JP2003017830A - Wiring circuit board manufacturing and checking method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide methods of manufacturing and checking a wiring circuit board provided with wiring patterns which can be checked easily, even if the wiring patterns are arranged at a narrow pitch. SOLUTION: A wiring etching resist pattern 30 is formed on a metal foil 2, and checking etching resist patterns 31 are formed adjacent to the wiring etching resist pattern 30. The inspecting etching resist patterns 31 are each formed of a pair of inspecting resist patterns 31a and 31b. A inspecting pattern, which is etched through the intermediary of the checking resist patterns 31a and 31b, is observed visually through an optical microscope, it is determined whether or not space between the checking patterns is within an proper range, and it is inspected as to whether the wiring pattern 20 of a product is properly etched.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed circuit board and a method for inspecting the same.

[0002]

2. Description of the Related Art A printed circuit board such as a printed wiring board is used in various electric or electronic devices. The printed wiring board should be placed on an insulating substrate such as insulating plastic.
A conductor pattern made of a metal foil such as copper is formed. Such printed wiring boards are classified into flexible wiring boards and rigid wiring boards depending on the material used for the insulating board. In the flexible wiring board, the insulating substrate is made of a highly flexible material such as polyimide resin. On the other hand, in the rigid wiring board, the insulating board is made of a material having high hardness such as glass and epoxy resin.

In the manufacturing process of such a printed circuit board, first, a metal foil is laminated on an insulating substrate, an etching resist pattern having a predetermined shape is formed on the metal foil, and then the metal foil is chemically etched. Thus, a wiring pattern having a predetermined shape is formed.

FIG. 7 is a sectional view showing etching of a wiring pattern using an etching resist pattern.

As shown in FIG. 7, in the chemical etching, the etching liquid is the etching resist pattern 33.
An undercut phenomenon occurs in which the wiring pattern 35 is etched to reach the back side of the wiring pattern 35 and is etched. Due to this undercut phenomenon, the wiring top width w0 of the wiring pattern 35 becomes slightly smaller than the width w of the etching resist pattern, and the wiring top width w0 of the wiring pattern 35 becomes smaller.
Is not the same as the width w of the etching resist pattern 33.

Therefore, in the manufacturing process of such a printed circuit board, it is necessary to inspect whether or not the wiring top width w0 is formed as designed. This inspection can be performed by measuring the surface of the printed circuit board using a surface roughness meter. However, measuring all the printed circuit boards with a surface roughness meter during the manufacturing process is extremely inefficient, such as taking too much time.
Visual inspection was performed using an optical microscope.

[0007]

However, in the visual inspection using the optical microscope, the pitch p of the wiring pattern 35 (the total value of the wiring top width w0 and the space width s) is about 100 μm, and the wiring top width w0. Is about 50 μm, the limit is ± 5 μm.
It is impossible to inspect thinner wiring patterns in the production line.

On the other hand, in recent years, the pitch of the wiring patterns on the printed circuit board has become smaller along with the miniaturization and high integration of electric or electronic devices.
In particular, when the pitch of the wiring pattern is a fine pitch of 75 μm or less (fine pitch), the wiring top width w
There is a need for a method that can easily test 0.

An object of the present invention is to provide a method for manufacturing a wiring circuit board and an inspection method capable of easily inspecting a wiring pattern even if the pitch of the wiring pattern becomes small.

[0010]

According to a first aspect of the present invention, there is provided a method of manufacturing a printed circuit board, comprising: forming an etching resist pattern for a wiring pattern on a conductor layer laminated on an insulating layer; In a method of manufacturing a wired circuit board, which forms a wiring pattern by etching a layer, at least one inspection etching resist pattern having a predetermined shape for inspecting the width of the wiring pattern near the etching resist pattern for the wiring pattern Is provided, the wiring pattern is formed on the conductor layer by using the etching resist pattern for the wiring pattern, and the inspection pattern is formed on the conductor layer by using the etching resist pattern for inspection.

In the method for manufacturing a wired circuit board according to the present invention, at least one etching resist pattern for inspection is provided in the vicinity of the etching resist pattern for wiring patterns. When the wiring pattern is formed on the conductor layer by using the inspection pattern, the inspection pattern is formed on the conductor layer by using the etching resist pattern for inspection.

Accordingly, the correlation between the size of the predetermined portion of the inspection pattern and the width of the wiring pattern is measured in advance, and the size of the predetermined portion of the inspection pattern formed simultaneously when the wiring pattern is formed is visually measured. Thereby, the wiring pattern can be inspected. Therefore, the wiring pattern can be easily inspected even if the pitch of the wiring pattern becomes small.

Each of the at least one inspection etching resist pattern may include a pair of inspection resist patterns having a predetermined shape.

In this case, the correlation between the distance between the pair of inspection patterns formed by using the pair of inspection resist patterns and the width of the wiring pattern is measured in advance, and the wiring pattern is formed simultaneously when the wiring pattern is formed. By visually measuring the interval between the pair of inspection patterns, the wiring pattern can be inspected accurately and easily even when the pitch of the wiring pattern is small.

The pair of inspection resist patterns may be provided so as to face each other. In this case, the wiring pattern can be inspected more accurately and easily based on the interval between the facing portions of the pair of inspection patterns.

The pair of inspection resist patterns may each have a substantially triangular shape, and the vertexes of the substantially triangular shape may be arranged to face each other.

In this case, the wiring pattern can be inspected more accurately and easily on the basis of the interval between the apexes of the pair of inspection patterns which face each other in a substantially triangular shape.

The correlation between the size of a predetermined portion of the inspection pattern formed by using the etching resist pattern for inspection and the width of the wiring pattern formed by using the etching resist pattern for wiring pattern is measured in advance and the inspection is performed. Of the inspection pattern formed by using the etching resist pattern for inspection is visually measured through an optical microscope, and the wiring pattern formed by using the etching resist pattern for the wiring pattern is inspected based on the correlation. May be.

In this case, the dimensions of a predetermined portion of the inspection pattern formed by using the etching resist pattern for inspection are visually measured through an optical microscope, and the dimensions of the predetermined portion of the inspection pattern and the width of the wiring pattern which are measured in advance are measured. The wiring pattern can be inspected based on the correlation with. Thereby, the wiring pattern can be inspected accurately and easily.

A correlation between a predetermined portion interval between a pair of inspection patterns formed by using a pair of inspection resist patterns and a width of a wiring pattern formed by using an etching resist pattern for a wiring pattern is shown. Measured in advance, 1
Formed using the etching resist pattern for the wiring pattern based on the correlation by visually measuring the interval of a predetermined portion between the pair of inspection patterns formed by using the etching resist pattern for the pair inspection The formed wiring pattern may be inspected.

In this case, the distance between the pair of inspection patterns formed by using the pair of inspection resist patterns is visually measured through an optical microscope, and the previously measured distance between the pair of inspection patterns and wiring are measured. The wiring pattern can be inspected based on the correlation with the width of the pattern. Thereby, the wiring pattern can be inspected accurately and easily.

The width of the etching resist pattern for the wiring pattern may be 60 μm or less.

In this case, a fine wiring pattern is formed using the etching resist pattern for the wiring pattern. Since the inspection pattern is formed at the same time as the fine wiring pattern, the fine wiring pattern can be accurately and easily inspected by the inspection pattern.

A method of inspecting a printed circuit board according to a second aspect of the present invention is a method of inspecting a printed circuit board in which a wiring pattern is formed by etching a conductor layer laminated on an insulating layer using an etching resist pattern for a wiring pattern. An inspection method, in which at least one inspection etching resist pattern having a predetermined shape is provided in the vicinity of the wiring pattern etching resist pattern, and the wiring pattern is formed on the conductor layer using the wiring pattern etching resist pattern. , Forming an inspection pattern on a conductor layer using an etching resist pattern for inspection, visually measuring the dimensions of a predetermined portion of the inspection pattern through an optical microscope, and measuring the dimensions of the predetermined portion of the inspection pattern and the wiring pattern Etching resist for wiring pattern based on correlation with width It is intended to inspect a wiring pattern formed using the pattern.

In the method for inspecting a wired circuit board according to the present invention, since at least one etching resist pattern for inspection is provided in the vicinity of the etching resist pattern for wiring pattern, the etching resist pattern for wiring pattern is used. When the wiring pattern is formed on the conductor layer by using the inspection pattern, the inspection pattern is formed on the conductor layer by using the etching resist pattern for inspection.

Thus, the correlation between the size of the predetermined portion of the inspection pattern and the width of the wiring pattern is measured in advance, and the size of the predetermined portion of the inspection pattern formed simultaneously with the formation of the wiring pattern is visually measured. Thereby, the wiring pattern can be inspected. Therefore, the wiring pattern can be easily inspected even if the pitch of the wiring pattern becomes small.

[0027]

1 (a) to 1 (e) are process sectional views showing a method of manufacturing a printed circuit board according to an embodiment of the present invention. FIG. 2 is a schematic plan view of an etching resist pattern in the manufacturing method of FIG.

First, as shown in FIG. 1A, the metal foil 2 is laminated on the insulating substrate 1. In this case, the metal foil 2 may be attached to the insulating substrate 1 with an adhesive, the metal foil 2 may be formed on the insulating substrate 1 by metal plating, or a plastic solution may be applied and dried on the metal foil 2. By doing so, the insulating substrate 1 may be formed. After that, the metal foil 2 is half-etched to be a thin layer.

The material of the insulating substrate 1 is polyimide,
Plastics such as polyamic acid, polyester and polyethylene naphthalate are used. In particular, it is preferable to use polyimide having excellent heat resistance.

As the metal foil 2, copper, nickel, stainless steel, aluminum, or an alloy of two or more of these metals is used. In particular, it is preferable to use copper or a copper alloy that is excellent in flexibility, workability, electrical characteristics and cost. The metal foil 2 preferably has a thickness of 9 to 18 μm.

Next, as shown in FIG. 1B, the metal foil 2
Photoresist 3 is stuck on top. As the photoresist 3, for example, a dry film photoresist containing an acrylic copolymer having a carboxyl group as a main component and containing a polyfunctional (meth) acrylate monomer, a photopolymerization initiator and the like is used. The thickness of the photoresist 3 is 6 to 1
It is preferably 5 μm.

Thereafter, as shown in FIG. 1C, the photoresist 3 is exposed through a photomask and developed to develop a wiring etching resist pattern 30 having a shape corresponding to a wiring pattern to be a product, and An etching resist pattern 31 for inspection having a shape corresponding to the inspection pattern is formed.

As shown in FIG. 2, a wiring etching resist pattern 30 is formed on the metal foil 2, and a plurality of inspection etching resist patterns 31 are formed in the vicinity of the wiring etching resist pattern 30. Although schematically shown in FIG. 2, the actual wiring etching resist pattern 30 has a fine pattern shape corresponding to the wiring pattern to be a product.

Etching resist pattern 31 for inspection
As will be described later, is used to inspect whether or not the wiring pattern formed by using the wiring etching resist pattern 30 is properly etched.
The inspection etching resist pattern 31 is composed of a pair of inspection resist patterns 31a and 31b.

It is sufficient that at least one inspection etching resist pattern 31 is formed on the wiring etching resist pattern 30 of one product, but a plurality of inspections are performed on the wiring etching resist pattern 30 of one product. It is preferable that the etching resist pattern 31 is formed.

Next, as shown in FIG. 1D, the metal foil 2
The exposed portion is chemically etched with an etching solution such as an aqueous solution of ferric chloride (FeCl ₃ ). As a result, the wiring pattern 20 is formed under the wiring etching resist pattern 30, and the inspection pattern 21 is formed under the inspection etching resist pattern 31.

The wiring pitch of the wiring pattern 21 is 40 to 8
The wiring top width is 55 μm or less. In the manufacturing method of the present embodiment, the wiring top width is 10 to 40 μm.
It is particularly effective when the thickness is as thin as m.

As described with reference to FIG. 7, in the chemical etching, an undercut phenomenon occurs in which the etching solution reaches the back side of the etching resist pattern 33 and etches the wiring pattern 35. Due to this undercut phenomenon, the wiring top width w of the wiring pattern 35 is larger than the width w of the etching resist pattern 33.
0 becomes small.

In the present embodiment, the width of the wiring etching resist pattern 30 for forming the wiring pattern 20 is set to a large value of 15 to 50 μm in consideration of this undercut.

Finally, as shown in FIG. 1E, the wiring etching resist pattern 30 and the inspection etching resist pattern 31 are removed by a stripping solution such as an aqueous sodium hydroxide solution.

FIG. 3 is an enlarged view of the inspection etching resist pattern. Here, the shape and dimensions of the inspection etching resist pattern will be described with reference to FIG.

As shown in FIG. 3, the inspection etching resist pattern 31 is composed of a pair of triangular inspection resist patterns 31a and 31b. The pair of inspection resist patterns 31a and 31b are arranged such that one apex of a triangle faces each other. The length of the bottom of each of the inspection resist patterns 31a and 31b is A, the height from the bottom to the apex is B, and the distance between the apexes of the pair of inspection resist patterns 31a and 31b is C.

As will be described later with reference to FIG. 4, the inspection patterns 21a and 21b which are etched through the inspection resist patterns 31a and 31b are visually observed through an optical microscope, and a distance D between the inspection patterns 21a and 21b is predetermined. It is inspected whether the wiring pattern 20 of the product is properly etched by determining whether the wiring pattern 20 is within the appropriate range.

In this case, the distance C between the vertices of the triangles of the pair of inspection resist patterns 31a and 31b is 0 to 10.
It is set to 0 μm. In particular, when C = 0, the production of the inspection resist patterns 31a and 31b becomes easy, which is preferable.

A pair of inspection resist patterns 31a, 3a
The length A of the base of the triangle 1b is 10 to 10,000 μm. Particularly, it is preferable that the length A of the bottom side is 300 to 700 μm. Further, the height B from the base of the triangle to the apex of the pair of inspection resist patterns 31a and 31b is 10 to 10000 μm. Especially, the height B is 3
It is preferable that the thickness is from 00 to 1400 μm. Further, the ratio A / B of the length A of the bottom side to the height B is 0.5 to 50. In particular, the ratio A / B between the length A of the bottom side and the height B is 0.5
It is preferable to set to 2.5.

FIG. 4 is a schematic diagram showing an inspection method using an inspection pattern. As shown in FIG. 4A, a pair of triangular inspection resist patterns 31 a, 31 are formed on the metal foil 2.
b is formed so that one vertex of two triangles face each other.

Here, the inspection resist pattern 31a,
A pair of inspection patterns 2 etched through 31b
Interval D between 1a and 21b and wiring pattern 2 of the product of FIG.
The correlation with the wiring top width of 0 is measured in advance, and the distance D between the pair of inspection patterns 21a and 21b when the desired wiring top width is obtained in the wiring pattern 20 of the product is checked.

In FIG. 4B, since the etching is insufficient, the distance D between the pair of inspection patterns 21a and 21b becomes the same as the distance C between the pair of inspection resist patterns 31a and 31b. Yes (shorter than desired interval). In this case, there is a possibility that the wirings are in contact with each other or short-circuited in the wiring pattern 20 of the product.

In FIG. 4D, the distance D between the pair of inspection patterns 21a and 21b is considerably longer than the distance C between the pair of inspection resist patterns 31a and 31b due to excessive etching. In this case, there is a possibility of poor contact or disconnection in the wiring pattern 20 of the product.

In FIG. 4C, the etching is properly performed and a desired distance D is obtained between the pair of inspection patterns 21a and 21b. In this case, the product wiring pattern 2
Even at 0, the desired size and shape are obtained.

FIG. 5 is a schematic plan view showing another example of the shape of the etching resist pattern for inspection.

In the example of FIG. 5A, the pair of inspection resist patterns 31a and 31b have a diamond shape. The inspection resist patterns 31a and 31b are arranged so that one apex of the rhombus faces each other.

In the example of FIG. 5B, the pair of inspection resist patterns 31a and 31b have a semicircular shape. The inspection resist patterns 31a and 31b are arranged such that semicircular arc-shaped portions face each other.

In the example of FIG. 5C, the pair of inspection resist patterns 31a and 31b have a rectangular shape. The inspection resist patterns 31a and 31b are arranged such that one sides of the rectangles face each other in parallel.

A pair of inspection resist patterns 31 is provided.
A single resist pattern for inspection may be used instead of a and 31b. In that case, the length of a predetermined portion of the inspection pattern formed using a single inspection resist pattern is visually measured through an optical microscope, and the length of the portion is within a predetermined appropriate range. By determining whether or not the wiring pattern 20 is properly etched, it is inspected.

[0056]

Example 1 In Example 1, a polyimide having a thickness of 25 μm was used as the insulating substrate 1, a copper foil having a thickness of 12 μm was used as the metal foil 2, and eight wiring patterns 2 were used.
A printed circuit board having 0 and the inspection pattern 21 was produced.

As design values of the wiring pattern 20, the pitch is 50 μm and the wiring top width is 18 μm.
As the acceptance criteria, the wiring top width of the wiring pattern 20 of the product is set to be within the range of 16 to 20 μm.

Here, the inspection resist patterns 31a and 31b shown in FIG. 3 were used. The length A of the base of each triangle of the inspection resist patterns 31a and 31b is 500.
The height B from the bottom to the apex was 1000 μm, and the interval C between the apexes of the pair of inspection resist patterns 31a and 31b was 0 μm.

First, a pair of inspection resist patterns 31.
a pair of inspection patterns 21 formed by a and 31b
The correlation between the distance D between a and 21b and the wiring top width of the wiring pattern 20 of the product was examined to create a calibration curve.

FIG. 6 is a diagram showing a calibration curve of the correlation between the distance D between the inspection patterns and the wiring top width of the wiring pattern of the product.

The values actually measured are plotted in FIG. 6 by the mark "□", and based on this, D = -10.849w0 + 3
The calibration curve 1 was 49.56. The calibration curve 1 is shown by a solid line in FIG.

From the calibration curve 1 in FIG. 6, a pair of inspection patterns 2
When the distance D between 1a and 21b is 135 to 170 μm, the wiring top width w0 of the wiring pattern 20 of the product is 1
It falls within the range of 6 to 20 μm. The distance D between the pair of inspection patterns 21a and 21b after etching was visually measured through an optical microscope, and a wiring circuit board having a distance D of 135 to 170 μm was regarded as a passing product.

After the etching, the wiring top width w0 of the wiring pattern 20 of the acceptable product is verified by using a surface roughness meter for verification.
Was measured and found to be in the range of 16 to 20 μm.

Example 2 In Example 2, a calibration curve was prepared in the same manner as in Example 1 except that the distance C between the vertices of the pair of inspection resist patterns 31a and 31b was 20 μm. did.

The values actually measured are plotted in FIG. 6 by the mark "⋄", and based on this, D = -11.327w0 + 3
The calibration curve 2 was 79.75. The calibration curve 2 is shown by a broken line in FIG.

From the calibration curve 2 in FIG. 6, a pair of inspection patterns 2
When the distance D between 1a and 21b is 155 to 195 μm, the wiring top width w0 of the wiring pattern 20 of the product is 1
It falls within the range of 6 to 20 μm. The distance D between the pair of inspection patterns 21a and 21b after etching was visually measured through an optical microscope, and a wiring circuit board having a distance D of 155 to 195 μm was regarded as a passing product.

After the etching, for verification, the wiring top width w0 of the wiring pattern 20 of the acceptable product is verified by using a surface roughness meter.
Was measured and found to be in the range of 16 to 20 μm.

(Example 3) In Example 3, a calibration curve was prepared in the same manner as in Example 1 except that the distance C between the vertices of the pair of inspection resist patterns 31a and 31b was set to 50 μm. did.

The values actually measured are plotted in FIG. 6 by the mark “◯”, and based on this, D = −9.3211w0 + 3
Calibration curve 3 was 73.66. The calibration curve 3 is shown by a broken line in FIG.

From the calibration curve 3 in FIG. 6, a pair of inspection patterns 2
When the distance D between 1a and 21b is 190 to 220 μm, the wiring top width w0 of the wiring pattern 20 of the product is 1
It falls within the range of 6 to 20 μm. The distance D between the pair of inspection patterns 21a and 21b after etching was visually measured through an optical microscope, and the wired circuit board having the distance D of 190 to 220 μm was regarded as an acceptable product.

After the etching, the wiring top width w0 of the wiring pattern 20 of the acceptable product is verified by using a surface roughness meter for verification.
Was measured and found to be in the range of 16 to 20 μm.

[Brief description of drawings]

FIG. 1 is a process cross-sectional view showing a method of manufacturing a printed circuit board according to an embodiment of the present invention.

FIG. 2 is a schematic plan view of an etching resist pattern in the manufacturing method of FIG.

FIG. 3 is an enlarged view of an inspection etching resist pattern.

FIG. 4 is a schematic diagram showing an inspection method using an inspection pattern.

FIG. 5 is a plan view showing another example of the shape of the etching resist pattern for inspection.

FIG. 6 is a diagram showing a calibration curve of a correlation between an interval between inspection patterns and a wiring top width of a wiring pattern of a product.

FIG. 7 is a cross-sectional view showing etching of a metal foil using an etching resist pattern.

[Explanation of symbols]

1 Insulation board 2 metal foil 3 photoresist 20 wiring patterns 21,21a, 21b Inspection pattern 30 Etching resist pattern for wiring 31 Etching resist pattern for inspection 31a, 31b Inspection resist pattern

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05K 3/00 G01B 11/24 F // G01R 31/28 G01R 31/28 UF term (reference) 2F065 AA03 AA07 AA56 BB01 BB02 CC01 JJ12 2G051 AA65 AB20 AC22 CA11 2G132 AA00 AA20 AC03 AD15 AK04 AL10 5E338 DD13 DD32 EE31 EE44 5E339 AB02 BE13 CE01 CE02 CE12 CF16 CF17 EE03 GG02

Claims (8)

[Claims] 1. A method for manufacturing a wired circuit board, wherein an etching resist pattern for a wiring pattern is formed on a conductor layer laminated on an insulating layer, and the wiring pattern is formed by etching the conductor layer. At least one inspection etching resist pattern having a predetermined shape for inspecting the width of the wiring pattern is provided in the vicinity of the pattern etching resist pattern, and wiring is provided in the conductor layer using the wiring pattern etching resist pattern. A method for manufacturing a wired circuit board, which comprises forming a pattern and forming an inspection pattern on the conductor layer using the inspection etching resist pattern. 2. The method of manufacturing a printed circuit board according to claim 1, wherein each of the at least one etching resist pattern for inspection includes a pair of inspection resist patterns having a predetermined shape. 3. The pair of inspection resist patterns comprises:
The method for manufacturing a wired circuit board according to claim 2, wherein the methods are provided so as to face each other. 4. The wiring circuit according to claim 2, wherein the pair of inspection resist patterns each have a substantially triangular shape, and are arranged so that the vertices of the substantially triangular shape face each other. Substrate manufacturing method. 5. A correlation between a size of a predetermined portion of an inspection pattern formed by using the etching resist pattern for inspection and a width of a wiring pattern formed by using the etching resist pattern for wiring pattern is previously set. Measure and visually measure the dimensions of a predetermined portion of the inspection pattern formed by using the etching resist pattern for inspection through an optical microscope, and form by using the etching resist pattern for the wiring pattern based on the correlation. The method for manufacturing a wired circuit board according to claim 1, wherein the printed wiring pattern is inspected. 6. An interval of a predetermined portion between a pair of inspection patterns formed by using the pair of inspection resist patterns and a width of a wiring pattern formed by using the etching resist pattern for the wiring pattern. Is measured in advance, and an interval between the pair of inspection patterns formed by using the pair of etching resist patterns for inspection is visually measured through an optical microscope, and the wiring pattern is obtained based on the correlation. 5. The method for manufacturing a wired circuit board according to claim 2, wherein the wiring pattern formed by using the etching resist pattern for a wiring is inspected. 7. The method for manufacturing a wired circuit board according to claim 1, wherein the width of the etching resist pattern for the wiring pattern is 60 μm or less. 8. A method for inspecting a printed circuit board on which a wiring pattern is formed by etching a conductor layer laminated on an insulating layer using an etching resist pattern for the wiring pattern, wherein the etching for the wiring pattern is performed. At least one inspection etching resist pattern having a predetermined shape is provided in the vicinity of the resist pattern, the wiring pattern is formed on the conductor layer using the etching resist pattern for the wiring pattern, and the etching resist pattern for the inspection is used. To form an inspection pattern on the conductor layer, and visually measure the dimensions of a predetermined portion of the inspection pattern through an optical microscope, based on the correlation between the dimensions of the predetermined portion of the inspection pattern and the width of the wiring pattern measured in advance. Using the etching resist pattern for the wiring pattern Method of inspecting a wired circuit board, characterized by inspecting the formed wiring pattern.