JP2003182076A - Ink jet recording head and ink jet recorder - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an ink jet recording head and an ink jet recorder in which the print quality can be enhanced while reducing the size by arranging the pressure generating chambers with high density. <P>SOLUTION: The ink jet recording head comprising a channel forming substrate 10 having pressure generating chambers 12 communicating with nozzle openings, a lower electrode 60 provided on one surface side of the channel forming substrate 10 through a diaphragm, and a piezoelectric element 300 consisting of a piezoelectric layer 70 and an upper electrode 80 is further provided with a substrate 30 being bonded to the piezoelectric element 300 side of the channel forming substrate 10. Securing area of driving ICs is limited by securing at least two driving ICs 111 and 112 for driving the piezoelectric element 300 onto the bonding substrate 30 while stacking. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention comprises a vibrating plate which constitutes a part of a pressure generating chamber communicating with a nozzle opening for ejecting ink droplets, and a piezoelectric element is provided through the vibrating plate to displace the piezoelectric element. The present invention relates to an ink jet type recording head and an ink jet type recording apparatus for ejecting ink droplets.

[0002]

2. Description of the Related Art A part of a pressure generating chamber that communicates with a nozzle opening for ejecting ink droplets is composed of a vibrating plate, and the vibrating plate is deformed by a piezoelectric element to pressurize ink in the pressure generating chamber to eject it from the nozzle opening. Two types of inkjet recording heads that eject ink droplets have been put into practical use: one that uses a longitudinal vibration mode piezoelectric actuator that expands and contracts in the axial direction of a piezoelectric element, and one that uses a flexural vibration mode piezoelectric actuator. ing.

The former allows the volume of the pressure generating chamber to be changed by bringing the end face of the piezoelectric element into contact with the vibrating plate, and a head suitable for high-density printing can be manufactured. There is a problem in that the manufacturing process is complicated because a difficult process of matching the array pitch of the openings and cutting into comb teeth or a work of positioning and fixing the cut piezoelectric element in the pressure generating chamber are required.

On the other hand, in the latter, the piezoelectric element can be formed on the vibration plate by a relatively simple process of sticking a green sheet of a piezoelectric material in conformity with the shape of the pressure generating chamber and firing it. However, due to the use of flexural vibration, a certain area is required, and there is a problem that high-density arrangement is difficult.

On the other hand, in order to eliminate the disadvantage of the latter recording head, a uniform piezoelectric material layer is formed over the entire surface of the diaphragm by a film forming technique as disclosed in Japanese Patent Laid-Open No. 5-286131. It has been proposed that the piezoelectric material layer is cut into a shape corresponding to the pressure generating chamber by a lithographic method and a piezoelectric element is formed so as to be independent for each pressure generating chamber.

Further, such a piezoelectric element is generally
It is driven by a drive IC (semiconductor integrated circuit), and the drive IC is fixed on, for example, a bonding substrate bonded to one surface side of the flow path forming substrate in which the pressure generating chamber is formed, and each piezoelectric element and wire bonding. Etc. electrically connected.

[0007]

However, in such an ink jet recording head, since a large number of piezoelectric elements are driven by one driving IC, the density of the piezoelectric elements (pressure generating chambers) is increased. There is a problem that the area of the drive IC is increased and the head is enlarged.

Further, the ink jet type recording head has been remarkably multifunctional and high performance in recent years. For example, so-called multi-shot in which a plurality of originals are combined and printed, or ink droplets having different diameters are ejected. In order to deal with so-called variable dots and the like, the logic part of the drive IC becomes complicated, and the area of the drive IC increases. Further, there is a problem that the area of the drive IC increases due to the reduction of the ON resistance, and the head becomes large.

In view of such circumstances, the present invention provides an ink jet type recording head and an ink jet type recording apparatus which are capable of arranging the pressure generating chambers at a high density to improve printing quality and miniaturize them. Is an issue.

[0010]

A first aspect of the present invention for solving the above-mentioned problems is to provide a flow path forming substrate having a pressure generating chamber communicating with a nozzle opening, and to one surface side of the flow path forming substrate. An ink jet recording head comprising a piezoelectric element composed of a lower electrode, a piezoelectric layer and an upper electrode provided via a vibration plate, having a bonding substrate bonded to the piezoelectric element side of the flow path forming substrate. The inkjet recording head is characterized in that at least two drive ICs for driving a piezoelectric element are laminated and fixed on the bonding substrate.

In the first aspect, since the fixed area of the driving IC can be minimized, the pressure generating chambers can be arranged in high density and the head can be downsized.

According to a second aspect of the present invention, in the first aspect, the stacked drive ICs are electrically connected to each other,
The inkjet recording head is characterized in that the drive IC and the piezoelectric element are electrically connected by a conductive wire extending from at least one drive IC to the flow path forming substrate.

In the second aspect, since the piezoelectric element is driven by at least two drive ICs stacked,
The fixed area of the drive IC, which requires complicated logic processing, can be minimized. Further, by connecting the drive IC and the piezoelectric element with a conductive wire, they can be electrically connected relatively easily.

A third aspect of the present invention is characterized in that, in the second aspect, the stacked drive ICs are electrically connected via a connecting bump provided between the two. It is in an inkjet recording head.

In the third aspect, the drive I to be stacked is stacked.
It is not necessary to secure a space for electrically connecting C, and the head can be remarkably downsized.

A fourth aspect of the present invention is the ink jet recording head according to the second aspect, characterized in that the stacked drive ICs are electrically connected to each other by their conductive wires.

In the fourth aspect, the drive I to be stacked is stacked.
The Cs can be electrically connected to each other relatively easily.

According to a fifth aspect of the present invention, in any one of the second to fourth aspects, lead-out wirings drawn out from the respective piezoelectric elements are extended on the flow path forming substrate, and the lead-out wirings and the above-mentioned lead-out wirings are provided. An inkjet recording head is characterized in that it is electrically connected to a conductive wire.

In the fifth aspect, the piezoelectric element and the drive I
It is possible to electrically connect C to each other with relative ease, which improves manufacturing efficiency and reduces manufacturing cost.

According to a sixth aspect of the present invention, in the fifth aspect, the flow path forming substrate has at least two rows of the pressure generating chambers, and corresponds to between the rows of the pressure generating chambers of the bonding substrate. In the ink jet recording head, a through hole penetrating the joint substrate in the thickness direction is provided in a portion corresponding to the above, and the lead wiring extends to a portion corresponding to the through hole.

In the sixth aspect, since the area of the through hole for extending the conductive wire can be suppressed to be small,
The head can be surely downsized.

A seventh aspect of the present invention is an ink jet recording head according to the sixth aspect, characterized in that the stacked drive ICs are fixed to both sides of the through hole of the bonding substrate. is there.

In the seventh aspect, the drive IC and the lead wiring can be relatively easily connected by the conductive wire, and the manufacturing efficiency is improved.

An eighth aspect of the present invention is the piezoelectric element holding portion according to any one of the first to seventh aspects, wherein the bonding substrate seals the space in a state where the space is secured in a region facing the piezoelectric element. An inkjet recording head characterized by having:

According to the eighth aspect, the head can be downsized and the piezoelectric element can be prevented from being damaged due to the external environment.

A ninth aspect of the present invention is characterized in that, in any one of the first to eighth aspects, the joint substrate has a reservoir portion that constitutes at least a part of a common ink chamber of each pressure generating chamber. Inkjet type recording head.

In the ninth aspect, since the bonding substrate also serves as the reservoir forming substrate, it is not necessary to separately provide the reservoir forming substrate, and the head can be made smaller.

In a tenth aspect of the present invention according to any one of the first to ninth aspects, the pressure generating chamber is formed in a silicon single crystal substrate by anisotropic etching, and each layer of the piezoelectric element is formed by film formation and lithography. An ink jet recording head characterized by being formed by a method.

According to the tenth aspect, a large amount of ink jet recording head having high density nozzle openings can be manufactured relatively easily.

An eleventh aspect of the present invention is an ink jet recording apparatus including the ink jet recording head according to any one of the first to tenth aspects.

According to the eleventh aspect, it is possible to realize an ink jet type recording apparatus which is capable of high quality and multifunctional printing and is miniaturized.

[0032]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below based on embodiments.

(Embodiment 1) FIG. 1 is an exploded perspective view showing an ink jet recording head according to Embodiment 1 of the present invention, and FIG. 2 is a plan view and a sectional view of FIG.

As shown in the figure, the flow path forming substrate 10 is a silicon single crystal substrate having a plane orientation (110) in this embodiment. One surface of the flow path forming substrate 10 is an opening surface, and an elastic film 50 having a thickness of 1 to 2 μm made of silicon dioxide formed in advance by thermal oxidation is formed on the other surface.

On the other hand, the opening surface of the flow path forming substrate 10 is anisotropically etched to form a silicon single crystal substrate.
Two pressure generation chambers 12 partitioned by a plurality of partition walls 11 are arranged side by side in the width direction, and the pressure generation chambers 12 are connected to a reservoir portion 31 of a reservoir forming substrate 30 described later in common in each pressure generation chamber 12 on the outer side in the longitudinal direction. A communication portion 13 that forms a part of the reservoir 100 that serves as the ink chamber of each of the pressure generating chambers 12 is formed.
And one end portion in the longitudinal direction of each of them are communicated with each other via the ink supply paths 14.

Here, the anisotropic etching is performed by utilizing the difference in etching rate of the silicon single crystal substrate. For example, in this embodiment, the silicon single crystal substrate is set to K.
When it is dipped in an alkaline solution such as OH, it is gradually eroded and the first (111) plane perpendicular to the (110) plane and the first (111) plane
Forms an angle of about 70 degrees with the (111) plane of
A second (111) plane that makes an angle of about 35 degrees with the (0) plane appears, and the etching rate of the (111) plane is about 1/180 of the etching rate of the (110) plane. Is done using. By such anisotropic etching, it is possible to perform precision machining based on the depth machining of the parallelogram shape formed by the two first (111) planes and the two diagonal second (111) planes. The pressure generating chambers 12 can be arranged in high density.

In this embodiment, the long side of each pressure generating chamber 12 is formed by the first (111) plane, and the short side is formed by the second (111) plane. The pressure generating chamber 12 is provided in the flow path forming substrate 1
It is formed by etching through almost 0 to reach the elastic film 50. Here, the elastic film 50 is
The amount of the alkaline solution that etches the silicon single crystal substrate is extremely small. Further, each ink supply passage 14 communicating with one end of each pressure generation chamber 12 is formed shallower than the pressure generation chamber 12, and keeps the flow resistance of the ink flowing into the pressure generation chamber 12 constant. That is, the ink supply path 14 is formed by etching the silicon single crystal substrate halfway in the thickness direction (half etching). The half etching is performed by adjusting the etching time.

As for the thickness of the flow path forming substrate 10, an optimum thickness may be selected in accordance with the array density of the pressure generating chambers 12. For example, if the array density is about 180 dpi, the flow path forming substrate 10 is formed. The thickness of the substrate 10 may be about 220 μm, but when the pressure generating chambers 12 are arranged at a relatively high density of 200 dpi or more, the thickness of the flow path forming substrate 10 is made relatively thin as 100 μm or less. Is preferred. This is because the array density can be increased while maintaining the rigidity of the partition walls 11 between the adjacent pressure generating chambers 12.

On the opening surface side of the flow path forming substrate 10,
A nozzle plate 20 having a nozzle opening 21 that communicates with the pressure generating chamber 12 on the side opposite to the ink supply path 14 is fixed via an adhesive or a heat-welding film. The nozzle plate 20 has a thickness of, for example, 0.1 to 1
mm, a coefficient of linear expansion of 300 ° C. or less, for example, 2.5 to
It is made of glass ceramics of 4.5 [× 10 ⁻⁶ / ° C.] or rust-free steel. The nozzle plate 20 entirely covers one surface of the flow path forming substrate 10 with one surface, and also serves as a reinforcing plate that protects the silicon single crystal substrate from impact and external force. Further, the nozzle plate 20 is used as the flow path forming substrate 10.
It may be made of a material having substantially the same thermal expansion coefficient. In this case, since the flow path forming substrate 10 and the nozzle plate 20 have substantially the same deformation due to heat, they can be easily joined using a thermosetting adhesive or the like.

Here, the size of the pressure generating chamber 12 that applies the ink drop ejection pressure to the ink and the size of the nozzle opening 21 that ejects the ink drop depend on the amount of the ejected ink drop, the ejection speed, and the ejection frequency. Optimized. For example,
When recording 360 ink drops per inch, it is necessary to accurately form the nozzle openings 21 with a diameter of several tens of μm.

On the other hand, a thickness of, for example, about 0.2 μm is formed on the elastic film 50 on the side opposite to the opening surface of the flow path forming substrate 10.
The lower electrode film 60, the piezoelectric layer 70 having a thickness of, for example, about 1 μm, and the upper electrode film 80 having a thickness of, for example, about 0.1 μm are laminated in a process described below to form the piezoelectric element 30.
Configures 0. Here, the piezoelectric element 300 refers to a portion including the lower electrode film 60, the piezoelectric layer 70, and the upper electrode film 80. Generally, one of the electrodes of the piezoelectric element 300 is used as a common electrode, and the other electrode and the piezoelectric layer 70 are patterned for each pressure generating chamber 12. Further, here, a portion which is composed of one of the patterned electrodes and the piezoelectric layer 70 and in which piezoelectric strain is generated by applying a voltage to both electrodes is referred to as a piezoelectric active portion. In the present embodiment, the lower electrode film 60 is the common electrode of the piezoelectric element 300, and the upper electrode film 80 is the individual electrode of the piezoelectric element 300.
There is no problem in reversing this due to the driving circuit and wiring.
In any case, the piezoelectric active portion is formed for each pressure generating chamber 12. Further, here, the piezoelectric element 300 and the vibration plate that is displaced by the driving of the piezoelectric element 300 are collectively referred to as a piezoelectric actuator.

Further, each of the piezoelectric elements 300 as described above includes
For example, lead electrodes 90 made of gold (Au) or the like are respectively connected. The lead electrodes 90 are drawn out from the vicinity of the ends in the longitudinal direction of each piezoelectric element 300, and are respectively extended to the regions corresponding to the spaces between the rows of the pressure generating chambers 12 on the elastic film 50.

A reservoir forming substrate 30 having a reservoir portion 31 forming at least a part of the reservoir 100 is bonded on the flow passage forming substrate 10 on which the piezoelectric element 300 is formed. In the present embodiment, the reservoir portion 31 is formed to penetrate the reservoir forming substrate 30 in the thickness direction and extend in the width direction of the pressure generating chamber 12, and as described above, the communicating portion of the flow passage forming substrate 10. A reservoir 100 that communicates with the pressure generating chamber 12 and serves as a common ink chamber for the pressure generating chambers 12.
Are configured.

Further, the piezoelectric element 3 of the reservoir forming substrate 30
In a region facing 00, a piezoelectric element holding portion 32 is provided corresponding to the pressure generating chamber 12 and capable of sealing the space in a state in which a space that does not hinder the movement of the piezoelectric element 300 is secured. The piezoelectric element 3 is provided in the piezoelectric element holding portion 32.
00 is sealed.

For such a reservoir forming substrate 30, it is preferable to use a material having substantially the same coefficient of thermal expansion as that of the passage forming substrate 10, such as glass or a ceramic material. In this embodiment, the passage forming substrate 10 is used. It was formed using a silicon single crystal substrate of the same material as.

In addition, the substantially central portion of the reservoir forming substrate 30,
That is, in the region facing between the rows of the pressure generating chambers 12,
Through-hole 33 penetrating the reservoir forming substrate 30 in the thickness direction
Is provided. The lead electrode 90 drawn from each piezoelectric element 300 extends to the region corresponding to the through hole 33, and the vicinity of the end portion thereof is the through hole 3.
It is exposed in 3.

Further, the through hole 33 of the reservoir forming substrate 30.
2 for driving the piezoelectric elements 300 on both sides of each of the pressure generating chambers 12, that is, on each of the regions corresponding to each row of the pressure generating chambers 12.
Two drive ICs (first drive IC 111, second drive IC
112) are laminated and fixed. Then, the first drive IC 111 and the second drive IC 112 are electrically connected by a connection wiring 121 made of a conductive wire such as a bonding wire.

That is, the first drive ICs 11 that are stacked
The first and second drive ICs 112 are substantially one drive I
C, for example, in the present embodiment, the first drive IC 111 constitutes a logic section for performing calculations and commands, and the second drive IC 112 switches the piezoelectric element 300 to which a voltage is applied. It constitutes an analog switch section for performing.

The first drive IC 111 and the lead electrode 90 extending from the piezoelectric element 300 are connected to the through hole 33.
They are electrically connected to each other by connection wirings 122, which are made of conductive wires such as bonding wires, which are extended through the wirings (see FIG. 2B).

In this embodiment, the first drive IC 1
11 and the lead electrode 90 are electrically connected by the connection wiring 122. However, for example, as shown in FIG. 3, of course, the second drive IC 112 and the lead electrode 90 are electrically connected by the connection wiring 122. You may make it connect.

As described above, in this embodiment, the two drive ICs (the first drive IC) laminated and fixed on the reservoir forming substrate 30 are used.
Since the piezoelectric element 300 is driven by the driving IC 111 and the second driving IC 112), the fixed area of the driving IC can be suppressed small and the head can be miniaturized.

In particular, when the drive IC is to perform complicated processing, the drive I can be obtained by driving the piezoelectric element 300 by the two drive ICs 111 and 112 as described above.
The fixed area of C can be significantly reduced.

Further, in the present embodiment, the connection wiring 122 is extended to the through hole 33 provided in the region facing between the columns of the pressure generating chambers 12 of the reservoir forming substrate 30, and the lead wiring 90 is formed.
Since the first drive IC 111 and the first drive IC 111 are electrically connected to each other, the area of the reservoir forming substrate 30 can be reduced and the head can be further downsized.

A compliance substrate 40 including a sealing film 41 and a fixing plate 42 is bonded onto the reservoir forming substrate 30. Here, the sealing film 41
Is a material having low rigidity and flexibility (for example, a thickness of 6
and a reservoir portion 31 made of a sealing film 41.
One side is sealed. The fixing plate 42 is formed of a hard material such as metal (for example, stainless steel (SUS) having a thickness of 30 μm). Since the region of the fixing plate 42 facing the reservoir 100 is the opening 43 that is completely removed in the thickness direction, one surface of the reservoir 100 is sealed with only the flexible sealing film 41. The flexible portion 34 is deformable by the change of the internal pressure.

In the ink jet recording head of the present embodiment as described above, the ink is taken in from the external ink supply means (not shown), the inside of the reservoir 100 to the nozzle opening 21 is filled with the ink, and then the first driving IC 1
11 and the recording signal from the second driving IC 112,
Each voltage is generated by applying a voltage between the lower electrode film 60 and the upper electrode film 80 corresponding to the pressure generating chamber 12 to bend and deform the elastic film 50, the lower electrode film 60, and the piezoelectric layer 70. The pressure in the chamber 12 increases and the nozzle opening 21
Ink drops are ejected from.

(Second Embodiment) FIG. 4 is a sectional view of an ink jet recording head according to a second embodiment.

The present embodiment is an example in which the first drive IC 111 and the second drive IC 112 are electrically connected by another connection method. That is, as shown in FIG. 4, the first drive IC 111 and the second drive IC 112 are arranged such that their respective active surfaces face each other, and the first drive IC 111
Provided between the C111 and the second drive IC 112,
For example, it is the same as the first embodiment except that the connection bumps 130 made of solder or the like are used for the electrical connection.

In such a configuration, the first drive IC 11
Since it is not necessary to secure a space for fixing the connection wiring connected to the second drive IC 112 on the head 1, the head can be downsized and the second drive IC 112 can be made large.
More complicated processing can be performed.

(Third Embodiment) FIG. 5 is a sectional view of an ink jet recording head according to a third embodiment.

The present embodiment is another example of the wiring structure between the piezoelectric element 300 and the first drive IC 111. As shown in FIG.
The through holes 33 </ b> A are provided in the regions facing the lead electrodes 9 and the lead electrodes 9 are led out from the respective piezoelectric elements 300.
0 extends from the end of the pressure generating chamber 12 on the reservoir 100 side into each of the through holes 33A. The second embodiment is the same as the first embodiment except that it is electrically connected to the first drive IC 111 by the connection wiring 122A extending in each of the through holes 33A.

With such a structure, of course, the driving IC
Since the fixed area of the head can be kept small, the head can be downsized.

In this embodiment, two sets of drive ICs are used.
The (first drive IC 111 and the second drive IC 112) drives the piezoelectric elements 300 in each column of the pressure generating chambers 12, but of course, the invention is not limited to this, and FIG.
, A set of drive ICs (first drive IC 111
And all the piezoelectric elements 3 by the second drive IC 112).
00 may be driven.

(Other Embodiments) Although the respective embodiments of the present invention have been described above, the present invention is not limited to the above.

For example, in the above embodiment, the first drive I
Although one second driving IC 112 is fixed on the C111, the present invention is not limited to this. For example, as shown in FIG. 7A, a plurality of second driving ICs 112 are arranged on the first driving IC 111. It may be fixed to. Further, in the above-described embodiment, the two drive ICs (the first drive IC 111 and the second drive IC 112) are stacked, but for example, as shown in FIG. 7B, the second drive IC 112 is stacked.
A third drive IC 113 is further laminated on the connection wiring 1
Alternatively, it may be electrically connected to the second drive IC 112 at 23.

Further, in the above-described embodiment, the two laminated layers are used.
Two driving ICs (first driving IC 111 and second driving IC
C112) is electrically connected to these first drive IC1
11 and the second driving IC 112 are used to drive the piezoelectric element 300. However, it is needless to say that each driving IC drives a different piezoelectric element 300 without electrically connecting the two stacked driving ICs. You may

Further, for example, in the above-described embodiment, the thin film type ink jet recording head manufactured by applying the film formation and the lithographic process is taken as an example. However, the present invention is not limited to this and, for example, The present invention can also be applied to a thick film type ink jet recording head formed by a method such as attaching a green sheet.

Further, the ink jet recording head of each of these embodiments constitutes a part of a recording head unit having an ink flow path communicating with an ink cartridge or the like, and is mounted on an ink jet recording apparatus. Figure 8
It is a schematic diagram showing an example of the ink jet type recording device.

As shown in FIG. 8, recording head units 1A and 1B having an ink jet recording head are detachably provided with cartridges 2A and 2B constituting an ink supply means.
The carriage 3 on which B is mounted is provided on a carriage shaft 5 attached to the apparatus body 4 so as to be movable in the axial direction. The recording head units 1A and 1B are, for example,
The black ink composition and the color ink composition are respectively discharged.

The driving force of the driving motor 6 is transmitted to the carriage 3 via a plurality of gears (not shown) and the timing belt 7, so that the carriage 3 having the recording head units 1A and 1B mounted thereon follows the carriage shaft 5. Be moved. On the other hand, a platen 8 is provided on the apparatus main body 4 along the carriage shaft 5, and a recording sheet S, which is a recording medium such as paper fed by a feed roller (not shown), is conveyed on the platen 8. It is like this.

[0070]

As described above, in the ink jet recording head of the present invention, two drive ICs are provided on the bonding substrate.
Since they are stacked and fixed, the fixing area of the drive IC can be suppressed to a small size, and the head can be downsized.

[Brief description of drawings]

FIG. 1 is a perspective view of an ink jet recording head according to a first embodiment of the invention.

2A and 2B are a plan view and a sectional view of the ink jet recording head according to the first embodiment of the invention.

FIG. 3 is a cross-sectional view showing a modified example of the ink jet recording head according to the first embodiment of the invention.

FIG. 4 is a sectional view of an ink jet recording head according to a second embodiment of the invention.

FIG. 5 is a sectional view of an ink jet recording head according to a third embodiment of the invention.

FIG. 6 is a cross-sectional view showing a modified example of the ink jet recording head according to the third embodiment of the invention.

FIG. 7 is a sectional view of an ink jet recording head according to another embodiment of the present invention.

FIG. 8 is a schematic diagram of an inkjet recording apparatus according to an embodiment of the present invention.

[Explanation of symbols]

10 Flow path forming substrate 11 partitions 12 Pressure generation chamber 13 Communication 14 Ink supply path 20 nozzle plate 21 nozzle opening 30 Reservoir forming substrate 31 Reservoir section 32 Piezoelectric element holder 33, 33A through hole 50 elastic membrane 60 Lower electrode film 70 Piezoelectric layer 80 Upper electrode film 90 Lead electrode 100 reservoir 111 First drive IC 112 Second drive IC 121, 122, 123 connection wiring 300 Piezoelectric element

Claims (11)

[Claims] 1. A flow path forming substrate having a pressure generating chamber communicating with a nozzle opening, and a lower electrode, a piezoelectric layer and an upper electrode provided on one surface side of the flow path forming substrate via a vibrating plate. An ink jet recording head including a piezoelectric element having the following: a bonding substrate bonded to the piezoelectric element side of the flow path forming substrate, and at least two drive ICs for driving the piezoelectric element on the bonding substrate. An ink jet recording head, characterized in that a plurality of layers are fixed. 2. The drive IC according to claim 1, wherein the stacked drive ICs are electrically connected to each other, and at least one drive I
An inkjet recording head, wherein the drive IC and the piezoelectric element are electrically connected by a conductive wire extending from C to the flow path forming substrate. 3. The ink jet recording head according to claim 2, wherein the stacked drive ICs are electrically connected via connection bumps provided between the drive ICs. 4. The drive IC stacked according to claim 2.
An ink jet recording head, characterized in that the conductive wires are electrically connected to each other. 5. The lead wire drawn out from each of the piezoelectric elements is extended on the flow path forming substrate according to claim 2, and the lead wire and the conductive wire are electrically connected. An ink jet recording head characterized by being provided. 6. The flow path forming substrate according to claim 5, wherein the flow path forming substrate includes at least two rows of pressure generating chambers, and the bonding substrate is thickened at a portion corresponding to the row of the pressure generating chambers of the bonding substrate. An ink jet recording head, wherein a through hole penetrating in the depth direction is provided, and the lead wiring extends to a portion corresponding to the through hole. 7. The ink jet recording head according to claim 6, wherein the stacked drive ICs are fixed to both sides of the through hole of the bonding substrate. 8. The bonding substrate according to claim 1, further comprising a piezoelectric element holding portion that seals the space in a state where the space is secured in a region facing the piezoelectric element. Inkjet recording head. 9. The ink jet recording head according to claim 1, wherein the joint substrate has a reservoir portion that constitutes at least a part of a common ink chamber of each pressure generating chamber. 10. The pressure generating chamber according to claim 1, wherein the pressure generating chamber is formed in a silicon single crystal substrate by anisotropic etching, and each layer of the piezoelectric element is formed by film formation and a lithography method. An ink jet recording head characterized by being present. 11. An ink jet recording apparatus comprising the ink jet recording head according to claim 1.