JP2003198162A - Build-up wiring substrate structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent the data communication rate from lowering or the size of a substrate structure from increasing even if a build-up wiring substrate structure is employed and wiring is made from an element mounted on an upper layer wiring substrate to a connector. <P>SOLUTION: One or more than one lower layer side connector 6 connected with a lower layer side circuit 4 and provided with a ground connection part 10 on the front side is secured to a lower layer wiring substrate 2, and one or more than one upper layer side connector 7 connected with an upper layer side circuit 5 and provided with a ground connection part 10 on the front side is secured to an upper layer wiring substrate 3 at a position adjacent to the lower layer side connector 6. A conductive securing metal 11 is secured to the front side of the lower layer side connector 6 and the upper layer side connector 7 such that it is connected with the ground connection part 10. As compared with a case where the upper layer side circuit 5 mounted on the upper layer wiring substrate 3 is wired to a connector secured to the layer wiring substrate 2, the wiring pattern length is shortened and the substrate structure is simplified. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stacked wiring board structure in which two wiring boards on which elements are mounted and wiring patterns are formed are stacked and arranged.

[0002]

2. Description of the Related Art In various electronic devices, a connector is fixed to a printed wiring board and a wiring pattern formed on the printed wiring board is connected to the connector.

FIG. 7 is a perspective view showing an example of a printed wiring board to which such a connector is fixed. As shown in FIG. 7, a printed wiring board 101 is provided, and a plurality of connectors 10 are provided on one piece of the printed wiring board 101.
2 is fixed. Although the connection structure between each connector 102 and the printed wiring board 101 is not shown, each connector 102 is provided with a plurality of connection pins (not shown) standing upright, and these connection pins are connected to the printed wiring board 101.
The connector 102 is fixed to the printed wiring board 101 by being inserted into a connector mounting connection hole (not shown) formed in the above, and soldering each connection pin to a wiring pattern formed around the connection hole. Has been done. That is, such a fixing structure realizes mechanical fixing and electrical connection between the printed wiring board 101 and each connector 102.

Next, a fixing metal fitting 103 is fixed to the front surface of each connector 102. This fixing bracket 103
Includes a fixing portion 104 for the casing side (not shown), and the fixing portion 104 is fixed to the casing to play a role of mechanical fixing of fixing the printed wiring board 101 to the casing. Moreover, each connector 102 has a ground connecting portion (not shown) on the front surface thereof, the fixing metal fitting 103 has conductivity, and the fixing metal fitting 103 having such conductivity is connected to the ground connecting portion. The fixing metal fitting 103 also serves to electrically connect the printed wiring board 101 to the casing so as to be grounded.

Here, in the example shown in FIG. 7, the printed wiring board 101 has a processor section 105 such as a CPU and a memory.
Is installed. Therefore, the printed wiring board 10
1 functions as a motherboard.

On the other hand, in various electronic devices, a printed wiring board 101 on which a CPU, a memory, etc., which is a mother board, is mounted due to various factors such as multi-functionalization and miniaturization.
It is becoming more common to stack other printed wiring boards on top. Also in the example shown in FIG. 7, another printed wiring board, the upper layer wiring board 106, is stacked and arranged on the printed wiring board 101.

Further, the single printed wiring board 101 and the upper wiring board 106 can be multi-layered so that more wiring patterns can be accommodated in a small area. .

[0008]

As illustrated in FIG. 7, when a stacked wiring board structure in which an upper wiring board 106, which is another printed wiring board, is stacked and arranged on a printed wiring board 101, a lower wiring side structure is adopted. If the connector 102 fixed to the printed wiring board 101 includes the connector 102 related to the element mounted on the upper layer wiring board 106 on the upper layer side, wiring from the element to the connector 102 related to the element is performed. Need to

As an example, FIG. 7 shows an upper wiring substrate 106.
Includes a LAN board 107 including elements for LAN,
An example in which the connector 102 includes a LAN connector 102a for LAN is shown. In this case, wiring must be performed from the LAN board 107 provided on the upper layer side wiring board 106 to the LAN connector 102a provided on the lower layer side printed wiring board 101. To this end, the upper wiring board 106 and the printed wiring board 10
Generally, a technique of connecting the printed wiring patterns (not shown) provided in each of the No. 1 with a connector (not shown) is adopted.

However, when the connector 102 fixed to the lower-layer printed wiring board 101 and the element mounted on the upper-layer wiring board 106 are wired in this way, the wiring pattern length is inevitably lengthened and the data communication speed is increased. However, there is a problem in that this leads to a decrease in the size and an increase in the size of the substrate structure.

It is an object of the present invention to adopt a stacked wiring board structure and reduce the data communication speed and increase the size of the board structure even if the elements mounted on the upper layer side wiring board are wired to the connector. Is not to invite.

[0012]

According to the present invention, there is provided a lower layer wiring board on which a lower layer side element is mounted and a lower layer side wiring pattern is formed, and an upper layer side wiring pattern is formed on which an upper layer side element is mounted and the lower layer wiring board is formed. And an upper layer wiring board stacked and arranged on the lower layer wiring board. One or more lower layer side connectors, which are connected to the lower layer side wiring pattern and have a ground connecting portion on the front surface, are fixed to the lower layer wiring board. One or more upper layer side connectors, which are connected to the upper layer side wiring pattern and have a ground connecting portion on the front surface, are fixed to the board so as to be positioned adjacent to the lower layer side connectors. Also, by fixing a conductive fixing metal fitting to the front surface side of the upper layer side connector, and fixing the fixing part of the fixing metal fitting to the casing side, each part is attached to the casing. Together to be a constant,
By connecting the fixing metal fittings to the ground connecting portions of the lower layer side connector and the upper layer side connector, the lower layer wiring board and the upper layer wiring board are connected to the ground.

Therefore, the connector for the lower layer side element mounted on the lower layer wiring board is connected to the lower layer side wiring pattern formed on the lower layer wiring board as the lower layer side connector, and the upper layer side mounted on the upper layer wiring board. The connector for the element is connected as an upper layer side connector to the upper layer side wiring pattern formed on the upper layer wiring board. As a result, the wiring pattern length is shortened and the board structure is simplified as compared with the case where the upper layer side element mounted on the upper layer wiring board is wired up to the lower layer side connector fixed to the lower layer wiring board.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a first embodiment of the present invention.
And it demonstrates based on FIG.

FIG. 1 is an exploded perspective view of the entire stacked wiring board structure, and FIG. 2 is a perspective view thereof.

Stacked wiring board structure 1 of the present embodiment
Has a lower wiring board 2 and an upper wiring board 3 which are both printed wiring boards as basic constituent elements.

A lower layer side circuit 4 is provided on the lower layer wiring board 2. The lower layer side circuit 4 is composed of a lower layer side element including a microprocessor unit such as a CPU and a memory mounted on the lower layer wiring board 2, and a lower layer side wiring pattern formed on the lower layer wiring board 2. In addition,
The lower wiring board 2 is configured as a motherboard including a microprocessor section.

On one upper layer wiring board 3, an upper layer side circuit 5 is provided.
Is provided. The upper layer side circuit 5 is composed of an upper layer side element mounted on the upper layer wiring board 3 and an upper layer side wiring pattern formed on the upper layer wiring board 3.

The lower layer wiring board 2 and the upper layer wiring board 3 are connected to each other via a connector (not shown), whereby the lower layer side wiring pattern in the lower layer side circuit 4 and the upper layer side circuit 5 are connected. Is connected to the upper layer side wiring pattern.

Next, the lower layer side connector 6 is fixed to one piece of the lower layer wiring board 2. This lower layer side connector 6
Are a monitor connector 6a and a LAN connector 6b. In such a lower layer side connector 6, as an example, a plurality of connection pins (not shown) provided upright on the lower layer side connector 6 are inserted into connection holes for connector attachment (not shown) formed in the lower layer wiring board 2, and Each connection pin is fixed to the lower layer wiring board 2 by soldering each connection pin to a wiring pattern formed around the connection hole. That is,
With such a fixing structure, mechanical fixing and electrical connection between the lower layer wiring board 2 and the lower layer side connector 6 are realized.

Next, the upper layer side connector 7 is fixed to one piece of the upper layer wiring board 3. This upper layer side connector 7
Is a serial connector 7a and a keyboard connector 7b
Is. Such an upper layer side connector 7 is, for example,
A plurality of connection pins 8 erected on the upper layer side connector 7 are inserted into a connection hole 9 (not shown) for mounting a connector formed in the upper layer wiring board 3, and a wiring pattern formed around the connection hole 9 is patterned. Each connection pin 8 is fixed to the upper wiring board 3 by soldering. That is, with such a fixing structure, mechanical fixing and electrical connection between the upper wiring board 3 and the upper connector 7 are realized.

Here, the lower layer side connector 6 and the upper layer side connector 7 are positioned so as to be adjacent to each other in a state where the lower layer wiring board 2 and the upper layer wiring board 3 are stacked and arranged. Further, the lower layer side connector 6 and the upper layer side connector 7 are provided with a ground connecting portion 10 on the front side thereof. Ground lines (not shown) of the lower layer side circuit 4 and the upper layer side circuit 5 provided on the lower layer wiring board 2 and the upper layer wiring board 3, respectively, are connected to these ground connection portions 10.

Next, fixing fittings 11 are fixed to the front surfaces of the lower layer side connector 6 and the upper layer side connector 7. The fixing fitting 11 is fixed to the front surfaces of the lower layer side connector 6 and the upper layer side connector 7 by screwing with a plurality of screws 12.

The fixing metal fitting 11 is provided with a fixing portion 13 for the casing side (not shown). By fixing the fixing portion 13 to the casing, the lower wiring board 2 and the upper wiring board 3 are fixed to the casing. Play a role in static fixation. Moreover, the fixing metal fitting 1
1 has conductivity, and the fixing metal fitting 11 having such conductivity has a lower layer side connector 6 and a lower layer side connector 6 so as to be connected to a ground connecting portion 10 provided on the front side of the lower layer side connector 6 and the upper layer side connector 7. Since it is fixed to the upper layer side connector 7, the fixing metal fitting 11 also plays a role of electrical connection for electrically connecting the lower layer wiring board 2 and the upper layer wiring board 3 to the casing and grounding the casing.

In such a structure, the lower wiring board 2
The connector for the lower layer side circuit 4 including the lower layer side element mounted on the lower layer side connector 6 is connected to the lower layer side circuit 4 including the lower layer side wiring pattern formed on the lower layer wiring board 2 as the lower layer side connector 6, and the upper layer wiring board 3 The connector for the upper layer side circuit 5 including the upper layer side element mounted on is the upper layer side connector 7
Is connected to the upper layer side circuit 5 including the upper layer side wiring pattern formed on the upper layer wiring board 3. Thus, according to the present embodiment, as compared with the case where the upper layer side circuit 5 including the upper layer side element mounted on the upper layer wiring board 3 is wired up to the lower layer side connector 6 fixed to the lower layer wiring board 2. hand,
The wiring pattern length is shortened and the substrate structure is simplified. Therefore, the stacked wiring board structure 1 is adopted, and the upper layer side circuit 5 including the upper layer side element mounted on the upper layer wiring board 3 is included.
Therefore, even if wiring is made to the connector which is the upper layer side connector 7, it is possible to maintain high data communication speed and miniaturization of substrate structure.

Further, according to the present embodiment, the fixing metal fitting 11 is composed of a one-piece component. Therefore, even if the lower layer side connector 6 and the upper layer side connector 7 are divided, it is possible to easily attach the fixing metal fitting 11 to the lower layer side connector 6 and the upper layer side connector 7.

The second embodiment of the present invention is shown in FIGS.
It will be described based on.

FIG. 3 is an exploded perspective view of the entire stacked wiring board structure, and FIG. 4 is a perspective view thereof. The same parts as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

In the present embodiment, the fixing metal fitting 11 is divided into a piece 21 fixed to the lower layer side connector 6 and a piece 22 connected to the upper layer side connector 7, and the respective pieces 21 and 22 are connecting pieces. It is electrically connected by 23. The connecting piece 23 is the piece 2 having the fixing portion 13.
It has a groove portion 23a which is provided at one end portion and into which the other piece 22 having no fixing portion 13 is fitted. Such a connecting piece 23 is formed, for example, by bending a metal that is thinner than the fixing metal fitting 11, and is fixed to the end of the piece 21 including the fixing portion 13 by welding as an example.

Therefore, according to the present embodiment, the pieces 21 and 22 constituting the fixing metal fitting 11 are fixed to the lower layer side connector 6 and the upper layer side connector 7, and the upper layer wiring board 3 is held in this state. By stacking and arranging on the lower layer wiring board 2, the pieces 21 and 22 that have been divided into two are connected by the connection piece 23, and the lower layer wiring board 2 and the upper layer wiring board 3 are electrically connected to the casing and electrically connected to ground. The state is obtained. At this time, the groove portion 2 of the connecting piece 23 provided at the end of the piece 21 having the fixing portion 13
By fitting the end of the other piece 22 to 3a,
The pieces 21 and 22 that have been divided into two are connected by a connection piece 23. As a result, the mechanical strength of the lower layer side connector 6 and the upper layer side connector 7 in both directions of inserting and removing terminals (not shown) is maintained.

Here, in order to fix each of the pieces 21 and 22 constituting the fixing metal fitting 11 to the lower layer side connector 6 and the upper layer side connector 7, either by using a screw 12 or by caulking. It doesn't matter.

As described above, according to the present embodiment, the fixing metal fitting 11 includes the piece 2 fixed to the lower layer side connector 6.
1 and a piece 22 connected to the upper layer side connector 7 are divided into two parts, and each piece is electrically connected. Therefore, workability when stacking and arranging the upper layer wiring board 3 on the lower layer wiring board 2 can be improved.

A third embodiment of the present invention is shown in FIGS.
It will be described based on.

FIG. 5 is a front view for comparatively explaining the shape of the D-sub connector, and FIG. 6 is a perspective view of the entire stacked wiring board structure. The same parts as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

This embodiment relates to the positional relationship between the monitor connector 6a included in the lower layer side connector 6 and the serial connector 7a included in the upper layer side connector 7. The monitor connector 6a and the serial connector 7a are both so-called D-sub connectors.

Here, as shown in FIG. 5, the D-sub connector normally has a plurality of connection pins 8 as shown in FIG. The connecting portion 31 has a trapezoidal shape. That is, in general, the D-sub connector is connected to the connecting pin 8 from the upper surface of the printed wiring board.
In consideration of the fact that the
The shape of 1 is an inverted trapezoidal shape. The monitor connector 6a and the serial connector 7a used in the first embodiment of the present invention are such general D-sub connectors.

On the other hand, in the present embodiment, as for the serial connector 7a included in the upper layer side connector 7, as shown in FIG. 5 (b), the connecting portion 31 is oriented in the opposite direction to the general D-sub connector. A serial connector 7a having a shape is used.

That is, in this embodiment, the lower layer side connector 6 and the upper layer side connector 7 each include a D-sub connector, and the shape of the connection portion 31 of the D-sub connector included in the upper layer side connector 7 is the reverse shape. is there. Therefore, in the state where the lower layer wiring board 2 and the upper layer wiring board 3 are stacked and arranged, both connection portions 31 of the monitor connector 6a included in the lower layer side connector 6 and the serial connector 7a included in the upper layer side connector 7 face downward. It is arranged in a trapezoidal shape, and the wiring connection work for the monitor connector 6a and the serial connector 7a can be facilitated. Also,
You can also remove the appearance of discomfort.

[0039]

According to the present invention, the connector for the element mounted on the lower layer wiring board is connected to the lower layer side wiring pattern formed on the lower layer wiring board as the lower layer side connector and mounted on the upper layer wiring board. Since the connector for the element is connected to the upper layer wiring pattern formed on the upper layer wiring board as the upper layer side connector, the element mounted on the upper layer wiring board is fixed to the lower layer wiring board. Compared with wiring up to the connector, the wiring pattern length can be shortened and the board structure can be simplified. Therefore, the stacked wiring board structure is adopted and mounted on the upper layer wiring board on the upper layer side. Even if the element is wired to the connector, the high data communication speed and the miniaturization of the substrate structure can be maintained.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of an entire stacked wiring board structure showing a first embodiment of the present invention.

FIG. 2 is an overall perspective view of a stacked wiring board structure according to the first embodiment of the present invention.

FIG. 3 is an exploded perspective view of an entire stacked wiring board structure showing a second embodiment of the present invention.

FIG. 4 is an overall perspective view of a stacked wiring board structure according to a second embodiment of the present invention.

FIG. 5 is a front view for comparatively explaining the shape of a D-sub connector as a third embodiment of the present invention.

FIG. 6 is an overall perspective view of a stacked wiring board structure according to a third embodiment of the present invention.

FIG. 7 is a perspective view showing a conventional example of a printed wiring board to which a connector is connected.

[Explanation of symbols]

2 ... Lower layer wiring board, 3 ... Upper layer wiring board, 4 ... Lower layer side element, Lower layer side wiring pattern (lower layer side circuit), 5 ... Upper layer side element, Upper layer side wiring pattern (upper layer side circuit), 6 ... Lower layer side connector, 7 ... upper layer side connector, 10 ... ground connection part,
11 ... Fixing metal fitting, 13 ... Fixing part, 6a, 7a ... D-sub connector (monitor connector 6a, serial connector 7a)

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Yuki Tsuchiya             570, Ohito, Ohito-cho, Takata-gun, Shizuoka             Kook Co., Ltd. Ohito Office (72) Inventor Yasuhiro Nako             570, Ohito, Ohito-cho, Takata-gun, Shizuoka             Kook Co., Ltd. Ohito Office (72) Inventor Takanori Kamizono             570, Ohito, Ohito-cho, Takata-gun, Shizuoka             Kook Co., Ltd. Ohito Office (72) Inventor Akihiro Katsuumi             570, Ohito, Ohito-cho, Takata-gun, Shizuoka             Kook Co., Ltd. Ohito Office (72) Inventor Koho Matsumoto             570, Ohito, Ohito-cho, Takata-gun, Shizuoka             Kook Co., Ltd. Ohito Office F-term (reference) 5E344 AA01 AA16 BB02 BB06 BB15                       CC13 CC15 CD12 CD18 EE06                       EE08 EE12                 5E348 AA03 AA16 AA32 EF44

Claims (4)

[Claims] 1. A lower layer wiring board on which a lower layer side element is mounted and a lower layer side wiring pattern is formed, and an upper layer wiring board on which an upper layer side element is mounted and an upper layer side wiring pattern is formed, and which is stacked and arranged on the lower layer wiring board. And one or more lower layer side connectors fixed to the lower layer wiring board and connected to the lower layer side wiring pattern and provided with a ground connecting portion on the front surface, and positioned so as to be positioned adjacent to the lower layer side connector. The lower layer connector and the upper layer side connector, which are fixed to the upper layer wiring board and connected to the upper layer side wiring pattern, have one or more upper layer side connectors having a ground connecting portion on the front surface, and a fixing portion for the casing side. Fixing metal fittings that are fixed to the front side of the and are connected to the ground connecting portions of these lower layer side connector and upper layer side connector It comprises a stacking wiring board structure. 2. The stacked wiring board structure according to claim 1, wherein the fixing metal member is constituted by a one-piece component. 3. The fixing metal fitting according to claim 1, wherein the fixing metal piece is divided into a piece fixed to the lower layer side connector and a piece connected to the upper layer side connector, and each piece is electrically connected. Stacked wiring board structure. 4. The lower layer side connector and the upper layer side connector each include a D-sub connector, and the shape of the connection portion of the D-sub connector included in the upper layer side connector is an inverted shape. 3. The stacked wiring board structure described in 3.