JP2003017844A - Cream solder printer and board transfer program - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cream solder printer and a board transfer program, by which the board transfer is efficiently performed by changing the transfer time, in response to the size of boards to be carried. SOLUTION: The cream solder printer put cream solder into print on boards. The cream solder printer is provided with a transfer means for transferring boards at a previously set speed and a control means for changing the setting of the carrying speed of the carrying means, according to the inputted size of boards.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cream solder printer and a board transfer program for transferring a board at a speed according to the size of the board.

[0002]

2. Description of the Related Art Generally, a cream solder printer is known as a device for applying cream solder to the surface of a printed circuit board. As shown in FIG. 6, a cream solder printer 100 conveys a printed circuit board 120. The transport device 101 is provided. The carrying-in buffer carrying section 102 for carrying in the carrying apparatus 101 so as to take in the printed circuit board 120 carried from the upstream (left side in the figure) preceding process carrying apparatus 110, and the carrying-in buffer carrying section 102.
On a portion of the printed circuit board 120 that is transported from the printed circuit board 120 on which cream solder is printed, the circuit board print transporting section 103 that transports the printed circuit board 120, and the printed circuit board 120 that is printed from the circuit board print transporting section 103 is transported to the post-process transporting apparatus 111 A carry-out buffer carrying unit 104 for carrying out the paper and a carrying speed control unit 109 for controlling the carrying speed of these units are provided. Each of the carry-in buffer carrying section 102, the board printing carrying section 103, and the carry-out buffer carrying section 104 has a sensor (carry-in buffer carrying section sensor 105, board printing carrying section sensor 1) that detects a printed circuit board at a predetermined position.
06, a carry-out buffer carrying section sensor 107), a carrying belt (not shown) for carrying the printed circuit board 120, and carrying motors 108, ... Which rotate the carrying belt. The conveyance speed control unit 109 is used for the conveyance motor 1
By controlling the rotation speeds of the transfer motors 08, ..., Further, the transfer speeds are controlled, and further, the rotation speeds of the transfer motors 108, ... Are decelerated based on the substrate position detection signals input from the respective sensors. Stop. This transport speed control unit 109
The transport speed set by is equal to either the transport speed of the front-step transport device 110 or the transport speed of the post-process transport device 111, or both. In order to specifically describe, the transport speed of the pre-process transport device 110 is V5, and the pre-process transport device 11 is
0 to V1 for the carry-in buffer carrying section 102 of the cream solder printer 100, V2 for the carry-in buffer carrying section 102 to the board print carrying section 103, and V2 for the board print carrying section 103 to the carry-out buffer carrying section 1.
Transport speed up to 04 is V3, unloading buffer transport unit 104
From the post-process transfer device 111 to the transfer speed V
4. If the transport speed of the post-process transport device 111 is V6,
Conventionally, when the transport speed V5 of the front-step transport device 110 and the transport speed V6 of the subsequent-process transport device are different, each transport speed of the transport device 101 is set to be equal to either one (V1 = V2 = V3). = V4 = V5, or V1 =
V2 = V3 = V4 = V6) and the transport speed V5,
When both V6 are equal, the respective conveying speeds of the conveying device 101 are set to be equal to these (V1 = V2 = V
3 = V4 = V5 = V6).

[0003]

Normally, the cream solder printing machine 100 is capable of printing on printed circuit boards of various sizes.
Printed circuit boards of various sizes will be transported.
However, as described above, when the deceleration of the transportation motor is started by the detection of each sensor (the loading buffer transportation unit sensor 105, the board printing transportation unit sensor 106, the unloading buffer transportation unit sensor 107), the printed circuit board There is a possibility that the stop position may change depending on the size and the mass. In particular, for a printed circuit board with a large size and a large mass, if the transport speed is high, when decelerating after sensor detection,
There is a risk that the inertial force on the printed circuit board becomes large and the predetermined stop position is greatly exceeded, and the printed circuit board may run off from each part (the carry-in buffer carrying section 102, the board print carrying section 103, the carry-out buffer carrying section 104). In addition, since printed circuit boards of various sizes and masses must be transported under the same conditions, when the driving force of the transportation motors 8 ... Has the greatest effect, that is, the maximum substrate size that can be transported and the maximum substrate mass. Had to assume. For this reason, the transport speed of each device (pre-process transport device 110, cream solder printer 100, post-process transport device 111) is set to a value corresponding to the maximum substrate size or maximum substrate mass that can be transported. It is set. However, if the transport speed of each device is set to a constant value in advance as described above, it is possible to transport a printed circuit board with a small size or mass, that is, a printed circuit board with a small inertial force or driving force generated during transportation. Even if there is, the conveyance time is not efficient because it is conveyed only at the set conveyance speed.

An object of the present invention is to provide a cream solder printing machine and a board transfer program for changing the transfer time according to the size of the board to be transferred so as to efficiently transfer the board.

[0005]

The invention according to claim 1 is
For example, as shown in FIG. 1, a cream solder printing machine (A) that prints cream solder on a substrate (printed circuit board 20).
In (1), a transport means (transport device 1) for transporting the substrate at a preset speed, and a control means for changing the transport speed setting of the transport means based on the input size of the substrate (transport speed control And part 9).

According to the first aspect of the invention, the setting of the transfer speed of the transfer means is changed by the control means based on the input size of the board. In addition, it is possible to set the transportation speed according to each size. Therefore, even when the size of the substrate to be transferred is different, the transfer time is not constant and the substrate can be efficiently transferred.

According to a second aspect of the present invention, in the cream solder printing machine according to the first aspect, the control means calculates the mass of the board based on the input board size, and the board mass is preset. If the mass is less than
At least one of a control for increasing the setting of the transfer speed of the transfer means and a control for decreasing the setting of the transfer speed of the transfer means when the substrate mass is larger than a preset mass. There is.

According to the second aspect of the invention, the control means calculates the mass of the substrate based on the input substrate size, and when the substrate mass is smaller than the preset mass, the At least one of the control for increasing the setting of the transfer speed of the transfer means and the control for decreasing the setting of the transfer speed of the transfer means is performed when the substrate mass is larger than a preset mass. When the transfer speed is set to a value that corresponds to the maximum size or maximum mass that can be transferred, that is, when it is set to a low speed, when a substrate with a mass smaller than the preset mass is transferred, The set value of the transfer speed is increased, and the transfer time can be shortened. Further, for example, when the transport speed is set to a high speed, and a substrate having a mass larger than a preset mass is transported, the set value of the transport speed is lowered, so that the substrate is accelerated and decelerated. The inertial force generated on the substrate can be reduced, and the substrate can be prevented from being displaced from a predetermined position.

Further, in the cream solder printing machine,
Normally, the board size (width, depth, thickness) is to be entered as a setting value when changing the board to be printed, but the board mass is not entered because it is not particularly related to printing. . Moreover, there is a high possibility that the mass of the substrate is unknown. Therefore, since the mass is calculated from the board size, it is possible to avoid increasing the number of setting items and prevent the operation of the cream solder printing machine from becoming complicated.

According to a third aspect of the invention, in the cream solder printing machine according to the first aspect, the control means calculates the mass of the board based on the input board size, and the board mass is preset. If the mass is larger than
Control for increasing at least one of the acceleration time and the deceleration time when the transfer means transfers the substrate without increasing the preset maximum speed, and when the substrate mass is smaller than the preset mass. Is characterized by performing at least one of the control of shortening at least one of the acceleration time and the deceleration time when the transfer means transfers the substrate without lowering the preset maximum speed.

According to the third aspect of the present invention, the control means calculates the mass of the substrate based on the input substrate size, and the conveying means conveys the substrate without increasing a preset maximum speed. Control for increasing at least one of the acceleration time and the deceleration time when performing, and when the substrate mass is smaller than a preset mass, the transfer means does not decrease the preset maximum speed. Since at least one of both the control of shortening at least one of the acceleration time and the deceleration time when carrying is carried out, for example, when the carrying speed is set to a high speed in advance, When a large substrate is transported, the inertial force applied to the substrate during acceleration and deceleration can be weakened. Therefore, it is possible to prevent the substrate from deviating from the predetermined position at the time of starting and stopping the conveyance, and particularly at the time of stopping, it is possible to easily stop the substrate at the predetermined stop position. In addition, for example, when the transport speed is set to a low speed in advance and a substrate having a mass smaller than the preset mass is transported, at least one of the acceleration time and the deceleration time is shortened to reduce the transport time. It can be shortened.

According to a fourth aspect of the present invention, there is provided a board transfer program in which a size of a board to be transferred in a cream solder printing machine is input to a computer, and the input board size and the previously input density of the board are stored. The function of calculating the mass of the substrate based on the both, the calculated substrate mass is compared with the preset substrate mass, if the calculated substrate mass is smaller, the preset A function of performing at least one of increasing the transport speed with respect to the transport speed and lowering the transport speed with respect to a preset transport speed when the calculated substrate mass is larger. The feature is to let.

According to the invention of claim 4, it is possible to obtain the same effect as that of claim 2.

According to a fifth aspect of the present invention, there is provided a board transfer program in which a size of a board to be transferred in a cream solder printer is input to a computer, and the input board size and the previously input density of the board are stored. The function of calculating the mass of the substrate based on the both, the calculated substrate mass is compared with the preset substrate mass, and if the calculated substrate mass is larger, it is preset. If at least one of the acceleration time and the deceleration time at the time of carrying the substrate without increasing the carrying speed is lengthened, and if the calculated substrate mass is smaller, the preset carrying speed is not lowered. A function of performing at least one of both of shortening at least one of acceleration time and deceleration time when the substrate is transferred,
It is characterized by realizing.

According to the invention of claim 5, it is possible to obtain the same effect as that of claim 3.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION [First Embodiment] A first embodiment of the present invention will be described below with reference to the drawings of FIGS.

The cream solder printing machine A of the present embodiment is provided with a carrying device 1 for carrying a printed circuit board 20, as shown in FIG. The carrying device 1 carries a carry-in buffer carrying unit 2 carrying the printed circuit board 20 carried from the upstream (left side in the drawing) carrying device 10, and a print carried from the carry-in buffer carrying unit 2. A board printing and transporting section 3 for transporting the printed board 20 on a portion on which the cream solder is printed on the board 20;
Printed printed circuit board 20 from the circuit board print transport unit 3
Carry-out buffer carrying section 4 for carrying out the product to the post-process carrying device 11
And a transport speed control unit (control means) 9 for controlling the transport speed of each of these units.

Each of the carry-in buffer carrying section 2, the board print carrying section 3, and the carry-out buffer carrying section 4 has a sensor (carry-in buffer carrying section sensor 5, board print carrying section sensor) for detecting a printed circuit board at a predetermined position. 6, a carry-out buffer transport unit sensor 7), a transport belt (not shown) for transporting the printed circuit board 20, and a transport motor 8, ... For rotating the transport belt.

Now, the change in the conveying speed from the start to the stop of the driving of the conveying motor controlled by the conveying speed control unit 9 will be described with reference to the speed-time diagram of FIG. First, the transportation motor is driven from the transportation stopped state to start transportation. Then, the rotation speed of the transportation motor is increased to accelerate the transportation speed to the preset speed Va within the transportation speed acceleration time ta. When the transport speed becomes the speed Va,
The printed circuit board is conveyed while maintaining the speed. After that, when the sensor detects the printed circuit board, the rotation speed of the transportation motor is reduced to reduce the transportation speed and stop within the transportation speed deceleration time tc. It should be noted that the time during which the robot is moving at a constant speed is defined as the transport drive time tb. The area of a portion (shaded portion) surrounded by the line indicating the speed change and the time axis represents the transport distance L. Basically, the transport start point and the stop point are predetermined, and therefore the transport distance L is also determined before transport. That is, since the area of the hatched portion is constant, in order to shorten the transport time, the transport speed is increased and the transport drive time tb is shortened, or the transport speed acceleration time ta and the transport speed deceleration time tc are shortened. do it.

The transfer speed control unit 9 controls the rotation speeds of the transfer motors 8, ... Based on the input board size (width, depth, thickness, etc. of the board to be transferred) and board type. The transfer speed, the acceleration time, the deceleration time, etc. are changed, and the rotation speed of the transfer motors 8 ... Is decelerated based on the substrate position detection signal input from each sensor to stop the rotation.

The transport speed control unit 9 includes a storage unit and a CPU.
And so on. The storage unit is composed of a magnetic or optical recording medium, a semiconductor memory or the like, and various programs such as a transfer system program and a board mass calculation program, transfer speed data, acceleration / deceleration time data, and density data of various boards. Various data such as is stored. In the present embodiment, two types of low speed values and high speed values are stored as the transport speed data. The low speed value is the value corresponding to the maximum mass of the printed circuit board that can be transported, that is,
The printed circuit board is set to a value that does not deviate from a predetermined position due to the inertial force during acceleration / deceleration. Therefore, it is possible to prevent the printed circuit board transported by the transport device 1 from being displaced from a predetermined position during acceleration / deceleration. The low speed value is set to be equal to the conveyance speeds V5 and V6 of the pre-process conveyance device 10 and the post-process conveyance device 11, and the respective conveyance speeds (conveyance speed V1 between the pre-process conveyance device 10 and the carry-in buffer conveyance unit 2 are Transport speed V2 from the carry-in buffer transport unit 2 to the board print transport unit 3, transport speed V3 from the substrate print transport unit 3 to the carry-out buffer transport unit 4, transport speed V4 from the carry-out buffer transport unit 4 to the post-process transport apparatus 11. ) Is set as the initial value. On the other hand, the high-speed value is a value corresponding to the mass (reference mass) set for mass comparison, that is, if it is less than the reference mass, the inertial force during acceleration / deceleration does not cause the printed circuit board to shift from the predetermined position. Since the value is set to a value, if the printed circuit board is lighter than the reference mass, it can be conveyed at high speed while preventing the printed board from being displaced from a predetermined position during acceleration / deceleration.

The CPU of the transfer speed control unit 9 calculates the substrate mass based on the input substrate size and the input density data corresponding to the type of the substrate, and compares the calculated result with the reference mass. The transport speed is determined to be either a high speed value or a low speed value. Then, the CPU rotates the transport motors 8 of the respective units (the carry-in buffer transport unit 2, the board print transport unit 3, the unload buffer transport unit 4) so that the transport speeds V2 and V3 become the determined speeds. It controls the speed.

A procedure for changing the transfer speed of the cream solder printing machine A configured as described above will be described with reference to FIGS. 1 and 3.

Before carrying the board, the board size (width dimension, depth dimension, thickness dimension) and the board type on which the cream solder is printed are input to the carrying device 1. (Step S1) The transfer apparatus 1 calculates the substrate mass from the input substrate size and the density data selected based on the substrate type, and compares it with the reference mass. (Step S2) As a result of this comparison, if the calculated substrate mass is smaller, the process proceeds to step S3, and if it is larger, the process proceeds to step S4.

At step S3, the transport speed V
2, V3 is changed from a preset low speed value to a high speed value, and the process proceeds to step S4. When the process proceeds to step S4, the conveyance of the printed circuit board is started at the set conveyance speed (a low speed value for a substrate larger than the reference mass, a high speed value for a small substrate). If the substrate mass of the printed circuit board being transported is smaller than the reference mass,
It is conveyed at a speed change as shown in (b), and when it is large, it is conveyed at a speed change as shown in FIG. 1 (c). That is, in the case of a printed circuit board having a mass smaller than the reference mass, the time during which the cream solder printer A is transported is shortened by the time T as compared with the case where the mass is large.

As described above, according to the cream solder printing machine of the first embodiment, the carrying speed is changed based on the board size of the printed board 20 to be carried, so that printing of different sizes is performed. When the substrate is transported, the transportation speed can be set according to each size. Therefore, even when the size of the printed circuit board to be transferred is different, the transfer time is not constant and the printed circuit board can be efficiently transferred. Further, in the present embodiment, the substrate mass is calculated based on the input substrate size, and when the calculated substrate mass is smaller than the preset reference mass, the transport speed is set as the reference mass. Since it is changed to a high-speed value that supports it, even when transporting a printed circuit board that is smaller than the reference mass, it is possible to increase the transport speed while preventing the displacement of the printed circuit board when the transport is stopped, and to transport efficiently. can do. Further, the transport speeds V1 and V4 are set to be the same as the transport speed V5 of the pre-process transport device and the transport speed V6 of the post-process transport device.
It is possible to smoothly transfer the substrate generated when the substrate is carried in and out.

In the present embodiment, the transport speed is set to only two types, a high speed value and a low speed value, but it may be set in any number of steps, and the calculated substrate mass and
It is also possible to calculate an appropriate transfer speed based on the calculated substrate mass without determining the change of the transfer speed based on the result of comparison with the reference mass. With such a configuration, it is possible to more efficiently carry the sheet according to the substrate size.

[Second Embodiment] A second embodiment of the present invention will be described below with reference to the drawings of FIGS.

Except for the parts peculiar to the second embodiment, it is the same as in the first embodiment. And
In the second embodiment, the same parts as those in the first embodiment described above are designated by the same reference numerals, and the description thereof will be omitted.

In the first embodiment, whether the transport speed preset to the low speed value is changed to the high speed value or is maintained as it is is changed according to the input substrate size. As a result, the printed circuit board was conveyed at a speed at which it was difficult to shift, but in the second embodiment,
The conveying speeds V2 and V3 are set to high speed values in advance, and the deceleration time is changed according to the input board size to prevent the printed board from being displaced.

That is, the transfer speed control unit 9 of the second embodiment compares the substrate mass calculated based on the input substrate size with the reference mass, and when the substrate mass is smaller than the reference mass, The conveyance is stopped at a preset deceleration time, and when the mass is larger than the reference mass, the deceleration time is changed to be longer and the conveyance is stopped at the changed deceleration time. That is, by increasing the deceleration time, the inertial force generated in the printed circuit board during deceleration is reduced and the printed circuit board is prevented from shifting. As the deceleration time according to the substrate mass, a plurality of deceleration time data may be stored in the storage unit in advance, and an appropriate one may be selected from them, or the calculated substrate mass and transfer speed may be selected. Alternatively, the deceleration time that is less likely to cause a deviation during deceleration may be calculated based on the transport distance and the like. Also, to reduce the speed of substrate transfer
Multiple sensors are arranged continuously in the moving direction,
It may be started based on the detection signal of the sensor located at the position corresponding to the set deceleration time, or the deceleration start point based on the set deceleration time, the conveyance speed, the conveyance distance, etc. without the sensor. May be calculated, and the calculation may be started from the calculated point.

The deceleration time changing procedure of the cream solder printing machine A according to the second embodiment will be described with reference to FIGS. 4 and 5.

Before carrying the board, the board size (width dimension, depth dimension, thickness dimension) and the board type on which the cream solder is printed are input to the carrying device 1. (Step S
1 ′) The transfer device 1 calculates the substrate mass from the input substrate size and the density data selected based on the substrate type, and compares it with the reference mass. (Step S2 ′) As a result of this comparison, if the calculated substrate mass is larger, the process proceeds to step S3 ′, and if it is smaller, the process proceeds to step S4 ′.

When the process proceeds to step S3 ', the transport speed V
2, the deceleration time of V3 is changed from a preset value to a long value, and the process proceeds to step S4 '. Step S
When it moves to 4 ', the transfer is started, and the deceleration time at the time of transfer is set (if the substrate is larger than the reference mass,
The printed circuit board is transported in the deceleration time changed in step S3 ′, and in the case of a small board, the deceleration time set in advance). In the present embodiment, when the substrate mass of the printed circuit board to be conveyed is larger than the reference mass, as shown in FIG.
As shown in (b), from the deceleration start point, the transport speed V
2 and V3 are decelerated to transport speeds V5 and V6 (V2 ', V
3 '), and then the sheet is once conveyed at a constant speed, and then decelerated so as to stop at a predetermined stop position.

As described above, according to the cream solder printing machine of the second embodiment, the transport speeds V2 and V3 are set to high speed values in advance, and the mass of the board is determined based on the input board size. Is calculated, and when the substrate mass is larger than the preset mass, the deceleration time is lengthened, so that the inertial force applied to the substrate during deceleration can be weakened. Therefore, as in the conventional case, the respective transfer speeds V1, V2, V3, and V4 are higher than the transfer speed V5 of the pre-process transfer device 10 and the transfer speed V6 of the post-process transfer device 11, so that the transfer time is shortened. In addition, it is possible to prevent the printed circuit board 20 from shifting from a predetermined position when stopped.

In the second embodiment, only the deceleration time is changed, but the acceleration time may be changed in order to prevent the deviation during acceleration. Further, in the second embodiment, the inertial force applied to the printed circuit board 20 is reduced by once setting the speed constant until deceleration until the stop, but the speed change at the time of deceleration is made gentle. Therefore, the inertial force may be reduced. The transport speed and the acceleration / deceleration time may be arbitrarily changed as long as the printed circuit board to be transported can be stopped at a predetermined position. In addition, in this Embodiment, although the structure which the conveyance speed control part 9 was equipped in the conveyance apparatus 1 was illustrated and demonstrated, in addition to this, for example, the control part which controls a cream solder printer has a conveyance speed control. It may be configured to have the function of the unit 9.

It should be understood that the embodiments disclosed this time are illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description but by the claims, and is intended to include meanings equivalent to the claims and all modifications within the scope. The series of processes in the first and second embodiments may be provided as a computer-executable program. In such a case, a storage such as a CD-ROM or a floppy (registered trademark) disk is stored. It can be provided via a medium or a communication line.

[0038]

According to the first aspect of the present invention, when substrates of different sizes are conveyed, it is possible to set the conveying speed according to each size. Therefore, even when the size of the substrate to be transferred is different, the transfer time is not constant and the substrate can be efficiently transferred.

According to the second aspect of the present invention, for example, when the transport speed is previously set to a value corresponding to the maximum transportable size or maximum mass, that is, when the transport speed is set to a low speed. When a substrate having a mass smaller than a preset mass is transported, the transport speed setting value is increased, and the transport time can be shortened. Further, for example, when the transport speed is set to a high speed, and a substrate having a mass larger than a preset mass is transported, the set value of the transport speed is lowered, so that the substrate is accelerated and decelerated. The inertial force generated on the substrate can be reduced, and the substrate can be prevented from being displaced from a predetermined position. In a cream solder printing machine, the board size (width, depth, thickness) is usually set as a set value when changing the board to be printed.
However, the mass of the board was not entered because it is not particularly related to printing. There was also a high possibility that the mass of the substrate was difficult to understand. Therefore, by calculating the mass from the board size,
It is possible to prevent the operation of the cream solder printing machine from becoming complicated without increasing the number of setting items.

According to the third aspect of the present invention, for example, when the transport speed is set to a high speed in advance and a substrate having a mass larger than the preset mass is transported, the substrate is accelerated and decelerated. The inertial force applied to can be weakened. Therefore, it is possible to prevent the substrate from deviating from the predetermined position at the time of starting and stopping the conveyance, and especially at the time of stopping.
It can be easily stopped at a predetermined stop position.
In addition, for example, when the transport speed is set to a low speed in advance and a substrate having a mass smaller than the preset mass is transported, at least one of the acceleration time and the deceleration time is shortened to reduce the transport time. It can be shortened.

[Brief description of drawings]

FIG. 1 is a block diagram showing a main configuration of a cream solder printing machine according to the present embodiment and a speed-time diagram showing a carrying speed of a carrying device provided in the cream solder printing machine.

FIG. 2 is a diagram for explaining the velocity-time diagram of FIG.

FIG. 3 is a flow chart showing a control procedure performed by a conveyance speed control unit of FIG.

FIG. 4 is a block diagram showing a modified example of FIG. 1 and speed-
It is a time diagram.

5 is a flowchart showing a control procedure performed by the transport speed control unit of FIG.

FIG. 6 is a block diagram showing a main configuration of a conventional cream solder printing machine.

[Explanation of symbols]

1 Transport device (transport) 9 Conveyance speed controller (control means) 20 Printed circuit board (board) A cream solder printing machine

Claims (5)

[Claims] 1. A cream solder printing machine for printing cream solder on a board, comprising: a carrying means for carrying the board at a preset speed;
A cream solder printing machine comprising: a control unit configured to change a setting of a transfer speed of the transfer unit based on an input size of the substrate. 2. The cream solder printing machine according to claim 1, wherein the control means calculates the mass of the board based on the input board size, and the board mass is smaller than a preset mass. In this case, control for increasing the setting of the conveying speed of the conveying means,
The cream solder printing machine characterized in that, when the mass of the substrate is larger than a preset mass, at least one of the control of lowering the setting of the transfer speed of the transfer means is performed. 3. The cream solder printer according to claim 1, wherein the control means calculates the mass of the board based on the input board size, and the board mass is larger than a preset mass. In this case, control is performed to lengthen at least one of the acceleration time and the deceleration time when the transfer means transfers the substrate without increasing the preset maximum speed, and the substrate mass is greater than the preset mass. If it is also small, it is possible to perform at least one of both the control of shortening at least one of the acceleration time and the deceleration time when the transfer unit transfers the substrate without lowering the preset maximum speed. Characteristic cream solder printing machine. 4. The size of a board conveyed in a cream solder printing machine is input to a computer, and the mass of the board is calculated based on both the input board size and the previously input density of the board. Compare the function and the calculated substrate mass with a preset substrate mass, and if the calculated substrate mass is smaller, increase the transport speed with respect to the preset transport speed. And a function of performing at least one of lowering the transport speed with respect to a preset transport speed when the calculated substrate mass is larger, and a substrate transport program. 5. A computer is inputted with a size of a substrate conveyed in a cream solder printing machine, and the mass of the substrate is calculated based on both the inputted substrate size and the previously inputted density of the substrate. Compare the function and the calculated substrate mass with the preset substrate mass, and if the calculated substrate mass is larger, transport the substrate without increasing the preset transport speed. When increasing at least one of the acceleration time and deceleration time when performing, if the calculated substrate mass is smaller, the acceleration time when transporting the substrate without lowering the preset transport speed and A substrate transfer program that realizes a function of performing at least one of both of shortening at least one of deceleration times.