JP2002348553A - Pressure-sensitive adhesive tape or sheet for securing end of winding around electronic part element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive tape for securing the end of winding around an electronic part element having excellent adhesion characteristics at high temperatures and having a thin type pressure-sensitive adhesive layer. SOLUTION: This pressure-sensitive adhesive tape or sheet for securing the end of the winding around the electronic part element is characterized by having a radiation curing pressure-sensitive adhesive layer having 5-100 μm thickness on one surface of a substrate film, wherein a back surface treating layer containing a radiation-polymerizable component may be provided on the surface opposite to the pressure-sensitive adhesive layer of the substrate film. Furthermore, an electronic part subjected to the securing of the end of the winding with the pressure-sensitive adhesive tape or sheet for securing the end of the winding around the electronic part element is provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive tape or sheet for winding an electronic component element wound around an outer peripheral portion of an electronic component element such as a capacitor element, and more particularly to, for example, a wet or dry aluminum electrolytic capacitor. The present invention relates to a pressure-sensitive adhesive tape for winding a capacitor element for preventing unwinding of a winding end portion of a roll of a surface-oxidized aluminum foil and electrolytic paper or a separator.

[0002]

2. Description of the Related Art A wet or dry wound aluminum electrolytic capacitor is a capacitor element in which an aluminum foil (electrode foil) having an etched and oxidized surface and an electrolytic paper or separator made of manila hemp are alternately stacked and wound. Is inserted into an aluminum can (metal case) together with an electrolytic solution. The outermost layer may be an electrode foil, an electrolytic paper or a separator.

Conventionally, as means for preventing the winding end portion of the wound capacitor element from being unwound, means for directly applying a pressure-sensitive adhesive to the outermost electrolytic paper or separator and bonding and fixing the same can be used. Alternatively, a means is employed in which an adhesive tape having a tape width approximately equal to the height of the capacitor element is attached to and fixed to the outermost periphery of the wound body one or more times so that the tape width direction is the height direction of the capacitor element. ing. The adhesive tape for winding used in the latter means is mainly an adhesive tape using biaxially stretched polyethylene terephthalate (PET), polypropylene (PP), polyphenylene sulfide (PPS) or the like as a support base material, or unstretched. Adhesive tapes using polyimide (PI) or polyetherimide (PEI) as a support base material are used.

In recent years, the miniaturization of electronic components has progressed, and there has been a demand for miniaturization and thinning of device-winding components for electronic components such as capacitors. Further, in the case of chip components for surface mounting, higher heat resistance of, for example, 250 ° C. or more is required at the time of solder reflow due to an increase in solder melting temperature due to lead removal in recent years. Therefore, an adhesive tape or sheet having a rubber-based or silicone-based adhesive layer based on an engineering plastic film such as a polyester film or a polyimide film having high-temperature heat resistance has often been used. However, the adhesive strength is reduced as a result of thinning the pressure-sensitive adhesive layer for miniaturization, and the heat resistance is poor in a rubber-based pressure-sensitive adhesive layer, while the silicone-based pressure-sensitive adhesive layer is excellent in heat resistance. Since the adhesive strength at high temperature is reduced, the end of the attached tape or sheet is peeled off, and there has been no satisfactory use for element winding.

[0005]

SUMMARY OF THE INVENTION It is an object of the present invention to provide an adhesive composition having excellent adhesive properties at high temperatures even if the pressure-sensitive adhesive layer has a small thickness.
It is intended to obtain an adhesive tape or sheet for winding electronic component elements.

[0006]

Means for Solving the Problems The inventors of the present invention have conducted intensive studies to achieve the above object, and as a result, have used a radiation-transmissive film for a base material and further containing a radiation-curable pressure-sensitive adhesive. According to the pressure-sensitive adhesive tape or sheet using the layer, it has been found that the element can be more firmly adhered by curing the pressure-sensitive adhesive layer by irradiating the tape to the capacitor element and then irradiating radiation from the back side of the tape, and the present invention. Was completed.

That is, the present invention provides a pressure-sensitive adhesive tape or sheet for winding an electronic component element, which has a radiation-curable pressure-sensitive adhesive layer having a thickness of 5 to 100 μm on one surface of a substrate film. At this time, it is preferable to have a back surface treatment layer containing a radiation curable component on the surface of the base film opposite to the pressure-sensitive adhesive layer.

The present invention also provides an electronic component wound with an adhesive tape or sheet for winding an electronic component element having a radiation-curable pressure-sensitive adhesive layer having a thickness of 5 to 100 μm on one side of a base film.

[0009]

Embodiments of the present invention will be described below with reference to the drawings as necessary. FIG. 1 is a schematic sectional view showing an example of an adhesive tape or sheet for winding an electronic component element of the present invention. The adhesive tape or sheet for winding the electronic component element includes a back surface treatment layer 1, a substrate 2,
It comprises a radiation-curable pressure-sensitive adhesive layer 3 and a release film 4.

The base film used as the base material 2 of the pressure-sensitive adhesive tape or sheet is not particularly limited as long as it can transmit radiation, and various films can be used. A film is used. Such films include, for example, polyolefin-based films such as polyethylene films, polypropylene (PP) films, polybutene films, polybutadiene films, and polymethylpentene films; polyvinyl chloride-based films such as polyvinyl chloride films and vinyl chloride copolymer films. Polyester film such as polyethylene terephthalate (PET) film, polybutylene terephthalate (PBT) film, polyethylene naphthalate (PEN); polyarylate film; polyurethane film; ethylene-vinyl acetate copolymer film; ionomer resin film; Poly (meth) acrylic acid-based films such as (meth) acrylic acid copolymer films and ethylene- (meth) acrylate copolymer films; Li polyphenylene sulfide (PPS) film; polyimide (PI) film; polystyrene films; polycarbonate films; polyamide films and their crosslinked films, porous films or composites, and the like. These films may be laminated and used. Particularly, a PET film is preferably used.

The thickness of the base film can be appropriately selected within a range that does not impair the workability of winding the electronic component element, etc.
Generally, it is about 5 to 100 μm, preferably about 9 to 50 μm. The surface of the substrate film may be subjected to a conventional physical or chemical treatment such as a release agent treatment, a mat treatment, a corona discharge treatment, a primer treatment, or the like, if necessary.

The radiation-curable pressure-sensitive adhesive layer 3 can be composed of a known or commonly used radiation-curable pressure-sensitive adhesive composition. As a typical example of such a radiation-curable pressure-sensitive adhesive composition, for example,
(I) an adhesive component, (ii) a radiation-curable component, (iii)
The composition includes a photopolymerization initiator and, if necessary, a conventional additive such as a crosslinking agent, a tackifier, a plasticizer, a filler, an antioxidant, and a coloring agent.

The term “radiation-curable” used herein refers to, for example, ultraviolet rays, laser beams, α rays, β rays, γ rays, X rays,
Irradiation of radiation such as an electron beam to the pressure-sensitive adhesive tape or sheet induces the growth of a molecular chain and a crosslinking reaction, and means that the curable component is cured.

The pressure-sensitive adhesive component (i) includes an acrylic pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, a silicone-based pressure-sensitive adhesive and the like.

As the acrylic pressure-sensitive adhesive, those usually used for pressure-sensitive adhesive tapes can be used. (A) The main monomer having a low glass transition point (50-100
Weight percent), (B) a comonomer having a high glass transition point that gives adhesion and cohesion (about 0 to 50 weight%), and (C) a functional group-containing monomer (monoethylene for crosslinking and improving adhesion). (Unsaturated unsaturated monomer) (about 0 to 50% by weight) and the like.

Examples of the main monomer (A) include ethyl acrylate, butyl acrylate, amyl acrylate,
Alkyl acrylates or cycloalkyl acrylates such as 2-ethylhexyl acrylate, cyclohexyl acrylate, octyl acrylate, and benzyl acrylate; methacryls such as butyl methacrylate, 2-ethylhexyl methacrylate, cyclohexyl methacrylate, and benzyl methacrylate Examples thereof include acid alkyl esters and cycloalkyl methacrylates. These monomers can be used alone or in combination of two or more. Usually, the glass transition point (T
Compounds having g) of -50 ° C or lower are used.

Examples of the comonomer (B) include (meth) acrylates having a small number of carbon atoms, such as methyl acrylate, methyl methacrylate, and ethyl methacrylate; vinyl acetate, vinyl propionate, vinyl ether, styrene, acrylonitrile, methacrylic acid. Examples include vinyl group-containing compounds such as lonitrile. These monomers can be used alone or in combination of two or more. Usually, a compound having a higher Tg of the homopolymer than the main monomer (A) is used.

Examples of the functional group-containing monomer (C) include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, crotonic acid, maleic acid, fumaric acid, and itaconic acid;
Hydroxyl group-containing monomers such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, N-methylolacrylamide, and allyl alcohol; dimethylaminoethyl (meth) acrylate, diethylamino Tertiary amino group-containing monomers such as ethyl (meth) acrylate and dimethylaminopropyl (meth) acrylate; amide group-containing monomers such as amyrilamide and methacrylamide; N-methyl (meth) acrylamide, N-ethyl (meth) acrylamide and N N-substituted amide group-containing monomers such as -methoxymethyl (meth) acrylamide, N-ethoxymethyl (meth) acrylamide, Nt-butylacrylamide, N-octylacrylamide; Epoxy group-containing monomers such as Gilles methacrylate.

As the rubber-based pressure-sensitive adhesive, a natural rubber or a synthetic rubber is used as a main polymer, and a pressure-sensitive adhesive polymer material, a phenolic antioxidant, a metal oxide or the like is blended as necessary. it can.

As the silicone-based pressure-sensitive adhesive, for example, a polysiloxane containing an alkyl group or a phenyl group such as polydimethylsiloxane, polymethylphenylsiloxane or polydiphenylsiloxane as a silicone component, and a peroxide such as benzoyl peroxide are used. And a cured product obtained by an addition reaction between a vinyl group-containing polysiloxane and hydrosilane.

As the pressure-sensitive adhesive component (i), acrylic pressure-sensitive adhesives are preferably used, and those having a glass transition point of -20 ° C. or less are particularly preferable. Glass transition point is -2
When the temperature exceeds 0 ° C., the pressure-sensitive adhesive becomes hard depending on the use temperature, and the tackiness may not be maintained.

The weight-average molecular weight of the polymer used for the pressure-sensitive adhesive component (i) is not particularly limited.
It is 100,000, preferably 400,000 to 1,000,000. If the weight average molecular weight is less than 200,000, the adhesive strength and cohesive strength are weak.
If it exceeds 100,000, the pressure-sensitive adhesive becomes too hard, so that the pressure-sensitive adhesiveness becomes insufficient and the workability of sticking becomes poor.

As the pressure-sensitive adhesive component, any of a crosslinked type and a non-crosslinked type can be used. In the case of a cross-linking type, an appropriate cross-linking agent can be appropriately selected from the below-described cross-linking agents according to the functional group of each and used.

The radiation-curable component (ii) may be any monomer, oligomer, polymer or the like having a carbon-carbon double bond in the molecule and curable by radical polymerization. For example, hexanediol di (meth) acrylate, ethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, pentaerythritol tri (meth) acrylate, trimethylolpropane tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate ) Acrylic compounds such as acrylate, urethane acrylate, epoxy acrylate, and polyester acrylate; urethane (meth) acrylate; polyester (meth) acrylate; 2-propenyl di-3-butenyl cyanurate, 2-hydroxyethyl bis (2-acrylic) Cyanurates such as (roxyethyl) isocyanurate, tris (2-acryloxyethyl) isocyanurate and tris (2-methacryloxyethyl) isocyanurate Isocyanurate compounds, and their oligomers and polymers.
These can be used alone or in combination of two or more.

Among the above, when an acrylic monomer or oligomer is used, the curable component can be used at room temperature or low temperature.
In addition to being able to cure in a short time, it has excellent handling properties. In particular, those containing a reactive monomer or oligomer having an acryloyl group are preferable. When a compound containing two or more acryloyl groups is used, the formation of a stitch structure is sufficiently performed, and the cohesiveness of the pressure-sensitive adhesive is further improved. An adhesive layer is obtained.

The amount of the curable component (ii) used is, for example, about 0.05 to 50 parts by weight, preferably about 0.1 to 20 parts by weight, based on 100 parts by weight of the pressure-sensitive adhesive component (i).
When the radiation-curable component (ii) is less than 0.05 parts by weight, foaming and swelling due to the generated gas may not be sufficiently suppressed due to the cohesive force of the pressure-sensitive adhesive. On the other hand, 50
When used in excess of parts by weight, the pressure-sensitive adhesive layer becomes too hard, and the adhesive strength may be reduced.

The curable component (ii) preferably has good compatibility with the pressure-sensitive adhesive component (i). Also, the curable component (ii)
And the main component (A) of the pressure-sensitive adhesive component (i).

As the photopolymerization initiator (iii), any substance can be used as long as it is a substance which is cleaved by irradiation with radiation having an appropriate wavelength which can trigger the polymerization reaction to generate radicals.
For example, benzoins such as benzoin, benzoin methyl ether, benzoin ethyl ether, methyl o-benzoylbenzoate-p-benzoin ethyl ether, benzoin isopropyl ether, α-methyl benzoin; benzyl dimethyl ketal, trichloroacetophenone, 2,2-diene Acetophenones such as ethoxyacetophenone and 1-hydroxycyclohexylphenyl ketone; 2-hydroxy-2-methylpropiophenone,
Propiophenones such as -hydroxy-4'-isopropyl-2-methylpropiophenone; benzophenones such as benzophenone, methylbenzophenone, p-chlorobenzophenone and p-dimethylaminobenzophenone; 2-chlorothioxanthone and 2-ethylthioxanthone And thioxanthones such as 2-isopropylthioxanthone; benzyl; dibenzosuberone; and α-acyl oxime esters.

The amount of the polymerization initiator (iii) used is, for example, 0.5 to 30 with respect to 100 parts by weight of the curable component (ii).
It is about 1 part by weight, preferably about 1 to 20 parts by weight.

When an electron beam is used for the radiation used for the curing reaction of the pressure-sensitive adhesive, it is not necessary to add the polymerization initiator (iii). However, in this case, the progress of the curing reaction is significantly inhibited by the presence of oxygen. Therefore, even when the curing reaction is performed with the adhesive tape or sheet attached to the adherend, an inert gas atmosphere such as nitrogen is used. It is preferably performed under

Further, a polymerization accelerator can be used together with the polymerization initiator (iii). Examples of such a polymerization accelerator include 4,4′-bis (diethylamine) benzophenone, ethyl N-dimethylaminobenzoate, dimethylethanolamine, glycine, and the like.

The polymerization initiator (iii) and the polymerization accelerator may be added in the form of microcapsules in order to improve the stability during storage.

In addition to the above components, the radiation-curable pressure-sensitive adhesive composition includes, for example, rosin resins, terpene resins such as α-pinene and β-pinene, terpene-phenol resins, chroman-indene resins, and petroleum resins. , Styrene resin, xylene resin and other tackifiers; epoxy compounds, isocyanate compounds, metal chelates, metal alkoxides, metal salts, amine compounds, hydrazine compounds, aldehyde compounds, etc .; liquid polyethers, glycol esters , Liquid polyterpene, liquid polyacrylate, phthalate, trimellitate and other softeners (plasticizers); fillers; ultraviolet absorbers; antioxidants;
Various additives such as a pigment; a dye; and a silane coupling agent may be blended.

The thickness (dry film thickness) of the radiation-curable pressure-sensitive adhesive layer 3 is about 5 to 100 μm, preferably 10 to 60 μm.
m.

The base film constituting the release film 4 is not particularly limited as long as it is a film (including a sheet) capable of protecting the pressure-sensitive adhesive layer 3, and is, for example, a paper material such as glassine paper; Film, polypropylene film, resin film such as polyester and the like can be mentioned.

The release film 4 is formed on the surface of the base film to which the pressure-sensitive adhesive layer is applied, if necessary, of a silicone-based (including a radiation-curable component), a fluorine-based, a long-chain alkyl-based or a fatty acid amide-based release. The release agent can be treated with a mold agent, silica powder or the like.

The pressure-sensitive adhesive tape or sheet of the present invention has a basic structure of a base material 2, a radiation-curable pressure-sensitive adhesive layer 3, and a release film 4, but may further have a functional film laminated thereon. . For example, back treatment layer 1 containing a release component
May be provided on the back surface of the base material 2. In particular, in the case of an element winding application, when there is a portion that adheres to the tape's own back surface, in order to further increase the adhesive force to the own back surface, a back treatment layer containing a radiation polymerizable component is included. 1 may be provided on the back surface of the base material 2.

The release component constituting the back surface treatment layer 1 is not particularly limited, and examples thereof include a long-chain alkyl acrylate copolymer, a long-chain alkyl vinyl ether copolymer,
Long chain alkyl vinyl ester copolymers and the like can be mentioned. Examples of the radiopolymerizable component include various components exemplified as the pressure-sensitive adhesive component (i), the radiation-curable component (ii), and the photopolymerization initiator (iii) constituting the radiation-curable pressure-sensitive adhesive composition. Can be used.

As a method for producing the pressure-sensitive adhesive tape or sheet for winding electronic component elements of the present invention, an ordinary method for producing a pressure-sensitive adhesive tape can be applied. Specifically, for example, the radiation-curable pressure-sensitive adhesive composition is applied to the substrate 2 using a die or a comma coater.
The radiation-curable pressure-sensitive adhesive layer 3 is formed by transferring or applying to the substrate, and then dried (heat-crosslinked if necessary), and a release film 4 is bonded to the surface of the pressure-sensitive adhesive layer. Further, a method in which the radiation-curable pressure-sensitive adhesive composition is applied to the release film 4, dried, and then transferred onto the substrate 2 can be employed. As a method for applying the pressure-sensitive adhesive composition, for example, a flow coater, a knife coater, a roll coater, dipping, or the like can be used.

Further, when the back surface treatment layer 1 is provided, for example, after forming the radiation-curable pressure-sensitive adhesive layer 3 on the surface of the substrate 2 by the above-described method, the radiation-curable pressure-sensitive adhesive layer 3 The back surface treatment layer 1 can be formed by applying and drying a release component and / or a radiation polymerizable component in the same manner as in the method of forming the pressure-sensitive adhesive layer 3.

The adhesive tape or sheet for winding an electronic component element according to the present invention is, for example, a terminal stopper for winding an outer periphery of an electrolytic capacitor element having a structure in which an anode foil and a cathode foil are wound via an electrolytic paper or a separator. Useful (for winding).

[0042]

The pressure-sensitive adhesive tape or sheet of the present invention is applied to an adherend by irradiating it with radiation such as ultraviolet rays from the substrate film side after being adhered to the adherend to cure the adhesive layer. Expresses stronger adhesion. Further, after the pressure-sensitive adhesive is cured, for example, it is excellent in holding property to an adherend even under a high temperature such as solder reflow, and can be wound without causing peeling of a terminal, and is useful as a winding application of a wound capacitor or the like.

[0043]

EXAMPLES The present invention will be described below in more detail with reference to Examples, but the present invention is not limited to these Examples.

Example 1 An acrylate copolymer having a weight average molecular weight of 500,000 (adhesive component) obtained by copolymerizing 90 parts by weight of butyl acrylate and 10 parts by weight of acrylic acid in ethyl acetate by a conventional method. ), 5 parts by weight of propylene glycol diacrylate monomer as a radiation-curable component, 0.6 parts by weight of 1-hydroxycyclohexyl phenyl ketone as a photopolymerization initiator, and 1 part by weight of trimethylolpropane tolylene diisocyanate as a crosslinking agent Then, an acrylic radiation-curable pressure-sensitive adhesive composition was prepared.
The obtained pressure-sensitive adhesive composition is applied to one surface of a polyethylene terephthalate (PET) film (substrate) having a thickness of 25 μm, and is heat-crosslinked at 130 ° C. for 5 minutes to obtain a film having a thickness of 30 μm.
m of the radiation-curable pressure-sensitive adhesive layer was formed. Next, on the surface of the pressure-sensitive adhesive layer, a 38 μm-thick polyester film (trade name “Lumira S-10”, manufactured by Toray Co., Ltd.) obtained by applying a release agent treatment with silicone to the surface of the pressure-sensitive adhesive layer to be bonded (release film) Were laminated. Furthermore, on the opposite side of the pressure-sensitive adhesive layer of the substrate,
A coating solution prepared by dissolving 100 parts by weight of a polyvinyl acetate copolymer (weight average molecular weight: 500,000), 30 parts by weight of the radiation-curable component, and 1 part by weight of the photopolymerization initiator in toluene is applied as an adhesive component. Then, by drying at 100 ° C. for 3 minutes to form a back surface treatment layer having a thickness of less than 1 μm, a radiation-curable pressure-sensitive adhesive sheet (used as a tape or sheet for winding a capacitor element; the same applies to the following examples) was produced.

Example 2 A radiation-curable pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1, except that hexanediol diacrylate was used as the radiation-curable component instead of propylene glycol diacrylate monomer.

Example 3 In Example 1, the weight-average molecular weight was 5 as an adhesive component.
A radiation-curable pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1, except that an acrylic acid ester-based copolymer having a weight average molecular weight of 1.3 million was used instead of the 100,000 acrylic acid ester-based copolymer.

Example 4 In Example 1, except that the back surface treatment layer was not provided,
A radiation-curable pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1.

Example 5 A radiation-curable pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1, except that the release film was not adhered.

Comparative Example 1 An adhesive sheet was obtained in the same manner as in Example 3, except that the radiation-curable component and the photopolymerization initiator were not added.

Comparative Example 2 40 parts by weight of a terpene resin as a tackifying resin, 30 parts by weight of a petroleum resin, and an antioxidant (trade name "Sumilyzer NW", Sumitomo Chemical Co., Ltd.) in 100 parts by weight of natural rubber (adhesive component) 2 parts by weight (manufactured by K.K.) were added to prepare a rubber-based pressure-sensitive adhesive composition. A pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1, except that the rubber-based pressure-sensitive adhesive composition was used instead of the acrylic radiation-curable pressure-sensitive adhesive composition.

Evaluation Test The following tests were performed on each of the pressure-sensitive adhesive sheets obtained in Examples and Comparative Examples. Table 1 shows the results. (Heat resistance test) Each adhesive sheet was cut to a width of 20 mm, the release film was peeled off, and a stainless steel plate (SUS4
30BA) as an adherend, and then 5 kgf / cm
² was pressed for 10 seconds at a pressure of 0.49 MPa. The bonding area was 25 × 25 mm. The test piece was irradiated with ultraviolet light from the side of the sheet substrate, and 1 kgf (9.8
The load of N) was applied vertically from the sheet side, and the size of the displacement of the bonded portion after being left at 180 ° C. for 1 hour was measured. When the back surface of the sheet is used as the adherend instead of the stainless steel plate, the adhesive sheet is made of a stainless steel plate (SUS430B).
After adhering to A), the test was carried out in the same manner as described above, using a test piece with the pressure-sensitive adhesive sheet adhered in a laminated form. (End Peeling Test) A release film was peeled from each pressure-sensitive adhesive sheet and temporarily bonded to the end portion of the wound capacitor element, and then ultraviolet irradiation was performed from the sheet substrate surface side. After the sheet was left at 180 ° C. for 1 hour, the terminal peeling state of the sheet was visually observed. When no peeling was observed, it was judged as ○, and when peeling occurred, it was judged as ×.

[Table 1]

As shown in Table 1, each of the pressure-sensitive adhesive sheets of Examples 1 to 5 has excellent holding properties to the adherend at high temperatures, and is suitable for use in fixing elements such as wound capacitors at high temperatures. Peeling of the sheet was not observed. In contrast, in each of the pressure-sensitive adhesive sheets of Comparative Examples 1 and 2,
The retention of the adherend at a high temperature was not sufficient, and even when the device was used for winding a device, end peeling of the sheet occurred at a high temperature.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing an example of an adhesive tape for winding an electronic component element of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Back treatment layer 2 Base material 3 Radiation curable adhesive layer 4 Release film

Continued on the front page F-term (reference) 4F100 AK01B AK22J AK25J AK42 AR00C AT00A BA02 BA03 BA07 BA10B BA10C CA02 CA30 EH46 EJ05 GB41 JB14B JB20C JL13B YY00B 4J004 AA04 AA05 AA10 A05CA05 CC04 CC04 CC04 CC EK03 FA131 GA07 GA14 GA19 GA22 HB14 HB18 HB44 JB07 KA13 KA26 LA01 LA06 LA08 LA09 MA10 MB03 NA19 NA20 PA32

Claims (3)

[Claims] 1. A base material film having a thickness of 5 to 100
An adhesive tape or sheet for winding electronic component elements, comprising a radiation-curable adhesive layer having a thickness of μm. 2. The pressure-sensitive adhesive tape or sheet according to claim 1, further comprising a back treatment layer containing a radiation-polymerizable component on the surface of the base film opposite to the pressure-sensitive adhesive layer. 3. An electronic component wound with the adhesive tape or sheet for winding an electronic component element according to claim 1.