 is connected to the IC module 111 by electromagnetic induction from an information writing / reading device (not shown) provided outside.
An inlet 110 formed with a conductive antenna 112 for supplying a current to the IC module 111 to write and read information to and from the IC module 111 in a non-contact state,
The inlet 110 is laminated on the surface on which the IC module 111 is mounted with an adhesive layer 150 interposed between the IC module 111 and the antenna 112, and includes a surface sheet 120 on which information is printed. . The antenna 112 is formed in a coil shape in a state where the area where the IC module 111 is mounted is broken on the resin sheet 115.
When the module 111 is mounted, the disconnection part is I
The structure is such that it is connected via the C module 111. Further, the portions of the antenna 112 that are both ends of the coil shape are formed on both sides of the disconnection portion of the antenna 112. Further, a connecting member 113 having a U-shape that covers the IC module 111 covers the IC module 111, and the end portion of the U-shape is electrically connected to the coil 112 of the antenna 112. Are mounted on the resin sheet 115 via the adhesive 117 containing conductive particles so as to be electrically connected.
The antenna 112 forms one loop via the IC module 111 and the connection member 113. In this connection member 113, a metal having a large plastic deformation force having spring characteristics represented by stainless steel, stainless spring steel, phosphor bronze plate, quenched ribbon steel, spring steel, etc., brass plate, brass plate, copper plate , Iron plate, duralumin, and other metal plates such as alloys. In addition, adhesive 1
In No. 17, which contains fine conductive particles,
The adhesive 117 alone does not have electrical conductivity, and only those that come into contact with each other through the conductive particles become conductive, so that the end of the connecting agent 113 and the antenna 11 are electrically connected.
2 will be electrically connected.

In the non-contact type IC tag 100 constructed as described above, the antenna 112 is moved from the antenna 112 by electromagnetic induction from the information writing / reading device when it is brought close to the information writing / reading device provided outside. IC module 11
1 to supply current, so that in the non-contact state,
The information writing / reading device writes information to the IC module 111, and the information writing / reading device reads the information written in the IC module 111.

In the non-contact type IC tag 100 as described above, both ends of the coil shape of the antenna 112 are connected by the connecting members 113 made of metal and mounted on the resin sheet 115 so as to cover the IC module 111. Therefore, both ends of the coil shape of the antenna 112 can be easily connected only by mounting the connection member 113 on the resin sheet 115, and an external force is applied to the non-contact type IC tag 100 in the bending direction. If pressure is applied to the IC module 111, the IC module 111 may be damaged or the IC
The possibility that the module 111 and the antenna 112 are disconnected at the contact 114 is reduced. Further, since the connecting member 113 is not in contact with the IC module 111, the connecting member 113 and the resin sheet 115 are
It is possible to use an inexpensive adhesive as the adhesive 117 for adhering to each other, and it is not necessary to perform fine pressure control when adhering the connection member 113 and the resin sheet 115 with the adhesive 117.

The method of manufacturing the non-contact type IC tag 100 as described above will be described below.

FIG. 2 shows the non-contact type IC tag 1 shown in FIG.
It is a figure for demonstrating the manufacturing method of 00.

First, the coil-shaped antenna 112 is formed on the resin sheet 115 by printing or etching (FIG. 2A).

Next, the IC module 111 is mounted on the resin sheet 115 via the conductive adhesive 116 so that the IC module 111 is mounted on the antenna 112, and a predetermined pressure is applied to the IC module 111. As a result, the IC module 111 and the resin sheet 115 are adhered to each other with the adhesive 116, and the antenna 112 and the IC are attached at the contact points 114 provided on the back surface of the IC module 111.
The module 111 is electrically connected to the inlet 11
0 is completed (FIG. 2 (b)).

Next, the connection member 113 is covered with conductive particles on the resin sheet 115 so as to cover the IC module 111 and be electrically connected to both ends of the coil shape of the antenna 112. Mounted via the adhesive 117, and the connecting member 113 and the resin sheet 115 are bonded to each other by applying a predetermined pressure to the connecting member 113.
It adheres by 17 (FIG.2 (c)).

Here, the structure of the connecting member 113 will be described in detail.

FIG. 3 is a view showing one structural example of the connecting member 113 shown in FIG.

As shown in FIG. 3, the connecting member 113 in this embodiment is connected to the antenna 112 and is connected to the connecting portion 118.
However, it has a structure with a plurality of tip shapes,
When a predetermined pressure is applied in a state where the resin sheet 115 is mounted on the resin sheet 115, the pointed shape is cut into the portion of the resin sheet 115 where the antenna 112 is located.
It will be joined to the antenna part of. Accordingly, when the connection member 113 is mounted on the resin sheet 115,
The contact area between the antenna 11 and the antenna 112 increases, and the antenna 11
It is possible to reduce the resistance value between 2 and the connecting member 113.

Then, the adhesive layer 1 is formed on the inlet 110.
Non-contact type IC by laminating the topsheet 120 via 50
The tag 100 is completed (FIG. 2 (d)).

(Second Embodiment) FIG. 4 shows the R of the present invention.
Non-contact type I as the second embodiment of F-ID media
It is a figure which shows the other example of a C tag, (a) is a figure which shows a structure, (b) is sectional drawing in the AA 'part shown to (a), (c) was shown to (a). It is sectional drawing in a BB 'part.

In this embodiment, as shown in FIG. 4, the resin sheet 2
An IC module 211 capable of writing and reading information from the outside is mounted on 15 via an adhesive 216, and the IC module 2 via a contact 214.
11 is connected to the IC module 211 by electromagnetic induction from an information writing / reading device (not shown) provided outside.
An inlet 210 formed with a conductive antenna 212 for supplying electric current to the IC module 211 to write and read information to and from the IC module 211 in a non-contact state,
The inlet 210 is laminated on the surface on which the IC module 211 is mounted with an adhesive layer 250 interposed between the IC module 211 and the antenna 212, and includes a surface sheet 220 on which information is printed. . In the antenna 212, the resin sheet 215 is formed in a coil shape in a state where the area where the IC module 211 is mounted is broken, and
When the module 211 is mounted, the disconnection part is I
The structure is such that it is connected via the C module 211. Also, the portions of the antenna 212 that are both ends of the coil shape are formed on both sides of the antenna 212 in the disconnection portion. Further, the connecting member 21 made of metal has a U-shape so as to extend along the three sides of the IC module 211.
The resin 3 is provided with a conductive adhesive 217 so that 3 is electrically connected to the antenna 212 along the three sides of the IC module 211 and at both ends of the coil shape of the antenna 212. It is mounted on the seat 215, so that the antenna 212 forms one loop via the IC module 211 and the connection member 213. Further, as shown in FIG. 4C, when the connecting member 213 is mounted on the resin sheet 215, the connecting member 213 does not come into contact with the resin sheet 215 except for the portions which become the ends of the coil shape of the antenna 212. It has a shape. Further, regarding the thickness of the connecting member 213, the height with respect to the resin sheet 215 when mounted on the resin sheet 215 via the adhesive 217 is equal to
It is preferable that the height is higher than the height of the IC module 211 mounted on the surface of the IC module 211 via the adhesive 216.

In the non-contact type IC tag 200 constructed as described above, the connecting member is mounted on the resin sheet 215 so that both ends of the coil shape of the antenna 212 are made of metal and follow the outer shape of the IC module 211. Since the antenna 212 is connected by 213, both ends of the coil shape of the antenna 212 can be easily connected only by mounting the connection member 213 on the resin sheet 215, and the antenna 212 can be bent with respect to the non-contact type IC tag 200. When an external force is applied in the direction in which it is applied or pressure is applied to the entire surface of the non-contact type IC tag 200, the IC module 211
The possibility that the IC module 211 is damaged or the IC module 211 and the antenna 212 are disconnected at the contact point 214 is reduced. Further, since the connecting member 213 is not in contact with the IC module 211, an inexpensive adhesive can be used as the adhesive 217 for adhering the connecting member 213 and the resin sheet 215, and the connecting member can be used. 213 and the resin sheet 215 with the adhesive 21
There is no need to perform fine pressure control when bonding with 7. Further, since the connecting member 213 is not provided on the IC module 211, the thickness of the non-contact type IC tag 200 in the region where the IC module 211 is mounted is different from that described in the first embodiment. Can be made thinner, and thus the flatness of the surface of the non-contact type IC tag 200 can be improved.

(Third Embodiment) FIG. 5 shows the R of the present invention.
Non-contact type I as the third embodiment of F-ID media
It is a figure which shows the other example of a C tag, (a) is a figure which shows a structure, (b) is sectional drawing in the AA 'part shown to (a), (c) was shown to (a). It is sectional drawing in a BB 'part.

In this embodiment, as shown in FIG. 5, the resin sheet 3
An IC module 311 capable of writing and reading information from the outside is mounted on 15 via an adhesive 316, and the IC module 311 via a contact 314.
11 is connected to the IC module 311 by electromagnetic induction from an external information writing / reading device (not shown).
An inlet 310 formed with a conductive antenna 312 for supplying current to the IC module 311 to write and read information to and from the IC module 311 in a non-contact state,
The inlet 310 is laminated on the surface on which the IC module 311 is mounted via an adhesive layer 350 to protect the IC module 311 and the antenna 312, and a surface sheet 320 on which information is printed. . Note that the antenna 312 is formed in a coil shape in a state where the area where the IC module 311 is mounted is broken on the resin sheet 315, and
When the module 311 is mounted, the disconnection part is I
The structure is such that it is connected via the C module 311. Further, the portions of the antenna 312 that are both ends of the coil shape are formed on both sides of the antenna 312 in the disconnection portion. Further, a connection member 313 made of metal has a hole into which the IC module 311 is inserted, and the IC module 311 is inserted into this hole, and
The antenna 312 is mounted on the resin sheet 315 via a conductive adhesive 317 so as to be electrically connected to the antenna 312 at both ends of the coil shape of the antenna 312. IC module 3
11 and the connecting member 313 form one loop. Further, as shown in FIG. 5C, when the connecting member 313 is mounted on the resin sheet 315, the connecting member 313 does not come into contact with the resin sheet 315 except for the portions that are the ends of the coil shape of the antenna 312. It has a shape. Further, the thickness of the connecting member 313 is such that it becomes thinner from the portion adjacent to the hole to the outer periphery,
Further, in the case of such a shape that the thickness does not change, the height with respect to the resin sheet 315 when mounted on the resin sheet 315 via the adhesive 317 is
It is preferable that the height is higher than the height of the IC module 311 mounted on the resin sheet 315 via the adhesive 316.

In the non-contact type IC tag 300 constructed as described above, both ends of the coil shape of the antenna 312 are formed on the resin sheet 315 so that the IC module 311 can be inserted into the holes formed inside by the metal. Since they are connected by the mounted connection member 313, both ends of the coil shape of the antenna 312 can be easily connected only by mounting the connection member 313 on the resin sheet 315, and the non-contact type IC tag 300 On the other hand, when an external force is applied in the bending direction or pressure is applied to the entire surface of the non-contact type IC tag 300, I
The possibility that the C module 311 is damaged or the IC module 311 and the antenna 312 are disconnected at the contact 314 is reduced. Further, since the connecting member 313 is not in contact with the IC module 311, an inexpensive adhesive can be used as the adhesive 317 for adhering the connecting member 313 and the resin sheet 315, and at the same time, the connecting member can be used. 313 and resin sheet 3
There is no need to perform fine pressure control when bonding 15 and 15 with the adhesive 317. Further, since the connecting member 313 is not provided on the IC module 311, the IC module 31 is different from the one described in the first embodiment.
It is possible to reduce the thickness of the non-contact type IC tag 300 in the region where the No. 1 is mounted, and thus the non-contact type IC tag 300 is formed.
The flatness of the surface of the tag 300 can be improved.

In the second embodiment, the connecting member 213 having a U-shape along the three sides of the IC module 211, and the third embodiment will be described. In the case of
Although the connection member 313 having a hole composed of sides adjacent to the four sides of No. 1 has been described as an example, a contact member having a shape adjacent to at least two sides of the IC module may be used. When an external force is applied to the IC tag in the bending direction or pressure is applied to the entire surface of the non-contact type IC tag, the IC module may be damaged or the IC module and the antenna may come into contact with each other. The possibility of disconnection is reduced.

Needless to say, the present invention also includes a non-contact type IC tag constructed by combining the components shown in the above-described embodiments.

Further, in the above-described embodiment, the RF capable of writing and reading information in the non-contact state is used.
-The non-contact type IC tag has been described as an example of the ID medium, but the present invention is not limited to the non-contact type IC tag, and an IC module such as a non-contact type IC label or a non-contact type IC card is mounted. Any component including an inlet can be applied.

[0046]

As described above, in the present invention,
An antenna having a coil shape is formed,
An RF-I including at least a base material that is connected to an antenna and has an IC module that writes and reads information in a non-contact state via the antenna.
The D medium is provided with a U-shape for covering the IC module, the ends of the U-shape are connected to both ends of the coil shape of the antenna, and the IC module is covered by the U-shape. In addition, since the connecting member made of a conductive material mounted on the base substrate is provided, both ends of the coil shape of the antenna can be easily connected, and an external force is applied to the RF-ID medium in a bending direction. It is possible to reduce the possibility that the RF-ID medium may be damaged or the RF-ID medium and the antenna may be disconnected when pressure is applied to the IC module or pressure is applied to the IC module.

Further, the base member is provided with a shape which extends along at least two sides of the IC module, connects both ends of the coil shape of the antenna, and is shaped so as to extend along at least two sides of the IC module. In the case where a connecting member made of a conductive material is provided on the
Both ends of the coil shape of the antenna can be easily connected, and when an external force is applied to the RF-ID medium in a bending direction or pressure is applied to the entire RF-ID medium, the RF-ID medium is It is possible to reduce the possibility that the medium will be damaged or the RF-ID medium and the antenna will be disconnected.

The thickness of the reinforcing member is the height of the reinforcing member with respect to the base substrate when the reinforcing member is mounted on the base substrate, and the height of the IC module when the IC module is mounted on the base substrate. In the case where the height is higher than the height of the module, when pressure is applied to the entire surface of the RF-ID medium, this pressure is not applied to the IC module, and the IC module can be protected more reliably.

Further, in the case where the reinforcing member has a shape in which the thickness of the portion adjacent to the side of the IC module is thicker than the thickness of the other portion, the area where the reinforcing member is mounted has a gentle convex shape. Can be

[Brief description of drawings]

FIG. 1 is a diagram showing an example of a non-contact type IC tag according to a first embodiment of an RF-ID medium of the present invention,
(A) is a figure which shows a structure, (b) is A- shown in (a).
It is sectional drawing in A'part.

FIG. 2 is a diagram for explaining a method of manufacturing the non-contact type IC tag shown in FIG.

FIG. 3 is a diagram showing a structural example of a connecting member shown in FIG.

FIG. 4 is a diagram showing another example of the non-contact type IC tag which is the second embodiment of the RF-ID medium of the present invention,
(A) is a figure which shows a structure, (b) is A- shown in (a).
A sectional view taken along the line A ', (c) is B- shown in (a)
It is sectional drawing in a B'portion.

FIG. 5 is a diagram showing another example of the non-contact type IC tag which is the third embodiment of the RF-ID medium of the present invention,
(A) is a figure which shows a structure, (b) is A- shown in (a).
A sectional view taken along the line A ', (c) is B- shown in (a)
It is sectional drawing in a B'portion.

FIG. 6 is a diagram showing a structure of a general non-contact type IC tag by an electromagnetic induction system, (a) is a diagram showing an internal structure,
(B) is a cross-sectional view taken along the line AA ′ shown in (a).

[Explanation of symbols]

100, 200, 300 Non-contact type IC tag 110, 210, 310 Inlet 111, 211, 311 IC module 112, 212, 312 Antenna 113, 213, 313 Connection member 114, 214, 314 Contact 115, 215, 315 Resin sheet 116 , 117, 216, 217, 316, 317
Adhesive 118 Connection part 120,220,320 Topsheet 150,250,350 Adhesive layer

Claims (5)

[Claims] 1. A base substrate on which an antenna having a coil shape is formed, and which is mounted on an IC module which is connected to the antenna and in which writing and reading of information are performed in a non-contact state via the antenna. In at least an RF-ID medium, which is provided with, a U-shape for covering the IC module is provided, and ends of the U-shape are respectively connected to both ends of the coil shape of the antenna, and The IC is shaped like a U
An RF-ID medium comprising a connecting member made of a conductive material and mounted on the base material so as to cover the module. 2. A base material on which an antenna having a coil shape is formed, and which is mounted on an IC module which is connected to the antenna and in which writing and reading of information are performed in a non-contact state via the antenna. In an RF-ID medium having at least, a shape having at least two sides of the IC module is provided, and both ends of the coil shape of the antenna are connected,
Further, it has a connecting member made of a conductive material and mounted on the base substrate so as to extend along at least two sides of the IC module due to the shape.
F-ID media. 3. The RF-ID medium according to claim 2, wherein the connecting member is mounted on the base substrate so as to extend along four sides of the IC module. media. 4. The RF- according to claim 2 or 3.
In the ID medium, the connection member has a height with respect to the base substrate when mounted on the base substrate that is greater than a height of the IC module when the IC module is mounted on the base substrate. An RF-ID medium characterized by having a thickness that also increases. 5. The RF- according to claim 2 or claim 3.
In the ID medium, the RF-ID medium is characterized in that the connecting member has a shape such that a thickness of a portion adjacent to a side of the IC module is thicker than thicknesses of other portions.