JP2002124845A - Crystal vibrator package and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique capable of realizing adjustment of frequency characteristics of a crystal piece in a packaged state. SOLUTION: A crystal oscillator package 10 comprises: a base member 20 manufactured with a glass having high transmittance; a crystal vibrator 14 which is adhered to a silver paste 12 to this base member 20, and is mounted thereto in an overhung support state; and a cap member 16 to be mounted to the base member 20 so as to airtightly seal this crystal vibrator 14. A conventional base member is made of ceramics, but this base member is formed as a molding product made of a glass. Compared with ceramics, the glass is extremely easy to mold and its manufacturing cost can be lowered, and its thermal conductivity is small. Therefore, the thermal insulating properties are superior, thereby displaying an operation of efficiently protecting the inside crystal vibrator. As the base member is structured by the mold product made of the glass with the high transmittance, it is possible to readily execute adjustment of frequencies of the inside crystal vibrator by projection of laser beams.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in the structure of a crystal resonator package and an improvement in manufacturing technology.

[0002]

2. Description of the Related Art Quartz resonators are often used as devices, specifically as one of components mounted on printed circuit boards, because of their excellent frequency characteristics. However, in order to stabilize the characteristics of the crystal unit, it is desirable to put it in a sealed container in order to block the influence of the outside air. An example of such a package structure is disclosed in Japanese Patent Application Laid-Open No. H11-302034, entitled "Glass-Ceramic Composite". And a flat package type piezoelectric component using the same ".

More specifically, FIG. 1 of the above publication shows a package 15 in which a crystal blank 12 is placed in a base member 11 (the reference numeral is the same as described in the publication and the same applies hereinafter) and a cap member 13 is covered. I have. The present invention is characterized in that the package 15 is made of a material having substantially the same coefficient of thermal expansion as the crystal blank 12, and the package 15 is made of a mixture of ceramic and glass powder.

[0004]

If there is a remarkable difference between the coefficient of thermal expansion of the package 15 and the coefficient of thermal expansion of the crystal blank 12, the thermal expansion and contraction of the package 15 will affect the crystal blank 12, and the crystal blank 12 will be affected.
It is fully conceivable that the frequency characteristics of the data are adversely affected. In the invention of the above publication, the thermal expansion coefficients of both are approximated, so there is no need to worry. However, there are the following problems.

Problem: Since the crystal blank 12 cannot be seen from outside after the cap member 13 is covered, it is not possible to adjust the frequency characteristics of the crystal blank 12 even if it is desired.
That is, conventionally, the frequency characteristic of the crystal blank 12 was managed as a single product, and was not adjusted in the state of the package 15, or variation was allowed. However, since the crystal blank 12 is adhered to the base member 11 with an adhesive, the frequency characteristics of the crystal blank 12 can be delicately changed depending on the bonding condition (the amount of the adhesive and the bonding area). In recent years, as the variations in devices have been severely restricted, it has become necessary to strictly control the frequency characteristics of packaged quartz pieces.

Problem: At present, the package 15 has the crystal blank 12 placed on one base member 11 and the cap member 13.
Productivity is extremely low due to single item production where the product is covered. Problem: The base member 11 must be positioned and fixed when attaching the crystal blank 12. In order to efficiently perform positioning and fixing, the base member 11 needs to have a certain size, and currently, a size of about 2 mm × 4 mm is employed. Therefore, it is difficult to further reduce the size.

It is an object of the present invention to provide a technique capable of realizing frequency characteristic adjustment of a crystal blank in a packaged state, enabling mass production, and easily achieving compact base members and packages. .

[0008]

According to one aspect of the present invention, there is provided a crystal resonator package comprising: a base member;
In a crystal resonator package including a crystal resonator mounted on the base member and a cap member placed on the base member to seal the crystal resonator, at least one of the base member and the cap member is a glass molded product. It is characterized by being.

In the present invention, the base member and / or the cap member, which are conventionally made of ceramics, are formed into glass molded articles. Compared to ceramics, glass is extremely easy to mold and can reduce manufacturing costs, and has a small thermal conductivity, so it has excellent heat insulation properties and exhibits an effect of well protecting an internal quartz oscillator. Since the base member and / or the cap member are made of a glass plate having a high transmittance, the frequency of the internal quartz oscillator can be easily adjusted by laser beam irradiation.

According to a second aspect of the present invention, there is provided a crystal resonator package, wherein a clearance of at least 50 μm is provided between the base member and the crystal resonator.

By providing the clearance, only the crystal oscillator can be easily cut by the laser beam. If the thickness is less than 50 μm, the heat applied to the quartz oscillator will move to the base member, thereby reducing workability and possibly melting the base member. Therefore, it is effective to provide a clearance of at least 50 μm between the base member and the crystal unit.

According to a third aspect of the present invention, a concave portion is provided in the base member to secure a clearance.

Several structures are conceivable for securing the clearance. Among them, the structure in which the concave portion is provided in the base member is simple. In particular, since the concave portion can be provided at the same time when the base member is molded, the manufacturing cost is reduced. Can be kept low.

According to a fourth aspect of the present invention, in the quartz resonator package, the cap member is coated with an electromagnetic shield film on at least the outer surface.

It is possible to cut off the incidence of electromagnetic noise from outside or the emission of electromagnetic interference noise (EMI noise) emitted from the crystal unit.

According to a fifth aspect of the present invention, there is provided a crystal resonator package having a crystal connecting electrode on one surface of a base member and an external connecting electrode on the other surface of the base member, wherein the crystal connecting electrode and the external connecting electrode are provided. Are electrically connected via a conductive member embedded in the through hole, and a crystal resonator is mounted on the crystal connection electrode.

Since the crystal connection electrode and the external connection electrode are connected straight through the through hole, the wiring capacity is small and the electrical characteristics of the crystal resonator can be stabilized.

According to a sixth aspect of the present invention, there is provided a crystal resonator package including an external connection electrode on one surface of a base member, a crystal connection electrode on the other surface of the base member, and a crystal resonator on the crystal connection electrode. The external connection electrode and the crystal connection electrode are electrically connected by a metal member that is mounted and penetrated through the base member.

Since the metal member has good conductivity, the electrical characteristics of the crystal unit can be further stabilized.

According to a seventh aspect of the present invention, there is provided a crystal resonator package, wherein an external connection electrode is provided on one surface of the base member, a metal member penetrated through the base member is connected to the external connection electrode, and the other surface of the base member is connected to the external member. The present invention is characterized in that a metal member is protruded, and a quartz oscillator is directly mounted on the tip end surface of the protruding portion.

One end of the metal member is protruded, and the crystal unit is directly mounted thereon. As a result, it is possible to omit the crystal connection electrode, and to reduce the number of steps, the manufacturing cost, and the product cost.

According to a eighth aspect of the present invention, there is provided a method for manufacturing a crystal resonator package, comprising: charging a material glass between upper and lower molds and press-molding the material glass while heating the material glass to a softening point temperature or higher. By forming a plate, a molding step of molding a plurality of base members for a crystal resonator package of length m × n on a single glass plate; and forming each of the obtained base members from one surface to the other. An electrode forming step of providing a conductive member reaching the surface, and forming an external connection electrode and a crystal connection electrode electrically connected to these conductive members on one surface and the other surface of the base member, respectively; A quartz crystal mounting step of mounting a quartz oscillator on the electrode for use, a sealing step of covering a base member with a cap member so as to seal the quartz oscillator, and m × n by cutting one glass plate into base member units.
Separating step of obtaining a plurality of crystal resonator packages. Note that both m and n are positive integers of 1 or more.

The base member for the package is manufactured by a multi-piece press method using a glass material. Since a large number of pieces are taken, (m × n) base members can be obtained in one press step, and productivity can be remarkably improved. After setting the crystal unit on the multi-cavity glass plate, covering the cap member, and then dividing the base member to obtain m × n crystal unit packages, it is possible to efficiently produce a large number of crystal unit packages. In addition, since the crystal resonator and the cap member are divided after being attached in a so-called large-size plate state, the size of the crystal resonator package can be easily reduced.

According to a ninth aspect of the present invention, there is provided a method for manufacturing a crystal resonator package, wherein a laser beam passing through a base member and focused on the crystal resonator is irradiated from outside the package before or after the separating step. The frequency of the crystal oscillator is adjusted by evaporating a part of the oscillator or removing a part of the metal film covering the crystal oscillator.

Since the glass having a high transmittance is used for the base member, the frequency of the crystal unit can be adjusted after packaging. Therefore, the frequency characteristics of the crystal resonator package can be managed at a high level.

According to a tenth aspect of the present invention, the cutting in the separating step is performed by a fusing method using a laser beam or a mechanical cutting method using a diamond grindstone or bending.

If the division is performed by a laser beam, the time required for the division can be reduced. Alternatively, the mechanical cutting can be done with an inexpensive bending machine, and may be hand-folded for small-scale production. Therefore, production costs can be reduced.

According to a eleventh aspect of the present invention, there is provided a method of manufacturing a crystal resonator package, wherein in a forming step, a through-hole from one surface of the base member to the other surface of the base member is formed at the same time as forming by a pin provided in a forming die. Features.

In the present invention, through-holes are formed in a molding process by using pins provided in a molding die. Generally, the molding step and the through-hole opening step are performed separately. However, according to the present invention, both steps can be completed in one step, and the number of steps can be reduced.

According to a twelfth aspect of the present invention, in the method of manufacturing a crystal resonator package, in the electrode forming step, a conductive member is embedded in a through-hole formed through the base member, and an external connection electrode and a crystal connection electrode are formed in the base member. Is formed by a printing method.

With the printing method, the electrodes can be efficiently formed in a short time. That is, according to the present invention, the electrode forming time in the electrode forming step can be reduced, and the process time for manufacturing the crystal resonator package can be reduced.

[0032]

Embodiments of the present invention will be described below with reference to the accompanying drawings. For reference, the drawings that best correspond to the claims of the claims are listed. FIG. 1, FIG. 11, FIG. 12, and FIG. 17 correspond to claim 1.
FIG. 8B corresponds to claim 2. FIG. 1 and FIG. 8B correspond to claim 3. Claim 4 does not have a corresponding diagram, and therefore is described with an explanatory note. FIG. 1 and FIG. 11 correspond to claim 5. FIG. 12, FIG. 16 (d), and FIG. 17 correspond to claim 6. FIG. 16 (d) and FIG. 17 correspond to claim 7. FIG. 5, FIG. 9 or FIG. 10 corresponds to claim 8. FIG. 8B or FIG. 8C corresponds to claim 9. Claim 1
FIG. 18A corresponds to 0. FIG. 4 corresponds to claim 11. FIG. 7B corresponds to claim 12.

FIG. 1 is a cross-sectional view of a crystal resonator package according to the present invention. A crystal resonator package 10 includes a base member 20 made of glass having a high transmittance and a crystal connection electrode 13 of the base member 20. And a cap member 1 that is put on a base member 20 to seal the quartz oscillator 14 in a cantilevered state.
6 Reference numeral 17 denotes a glass-based adhesive, and it is preferable that the edge of the base member 20 corresponding to the glass-based adhesive 17 has a surface roughness of 3 to 4 μm in order to increase the adhesive strength. Rough surface formation can be easily achieved by polishing with alumina abrasive grains.

Although the cap member 16 may be made of an opaque material such as a metal, the base member 20 adjusts the frequency of the internal quartz oscillator by irradiating the laser beam, so that the laser beam is sufficiently transmitted. It is preferable that the glass plate has an iron content of 3000 ppm or less so that the glass plate can be formed. As the glass plate, soda lime silicate glass used for architectural window glass, alkali-free glass used for liquid crystal display glass, low alkali glass used for PDP display glass, etc. can be adopted, but if the transmittance can be ensured. The components can be arbitrarily selected.

Further, the cap member 16 can also be formed of a transparent glass molded product or a glass plate.
In this case, it is desirable to coat at least one surface with a metal film for electromagnetic shielding. Although not shown, the metal film is connected to a GND (ground) terminal of the base member 20 to block external electromagnetic noise, and to prevent electromagnetic interference noise ( EMI noise) is prevented from leaking to the outside.
By forming both the base member and the cap member put on it into a molded product made of glass, the linear expansion coefficients of both can be matched, and the package can be smoothly expanded or contracted without being distorted when subjected to a temperature change. Can be.

Then, the base member 20 has the concave portion 2 on the upper surface.
1, electrodes 22 and 23 are provided on the lower surface, and through holes 24 penetrating the upper and lower surfaces are provided.
It is a molded article molded to 3 mm or less. Reference numeral 12 denotes a conductive member such as a silver paste filled in the through hole 24.

Although a ceramic base member has been conventionally used, the thermal conductivity of the ceramic is, for example, 2%.
4.3 w / (m · K). On the other hand, the thermal conductivity of glass is about 1 w / (m · K). For example, if incorporated in a mobile phone, the crystal resonator package 10 is exposed to a large temperature change. If the base member 20 is made of a glass product, the heat insulating performance is improved by a factor of 20 or more as compared with ceramics, so that sufficient time can be gained before the temperature of the internal quartz oscillator 14 changes. Therefore, it can be said that the present invention in which the base member is changed from ceramics to glass can stabilize the vibration performance of the crystal unit 14.

FIG. 2 is a cross-sectional view taken along line 2-2 of FIG. 1. When the crystal resonator package 10 is viewed from above, the U-shaped crystal resonator 14 has a recess 21
It is a cantilever extending upward, and indicates that the crystal unit 14 is shielded from the outside air by surrounding such a crystal unit 14 and the concave portion 21 with the cap member 16.

A molding die suitable for producing the glass base member 20 employed in the crystal resonator package 10 having the above-described structure and a production method using the molding die will be sequentially described below. FIG. 3 is a principle diagram of a molding die for manufacturing a base member according to the present invention. The molding die 30 includes an upper die 31 as a movable die and a lower die 41 as a fixed die. The upper mold 31 may be fixed and the lower mold 41 may be movable.

In this example, the upper die 31 is provided with through-hole forming pins 32... (A plurality is shown; the same applies hereinafter) and boundary forming protrusions 33. 41, a pin receiving recess 42, a vent hole (vent hole) 43, and a recess forming projection 44 are provided. 45 indicated by an imaginary line indicates a material glass. That is, the molding die 30 is a multi-cavity die capable of manufacturing a large number of base members 20 (see FIGS. 1 and 2) in one press step.

FIG. 4 is an operation view of FIG. 3, in which a multi-cavity glass plate 50 is obtained by pressing. In the process of lowering the upper die 31 to the bottom dead center, the multi-cavity glass plate 50 is formed in the multi-cavity glass plate 50. A through hole 24 is formed by the pin 32, a thin portion of the boundary is formed by the projection 33 for forming the boundary,
A concave portion is formed by the concave portion forming convex portions 44.

The manufacturing method of the multi-cavity glass plate described with reference to FIG. FIG. 5 is a manufacturing flowchart of the multi-cavity glass sheet according to the present invention. STxx indicates a step number (the same applies hereinafter). ST01: First, a material glass and a mold are prepared. ST02: Material glass is put between the upper and lower molds. ST03: Heat the material glass above the softening point temperature. ST04: Press molding is performed. With this press,
The through hole and the thin part are formed simultaneously. ST05: Dispense the obtained multi-piece glass plate.

FIG. 6 is a plan view of a multi-piece glass plate according to the present invention.
And a through-hole 24... And a groove-shaped thin portion 51 at the boundary. Vertical thin part 51 and horizontal thin part 51
The vertical m × horizontal n arranged in a grid pattern or a chocolate pattern with
One base member can be obtained from one multi-piece glass plate 50. A technique for manufacturing a large number of crystal resonator packages using such a multi-cavity glass plate 50 will be described below.

FIGS. 7A to 7C are views for explaining the manufacture of a crystal resonator package according to the present invention (part 1). (A) is a groove-shaped thin portion 5 having concave portions 21... And through holes 24...
The multi-piece glass plate 50 having 1... (B)
Then, the through holes 24 are filled with the conductive members 12 such as a silver paste, and the upper and lower surfaces of the multi-piece glass plate 50 are printed by a printing method on the crystal connection electrode 13 and the external connection electrode 2.
Are provided, and crystal oscillators 14 are attached to the electrode 13 for crystal connection. (C), the cap members 16... Are provided on the upper surfaces of the thin portions 51.
Put on.

FIGS. 8A to 8C are views for explaining the manufacture of a crystal resonator package according to the present invention (part 2). 3A, the thin portions 51... Serving as boundaries are cut by the cutting laser beams 52. Note that this cutting may be performed by a mechanical cutting method in which a mechanical bending force is applied to the thin portions 51... Like cracking a rice cracker (senbei) or chocolate.

The boundary is made thinner than other parts on the premise of cutting. Specifically, the thin part 51 is 0.3 m thick.
The thickness should not exceed m. 0.3mm because it is glass
This is because if it is below, it can be easily divided. It is easier to cut with a laser beam 52 if it is thin.

Next, a laser beam 53 for truncation, which passes through the base member 20 and is focused on the front end of the crystal unit 14 in FIG. The tip is cut off by evaporation by ΔL to adjust the frequency of the quartz oscillator 14. For this purpose, the quartz oscillator 14 is set to have a length (L + ΔL) in advance. That is, make it longer. The laser beam 53 is YAG
(Yttrium-Aluminum-Garnet) A laser that is a type of light beam and is shielded when it hits iron in the glass. Therefore, it is desirable to use glass having an iron content of 3000 ppm or less.

It is not preferable that the quartz oscillator 14 is in contact with or close to the base member 20 when irradiating a laser while focusing on the tip of the quartz oscillator 14 to heat and evaporate the quartz. If they are in contact with or in proximity to each other, heat transfer from the crystal unit 14 to the base member 20 becomes active, and it becomes difficult to cut the target. In addition, it is not preferable to have the base member 20 beside when aiming at the tip of the crystal unit 14. Therefore, a clearance d of at least 50 μm is secured between the base member 20 and the crystal unit 14. This clearance d can be reliably ensured by providing the base member 20 with a concave portion 21 having an appropriate depth.

FIG. 5C is a view showing another embodiment of FIG. 5B, in which a metal film 54 is locally covered on the crystal unit 14 in advance. The metal film 54 is a mass member that plays a role of “weight”. If the cap member 16 is a glass product, it transmits light. Therefore, the metal film 54 is irradiated with a laser beam 56 from above, and a part of the metal film 54 is removed by the thermal energy. As a result, the size of the weight changes, so that the frequency of the crystal resonator 14 changes. That is, according to (c), the frequency can be adjusted without cutting down the crystal resonator 14. Depending on the type of the crystal unit, the metal film 54 is provided not at the tip of the crystal unit but at the center, so that the laser beam 56 may be applied to the metal film 54 as appropriate according to the position.

The manufacturing method of the crystal resonator package described with reference to FIGS. FIG. 9 is a manufacturing flowchart of the crystal resonator package according to the present invention. ST11: First, a multi-cavity glass plate is prepared (FIG. 7).
(A)). ST12: Fill the through holes with a silver paste as a conductive member (see FIG. 7B). ST13: Print the electrodes. Gold plating is applied if necessary (see FIG. 7B). ST14: Attach a quartz oscillator (see FIG. 7B). ST15: Attach the cap member (see FIG. 7C).

ST16: The base member is cut by cutting it with a laser beam or a diamond grindstone, or by bending it by hand or machine. The diamond grindstone has diamond abrasive grains adhered to the outer periphery of a disk, and the glass can be cut by rotating the disk at high speed.

ST17: The frequency of the quartz oscillator is adjusted with the laser beam (see FIG. 8B or 8C). ST18: Thus, a crystal resonator package can be obtained (see FIGS. 1 and 2).

FIG. 10 is a flow chart showing another embodiment of FIG. 9, wherein ST18 is moved before ST16 (or ST17) in FIG. The description will be repeated again. ST21: First, a multi-cavity glass plate is prepared (FIG. 7).
(A)). ST22: Fill the through-hole with a silver paste as a conductive member (see FIG. 7B). ST23: Print the electrodes. Gold plating is applied if necessary (see FIG. 7B). ST24: Attach a quartz oscillator (see FIG. 7B). ST25: Attach the cap member (see FIG. 7C).

ST26: The frequency of the crystal oscillator is adjusted with the laser beam (see FIG. 8B or 8C). ST27: Cut the base member with a laser beam or a diamond grindstone (high-speed rotating cutter) or cut the base member by bending it by hand or machine. ST28: Thus, a crystal resonator package can be obtained (see FIGS. 1 and 2).

FIG. 11 is a view showing another embodiment of FIG. 1. This crystal resonator package 10 is bonded to a base member 20 made of glass having a high transmittance and a crystal connection electrode 13 of the base member 20. A quartz oscillator 14 mounted in a cantilevered support state, a cap member 16 put on a base member 20 to seal the quartz oscillator 14, and a base member 2
And a glass base member protection plate 55 attached to the bottom of the “0”. The base member protection plate 55 exerts a sealing effect, and it is possible to effectively prevent the leakage of the leak through the through hole 24 or the invasion of the outside air.

FIG. 12 is a diagram showing still another embodiment of FIG.
The crystal resonator package 10 includes external connection electrodes 22 and 23 on one surface of a base member 20.
0 is provided with a crystal connection electrode 13 on the other surface, the crystal resonator 14 is mounted on the crystal connection electrode 13, and the external connection electrode 22 and the crystal connection electrode 22 are formed by a metal member 58 penetrated through the base member 20. 14 are electrically connected.

One end of the crystal unit 14 is connected to the crystal connection electrode 1.
It is acceptable to strengthen the bonding with the adhesive 59 after placing on 3. Further, by forming the cap member 16 as a molded product made of glass, the laser beam 56 can be applied to the metal film 54, and the frequency adjustment of the crystal unit 14 can be easily performed. For other configurations, reference numerals are diverted, and description thereof is omitted.

FIG. 13 is a sectional view taken along the line 13-13 in FIG. 12, in which the crystal oscillator 14 is mounted on the electrodes 13 for crystal connection, and the metal members 58, 58 are attached to the electrodes 13 for crystal connection from below. Indicates that is connected.

FIG. 14 is a sectional view taken along the line 14-14 of FIG. 12, in which the external connection electrodes 22 and 2 are provided on one surface of the base member 20.
2, 23, 23 are formed by a printing method, and external connection electrodes 22, 23 are formed.
It shows that the metal members 58 extend from 22 to the back of the drawing.

FIGS. 15A to 15C are views showing how to attach the metal member shown in FIG. For example, in (a), a small-diameter through-hole 61 is opened in the base member 20, and while the base member 20 is in a thermally softened state, the pin-shaped metal member 5 is formed.
Type 8.

(B) shows the metal member 58 and the base member 20 after the driving. 3C, the external connection electrodes 22 and 23 are printed on one surface of the base member 20, and the crystal connection electrode 13 is printed on the other surface.
The crystal resonator 14 may be attached to the device 3.

FIGS. 16A to 16D are diagrams showing another embodiment of FIG. In (a), a metal member 62 having a special shape is driven into the base member 20. (B) is a perspective view of the metal member 62 of a special shape, (c) is a CC cross-sectional view of (a),
The metal member 62 is a headed pin including a sufficiently large flat head 63 and a shaft portion 64 having a square cross section.

In (d), the flat head 63 of the metal member 62
The quartz oscillator 14 is directly mounted via an adhesive 65.
As a result, the crystal connecting electrode 13 (see FIG. 15C) can be omitted.

FIG. 17 is a diagram showing still another embodiment of FIG.
In this crystal resonator package 10, thick pin-shaped metal members 66, 67 are driven into the base member 20, and the external connection electrodes 2
2 and 23, and the crystal unit 1 is attached to the metal members 66 and 67.
4 and is fixed to one of the metal members 66 with an adhesive 59.

FIG. 18 is a sectional view taken along the line 18-18 in FIG. 17, and shows that the quartz oscillator 14 is mounted on the metal members 66, 66, 67. For other configurations, reference numerals are diverted, and description thereof is omitted.

[0066]

According to the present invention, the following effects are exhibited by the above configuration. A quartz resonator package according to claim 1, comprising: a base member; a quartz resonator mounted on the base member; and a cap member covering the base member to seal the quartz resonator. At least one of the member and the cap member is a molded product made of glass. That is, the base member and / or the cap member, which are conventionally made of ceramics, are formed into glass molded products in the present invention. Compared to ceramics, glass is extremely easy to mold and can reduce manufacturing costs, and has excellent thermal insulation because of its low thermal conductivity.
It works to protect the internal crystal oscillator well. Since the base member and / or the cap member are made of a glass plate having a high transmittance, the frequency of the internal quartz oscillator can be easily adjusted by laser beam irradiation.

The crystal resonator package according to a second aspect is characterized in that a clearance of at least 50 μm is provided between the base member and the crystal resonator. By providing the clearance, only the quartz oscillator can be easily cut by the laser beam. If the thickness is less than 50 μm, the heat applied to the quartz oscillator will move to the base member, thereby reducing workability and possibly melting the base member. Therefore, it is effective to provide a clearance of at least 50 μm between the base member and the crystal unit.

A third aspect of the present invention is characterized in that a concave portion is provided in the base member in order to secure a clearance. Several structures are conceivable for securing the clearance. Among them, the structure in which the concave portion is provided in the base member is simple, and the manufacturing cost can be kept low.

According to a fourth aspect of the invention, there is provided a crystal resonator package, wherein at least an outer surface of the cap member is covered with an electromagnetic shielding film. It is possible to cut off the incidence of external electromagnetic noise or the emission of electromagnetic interference noise (EMI noise) emitted from the crystal unit.

According to a fifth aspect of the present invention, there is provided a crystal resonator package having a crystal connecting electrode on one surface of a base member and an external connecting electrode on the other surface of the base member, wherein the crystal connecting electrode and the external connecting electrode are provided. Are electrically connected via a conductive member embedded in the through hole, and a crystal resonator is mounted on the crystal connection electrode. Since the crystal connection electrode and the external connection electrode are connected straight through the through hole, the wiring capacity is small, and the electrical characteristics of the crystal resonator can be stabilized.

According to a sixth aspect of the present invention, there is provided a crystal resonator package including an external connection electrode on one surface of a base member, a crystal connection electrode on the other surface of the base member, and a crystal resonator mounted on the crystal connection electrode. The external connection electrode and the crystal connection electrode are electrically connected by a metal member that is mounted and penetrated through the base member. Since the metal member has good conductivity, the electrical characteristics of the crystal unit can be further stabilized.

According to a seventh aspect of the present invention, there is provided a crystal resonator package, wherein an external connection electrode is provided on one surface of the base member, a metal member penetrated through the base member is connected to the external connection electrode, and the other surface of the base member is provided. , And a crystal unit is directly mounted on the tip surface of the protruding portion. Protruding one end of the metal member, there,
The crystal resonator was directly mounted. As a result,
The electrode for crystal connection can be omitted, so that the number of steps, the manufacturing cost, and the product cost can be reduced.

According to a eighth aspect of the present invention, there is provided a method for manufacturing a crystal resonator package, comprising: charging a material glass between upper and lower dies of a forming die; By forming a plate, a molding step of molding a plurality of base members for a crystal resonator package of length m × n on a single glass plate; and forming each of the obtained base members from one surface to the other. An electrode forming step of providing a conductive member reaching the surface, and forming an external connection electrode and a crystal connection electrode electrically connected to these conductive members on one surface and the other surface of the base member, respectively; A crystal mounting process of mounting a crystal oscillator on the electrode for use, a sealing process of covering a base member with a cap member so as to seal the crystal oscillator, and m × n crystal oscillations by cutting a glass plate into base member units. Child package And a separating step of obtaining

The package base member is manufactured by a multi-piece press method using a glass material. Since a large number of pieces are taken, (m × n) base members can be obtained in one press step, and productivity can be remarkably improved. After setting the crystal unit on the multi-cavity glass plate, covering the cap member, and then dividing the base member to obtain m × n crystal unit packages, it is possible to efficiently produce a large number of crystal unit packages. In addition, since the crystal resonator and the cap member are divided after being attached in a so-called large-size plate state, the size of the crystal resonator package can be easily reduced.

According to a ninth aspect of the present invention, a laser beam passing through the base member and focused on the crystal unit is irradiated from outside the package before or after the separating step. The frequency of the crystal oscillator is adjusted by evaporating a part of the oscillator or removing a part of the metal film covering the crystal oscillator. Since high transmittance glass is used for the base member,
After packaging, the frequency of the crystal oscillator can be adjusted. Therefore, the frequency characteristics of the crystal resonator package can be managed at a high level.

In a tenth aspect of the present invention, the cutting in the separating step is performed by a fusing method using a laser beam or a mechanical cutting method using a diamond grindstone or bending. If the division is performed by a laser beam, the time required for the division can be reduced. Alternatively, the mechanical cutting can be done with an inexpensive bending machine, and may be hand-folded for small-scale production. Therefore, production costs can be reduced.

According to a eleventh aspect of the present invention, there is provided a method of manufacturing a crystal resonator package, wherein a through-hole from one surface of the base member to the other surface of the base member is formed by a pin provided in a molding die at the same time as molding. Features. In the present invention, a through-hole is formed in a molding process by a pin provided in a molding die. Generally, the molding step and the through-hole opening step are performed separately. However, according to the present invention, both steps can be completed in one step, and the number of steps can be reduced.

According to a twelfth aspect of the present invention, in the method of manufacturing a crystal resonator package, in the electrode forming step, a conductive member is embedded in a through hole formed through the base member, and an external connection electrode and a crystal connection electrode are formed in the base member. Is formed by a printing method. With the printing method, the electrodes can be efficiently formed in a short time. That is, according to the present invention, the electrode forming time in the electrode forming step can be reduced, and the process time for manufacturing the crystal resonator package can be reduced.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a crystal resonator package according to the present invention.

FIG. 2 is a sectional view taken along line 2-2 of FIG.

FIG. 3 is a principle view of a molding die for manufacturing a base member according to the present invention.

FIG. 4 is an operation diagram of FIG. 3;

FIG. 5 is a manufacturing flowchart of a multi-cavity glass plate according to the present invention.

FIG. 6 is a plan view of a multi-cavity glass plate according to the present invention.

FIG. 7 is an explanatory view of manufacturing a crystal resonator package according to the present invention (part 1).

FIG. 8 is a view for explaining the manufacture of a crystal resonator package according to the present invention (part 2).

FIG. 9 is a manufacturing flowchart of the crystal resonator package according to the present invention.

FIG. 10 is a view showing another embodiment of FIG. 9;

FIG. 11 is a view showing another embodiment of FIG. 1;

FIG. 12 is a view showing still another embodiment of FIG. 1;

13 is a sectional view taken along line 13-13 of FIG.

FIG. 14 is a sectional view taken along line 14-14 of FIG. 12;

FIG. 15 is a view showing how to attach the metal member shown in FIG. 12;

FIG. 16 is a view showing another embodiment of FIG. 15;

FIG. 17 is a view showing still another embodiment of FIG. 1;

18 is a sectional view taken along line 18-18 of FIG. 17;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Crystal oscillator package, 12 ... Conductive member (silver paste), 13 ... Crystal connection electrode, 14 ... Crystal oscillator, 1
6 cap member, 20 base member, 21 recess, 2
2, 23 ... external connection electrode, 24 ... through hole, 30 ...
Molding die, 31 ... Upper die, 32 ... Pin, 41 ... Lower die, 45 ...
Glass material, 52: laser beam for dividing, 53: laser beam for cutting, 54: metal film, 56: laser beam for processing the metal film, 58, 62, 66, 67: metal member, d: clearance.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Toshiro Ikuma 4-28-7 Kitahama, Chuo-ku, Osaka-shi, Osaka Inside Nippon Sheet Glass Co., Ltd. (72) Inventor Kazuo Shibaoka 4-chome, Kitahama, Chuo-ku, Osaka, Osaka No. 28 Inside Nippon Sheet Glass Co., Ltd. (72) Inventor Shin Shin Wakasugi 1-1-12 Tanashi-cho, Nishi-Tokyo, Tokyo Inside Citizen Watch Co., Ltd. (72) Inventor Hisao Wakabayashi 6, Chome Tanashi-cho, Nishi-Tokyo, Tokyo No. 1-12 Citizen Watch Co., Ltd. F-term (reference) 5J108 AA02 BB02 CC04 EE03 EE07 EE18 GG03 GG08 GG17 KK04 KK06 MM02 NB05

Claims (12)

[Claims] 1. A crystal resonator package comprising a base member, a crystal resonator mounted on the base member, and a cap member covering the base member to seal the crystal resonator. A crystal resonator package, wherein at least one of the cap members is a molded product made of glass. 2. The crystal resonator package according to claim 1, wherein a clearance of at least 50 μm is provided between said base member and said crystal resonator. 3. The crystal resonator package according to claim 2, wherein a recess is provided in the base member to secure the clearance. 4. The crystal resonator package according to claim 1, wherein said cap member has at least an outer surface coated with an electromagnetic shield film. 5. A crystal connection electrode is provided on one surface of the base member, and an external connection electrode is provided on the other surface of the base member, and the crystal connection electrode and the external connection electrode are embedded in a through hole. The crystal resonator package according to claim 1, wherein the crystal resonator is electrically connected via a conductive member, and the crystal resonator is mounted on the crystal connection electrode. 6. An external connection electrode is provided on one surface of the base member, a crystal connection electrode is provided on the other surface of the base member, and the crystal resonator is mounted on the crystal connection electrode. 2. The crystal resonator package according to claim 1, wherein the external connection electrode and the crystal connection electrode are electrically connected by a metal member penetrating the base member. 7. An external connection electrode is provided on one surface of the base member, a metal member penetrated through the base member is connected to the external connection electrode, and the metal member is connected from the other surface of the base member. 2. The crystal resonator package according to claim 1, wherein the crystal resonator is protruded, and the crystal resonator is directly mounted on a front end surface of the protrusion. 8. A material glass is put between upper and lower molds of a forming die, and the material glass is pressed and formed while being heated to a softening point temperature or higher to form one glass plate. A molding step of molding a plurality of m × n quartz crystal package base members on a glass plate; providing a conductive member from one surface to the other surface on each of the obtained base members; An electrode forming step of forming an external connection electrode and a crystal connection electrode electrically connected to the conductive member on one surface and the other surface of the base member, respectively, and mounting a crystal oscillator on the formed crystal connection electrode A mounting step, a sealing step of covering the base member with a cap member so as to seal the crystal unit, and cutting the one glass plate into the base member units.
A method for manufacturing a crystal resonator package, comprising: a separation step of obtaining xn crystal resonator packages. 9. Before or after the separating step, a part of the crystal unit is evaporated by irradiating a laser beam passing through the base member and focused on the crystal unit from outside the package, or 9. The method for manufacturing a crystal resonator package according to claim 8, wherein the frequency of the crystal resonator is adjusted by removing a part of the metal film covering the crystal resonator. 10. The cutting in the separating step is performed by a fusing method using a laser beam or a mechanical cutting method using a diamond grindstone or bending.
The manufacturing method of the crystal resonator package described in the above. 11. The quartz crystal according to claim 8, wherein in the forming step, a through hole from one surface of the base member to the other surface is formed simultaneously with the forming by a pin provided in the forming die. Manufacturing method of vibrator package. 12. In the electrode forming step, the conductive member is buried in a through hole formed through the base member, and an external connection electrode and a crystal connection electrode are formed on the base member by a printing method. The method for manufacturing a crystal resonator package according to claim 8, wherein