JP2003025063A - Soldering method and soldering device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an excellent fillet shape by feeding a sufficient amount of soft solder to a part to be soldered and to secure excellent wettability to realize soldering of high productivity which does not cause defective bridging. SOLUTION: In a spout soldering method, a work 3 to be soldered is brought into contact with molten solder spouted from a spout guide 2 upwardly in the reverse-oblique direction to the advancing direction of the plate-like work 3. The solder is spouted to a horn-like squirt hole 4 from the spout guide 2 and diffused over the horn-like squirt hole 4 in a ridge shape to form a diffused spout part 5. A ridge-shaped wave spout part 6 is formed by the wave generated when the molten solder flows from the ridge-shaped diffused spout part 5 in a spreading manner. The plate-like work 3 is soldered by bringing into contact with the wave spout part 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder for supplying molten solder ejected from a jet guide to a solder mounting portion of a work to be soldered such as a printed wiring board on which electronic parts are mounted for soldering. The present invention relates to a soldering method and a soldering device.

[0002]

2. Description of the Related Art Fillet shape and wettability of a soldered portion are important indicators of soldering quality when soldering a printed wiring board. That is, a sufficient amount of solder is supplied to the soldered portion of the printed wiring board and its wettability is good, so that good electrical connectivity and mechanical connection with sufficient strength of the soldered portion are provided. It is necessary to satisfy the sexuality.

Of course, even if the fillet shape is improved by supplying a sufficient amount of solder to the portion to be soldered, the molten solder is spread over the adjacent portion to be soldered. Should not cause bridging failure.

As a conventional example that attempts to realize such a demand, there is JP-A-7-336038. The point of the conventional example disclosed in Japanese Patent Laid-Open No. 7-336038 is that the flow rate and the separation angle of the molten solder at the peel back point where the printed wiring board and the jet wave of the molten solder separate from each other can be easily adjusted. It is in the place where it was made.

Further, Japanese Patent Laid-Open No. 11-74639 is known as a conventional example of a technique obtained by further improving this technique. The conventional example disclosed in Japanese Patent Laid-Open No. 11-74639 is configured so that the split point of the jet wave and the peel back point can be matched and soldered.

Further, as this type of soldering apparatus, for example, JP-A-63-199064 and JP-A-63-80961 are conventionally known. In the soldering devices shown in these publications, molten solder is jetted by a pressure feeding device, and the printed wiring board is passed through the jetted molten solder portion to perform soldering. In this case, when the molten solder is jetted in the same direction as the traveling direction of the printed wiring board, a bridge is generated, so that the solder is jetted in the opposite direction to the traveling direction of the printed wiring board.

However, the conventional examples disclosed in JP-A-7-336038 and JP-A-11-74639 have an advantage that the fillet shape of the soldered portion can be improved. In order to improve the productivity when soldering the printed wiring board, it is necessary to increase the transport speed of the printed wiring board that is transported to the soldering device by the transport conveyor.

For example, if the conveying speed of the printed wiring board is doubled, the soldering productivity can be doubled. However, in the conventional soldering apparatus, the jet wave of the printed wiring board and the molten solder is jetted. There is a problem that the contact time between and becomes short and the solder wettability of the soldered portion deteriorates. By the way, it is usually 1m / mi in the conventional soldering equipment.
A carrier speed of about n is adopted, and the target soldering quality is obtained at this carrier speed.

That is, the contact between the printed wiring board and the jet wave of the molten solder causes heat input from the molten solder to the soldered portion of the printed wiring board to heat the soldered portion. Although solder wetting of the soldering portion occurs, when the contact time between the printed wiring board and the jet wave of the molten solder becomes short, the heating is not sufficiently performed and the solder wettability deteriorates.

By the way, in the conventional soldering device, it takes about 3 seconds.
The desired solder wettability is obtained by ensuring a contact time of about ec. That is, normally, the soldering process is performed such that the conveying speed of the printed wiring board is 1 m / min and the contact time is about 3 sec.

The amount of heat input per unit time from the molten solder to the soldered portion of the printed wiring board can also be increased by increasing the flow velocity of the jet wave of the molten solder. However, the flow velocity of the jet wave of molten solder is high, the contact time with the printed wiring board is long, the amount of solder supplied to the soldered part is large, the fillet shape is good, and the bridge between adjacent soldered parts is large. There is no soldering device that does not cause defects. In the conventional jet wave, for example, in the jet wave of the technique disclosed in JP-A-7-336038 or JP-A-11-74639, the jet wave contacting the printed wiring board has a single mountain shape. The contact time with a printed wiring board having a flat surface is naturally limited. That is, the depth at which the printed wiring board can be immersed in the jet wave (usually 1/2 the thickness of the printed wiring board).
The contact time cannot be made longer than that determined by the depth of the solder, and as a result, the contact time between the jet wave of the molten solder and the printed wiring board cannot be lengthened.

[0012] Further, in recent years, as environmental concerns have been attracted, exposed electrical equipment is exposed to acid rain and the like, whereby the elution of lead from the solder of the printed wiring board used therefor is promoted, and The problem is that environmental damage is caused by harm. Therefore, lead-free solder that does not use lead and soldering technology that uses the lead-free solder are being developed. However, since lead-free solder generally has poor wettability, there is a current demand for a soldering technique capable of improving wettability in lead-free solder.

[0013]

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and it is possible to obtain a sufficient contact time with a printed wiring board even if the flow velocity is high, and to the portion to be soldered. A sufficient amount of solder can be supplied to obtain a good fillet shape, good wettability can be secured, and bridging defects do not occur, achieving highly productive soldering processing. It is another object of the present invention to provide a soldering method and a soldering device that can improve the wettability of lead-free solder.

[0014]

In order to solve the above-mentioned problems, a soldering method according to the present invention is a device 1 for feeding molten solder under pressure.
The molten solder ejected from the jet guide 2 is pressure-fed to the jet guide 2 by the plate guide, and the plate-shaped soldered work 3 is passed through the molten solder portion ejected from the jet guide 2 to perform the soldering. A jet-type soldering method in which the work to be soldered 3 is brought into contact with the solder work 3 by spraying it obliquely upward and upward from the advancing direction of the solder work 3, and the solder is jetted from the jet guide 2 to the horn-shaped outlet 4. Formed on the horn-shaped outlet 4 is a diffusion jet portion 5 in which the molten solder diffuses and jets in a mountain shape, and the mountain shape is formed by a wave generated when the molten solder spreads from the mountain-shaped diffusion jet portion 5. The wave jet part 6 is formed, and the plate-like work 3 to be soldered is brought into contact with the wave jet part 6 for soldering.

However, the molten solder ejected from the jet guide 2 in a diagonally upward direction opposite to the traveling direction of the plate-shaped workpiece 3 to be soldered is guided to the horn-shaped blower port 4 whose opening gradually expands. A mountain-shaped diffusion jet part 5 is generated while diffusing. Since the potential energy of the diffusion jet portion 5 of the molten solder jetted from the jet guide 2 is large, a wave is generated in the molten solder that spreads while flowing down from the mountain-shaped diffusion jet portion 5, and the wave jet portion 6 is caused by this wave. Is formed. A wave-like jet wave is formed by the diffusion jet portion 5 and the wave jet portion 6 thus formed. Further, in the present invention, since the plate-like soldered work 3 such as a printed wiring board is brought into contact with the wave jet portion 6 as described above, the wave jet portion 6 is a plate such as a printed wiring board. The contact length corresponding to the wavelength of the wave jet portion 6 can be increased by bringing the workpiece 3 to be soldered into contact (that is, at least the wavelength of the wave jet portion 6 in the solder work 3 conveyed by the conveyor). It is possible to obtain a contact time equivalent to. Moreover,
Since the jet flow is ejected from the jet guide 2 in an obliquely upper direction opposite to the traveling direction of the plate-shaped soldered work 3, the flow velocity of the molten solder jetted from the jet guide 2 is increased, and the flow velocity of the jet wave formed by this is increased. Is also faster. In addition, the soldered work 3 is held at the jet wave portion where the molten solder rises from the valley-shaped portion between the diffusion jet portion 5 and the wave jet portion 6.
Is separated from the jet wave, and the amount of solder dropped from the soldered part of the work 3 to be soldered into the flow in the jet due to the separation is small, and a sufficient amount of molten solder is applied to the soldered part. Can be supplied.

Further, the molten solder is jetted from the jet guide 2 to the blower port 4, and the molten solder rises in a mountain shape on the blower port 4 from the top toward the opposite side to the traveling direction of the work 3 to be soldered. Forming a ridged jet portion 7 that splits into a divergent flow and a flow toward the advancing direction, and the ridges are formed by waves generated when the molten solder spreads from the ridged jet portion 7 It is preferable that the wave jet part 6 is formed, and the plate-like soldered work 3 is brought into contact with the split jet part 7 and the wave jet part 6 to perform soldering.

By adopting such a method, the molten solder jetted from the blower port 4 is guided by the horn-shaped blower port 4 whose opening gradually expands, and rises in a mountain shape while diffusing. The diffusion jet portion 5 is generated, and the mountain-shaped raised diffusion jet portion 5 is divided into a flow from the top toward the opposite side to the traveling direction of the workpiece 3 to be soldered and a flow toward the traveling direction side. Therefore, the diffusion jet unit 5 constitutes the split-ridge jet unit 7. Then, the flow velocity of the molten solder becomes substantially zero at the top of the ridge jet unit 7, and then the flow direction changes rapidly in different directions. Since the molten solder flowing toward the opposite side with respect to the direction has a large potential energy in the ridged jet portion 7, a wave is generated in the molten solder that spreads while flowing down from the ridged jet portion 7. The wave jet portion 6 is formed by the wave.

In this way, a wave-like jet wave is formed. When the split jet portion 7 and the wave jet portion 6 formed in the jet wave are brought into contact with the plate-shaped soldered work 3. , At least the contact length corresponding to the wavelength of the jet wave formed in a wave shape, which is the interval between the split jet portion 7 and the wave jet portion 6, can be lengthened (that is, in the soldered work 3 conveyed by the conveyor) At least a contact time corresponding to the wavelength of the wave jet portion 6 can be obtained). Moreover, since the jet is ejected from the jet guide 2 in the diagonally upward direction opposite to the traveling direction of the plate-shaped soldered work 3, the flow velocity of the molten solder jetted from the jet guide 2 is increased, and the jet wave is formed by the jet wave. The flow velocity of is also faster. Further, since the work piece 3 to be soldered that separates from the jet flow wave separates from the split jet section 7, the work piece 3 to be soldered and the work piece 3 to be soldered from the top of the split jet section 7 are separated.
Of the molten solder flowing in the traveling direction side of the work 3 to be soldered
The relative speed of the solder becomes almost zero, the amount of solder dropped from the soldered portion of the soldered work 3 at the time of detachment becomes small, and a sufficient amount of molten solder can be supplied to the soldered portion. Is.

Further, in the soldering apparatus of the present invention, the molten solder is pressure-fed to the jet guide 2 by the pressure feeding apparatus 1, and the plate-like soldered work 3 is passed through the molten solder portion ejected from the jet guide 2. In soldering, a jet type soldering device in which molten solder ejected from the jet guide 2 is ejected obliquely upward and opposite to the traveling direction of the plate-shaped workpiece 3 to be brought into contact with the workpiece 3 to be soldered. Therefore, the jet port 2 of the jet guide 2 for jetting the molten solder in a diagonally upward direction opposite to the traveling direction of the workpiece 3 to be soldered has a horn shape, and the molten solder is diagonally opposite to the traveling direction of the workpiece 3 to be soldered. An outer wall 8 which is a wall portion on the traveling direction side of the soldered work 3 of the jet guide 2 for jetting upward and an inner wall 9 which is a wall portion on the opposite side to the traveling direction of the soldered work 3.
Are formed by arcuate members that are convex in the traveling direction of the work 3 to be soldered, and are connected to the blower port 4 from the upper end of the inner wall 9 in the direction opposite to the traveling direction of the work 3 to be soldered. The ejected flow guide plate 10 is formed, and the flow guide plate 10 has a mountain-like vertical cross-sectional shape in a direction parallel to the traveling direction of the workpiece 3 to be soldered or a continuous mountain-like shape in which two or more mountains are continuous. It is characterized by being formed into.

In this way, the work 3 to which the molten solder is soldered
Jet guide 2 for jetting diagonally upward and opposite to the advancing direction of
By making the blowing port 4 of the horn shaped like a horn, the molten solder ejected from the jet flow guide 2 in an obliquely upward direction opposite to the traveling direction of the plate-shaped soldered work 3 has a horn-shaped blowing shape with an opening gradually expanding. A mountain-shaped diffusion jet portion 5 is generated while being guided by the mouth 4, and the potential energy of the diffusion jet portion 5 of the molten solder jetted from the jet guide 2 is large. However, a wave is generated in the molten solder that spreads, the wave jet portion 6 is formed by this wave, and a wave jet wave can be formed by the diffusion jet portion 5 and the wave jet portion 6 thus formed, and In addition to this, a flow guide plate 10 is formed at the blowout port 4 and extends from the upper end of the inner wall 9 in the direction opposite to the traveling direction of the workpiece 3 to be soldered. Progress of work 3 to be soldered Since the vertical cross-sectional shape in the direction parallel to the direction is formed in a mountain shape or a continuous mountain shape in which two or more mountains are continuous, the wavelike jet wave of the molten solder is the mountain shape of the flow guide plate 10. Even the top part of the shape rises and becomes a mountain shape. As a result, a wave-like jet wave rises at the mountain-shaped top portion of the flow guide plate 10, and the work 3 to be soldered is brought into contact with this portion, so that the length of contact with the work 3 to be soldered (that is, The contact time) can be extended. Further, the outer wall 8 which is a wall portion of the jet guide 2 on the advancing direction side of the soldered work 3 and the inner wall 9 which is a wall portion on the opposite side to the advancing direction of the soldered work 3 are respectively attached to the soldered work 3 respectively. By using an arc-shaped member that is convex in the traveling direction of the molten solder, the flow rate of the molten solder that is jetted from the jet guide 2 by jetting the molten solder obliquely upward and upward in the traveling direction of the workpiece 3 to be soldered with a simple configuration. The structure can be made faster.

A nozzle-shaped jet guide 2 is composed of an arcuate drum 12 whose rotation can be adjusted around a shaft 11 and an arcuate member 13 provided so as to face the surface of the drum 12.
It is preferable that the jet guide plate 14 projecting in the arc direction is provided at the edge of the blower port 4 of the arc-shaped member 13 facing the surface of the drum 12 so that the projection amount can be adjusted. With such a configuration, by rotating the drum 12, the angle of the flow guide plate 10 is changed and the opening angle of the horn of the horn-shaped blower port 4 for ejecting the molten solder from the jet guide 2 and the like. The flow rate of the molten solder can be adjusted by changing the depth of the horn. Also, the arc-shaped member 13
By adjusting the amount of projection of the jet guide plate 14 above the
The flow rate of the jet guide plate 14 jetted from the blower port 4 can be adjusted so as to overflow and flow down, whereby the flow rate of the molten solder flowing to the flow guide plate 10 side can be adjusted.

Further, the length from the center position of the blow port 4 to the top 15 of the mountain-shaped portion of the flow guide plate 10 closest to the blow port 4 and the length between the tops 15 of the adjacent mountain-shaped portions, and The distance from the top 15 of the mountain-shaped portion closest to the downstream end of the molten solder to the downstream end is approximately the same length, and the distance between the blower openings 4 is 1/3 or less of the length. 1
It is preferable that the interval be / 6 or more. With such a structure, the mountain portion of the wave jet portion 6 can be located on the mountain-shaped top portion of the flow guide plate 10. Further, by setting the interval of the blowout ports 4 to be 1/3 or less to 1/6 or more of the length, when the molten solder jetted in a mountain shape flows on the blowout ports 4, a large drop causes the wave energy. A wave trough is formed between the blowout port 4 and the peak-shaped top of the flow guide plate 10, and then a peak is formed at the peak-shaped top of the flow guide plate 10. As described above, a wave is generated as described above, and a reliable wave can be easily generated in the jet wave.

Further, the inner wall 9 and the outer wall 8 of the jet flow guide 2 are formed in an arc shape having different points O1 and O2 as central points, and the outermost portion of the inner wall 9 of the jet flow guide 2 is substantially formed. The upper end of the outer wall 8 is preferably located at the vertically upper position. With this structure, the cross-sectional area of the molten solder sent from the pressure-feeding device 1 can be gradually reduced in the jet guide 2 toward the blowing port 4, and thus the molten solder is jetted from the blowing port 4. The molten solder can be ejected in substantially the same direction with a large flow rate and a high flow rate. Further, since the upper end portion of the outer wall 8 is located substantially vertically above the outermost portion of the inner wall 9 of the jet flow guide 2, the upper end of the outer wall 8 is melted obliquely upward and upward with respect to the traveling direction of the work 3 to be soldered. Correcting the trajectory of the molten solder jet in the vertical direction, which is intended to cancel the jet of solder, at the upper end of the outer wall 8 so that the jet of molten solder is concentrated obliquely upward and upward with respect to the traveling direction of the workpiece 3 to be soldered. As a result, the molten solder can be ejected in the substantially same direction with a large flow rate and a high flow velocity.

The arc-shaped outer wall 8 of the jet guide 2
Is preferably 1.3 to 2.0 times the radius of the arc-shaped inner wall 9. With this configuration,
The flow rate of the molten solder flowing to the flow guide plate 10 side is large, the thickness of the jet flow is thick, and a jet wave having a high flow velocity can be formed.

In addition, the shaft 1 is attached to the upper portion of the outer wall 8 of the jet guide 2.
6 is provided with a rotatable jet guide plate 14, and the jet guide plate 14 has an angle in a direction inclined obliquely upward and reverse of the traveling direction of the workpiece 3 to be soldered with reference to a vertical line M passing through the shaft 16. It is preferably variable. With such a configuration, along the jet guide plate 14 having an arbitrary angle in the direction inclined obliquely upward and opposite to the traveling direction of the workpiece 3 to be soldered with the vertical line M passing through the shaft 16 as a reference. The jet wave of the molten solder jetted can be brought into contact with the workpiece 3 to be soldered at an arbitrary angle, and the angle of the separation point between the workpiece 3 to be soldered and the jet wave can be adjusted. That is, when the angle is increased in a direction that is obliquely upward and opposite to the traveling direction of the work 3 to be soldered on the basis of the vertical line M passing through the axis 16, the work 3 to be soldered and the jet wave of the molten solder are separated from each other at the separation point. The flow velocity in the direction opposite to the traveling direction of the soldering work 3 becomes faster, and the occurrence of fine bridging defects in the soldering portion is eliminated. Further, when the angle is reduced in a direction inclining upward and obliquely to the traveling direction of the work 3 to be soldered with reference to the vertical line M passing through the axis 16, at the point of separation between the work 3 to be soldered and the jet wave of the molten solder, The downward component of the jet wave becomes small (that is, the pressing force of the jet wave against the soldering work 3 becomes large, and the component that the molten solder is peeled downward from the work 3 to be soldered becomes small) The solder can be supplied to the work 3 to be soldered. Further, a vertical line M passing through the axis 16
The workpiece 3 to be soldered is formed by forming an angle in a direction obliquely upward and opposite to the traveling direction of the workpiece 3 to be soldered.
The flow velocity at the point of separation from the jet wave of the molten solder and the flow rate increases.

Further, the jet guide plate 14 may be inclined at an angle of 30 ± 10 ° in a direction obliquely upward and opposite to the traveling direction of the work 3 to be soldered with reference to a vertical line M passing through the shaft 16. preferable. With such a configuration, the flow velocity in the direction opposite to the traveling direction of the workpiece 3 to be soldered can be increased, and the downward component of the jet wave can be reduced.

Further, it is preferable that the portion of the flow guide plate 10 closest to the inner wall 9 has a curved shape which is convex toward the workpiece 3 to be soldered along the flow direction of the molten solder. With such a configuration, it is possible to suppress the occurrence of turbulent flow due to a change in the angle of the molten solder jetted along the inner wall 9 of the jet guide 2 between the inner wall 9 and the flow guide plate 10. It is possible.

Further, the flow guide plate 10 is formed such that a plurality of guide pieces 10a are continuous along the flow direction of the molten solder through the bent portions so that the guide pieces 10a are continuous with each other. It is preferable that the angle between the adjacent guide pieces 10a can be made variable via the. With such a configuration, the molten solder flowing on the flow guide plate 10 in the direction opposite to the traveling direction of the work 3 to be soldered changes the flow angle at the intersections of the adjacent guide pieces 10a, and disturbs. Although it becomes a flow, this turbulent flow flows downward and a wave jet is formed. And the adjacent guide piece 1
Since the turbulent flow state, that is, the wave jet flow changes depending on the size of the angle formed by 0a, a wave jet flow having a complicated shape can be formed, and the size of the wave jet flow can be adjusted.

[0029]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below based on the embodiments shown in the accompanying drawings.

FIG. 1 is a side sectional view of the soldering device of the present invention, and FIG. 2 is a partially cutaway perspective view showing the blower port 4 portion shown in FIG.

As shown in FIGS. 1 and 2, the soldering device 1
Reference numeral 7 denotes a solder bath 18 in which molten solder which has been melted by being heated by a heater (not shown) is contained, and a solder bath 18
And a molten solder jet device 19 for soldering the molten solder contained therein to a work 3 to be soldered such as a printed wiring board. The molten solder jet device 19 is provided in an upper part of the solder bath 18. It is provided.

The molten solder jet device 19 is provided with a blower body 20, and a lower portion of the blower body 20 becomes a lower tube portion 22 in which a pumping device 1 such as a pump and a rectifying plate 21 are installed. The upper part of the jet flow guide 2 constitutes a jet flow port, and the upper part of the jet flow guide 2 projects above the melt surface of the solder bath 18. Then, the molten solder stored in the solder bath 18 is pressure-fed to the jet guide 2 by the pressure feeding device 1 and jetted from the jet guide 2 to form a jet wave of the molten solder. Above the solder bath 18, a plate-like soldered work 3 such as a printed wiring board on which a large number of electronic components are mounted is conveyed by a conveyer 23. By carrying the soldering work 3, the soldering surface (that is, the soldering portion) of the plate-shaped soldering work 3 is brought into contact with the jet wave of the molten solder to perform soldering on the soldering work 3. It has become. That is, the conveyer 23 is the work 3 to be soldered.
1 is a means for contacting the portion to be soldered with the jet wave of the molten solder. In the example of FIG. 1, the workpiece 3 to be soldered is conveyed above the solder bath 18 at an elevation angle θ by the conveyor 23. There is.

The jet guide 2 provided on the upper portion of the nozzle 20
Is provided with a horn-shaped blower opening 4 in which the opening gradually expands, and the molten solder ejected from the jet guide 2 is obliquely upwardly upward from the blower opening 4 in the traveling direction of the plate-shaped soldered work 3. It is configured to blow up to. That is, the outer wall 8 which is a wall portion of the jet guide 2 on the traveling direction side of the workpiece 3 to be soldered and the inner wall 9 which is a wall portion on the opposite side to the traveling direction of the workpiece 3 to be soldered are respectively attached to the workpiece 3 to be soldered. Is formed in a nozzle shape by an arcuate member that is convex in the traveling direction of the nozzle, and the molten solder is guided from the arcuate inner wall 9 and the arcuate outer wall 8 by the arcuate inner wall 9 and the arcuate outer wall 8. It is designed to be ejected obliquely above and opposite to the traveling direction of the work 3 to be soldered.

In the embodiment shown in the accompanying drawings, an arc-shaped inner wall 9 is constituted by an arc-shaped drum 12 which is rotatable about a shaft 11 in the direction of arrow A in FIG. The outer wall 8 provided facing the surface of the drum 12
Is formed by an arc-shaped member 13. Further, a jet guide plate 14 protruding in the arc direction of the arc-shaped member 13 is attached to the edge of the outlet 4 of the arc-shaped member 13, and either the arc-shaped member 13 or the jet guide plate 14 is attached. The bolt 24 provided on one side is passed through the vertically long hole 25 provided on the other side and is fastened by the nut 26. By loosening the nut 26 and sliding it in the direction of arrow B in FIG.
4 is adjusted in position with respect to the vertically elongated hole 25, and the arc-shaped member 1
The amount (length) of upward projection of the jet guide plate 14 from the upper part of 3 can be adjusted. In the embodiment shown in FIG. 1, a discharge guide plate 31 is provided so as to project downward from the upper end portion of the jet guide plate 14 and obliquely downward in the traveling direction of the work 3 to be soldered. Further, a lower horizontal piece 13a is provided below the arcuate member 13, and the lower tubular portion 22
A mounting piece 22a for mounting and supporting the lower horizontal piece 13a is provided on the upper part of the lower horizontal piece 13a.
In the direction in which the arc-shaped member 13 placed on a moves toward or away from the drum 12 facing it (that is, FIG.
The position is freely adjustable in the direction of arrow C), and in the embodiment shown in the accompanying drawings, the adjusting screw 28 is passed through the long hole 29 provided in the lower horizontal piece 13a and screwed into the female screw hole provided in the mounting piece 22a. The inner wall 9 of the jet guide 2 which is a jet port
The distance between the passage and the outer wall 8 can be adjusted.

The blowout port 4 is formed with a flow guide plate 10 extending from the upper end portion of the inner wall 9 in the direction opposite to the traveling direction of the work 3 to be soldered. In the embodiment shown in the accompanying drawings, A flow guide plate 10 is provided on an arcuate drum 12 forming the inner wall 9. The flow guide plate 10 has a vertical cross-sectional shape in a mountain shape or a continuous mountain shape in which two or more mountains are continuous in a direction parallel to the traveling direction of the workpiece 3 to be soldered. Both of the inclined pieces are guide pieces 10a, and the tops 15 are formed at the intersections of the adjacent guide pieces 10a, and the guide pieces 10a near the upper end side of the inner wall 9 of the flow guide plate 10 having the mountain shape. Is the work to be soldered 3
Is inclined diagonally upward and opposite to the traveling direction, and a discharge falling piece 27 is provided at the end of the flow guide plate 10 opposite to the traveling direction of the workpiece 3 to be soldered. A side plate 30 is provided so as to surround the flow guide plate 10 and the jet flow guide plate 14 from both sides, and the openings of the flow guide plate 10, the jet flow guide plate 14, and the both side plates 30 gradually expand. The horn-shaped blower opening 4 is configured. The portion indicated by H in FIG. 1 is a horn portion in which the opening gradually expands. Then, in FIG. 2, the fixing screw 32 fixing the shaft 11 is loosened and the arcuate drum 12 is rotated about the shaft 11 to change the angle of the flow guide plate 10 to melt the solder from the jet guide 2. Horn-shaped blower outlet 4
It is possible to adjust the flow rate of the molten solder by changing the horn opening angle and the horn depth.

The current plate 21 provided in the lower cylindrical portion 22 is provided between the pressure feeding device 1 and the jet flow guide 2 constituting the jet flow port, and regulates the flow of the molten solder sent from the pressure feeding device 1. The member is a plate-shaped member having a large number of through holes. Further, the flange provided on the lower tubular portion 22 shown in FIG. 2 is a member for fixing with a screw in accordance with a flange portion (not shown) of the pumping device 1 such as a pump.

In the soldering apparatus having the above-mentioned structure, the outer wall 8 and the inner wall 9 of the jet guide 2 forming the jet port are each formed into an arc shape which is convex in the traveling direction of the work 3 to be soldered. The molten solder jetted from the horn-shaped blower port 4 mainly flows in an obliquely upper direction opposite to the traveling direction of the work 3 to be soldered (that is, on the flow guide plate 10). Above, a jet wave having a large flow rate and a high flow velocity can be formed.

Further, by adjusting the amount of protrusion (length) of the jet guide plate 14 to the upper side, the flow rate of the molten solder jetted from the blower port 4 overflowing and flowing down the jet guide plate 14 can be adjusted. Thus, the flow rate of the molten solder flowing to the flow guide plate 10 can be adjusted. Further, the flow rate can be adjusted by rotating and adjusting the arcuate drum 12 as described above.

Next, a method of soldering the work 3 to be soldered by using the soldering apparatus shown in FIGS. 1 and 2 will be described with reference to FIG.

The molten solder pressure-fed to the jet guide 2 by the pressure-feeding device 1 is guided by the arc-shaped outer wall 8 and the arc-shaped inner wall 9 of the arc-shaped jet guide 2, and the plate-shaped soldered portion 4 is introduced from the horn-shaped blower port 4. It is jetted upward and diagonally opposite to the advancing direction of the attachment work 3.

In this way, the molten solder ejected from the jet flow guide 2 in an obliquely upward direction opposite to the traveling direction of the plate-shaped soldered work 3 is guided to the horn-shaped blower port 4 whose opening gradually expands. And becomes a mountain-shaped diffusion jet part 5 while diffusing. In this diffusion jet unit 5, the turbulent component of the jet flow is greatly attenuated as the flow diffuses in the horn-shaped blower port 4 whose opening gradually expands.

In the diffusion jet part 5, the opening width of the starting end is much shorter than the length of the flow guide plate 10, and the blower port 4 is provided.
Since it is formed by the molten solder jetted from, it is formed in the shape of a mountain with a high height above the horn-shaped blow-out port 4 as shown in FIG.

Therefore, the molten solder flows down from the mountain-shaped diffusion jet portion 5 toward the jet guide plate 14 and the flow guide plate 10, but most of the molten solder flows down toward the flow guide plate 10. Some molten solder overflows the upper end of the jet flow guide plate 14, flows through the discharge guide plate 31, and flows down into the solder bath 18. As described above, a part of the molten solder of the diffusion jet portion 5 rising in a mountain shape is overflowed to the jet guide plate 14, whereby the attenuation of the turbulent flow generated in the diffusion jet portion 5 can be further promoted. Is.

On the other hand, as described above, since the diffusion jet portion 5 of the molten solder formed in the shape of a mountain with a high height above the horn-shaped nozzle 4 has a large potential energy, When the molten solder flows down and spreads on the flow guide plate 10, a wave is generated in the molten solder due to the above-mentioned potential energy, and the wave causes the wave jet portion 6 to be formed. A wavelike jet wave is formed with the jet portion 6. Here, since the turbulent flow component of the jet flow is greatly attenuated in the diffusion jet unit 5 as the flow is diffused, a stable jet wave is formed in the wave jet unit 6.

By the way, the present inventor has found that the above wave jet wave is most likely to be generated when a predetermined condition is satisfied. That is, the length from the center position of the start end of the blower port 4 to the top 15 of the mountain-shaped portion of the flow guide plate 10 closest to the blower port 4 (indicated by L1 in FIG. 3) and the downstream side of the molten solder. The distance (indicated by L2 in FIG. 3) from the top portion 15 of the mountain-shaped portion closest to the end portion to the end portion on the downstream side has substantially the same length, and the outlet 4
The wave jet part 6 can be best formed when the interval between the openings at the starting end of the above (shown by L3 in FIG. 3) is an interval of 1/3 or less to 1/6 or more of the length. When two or more mountain-shaped portions are formed, the length between the tops of the adjacent mountain-shaped portions (indicated by L2 in FIG. 3) and the distance between the tops of the adjacent mountain-shaped portions. Is the same as L1 and L2.

By setting the length and the spacing under the above conditions, the wave jet portion 6 is provided on the top portion 15 of the flow guide plate 10.
The molten solder flows so that the peak-shaped portions are positioned, and the wave of the jet wave having the length of L1 and L2 as the wavelength λ is easily generated.

The distance between the blow ports 4 is set to 1/3 of the above length.
By configuring the interval to be equal to or less than 1/6 or more,
When the molten solder jetted in the shape of a mountain flows over the nozzle 4, wave energy is generated due to the large drop, and this nozzle 4
And a wave-shaped trough is formed between the mountain-shaped top 15 of the flow guide plate 10, and thereafter, wave is formed so as to form a mountain on the mountain-shaped top 15 of the flow guide plate 10. It is possible to easily generate a reliable wave motion in the jet wave.

The condition in which this wave is most likely to occur is that the air outlet 4
The distance L3 between the openings at the start end of is equal to 1 / of the lengths L1 and L2.
It is a case of about 4 to 1/5. If this interval is wider than 1/3, the wavelength λ of the wave generated by the jet flow becomes longer than the L1 and L2 of the flow guide plate 10 and does not match, which is not preferable because the wave jet portion 6 is less likely to occur. If it is narrower than 1/6, the wavelength of the wave generated by the jet flow is shorter than L1 and L2, and the wave is easily attenuated, and the wave jet portion 6 is less likely to occur, which is not preferable.

Therefore, when soldering the work 3 to be soldered, a carrier such as a printed wiring board is conveyed above the solder bath 18 in the direction of arrow Y in FIG. The lower surface (that is, the surface to be soldered) of the soldering work 3 and the wave jet portion 6 are brought into contact with each other for soldering. By performing the soldering in this way, the workpiece 3 to be soldered comes into contact with the wave jet portion 6 having a very small turbulent component, and at this time, at least a contact length corresponding to the wavelength λ of the wave jet portion is obtained. Will be done. That is, the transport conveyor 23
In the work 3 to be soldered carried by, it is possible to obtain at least a contact time corresponding to the wavelength λ of the wave jet portion 6. Moreover, since the jet work is guided by the jet guide 2, the jet work is ejected obliquely upward and opposite to the advancing direction of the plate-shaped workpiece 3 to be soldered, so that the flow velocity of the molten solder jetted from the jet guide 2 is increased, which is formed. The flow velocity of the jet wave also increases.

Therefore, it is possible to secure a sufficient contact time even if the work speed of the work 3 to be soldered is increased, and to secure a sufficient amount of heat input to the work 3 to be soldered. It is possible to obtain good solder wettability. By the way, L1 = L2 = about 7 cm,
When the wave jet part 6 is formed with L3 = about 1.5 cm, the transfer speed of the printed wiring board, which is the work 3 to be soldered, is about 2.5 s even if it is 2 m / min, which is twice as fast as the conventional one.
It has been confirmed that a contact time of about ec can be secured.

Therefore, good wettability can be obtained even when lead-free solder, which has relatively poor wettability, is used. That is, if the conveyance speed of the printed wiring board, which is the work 3 to be soldered, is 1 m / min, which is the same as the conventional one, it is about 5
A contact time of about sec can be obtained, and the molten solder flows and is supplied to the soldered portion of the workpiece 3 to be soldered at a high speed by the jet wave having a high flow velocity, whereby the wettability can be improved. . By the way, Sn-Ag-
It has been confirmed that Cu-based lead-free solder can be used to obtain wettability equivalent to that of Sn-Pb-based solder.

Further, as described above, since the flow velocity of the jet wave is high, the dynamic pressure of the jet flow is large, and the molten solder can be surely introduced into and supplied to the fine soldered portion. Since the flow velocity is high, the solder that causes the bridge is removed and the bridge failure does not occur.

Further, the work 3 to be soldered is separated from the jet wave at the jet wave portion where the molten solder rises and flows from the valley-shaped portion between the diffusion jet portion 5 and the wave jet portion 6. The amount of solder dropped from the soldered portion of the soldered work 3 into the flow of the jet due to the detachment is small, and a sufficient amount of molten solder can be supplied to the soldered portion, which is a good fillet. A shape can be formed. Since the flow of the wave jet portion 6 is stable as described above, a stable fillet shape can be obtained.

Next, another embodiment of the soldering method using the soldering device shown in FIGS. 1 and 2 will be described with reference to FIG.

In the soldering device shown in FIGS. 1 and 2, when the drum 12 is rotated about the shaft 11 in the direction of arrow A in FIG. 4, the angle of the flow guide plate 10 can be changed.
By changing the angle of the flow guide plate 10, the opening angle of the horn-shaped outlet 4 and the depth of the horn can be adjusted. Then, as shown in FIG. 4, the flow guide plate 1
It is also possible to adjust the angle of 0 to move the guide piece 10a closer to the upper end of the inner wall 9 of the flow guide plate 10 to a substantially horizontal state.

As shown in FIG. 4, in the embodiment in which the guide piece 10a near the upper end of the inner wall 9 of the flow guide plate 10 is in a state close to horizontal, the jet guide plate 14 is used more than in the case of FIG. The flow rate is adjusted so as to be slightly lower in the direction of the arrow B, and the flow rate of the molten solder jetted from the blower port 4 overflowing and flowing down is adjusted to be larger than that in the case of FIG. That is, in the present embodiment, the mountain-shaped diffusion jet part 5 in which the molten solder jetted from the nozzle 4 rises in the mountain shape.
The molten solder always flows down in the direction of the jet flow guide plate 14 (arrow B) and in the direction of the flow guide plate 10 (arrow C). Therefore, the mountain-shaped diffusion jet part 5 of the present embodiment is
A split ridge in which the molten solder rises in a mountain shape on the blowout port 4 and is jetted so as to be divided into a flow from the top toward the opposite side to the traveling direction of the workpiece 3 to be soldered and a flow toward the traveling direction side. It becomes the jet unit 7.

Further, in the present embodiment, as shown in FIG. 4, the conveyer 23 is provided so as to convey the work 3 to be soldered horizontally.

Therefore, the blower opening 4 adjusted as described above.
When the molten solder is jetted from the ridge-shaped diffusion jet portion 5, the jet guide plate 14 is always directed in the direction (arrow B) and the flow guide plate 1.
Since the molten solder flows down in the 0 direction (arrow C), the mountain-shaped diffusion jet portion 5 becomes the split jet portion 7 that splits the molten solder from the top portion to both sides. In the adjustment example of FIG. 4, the guide piece 10a near the upper end of the inner wall 9 of the flow guide plate 10 is in a substantially horizontal state, so that the turbulent flow diffusion action is relatively low.

Even in the case of such an adjustment, the split-spout jet section 7
Waves are generated in the molten solder that spreads while flowing down from the flow guide plate 10 to the mountain-shaped flow, that is, the wave jet portion 6. Then, the flow velocity of the molten solder becomes substantially zero at the top of the split jet portion 7, and thereafter, as described above, the direction of rapid flow is changed between the direction of the flow guide plate 10 and the direction of the jet flow guide plate 14, respectively. Run down. Here, the wave jet portion 6 is formed by the same action as in the case of FIG. 3 by the molten solder flowing in the direction of the flow guide plate 10.

Here, in this embodiment, since the jet flow guide plate 14 is lowered in the direction of the arrow B in FIG. 3, the heights of the split jet portion 7 and the wave jet portion 6 which are the diffusion jet portions 5 are high. The height can be made almost the same. Also,
As described above, the flow velocity of the molten solder becomes almost zero at the top of the split-spouting jet portion 7 thus formed,
Then, a jet wave can be formed that rapidly flows down in the direction of the flow guide plate 10.

In the present embodiment, the split jet portion 7 and the wave jet portion 6 having substantially the same height are provided on the lower surface side of the workpiece 3 to be soldered, which is conveyed substantially horizontally as shown in FIG. The soldering is performed by bringing the surface to be soldered, which is the surface, into contact.

As described above, when the split jet portion 7 and the wave jet portion 6 having substantially the same height are brought into contact with the surface to be soldered, which is the lower surface of the workpiece 3 to be soldered, at least the split jet portion. It is possible to obtain the distance between the wave jet portion 7 and the wave jet portion 6, that is, the contact length corresponding to the wavelength λ of the jet wave formed in a wave shape. That is, in the work 3 to be soldered transported by the transport conveyor 23, at least the wavelength λ of the wave jet portion 6
It is possible to obtain a contact time corresponding to still,
As for this contact time, the same value as that of the soldering method in the above-described embodiment of FIG. 3 can be obtained.

Moreover, since the molten solder is jetted from the blower port 4 obliquely upward and upward in the traveling direction of the workpiece to be soldered, the flow velocity of the molten solder is high and the flow velocity of the jet wave formed thereby is high. Since the guide piece 10a near the upper end portion of the inner wall 9 of the flow guide plate 10 is in a substantially horizontal state, the flow velocity of the jet wave flowing through the guide piece 10a also becomes high in this respect. Further, the work 3 to be soldered, which is separated from the jet wave, is separated from the ridge jet part 7.

Therefore, it is possible to secure a sufficient contact time of the molten solder and to secure a sufficient heat input amount to the soldered work 3 even if the conveying speed of the soldered work 3 is increased. Become.

Therefore, good wettability can be obtained even if lead-free solder, which has relatively poor wettability, is used. That is, similar to the soldering method in the embodiment shown in FIG. 3, the contact time of about 5 sec is obtained when the transport speed of the printed wiring board, which is the work 3 to be soldered, is 1 m / min, which is the same as the conventional one. Furthermore, the molten solder flows and is supplied to the soldered portion of the soldered work 3 at a high speed by the jet wave having a high flow velocity, thereby improving the wettability. By the way, Sn-Ag
It has been confirmed that the same wettability as that of Sn-Pb type solder can be obtained by using -Cu type lead-free solder.

Further, as described above, since the flow velocity of the jet wave is high, the dynamic pressure of the jet flow is large, and the molten solder can be surely introduced into and supplied to a fine soldered portion. Then, the work piece 3 to be soldered that separates from the jet wave can be separated at the ridge point P at which the flow velocity of the ridge jet part 7 becomes substantially zero, and the work piece 3 to be soldered from the work piece 3 to be soldered can be separated. The amount of the molten solder dropped by the flow of the jet wave formed by overflowing the jet guide plate 14 is reduced, and a sufficient amount of the molten solder can be supplied to the soldered portion, thus providing a good fillet shape. Can be formed.

Next, still another embodiment of the present invention will be described with reference to FIG.

In the soldering apparatus shown in FIG. 1, the work 3 to be soldered advances as the upper portion of the jet flow guide plate 14 forming a part of the horn-shaped blower opening 4 with the opening gradually increasing. Although it is inclined obliquely upward so as to be displaced toward the direction side, the horn-shaped blower opening 4 has a horn shape that is open to the right side of the drawing (that is, the traveling direction of the workpiece 3 to be soldered). In the soldering device used in the present embodiment, the entire jet guide plate 14 is formed in an arc shape that is continuous with the arc of the arc-shaped member 13 that forms the outer wall 8, and the embodiment shown in FIG. The shape of the horn-shaped blower opening 4 in which the opening gradually widens has a horn shape in which the opening direction of the horn is opened only in the direction opposite to the traveling direction of the workpiece 3 to be soldered. Therefore, the flow velocity of the molten solder flowing through the flow guide plate 10 can be further increased, and the jet wave contacting the workpiece 3 to be soldered, that is, the flow velocity of the molten solder can be further increased, and the workpiece 3 to be soldered can be further increased. It is possible to secure a sufficient contact time of the molten solder and to secure a sufficient amount of heat input to the work 3 to be soldered even if the transport speed of (1) is increased.

Next, still another embodiment of the present invention will be described with reference to FIGS. The embodiment shown in FIG. 6 shows a method of soldering to the work 3 to be soldered by the soldering method shown in FIG. 3 using the soldering apparatus shown in FIG. 5, and the embodiment shown in FIG. It shows a method of soldering to the work 3 to be soldered by the soldering method shown in FIG. 4 using the soldering apparatus shown.

Therefore, the operation of the embodiment shown in FIG. 6 has the same operation as that of the embodiment shown in FIG. 3, and the operation of the embodiment shown in FIG. 7 has the same operation as that of the embodiment shown in FIG.
Since the embodiments shown in FIGS. 6 and 7 both use the soldering device shown in FIG. 5, the jet wave formed on the flow guide plate 10, that is, the flow velocity of the molten solder, is higher than that of the soldering device shown in FIG. Since it is also fast, the action associated therewith is further enhanced.

Therefore, the amount of heat input to the soldered work 3 when the soldered work 3 is brought into contact with the jet wave can be further increased, and the soldered work 3 can be transported at a higher speed. A sufficient amount of heat input to the attachment work 3 can be secured, and good wettability can be obtained. Further, even if the lead-free solder, which has a relatively poor wettability, is used, a better wettability can be obtained.

As described above, in the embodiments shown in FIGS. 6 and 7, the jet flow velocity is higher, so that the dynamic pressure of the jet flow is higher and the molten solder is more reliably applied to the fine soldered portion. It can be introduced and supplied, so that no bridging failure will occur. Furthermore, since the wave jet is used as in the soldering method shown in FIG. 3, a sufficient amount of molten solder is supplied to the soldered portion of the soldered work 3 to form a good fillet shape, It is possible to obtain a stable fillet shape.

If the flow rate of the molten solder sent from the pumping device 1 such as a pump to the blower port 4 is increased (for example, the rotational speed of the pump is increased to increase the flow rate), the flow velocity of the jet wave, that is, the flow wave The flow velocity of the molten solder flowing through the guide plate 10 is further increased. However, if the flow velocity is extremely increased, a large turbulent flow is likely to occur when the jet wave and the workpiece 3 to be soldered come into contact with each other, and a solder ball or the like is generated. It tends to occur.

In such a case, the height of the jet flow guide plate 14 is adjusted to be slightly lower, and the flow rate of the molten solder overflowing the jet flow guide plate 14 is adjusted to be increased. Even if the flow rate of the molten solder delivered from the device 1 is increased, the flow velocity of the molten solder flowing through the flow guide plate 10 can be prevented from becoming extremely high. The operation of the soldering method shown in FIG.
The flow velocity of the jet wave formed on the flow guide plate 10, that is, the flow velocity of the molten solder is further increased.
The molten solder that overflows 4 flows more rapidly downward, and the detachment angle of the molten solder at the peel back point becomes even larger.

Therefore, even if the conveying speed of the work 3 to be soldered is increased, the heat input to the work 3 to be soldered can be more sufficiently secured, and good solder wettability can be obtained. Therefore, good solder wettability can be obtained even if lead-free solder having relatively poor wettability is used.

Further, since the flow velocity of the jet wave is high, the molten solder can be surely supplied to the fine soldered portion, and the work 3 to be soldered which separates from the jet wave is separated from the split jet portion 7. It becomes possible to disengage at the ridge point P where the flow velocity becomes substantially zero, and the disengagement angle becomes even larger than in the case of the soldering method of FIG. In this way, a sufficient amount of molten solder is supplied to form a good fillet shape, and a bridge defect does not occur.

Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 8 shows still another embodiment of the soldering device. Opposite to the advancing direction of the soldered work 3 and the outer wall 8 which is the wall portion on the advancing direction side of the soldered work 3 of the jet guide 2 for injecting the molten solder obliquely upward in the direction opposite to the advancing direction of the soldered work 3. The inner wall 9, which is the wall on the direction side, is formed by an arcuate member that is convex in the traveling direction of the workpiece 3 to be soldered. The center point O1 of the arc of the arc-shaped inner wall 9 of the jet guide 2
And the center point O2 of the arc of the arc-shaped outer wall 8 does not match and is at a different position, and thus the center points O1 and O2 of the arc-shaped inner wall 9 and the arc-shaped outer wall 8 are different from each other.
The molten solder sent from the pressure-feeding device 1 is configured to gradually reduce its cross-sectional area in the jet guide 2 toward the blowing port 4. Further, the upper end portion of the outer wall 8 is positioned substantially vertically above the outermost portion of the inner wall 9 of the jet flow guide 2 (that is, as shown in FIG. 8, the outermost portion of the inner wall 9 of the jet flow guide 2 is placed on the outermost side). The upper end portion of the outer wall 8 is located on the vertical line Q passing through the point). Further, a flow guide plate 10 is formed on the blower port 4 and extends from the upper end portion of the inner wall 9 in a direction opposite to the traveling direction of the workpiece 3 to be soldered.
The flow guide plate 10 is formed such that the vertical cross-sectional shape in a direction parallel to the traveling direction of the workpiece 3 to be soldered is a mountain shape or a continuous mountain shape in which two or more mountains are continuous. Further, the work 3 to be soldered is conveyed by the conveyor 23 at an elevation angle θ.

In the present embodiment, however, the molten solder pressure-fed to the jet guide 2 by the pressure feeding device 1 such as a pump is guided by the jet guide 2 and gradually expands from the horn-shaped blow-out port 4 to a plate. The molten solder is sprayed upward in the direction opposite to the advancing direction of the work 3 to be soldered, and the molten solder diffuses in a mountain shape and jets onto the horn-shaped blower opening 4 by the same action as described in each of the above-described embodiments. The diffusion jet part 5 is formed, and the wave-like jet part 6 is formed by waves generated when molten solder flows and spreads from the mountain-shaped diffusion jet part 5.

Here, the center points O1 and O2 of the arc-shaped inner wall 9 and the arc-shaped outer wall 8 are made different from each other, and the molten solder sent from the pressure feeding device 1 is gradually moved toward the blower port 4 in the jet guide 2. Since the cross-sectional area is reduced, the molten solder jetted from the blower port 4 can be formed on the flow guide plate 10 as a wave flow having a large flow rate and a high flow velocity in substantially the same direction. The load of can be reduced.
Further, since the upper end portion of the outer wall 8 is located substantially vertically above the outermost portion of the inner wall 9 of the jet flow guide 2, the upper end of the outer wall 8 is melted obliquely upward and upward with respect to the traveling direction of the work 3 to be soldered. Correcting the trajectory of the molten solder jet in the vertical direction, which is intended to cancel the jet of solder, at the upper end of the outer wall 8 so that the jet of molten solder is concentrated obliquely upward and upward with respect to the traveling direction of the workpiece 3 to be soldered. As a result, the molten solder can be ejected in substantially the same direction with a large flow rate and a high flow rate, and also in this respect, a jet flow with a large flow rate and a high flow rate can be formed.

Here, the radius of the arc-shaped outer wall 8 of the jet guide 2 is 1.3 to 2.0 of the radius of the arc-shaped inner wall 9.
Configure to double. As described above, the radius of the arc-shaped outer wall 8 of the jet flow guide 2 is 1.3 to 2.0 times the radius of the arc-shaped inner wall 9, so that the jet guide 2 flows on the flow guide plate 10. The flow rate of the molten solder is large, the thickness of the jet flow is large, and a jet wave with a high flow velocity can be formed.

The outer wall 8 has an arc-shaped inner wall 9
If the radius exceeds 2.0 times, the cross-sectional area of the jet guide 2 in the direction of the flow of the molten solder will suddenly decrease, and the flow rate of the molten solder jetted from the blower port 4 will be further increased. The thickness of the molten solder on 10 becomes thin, it becomes difficult to solder to the work 3 to be soldered such as a thick printed wiring board, and sufficient soldering time cannot be obtained, which is not preferable.

Further, the inner wall 9 in which the radius of the outer wall 8 is arcuate
When the radius is less than 1.3 times the radius of the molten solder, the cross-sectional area of the molten solder in the jet guide 2 in the flow direction is 1.3 to 2.
The flow velocity of the molten solder jetted from the blower opening 4 becomes gentler as compared with 0 times, and therefore the blower opening 4
The jetting height of the jet of molten solder from the lower part becomes lower, and the thickness of the molten solder on the flow guide plate 10 becomes thinner, so that it is difficult to solder to the work 3 to be soldered such as a thick printed wiring board. In addition, since the flow velocity is low, the amount of heat input to the soldered portion is small, which is not preferable.

Next, another embodiment of the soldering apparatus will be described with reference to FIG. In this embodiment, a jet guide plate 14 that is rotatable by a shaft 16 is provided on the outer wall 8 of the jet guide 2, and the jet guide plate 14 is soldered on the basis of a vertical line M passing through the shaft 16. It is configured such that the angle can be changed in a direction that is inclined obliquely upward and opposite to the traveling direction of the attachment work 3. That is, in the present embodiment, the jet guide plate 14 can be adjusted so as to be inclined at an arbitrary angle in a direction that is obliquely upward and opposite to the traveling direction of the work 3 to be soldered, with reference to the vertical line M passing through the shaft 16. Therefore, by adjusting this angle, the jet wave of the molten solder jetted along the jet flow guide plate 14 can be brought into contact with the workpiece 3 to be soldered at an arbitrary angle. The angle of the detachment point between the attachment work 3 and the jet wave can be adjusted. That is, when the angle is increased in a direction that is obliquely upward and opposite to the traveling direction of the work 3 to be soldered on the basis of the vertical line M passing through the axis 16, the work 3 to be soldered and the jet wave of the molten solder are separated from each other at the separation point. The flow velocity in the direction opposite to the traveling direction of the soldering work 3 becomes faster, and the occurrence of fine bridging defects in the soldering portion is eliminated. Further, when the angle is reduced in a direction inclining upward and obliquely to the traveling direction of the work 3 to be soldered with reference to the vertical line M passing through the axis 16, at the point of separation between the work 3 to be soldered and the jet wave of the molten solder, The downward component of the jet wave becomes small (that is, the pressing force of the jet wave against the soldering work 3 becomes large, and the component that the molten solder is peeled downward from the work 3 to be soldered becomes small) Solder can be supplied to the work 3 to be soldered, and a good fillet shape with thick solder can be formed. It can also be used for lead-free solder, which has relatively poor wettability. Further, the vertical line M passing through the shaft 16 is used as a reference to form an angle in a direction that is obliquely upward and opposite to the traveling direction of the work 3 to be soldered, so that the separation point between the work 3 to be soldered and the jet wave of the molten solder is determined. The flow velocity is high and the flow rate is large, and as a result, internal defects in the solder fillet can be prevented. Further, with respect to the vertical line M passing through the shaft 16, the work 3 to be soldered is diagonally upward and upward. The diffusion jet portion 5 (divisional jet portion 7) can be easily formed by forming an angle in the direction inclining to.

Here, the jet guide plate 14 is inclined at an angle of 30. +-. 10.degree. In the direction obliquely upward and opposite to the traveling direction of the work 3 to be soldered with reference to the vertical line M passing through the shaft 16. It is preferable to do. With this angle, the flow velocity in the direction opposite to the advancing direction of the workpiece 3 to be soldered can be increased, and the lower component of the jet wave can be reduced, so that the best soldering can be performed.

Next, still another embodiment of the soldering apparatus of the present invention will be described with reference to FIG. In this embodiment, the portion of the flow guide plate 10 closest to the inner wall 9 has a curved shape that is convex toward the work 3 to be soldered along the flow direction of the molten solder. By doing so, the molten solder jetted along the inner wall 9 of the jet guide 2 is prevented from causing turbulent flow due to a change in angle at the connecting portion (that is, the intersection) of the inner wall 9 and the flow guide plate 10. Therefore, the flow velocity and the flow rate loss can be reduced.

In the soldering apparatus shown in FIG. 10, the flow velocity of the molten solder is high, the flow rate is high, the downward component of the jet wave is small at the point where the work 3 to be soldered and the jet wave are separated, and the turbulent component is suppressed. As a result, sufficient molten solder can be supplied to the part to be soldered to form a good fillet shape with a thick solder, bridge defects can be prevented from occurring, and fillet internal defects can also be prevented from occurring.

Next, still another embodiment of the present invention will be described with reference to FIG. In the present embodiment, the flow guide plate 10 is formed by continuously forming a plurality of guide pieces 10a along the flow direction of the molten solder through the bent portions 10b so as to form a continuous chevron shape. Guide pieces 1 that are adjacent to each other via a shaft that forms a continuous bent portion 10b
The angle formed by 0a is variable so that the magnitude of wave motion can be adjusted.

That is, as shown in FIG. 11, the jet wave of the molten solder flowing on the flow guide plate 10 is adjacent to the guide piece 1.
By changing the angle formed by 0a, it is possible to adjust to a more complicated shape as compared with that of each of the above-described embodiments, and a work 3 to be soldered such as a printed wiring board can be made of molten solder. The amount of heat input to the soldered part of the soldered work 3 when brought into contact with the jet wave can be adjusted. For this reason, the amount of heat input to the work 3 to be soldered can be secured regardless of the transport speed and the transport angle of the work 3 to be soldered, and good wettability is obtained even with lead-free solder, which has a relatively poor wettability. Is what you get. The dynamic pressure and the turbulent flow to the soldered work 3 while the soldered work 3 is in contact with the jet wave can be adjusted, so that the soldered work can be reliably performed regardless of the soldered portion of a fine portion such as a chip component. It is possible to supply the molten solder to and to form a good fillet shape.

In the embodiment shown in FIGS. 8 to 11, the inner wall 9 of the jet guide 2 in the shape of an arc is attached to the nozzle body 2.
Although the example is shown in which the jet guide 2 is integrally connected to the lower tubular portion 22, the arc-shaped inner wall 9 of the jet guide 2 has an arc-like shape that rotates about the shaft 11 as in the example shown in FIGS. It may be configured by the drum 12. In addition, in the embodiment shown in FIGS. 8, 10 and 11, an example in which the arc-shaped jet guide plate 14 is integrally provided on the upper portion of the arc-shaped outer wall 8 is shown. Also in FIG. 11, the jet flow guide plate 14 may be attached separately from the outer wall 8 along the arcuate direction of the arcuate outer wall 8 so that the projection amount can be adjusted. Although the outer wall 8 is integrally connected to the lower tubular portion 22 in the embodiments shown in FIGS. 8 to 11, the outer wall 8 and the lower tubular portion 22 are shown as separate bodies in FIGS. 1 and 4. Similar to the example, it may be adjustable in the arrow C direction.

[0090]

As described above, in the invention according to claim 1 of the present invention, the molten solder is directed from the jet guide to the horn-shaped blower port in the diagonally upper direction opposite to the traveling direction of the plate-shaped soldered work. A diffusive jet part is formed on the horn-shaped nozzle where the molten solder diffuses in a mountain shape and jets. A wave generated when the molten solder spreads from the mountain-shaped diffusive jet part causes a mountain-like wave motion. Since a jet part is formed and a plate-shaped work to be soldered is brought into contact with this wave jet part for soldering, the work to be soldered comes into contact with the wave jet part with extremely few turbulent components, and the contact length is also It is possible to increase the contact time by increasing the flow rate of the molten solder jetted from the jet guide. Became faster, It is possible to secure a sufficient contact time even if the work speed of the work to be soldered is increased, and it is also possible to secure a sufficient amount of heat input to the work to be soldered, thus obtaining good solder wettability. Is something that can be done. Moreover, since the flow velocity of the jet wave is high, the dynamic pressure of the jet flow is large, and the molten solder can be surely introduced and supplied to a fine soldered portion, and bridging failure does not occur. Further, since the plate-shaped work to be soldered is brought into contact with the wave jet part to perform soldering, a good fillet shape can be stably formed. As a result, the soldering productivity can be improved, and even if lead-free solder is used, the wettability is good, the fillet shape is good, and bridges do not occur.

According to the invention of claim 2, in addition to the effect of the invention of claim 1, the molten solder is jetted from the jet guide to the blowing port, and the molten solder is piled up on the blowing port. To form a ridged jet part that swells from the top and diverges into a flow from the top toward the opposite side to the traveling direction of the workpiece to be soldered and a flow toward the traveling direction side,
Waves generated when molten solder spreads and spreads from the mountain-shaped split jet section forms a mountain-shaped wave jet section, and a plate-shaped workpiece to be soldered is brought into contact with the split jet section and the wave jet section. Since the soldering is performed by the soldering, the length of contact of the work to be soldered with the molten solder can be lengthened and the contact time can be lengthened, and the direction of travel of the plate-shaped work to be soldered from the jet guide can be increased. Since it is jetted in the diagonally upward direction, the flow velocity of the molten solder jetted from the jet guide becomes faster, and therefore a sufficient contact time can be secured and the soldered workpiece can be secured even if the conveying speed of the workpiece to be soldered is increased. It is possible to secure a sufficient amount of heat input to the work and obtain good solder wettability.
Also, good solder wettability can be obtained even if free solder having relatively poor wettability is used. Further, since the flow velocity of the jet wave is high, the dynamic pressure of the jet flow is large, so that the solder can be surely introduced into the minute soldered portion and supplied, and the work to be soldered that separates from the jet wave can be separated. Since the work piece to be soldered is separated from the ridge jet part, the work to be soldered can be separated at the ridge point where the flow velocity of the ridge jet part is almost zero, and the work piece to be soldered is detached at the time of separation. The amount of solder dropped from the soldering part is reduced, and a sufficient amount of molten solder can be supplied to the soldered part. As a result, the soldering productivity can be improved, and even if lead-free solder is used, the wettability is good, the fillet size is large, and the solder thickness is large and the connection strength is large. It is possible to perform soldering that does not occur, and it is particularly suitable for manufacturing a printed wiring board having a high soldering quality and high connection strength by soldering.

Further, in the present invention as defined in claim 3, the jet guide has a horn-shaped outlet for jetting the molten solder in a diagonally upward direction opposite to the traveling direction of the workpiece to be soldered. An outer wall, which is a wall portion on the traveling direction side of the workpiece to be soldered, and an inner wall, which is a wall portion on the opposite side to the traveling direction of the soldered work, of the jet guide for ejecting upward and obliquely upward of the traveling direction of the soldering work. Are each formed by an arcuate member that is convex in the traveling direction of the workpiece to be soldered, and flow guides that are continuous from the upper end of the inner wall to the direction opposite to the traveling direction of the workpiece to be soldered. A plate is formed, and the flow guide plate is formed in a mountain-shaped vertical cross-sectional shape in a direction parallel to the traveling direction of the workpiece to be soldered or a continuous mountain-shaped shape in which two or more mountains are continuous. Waves with a device of various configurations It is possible to form a jet wave, and moreover, a wave jet wave of molten solder is raised at the top of the mountain shape of the guide plate to form a wave jet wave of the guide plate. By contacting the work to be soldered with the jet wave rising at the top of the chevron, the contact length (that is, contact time) to the work to be soldered
Is something that can be lengthened. Moreover, the outer wall, which is a wall portion of the jet guide on the traveling direction side of the work piece to be soldered, and the inner wall, which is a wall portion on the side opposite to the traveling direction of the work piece to be soldered, are respectively projected in the traveling direction of the work piece to be soldered. Since it is composed of a curved arc-shaped member, the structure should be such that the flow rate of the molten solder jetted from the jet guide is increased by spraying the molten solder diagonally upward and opposite to the traveling direction of the workpiece to be soldered with a simple structure. Is something that can be done.

In addition to the effect of the invention described in claim 3, in the invention described in claim 4, in addition to the effect of the invention described in claim 3, an arc-shaped drum whose rotation can be adjusted about a shaft, and which faces the drum surface. Forming a nozzle-shaped jet guide with the arc-shaped member provided in the same manner, and guiding the jet flow of the molten solder in the arc direction at the edge of the blow-out port of the arc-shaped member provided facing the drum surface. Since the plate is provided so that the amount of protrusion can be adjusted, the flow rate of the molten solder can be adjusted with a simple configuration in which the drum is rotated and the amount of protrusion of the jet guide plate is adjusted.

According to the invention of claim 5, in addition to the effect of the invention of claim 4, in addition to the mountain-shaped portion of the flow guide plate closest to the blower port from the center position of the blower port. The length to the apex, the length between the apices of each adjacent chevron-shaped portion, and the distance from the crest of the chevron-shaped portion closest to the downstream end of the molten solder to the downstream end are approximately the same length. In addition, the interval of the air outlets is 1/3 or less to 1/6 of the length.
Since the intervals are set as described above, it is possible to make the wave-like jet portion mountain-shaped portion to be located at the mountain-shaped top portion of the flow guide plate with the molten solder jetted from the blower opening with a simple structure, and to ensure the jet wave. The wave can be easily generated to further enhance the soldering effect by the wave jet.

In addition to the effect of the invention described in claim 3, in the invention described in claim 6, the inner wall and the outer wall of the jet guide are formed in an arcuate shape having different points as central points. Since the upper end portion of the outer wall is located substantially vertically above the outermost portion of the inner wall of the jet guide part, the molten solder sent from the pressure feeding device is directed toward the blower inside the jet guide. The cross-sectional area can be gradually reduced, and the molten solder jetted from the outlet can be jetted in a substantially uniform direction with a large flow rate and a high flow velocity, and the outermost portion of the inner wall of the jet guide part can be ejected. Since the upper end of the outer wall is located at a substantially vertical upper position, the jet flow of the molten solder in the vertical direction that attempts to cancel the jet flow of the molten solder in an obliquely upward direction opposite to the traveling direction of the work to be soldered is applied to the outer wall. Correct the trajectory at the upper end and melt The jet of field and can be aggregated to reverse obliquely upward with respect to the traveling direction of the soldering work, but capable of ejecting even a molten solder at a rate much faster flow rate substantially the same direction.

According to the invention of claim 7, in addition to the effect of the invention of claim 6, the radius of the arc-shaped outer wall of the jet guide is smaller than the radius of the arc-shaped inner wall of 1.
Since it is set to 3 to 2.0 times, the flow rate of the molten solder flowing to the flow guide plate side is large, the thickness of the jet flow is thick, and a jet wave with a high flow velocity can be formed with a simple configuration.

According to the invention of claim 8, in addition to the effect of the invention of claim 6, a jet guide plate rotatable by an axis is provided on an upper portion of the outer wall of the jet guide. Since the angle of the jet guide plate is variable with respect to the vertical line passing through the axis and in the direction diagonally upward and opposite to the traveling direction of the work to be soldered, the angle of the separation point between the work to be soldered and the jet wave is It is something that can be adjusted, and when the angle is increased in the direction that tilts upward diagonally opposite to the traveling direction of the work to be soldered with respect to the vertical line passing through the axis, at the separation point between the work to be soldered and the jet wave of molten solder, The flow velocity in the direction opposite to the advancing direction of the work to be soldered becomes faster, eliminating the occurrence of bridging defects in the fine soldering part. Tilt upwards When the angle is made smaller in the direction, the lower component of the jet wave becomes smaller at the separation point between the soldered work and the jet wave of the molten solder, and the molten solder can be reliably supplied to the soldered work. Further, by making an angle in a direction obliquely upward and opposite to the traveling direction of the work to be soldered with reference to a vertical line passing through the axis, the flow velocity at the separation point between the work to be soldered and the jet wave of the molten solder is high, The flow rate also increases.

According to the invention of claim 9, in addition to the effect of the invention of claim 8, the advancing direction of the work to be soldered is based on the vertical line through which the jet guide plate passes through the axis. Since it is inclined at an angle of 30 ± 10 ° in the direction diagonally upward and obliquely upward, the flow velocity in the direction opposite to the traveling direction of the workpiece to be soldered can be increased, and the lower component of the jet wave can be reduced, and the wave jet flow can be reduced. The effect of can be further enhanced.

According to the tenth aspect of the invention,
In addition to the effect of the invention according to claim 6, since the portion closest to the inner wall of the flow guide plate has a curved shape that is convex toward the workpiece to be soldered along the flow direction of the molten solder, The molten solder jetted along the inner wall of the jet guide,
It is possible to suppress the occurrence of turbulence due to an angle change in the connecting portion of the inner wall and the flow guide plate, reduce the loss of flow velocity and flow rate, improve the solder wettability and the shape of the solder fillet, and reduce the occurrence of bridging defects. This has the effect of reducing defects inside the solder fillet.

Further, in the invention according to claim 11,
In addition to the effect of the invention according to claim 6, the flow guide plate has a plurality of guide pieces that are continuous along the flow direction of the molten solder so as to form a continuous chevron shape through bent portions, and the guide pieces are connected to each other. Since the angle formed by the adjacent guide pieces can be freely changed via the continuous bent portion, the wave jet can be formed in a complicated shape by changing the wave jet depending on the size of the angle formed by the adjacent guide pieces. The size of the wave jet can be adjusted with a simple structure, the amount of heat input can be secured regardless of the transfer speed, transfer angle, and thickness of the workpiece to be soldered, and it is also suitable for lead-free solder, which has relatively poor wettability. The wettability can be obtained.

[Brief description of drawings]

FIG. 1 is a schematic side sectional view of an embodiment of a soldering device of the present invention.

FIG. 2 is a partially cutaway perspective view of the above-described blowout port portion.

FIG. 3 is a schematic side sectional view showing an embodiment of a soldering method using the above soldering device.

FIG. 4 is a schematic side sectional view showing another embodiment of a soldering method using the above soldering device.

FIG. 5 is a schematic side sectional view showing another embodiment of the soldering device of the present invention.

FIG. 6 is an explanatory view showing the wavelength of the jet wave of the above.

7 is a schematic side sectional view showing an example in which the drum is rotationally adjusted in the soldering device of FIG.

FIG. 8 is a schematic side sectional view showing still another embodiment of the soldering device of the present invention.

FIG. 9 is a schematic side sectional view showing still another embodiment of the soldering device of the present invention.

FIG. 10 is a schematic side sectional view showing still another embodiment of the soldering device of the present invention.

FIG. 11 is a schematic side sectional view showing still another embodiment of the soldering device of the present invention.

[Explanation of symbols]

1 pumping device 2 Jet guide 3 Work to be soldered 4 mouth 5 Diffusion jet part 6 Wave jet part 7 minutes ridge jet section 8 outer wall 9 inner wall 10 Flow guide plate 10a guide piece 11 axes 12 drums 13 Arc-shaped member 14 Jet flow guide plate 15 top 16 axes

Continued front page    (72) Inventor Akinori Kai             2 27-1 Shimomaruko, Ota-ku, Tokyo Japan             Electric Heat Meter Co., Ltd. (72) Inventor Shuichi Kuroi             1048, Kadoma, Kadoma-shi, Osaka Matsushita Electric Works             Within the corporation (72) Inventor Keisuke Yuki             1048, Kadoma, Kadoma-shi, Osaka Matsushita Electric Works             Within the corporation (72) Inventor Takao Miyai             1048, Kadoma, Kadoma-shi, Osaka Matsushita Electric Works             Within the corporation F-term (reference) 4E080 AA01 AB03 CA02 CB03                 5E319 AA03 AC01 CC24 GG05 GG15

Claims (11)

[Claims] 1. A molten solder ejected from a jet guide during soldering, in which molten solder is pressure-fed to a jet guide by a pressure feeding device, and a molten solder portion ejected from this jet guide is passed through a plate-shaped workpiece to be soldered. This is a jet-type soldering method in which solder is jetted diagonally upward and opposite to the traveling direction of the work piece to be soldered so that the work piece to be soldered comes into contact, and molten solder is applied from a jet flow guide to a horn-shaped outlet. A diffusing jet portion is formed on the horn-shaped blowout port, in which molten solder diffuses into a mountain shape and jets, and a wave shape generated when the molten solder spreads from the mountain-shaped diffusing jet portion forms a mountain shape. A soldering method characterized in that a wave jet portion is formed, and a plate-shaped workpiece to be soldered is brought into contact with the wave jet portion to perform soldering. 2. The molten solder is jetted from the jet guide to the blowing port, and the molten solder rises in a mountain shape on the blowing port and flows from the top toward the opposite side to the traveling direction of the workpiece to be soldered. Forming a ridged jet part that splits into a divergent flow and a ridged wave jet part formed by the waves generated when molten solder spreads from the ridged jet part. The soldering method according to claim 1, wherein a soldering work is carried out by bringing a plate-shaped soldered work into contact with the split jet portion and the wave jet portion. 3. The molten solder ejected from the jet guide when the molten solder is pressure-fed to the guide by the pressure feeding device, the plate-shaped work to be soldered is passed through the molten solder portion ejected from the jet guide, and soldering is performed. Is a jet-type soldering device in which a plate-shaped soldered workpiece is sprayed upward and diagonally upward to bring the workpiece to be soldered into contact with the soldered workpiece. The outlet of the jet guide for jetting upward has a horn shape, and the wall of the jet guide for jetting this molten solder diagonally upward and opposite to the advancing direction of the workpiece to be soldered is on the side of the advancing direction of the workpiece to be soldered. An outer wall and an inner wall, which is a wall portion on the side opposite to the traveling direction of the work to be soldered, are formed by arc-shaped members that are convex in the traveling direction of the work to be soldered, A guide plate for flow is formed continuously from the upper end of the inner wall in the direction opposite to the traveling direction of the work to be soldered, and the flow guide plate is longitudinally cut in a direction parallel to the traveling direction of the work to be soldered. A soldering device, wherein the surface shape is a mountain shape or a continuous mountain shape in which two or more mountains are continuous. 4. A nozzle-shaped jet guide is formed by an arcuate drum whose rotation can be adjusted about an axis and an arcuate member provided so as to face the drum surface, and which opposes the drum surface. 4. The soldering apparatus according to claim 3, wherein a guide plate for a jet flow of the molten solder, which projects in the arc direction, is provided at the edge of the blowout port of the arc-shaped member provided in such a manner that the projection amount can be adjusted. 5. The length from the center position of the blowout port to the top of the chevron-shaped portion closest to the blowout port of the flow guide plate, the length between the crests of adjacent chevron-shaped portions, and the downstream side of the molten solder. The distance from the top of the mountain-shaped portion closest to the end to the end on the downstream side is set to be substantially the same, and the distance between the blow ports is set to 1/3 or less to 1/6 or more of the length. The soldering device according to claim 4, wherein the soldering device is formed of: 6. The jet guide has an inner wall and an outer wall formed in an arc shape having different points as central points, and the upper end of the outer wall is located substantially vertically above the outermost portion of the inner wall of the jet guide. 4. The soldering device according to claim 3, wherein 7. The soldering apparatus according to claim 6, wherein the radius of the arc-shaped outer wall of the jet flow guide is 1.3 to 2.0 times the radius of the arc-shaped inner wall. 8. A jet flow guide plate is provided on an upper portion of an outer wall of the jet flow guide so as to be rotatable by a shaft, and the jet flow guide plate is diagonally opposite to a traveling direction of a workpiece to be soldered with reference to a vertical line passing through the shaft. 7. The soldering device according to claim 6, wherein the angle is variable in the direction of tilting upward. 9. The jet guide plate is inclined at an angle of 30 ± 10 ° with respect to a vertical line passing through an axis in a direction inclined obliquely upward and opposite to the traveling direction of the workpiece to be soldered. Item 8. The soldering device according to item 8. 10. The method according to claim 6, wherein a portion closest to the inner wall of the flow guide plate has a curved shape which is convex toward the workpiece to be soldered along the flow direction of the molten solder. Soldering device. 11. A flow guide plate is formed by connecting a plurality of guide pieces to each other along a flow direction of the molten solder so as to form a continuous chevron shape through a bent portion, and connecting the guide pieces to each other through a bent portion that is continuous. 7. The soldering device according to claim 6, wherein the angle formed between the adjacent guide pieces is variable.