JP2003006588A - Ic module, manufacturing method therefor and ic card manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC module not to be deformed or destroyed even by impact force and bending stress from the outside, the manufacturing method and an IC card manufacturing method. SOLUTION: In the IC module incorporated in an IC card, a center sheet 1 is provided and a capacitor electrode 73 is formed with metallic foil on the surface of the center sheet on the opposite side of the surface where an IC chip 4 is loaded at the position of the center sheet 1 where the IC chip 4 is loaded on the center sheet 1. Since the IC chip 4 is reinforced by the metallic foil, the effect of improving impact force resistance and bending stress resistance is provided. Further, at the position of loading the IC chip 4, the capacitor electrode 71 is formed with the metallic foil on the surface on the opposite side of the surface where the capacitor electrode 73 is formed of the center sheet. Since the IC chip 4 is reinforced doubly by the metallic foil, the effect of further improving the impact force resistance and the bending stress resistance is provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC module resistant to external force, a method of manufacturing the same, and a method of manufacturing an IC card.

[0002]

2. Description of the Related Art In recent years, from the viewpoint of efficiency of information processing and security, an IC having a built-in IC circuit by a semiconductor element for recording and processing data is used instead of a magnetic card.
Practical application of cards is in progress. The IC card is usually stored in a wallet or a card case, or is carried as a single card. Under these conditions of use, external stress, impact force, etc. (external force) are often applied to the IC card. In that case, the IC chip built in the IC card is deformed by the external force. , The functions of data recording and data processing may not be achieved. Therefore, an IC card and an IC module that are not deformed or destroyed by an external force are desired.

Recently, as disclosed in Japanese Patent Laid-Open No. 2000-99678, when an IC card is manufactured,
There is known an IC card in which a metal foil is left on a portion other than the circuit surface of the IC chip and the IC chip is reinforced by the metal foil. Further, as disclosed in JP-A-2-158156, there is known an IC card in which an IC chip is sealed with a resin and a reinforcing plate is formed on the IC chip.

[0004]

However, the IC card in which the IC chip is sealed with resin disclosed in Japanese Patent Laid-Open No. 2-158156 has a problem that sufficient reinforcing strength cannot be obtained. In addition, JP-A-2-1581
In the IC card in which the reinforcing plate is formed on the IC chip disclosed in Japanese Patent No. 56, the reinforcing process is performed on the IC chip itself having a thickness of 0.2 mm or less to form the reinforcing plate. However, as the performance of IC chips has increased in recent years, the IC chips tend to become large and thick, so that there is a problem in that even if the IC chips themselves are reinforced by etching or the like, sufficient reinforcing strength cannot be obtained. Therefore, it is deformed by impact force and bending stress from the outside,
There is a demand for an IC module and an IC card that do not break.

Therefore, an object of the present invention is to provide an IC module which is resistant to external impact and bending and a method for manufacturing the same.
An object of the present invention is to provide a method of manufacturing an IC card which is not deformed or destroyed by an external impact force and a bending stress.

[0006]

In order to solve the above-mentioned problems, an IC module of the present invention comprises an insulating substrate, an antenna coil formed on the insulating substrate, and a signal mounted on the insulating substrate. An IC module having a processing IC chip, wherein a first reinforcing plate is provided on a surface of the insulating substrate opposite to a surface on which the IC chip is mounted at a position of the insulating substrate on which the IC chip is mounted. Are formed.

According to the above IC module of the present invention,
A first material of the same material as that of the antenna coil is provided on the surface of the insulating substrate opposite to the surface on which the IC chip of the insulating substrate is mounted at the position of the insulating substrate.
Since the reinforcing plate is formed, even if external impact force or bending stress is generated on the IC chip, since it is reinforced by the reinforcing plate, it is not deformed or destroyed by the impact force or bending stress. An IC module can be obtained.

Preferably, the first reinforcing plate is made of the same material as the antenna coil.

Preferably, a second reinforcing plate formed on the surface of the insulating substrate opposite to the surface on which the first reinforcing plate is formed at a position where the IC chip is mounted. Have more.

According to the IC module of the above invention, I
The C chip has a double reinforcing plate formed through an insulating substrate. Even when an external impact force or bending stress is generated on the IC chip, the double reinforcing plate is formed by the double reinforcing plate. Since it is reinforced, it is possible to obtain an IC module that is not deformed or destroyed by impact force or bending stress.

Further, preferably, the first reinforcing plate and the second reinforcing plate are conductive members, and are the first reinforcing plate which is the first electrode and the second electrode. A capacitor is formed by the second reinforcing plate and the insulating substrate that is a dielectric, and the IC chip is mounted on at least a part of the capacitor.

According to the IC module of the above invention, I
Since the capacitor is formed in the region where the C chip is mounted, the electrode forming region of the capacitor is secured to be wider, so that the capacitor having a larger capacitance can be formed.

Further, preferably, the first electrode of the capacitor is further formed on a surface of the insulating substrate on which the second electrode is formed, and the IC chip is the insulating substrate. Of the first electrode formed on the surface of the insulating substrate and the formation area of the second electrode formed on the surface of the insulating substrate.

Preferably, the edges of the first electrode and the second electrode on which the IC chip is mounted are
It is offset from the center of the IC chip.

Further, preferably, the IC chip is mounted on the insulating substrate via an anisotropic conductive film.

Preferably, the IC chip is mounted on the insulating substrate and sealed with resin.

Further, preferably, the IC chip further has a reinforcing plate formed on a surface of the IC chip opposite to a surface in contact with the insulating substrate.

In order to solve the above problems, the IC of the present invention
The module manufacturing method is an IC module manufacturing method for forming a reinforcing plate of an IC module having an insulating substrate, an antenna coil formed on the insulating substrate, and a signal processing IC chip mounted on the insulating substrate. And a first reinforcing plate and a part of the antenna coil on the surface of the insulating substrate opposite to the surface on which the IC chip is mounted at the position of the insulating substrate on which the IC chip is mounted. And a mounting step for mounting the IC chip.

According to the method of manufacturing an IC module of the above invention, a first surface is provided on the surface of the insulating substrate opposite to the surface on which the IC chip is mounted at the position of the insulating substrate on which the IC chip is mounted. Since the reinforcing plate and a part of the antenna coil are formed at the same time, the manufacturing time can be shortened as compared with the case where the first reinforcing plate and a part of the antenna coil are manufactured separately.

Preferably, at a position where the IC chip is mounted, a second reinforcing plate and one of the antenna coils are provided on a surface opposite to a surface on which the insulating substrate and the first reinforcing plate are formed. A second reinforcing plate forming step of simultaneously forming the portions.

Further, preferably, the first reinforcing plate and the second reinforcing plate are conductive members, and are the first reinforcing plate which is the first electrode and the second electrode. A capacitor is formed by the second reinforcing plate and the insulating substrate that is a dielectric, and in the mounting step, the IC chip is mounted on at least a part of the capacitor.

Further, preferably, in the step of forming the second reinforcing plate, at a position where the IC chip is mounted, on a side of the insulating substrate opposite to a surface on which the first reinforcing plate is formed. A first electrode of the capacitor and a second electrode of the capacitor on a surface, and a first electrode formed on one surface of the insulative substrate and an opposite surface of the insulative substrate. A step of electrically connecting the formed first electrode with a through hole, and in the mounting step,
The IC chip is mounted by straddling a first electrode and a second electrode formed on one surface of the insulating substrate.

Further, preferably, in the mounting step, the IC chip is straddled over a first electrode and a second electrode formed on one surface of the insulating substrate, and the first electrode and The edge of the second electrode is mounted while being displaced from the center of the IC chip.

Also, preferably, in the mounting step, the IC chip is mounted via an anisotropic conductive film.

Preferably, the method further comprises the step of resin-sealing the IC chip.

Preferably, the method further comprises the step of forming a reinforcing plate on the surface of the IC chip opposite to the surface in contact with the insulating substrate.

In order to solve the above problems, the method of manufacturing an IC card according to the present invention provides an insulating substrate, an antenna coil formed on the insulating substrate, and a signal processing device mounted on the insulating substrate. An IC card manufacturing method for forming a reinforcing plate of an IC card containing an IC module having an IC chip and a capacitor, the surface on which the IC chip is mounted at the position of the insulating substrate on which the IC chip is mounted. A step of forming a first reinforcing plate and a part of the antenna coil on the surface of the insulative substrate opposite to the step of forming the IC chip; a mounting step of mounting the IC chip; Coating with a protective layer.

Preferably, at a position where the IC chip is mounted, a second reinforcing plate is formed on a surface opposite to the surface on which the insulating substrate and the first reinforcing plate are formed. And a reinforcing plate forming step.

Further, preferably, the first reinforcing plate and the second reinforcing plate are conductive members, and are the first reinforcing plate which is the first electrode and the second electrode. A capacitor is formed by the second reinforcing plate and the insulating substrate that is a dielectric, and in the mounting step, the IC chip is mounted on at least a part of the capacitor.

Further, preferably, in the step of forming the second reinforcing plate, at a position where the IC chip is mounted, on a side opposite to a surface of the insulating substrate on which the first reinforcing plate is formed. A first electrode of the capacitor and a second electrode of the capacitor on a surface, and a first electrode formed on one surface of the insulative substrate and an opposite surface of the insulative substrate. The step of forming a through hole to electrically connect the formed first electrode and the mounting step include the step of connecting the first electrode and the second electrode formed on one surface of the insulating substrate. Equipped with an IC chip.

Further, preferably, in the mounting step, the IC chip is straddled over a first electrode and a second electrode formed on one surface of the insulating substrate, and the first electrode and the second electrode are formed. The edge of the second electrode is mounted while being displaced from the center of the IC chip.

[0032]

BEST MODE FOR CARRYING OUT THE INVENTION First Embodiment A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a diagram showing the configuration of the IC card according to the present embodiment. FIG. 2 is a schematic plan view of an IC module incorporated in the IC card illustrated in FIG. Figure 3
FIG. 3 is a sectional view taken along line AA ′ of FIG.

As shown in FIG. 1, the non-contact type IC card 200 according to the first embodiment has a 7-layer laminated structure, and adhesive sheets 10 and 11 are provided on both sides of an IC module 100 described later. The core sheets 12 and 13 and the over sheets 14 and 15 are laminated.

The size of the IC card 200 is, for example, I
54 mm in length and 85.6 m in width determined by SO international standard
m and the thickness is 0.76 mm ± 10%.

First, each card base material will be described. The adhesive sheets 10 and 11 are made of, for example, a sheet containing polyester resin, epoxy resin or the like as a main component. Core sheets 12, 13 and over sheet 1
4, 15 are made of plastic resin. These core sheets 12, 13 and oversheets 14,
15 is, for example, PET-G, ABS resin, PET, PE
It is made of N, acrylic resin, polycarbonate, or plastic resin such as vinyl chloride.

As shown in the figure, the IC module 100
Has a center sheet 1, an antenna coil 2, an anisotropic conductive film 3, an IC chip 4, and a reinforcing metal foil 5.

The center sheet 1 is made of plastic resin. The antenna coil 2 is an antenna coil connected to the IC chip 4, and includes a front surface antenna coil 21, a back surface metal foil 22, and a through hole 23.
With 24. Further, the antenna coil 2 forms a resonance circuit together with a capacitor (not shown), and transmits and receives a signal using a radio wave having a resonance frequency. The surface antenna coil 21 is
The center sheet 1 is formed of a conductive metal on the periphery of the loop on the loop. In addition, the surface antenna coil 21
Are electrically connected to the back surface metal foil 22 through the through holes 23 and 24. The back surface metal foil 22 is a conductive metal foil formed on the back surface of the center sheet 1, and is electrically connected to the front surface antenna coil 21 through the through holes 23 and 24. Further, the back surface metal foil 22 is formed of the same material as the front surface antenna coil 21,
It may be formed of different materials.

The anisotropic conductive film 3 is, for example, one in which conductive fine particles are dispersed and blended in an adhesive, and the film itself has an insulating property. It is the manifestation of sex.

The IC chip 4 is an IC chip having a circuit for signal processing, is provided with bumps (connection terminals) 6, and is electrically connected to the antenna coil 2 via the anisotropic conductive film 3. It is connected to the.

The reinforcing metal foil 5 is formed of metal on the back surface of the center sheet 1 on the side opposite to the position where the IC chip 4 is mounted. Further, the reinforcing metal foil 5 is formed larger than the edge of the center sheet 1 of the IC chip 4.

As described above, in the IC module 100 and the IC card 200 of the present embodiment, the reinforcing metal foil 5 is formed on the back surface of the center sheet 1 at the position opposite to the position where the IC chip 4 is mounted. Because I am
There is an effect that bending resistance, impact resistance and the like of the C chip 4 are increased.

Next, a method of manufacturing the IC module 100 will be described with reference to the sectional view shown in FIG. 4 and the flow chart shown in FIG.

Step ST1: As shown in FIG. 4A, the metal foils 21a and 22a are formed on both sides of the center sheet 1.
Stick.

Step ST2: As shown in FIG. 4B, the front surface antenna coil 21 and the rear surface metal foil 2 to be formed.
2 and the resist R having the pattern of the reinforcing metal foil 5
21 and R22 are applied.

Step ST3: As shown in FIG. 4 (c), etching is performed using an etching solution to expose the center sheet 1 other than the resist R20 and R22 coating portions.

Step ST3: As shown in FIG. 4 (d), the resists R20 and R22 are removed to form the desired front surface antenna coil 21, rear surface metal foil 22, and reinforcing metal foil 5.

Step ST4: Through holes 23 and 24
To form the front surface antenna coil 21 and the back surface metal foil 22.
To be electrically connected.

Step ST5: Center seat 1 above
The anisotropic conductive film 3 is transferred onto the surface antenna coil 21 formed on the surface of the IC chip 4, and the connecting terminal 6 of the IC chip 4 is connected.
Is placed on the anisotropic conductive film 3 so that the IC chip 4 is located on the lower surface, and is thermally pressure-bonded from above to connect the IC chip 4 to the surface antenna coil 21 and fix the IC chip 4 to the IC chip 4
And the antenna coil 2 are electrically connected. Through the above steps, the IC module 100 according to the first embodiment can be formed.

Next, a method of manufacturing the IC card 200 will be described with reference to the flowchart shown in FIG. Step ST11: The center sheet 1, the adhesive sheets 10 and 11, the core sheets 12 and 13, and the oversheets 14 and 15 are laminated as shown in FIG. 1 and temporarily attached. In this temporary tensioning step, for example, it is sandwiched by two rubber rolls, the roll interval and the rubber strength are appropriately adjusted and set to be laminated, and the air is pushed out so that no air remains in the bonding surface. Let

Step ST12: The above-mentioned center sheet 1, adhesive sheets 10 and 11 and core sheet 1 which have been temporarily attached.
The laminated body of Nos. 2 and 13 and the oversheets 14 and 15 is pressed together with heat by a press tool such as a press plate (not shown) and laminated. For example, temperature 120 ° C, pressure 20
Press laminating is performed with a pressure of 12 kg / cm ^{2 for} 12 minutes.

Step ST13: By the above processing, the desired IC card 200 can be formed by punching into a card size.

As described above, in the method of manufacturing the IC module 100 and the IC card 200 according to the first embodiment, the back surface metal foil 22 and the reinforcing metal foil 5 are simultaneously formed by etching. Therefore, the back metal foil 2
2 and the reinforcing metal foil 5 are formed separately,
The manufacturing method becomes simple.

The IC chip 4 is the antenna coil 2
It is mounted on the above and is connected to the antenna coil 2 through the connection terminal 6 and the anisotropic conductive film 3. Therefore, the manufacturing method is simpler than the conventional method of connecting by wire bonding.

Second Embodiment A second embodiment will be described with reference to FIGS. 7 to 9. FIG. 7 is a schematic plan view of an IC module built in the IC card according to the present embodiment. FIG. 8 is an enlarged view of the IC chip and the capacitor of the IC module illustrated in FIG. FIG. 9 is a cross-sectional view taken along the line BB ′ of FIG. In the IC module 100 and the IC card 200 of this embodiment, as shown in FIG.
The C module 100 has a center sheet 1, an antenna coil 2, an anisotropic conductive film 3, an IC chip 4, and a capacitor 7.

The center sheet 1 is made of plastic resin. The center sheet 1 also has a role of a dielectric of the capacitor. The antenna coil 2 is a coil connected to the IC chip 4, and has a front surface antenna coil 21 and a back surface metal foil 22 electrically connected through a through hole 23. Surface antenna coil 21,
The through holes 23 and the anisotropic conductive film 3 are the same as those described in the first embodiment.

As shown in the figure, the capacitor 7 of the IC module 100 is provided with the center sheet 1, the capacitor electrodes 71 and 72 formed on the surface of the center sheet 1, and the capacitor electrodes 71, 72. Capacitor electrode 7 formed on the back surface opposite to the surface
3 and through holes 8.

The through hole 8 has a capacitor electrode 72 formed on the front surface and a capacitor electrode 7 formed on the back surface.
3 is electrically connected.

The edges of the capacitor electrode 71 and the capacitor electrode 72 are formed so as to deviate from the center of the IC chip 4 to be mounted.

The IC chip 4 straddles the capacitor electrode 71 and the capacitor electrode 72, and the center of the IC chip 4 has the capacitor electrode 71 and the capacitor electrode 72.
It is mounted off the edge of. Further, bumps (connection terminals) 6 are provided on the IC chip 4, and the IC chip 4 is formed via the capacitor electrode 71 and the capacitor electrode 72 formed on the surface of the center sheet 1 and the anisotropic conductive film 3. 4 is electrically connected.

As described above, in the IC module 100 and the IC card 200 of the second embodiment, I
Since the mounting area of the capacitor electrode of the C chip 4 and a part of the mounting area of the capacitor electrode are shared and the mounting area of the IC chip 4 is formed by overlapping two layers of metal foil, the first embodiment Bending stress, impact resistance and the like of the IC chip 4 are further improved as compared with the above-mentioned form.

Further, in the IC module 100 and the IC card 200 of the second embodiment, the mounting area of the IC chip 4 is divided into the capacitor electrode 71 and the capacitor electrode 72, and the boundary thereof is the IC chip 4 By deviating from the center of the IC chip 4, the easily bendable area of the mounting area of the IC chip 4 is on the end side of the IC chip 4, and the mechanical strength of the IC chip 4 is further improved.

Further, since the electrodes 71 and 72 of the two capacitors are formed on the mounting surface of the IC chip 4, by directly mounting the connection terminal 6 of the IC chip 4, the IC
The chip 4 and the capacitor can be connected, and the connection failure is less likely to occur than in the case of connection by wire bonding.

In the IC module 100 and the IC card 200, the IC chip 4 is placed on the capacitor 7.
It becomes possible to use the area under the IC chip 4 which has not been conventionally formed as an electrode of a capacitor by mounting the device, and it is possible to secure a larger capacitance than the conventional one.

The method of manufacturing the IC module 100 and the IC card 200 is almost the same as that shown in the first embodiment. Hereinafter, differences from the first embodiment will be described.

As shown in FIG. 5, in step ST2, the capacitor electrodes 71, 7 are formed on the surface of the center sheet 1.
A resist having a pattern of 2 and a resist having a pattern of the capacitor electrode 73 are applied on the back surface. And
Etching is performed (ST3), the resist is removed (ST4), and capacitor electrodes 71, 72, 73 are formed. Then, in step ST5, the capacitor electrode 72 and the capacitor electrode 73 are electrically connected through the through hole 8. Then, in step ST6, the center of the IC chip 4 is shifted from the edges of the capacitor electrode 72 and the capacitor electrode 73 while straddling the formed capacitor electrode 72 and the capacitor electrode 73, and the IC chip 4 is interposed via the anisotropic conductive film. Equipped with. 1st except the above steps
This is similar to that described in the embodiment.

As described above, in the method of manufacturing the IC chip 100 and the IC card 200 according to the second embodiment, the IC chip 4 straddles the capacitor electrode 72 and the capacitor electrode 73 and is at the center of the IC chip 4. Shifts from the edges of the capacitor electrodes 72 and 73,
The IC chip 4 is mounted via the anisotropic conductive film 3. Therefore, the process of mounting the IC chip 4 becomes easy.

Third Embodiment A third embodiment will be described with reference to FIG. IC module 100 and IC card 200 of the present embodiment
In FIG. 10, as shown in FIG. 10, the IC chip 4 is sealed with resin 50 so as to be covered. Resin encapsulation 50
Is an anisotropic conductive film 3, the IC chip 4, and the capacitor electrodes 71, 72 using, for example, a thermosetting resin.
Is sealed. Regarding other configurations, the IC module 100 and the IC card 200 of the second embodiment
It is similar to that described in.

As described above, in the IC module 100 and the IC card 200 of the third embodiment, I
In the mounting area of the C chip 4, two layers of metal foil are formed to overlap each other, and the IC chip 4 is further sealed with a resin seal 50. Therefore, the bending stress, impact resistance and the like are improved as compared with the case where the IC chip 4 is reinforced only by resin sealing.

Regarding the method of manufacturing the IC module 100 and the IC card 200 of this embodiment, the IC module 100 and the IC card 200 of the second embodiment will be described.
It is almost the same as the manufacturing method of. Only differences from the second embodiment will be described. As shown in FIG. 11, step ST
In 7a, for example, the IC chip 4 is covered with a thermosetting resin so as to surround the IC chip 4 and is heated and cured to seal the IC chip 4 as a resin seal 50. Other than that, it is the same as that described in the second embodiment.

Fourth Embodiment A fourth embodiment will be described with reference to FIG. IC module 100 and IC card 200 of the present embodiment
In FIG. 12, a reinforcing plate 60 is formed of metal on the surface of the IC chip 4 opposite to the surface in contact with the capacitor electrodes 71 and 72. For other configurations, the IC modules 100 and I of the second embodiment are used.
This is the same as described for the C card 200.

As described above, in the IC module 100 and the IC card 200 of the fourth embodiment, I
A reinforcing plate 60 is formed on the surface of the C chip 4 opposite to the surface in contact with the capacitor electrodes 71, 72. IC chip 4
Is double reinforced by the capacitor electrodes 71, 71 and the capacitor electrode 73, and further reinforced by the reinforcing plate 60. Therefore, compared with the IC module 100 and the IC card 200 according to the second embodiment, there is an effect that bending stress, impact resistance and the like of the IC chip 4 are increased. For this reason,
Even if the reinforcing plate is formed thinner than the conventional reinforcing plate, it is possible to obtain bending stress, impact resistance and the like that are equal to or higher than those of the conventional reinforcing plate.

Regarding the method of manufacturing the IC module 100 and the IC card 200 of the present embodiment, except that the reinforcing plate 60 is made of metal on the surface of the IC chip 4 opposite to the surface in contact with the capacitor electrodes 71 and 72, It is similar to that described in the second embodiment. Only the differences will be described below. As shown in FIG. 13, in step ST7b,
A reinforcing plate 60 is formed of metal foil on the surface of the IC chip 4 opposite to the surface in contact with the capacitor electrodes 71 and 72. Other than that, it is the same as that described in the second embodiment.

The present invention is not limited to this embodiment, and various suitable modifications can be made. For example, the IC chip 4 of the present embodiment is connected through the anisotropic conductive film, but the connection is not limited to this.
For example, the IC chip 4 may be connected using a gold wire or the like.

[0074]

As described above, according to the present invention, it is possible to provide an IC module in which the IC chip has improved impact resistance and bending stress with respect to the outside. As described above, according to the present invention, it is possible to provide a method of manufacturing an IC module and an IC card in which the IC chip has improved impact resistance and bending stress with respect to the outside.

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration of an IC card according to a first embodiment of the present invention.

FIG. 2 is an IC built in the IC card shown in FIG.
It is a schematic plan view of a module.

3 is a cross-sectional view of an IC chip of the IC module shown in FIG.

FIG. 4 is a diagram showing a method for manufacturing the IC module shown in FIG.

5 is a flow chart of a method of manufacturing the IC module shown in FIG.

6 is a flowchart of a method for manufacturing the IC card shown in FIG.

FIG. 7 is a schematic plan view of an IC module built in an IC card according to a second embodiment of the present invention.

8 is an enlarged view of an IC chip and a capacitor of the IC module shown in FIG.

9 is a sectional view of the IC module and the capacitor shown in FIG.

FIG. 10 is a sectional view of an IC chip and a capacitor of an IC module according to a third embodiment of the present invention.

11 is a flowchart of a method for manufacturing the IC module shown in FIG.

FIG. 12 is a sectional view of an IC chip and a capacitor of an IC module according to a fourth embodiment of the present invention.

13 is a flowchart of a method for manufacturing the IC module shown in FIG.

[Explanation of symbols]

1 ... Center sheet 2 ... Antenna coil 21 ... Surface antenna coil 21a, 22a ... Metal foil 22 ... Back side metal foil 23, 24 ... Through hole 3 ... Anisotropic conductive film 4 ... IC chip 5 ... Reinforcing metal foil 6 ... Connection terminal 7 ... Capacitor 71, 72, 73 ... Capacitor electrodes 8 ... Through hole 10, 11 ... Adhesive sheet 12, 13 ... Core sheet 14,15 ... Overseat 50 ... Resin sealing 60 ... Reinforcing plate 100 ... Module 200 ... Card R20, R21, R22 ... Resist

Continued front page    (72) Inventor Hiroyuki Yamaguchi             1-1-1, Ichigaya-Kagacho, Shinjuku-ku, Tokyo             Dai Nippon Printing Co., Ltd. F-term (reference) 2C005 MA10 NA09 NA31 NA35 NB34                       PA03 PA04 PA14 PA19 PA26                       PA29 RA05 RA06 RA09                 5B035 AA08 BA05 BB09 CA03 CA23

Claims (25)

[Claims] 1. An IC module having an insulating substrate, an antenna coil formed on the insulating substrate, and a signal processing IC chip mounted on the insulating substrate, wherein the IC chip is mounted. An IC module in which a first reinforcing plate is formed on the surface of the insulating substrate opposite to the surface on which the IC chip is mounted at the position of the insulating substrate. 2. The IC module according to claim 1, wherein the first reinforcing plate is made of the same material as the antenna coil. 3. A second reinforcing plate formed on the surface of the insulating substrate opposite to the surface on which the first reinforcing plate is formed, at a position where the IC chip is mounted. 1
Or the IC module described in 2. 4. The first reinforcing plate and the second reinforcing plate are conductive members, and the first reinforcing plate that is a first electrode and the second reinforcing plate that is a second electrode. The IC module according to claim 3, wherein a reinforcing plate and the insulating substrate that is a dielectric form a capacitor, and the IC chip is mounted on at least a part of the capacitor. 5. The first electrode of the capacitor is further formed on a surface of the insulating substrate on which the second electrode is formed, and the IC chip is formed on the surface of the insulating substrate. The IC module according to claim 4, wherein the IC module is mounted astride the formed region of the first electrode and the formed region of the second electrode. 6. The first device on which the IC chip is mounted
6. The IC module according to claim 5, wherein edges of the electrode and the second electrode are displaced from the center of the IC chip. 7. The IC module according to claim 3, wherein the IC chip is mounted on the insulating substrate via an anisotropic conductive film. 8. The IC module according to claim 3, wherein the IC chip is mounted on the insulating substrate and sealed with resin. 9. The IC according to claim 1, further comprising a reinforcing plate formed on a surface of the IC chip opposite to a surface in contact with the insulating substrate.
module. 10. An IC module manufacturing method for forming a reinforcing plate of an IC module having an insulating substrate, an antenna coil formed on the insulating substrate, and a signal processing IC chip mounted on the insulating substrate. A part of the first reinforcing plate and the antenna coil is provided on the surface of the insulating substrate opposite to the surface on which the IC chip is mounted at the position of the insulating substrate on which the IC chip is mounted. A method of manufacturing an IC module, comprising: a first reinforcing plate forming step of simultaneously forming the same; and a mounting step of mounting the IC chip. 11. A second reinforcing plate and a part of the antenna coil are provided on a surface opposite to a surface on which the insulating substrate and the first reinforcing plate are formed, at a position where the IC chip is mounted. The method of manufacturing an IC module according to claim 10, further comprising a step of forming a second reinforcing plate that is formed at the same time. 12. The first reinforcing plate and the second reinforcing plate are conductive members, and the first reinforcing plate that is a first electrode and the second reinforcing plate that is a second electrode. The IC module manufacturing according to claim 11, wherein a capacitor is formed by a reinforcing plate and the insulating substrate that is a dielectric, and the IC chip is mounted on at least a part of the capacitor in the mounting step. Method. 13. In the second reinforcing plate forming step,
A first electrode of the capacitor and a second electrode of the capacitor are formed on the surface of the insulating substrate opposite to the surface on which the first reinforcing plate is formed at the position where the IC chip is mounted. A step of forming a through hole and electrically connecting the first electrode formed on one surface of the insulating substrate and the first electrode formed on the opposite surface of the insulating substrate. The IC module manufacturing method according to claim 12, wherein, in the mounting step, the IC chip is mounted across the first electrode and the second electrode formed on one surface of the insulating substrate. 14. In the mounting step, the IC chip is straddled over a first electrode and a second electrode formed on one surface of the insulating substrate, and the first electrode and the second electrode are formed. 14. The IC module manufacturing method according to claim 13, wherein the edge of the IC chip is mounted while being displaced from the center of the IC chip. 15. The method of manufacturing an IC module according to claim 10, wherein in the mounting step, the IC chip is mounted via an anisotropic conductive film. 16. The method of manufacturing an IC module according to claim 10, further comprising a step of resin-sealing the IC chip. 17. The method of manufacturing an IC module according to claim 10, further comprising a step of forming a reinforcing plate on a surface of the IC chip opposite to a surface in contact with the insulating substrate. 18. A reinforcing plate for an IC card containing an insulating substrate, an antenna coil formed on the insulating substrate, and an IC module having a signal processing IC chip and a capacitor mounted on the insulating substrate. Forming the IC
A method for manufacturing a card, comprising: a first reinforcing plate on the surface of the insulating substrate opposite to the surface on which the IC chip is mounted at the position of the insulating substrate on which the IC chip is mounted; and the antenna coil. A method of manufacturing an IC card, comprising: a first reinforcing plate forming step of forming a part of the IC chip; a mounting step of mounting the IC chip; and a step of covering the IC module with a protective layer. 19. At a position where the IC chip is mounted, a second reinforcing plate and a part of the antenna coil are provided on a surface opposite to a surface on which the insulating substrate and the first reinforcing plate are formed. The method according to claim 1, further comprising a step of forming a second reinforcing plate.
8. The IC card manufacturing method according to item 8. 20. The first reinforcing plate and the second reinforcing plate are conductive members, and the first reinforcing plate that is a first electrode and the second reinforcing plate that is a second electrode. 20. The IC card manufacturing according to claim 19, wherein a capacitor is formed by a reinforcing plate and the insulating substrate that is a dielectric, and the IC chip is mounted on at least a part of the capacitor in the mounting step. Method. 21. In the second reinforcing plate forming step,
A first electrode of the capacitor and a second electrode of the capacitor are formed on the surface of the insulating substrate opposite to the surface on which the first reinforcing plate is formed at the position where the IC chip is mounted. A step of forming a through hole and electrically connecting the first electrode formed on one surface of the insulating substrate and the first electrode formed on the opposite surface of the insulating substrate. 21. The IC card manufacturing method according to claim 20, wherein in the mounting step, the IC chip is mounted by straddling a first electrode and a second electrode formed on one surface of the insulating substrate. 22. In the mounting step, the IC chip is straddled over a first electrode and a second electrode formed on one surface of the insulating substrate, and the first electrode and the second electrode are formed. 22. The IC card manufacturing method according to claim 21, wherein the edge of the IC chip is mounted so as to be displaced from the center of the IC chip. 23. The IC card manufacturing method according to claim 18, wherein in the mounting step, the IC chip is mounted via an anisotropic conductive film. 24. The IC card manufacturing method according to claim 18, further comprising a step of sealing the IC chip with a resin. 25. The method of manufacturing an IC card according to claim 18, further comprising a step of forming a reinforcing plate on a surface of the IC chip opposite to a surface in contact with the insulating substrate.