JP2003273589A - Electronic circuit component mounting apparatus and image processing system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an image pick-up device which is capable of imaging an object of various sizes ranging from a large to a small ones as satisfying a requirement such as high resolution. <P>SOLUTION: The image processing system of an electronic circuit component mounting apparatus includes a component camera 122 and an image processing computer 166. The image processing computer 166 is equipped with an interpolation enlarging unit 202, the component camera 122 is equipped with an interpolation contacting unit, and either of them is selectively used. A circuit component 30 held by a suction nozzle 70 is imaged by the component camera 122, and the image data are transferred to the image processing computer 166. Interpolation enlargement processing is carried out by the interpolation enlarging unit 202 before image processing is carried out after the image data are transferred to the image processing computer 166. The interpolation contraction processing is carried out by the interpolation contracting unit before the image data are transferred to the image processing computer 166. The image data are subjected to interpolation enlargement processing or interpolation contraction processing at a designated magnification corresponding to the size of the circuit component 30. An XY moving device 52 is controlled on the basis of positional and rotational errors obtained through image processing of the circuit component 30 held by the suction nozzle 70. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image processing system for picking up an image of an object with an image pickup device such as a CCD camera and detecting the shape, size and position of the object based on the obtained image data, and an image processing system. The present invention relates to an electronic circuit component mounting machine equipped with a system.

[0002]

2. Description of the Related Art The image processing system is widely used, for example, in an electronic circuit component mounting machine. The electronic circuit component mounting machine takes out the electronic circuit component from the component supply device by the component holder and picks up the image of the electronic circuit component held by the component holder by the imaging device to hold the electronic circuit component at the holding position. An error (positional error of a predetermined reference point such as center and rotational position error) is acquired, at least the holding position error is corrected, and the error is mounted on the circuit board held by the circuit board holding device. There are many. The electronic circuit components mounted in this electronic circuit component mounting machine are, for example, small components of about 0.6 mm × 0.3 mm to 50 mm ×
It has a wide range of variation up to a large component of about 50 mm, and has a wide range of configurations from a simple rectangular shape to a complicated shape in which a large number of leads project from four sides to the sides. Further, in recent years, in order to improve the mounting density of components in electronic circuits, extremely high precision is required for the mounting position of each electronic circuit component.

If the electronic circuit component has a size of about 2.0 mm × 1.25 mm, the required accuracy can be satisfied even if the length of one pixel of the component is 45 μm.
In the case of a component having a size of about 0.6 mm × 0.3 mm, the number of pixels forming an image of the component decreases, so that the reliability of image processing becomes low. Therefore, the length of one pixel is 12.5
It is necessary to set the thickness to about μm. But,
If the length of one side of one pixel is set to 12.5 μm by a general CCD camera of 512 × 512 pixels,
Only a field of view of 6.4 mm × 6.4 mm can be obtained. Since an electronic circuit component of 10 mm × 10 mm cannot be imaged with this, conventionally, a plurality of CCD cameras having different magnifications are provided, and an appropriate CCD camera is selectively selected according to the size and shape of the electronic circuit component to be imaged. Was used to. This situation is the same even when a line sensor is adopted as the image pickup device.

In addition, the electronic circuit parts are
When the electronic circuit component is mounted on the circuit board when the tilt angle is equal to or greater than a certain value, the mounting position error may become unacceptably large. . If the electronic circuit component is held tilted by the component holder, the dimensions of the image obtained by imaging the component may change subtly, or the image of the component may have a shade difference or partial out-of-focus. If the dimensions of the electronic circuit component are accurately detected, or if the difference in shade and the out-of-focus state are surely detected, it is possible to detect that the electronic circuit component is held in an inclined state. Can be prevented from being attached to. Therefore, C
It is necessary to use an image pickup device such as a CD camera having excellent resolution. However, as described above, it is required to have a high resolution while picking up images of electronic circuit parts whose sizes and shapes are greatly different from each other by one image pickup device. It is difficult to meet. For this reason as well, conventionally, a plurality of image pickup devices having different magnifications are provided, and an appropriate image pickup device is selectively used according to the size and shape of the electronic component to be imaged. .

However, if a plurality of image pickup devices are provided,
In addition to increasing the apparatus cost, operations such as position adjustment and focusing of the image pickup devices are required for the number of image pickup devices, which requires time for maintenance. The above description has been made by taking as an example the image pickup of the electronic circuit component in the electronic circuit component mounting machine, but the image data obtained by picking up the image of the object whose size changes in a wide range is processed to obtain the shape and size of the object. The same problem occurs when it is necessary to acquire the position, etc.

[0006]

SUMMARY OF THE INVENTION In view of the above circumstances, the present invention provides a single imaging device for a wide range of objects from small to large while satisfying the demand for high resolution. The present invention provides an image processing system and an electronic circuit component mounting machine of the following respective aspects. Similar to the claims, each mode is divided into paragraphs, each paragraph is numbered, and the numbers of other paragraphs are referred to as necessary. This is merely for facilitating the understanding of the present invention, and the technical features and combinations thereof described in the present specification should not be construed as being limited to those described in the following respective sections. . Moreover, when a plurality of items are described in one section, it is not always necessary to adopt the plurality of items together. It is also possible to select and use only some of the items.

In each of the following items, (1) corresponds to claim 1, the combination of (2) and (3) is claim 2, and (4) is claim 3. (5) to claim 4, (6) to claim 5, (10) to claim 6, and (11) to claim 7.
Respectively correspond to.

(1) An electronic circuit component is taken out from the component supply device by a component holder, and an image of the electronic circuit component held by the component holder is picked up by an image pickup device to hold the electronic circuit component at a position error. In the electronic circuit component mounting machine for mounting on the circuit board held by the circuit board holding device by correcting at least the holding position error, the image data acquired by the image pickup device is interpolated and enlarged at a specified magnification. An electronic circuit component mounting machine comprising an interpolation processing unit that performs at least one of interpolation reduction. If the image data acquired by the image pickup device is subjected to interpolation enlargement at a designated magnification, image data that is almost equal to the image pickup magnification of the image pickup device can be obtained. When enlarging the image represented by the image data, for example, one pixel is added between two pixels that are adjacent to each other in the vertical direction, the horizontal direction, and the diagonal direction of a large number of pixels forming the imaging surface, It is possible to add the same image data as the original pixel to the newly added pixels, that is, to add the data of the original one pixel to three newly added pixels adjacent to the original pixel data. It is possible to enlarge the image represented by the image data, but the resolution is not improved when the image is enlarged in this way. However, if the interpolation enlargement determined by the interpolation calculation such as using the data of each newly added pixel as the average value of the data of a plurality of original pixels existing around the pixel is performed, the imaging magnification is optically increased. The resolution can be improved almost in the same way as when it is increased. Similarly, when reducing a captured image, for example, instead of simply thinning out the data of every other pixel, interpolation calculation based on the data of a plurality of original pixels adjacent to each other is performed, By determining new one-pixel data instead of pixels, it is possible to obtain image data corresponding to a reduced image that is substantially the same as when the imaging magnification is optically reduced. If both interpolation enlargement and interpolation reduction can be performed, image data corresponding to a case where the imaging magnification is changed in an optically wide range can be obtained, but only one of interpolation enlargement and interpolation reduction is performed. Even if only the image data can be omitted, image data corresponding to the case where the imaging magnification is optically changed within a certain range can be obtained. Therefore, it is possible to cope with electronic circuit components whose size and shape change in a wide range by only providing a smaller number (for example, one) of imaging devices in the electronic circuit component mounting machine as compared with the case where the present invention is not applied. It is possible to obtain an electronic circuit component mounting machine that is inexpensive and easy to maintain. (2) The electronic circuit component mounting machine according to item (1), which includes a magnification determining unit that determines the designated magnification. The designated magnification may be a constant value set in advance, but it is desirable to provide a magnification determination unit and determine it according to the imaging target, the imaging purpose, and the like. (3) The electronic circuit component mounting machine according to (2), wherein the magnification determining unit includes a component corresponding magnification determining unit that determines the designated magnification according to the type of electronic circuit component imaged by the imaging device. If the designated magnification is determined according to the type of electronic circuit component to be imaged, it is convenient to obtain image data equivalent to that of each electronic circuit component captured at a magnification suitable for them. (4) A magnification storage unit in which the component corresponding magnification determination unit stores a plurality of types of electronic circuit components and designated magnifications in association with each other,
The electronic circuit component mounting machine according to item (3), further comprising: a magnification reading unit that reads a designated magnification corresponding to the type of electronic circuit component imaged by the imaging device from the magnification storage unit. Considering the shape and size of electronic circuit parts, required resolution, purpose of imaging, etc., if the designated magnification is decided in advance for each electronic circuit part and stored in the magnification storage section, it is possible to take a picture when imaging each electronic circuit part. , The designated magnification corresponding to the electronic circuit component is read and used. Shape and dimensions of electronic circuit parts,
It is possible for the apparatus to automatically determine the designated magnification in consideration of the required resolution, the purpose of imaging, etc., or it may be performed by a person. (5) The component corresponding magnification determining unit includes a size-dependent magnification determining unit that determines the designated magnification based on at least the size (nominal size) of the electronic circuit component imaged by the imaging device. The electronic circuit component mounting machine described in the item 4). When the designated magnification is automatically determined according to the type of electronic circuit component, it is possible to determine it based on at least the size of the electronic circuit component,
It is desirable in order to easily determine an appropriate designated magnification. For example, when the electronic circuit component is a small component, the designated magnification for interpolation enlargement is determined, and when the electronic circuit component is a large component, the designated magnification for interpolation reduction is determined. If the electronic circuit component has a simple shape, the designated magnification can be determined based on only the size, for example,
For a rectangular parallelepiped electronic circuit component, it is desirable that the designated magnification be determined based on the vertical nominal dimension that is the dimension of the longest side. (6) The designated magnification is the designated magnification for interpolation enlargement (enlargement magnification)
And a scaling factor corresponding to the component,
The electronic circuit component mounting machine according to any one of the items (3) to (5), wherein the length of one side of one pixel of the image data is determined to be in the range of 8 to 20 μm. For example, when the electronic circuit component is a small component or a component having a complicated shape, if the enlargement magnification is determined so that the length of one side of one pixel is in the range of 8 to 20 μm in the image data after the interpolation enlargement, It is possible to obtain a resolution with which it is possible to favorably detect a holding position error of the electronic circuit component by the component holder, a suction error, and the like. (7) The interpolation processing unit includes an interpolation enlargement unit that performs interpolation enlargement of the image data at the designated magnification (1) to (6)
An electronic circuit component mounting machine according to any one of paragraphs. (8) An image processing device that processes image data, and a data transfer unit that transfers the image data acquired by the imaging device to the image processing device, wherein the interpolation enlargement unit performs the image processing by the data transfer unit. The electronic circuit component mounting machine according to item (7), wherein the interpolation enlargement is performed after image data is transferred to the device. If interpolation enlargement is performed, the amount of image data increases. Therefore, if interpolation enlargement is performed before the image data is transferred to the image processing apparatus by the data transfer unit, the time required to transfer the image data becomes long. , It takes a long time from the image pickup to the result of the image processing. In order to avoid this, it is desirable that the interpolation enlargement be performed after the transfer to the image processing apparatus by the data transfer unit. Particularly, when not only the image data corresponding to all the pixels on the image pickup surface but only the image data corresponding to the pixels in the limited area in which the image of the electronic circuit component may exist is acquired and transferred ( The effect of allowing the image data before interpolation enlargement to be transferred when image data corresponding to pixels within a limited area is transferred (referred to as partial acquisition / transfer) (referred to as partial transfer) Is big. Since the image before interpolation enlargement is small and exists only on a part of the imaging surface, the effect of partial acquisition / transfer and partial transfer is particularly large. (9) The interpolation processing unit includes an interpolation reduction unit that performs interpolation reduction of the image data at the designated magnification (1) to (8)
An electronic circuit component mounting machine according to any one of paragraphs. For example, when processing an image of an electronic circuit component that has a large size but a simple shape, or an electronic circuit component that does not require so high mounting position accuracy, it is possible to reduce the amount of image data by interpolation reduction. It is desirable to reduce the time required for (10) An image processing device that processes image data, and a data transfer unit that transfers the image data acquired by the imaging device to the image processing device, wherein the interpolation reduction unit performs the image processing by the data transfer unit. The interpolation reduction is performed before the image data is transferred to the device (9)
The electronic circuit component mounting machine according to the item. If the data transfer unit transfers the image data to the image processing apparatus after the amount of the image data is reduced by the interpolation reduction, the time required for the transfer can be shortened. The effect is particularly large when partial acquisition / transfer or partial transfer is performed, as described in connection with item (8). This is because the image that has been interpolated and reduced is small and exists only on a part of the imaging surface. (11) Image pickup device, image processing apparatus for processing image data obtained by the image pickup device, and image data obtained by the image pickup device are subjected to interpolation reduction at a designated magnification to reduce the amount of image data. An image processing system comprising: a data amount reducing transfer device for transferring the data to the image processing device. If the amount of image data is reduced and then the reduced image data is transferred, the time required for the data transfer and the time required for the image processing can be shortened. (12) An image pickup device, a data transfer device that transfers the image data acquired by the image pickup device, and image data transferred by the data transfer device by subjecting the image data An image processing system comprising: an image processing device for increasing the amount and processing the increased image data. If the image is picked up at a small magnification in advance, the required transfer time and the required processing time of the image data can be shortened. Then, the necessary resolution can be secured by performing interpolation enlargement and processing only when necessary.

[0009]

DETAILED DESCRIPTION OF THE INVENTION An electronic circuit component mounting machine having an image processing system according to an embodiment of the present invention will be described in detail below with reference to the drawings. FIG. 1 schematically shows a plan view of a circuit component mounting machine (hereinafter abbreviated as “component mounting machine”) in the present embodiment. The component mounting machine includes a wiring board transporting device 14, which is a circuit board transporting device provided on the base 10, a component mounting device 16, and a component supply device 18. The wiring board transport device 14 includes a wiring board conveyor 22 that transports the printed wiring board 20 that is a circuit board, and a wiring board holding device 24 that is a board holding device that positions and holds the transported printed wiring board 20 at a predetermined position. It is equipped with.
The component mounting device 16 takes out an electronic circuit component (hereinafter abbreviated as “circuit component”) 30 (see FIG. 2) which is an object from the component supply device 18, is transported by the wiring board transport device 14, and is at a predetermined position. The electronic circuit is assembled by mounting the printed wiring board 20 positioned and held at the predetermined mounting position on the predetermined mounting position. The direction parallel to the carrying direction of the printed wiring board 20 is defined as the X-axis direction, and the direction orthogonal to it is defined as the Y-axis direction.

The component supply device 18 includes a feeder holding base 40 whose position is fixed to the base 10, and a plurality of component feeders 42 on the feeder holding base 40 in which the respective component supply units are arranged in the X-axis direction and are detachably mounted. (Hereinafter abbreviated as “feeder 42”), and is provided at a fixed position. The feeder 42 is a circuit component 3 in the form of a taped electronic circuit component.
It is assumed that 0s are arranged in a line and sent to be positioned in a predetermined component supply unit. However, the feeder 42 is not limited to this, and various types can be adopted, for example, a bulk feeder that accommodates electronic circuit components in a bulk state, arranges them in a row, and supplies them one by one.

The component mounting device 16 is provided with a plurality of (two in the present embodiment) component holding heads 50, and these component holding heads 50 are horizontally moved in the X-axis direction and the Y-axis direction so that the components of the feeder 42 can be moved. The circuit component 30 is taken out from the component supply unit by being moved to the component extraction position corresponding to the supply unit. Therefore, the component mounting device 16 has the XY movement device 5
Equipped with 2. The XY moving device 52 includes the Y-axis slide 5
4, Y-axis slide drive device including Y-axis motor 56, feed screw 57 and nut 58, X-axis slide 60, X-axis motor 62, X-axis slide drive device including feed screw and nut,
A guide device (for example, guide rails 64 and 65 and guide blocks 66 and 67) for guiding each movement of the Y-axis and X-axis slides 54 and 60 is provided.

As shown in FIG. 2, the plurality of component holding heads 50 are arranged on the vertical side surface of the side wall forming the X-axis slide 60 in the X-axis direction which is the same direction as the direction in which the component feeders 42 are arranged. Therefore, it is provided so that it can be raised and lowered and rotated. By moving the X-axis slide 60 by the XY moving device 52, these component holding heads 50 are moved to arbitrary positions in the horizontal plane. Since the plurality of component holding heads 50 all have the same configuration, only one of them is representatively shown in FIG.
explain. As shown in FIG. 2, the component holding head 50 is
A suction nozzle 70 that is a component holder that suction-holds the circuit component 30 by negative pressure, and a nozzle holding portion 72 that detachably holds the suction nozzle 70 are provided. X-axis slide 60
In addition, the lifting device 76 for lifting the nozzle holding part 72
And a rotation device 78 for rotating the component holding head 50 about its axis. The vertical direction of the component holding head 50, which is orthogonal to both the X-axis and Y-axis directions,
This is called the Z-axis direction. Lifting device 76 in the present embodiment
Is a feed screw 80 rotatably held by the X-axis slide 60, and is screwed to the feed screw 80, and the component holding head 50
82 integrally provided on the nozzle holding portion 72 of the
And a Z-axis motor 84 that is a drive source, a drive pulley that transmits the rotation of the Z-axis motor 84 to the feed screw 80, a driven pulley,
A rotation transmission device 86 such as a timing belt is included. The rotation device 86 includes a θ-axis motor 94 that is a drive source,
The rotation transmission device 96 includes a driving gear and a driven gear that transmit the rotation of the θ-axis motor 94 to the component holding head 50.

As shown in FIG. 1, a reference mark camera 120 which is a CCD camera as an image pickup device is attached to the X-axis slide 60. The reference mark camera 120 is provided to detect a holding position error of the printed wiring board 20 by the wiring board holding device 24 by imaging a plurality of detected portions such as the reference marks provided on the printed wiring board 20. It is a thing. Prior to the start of the component mounting work, the reference mark camera 120 is moved to the proper position on the printed wiring board 20 which is positioned and held by the wiring board holding device 24, and each reference mark is imaged to obtain an image. The deviation of the reference mark from the normal position is detected by processing the data by the image processing unit. The position error of each fiducial mark, that is, the holding position error of the printed wiring board 20, is stored in the wiring board holding position error memory of the RAM 156 described later, and when the circuit component 30 is mounted,
It is used to correct the stop position of the X-axis slide 60.

A component camera, which is a CCD camera as an image pickup device, is provided in the middle of a conveyance path where the component holding head 50 conveys the circuit component 30 received from the feeder 42 to the printed wiring board 20 held by the wiring board holding device 24. 122 is provided. This component camera 122
The circuit component 30 held by the component holding head 50 is imaged from below. The obtained image data is processed by an image processing unit, which will be described later, so that the deviation of the circuit component 30 from the regular holding position is detected. The holding position error of the circuit component 30 is stored in the circuit component holding position error memory of the RAM 156, which will be described later, and is used for correcting the stop position of the X-axis slide 60 when the circuit component 30 is mounted. At least one of the reference mark camera 120 and the component camera 122 may be a line sensor.

This component mounting machine has a control unit 15 shown in FIG.
Controlled by 0. The control device 150 includes a PU (processing unit) 152, a ROM 154, and a RAM 15
Computer 1 having 6 and a bus connecting them
60 is mainly used. I / O port 1 on the bus
62 is connected to the image processing computer 166 for analyzing the data of the images taken by the reference mark camera 120 and the component camera 122, the Y-axis motor 56, the X-axis motor 62, the Z-axis motor 84, and the θ-axis motor 94. Various detectors and computers such as an encoder are connected, and the Y-axis motor 56,
An X-axis motor 62, a Z-axis motor 84, a θ-axis motor 94, etc. are connected. Y-axis motor 56, X-axis motor 62, Z
The shaft motor 84 and the θ-axis motor 94 are servomotors as electric motors that are drive sources, and can control the rotation angle with high accuracy. The ROM 154 starts a routine for mounting the circuit component 30 on the printed wiring board 20,
A program for controlling general operations of the component mounting machine is stored. Further, the RAM 156 stores a program and the like for moving the component holding head 50 according to the type of the circuit component 30 to be mounted on the printed wiring board 20, the mounting position, the mounting order, and the like.

The operation of the component mounting machine will be described. X
By the operation of the Y moving device 52, the suction nozzle 70 of the component holding head 50 is moved to the component supply portion of the feeder 42 of the component supply device 18, and the suction nozzle 70 is moved up and down to take out the circuit component 30 from the feeder 42. The suction nozzle 70 that has taken out the circuit component 30 is provided with an XY moving device 52.
Is moved to a position above the predetermined mounting position of the printed wiring board 20 positioned and held by the wiring board holding device 24, the suction nozzle 70 is moved up and down, and the circuit component 30 is mounted on the printed wiring board 20. It However, before that, the reference mark of the printed wiring board 20 is picked up by the reference mark camera 120 to acquire the holding position error of the printed wiring board 20 by the wiring board holding device 24, and the component camera 122 picks it up. The imaging of the circuit component 30 held by the nozzle 70 is performed, and the holding position error of the circuit component 30 by the suction nozzle 70, that is, the center position error and the rotational position error in the X and Y axis directions are acquired. Each suction nozzle 70 is rotated so that the correction is performed, and the X-axis slide 60 is moved. In this way, the parts are sequentially taken out and mounted, and the electronic circuit is assembled. The suction nozzle 7
Imaging of the circuit component 30 held at 0, acquisition of a holding position error, and the like are performed in the image processing system described below.

An image processing system according to this embodiment will be described. As shown in the functional block diagrams of FIGS. 4 and 5, the present image processing system transfers data from the component camera 122 as an imaging device, a data transfer unit 164 attached to the component camera 122, and the data transfer unit 164. Image processing computer 1 for processing compressed image data
66 is included. Image processing computer 166
The image data of the circuit component 30 held by the suction nozzle 70 is analyzed, and the center position error (generally a reference point position error) and the rotation of the circuit component 30 in the X and Y axis directions by the suction nozzle 70 are rotated. The position error is acquired. Further, the reference mark provided on the printed wiring board 20 is imaged by the reference mark camera 120, the image data thereof is transferred to the image processing computer 166, and the holding position error of the printed wiring board 20 by the wiring board holding device 24 is acquired. It However, the illustration and detailed description of the part of the image processing system that captures the reference mark and acquires the position error are omitted.

The circuit component 30 is imaged by the component camera 122, and the acquired image data is transferred to the data transfer section 164.
And is transferred to the image processing computer 166. In the image processing unit 190 of the image processing computer 166,
The center position error and the rotational position error of the circuit component 30 by the suction nozzle 70 are calculated by the image processing, the image processing result is transferred to the computer 160 of the control device 150, and the XY moving device 5 is based on the image processing result.
Each operating device of the component mounting machine such as 2 is controlled. The image data of the circuit component 30 may be subjected to interpolation enlargement or reduction at a designated magnification in the interpolation processing unit depending on the type (especially size and shape) of the circuit component 30. If the designated magnification is larger than 1, the interpolation enlargement is performed, if it is smaller than 1, the interpolation reduction is performed, and if the designated magnification is 1, neither the enlargement nor the reduction is performed. In the present embodiment, for example, the circuit component 30
In the case of a small part, interpolation enlargement is performed, and in the case of a large part, interpolation reduction is performed. As shown in FIGS. 4 and 5, the image processing system includes an image processing computer 16
6 is provided with an interpolation processing unit, and the component camera 122 is also provided with an interpolation processing unit, and one of the interpolation processing units is selected depending on which of the interpolation enlargement process and the interpolation reduction process is performed. Selectively activated. Figure 4
FIG. 5 conceptually shows the functions of the image processing system when the interpolation enlargement processing is performed, and FIG. 5 conceptually shows the functions when the interpolation reduction processing is performed. The component camera 122 is a monochrome CCD camera, and the image acquired by the component camera 122 is composed of a plurality of square CCD elements arranged regularly in a matrix in the vertical and horizontal directions. Image data having the degree of brightness (gradation) of bits (0 to 255) is obtained. The interpolation enlargement process and the interpolation reduction process will be described below.

An example of the case where the interpolation enlargement process is performed in the image processing system will be described with reference to FIG. The image data of the circuit component 30 captured by the component camera 122 is transferred to the image processing computer 166 via the data transfer unit 164 and the communication line 200 before being interpolated and enlarged. At that time, not the image data corresponding to all the pixels on the imaging surface, but only the image data corresponding to the pixels in the limited area where the image of the circuit component 30 may exist is acquired and transferred. Since the area in which the image of the circuit component 30 may exist in the image before the interpolation enlargement is small, the amount of image data to be transferred is small and the time required to transfer the image data is short. In the interpolation enlargement unit 202 which is the interpolation processing unit of the image processing computer 166, the image data is interpolated and enlarged at a designated magnification. The designated magnification is RA
The image data is stored in the designated magnification memory M156 corresponding to the type of the circuit component 30, and the image data is interpolated and enlarged at the designated magnification read from the RAM 156.

When the circuit component 30 has a simple shape such as a rectangular parallelepiped, it is desirable that the designated magnification for interpolation enlargement be determined based only on the size (nominal dimension). In the interpolation enlargement processing of this embodiment, the enlargement magnification is determined so that the length of one side of one pixel of the image data after the interpolation enlargement is in the range of 8 to 20 μm. Small parts (eg 0.6
Image processing of circuit parts 30) of about mm × 0.3 mm,
When detecting a holding position error of the circuit component 30 by the suction nozzle 70, a suction error, or the like, the enlargement magnification is determined so that the resolution of one pixel of the image data after the interpolation enlargement is in the range of 12.5 μm to 20 μm. Is desirable. Conventionally,
In the image processing of small circuit parts, the image of the suction nozzle influences the image processing, and the dimensional error of the circuit parts and the allowable value of the position error to prevent burrs are set. Are held in a tilted position on the suction nozzle, or if there is a suction error (abnormal suction) such as the side surface being sucked instead of the suction target surface, they are not detected and are directly mounted on the circuit board. In some cases, a defective substrate was generated. In the case of a small component of about 0.6 mm × 0.3 mm, the resolution of one pixel is 12.5 μm to 2
If it is about 0 μm, an adsorption error can be satisfactorily detected, and conventionally, an imaging device with a resolution of about 12.5 μm has been used to avoid the above problems. Therefore, in the interpolation enlargement processing in the present embodiment as well, the length of one side of one pixel of the image data after the interpolation enlargement is 8 to 8 so that the resolution is improved almost in the same manner as when the image pickup magnification is optically increased. The magnifying power is determined so as to be in the range of 20 μm.

The interpolation enlargement processing is performed as shown in FIG. It should be noted that FIG. 6 conceptually shows, as an example, a process in the case of performing interpolation enlargement at a specified magnification of 2. As shown in FIG. 6, in the enlargement process 1, in the original image data as the information before the enlargement processing of the transferred image data, the data of a plurality of pixels forming the image data has a gap in units of vertical and horizontal pixels. To be Next, in the enlarging step 2, among the data of the pixels having the gaps formed in the enlarging step 1, four adjacent values (portions indicated by upward hatching in the “enlarging step 2”) The value of one pixel surrounded by four pieces of data is obtained, and one of the values (the portion shown by the downward-sloping hatching in the “enlargement step 2”) is added between the above four pieces of data. Then, in the enlarging step 3, the average value of the four image data of the enlarging step 2 (portion indicated by upward-sloping hatching in the "enlarging step 3") is converted into one image data ( "Enlargement step 3" is newly added as a portion indicated by hatching on the lower right. Through each of the steps described above, image data that is twice as wide as the original image data is obtained. By performing the interpolation enlargement by the interpolation calculation in this way, the resolution can be improved almost in the same manner as when the imaging magnification is optically increased. The portion that performs each of the above steps is the interpolation enlarging unit 202 as an interpolation processing unit.

An example of the case where the interpolation reduction processing is performed in the image processing system will be described with reference to FIG. The interpolation reduction processing is suitable for image processing of the circuit component 30 having a large size but a simple shape, or the circuit component 30 that does not require so high mounting position accuracy, and reduces the amount of image data. Data transfer time and image processing time can be shortened. The circuit component 30 sucked and held by the suction nozzle 70 is imaged by the component camera 122, and the acquired image data is interpolated and reduced by the interpolation reduction unit 210 which is an interpolation processing unit of the component camera 122, and then the data transfer unit 1
Image processing computer 1 via 64 and communication line 200
66. At that time, not the image data corresponding to all the pixels on the imaging surface, but only the image data corresponding to the pixels in the limited area where the image of the circuit component 30 may exist is acquired and interpolated by the interpolation reduction unit 210. Since the size is reduced, the processing time is short. In the interpolation reduction unit 210, the image data (original image data) is interpolated and reduced at a designated magnification. The designated magnification corresponding to the type of the circuit component 30 is stored in the RAM 156 in advance.
The image data is interpolated and reduced by the designated magnification read out from No. 6. The interpolation reduction process is performed, for example, by calculating an average value of data of four pixels adjacent to each other among data of a plurality of pixels forming original image data (pre-reduction information), and a new one pixel replacing the four pixel data. It is carried out by determining the respective data. In this way, it is possible to obtain image data corresponding to a reduced image that is substantially the same as when the imaging magnification is optically reduced.

As is apparent from the above description, in the present embodiment, the component camera 122 constitutes an image pickup device, and the designated magnification memory of the RAM 156 of the computer 160 constitutes a magnification storage section. The portion for reading out the designated magnification corresponding to the type of the circuit component 30 stored in the above constitutes a magnification reading section. The magnification storage section and the magnification reading section constitute a size-dependent magnification determination section as a component-corresponding magnification determination section, which is a kind of magnification determination section. In this embodiment,
The designated magnification is determined in advance according to the type of the circuit component 30 as described above, but at that time, mainly the circuit component 3
Considering the size of 0 and the complexity of the shape, if the shapes are the same, the larger the size, the smaller the designated magnification (the greater the degree of reduction), and the smaller the size, the larger the designated magnification (the degree of the enlargement). Has been large).
Further, if the dimensions are the same, the more complicated the shape, the larger the designated magnification, and the simpler the shape, the smaller the designated magnification. Therefore, this magnification determining unit is a component-corresponding magnification determining unit and also a size-dependent magnification determining unit. In addition, the data transfer unit 164 that transfers the image data acquired by the component camera 122 to the image processing computer 166 before performing the interpolation enlargement constitutes a data transfer device, and the image processing computer 166 performs the interpolation enlargement process on the image data. The image processing apparatus includes an interpolation enlarging unit 202 that is an interpolation processing unit that increases the amount of image data, and configures an image processing apparatus that processes the increased image data. Further, the component camera 122 and the data transfer unit 164 including the interpolation reduction unit 210 as an interpolation processing unit reduce the amount of image data by performing interpolation reduction on the image data acquired by the component camera 122 to perform image processing. It constitutes a data amount reduction transfer device for transferring to the image processing computer 166 which is a device.

If both interpolation enlargement and interpolation reduction can be performed as in the present embodiment, one component camera 122 can satisfy various resolutions of circuit components 30 of various sizes while satisfying the requirement of high resolution. The image data corresponding to the case where the image pickup magnification is changed in an optically wide range can be obtained. However, it is not essential to support both the interpolation enlargement and the interpolation enlargement, and only one of them may be applicable. According to the present embodiment, the device cost can be reduced as compared with the conventional case where a plurality of cameras are required. Furthermore, the number of man-hours for adjusting the position and focusing of the component camera 122 can be reduced, and the time required for maintenance can be reduced.
By interpolating and enlarging the image, the resolution can be improved almost in the same manner as when the imaging magnification of the component camera 122 is optically increased. For example, optical performance 1 pixel 19 μm
By interpolating and enlarging image data of about 1.5 times, a high-quality image corresponding to the optical performance of 12.5 μm per pixel can be obtained. In the interpolation enlargement processing, the image data before the interpolation enlargement is transferred to the image processing computer 166. Therefore, after the image data is transferred in a state where the data amount is relatively small, the interpolation enlargement unit 202 of the image processing computer 166 performs the interpolation enlargement. As compared with the case where the interpolation-enlarged image data is transferred to the image processing computer 166, the time required for the data transfer, and thus the total time required for the image processing including the data transfer, the data processing, etc. Can be shortened. In the interpolation reduction processing, the image data subjected to the interpolation reduction in the interpolation reduction unit 210 of the component camera 122 is the image processing computer 1.
Since the data is transferred to 66, transfer in a state in which the amount of data before interpolation reduction is relatively large is avoided, and in this respect as well, the data transfer time and the time of the entire image processing can be shortened. That is, by performing the interpolation enlargement processing or the interpolation reduction processing on the image data as in the present embodiment, it is possible to cope with high-speed and high-accuracy mounting work by the component mounting machine.

However, the interpolation processing section of the component camera 122 can be made to function as the interpolation enlarging section to perform the interpolation enlarging processing, and the interpolation processing section of the image processing computer 166 can be made to function as the interpolation reducing section. It is also possible to perform interpolation reduction processing. Furthermore, an image processing system in which only one of the component camera 122 and the image processing computer 166 includes an interpolation processing unit can be used.

The image processing system, as shown in FIG.
The image capturing unit 300 may be provided between the component camera 122 and the image processing computer 166. For example, unlike the embodiment shown in FIGS. 4 and 5, the image capturing unit 300 is provided when the image processing computer 166 does not have the function of the image capturing unit. The image capturing unit 300 is connected to the component camera 122 via the communication line 302, and it is desirable that the image capturing unit 300 is connected to the image capturing unit 300 from the component camera 122 by a parallel signal so that image data can be transferred at high speed. The image capturing unit 300 includes an interpolation processing unit 310. The interpolation processing unit 310 may have the functions of both the interpolation enlarging unit and the interpolation reducing unit, and one of them may be selectively used according to the type of the circuit component 30. It may have only one function. Circuit component 30 acquired by the component camera 122
Image data is sent to the image capturing section 300 and subjected to interpolation enlargement or interpolation reduction in the same manner as described above. As described above, the image data before being subjected to the interpolation enlargement process or the interpolation reduction process is not the image data corresponding to all the pixels on the image pickup surface, but the image of the circuit component 30 may be limited. It is desirable that only the image data corresponding to the pixels in the area be acquired and sent to the image capturing unit 300. After the interpolation enlargement processing or the interpolation reduction processing, the processed image data is transferred from the data transfer unit 306 to the image processing computer 166, image processing is performed in the image processing unit 190, and the image processing result is the circuit component holding position error of the RAM 156. It is stored in the memory and used for correction of the stop position of the XY moving device 52.

The above-described interpolation enlargement processing and interpolation reduction processing of image data are examples of the interpolation processing, and the data of each newly added pixel is averaged over the data of a plurality of original pixels existing around the pixel. It was decided by a linear interpolation calculation as a value, but in addition to linear interpolation like this,
The pixel data may be non-linearly interpolated and enlarged. For example, as described in Japanese Patent Laid-Open No. 3-201673, an approximate curved surface is obtained based on actual grayscale values of a plurality of pixels vertically and horizontally adjacent to each other, and interpolation enlargement and interpolation are performed using the approximate curved surface. It is also possible to reduce the size.

The electronic circuit component mounting machine may be of a form other than the above embodiment. For example, a component holding head including a plurality of nozzle holders that respectively hold a plurality of suction nozzles is swung around one swivel axis, and a plurality of suction nozzles sucks an electronic circuit component from a component supply device at a component suction position, It may be adopted in an electronic circuit component mounting machine of the type that is mounted on the circuit board held by the circuit board holding device at the component mounting position. In the component supply device of the electronic circuit component mounting machine having this configuration, a plurality of electronic circuit component feeders are supported on the feeder support, and the plurality of electronic circuit component feeders are arranged in a direction parallel to the direction in which the component supply units are arranged. It includes a support moving device for moving the feeder support so that it can move. Also, the circuit board holding device is
An XY moving device, which is a relative moving device, is included so that the circuit board can be moved to any position in a plane parallel to the surface thereof. For example, the electronic circuit component mounting machine described in JP-A-6-342998 corresponds to this.

Although some embodiments of the present invention have been described in detail above, these are merely examples, and the present invention is described in the above-mentioned [Problems to be solved by the invention, means for solving problems and effects]. Various modifications and improvements can be performed based on the knowledge of those skilled in the art, including the described embodiments.

[Brief description of drawings]

FIG. 1 is a plan view schematically showing an electronic circuit component mounting machine including an image processing system according to an embodiment of the present invention.

FIG. 2 is a front view (partial cross section) showing a component holder of the electronic circuit component mounting machine.

FIG. 3 is a block diagram showing a part deeply related to the present invention in a control device for controlling the electronic circuit component mounting machine.

FIG. 4 is a functional block diagram conceptually showing the function of performing interpolation enlargement in the image processing system.

FIG. 5 is a functional block diagram conceptually showing a function when performing interpolation reduction in the image processing system.

FIG. 6 is a diagram for explaining each step of the interpolation enlargement processing.

FIG. 7 is a functional block diagram conceptually showing the functions of an image processing system which is another embodiment of the present invention.

[Explanation of symbols]

16: Component mounting device 18: Component supply device 20:
Printed wiring board 24: Wiring board holding device 30: Electronic circuit component 50: Component holding head 52: XY moving device 70: Suction nozzle 122: Component camera
150: Control device 156: RAM 166: Image processing computer 190: Image processing unit 20
2: Interpolation enlargement unit 210: Interpolation reduction unit 300: Image capture unit 310: Interpolation processing unit

Claims (7)

[Claims] 1. A holding position error of an electronic circuit component by the component holder is obtained by taking out an electronic circuit component from the component supply device by the component holder and imaging the electronic circuit component held by the component holder by an imaging device. In an electronic circuit component mounting machine that acquires and corrects at least the holding position error and mounts on the circuit board held by the circuit board holding device, in the image data acquired by the imaging device, interpolation enlargement and interpolation of a specified magnification An electronic circuit component mounting machine comprising an interpolation processing unit that performs at least one of reduction and reduction. 2. A component deciding unit that decides the designated magnification according to the type of electronic circuit component imaged by the image pickup device. The electronic circuit component mounting machine according to claim 1, comprising. 3. The component corresponding magnification determination unit stores a magnification storage unit that stores a plurality of types of electronic circuit components and designated magnifications in association with each other, and designates according to the type of electronic circuit components imaged by the imaging device. The electronic circuit component mounting machine according to claim 2, further comprising a magnification reading unit that reads a magnification from the magnification storage unit. 4. The component-dependent magnification determination unit includes a size-dependent magnification determination unit that determines the designated magnification based on at least the size of an electronic circuit component imaged by the imaging device. Electronic circuit component mounting machine. 5. The designated magnification includes a designated magnification for interpolation enlargement (enlargement magnification), and the component corresponding magnification determination unit sets the enlargement magnification to a length of one side of one pixel of image data of 8 to 20 μm.
The electronic circuit component mounting machine according to any one of claims 2 to 4, wherein the electronic circuit component mounting machine is determined to be within a range of m. 6. An image pickup device, an image processing apparatus for processing image data obtained by the image pickup device, and an amount of image data obtained by subjecting the image data obtained by the image pickup device to interpolation reduction of a designated magnification. And an image processing system for reducing the amount of data transferred to the image processing apparatus. 7. An image pickup device, a data transfer device for transferring image data acquired by the image pickup device, and an image obtained by subjecting the image data transferred by the data transfer device to interpolation enlargement processing at a specified magnification. An image processing system, comprising: an image processing apparatus that increases the amount of data and processes the increased image data.