JP2002344092A - Printed board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed board, capable of suppressing travel of the shock at the time of fall, etc., to a mounting section for mounting components, without increasing the size of the case for housing the printed board. SOLUTION: An arcuate slit section 21 is formed between a fixing section 2 for fixing a printed board on a case and a wiring section 5, on which mounting components 7, etc., are mounted, and the sections 2 and 5 are connected by a connecting section 22 between the section 21. Accordingly, without having provide to a shock-absorbing member separately from the printed board 1, the shock propagating to the section 2 from the case due to a fall is absorbed by the deformation of the section 22, having rigidity lower than that of the section 2 or 5, and thereby suppressing the propagation of the shock to the section 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a printed circuit board, and more particularly to a printed circuit board having impact resistance.

[0002]

2. Description of the Related Art Heretofore, as a printed circuit board used for electronic equipment such as a portable type, a printed circuit board having a fixing portion fixed by screws or the like inside a housing is known. For example, as shown in FIG. 5A, a printed circuit board 101 arranged in a housing 51 is provided on a boss 53 inside a bottom surface 52 of the housing 51 as shown in FIG. 5B. Some female screws are fixed by screwing a screw 11 through the through hole 4.

Here, the boss 53 of the printed circuit board 101 is used.
Is a fixing portion 2 of the printed circuit board 101. The portion of the printed circuit board 101 other than the fixing portion 2 is a wiring portion 5 in which a desired conductor pattern 6 is formed on the surface of the insulating base material 3, and is provided on a land portion (component mounting portion) 6 a of the conductor pattern 6. Are mounted components 7 by solder 8.

[0006] FIG. 5A shows only the arrangement of the printed circuit board 101 in the housing 51, and includes a cover portion and screws 11 of the housing 51, a conductor pattern 6, a mounting component 7,
The illustration of the solder 8, the solder resist film and the like is omitted. FIG. 5B is a cross-sectional view of the periphery of one fixing portion 2 of the printed circuit board 101 shown in FIG. 5A, and electrically connects the solder resist film and the conductor patterns 6 on both front and rear surfaces of the substrate. Illustration of the interlayer connection part is omitted.

In such a printed circuit board 101, an impact is transmitted from the housing 51 to the printed circuit board 101 when an electronic device is accidentally dropped on a floor or the like. When the impact is transmitted to the printed circuit board 101, for example, FIG.
As shown in (1), the wiring section 5 of the printed circuit board 101 is deformed.

[0006] At this time, in the solder 8 for connecting the mounting component 7 provided on the land 6a near the fixing portion 2, deformation stress may be generated in the joint 8a with the land 6a, and the joint 8a may be deformed. When the deformation stress of the portion 8a is large,
There may be a problem that the reliability of connection between the conductor pattern 6 and the mounting component 7 is reduced.

As a technique for solving such a problem,
Japanese Patent Application Laid-Open No. H11-55370 discloses a technique in which a housing is provided with a shock absorbing member.
There is a technology in which an impact absorbing member is provided between a printed board and a housing, as in the technology disclosed in Japanese Patent No. 163575.

[0008]

However, in the techniques disclosed in the above publications, there is a problem that the structure of the electronic device becomes complicated and the size of the housing becomes large because the shock absorbing member is provided.

[0009] The present invention has been made in view of the above points,
It is an object of the present invention to provide a printed circuit board capable of suppressing an impact such as a drop when it is dropped from being transmitted to a mounting section on which components are mounted, without increasing the size of a housing for housing the printed circuit board.

[0010]

In order to achieve the above object, according to the first aspect of the present invention, a fixing portion (2) for fixing in a housing (51) and a component (7) are mounted. A printed circuit board having a wiring portion (5) on which a conductor pattern (6) including a mounting portion (6a) is formed, wherein a shock absorbing portion (5) is provided between the fixed portion (2) and the wiring portion (5). 21, 2
2).

According to this, the shock at the time of drop transmitted from the housing (51) to the fixing portion (2) of the printed circuit board (1) is absorbed by the shock absorbing portions (21, 22). Therefore, there is no need to provide an impact absorbing member separately from the printed circuit board (1). In this way, it is possible to suppress the transmission of the impact to the mounting portion (6a) on which the component (7) is mounted without increasing the size of the housing for housing the printed circuit board.

According to the second aspect of the present invention, the shock absorbing portions (21, 22) are provided on a part of the outer periphery of the fixed portion (2).
It is characterized by being formed by providing a slit portion (21).

According to this, the shock absorbing portions (21, 22) can be formed by a simple method.

The reference numerals in parentheses attached to the respective means indicate the correspondence with specific means described later in the embodiments.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view of a main part of a printed circuit board according to this embodiment. The printed circuit board 1 is the same as the printed circuit board 101 shown in FIG. 5 described in the related art except for the main part shown in FIG. The same parts as those of the conventional printed circuit board 101 are denoted by the same reference numerals, and description thereof will be omitted.

As shown in FIG. 1, the printed circuit board 1 is provided with a plurality of (four in this example) discontinuous arc-shaped slit portions 21 having a width of about 0.2 to 2 mm on the outer periphery of the fixed portion 2. ing. That is, the slit portion 21 is provided on a part of the outer periphery of the fixed portion 2. Therefore, the fixed part 2 and the wiring part 5 of the printed board 1 are connected by the connecting part 22 between the plurality of slit parts 21. In this example, the connecting portion 22 is formed so as to have a width of about 0.2 to 2 mm. here,
The slit part 21 and the connecting part 22 constitute an impact absorbing part in the present embodiment.

FIG. 2A is a cross-sectional view of the vicinity of the fixing portion 2 in a state where the printed circuit board 1 according to the present embodiment is mounted in the housing 51, and FIG. It is sectional drawing which shows the example of a state around the fixing | fixed part 2 when adding. When no impact is applied, FIG.
When a shock is applied to the printed circuit board 1 in a state as described above, the connecting portion 22 is deformed as shown in FIG. 2B, the shock is transmitted to the wiring portion 5, and the wiring portion 5 is deformed. Can be suppressed. Therefore, it is possible to suppress the occurrence of deformation stress at the joint 8a between the solder 8 and the land 6a.

This is because the connecting portion 22 having a width of about 0.2 to 2 mm and a length of about 0.2 to 2 mm is formed between the slit portions 21 so that the fixing portion 2 and the wiring portion 5 can be formed. This is because the rigidity is reduced.

In FIG. 1, illustration of the conductor pattern 6, the solder resist film and the like is omitted. FIG.
Here, the illustration of the interlayer connection portion for electrically connecting the solder resist film and the conductor patterns 6 on both the front and back surfaces of the substrate is omitted.

Here, a method of manufacturing the printed circuit board 1 in this embodiment will be briefly described. First, an 18 μm thick copper foil is pattern-etched on both front and back surfaces of an insulating substrate 3 having a thickness of 0.8 mm in which an epoxy resin is reinforced with a glass cloth to form a conductor pattern 6. After forming a double-sided substrate connected between layers, a solder resist film was pattern-formed on both surfaces of the double-sided substrate.

Next, the through holes 4 and the slits 21 were formed by drilling or router processing. Finally, the mounted component 7 was soldered by a well-known reflow method to obtain the printed circuit board 1.

The above manufacturing method is an example.
The same effect can be obtained with the printed circuit board 1 obtained by another manufacturing method such as forming the through hole 4 and the slit portion 21 before forming the solder resist film. In this example, the epoxy resin reinforced with glass cloth was used for the insulating base material 3. However, an epoxy resin without glass cloth reinforcement or a thermosetting resin other than epoxy resin may be used. Or a thermoplastic resin.

Further, although copper foil is used for the conductor pattern 6, a metal foil other than copper foil may be used, or it may be formed by another conductive member.

According to the printed circuit board 1 having the above-described configuration, the impact absorbing portion formed by the slit portion 21 and the connecting portion 22 can have a lower rigidity than the fixing portion 2 and the wiring portion 5, so that the impact absorbing portion can be used at the time of dropping. The impact is absorbed by the deformation of the connecting portion 22 and can be suppressed from being transmitted to the wiring portion 5. Therefore,
There is no need to provide a shock absorbing member separately from the printed circuit board 1. Thus, the housing 5 for housing the printed circuit board 1
Without increasing the size of the component 1, it is possible to suppress the impact at the time of dropping or the like from being transmitted to the land portion 6 a on which the mounting component 7 is mounted.

(Other Embodiments) In the above embodiment, four arc-shaped slit portions 21 are provided on the outer periphery of the fixed portion 2, but the number and shape of the slit portions are not limited to this. For example, as shown in FIG. 3A, two arc-shaped slit portions 211 may be formed, or as shown in FIG. 3B, eight arc-shaped slit portions 212 may be formed. It may be something. FIG.
As shown in (c), a through hole 213 having a round hole shape or the like instead of a slit shape may be formed.

In the above-described embodiment, the shock absorbing portion is constituted by the slit portion 21 and the connecting portion 22. For example, as shown in FIG.
By forming 15 or the like, an impact absorbing portion having lower rigidity than the fixed portion 2 or the wiring portion 5 may be formed.

The shapes and dimensions of the slit portion 21 and the connecting portion 22 can be appropriately set according to the shape and material of the printed circuit board 1.

In the above embodiment, the printed board 1 is a double-sided board, but may be a single-sided board or a multilayer board. In addition, as mounting parts,
The present invention is not limited to the form of the mounted component 7, but covers all components that can be mounted on a printed circuit board.

[Brief description of the drawings]

FIG. 1 is a plan view of a main part of a printed circuit board according to an embodiment of the present invention.

FIGS. 2A and 2B are cross-sectional views of a main part of a printed circuit board according to an embodiment of the present invention in a state where the printed circuit board is mounted in a housing; FIG. 2A shows a state where no impact is applied; Indicates the status.

FIG. 3 is a plan view of a main part of a printed circuit board according to another embodiment.

FIG. 4 is a sectional view of a main part of a printed circuit board according to another embodiment.

FIG. 5 is a view showing a conventional printed circuit board;
Is a plan view of a printed circuit board provided in the housing, (b)
3 is a sectional view of a main part in a state where no impact is applied, and FIG. 3C is a sectional view of a main part in a state where an impact is applied.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Fixed part 4 Through hole 5 Wiring part 6 Conductor pattern 6a Land part (mounting part) 7 Mounting part (component) 8 Solder 8a Joining part 21 Slit part (part of shock absorption part) 22 Connection part (shock absorption) Part of part) 51 Housing 53 Boss part

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E338 BB13 BB17 5E348 AA11 AA16 AA32 CC06 CC08 EE32

Claims (2)

[Claims] A wiring section (5) on which a conductor pattern (6) including a mounting section (6a) for mounting a component (7) and a fixing section (2) for fixing in a housing (51) is formed. ), Wherein a shock absorbing portion (21, 22) is provided between the fixing portion (2) and the wiring portion (5). 2. The shock absorbing portion (21, 22) is formed by providing a slit portion (21) on a part of an outer periphery of the fixing portion (2). A printed circuit board according to claim 1.