JP2003121766A - Manufacturing method for optical component and optical switch - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method for an optical component and an optical switch which make it possible to join a first substrate where an optical waveguide is formed and a second substrate which has a specified optical element together extremely easily. SOLUTION: A 1st surface (where a first hollow part 31 is formed) of the first substrate 30 and a second surface (where a second hollow part 41 is formed) of the second substrate 40 are put opposite each other and united together. At this time, a joining member 50 is sandwiched between the first hollow part 31 and second hollow part 41 which face each other. The joining member 50 is made of a material (e.g. Pyrex (registered) glass) which can be joined with the first substrate 30 and second substrate 40 and is cylindrically formed. Then while the joining member 50 is sandwiched between the first substrate 30 and second substrate 40, the first substrate 30 and joining member 50 are joined together by anodization and the second substrate 40 and joining member 50 are joined together by anodization to unite the first substrate 30 and second substrate 40 together.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical component manufacturing method and an optical switch.

[0002]

2. Description of the Related Art As a method of manufacturing an optical component of this type, for example, Journal of Japan Institute of Electronics Packaging Vol. 3 No. 6 (2000).
The ones disclosed in P.470 to P.475 are known.
Journal of Japan Institute of Electronics Packaging Vol.3 No. 6 (2000)
In the method of manufacturing an optical component disclosed in P.470 to P.475, first, the alignment of the planar optical waveguide substrate and the optical element is performed with the alignment mark formed on the upper surface of the planar optical waveguide substrate and the lower surface of the optical element. It is based on. An image of the alignment mark formed on the flat optical waveguide substrate and the optical element is imaged, and the flat optical waveguide substrate or the optical element is moved so that the positions of both alignment marks match. After that, the both are positioned and heated to bond (bond) the optical element to the planar optical waveguide substrate.

[0003]

However, in the alignment using the alignment marks formed on the planar optical waveguide substrate and the optical element, the position in units of 0.1 μm for moving the planar optical waveguide substrate or the optical element. A drive mechanism having reproducibility is required, and it is necessary to heat and bond while maintaining the state of being positioned by the drive mechanism. For this reason, an expensive and complicated alignment device is required to accurately bond the planar optical waveguide substrate and the optical element. In addition, the alignment process itself becomes complicated.

Further, there are the following problems regarding the joining of the flat optical waveguide substrate and the optical element. When anodic bonding is adopted, there is a problem that either the planar optical waveguide substrate or the optical element must be a material containing specific ions. When the direct joining is adopted, for example, it is necessary to heat the silicon (Si) to about 1000 ° C. and there is a problem such as melting. In the case of adopting liquid phase bonding, there is a possibility that misalignment may occur in the liquid phase state and it is difficult to maintain positional accuracy.

The present invention has been made in view of the above points, and it is possible to very easily bond a first substrate having an optical waveguide and a second substrate having a predetermined optical element to each other. An object of the present invention is to provide a method of manufacturing a component and an optical switch.

[0006]

According to the method of manufacturing an optical component of the present invention, a first substrate having an optical waveguide and a predetermined optical element are moved to the optical waveguide. A method of manufacturing an optical component in which a second substrate on which a drive mechanism is formed is opposed to the first substrate, and a joining member made of a material that can be joined to the first substrate and the second substrate is provided on the first substrate and the second substrate. Two
It is characterized in that it is sandwiched between the first substrate and the joining member and the second substrate and the joining member are joined together.

In the method of manufacturing an optical component according to the present invention, a joining member made of a material that can be joined to the first substrate and the second substrate is sandwiched between the first substrate and the second substrate. 1
Since the second substrate and the joining member are joined while the second substrate and the joining member are joined together, a material suitable for joining the first substrate and the second substrate may be selected as the material of the joining member. It is not necessary to change the materials of the first substrate and the second substrate to ones suitable for bonding, and both substrates can be bonded very easily.

The method of manufacturing an optical component according to the present invention is
A first substrate having an optical waveguide formed on a first surface, and a second substrate having a predetermined optical element and a drive mechanism for moving the optical element with respect to the optical waveguide formed on a second surface. Is a method of manufacturing an optical component in which a first surface and a second surface are opposed to each other and bonded, and a first recessed portion is formed at a first position on the first surface,
A second recess is formed at a second position corresponding to the first position on the second surface, and a bonding member made of a material that can be bonded to the first substrate and the second substrate is used as the first position and the second position. The first substrate and the joining member are joined to each other by sandwiching the first substrate and the joining member, and the second substrate and the joining member are joined to each other.

In the method of manufacturing an optical component according to the present invention, a joining member made of a material that can be joined to the first and second substrates is sandwiched between the first and second substrates. 1
Since the second substrate and the joining member are joined while the second substrate and the joining member are joined together, a material suitable for joining the first substrate and the second substrate may be selected as the material of the joining member. It is not necessary to change the materials of the first substrate and the second substrate to ones suitable for bonding, and both substrates can be bonded very easily.

Further, in the method for manufacturing an optical component according to the present invention, since the joining member is sandwiched between the first position and the second position, the first substrate and the second substrate are kept in the positional accuracy. It is possible to join with. Further, since the first substrate and the second substrate are positioned by sandwiching the joining member between the corresponding first position and second position, the alignment mark is used as in the prior art. Both substrates can be positioned inexpensively and easily as compared with the conventional positioning.

Further, it is preferable that the first substrate and the joining member are anodically joined, while the second substrate and the joining member are anodically joined. Further, it is preferable that the first substrate and the bonding member are liquid-phase bonded while the second substrate and the bonding member are liquid-phase bonded. In any case, by using the existing bonding method, both substrates can be bonded more inexpensively and easily.

The joining member preferably has a columnar outer shape. In this case, it is possible to easily secure the positioning accuracy equivalent to that of the conventional technique, though the configuration is simple.

Further, the joining member preferably has a spherical outer shape. In this case, it is possible to easily secure the positioning accuracy equivalent to that of the conventional technique, though the configuration is simple.

On the other hand, the optical switch according to the present invention has a drive mechanism that has a first substrate having an optical waveguide formed on a first surface and a predetermined optical element, and moves the optical element with respect to the optical waveguide. Is an optical switch in which a first substrate and a second substrate formed on the second surface are joined with the first surface and the second surface facing each other.
A first recess formed at a first position on the surface, a second recess formed at a second position corresponding to the first position on the second surface, and a first substrate and a second substrate. It is made of a material capable of being joined to each other, and is sandwiched between the first position and the second position, and
And a joining member joined to the second substrate.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION A method of manufacturing an optical component and an optical switch according to an embodiment of the present invention will be described with reference to the drawings. In the description, the same elements or elements having the same function will be denoted by the same reference symbols, without redundant description.

First, the configuration of the optical switch 1 according to this embodiment will be described with reference to FIGS. 1 and 2. Figure 1
[Fig. 2] is a schematic view showing an optical switch according to an embodiment of the present invention, and Fig. 2 is a sectional view taken along line II-II thereof. Note that, in FIG. 1, the illustration of a silicon substrate 13 described later is omitted.

The optical switch 1 is a 2 × 2 switch. The optical switch 1 includes a flat optical waveguide substrate 2. Optical waveguides A and B are formed on the planar optical waveguide substrate 2. The optical waveguides A and B are provided so as to intersect each other at a predetermined angle. The planar optical waveguide substrate 2 includes a silicon (Si) substrate 3 and a quartz glass layer 4 formed on the surface of the silicon substrate 3. The quartz glass layer 4 includes cores corresponding to the patterned optical waveguides A and B,
And a clad formed on the silicon substrate so as to cover the core. The distance between the optical waveguides A and B at the input / output end (the end of the planar optical waveguide substrate 2) is set to 250 μm. An insulating layer 5 is formed on the planar optical waveguide substrate 2.
(For example made of silicon dioxide (SiO ₂ )).

On the surface of the planar optical waveguide substrate 2, there is formed a groove T which linearly extends so as to cross each optical axis of the optical waveguides A and B at each intersection with the optical waveguides A and B. The groove T has a depth such that the end faces of the optical waveguides A and B are exposed. In this embodiment, a planar optical waveguide substrate 2 having a thickness of 850 μm is used, and a groove T having a width of 55 μm and a depth of 50 μm is formed in the planar optical waveguide substrate 2 by a dicing technique.

A mirror device 6 is mounted on such a flat optical waveguide substrate 2. The mirror device 6 is
The movable member 7 having a cantilever structure is fixed on the insulating layer 5, and the movable member 7 extends to the groove T in a direction perpendicular to the width direction of the optical switch 1. The movable member 7 is made of, for example, silicon and has a thickness of 50 μm. Silicon, which is the material of the movable member 7, is made conductive by doping impurities such as boron.
A comb tooth portion 8 including a plurality of comb teeth 8 a is formed on the tip side portion of the movable member 7. Further, at the tip of the movable member 7, the optical waveguide A in the space defined by the groove T,
A mirror 9 (predetermined optical element) that blocks light passing on the optical path of B is fixed, and this mirror 9 is configured to enter the groove T, and is defined by the movable member 7 by the groove T. It will be held in the space. Mirror 9
Is, for example, 30 μm in thickness, 50 μm in height, and 50 in width.
It has a dimension of μm.

On the insulating layer 5, an elongated electrode 10 facing the movable member 7 is provided. This electrode 10
Extend to the groove T in parallel with the movable member 7. Similarly to the movable member 7, the electrode 10 is also made of conductive silicon and has a thickness of 50 μm. Electrode 1
A comb tooth portion 11 composed of a plurality of comb teeth 11 a is formed in a portion of 0 which faces the comb tooth portion 8.
It is configured such that a enters between the comb teeth 8a of the comb tooth portion 8. Here, the movable member 7 and the electrode 10 are the mirror 9
Functions as a drive mechanism for moving the optical waveguides with respect to the optical waveguides A and B.

An insulating layer 1 made of, for example, silicon dioxide (SiO ₂ ) is formed on the movable member 7 and the electrode 10.
Two are provided. The insulating layer 12 has a thickness of 2 μm, for example. A silicon substrate 13 is provided on the insulating layer 12.

The movable member 7 and the electrode 10 are connected to the voltage source 14
The voltage source 14 applies a predetermined voltage between the movable member 7 and the electrode 10,
An electrostatic force is generated between the movable member 7 and the electrode 10. The electrostatic force causes the movable member 7 to move.
The base 9a is bent with the base end portion 7a as a fulcrum, and accordingly, the mirror 9 moves along the bottom surface of the groove T by 50 μm in the arrow P direction substantially perpendicular to the extending direction of the movable member 7.

In such an optical switch 1, in the initial state (OFF state), the movable member 7 extends straight. In this state, the mirror 9 is in a state of advancing with respect to the optical paths of the optical waveguides A and B in the space defined by the groove T. For example, light passing on the optical waveguide A is reflected by the mirror 9 and is reflected by the optical waveguide B. Be led to. On the other hand, when a predetermined voltage is applied between the movable member 7 and the electrode 10 by the voltage source 14, the tip end portion of the movable member 7 is attracted to the electrode 10 by the electrostatic force generated between the movable member 7 and the electrode 10. , The mirror 9 moves to the electrode 10 side. This state (ON
(State), the mirror 9 is in a state of withdrawing with respect to the optical paths of the optical waveguides A and B in the space defined by the groove T. For example, light passing on the optical waveguide A passes through the groove T and again enters the optical waveguide. Guided by A.

At this time, since the comb-teeth portion 11 is provided on the electrode 10, the surface area of the electrode 10 as a whole is increased.
Therefore, the electrostatic force generated between the movable member 7 and the electrode 10 becomes large. Thereby, the movable member 7 and the electrode 10
It is possible to reduce the voltage value applied between and and to shorten the length of the movable member 7.

An example of the manufacturing process of the mirror device 6 will be described with reference to FIG.

First, an SOI (Silicon On Insulator) wafer is prepared. This wafer consists of a silicon (Si) substrate 23 having a thickness of 500 μm and a SiO ₂ layer 2 having a thickness of 3 μm.
4 is formed, and S having a thickness of 50 μm is formed on the SiO ₂ layer 24.
The i layer 25 is formed (see FIG. 3A). Then, a thickness of 2 μm for forming the movable member 7, the electrode 10 and the like on the Si layer 25 by photolithography.
A resist pattern 26 of m is formed (see FIG. 3B). Next, using the resist pattern 26 as a mask, the Si layer 25 is etched by reactive ion etching (see FIG. 3C). Then, photolithography is performed with a photoresist 27 having a thickness of 50 μm to form a pattern for forming the mirror 9 (see FIG. 3D). Next, the mirror portion 28 is formed by nickel plating, for example, and the resist 27 is removed (FIG. 3).
(See (e)). Then, the SiO ₂ layer (sacrificial layer) 24 is removed by wet etching using hydrofluoric acid. As a result, the SiO ₂ layer 24 under the portion having a small pattern width is formed.
Are completely removed and a cantilever is formed (Fig. 3 (f)).
reference).

Next, a method of manufacturing the optical switch 1 having the above-described structure will be described with reference to FIGS.

As shown in FIG. 4B, the first substrate 30 is a silicon substrate 30a (the above-mentioned silicon substrate) having a quartz glass layer 30b (corresponding to the above-mentioned quartz glass layer 4) formed on the surface thereof. (Corresponding to 3). The thickness of the quartz glass layer 30b is about 30 μm. On the one surface (first surface) side of the first substrate 30, as shown in FIG.
Portions 32 corresponding to a large number of flat optical waveguide substrates 2 to be cut and separated later are formed. Then, the first substrate 3
A predetermined position (first position) outside the region where the portion 32 corresponding to the planar optical waveguide substrate 2 is formed on one surface of 0 (the surface where the portion 32 corresponding to the planar optical waveguide substrate 2 is formed) Then, the first recess 31 is formed. In the present embodiment, the first recess 31 is formed at three places.

As shown in FIG. 4B, the first recess 31 is a groove having a V-shaped cross section. First depression 3
1 (groove) is formed by cutting using a dicing technique or the like. At this time, the first recess 31 (groove) is processed and formed with an accuracy of about ± 1 μm. In this embodiment, the width of the first recess 31 (groove) is set to about 200 μm, and the depth thereof is set to about 100 μm.
The angle of the bottom of the first recess 31 (groove) is 90 degrees.

The second substrate 40 is made of a silicon substrate (corresponding to the above-mentioned silicon substrate 13), and the second substrate 40
As shown in FIG. 5A, a portion 42 corresponding to a large number of mirror devices 6 to be cut and separated later is formed on the one surface (second surface) side. Then, the first recessed portion 3 outside the region where the portion 42 corresponding to the mirror device 6 is formed on the one surface of the second substrate 40 (the surface where the portion 42 corresponding to the mirror device 6 is formed).
The second recess 41 is formed at a position (second position) corresponding to 1. In this embodiment, the 2nd hollow part 41 is formed in 3 places.

As shown in FIG. 5B, the second recess 41 is a groove having a V-shaped cross section like the first recess 31. Since the second substrate 40 is a Si substrate,
The material of the surface portion on the one surface (second surface) side of the substrate 40 is made of silicon, and the second recess 41 (groove) is formed by crystal anisotropic etching with 100 surface as the surface. At this time, the second recess 41 (groove) is processed and formed with an accuracy of the order of 0.1 μm. In this embodiment,
The width of the second recess 41 (groove) is set to about 200 μm, and the depth thereof is set to about 300 μm. The angle of the bottom of the second recess 41 (groove) is 70 degrees.

Next, as shown in FIGS. 6A and 6B, the first substrate 30 and the second substrate 40 are integrated. At this time, one surface (first surface) of the first substrate 30 and one surface (second surface) of the second substrate 40 are opposed to each other. First
One surface of the substrate 30 is a surface facing the second substrate 40, and one surface of the second substrate 40 is a surface facing the first substrate 30. Then, the first substrate 30 and the second substrate 40
When they are opposed to each other and integrated with each other, between the first position and the second position, that is, the corresponding first hollow portion 31 and second hollow portion 4
The joining member 50 is sandwiched between the first and second members.

The joining member 50 is made of a material that can be joined to the first substrate 30 and the second substrate 40, and in this embodiment, Pyrex glass (borosilicate glass doped with sodium (Na)). ) Consists of. As shown in FIG. 6, this joining member 50 has a cylindrical outer shape, and its diameter is set to about 100 μm. In the state where the joining member 50 is sandwiched between the first hollow portion 31 and the second hollow portion 41, as shown in FIG. 6B, the joining member 50 and the silicon substrate 3 of the first substrate 30.
It is in contact with the 0a part.

The joining member 50 may have a spherical outer shape, as shown in FIG. Here, the first substrate 30 and the second substrate 40 are adjusted by adjusting the depths and widths of the first depressions 31 and the second depressions 41 (grooves) and the size (diameter, etc.) of the joining member 50. The interval between and can be set to a desired value.

Next, as described above, the first substrate 30 and the bonding member 50 are anodically bonded while the bonding member 50 is sandwiched between the first substrate 30 and the second substrate 40. , The second substrate 40 and the bonding member 50 are anodically bonded. The anodic bonding is performed by applying a negative voltage of about 400 V to the first substrate 30 and the second substrate 40 side for about 10 minutes while heating at 420 ° C. As a result, Na ions in the Pyrex glass move and bond with the silicon of the first substrate 30 and the second substrate 40,
The first substrate 30 and the joining member 50 are joined together, and the second substrate 40 and the joining member 50 are joined together.
The first substrate 30 and the second substrate 40 are integrated with each other through the. An adhesive or the like is applied in advance to desired portions on the portion 32 corresponding to the planar optical waveguide substrate 2 and the portion 42 corresponding to the mirror device 6, and liquid phase bonding is performed. Joining member 5
When Pyrex glass is used as 0, the coefficient of thermal expansion of silicon is almost the same as that of silicon, so that it does not break when the temperature changes.

In addition to the Pyrex glass described above, the material of the joining member 50 is alumina borosilicate glass (SiO 2).
_{2 -B 2 O 2 -Al 2 O} 3) sodium or lithium (L
A material doped with i), aluminum (Al), or the like may be used. For example, alumina borosilicate glass with Na
Alternatively, when using Li-doped one, the anodic bonding is
It may be performed by applying a negative voltage of about 100 V to the first substrate 30 and the second substrate 40 side for about 10 minutes in a state of being heated to 350 ° C.

Liquid phase bonding may be used instead of anodic bonding. In the case of liquid phase bonding, low melting point glass or gold (Ag) can be used as the material of the bonding member 50. When these materials are used, the joining member 50 is deformed to bring the first substrate 30 and the second substrate 40 into close contact with each other. Thus, the first substrate 30 and the second substrate 30
In a state in which the substrate 40 and the substrate 40 are closely attached, a portion 32 corresponding to the planar optical waveguide substrate 2 and a portion 4 corresponding to the mirror device 6
You may make it anodic-bond to 2 and.

Then, the integrated first substrate 30 and second substrate 40 are simultaneously cut by using a known dicing technique or the like. The integrated first substrate 30 and second substrate 40 are fixed to a dicing device (not shown) and then cut into a plurality of pieces, as shown in FIGS. 1 and 2. The optical switch 1 is separated.

As described above, in this embodiment, the first
The bonding member 50 made of a material that can be bonded to the first substrate 30 and the second substrate 40 is attached to the first substrate 30 and the second substrate 40.
Since the first substrate 30 and the joining member 50 are joined by being sandwiched between the first substrate 30 and the joining member 50, the second substrate 40 and the joining member 50 are joined to each other. It suffices to select a material suitable for bonding with the substrate 40, and it is not necessary to change the materials for the first substrate 30 and the second substrate 40 to those suitable for bonding. Can be joined to.

Further, in this embodiment, when the first substrate 30 and the second substrate 40 are opposed to each other and integrated,
Between the first position and the second position, that is, the first recess 31 (groove) formed on the first surface of the first substrate 30 and the second recess formed on the second surface of the second substrate 40. Since the joining member 50 is sandwiched between the two recesses 41 (grooves), it is possible to join the first substrate 30 and the second substrate 40 in a state in which positional accuracy is ensured. Further, by sandwiching the joining member 50 between the corresponding first position and the corresponding second position, that is, between the corresponding first recess 31 and the corresponding second recess 41, the first substrate is formed. Since the substrate 30 and the second substrate 40 are positioned, both the substrates 30 and 40 can be positioned inexpensively and easily as compared with the positioning using the alignment mark as in the conventional technique.

Further, in this embodiment, the first recess 31 formed on the first substrate 30 and the second recess 41 formed on the second substrate 40 are grooves having a V-shaped cross section. .
As a result, it is possible to easily secure the positioning accuracy equivalent to that of the conventional technique, even though the configuration is simple.

In this embodiment, the joining member 5 is also used.
0 has a cylindrical outer shape or a spherical outer shape.
As a result, it is possible to easily secure the positioning accuracy equivalent to that of the conventional technique, even though the configuration is simple.

Further, in this embodiment, the first substrate 30 and the joining member 50 are anodically joined, while the second substrate 40 and the joining member 50 are anodically joined. Further, the first substrate 30 and the joining member 50 are liquid-phase joined, while the second substrate 40 and the joining member 50 are liquid-phase joined. With any of these, by using the existing bonding method, both substrates can be bonded more inexpensively and easily.

Further, in the optical switch 1 of the present embodiment, the mirror 9 is fixed to the tip of the movable member 7, and the mirror 9 is substantially aligned with the groove T in the extending direction of the movable member 7. Since the movable member 7 is driven so as to move in the vertical direction (almost the width direction of the optical switch), the displacement amount of the mirror 9 can be small. Further, since the movable member 7 has a cantilever structure, the driving force for displacing the mirror 9 by a predetermined amount is small compared to the case where the double-supported beam structure is adopted. In addition to this, the movable member 7 and the electrode 10 are By integrally molding, the scale of the electrode 10 can be reduced. Thereby, the electrode 10 can be elongated along the movable member 7, so that the width dimension of the optical switch 1 can be reduced. Therefore, the optical switch 1 can be miniaturized and highly integrated, and the array of the optical switch 1 can be easily achieved.

Next, the configuration of a modification of the optical switch 1 according to this embodiment will be described with reference to FIGS. FIG. 8 is a schematic diagram showing a modification of the optical switch according to the embodiment of the present invention, FIG. 9 is a sectional view taken along the line IX-IX, and FIG. 10 is a sectional view taken along the line XX. In addition,
In FIG. 8, as in FIG. 1, the silicon substrate 13 is not shown. In the modified examples shown in FIGS. 8 to 10, the first recess and the second recess are formed on the optical switch side.

The optical switch 101 is a 2 × 2 switch, like the optical switch 1 described above. Optical switch 101
Has a planar optical waveguide substrate 2, and this planar optical waveguide substrate 2
At a first position outside the region where the optical waveguides A and B are formed on the first surface (the surface facing the mirror device 6) of the first recess 131 (for example, a groove having a V-shaped cross section). Are formed. The first recess 131 is provided so as to extend in the longitudinal direction of the planar optical waveguide substrate 2, that is, in the direction intersecting (for example, orthogonal to) the groove T. here,
The planar optical waveguide substrate 2 functions as a first substrate. First
The depression 131 (groove) is the above-mentioned first depression 31 (groove).
Similar to the above, it is formed by cutting such as dicing technology. At this time, the first recess 131 (groove) is processed and formed with an accuracy of about ± 1 μm.

The mirror device 6 (silicon substrate 13) has a second surface (a surface facing the planar optical waveguide substrate 2) outside the area where the drive mechanism (movable member 7 and electrode 10) is formed. A position corresponding to the first depression 131 (second position) and a position corresponding to the groove T (second position).
The second recessed portion 141 is formed at. Here, the mirror device 6 functions as a second substrate. Since the mirror device 6 is a Si substrate, the second
The material of the surface portion on the surface side is made of silicon, and the second recessed portion 141 (groove) has the same shape as the second recessed portion 41 (groove).
It is formed by crystal anisotropic etching with the 0 plane as the surface. At this time, the second recess 141 (groove) is processed and formed with an accuracy of about 0.1 μm unit.

The flat optical waveguide substrate 2 and the mirror device 6 are integrated. At this time, the first surface of the planar optical waveguide substrate 2 and the second surface of the mirror device 6 are opposed to each other. And
When the planar optical waveguide substrate 2 and the mirror device 6 are opposed to each other and bonded, the space between the corresponding first hollow portion 131 and the second hollow portion 141, and the corresponding groove T and the second hollow portion 141.
The joining member 50 is sandwiched between and. In this modification, the groove T functions as one of the first recesses formed in the planar optical waveguide substrate 2. Here, the first depression 13
By adjusting the depth and width of the first and second recesses 141 (grooves) and the groove T, and the size (diameter, etc.) of the joining member 50,
The distance between the flat optical waveguide substrate 2 and the mirror device 6 can be set to a desired value. In this embodiment,
The width of the first depression 131 and the second depression 141 is 200 μ
The depth is set to about 100 μm and the depth is set to about 100 μm. The diameter of the joining member 50 is 200μ.
It is set to about m.

The flat optical waveguide substrate 2 and the mirror device 6 are integrated with each other by joining the flat optical waveguide substrate 2 with the joining member 50 sandwiched so that the flat optical waveguide substrate 2 and the mirror device 6 contact each other. This is performed by anodic bonding the member 50 and the mirror device 6 and the bonding member 50. Liquid phase bonding may be used instead of anodic bonding.

As described above, in the above-described modification,
One of the bonding members 50 made of a material that can be bonded to the planar optical waveguide substrate 2 and the mirror device 6 is sandwiched between the planar optical waveguide substrate 2 and the mirror device 6 to bond the planar optical waveguide substrate 2 and the bonding member 50. , Mirror device 6
Since the bonding member 50 and the bonding member 50 are bonded to each other, a material suitable for bonding the flat optical waveguide substrate 2 and the mirror device 6 may be selected as the material of the bonding member 50.
Also, it is not necessary to change the material of the mirror device 6 to a material suitable for bonding, and the planar optical waveguide substrate 2 and the mirror device 6 can be bonded very easily.

In the modification described above, the optical switch 101 has the first recess 131 formed at the first position on the first surface of the planar optical waveguide substrate 2 and the mirror device 6.
Between the second position (first recess 131) and the second position (second recess 141), and the second recess 141 formed at the second position corresponding to the first position on the second surface of And a bonding member 50 that is sandwiched between the flat optical waveguide substrate 2 and the mirror device 6 and is bonded to the flat optical waveguide substrate 2 and the mirror device 6. Therefore, when the flat optical waveguide substrate 2 and the mirror device 6 are opposed to each other and integrated, the first recess 131 and the groove T formed on the first surface of the flat optical waveguide substrate 2 and the mirror device 6 are formed. Since the joining member 50 is sandwiched between the second hollow portion 141 formed on the second surface, the flat optical waveguide substrate 2 and the mirror device 6 can be joined together while ensuring positional accuracy.
In addition, the first depression 131 and the second depression 131 formed at corresponding positions
Since the planar optical waveguide substrate 2 and the mirror device 6 are positioned by sandwiching the joining member 50 between the recessed portion 141 and between the groove T and the second recessed portion 141,
The planar optical waveguide substrate 2 and the mirror device 6 can be positioned inexpensively and easily as compared with the positioning using the alignment mark as in the conventional technique.

Further, in the optical switch 101 of the modified example, since the groove T for moving the mirror 9 is used as the first hollow portion, the process for forming the first hollow portion can be simplified. You can

The present invention is not limited to the above embodiment. For example, the numbers and positions of the first recessed portions 31, 131 and the second recessed portions 41, 141 are not limited to those described above, but can be set appropriately. Also, the first
The shape of the recess 31 and the second recess 41 is not limited to a groove having a V-shaped cross section, and may be a groove having an inverted trapezoidal shape or an arc shape, a conical or pyramidal recess, or the like.

The present invention is based on the above-mentioned optical switch 1, 101.
Other than optical components such as variable attenuator, variable dispersion compensator,
It can also be applied to a gain equalizer or the like. In addition, FIG.
As shown in FIG. 5, the bonding member 50 may be used to seal the space surrounded by the bonding member 50 between the first substrate 30 and the second substrate 40.

[0055]

As described above in detail, according to the present invention, the first substrate having the optical waveguide formed thereon and the second substrate having a predetermined optical element can be bonded very easily. It is possible to provide a method of manufacturing a possible optical component and an optical switch.

[Brief description of drawings]

FIG. 1 is a schematic diagram showing an optical switch according to an embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view taken along the line II-II of FIG.

FIG. 3 is a diagram showing a manufacturing process of the mirror device shown in FIG. 1.

FIG. 4A is a schematic plan view showing a first substrate,
(B) is a schematic sectional view of the first substrate.

FIG. 5A is a schematic plan view showing a second substrate,
FIG. 3B is a schematic sectional view of the second substrate.

FIG. 6A is a view for explaining the manufacturing method of the optical switch according to the embodiment of the present invention, and FIG. 6B is also a schematic sectional view thereof.

FIG. 7 is a drawing for explaining the manufacturing method of the optical switch according to the embodiment of the present invention.

FIG. 8 is a schematic view showing a modified example of the optical switch according to the embodiment of the present invention.

9 is a schematic cross-sectional view taken along the line IX-IX in FIG.

10 is a schematic cross-sectional view taken along line XX of FIG.

FIG. 11 is a diagram for explaining an example of the method for manufacturing the optical component according to the embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Optical switch, 2 ... Planar optical waveguide substrate, 3 ... Silicon substrate, 4 ... Quartz glass layer, 6 ... Mirror device, 7 ... Movable member, 8 ... Comb tooth part, 9 ... Mirror, 10 ... Electrode, 11 ...
Comb tooth portion, 13 ... Silicon substrate, 14 ... Voltage source, 30 ... First substrate, 30a ... Silicon substrate, 30b ... Quartz glass layer, 31 ... First recessed portion, 40 ... Second substrate, 41 ... Second
Recessed portion, 50 ... Joining member, 101 ... Optical switch, 131
... 1st hollow part, 141 ... 2nd hollow part, A, B ... Optical waveguide, T ... Groove.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Masayuki Nishimura             Sumitomoden 1 Taya-cho, Sakae-ku, Yokohama-shi, Kanagawa             Ki Industry Co., Ltd. Yokohama Works (72) Inventor Toshiaki Kakii             Sumitomoden 1 Taya-cho, Sakae-ku, Yokohama-shi, Kanagawa             Ki Industry Co., Ltd. Yokohama Works F-term (reference) 2H041 AA15 AB13 AC06 AZ01 AZ08

Claims (7)

[Claims] 1. A first substrate having an optical waveguide formed thereon and a second substrate having a predetermined optical element and having a drive mechanism for moving the optical element with respect to the optical waveguide are opposed to each other. In the method of manufacturing an optical component, a joining member made of a material that can be joined to the first substrate and the second substrate is sandwiched between the first substrate and the second substrate, and A method of manufacturing an optical component, wherein the first substrate and the joining member are joined together, while the second substrate and the joining member are joined together. 2. A first substrate having an optical waveguide formed on a first surface, and a drive mechanism having a predetermined optical element for moving the optical element with respect to the optical waveguide is formed on a second surface. A second recessed portion is formed at a first position on the first surface by bonding the formed second substrate with the first surface and the second surface facing each other. A second position on the second surface corresponding to the first position.
A recessed portion is formed, and a joining member made of a material that can be joined to the first substrate and the second substrate is sandwiched between the first position and the second position, and the first substrate and the A method of manufacturing an optical component, wherein the second substrate and the bonding member are bonded while the bonding member is bonded. 3. The light according to claim 1 or 2, wherein the first substrate and the joining member are anodically joined, while the second substrate and the joining member are anodically joined. Manufacturing method of parts. 4. The liquid bonding of the first substrate and the bonding member, while the liquid bonding of the second substrate and the bonding member is performed. Manufacturing method of optical components. 5. The method of manufacturing an optical component according to claim 2, wherein the joining member has a cylindrical outer shape. 6. The method of manufacturing an optical component according to claim 2, wherein the joining member has a spherical outer shape. 7. A first substrate having an optical waveguide formed on a first surface, and a drive mechanism having a predetermined optical element for moving the optical element with respect to the optical waveguide is formed on a second surface. An optical switch in which the first surface and the second surface are bonded to each other with the formed second substrate, and a first recessed portion formed at a first position on the first surface; A second recess formed at a second position on the second surface corresponding to the first position; and a material that can be bonded to the first substrate and the second substrate, and the first position An optical switch comprising: a bonding member sandwiched between the second position and the first substrate and the second substrate.