JP2003049388A - Fabric comprising flat aramid fiber - Google Patents
Fabric comprising flat aramid fiberInfo
- Publication number
- JP2003049388A JP2003049388A JP2001240532A JP2001240532A JP2003049388A JP 2003049388 A JP2003049388 A JP 2003049388A JP 2001240532 A JP2001240532 A JP 2001240532A JP 2001240532 A JP2001240532 A JP 2001240532A JP 2003049388 A JP2003049388 A JP 2003049388A
- Authority
- JP
- Japan
- Prior art keywords
- single yarn
- cloth
- fabric
- aramid fiber
- flattened
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Reinforced Plastic Materials (AREA)
- Artificial Filaments (AREA)
- Nonwoven Fabrics (AREA)
- Paper (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、例えば電気・電子
分野で使用される半導体配線基板に好適に用いることが
できるアラミド繊維からなる布帛に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fabric made of aramid fiber which can be preferably used for a semiconductor wiring board used in the fields of electricity and electronics.
【０００２】[0002]
【従来の技術】半導体配線基板、プリント配線板等、特
に多層配線基板は導体層を設けた絶縁基材、例えばペー
パー状の布帛を複数枚、多層状に積層し、接合すること
により構成されている。そして、これら配線板を構成す
る各絶縁基材に設けた導体層は、その上下方向における
任意の導体層との間にスルーホール、インビアナホー
ル、ブラインドホールと呼ばれる導通穴を介して電気的
に接続される。一方、近年の電子機器の高性能化、小型
化、軽量化に伴い、配線基板には高密度化の要求に対応
することが必要となっている。2. Description of the Related Art A semiconductor wiring board, a printed wiring board, etc., especially a multilayer wiring board, is constructed by laminating a plurality of insulating base materials provided with conductor layers, for example, paper-like cloths in a multi-layered manner and joining them together. There is. Then, the conductor layer provided on each insulating base material that constitutes these wiring boards is electrically connected to an arbitrary conductor layer in the vertical direction through a through hole, an inverana hole, or a conduction hole called a blind hole. Connected. On the other hand, with the recent trend toward higher performance, smaller size, and lighter weight of electronic devices, it is necessary for wiring boards to meet the demand for higher density.
【０００３】上記要求に対応するために、積層する布
帛、例えばペーパー状基材を薄くすることが考えられ、
そのために単糸の直径を細くすることが好適であると思
われるが、紡糸する際に径の細い口金を使用して径の細
い（例えばシングルミクロン）繊維を製造することは工
程管理が困難であり、生産性も低下し、さらには高コス
ト化する等の問題から、直径を細くする以外の手法の出
現が望まれている。In order to meet the above requirements, it is conceivable to thin the fabric to be laminated, for example, a paper-like substrate,
Therefore, it seems preferable to reduce the diameter of the single yarn, but it is difficult to control the process when producing a fiber with a small diameter (for example, single micron) using a spinneret with a small diameter when spinning. In view of the problems that the productivity is lowered and the cost is further increased, the emergence of a method other than the method of reducing the diameter is desired.
【０００４】[0004]
【発明が解決しようとする課題】本発明の目的は、例え
ば半導体配線基板等に好適に用いられ、より簡便かつ低
コストで製造される薄型布帛を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a thin cloth which is suitable for use in, for example, a semiconductor wiring board and which can be manufactured more simply and at low cost.
【０００５】[0005]
【課題を解決するための手段】本発明者らは、上記課題
を鋭意検討した結果、布帛、例えばペーパーを構成する
単糸に着目し、単糸を扁平化することで、従来のペーパ
ーより厚さが顕著に薄いペーパーが作製できるというこ
とを見出した。より詳しくは、アラミド繊維の長径の長
さ（ａ）と短径の長さ（ｂ）との比（ａ／ｂ）を例えば
２以上にすることにより、従来のペーパーより厚さが薄
いペーパーを得ることに成功した。さらに検討を重ね、
本発明を完成するに至った。本発明での布帛とは、織物
または編物等の織布と不織布の両方を意味する。Means for Solving the Problems As a result of intensive studies on the above problems, the present inventors have focused on a single yarn constituting a cloth, for example, paper, and flattened the single yarn to make it thicker than a conventional paper. It was found that a paper having a significantly small thickness can be produced. More specifically, by setting the ratio (a / b) of the major axis length (a) and the minor axis length (b) of the aramid fiber to 2 or more, for example, a paper thinner than conventional paper can be obtained. I got it successfully. Further examination,
The present invention has been completed. The cloth in the present invention means both a woven cloth and a non-woven cloth such as a woven cloth or a knitted cloth.
【０００６】すなわち、本発明は、[１]単糸断面が扁平
化されたアラミド繊維からなることを特徴とする布帛、
[２]布帛が不織布であることを特徴とする前記[１]に記
載の布帛、[３]扁平化された単糸断面の長径の長さ
（ａ）と短径の長さ（ｂ）の比（ａ／ｂ）が２以上であ
ることを特徴とする前記[１]〜[２]に記載の布帛、[４]
単糸の扁平化が（ａ）扁平型の口金を用いて扁平化した
単糸を得る方法、（ｂ）真円状の単糸を加圧して扁平化
した単糸を得る方法および（ｃ）真円状の単糸を含む糸
条からなる布帛を加圧する方法のいずれかまたは１以上
の方法で行うことを特徴とする前記[１]〜[３]に記載の
布帛の製造方法、[５] 前記[１]に記載の扁平化したア
ラミド繊維からなる布帛を含有する半導体配線基板用プ
リプレグに関する。[0006] That is, the present invention [1] a fabric characterized by comprising a flat aramid fiber having a single yarn cross section,
[2] The cloth according to the above [1], wherein the cloth is a non-woven cloth, [3] of the major axis length (a) and the minor axis length (b) of the flattened single yarn cross section. The cloth according to the above [1] to [2], wherein the ratio (a / b) is 2 or more, [4]
Flattening of a single yarn is (a) a method for obtaining a flattened single yarn using a flat die, (b) a method for pressing a perfectly circular single yarn to obtain a flattened single yarn, and (c) The method for producing a fabric according to the above [1] to [3], characterized in that it is carried out by any one of or a method of pressing a fabric made of a yarn containing a perfect circular single yarn, [5] ] It relates to a prepreg for a semiconductor wiring board, which contains a cloth made of the flattened aramid fiber according to the above [1].
【０００７】[0007]
【発明の実施の形態】本発明に用いられるアラミド繊維
（芳香族ポリアミド繊維）は、その成分によりパラ系と
メタ系とに分けられる。パラ系は強力や弾性に優れ、引
張強力はナイロン（強力タイプ）の２．５倍の強さがあ
り、メタ系は耐熱性や難燃性に優れている。本発明に用
いられるアラミド繊維としては、パラ系が好ましく、具
体的には、パラ系アラミド繊維として、ポリパラフェニ
レンテレフタルアミド繊維（東レ・デュポン株式会社
製、商品名ケブラー）およびコポリパラフェニレン−
３，４’−ジフェニルエーテルテレフタルアミド繊維
（帝人株式会社製、商品名テクノーラ）等が挙げられ
る。中でも、ポリパラフェニレンテレフタルアミド繊維
（東レ・デュポン株式会社製、商品名ケブラー）が特に
好適に用いられる。BEST MODE FOR CARRYING OUT THE INVENTION The aramid fiber (aromatic polyamide fiber) used in the present invention is classified into a para type and a meta type depending on its component. The para type has excellent strength and elasticity, the tensile strength is 2.5 times stronger than nylon (strong type), and the meta type has excellent heat resistance and flame retardancy. The aramid fiber used in the present invention is preferably a para-type aramid fiber, and specifically, as the para-type aramid fiber, polyparaphenylene terephthalamide fiber (manufactured by Toray DuPont Co., Ltd., trade name: Kevlar) and copolyparaphenylene-
3,4'-diphenyl ether terephthalamide fiber (manufactured by Teijin Limited, trade name Technora) and the like can be mentioned. Among them, polyparaphenylene terephthalamide fiber (Kevlar, trade name, manufactured by Toray DuPont Co., Ltd.) is particularly preferably used.
【０００８】本発明の単糸断面が扁平化されたアラミド
繊維からなる布帛を得る方法としては、（ａ）扁平型の
口金を用いて紡糸し、扁平状単糸を得た後に布帛を形成
する方法、単糸を加圧する方法として（ｂ）真円型の口
金を用いて紡糸した真円状単糸に加圧処理を施して扁平
状単糸を得た後に、扁平状単糸を用いて布帛を形成する
方法、さらに所望により布帛を加圧する方法として
（ｃ）真円状の単糸を含む糸条からなる布帛を形成した
後に布帛を加圧する方法等が挙げられる。以下、例とし
て、好ましい実施の態様を説明する。As a method of obtaining a fabric made of aramid fibers having a flat single yarn cross section according to the present invention, (a) a flat type spinneret is used to obtain a flat single yarn, and then the fabric is formed. As a method for pressing a single yarn, (b) a flat single yarn is obtained by subjecting a perfect single yarn spun using a true circular die to a pressure treatment to obtain a flat single yarn. Examples of the method for forming the cloth and, if desired, the method for pressing the cloth include the method of forming the cloth (c) consisting of yarns containing a single circular yarn and then pressing the cloth. Hereinafter, a preferred embodiment will be described as an example.
【０００９】扁平型の口金を用いて扁平な単糸を製造す
るためには、公知の方法に従ってよい。具体的には、扁
平型の口金を用いること以外は、常法に従って、製造す
ることができる。扁平型の口金としては、例えば、楕円
形あるいは矩形の口金が挙げられる。特に、本発明では
矩形の口金を用いるのが好ましい。矩形の口金を用いて
も、楕円形つまり扁平断面を有する単糸が得られる。矩
形の口金を用いて扁平な断面をもつ単糸を製造する好ま
しい態様としては、例えば、本発明で好適に用いられる
パラ系アラミド繊維を約９９．９重量％程度の濃硫酸に
溶かし、ポリマー濃度約１９．０重量％程度、温度約８
０℃程度の紡糸ドープとし、溶融押出機にて上述した矩
形孔を有する口金から押し出し、わずかなエアギャップ
を通過させた後、約４℃程度の水中にて凝固させ、ネル
ソンローラに導き、水酸化ナトリウム水溶液で中和処理
し、温水で水洗後、ホットローラーで約１１０℃程度、
約１５秒間程度乾燥させると扁平化したアラミド繊維か
らなる単糸を得ることができる。In order to manufacture a flat single yarn using a flat die, a known method may be used. Specifically, it can be manufactured by a conventional method except that a flat die is used. Examples of the flat die include an elliptical or rectangular die. Particularly, in the present invention, it is preferable to use a rectangular base. Even with a rectangular spinneret, a single yarn with an oval or flat cross section is obtained. As a preferred embodiment for producing a single yarn having a flat cross section using a rectangular spinneret, for example, a para-aramid fiber preferably used in the present invention is dissolved in about 99.9% by weight of concentrated sulfuric acid to obtain a polymer concentration. About 19.0% by weight, temperature about 8
A spinning dope at about 0 ° C. was extruded from the spinneret having the above-mentioned rectangular holes with a melt extruder, passed through a slight air gap, then solidified in water at about 4 ° C., and led to a Nelson roller, and water was added. Neutralize with an aqueous solution of sodium oxide, wash with warm water, then use a hot roller at about 110 ° C.
A single yarn made of flattened aramid fiber can be obtained by drying for about 15 seconds.
【００１０】前述したように扁平型の口金を用いること
により得られた扁平状単糸を用いて、布帛を形成する方
法は、自体公知の方法に従ってよい。織布または不織布
を形成してもよいし、編物であってもかまわない。以
下、例として、布帛化する方法の好ましい態様について
説明する。As described above, the method for forming a fabric using the flat single yarn obtained by using the flat die may be a method known per se. Woven or non-woven fabric may be formed, or knitted fabric may be used. Hereinafter, as an example, a preferred embodiment of the method for forming a cloth will be described.
【００１１】本発明に係る布帛としては、中でも不織布
が特に好ましい。不織布とは繊維（短繊維あるいは長繊
維）集合体を機械的、化学的あるいは加熱等の手段を用
いて接着または交絡させてシート状またはウェブ構造に
したものをいう。不織布としては、表面が平滑なペーパ
ー状のものでもよいし、表面が平滑でない布状のもので
もよい。不織布は製造工程が短く、比較的低コストで生
産できるという利点を有する。不織布の製造工程は、３
つの基本的な工程をとっており、ウェブの形成、ウ
ェブの接着・結合、仕上げである。またウェブをつく
る方法は、乾式と湿式とがあり、本発明の目的を損なわ
ない限り、どのような製造方法をとってもかまわない
が、湿式の方がより好ましい。湿式法による好ましい実
施の態様として例えば下記の方法が挙げられる。原料繊
維を水中で叩解し、均一に分散させ、金網上（長網また
は円網式）に流出させて脱水し、乾燥させてウェブを作
る。これは紙を作る方法とまったく同じ方法でウェブが
作られる。異種の原料繊維を均一に混合することも可能
で、繊維結合剤は抄紙前に混合するか、ウェブが出来上
がってから、スプレーまたは浸漬で付与され、繊維同士
を接着する。この方法で作られた不織布は、紙の製法と
同じように作られているため、布よりも紙に近い性質が
ある。また原料のブレンドを変えることによって、耐湿
性、対候性、耐薬品性、電気絶縁性等の性質を高めるこ
とができる。Among the fabrics according to the present invention, non-woven fabric is particularly preferable. The non-woven fabric refers to a sheet (or web) structure obtained by adhering or entanglement of an aggregate of fibers (short fibers or long fibers) using a means such as mechanical, chemical or heating. The non-woven fabric may be a paper-like one having a smooth surface or a cloth-like one having a non-smooth surface. Nonwoven fabric has an advantage that it can be produced at a relatively low cost with a short manufacturing process. The manufacturing process of non-woven fabric is 3
It takes two basic steps: forming the web, bonding and joining the web, and finishing. Further, there are a dry method and a wet method for making a web, and any manufacturing method may be used as long as the object of the present invention is not impaired, but the wet method is more preferable. The following method is mentioned as a preferable embodiment of the wet method. The raw material fibers are beaten in water, uniformly dispersed, drained on a wire net (long wire or cylinder type), dehydrated, and dried to form a web. This makes the web exactly the same way you make paper. It is also possible to uniformly mix different kinds of raw fibers, and the fiber binder is mixed before papermaking or is applied by spraying or dipping after the web is completed to bond the fibers together. Since the non-woven fabric made by this method is made in the same manner as the paper is made, it has properties closer to paper than cloth. Further, by changing the blend of the raw materials, properties such as moisture resistance, weather resistance, chemical resistance, and electrical insulation can be enhanced.
【００１２】扁平化したアラミド繊維単糸からなる不織
布を製造するさらに好ましい態様としては、例えば、得
られた扁平化アラミド繊維を約３ｍｍ長程度にカット
し、これを水に分散させ、タッピー式角型抄紙機を用い
て秤量約５５ｇ／ｍ２程度の紙を抄紙し、必要に応じて
二枚の金属メッシュにはさんで熱風乾燥機中で、約１５
０℃程度、約５分間程度の乾燥を行うことにより、該ペ
ーパー状不織布を製造することができる。In a further preferred embodiment of producing a non-woven fabric composed of flattened aramid fiber single yarn, for example, the obtained flattened aramid fiber is cut into a length of about 3 mm, which is dispersed in water to form a tappy angle. Using a paper machine, weigh about 55 g / m 2 of paper, and if necessary, sandwich it between two metal meshes in a hot air drier for about 15
The paper-like nonwoven fabric can be produced by drying at about 0 ° C. for about 5 minutes.
【００１３】不織布を製造する乾式法による好ましい実
施の態様として、例えば下記の方法が挙げられる。乾式
法には、カード法とエアレイ法がある。供給される繊維
の束は、塊やモツレが残っているため、いったん繊維を
ほぐし、それと同時に縮んでいる繊維を引き伸ばし、そ
れぞれを並行状態に並べ、極めて薄い皮膜のようなウェ
ブを作る。この時使用する機械がカード（梳綿機ともい
う）といわれるもので、この作業をカーディングとい
う。カーディングは、細い針金が付いたロールの間に繊
維を通して行われるが、こうしたウェブの製法をカード
法という。カーディングによって得られる繊維は縦に整
列した薄いウェブ状なので、カードを直列に並べて多層
ウェブを作る。この方法では、縦の引張強度が大きな多
層ウェブが得られるが、カードを交差させる方法もとら
れている。この方法で得られる不織布は、柔軟性に富
み、ドレープ性に優れている。解きほぐされた原料繊維
は、適量ずつ空気（エア）の流れに乗せて飛散させなが
ら送られ、これを金網の上に降らせてウェブを形成する
のがエアレイ法である。エアを利用しているため、繊維
の配列が不規則で方向性のないウェブが得られる。また
金網ベルトのスピードを遅くすることによって厚手のウ
ェブを得ることができる。こうして作られた不織布は、
柔軟性に富み、ドレープ性にも優れている。これらの方
法はいずれも公知方法に従って行われてよい。As a preferred embodiment of the dry method for producing a non-woven fabric, the following method may be mentioned. The dry method includes the card method and the air lay method. Since the bundle of fibers supplied has lumps and mottle remaining, it loosens the fibers and at the same time stretches the shrinking fibers and arranges them in parallel to form an extremely thin film-like web. The machine used at this time is called a card (also called carding machine), and this work is called carding. Carding is performed by passing fibers between rolls with thin wires, and the method of making such a web is called the card method. Since the fibers obtained by carding are in the form of thin webs aligned vertically, the cards are placed in series to make a multilayer web. In this method, a multilayer web having a large longitudinal tensile strength can be obtained, but a method of crossing cards is also used. The nonwoven fabric obtained by this method is highly flexible and has excellent drapeability. In the air laying method, the unraveled raw material fibers are sent while being carried by an appropriate amount of air on the flow of air (air) and dropped onto a wire mesh to form a web. The use of air results in a non-oriented web with irregular fiber alignment. A thick web can be obtained by reducing the speed of the wire mesh belt. The non-woven fabric made in this way
It is highly flexible and has excellent drapeability. Any of these methods may be performed according to known methods.
【００１４】本発明に係る布帛は、織布または編物であ
ってもよい。織布の製造方法としては、公知の方法に従
ってよい。織成の方法（織り方）としては、例えば、平
織、綾織、からみ織、朱子織、三軸織、横縞織または斜
文織等他、いかなるものであってもよい。交繊は、例え
ばジェット織機（エアージェット織機、ウォータージェ
ット織機）、スルザー織機またはレピヤー織機等の自体
公知の織機を用いる等、自体公知の方法に従って容易に
行うことができる。また、編み方としては、例えば、平
編み、ゴム編みまたはパール編みなどの横編み、シング
ルデンビ編、シングルコード編、二目編などの縦編み、
レース編、浮き編、パイル編等が挙げられる。また、単
糸に限らず、マルチフィラメント、製紐糸等を用いて織
成または編成してもよい。The cloth according to the present invention may be a woven cloth or a knitted cloth. The woven fabric may be manufactured by a known method. The weaving method (weaving method) may be any method such as plain weave, twill weave, leno weave, satin weave, triaxial weave, horizontal striped weave or twill weave. The interlacing can be easily carried out according to a method known per se, for example, using a known loom such as a jet loom (air jet loom, water jet loom), a sulzer loom, or a lepier loom. As the knitting method, for example, flat knitting, horizontal knitting such as rubber knitting or pearl knitting, single denbi knitting, single cord knitting, warp knitting such as second stitch knitting,
Examples include lace knitting, floating knitting, and pile knitting. Further, it is not limited to a single yarn, and may be woven or knitted using a multifilament, a string yarn or the like.
【００１５】真円状の単糸を加圧して扁平な単糸を製造
する方法としては、公知の方法に従ってよい。真円状の
単糸を加圧して扁平化させる工程を導入すること以外
は、常法に従って製造することができる。真円状の単糸
を加圧して扁平な単糸を製造する好ましい態様として
は、例えば本発明で好適に用いられるパラ系アラミド繊
維を約９９．９重量％程度の濃硫酸に溶かし、ポリマー
濃度約１９．０重量％程度、温度約８０℃程度の紡糸ド
ープとし、真円状の口金を有する口金から押し出し、わ
ずかなエアギャップを通過させた後、約４℃程度の水中
にて凝固させ、ネルソンローラに導き、水酸化ナトリウ
ム水溶液で中和処理し、温水で水洗する。水洗後、繊維
に含まれる水含有量が約１０〜１００重量％程度となる
ように乾燥処理する。この後、線圧が約１〜１００ｋｇ
／ｃｍ程度に調整された約２００〜４００℃程度の金属
製熱ロールで、当該単糸の上下方向から加熱加圧するこ
とによって、本発明にかかる扁平化したアラミド繊維を
得ることができる。参考までに水含有量が約１０重量％
程度以下では繊維の緻密化が進み、加熱加圧しても、単
糸の扁平化が起こらない。また、水含有量が約１００重
量％程度以上では水分の加熱と蒸発に熱が取られ、単糸
を加熱できないので単糸の扁平化が起こらない。また線
圧が約１ｋｇ／ｃｍ程度以下では圧力が弱すぎて単糸の
扁平化が起こらない。一方線圧が約１００ｋｇ／ｃｍ程
度以上では単糸が破壊したりくっついたりするので、好
ましくない。As a method for producing a flat single yarn by pressing a perfect circular single yarn, a known method may be used. It can be manufactured according to a conventional method except that a step of pressurizing a perfect circular single yarn to flatten it is introduced. As a preferred embodiment for producing a flat single yarn by pressing a perfect circular single yarn, for example, a para-aramid fiber suitably used in the present invention is dissolved in about 99.9% by weight of concentrated sulfuric acid to obtain a polymer concentration. About 19.0% by weight, a spinning dope with a temperature of about 80 ° C., extruded from a die having a perfect circular die, allowed to pass through a slight air gap, and then solidified in water of about 4 ° C., It is led to a Nelson roller, neutralized with an aqueous sodium hydroxide solution, and washed with warm water. After washing with water, the fiber is dried so that the water content in the fiber is about 10 to 100% by weight. After this, the linear pressure is about 1-100kg
The flattened aramid fiber according to the present invention can be obtained by heating and pressurizing the single yarn from above and below with a metal heating roll of about 200 to 400 ° C. adjusted to about / cm. For reference, the water content is about 10% by weight
Below a certain degree, the fibers will be densified, and even if they are heated and pressed, flattening of the single yarn does not occur. Further, when the water content is about 100% by weight or more, heat is taken to heat and evaporate the water, and the single yarn cannot be heated, so that the flatness of the single yarn does not occur. Further, when the linear pressure is about 1 kg / cm or less, the pressure is too weak and flattening of the single yarn does not occur. On the other hand, if the linear pressure is about 100 kg / cm or more, the single yarn may break or stick, which is not preferable.
【００１６】前述したように、真円状単糸を加熱加圧す
ることにより得られた扁平状単糸を用いて、布帛を形成
する方法は、先に述べたような自体公知の方法にしたが
ってよい。布帛としては、織布でも不織布でもかまわな
い。As described above, the method for forming the cloth by using the flat single yarn obtained by heating and pressing the perfect circular single yarn may be a method known per se as described above. . The cloth may be woven or non-woven.
【００１７】真円状単糸からなる布帛を加圧して、扁平
化したアラミド繊維からなる布帛を形成する方法として
は、公知の方法に従ってもよい。この場合の布帛の例と
して、上記と同様、不織布、織物、編物等が挙げられ
る。真円状単糸からなる布帛をローラで上下方向に加圧
して、単糸を扁平化すること以外は、常法に従って製造
することができる。真円状単糸からなる布帛を加圧し
て、本発明にかかる扁平化したアラミド繊維からなる布
帛を形成する好ましい態様としては、例えば、先と同様
に真円状単糸を形成し、繊維に含まれる水含有量を約１
０〜１００重量％程度に保ったまま、布帛化する。この
布帛を線圧が約１〜１００ｋｇ／ｃｍ程度に調整された
約２００〜４００℃程度の金属製熱ロールで、布帛を形
成している単糸の上下方向から加熱加圧することによっ
て、本発明にかかる扁平化したアラミド繊維からなる布
帛を得ることができる。参考までに水含有量が約１０重
量％程度以下では繊維の緻密化が進み、加熱加圧して
も、単糸の扁平化が起こらない。また、水含有量が約１
００重量％程度以上では水分の加熱と蒸発に熱が取ら
れ、単糸を加熱できないので単糸の扁平化が起こらな
い。また線圧が約１ｋｇ／ｃｍ程度以下では圧力が弱す
ぎて単糸の扁平化が起こらない。一方線圧が約１００ｋ
ｇ／ｃｍ程度以上では単糸が破壊したりくっついたりす
るので、好ましくない。布帛は、不織布、織布のどちら
であってもよく、布帛を製造する方法としては、扁平化
したアラミド繊維単糸から形成した布帛（不織布または
織布）と同様な方法で製造することができるし、公知の
方法に従ってかまわない。例えば、不織布を形成する方
法としては、湿潤状態の膨潤した真円状単糸からなる繊
維を常法により切断し、湿式で製造した不織布を加熱加
圧することによって、本発明にかかる扁平化したアラミ
ド繊維からなる不織布を得ることもできる。すなわち、
真円状単糸からなる水含有量が約１０〜１００重量％程
度のパラ系アラミド繊維の水含有率を保ったまま常法に
より布帛を作り、その後連続繊維と同じ方法で加熱加圧
処理することにより扁平化したアラミド繊維からなる布
帛を得てもかまわない。また、織布を形成する方法とし
ては、湿潤状態の膨潤した真円状単糸からなる繊維を織
成または編成する方法が挙げられる。織成および編成方
法は、先に述べたような自体公知の方法に従ってよい。A known method may be used as a method for pressurizing a cloth made of a perfect circular single yarn to form a cloth made of flattened aramid fibers. Examples of the cloth in this case include a non-woven fabric, a woven fabric, a knitted fabric, and the like, as in the above. It can be manufactured according to a conventional method, except that a cloth made of a perfect circular single yarn is pressed vertically by a roller to flatten the single yarn. As a preferred embodiment of pressurizing a fabric made of a perfect circular single yarn to form a fabric made of a flattened aramid fiber according to the present invention, for example, a perfect circular single yarn is formed in the same manner as described above, and a fiber is formed. About 1 water content
Fabrication is carried out while maintaining about 0 to 100% by weight. By heating and pressing this cloth from the vertical direction of the single yarn forming the cloth with a metal heating roll of about 200 to 400 ° C. whose linear pressure is adjusted to about 1 to 100 kg / cm, the present invention A fabric made of the flattened aramid fiber can be obtained. For reference, when the water content is about 10% by weight or less, the densification of the fiber proceeds, and even if it is heated and pressed, the flatness of the single yarn does not occur. Also, the water content is about 1
If it is more than about 100% by weight, heat is taken for heating and evaporation of water, and the single yarn cannot be heated, so that the flatness of the single yarn does not occur. Further, when the linear pressure is about 1 kg / cm or less, the pressure is too weak and flattening of the single yarn does not occur. On the other hand, the line pressure is about 100k
If it is about g / cm 2 or more, the single yarn may break or stick, which is not preferable. The cloth may be either a non-woven cloth or a woven cloth, and the method for manufacturing the cloth can be the same as that for the cloth (non-woven cloth or woven cloth) formed from the flattened aramid fiber single yarn. However, a known method may be used. For example, as a method of forming a non-woven fabric, a fiber made of swollen true circular single yarn in a wet state is cut by a conventional method, and a non-woven fabric produced by a wet process is heated and pressed to obtain a flattened aramid according to the present invention. It is also possible to obtain a non-woven fabric made of fibers. That is,
A fabric is made by a conventional method while maintaining the water content of the para-aramid fiber having a water content of about 10 to 100% by weight consisting of a perfect circular single yarn, and then heat-pressurized in the same manner as the continuous fiber. A fabric made of flattened aramid fibers may be obtained. As a method of forming a woven cloth, a method of weaving or knitting fibers made of swollen perfect circular single yarn in a wet state can be mentioned. The weaving and knitting methods may be the methods known per se as described above.
【００１８】また、所望により、布帛を形成後に、布帛
表面を平滑化する工程を行ってもよい。例えばカレンダ
ー処理を行って、繊維表面を平滑化するとよい。該カレ
ンダー処理は、公知の方法に従って行われてよく、例え
ば熱ロールを用いる方法が挙げられる。If desired, a step of smoothing the surface of the cloth may be performed after forming the cloth. For example, calendering may be performed to smooth the fiber surface. The calender treatment may be carried out according to a known method, and examples thereof include a method using a heat roll.
【００１９】扁平化したアラミド繊維単糸断面の長径の
長さをａ、短径の長さをｂとした時、ａ／ｂは通常約
１．３〜７程度、より好ましくは約２〜４程度である。
約２以上であると、従来の布帛に比べて、顕著に薄い布
帛を作製できるため、特に好ましい。When the major axis length of the flattened aramid fiber single yarn cross section is a and the minor axis length is b, a / b is usually about 1.3 to 7, more preferably about 2 to 4. It is a degree.
When it is about 2 or more, a fabric which is remarkably thin as compared with a conventional fabric can be produced, which is particularly preferable.
【００２０】本発明のアラミド繊維の単糸繊度は約０．
１〜１０デニール程度であることが好ましい。アラミド
繊維は織物、不織布、紙等のシート形態としての基材で
あってもよく、また例えばエポキシ樹脂中に分散されて
なる短繊維形態としての基材であってもよい。不織布や
紙等の形態において、アラミド繊維は短繊維あるいはフ
ィブリル状パルプのいずれの形態でもよく、またこれら
の任意の組み合わせからなる混合物であってもよい。さ
らに目的を損なわない範囲で加圧熱処理に耐える他の繊
維、例えば、ガラス繊維、炭素繊維、ポリエーテルケト
ン繊維、ポリエーテルエーテルケトン繊維、ポリエーテ
ルイミド繊維、ポリイミド繊維、全芳香族ポリエステル
繊維、ポリフェニレンサルファイド繊維またはセラミッ
ク繊維等を混合してもよい。この場合の割合は約４０重
量％程度以下、好ましくは約３０重量％程度以下であ
る。The single yarn fineness of the aramid fiber of the present invention is about 0.
It is preferably about 1 to 10 denier. The aramid fiber may be a substrate in the form of a sheet such as a woven fabric, a non-woven fabric or paper, or may be a substrate in the form of a short fiber dispersed in an epoxy resin. In the form of non-woven fabric or paper, the aramid fibers may be in the form of short fibers or fibril pulp, or may be a mixture of any combination thereof. Further, other fibers resistant to heat treatment under pressure within the range not impairing the purpose, for example, glass fiber, carbon fiber, polyetherketone fiber, polyetheretherketone fiber, polyetherimide fiber, polyimide fiber, wholly aromatic polyester fiber, polyphenylene. Sulfide fibers or ceramic fibers may be mixed. In this case, the proportion is about 40% by weight or less, preferably about 30% by weight or less.
【００２１】上記にしたように製造された扁平化された
アラミド繊維からなる布帛は、単糸断面を扁平化したこ
とで、隣り合う単糸間の接着面積が大きくなるので、強
度が高い。また、このアラミド繊維からなる布帛は、さ
らに加工されて、例えば半導体配線基板用プリプレグ等
に用いられる。この際、布帛表面をより平滑にするため
に、自体公知のカレンダー処理を行うことが好ましい。
例えば、ホットロールにて、布帛を加圧する方法が挙げ
られる。こうして得られた布帛は、より薄いペーパー、
布帛、基板を必要としている産業分野において好適に用
いることが可能である。The fabric made of the flattened aramid fibers produced as described above has a high strength because the flattened cross section of the single yarn increases the bonding area between the adjacent single yarns. The cloth made of this aramid fiber is further processed and used, for example, as a prepreg for a semiconductor wiring board. At this time, in order to make the surface of the fabric smoother, it is preferable to perform calendering treatment known per se.
For example, a method of pressing the cloth with a hot roll may be mentioned. The cloth thus obtained is a thinner paper,
It can be preferably used in an industrial field requiring a cloth or a substrate.
【００２２】本発明により得られる扁平化されたアラミ
ド繊維からなる布帛を用いて半導体配線基板用プリプレ
グを製造する好ましい態様としては、例えば、自体公知
の方法により、例えば難燃性エポキシ樹脂等の熱硬化性
樹脂を含む組成物を不織布または織布に含浸させて、約
１５０℃程度で約５分間程度乾熱処理を施し、樹脂含浸
プリプレグを作製することができる。さらに、得られた
プリプレグから、半導体配線基板を作製する方法も、自
体公知の方法に従ってよい。好ましい一態様としては、
例えば、このプリプレグを適宜所望の枚数を積層し、約
１７０℃程度、圧力約４０ｋｇ／ｃｍ２程度で、約６０
分間、ホットプレスによる加圧成形を行って、プリント
配線基板を得ることができる。また、この加圧成形時に
銅箔を同時に積層し、銅張積層板を作製することも可能
である。As a preferred embodiment for producing a prepreg for a semiconductor wiring board by using a cloth made of the flattened aramid fiber obtained by the present invention, for example, a heat-resistant epoxy resin or the like can be prepared by a method known per se. A resin-impregnated prepreg can be prepared by impregnating a nonwoven fabric or a woven fabric with a composition containing a curable resin and subjecting it to a dry heat treatment at about 150 ° C. for about 5 minutes. Furthermore, a method for producing a semiconductor wiring board from the obtained prepreg may be a method known per se. In a preferred embodiment,
For example, by laminating a desired number of these prepregs as appropriate, at about 170 ° C. and a pressure of about 40 kg / cm 2 , about 60
The printed wiring board can be obtained by performing pressure molding by hot pressing for a minute. It is also possible to laminate a copper foil at the same time during this pressure molding to produce a copper clad laminate.
【００２３】[0023]
【実施例】本発明を実施例を用いてより詳細に説明す
る。しかし、本発明はこれらに限定されるものではな
い。EXAMPLES The present invention will be described in more detail by way of examples. However, the present invention is not limited to these.
【００２４】〔実施例１〕発煙硫酸に溶解させた８０℃
のポリパラフェニレンテレフタルアミド２０重量％溶液
をａ／ｂ＝２の口金から４℃の凝固浴に吐出し、水洗、
中和、乾燥して１．５デニール、ａ／ｂ＝２の単糸から
なるアラミド繊維を得た。これを３ｍｍに切断し、エポ
キシバインダーを加えて、タッピー式角形抄紙機を用い
て目付５５ｇ／ｍ２の紙を抄紙し、１５０℃で約５分間
乾燥後、２５０℃でカレンダー処理した。この紙の見か
け厚さは５０μｍであった。比較のため、真円からなる
口金で紡糸した場合には、得られた紙の厚さは６５μｍ
であった。Example 1 80 ° C. dissolved in fuming sulfuric acid
20% by weight solution of polyparaphenylene terephthalamide of is discharged from a die of a / b = 2 into a coagulation bath at 4 ° C., washed with water,
It was neutralized and dried to obtain an aramid fiber composed of a single yarn of 1.5 denier and a / b = 2. This was cut into 3 mm, an epoxy binder was added, and a paper having a basis weight of 55 g / m 2 was made using a tappy type square paper machine, dried at 150 ° C. for about 5 minutes, and then calendered at 250 ° C. The apparent thickness of this paper was 50 μm. For comparison, when spun using a spinneret consisting of a perfect circle, the thickness of the obtained paper is 65 μm.
Met.
【００２５】〔実施例２〕発煙硫酸に溶解させた８０℃
のポリパラフェニレンテレフタルアミド２０重量％溶液
を真円の口金から４℃の凝固浴に吐出し、水洗、中和
後、乾燥して１．５デニールで水分を４０重量％含有す
る真円断面を持つ単糸からなるアラミド繊維を得た。こ
れをさらに３５０℃、線圧３０ｋｇ／ｃｍの金属製ホッ
トローラーで加熱・加圧処理し、ａ／ｂが約２の単糸か
らなるアラミド繊維を得た。これを３ｍｍに切断し、エ
ポキシバインダーを加えて、タッピー式角形抄紙機を用
いて目付５５ｇ／ｍ２の紙を抄紙し、１５０℃で約５分
間乾燥し、２５０℃でカレンダー処理した。この紙の見
かけ厚さは５０μｍであった。Example 2 80 ° C. dissolved in fuming sulfuric acid
Of 20% by weight of polyparaphenylene terephthalamide solution is discharged into a coagulation bath at 4 ° C. from a perfect circular die, washed with water, neutralized, and dried to obtain a perfect circular cross section containing 40% by weight of water at 1.5 denier. An aramid fiber composed of a single yarn was obtained. This was further heated / pressurized with a metal hot roller having a linear pressure of 30 kg / cm at 350 ° C. to obtain an aramid fiber composed of a single yarn with a / b of about 2. This was cut into 3 mm, an epoxy binder was added, and a paper having a basis weight of 55 g / m 2 was made using a tappy type square paper machine, dried at 150 ° C. for about 5 minutes, and calendered at 250 ° C. The apparent thickness of this paper was 50 μm.
【００２６】〔実施例３〕発煙硫酸に溶解させた８０℃
のポリパラフェニレンテレフタルアミド２０重量％溶液
を真円の口金から４℃の凝固浴に吐出し、水洗、中和
後、乾燥して１．５デニールで水分を６０重量％含有す
る真円断面を持つ単糸からなるアラミド繊維を得た。こ
れを３ｍｍに切断し、エポキシバインダーを加えて、タ
ッピー式角形抄紙機を用いて目付５５ｇ／ｍ２の紙を抄
紙し、１００℃で約２分間乾燥し、３０重量％含有する
布帛を得た。これをさらに、３５０℃、線圧３０ｋｇ／
ｃｍでカレンダー処理した。得られた紙の見かけ厚さは
５０μｍであった。また、紙の中から繊維をとりだし
て、顕微鏡で観察したところ、該繊維はａ／ｂが約２で
ある単糸であった。Example 3 80 ° C. dissolved in fuming sulfuric acid
20 wt% solution of polyparaphenylene terephthalamide of No. 1 is discharged from a true circular die into a coagulation bath at 4 ° C., washed with water, neutralized and dried to obtain a true circular cross section containing 60 wt% of water at 1.5 denier. An aramid fiber composed of a single yarn was obtained. This was cut into 3 mm, an epoxy binder was added thereto, paper having a basis weight of 55 g / m 2 was made using a tappy type square paper machine, and dried at 100 ° C. for about 2 minutes to obtain a fabric containing 30% by weight. . This is further heated at 350 ° C and linear pressure of 30 kg /
It was calendered in cm. The apparent thickness of the obtained paper was 50 μm. When the fibers were taken out from the paper and observed with a microscope, the fibers were single yarns with a / b of about 2.
【００２７】[0027]
【発明の効果】本発明の扁平化したアラミド繊維からな
る布帛は、従来のペーパー基板より厚さが顕著に薄いペ
ーパーが提供できるので、例えば半導体配線基板等、薄
板の要求の高い産業分野へ応用できる。また、本発明の
扁平化したアラミド繊維からなる布帛は、製造方法が簡
便であり、特別な装置を必要としないので、低コストで
製造することができ、有益である。EFFECTS OF THE INVENTION Since the cloth made of the flattened aramid fiber of the present invention can provide a paper having a significantly smaller thickness than the conventional paper substrate, it can be applied to industrial fields in which thin plates are highly demanded such as semiconductor wiring substrates. it can. Further, the fabric made of the flattened aramid fiber of the present invention is advantageous in that it can be produced at a low cost because the production method is simple and no special device is required.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｃ０８Ｌ 63:00 Ｃ０８Ｌ 63:00 Ｚ Ｆターム(参考） 4F072 AA04 AA07 AB06 AB15 AB29 AD11 AD23 AG03 AL13 4L035 BB03 DD02 EE01 FF01 LC04 4L047 AA24 AB09 BA21 CB05 CC13 4L055 AF35 AF44 AF46 AG87 AH37 BD10 BE20 EA16 FA30 GA01 GA50 ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 7 Identification code FI theme code (reference) C08L 63:00 C08L 63:00 ZF term (reference) 4F072 AA04 AA07 AB06 AB15 AB29 AD11 AD23 AG03 AL13 4L035 BB03 DD02 EE01 FF01 LC04 4L047 AA24 AB09 BA21 CB05 CC13 4L055 AF35 AF44 AF46 AG87 AH37 BD10 BE20 EA16 FA30 GA01 GA50
Claims (5)
らなることを特徴とする布帛。1. A fabric comprising a aramid fiber whose single yarn cross section is flattened.
求項１に記載の布帛。2. The cloth according to claim 1, wherein the cloth is a non-woven fabric.
（ａ）と短径の長さ（ｂ）の比（ａ／ｂ）が２以上であ
ることを特徴とする請求項１〜２に記載の布帛。3. The ratio (a / b) of the major axis length (a) and the minor axis length (b) of the flattened single yarn cross section is 2 or more. The fabric according to 2.
いて行われる方法、（ｂ）真円状の単糸を加圧して行わ
れる方法、および（ｃ）真円状の単糸を含む糸条からな
る布帛を加圧して行われる方法のいずれかまたは１以上
の方法で行われることを特徴とする請求項１〜３記載の
布帛の製造方法。4. A method of flattening a single yarn by using (a) a flat die, (b) a method of pressurizing a perfect circular single yarn, and (c) a perfect circular shape. The method for producing a fabric according to any one of claims 1 to 3, wherein the method is performed by any one of the methods performed by pressurizing a fabric made of a yarn including a single yarn, or by one or more methods.
維からなる布帛を含有する半導体配線基板用プリプレ
グ。5. A prepreg for a semiconductor wiring board, which contains a cloth made of the flattened aramid fiber according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001240532A JP2003049388A (en) | 2001-08-08 | 2001-08-08 | Fabric comprising flat aramid fiber |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001240532A JP2003049388A (en) | 2001-08-08 | 2001-08-08 | Fabric comprising flat aramid fiber |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003049388A true JP2003049388A (en) | 2003-02-21 |
Family
ID=19071129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001240532A Pending JP2003049388A (en) | 2001-08-08 | 2001-08-08 | Fabric comprising flat aramid fiber |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003049388A (en) |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006200066A (en) * | 2005-01-20 | 2006-08-03 | Teijin Techno Products Ltd | Aromatic polyamide fiber paper and prepreg using the same |
| JP2007294927A (en) * | 2006-03-30 | 2007-11-08 | Kyocera Corp | Wiring board and mounting structure body, and manufacturing method of the wiring board |
| JP2008257710A (en) * | 2007-03-13 | 2008-10-23 | Semiconductor Energy Lab Co Ltd | Semiconductor device and manufacturing method thereof |
| US7785933B2 (en) | 2007-03-26 | 2010-08-31 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| US8240030B2 (en) | 2009-08-07 | 2012-08-14 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing electronic device |
| US8338931B2 (en) | 2007-03-26 | 2012-12-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and product tracing system utilizing the semiconductor device having top and bottom fibrous sealing layers |
| JP5173085B1 (en) * | 2012-02-09 | 2013-03-27 | 日本カラリング株式会社 | Composite hinge sheet, laser marking multilayer sheet for electronic passport and electronic passport |
| US8432254B2 (en) | 2008-01-31 | 2013-04-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US8558370B2 (en) | 2007-03-13 | 2013-10-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device with antenna |
| US8563397B2 (en) | 2008-07-09 | 2013-10-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US8642899B2 (en) | 2009-10-21 | 2014-02-04 | Semiconductor Energy Laboratory Co., Ltd. | Terminal structure, electronic device, and manufacturing method thereof |
| US9087950B2 (en) | 2009-06-05 | 2015-07-21 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device and method for manufacturing the same |
| WO2016170050A1 (en) | 2015-04-22 | 2016-10-27 | Teijin Aramid B.V. | Cord comprising multifilament para-aramid yarn comprising non-round filaments |
| KR101992447B1 (en) * | 2018-04-27 | 2019-06-25 | 주식회사 휴비스 | Dope dyed meta-aramid flat fiber |
| JP2020074497A (en) * | 2008-04-25 | 2020-05-14 | 株式会社半導体エネルギー研究所 | Semiconductor device |
| WO2022220234A1 (en) | 2021-04-12 | 2022-10-20 | ニッポン高度紙工業株式会社 | Circuit board unwoven fabric, circuit board prepreg using same, and circuit board using same |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6039463A (en) * | 1983-08-09 | 1985-03-01 | 帝人株式会社 | Aromatic polyamide fiber nonwoven sheet |
| JPH05163610A (en) * | 1991-12-18 | 1993-06-29 | Teijin Ltd | Aromatic polyamide flat yarn |
| JPH073693A (en) * | 1993-01-19 | 1995-01-06 | Sumitomo Chem Co Ltd | Production of para-aromatic polyamide paper |
| JPH08127994A (en) * | 1994-10-28 | 1996-05-21 | Honshu Paper Co Ltd | Nonwoven fabric for multilayer printed circuit board |
| JPH1072726A (en) * | 1996-07-02 | 1998-03-17 | Du Pont Toray Co Ltd | Production of multifilament elastic yarn |
| JPH10102393A (en) * | 1996-09-27 | 1998-04-21 | Oji Paper Co Ltd | Nonwoven fabric for laminated plate |
| JP2001123389A (en) * | 1999-08-19 | 2001-05-08 | Teijin Ltd | Aromatic polyamide fiber paper |
| JP2002275796A (en) * | 2001-01-10 | 2002-09-25 | Teijin Ltd | Heat-resistant tissue paper, prepreg made therefrom, and laminate for printed board |
-
2001
- 2001-08-08 JP JP2001240532A patent/JP2003049388A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6039463A (en) * | 1983-08-09 | 1985-03-01 | 帝人株式会社 | Aromatic polyamide fiber nonwoven sheet |
| JPH05163610A (en) * | 1991-12-18 | 1993-06-29 | Teijin Ltd | Aromatic polyamide flat yarn |
| JPH073693A (en) * | 1993-01-19 | 1995-01-06 | Sumitomo Chem Co Ltd | Production of para-aromatic polyamide paper |
| JPH08127994A (en) * | 1994-10-28 | 1996-05-21 | Honshu Paper Co Ltd | Nonwoven fabric for multilayer printed circuit board |
| JPH1072726A (en) * | 1996-07-02 | 1998-03-17 | Du Pont Toray Co Ltd | Production of multifilament elastic yarn |
| JPH10102393A (en) * | 1996-09-27 | 1998-04-21 | Oji Paper Co Ltd | Nonwoven fabric for laminated plate |
| JP2001123389A (en) * | 1999-08-19 | 2001-05-08 | Teijin Ltd | Aromatic polyamide fiber paper |
| JP2002275796A (en) * | 2001-01-10 | 2002-09-25 | Teijin Ltd | Heat-resistant tissue paper, prepreg made therefrom, and laminate for printed board |
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006200066A (en) * | 2005-01-20 | 2006-08-03 | Teijin Techno Products Ltd | Aromatic polyamide fiber paper and prepreg using the same |
| JP2007294927A (en) * | 2006-03-30 | 2007-11-08 | Kyocera Corp | Wiring board and mounting structure body, and manufacturing method of the wiring board |
| US8558370B2 (en) | 2007-03-13 | 2013-10-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device with antenna |
| JP2008257710A (en) * | 2007-03-13 | 2008-10-23 | Semiconductor Energy Lab Co Ltd | Semiconductor device and manufacturing method thereof |
| JP4519924B2 (en) * | 2007-03-13 | 2010-08-04 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor device |
| US7968427B2 (en) | 2007-03-13 | 2011-06-28 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
| US8552418B2 (en) | 2007-03-13 | 2013-10-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US7785933B2 (en) | 2007-03-26 | 2010-08-31 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| US8338931B2 (en) | 2007-03-26 | 2012-12-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and product tracing system utilizing the semiconductor device having top and bottom fibrous sealing layers |
| US8432254B2 (en) | 2008-01-31 | 2013-04-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP2020074497A (en) * | 2008-04-25 | 2020-05-14 | 株式会社半導体エネルギー研究所 | Semiconductor device |
| US8563397B2 (en) | 2008-07-09 | 2013-10-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US9087950B2 (en) | 2009-06-05 | 2015-07-21 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device and method for manufacturing the same |
| US8240030B2 (en) | 2009-08-07 | 2012-08-14 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing electronic device |
| US8642899B2 (en) | 2009-10-21 | 2014-02-04 | Semiconductor Energy Laboratory Co., Ltd. | Terminal structure, electronic device, and manufacturing method thereof |
| WO2013118283A1 (en) * | 2012-02-09 | 2013-08-15 | 日本カラリング株式会社 | Composite hinge sheet, laser marking multilayer sheet for electronic passport, and electronic passport |
| JP5173085B1 (en) * | 2012-02-09 | 2013-03-27 | 日本カラリング株式会社 | Composite hinge sheet, laser marking multilayer sheet for electronic passport and electronic passport |
| WO2016170050A1 (en) | 2015-04-22 | 2016-10-27 | Teijin Aramid B.V. | Cord comprising multifilament para-aramid yarn comprising non-round filaments |
| US10633767B2 (en) | 2015-04-22 | 2020-04-28 | Teijin Aramid B.V. | Cord comprising multifilament para-aramid yarn comprising non-round filaments |
| KR101992447B1 (en) * | 2018-04-27 | 2019-06-25 | 주식회사 휴비스 | Dope dyed meta-aramid flat fiber |
| WO2022220234A1 (en) | 2021-04-12 | 2022-10-20 | ニッポン高度紙工業株式会社 | Circuit board unwoven fabric, circuit board prepreg using same, and circuit board using same |
| KR20230169170A (en) | 2021-04-12 | 2023-12-15 | 듀폰 세이프티 앤드 컨스트럭션, 인크. | Nonwoven fabric for circuit boards, prepreg for circuit boards using the same, and circuit boards using the same |
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