JP2002111169A - Chip element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip element with a constitution easy to manufacture, and capable of mass production and is of low cost while having a cylindrical electronic part like a crystal vibrator as a constituent element. SOLUTION: A crystal vibrator 10 has a cylindrical trunk part 11 with an outer circumferential face as a first conductive part. One lead part 12 extended from a side edge face of the trunk part 11 is formed as a second conductive part. A first terminal member 20 is a plate-like member and is fixed to the trunk part 11 by a solder (H). A second terminal member 30 is formed by bending the plate-like member, and the lead part 12 is joined under pressure from above to an almost V-shaped groove 32 that extends vertically formed in an erected part 31 that is bent vertically. The crystal vibrator 10 with both fixed terminal members 20 and 30 is over-molded by a resin in a state with the lower faces of both terminal members 20 and 30 exposed to form an exterior frame 15 while the lower faces of both terminal members 20 and 30 function as mounting faces 25 and 35 onto the substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip device surface-mounted on a substrate, and more particularly, to a chip device having a cylindrical electronic component represented by a quartz oscillator as a component.

[0002]

2. Description of the Related Art Conventionally, when mounting electronic components on an integrated circuit or the like on a substrate, the electronic components are arranged on one side of the substrate, and leads extending from the electronic components are penetrated through the substrate and wired on the back side of the substrate. In addition to the method, surface mount technology (surface mount technolo) that converts electronic components into chip elements and mounts the connection terminals by soldering on the conductor pattern of the board
gy: SMT). Since this surface mount allows a completely independent circuit to be assembled on one side of the substrate, it is suitable for reducing the size, weight, and thickness of the element.

[0003] An electronic component formed into a chip element as described above is formed by soldering a terminal to a lead portion. When the electronic component is cylindrical, such as a crystal unit used in a computer or a mobile phone, for example. In order to achieve this, it is necessary to devise a device that can maintain a stable posture even when mounted on a substrate. As an example of such a contrivance, for example, as shown in FIG. 5, one of the two lead portions 81 extending from one side end surface of the electronic component 80 is bent to form a flat terminal. In some cases, the lead is connected to the upper surface of the lead 91 and the other lead 82 is connected to the side surface of a conductive lead plate 93 extending in a U-shape. In this case, the lead plate 93 is connected to the upper surface of the terminal 92 on the other side, and the lower surfaces 91a and 92a of both terminals 91 and 92 are located on the same plane. Therefore, when both terminals 91 and 92 are attached to the board, electronic component 80 is supported by both terminals 91 and 92 and lead plate 93 and is held in a stable posture.

The electronic component 80 to which the terminal members 91 and 92 are fixed as described above is overmolded with a resin in a state where the lower surfaces of the terminal members 91 and 92 are exposed, and an outer frame formed by the resin is formed. 85 is insulated. For this reason, the lower surfaces of both terminal members 91 and 92 become mounting surfaces 91a and 92a on the substrate, and these mounting surfaces 91a and
By soldering in a state where 2a is in contact with the conductor pattern on the substrate, a chip element having the electronic component 80 as a component can be mounted on the substrate.

[0005]

However, in such a conventional method, not only two terminals but also a lead plate are required, and the electronic component after being assembled is maintained in a stable posture, Since the electronic component has an unstable posture, other components for supporting the electronic component are required, and there is a problem that the processing takes time and the manufacturing cost is increased due to the variation in quality.

The present invention has been made in view of such a problem, and is easy to process and mass-producible while using a cylindrical electronic component typified by a crystal oscillator as a constituent element, thereby reducing the manufacturing cost. It is an object of the present invention to provide a chip element having a configuration that can be reduced.

[0007]

In order to achieve the above object, a chip element according to the present invention has a cylindrical body portion having an outer peripheral surface formed as a first conductive portion and one end of the body portion. One lead portion extending from the side end surface of the cylindrical electronic component (for example, the quartz oscillator 10 in the embodiment) in which the lead portion is formed as a second conductive portion, and the outer peripheral surface of the body portion of the cylindrical electronic component A fixed conductive first terminal member;
A conductive second terminal member fixed to the lead portion of the cylindrical electronic component, and both terminal members have a configuration in which a mounting surface on a substrate is formed. Here, the body of the cylindrical electronic component is held by a holding portion formed on the first terminal member, or the body is bonded or soldered to the first terminal member with a conductive adhesive. Is preferred. Further, it is preferable that the lead portion is pressed or crimped to the second terminal member.

In this chip element, the outer peripheral surface of the cylindrical body portion of the cylindrical electronic component is formed as a first conductive portion, and one lead extending from one side end surface of the body portion. The part is formed as a second conductive part. Then, the first terminal member is fixed to the body portion, and the second terminal member is fixed to the lead portion. For this reason, the cylindrical electronic component can be held in a stable position by being supported by both terminals, but does not require a separate lead plate in addition to the two terminals unlike the conventional case.
In addition, since assembly can be performed in a stable state at all times, processing is facilitated, and manufacturing costs can be reduced.

Further, by punching and bending a plate material, a plurality of sets of both terminal members are manufactured at the same time in a state of being adjacent to each other, and after a cylindrical electronic component is attached to both terminal members of each set. , The first and second terminal members are preferably cut off individually. In this way, the chip element of the present invention can be easily assembled and mass-produced, so that the manufacturing cost can be further reduced, and even a fine shape can be easily processed. , So productivity is also improved.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings. First, a first embodiment of a chip element according to the present invention will be described. This first
As shown in FIG. 1, a chip element according to the embodiment includes a crystal oscillator 10 which is a cylindrical electronic component,
And two terminal members 20 and 30 connected to the terminal. Here, FIG. 1A shows a state before the terminals 20 and 30 are attached to the crystal unit 10, and FIG. 1B shows a state after the terminals 20 and 30 are attached to the crystal unit 10.

The crystal unit 10 of this chip element has a cylindrical body 11 (for example, having an outer diameter of 0.5 mm and a length of 2 mm).
An outer peripheral surface of about 1 mm is formed as a first conductive portion, and one lead portion 12 (for example, having an outer diameter width of 0.2 mm and a length of 0 mm) extending from a side end surface at one end of the body portion 11 is formed. .5mm
Is formed as a second conductive portion. The first terminal member 20 is a plate-shaped member, and is soldered to the body 11 (the solder is indicated by the symbol H in FIG. 1B). The second terminal member 30 is obtained by bending a plate-like member, and is formed in a vertically bent vertical portion 31 and has a substantially V-shaped groove extending vertically. The lead portion 12 is pressed from above against the lead 32. This causes the second terminal member 30 to be fixed to the lead portion 12. Note that the first terminal 20 is replaced with the solder H by conductive bonding. It may be made to adhere and fix to body part 11 with an agent.

Thus, the first and second terminal members 20,
The crystal unit 10 to which the fixing member 30 is fixed is connected to both terminal members 20,
30 is overmolded with resin in a state where the lower surface is exposed, and is insulated by the outer frame 15 formed thereby. For this reason, the mounting surfaces 25 and 35 to be formed on the substrate are formed on the lower surfaces of both terminal members 20 and 30, and soldering is performed with these mounting surfaces 25 and 35 in contact with the conductor pattern on the substrate. 2), a chip element having the crystal unit 10 as a component can be mounted on a substrate.

FIG. 2 shows a second embodiment of the chip element according to the present invention. The chip element according to the second embodiment includes the same crystal resonator 110 as that described in the description of the first embodiment, and two terminal members 120 and 130 connected to the crystal resonator 110. It has become. Here, FIG. 2A shows a state before the terminals 120 and 130 are attached to the crystal unit 110, and FIG. 2B shows a state after the terminals 120 and 130 are attached to the crystal unit 110.

The first terminal member 120 has spring-shaped U-shaped holding portions 121 and 122 obtained by bending both ends upward from a plate-shaped member.
0 by pressing the upper body portion 111 between the holding portions 121 and 122 from above by pressing (press-fitting).
It is possible to fix both holding portions 121 and 122 in a state where the holding portions 121 and 122 are in contact with the outer periphery of the body portion 111. The second terminal member 130 is the same as the second terminal member 30 shown in the description of the first embodiment, and is obtained by bending a plate-shaped member and is formed on a vertically bent vertical portion 131. Into the substantially V-shaped groove 132 extending in the vertical direction,
The lead part 112 of the crystal unit 110 is pressed from above and connected.

Also in this case, the first and second terminal members 12
Crystal oscillator 110 to which 0 and 130 are fixed is overmolded with resin in a state where the lower surfaces of both terminal members 120 and 130 are exposed, and is insulated by an outer frame (not shown) formed thereby. . Therefore, the mounting surfaces 125, 13 on the substrate are provided on the lower surfaces of both terminal members 120, 130.
5 are formed, and these mounting surfaces 125 and 13 are formed.
By soldering 5 in a state of being in contact with the conductor pattern on the substrate, a chip element having the crystal unit 110 as a component can be mounted on the substrate.

FIG. 3 shows a third embodiment of the chip element according to the present invention. In the chip device according to the third embodiment, a quartz oscillator 210 which is a cylindrical electronic component;
Two terminal members 22 connected to the crystal unit 210
0, 230. Here, FIG.
3A shows a state before the terminals 220 and 230 are attached to the crystal unit 210, and FIG. 3B shows a state after the terminals 220 and 230 are attached to the crystal unit 210, respectively.

The crystal oscillator 210 in this chip element
The outer peripheral surface of a cylindrical body portion 211 is formed as a first conductive portion, and one lead portion 212 extending from a side end surface at one end of the body portion 211 is formed as a second conductive portion. ing. The lead portion 212 is bent downward as shown in the drawing, so that the lead portion 2 is smaller than in the first and second embodiments.
The tip of 12 is located below.

The first terminal member 220 is the same plate-shaped member as the first terminal member 20 described in the description of the first embodiment, and is soldered to the body 211 (the solder is applied in FIG. 3).
(Indicated by the symbol H in B). Also, the second terminal member 23
Numeral 0 is obtained by bending a flat plate-like member, and has crimping portions 231 and 232 obtained by bending both ends upward. The lead portion 212 of the crystal unit 210 is connected between these crimping portions 231 and 232. The crimping portion 23 is placed on the
The two crimping portions 231 and 232 can be fixed while being in contact with the lead portion 212 by bending and crimping the lead portions 212. The first
The terminal 220 may be bonded and fixed to the body 211 with a conductive adhesive instead of the solder H.

Also in this case, the first and second terminal members 22
The crystal unit 210 to which the reference numerals 0 and 230 are fixed is overmolded with a resin in a state where the lower surfaces of the terminal members 220 and 230 are exposed, and is insulated by an outer frame (not shown) formed thereby. . Therefore, the mounting surfaces 225, 23 on the substrate are provided on the lower surfaces of both terminal members 220, 230.
5 are formed, and these mounting surfaces 225, 23
By soldering 5 in a state of being in contact with the conductor pattern on the substrate, a chip element having the crystal oscillator 210 as a component can be mounted on the substrate.

As described in the first to third embodiments, in the chip element according to the present invention, the cylindrical body 11 of the crystal unit 10 (110, 210) is provided.
The outer peripheral surface of (111, 211) is formed as a first conductive portion, and one lead portion 12 (112, 212) extending from a side end surface at one end of the body portion 11 is a second conductive portion. The first terminal member 20 (120, 220) is fixed to the body portion 11, and the second terminal member 30 (130, 230) is fixed to the lead portion 12. . For this reason, the crystal unit 10 is supported by the two terminals 20 and 30 and can maintain a stable posture. However, unlike the conventional case, there is no need for a separate lead plate in addition to the two terminals. Since the assembly can be carried out in a state where it has been completed, the processing becomes very easy and the manufacturing cost can be reduced.

Incidentally, the first and second terminal members 20, 30 (120, 13) shown in the first to third embodiments described above.
0 or 220, 230) is the plate material 5 as shown in FIG.
0, and the both terminals 2
A plurality of sets 0 and 30 are simultaneously manufactured in a state of being adjacent to each other, and after the crystal unit 10 (110 or 210) is attached to both terminal members 20 and 30 of each set, the first and second sets are manufactured. It is preferable that the terminal members 20, 30 are individually cut off. In this way, the chip element of the present invention can be easily assembled and mass-produced, so that the manufacturing cost can be further reduced, and even a fine shape can be easily processed. , So productivity is also improved.

Although the embodiments of the chip element according to the present invention have been described above, the scope of the present invention is not limited to the above. For example, in the above-described embodiment, the crystal resonator 10 (110, 210) is used as a component as a cylindrical electronic component. However, this may be another cylindrical electronic component such as a capacitor or a resistor. Good. Further, the body portion may be held by a holding portion formed on the first terminal member, or may be bonded or soldered to the first terminal member with a conductive adhesive, and the lead portion may be connected to the second terminal member. The outer peripheral surface of the body of the cylindrical electronic component (crystal oscillator), which is another combination not shown in the first to third embodiments, may be formed by pressing the member to the member. A mode in which the lead portion extending from the body portion is clamped by a crimping portion provided in the second terminal portion member while being clamped by the clamping portion provided in the terminal member is also included in the scope of the present invention.

[0023]

As described above, in the chip element according to the present invention, the outer peripheral surface of the cylindrical body portion of the cylindrical electronic component is formed as the first conductive portion, and one end of the body portion is formed. One lead portion extending from the side end surface of the side is formed as a second conductive portion, the first terminal member is fixed to the body portion, and the second terminal member is fixed to the lead portion. It has become. For this reason, the cylindrical electronic component can be supported by both terminals and can maintain a stable posture. However, unlike the conventional case, there is no need for a separate lead plate in addition to the two terminals, and it is always in a stable state. Since assembly can be performed, processing is facilitated, and manufacturing costs can be reduced.

Also, by punching and bending a plate material, a plurality of sets of both terminal members are manufactured at the same time in a state of being adjacent to each other, and after the cylindrical electronic component is attached to the both terminal members of each set. , The first and second terminal members are preferably cut off individually. In this way, the chip element of the present invention can be easily assembled and mass-produced, so that the manufacturing cost can be further reduced, and even a fine shape can be easily processed. , So productivity is also improved.

[Brief description of the drawings]

FIGS. 1A and 1B are perspective views showing a first embodiment of a chip element according to the present invention, wherein FIG. 1A shows a state before both terminals are attached to a crystal unit, and FIG. Each state after is shown.

FIGS. 2A and 2B are perspective views showing a chip element according to a second embodiment of the present invention, wherein FIG. 2A shows a state before both terminals are attached to a crystal unit, and FIG. Each state after is shown.

FIGS. 3A and 3B are perspective views showing a third embodiment of the chip element according to the present invention, wherein FIG. 3A shows a state before both terminals are attached to a crystal unit, and FIG. Each state after is shown.

FIG. 4 is used for producing first and second terminal members.
FIG. 4 is a partial view of an example of a punched plate material.

FIG. 5 is a perspective view showing a configuration example of a conventional chip element having a cylindrical electronic component as a component.

[Explanation of symbols]

 REFERENCE SIGNS LIST 10 crystal oscillator (cylindrical electronic component) 11 body portion 12 lead portion 20 first terminal member 25 mounting surface 30 second terminal member 35 mounting surface 31 vertical portion 32 groove portion H solder

Continued on the front page (72) Inventor Hisashi Suwa 10213-31 Tana, Sagamihara-shi, Kanagawa F-term in Union Machinery Corporation (reference) 5E336 AA04 BB01 CC02 CC51 DD02 EE15 GG05

Claims (5)

[Claims] 1. A chip element surface mounted on a substrate, wherein an outer peripheral surface of a cylindrical body is formed as a first conductive portion and extends from a side end surface on one end side of the body. 1
A cylindrical electronic component having a lead portion formed as a second conductive portion; a conductive first terminal member fixed to the outer peripheral surface of the body portion of the cylindrical electronic component; A chip element, comprising: a conductive second terminal member fixed to the lead portion of an electronic component, wherein both of the terminal members have a mounting surface on the substrate. 2. The chip element according to claim 1, wherein said body portion is held by a holding portion formed on said first terminal member. 3. The chip element according to claim 1, wherein the body is bonded or soldered to the first terminal member with a conductive adhesive. 4. The chip device according to claim 1, wherein said lead portion is pressed or crimped to said second terminal member. 5. A plurality of sets of said terminal members are simultaneously manufactured in a state where said terminal members are adjacent to each other by punching and bending a plate material, and said cylindrical electronic component is attached to said terminal members of each set. The chip element according to claim 1, wherein the first and second terminal members are individually cut after being cut.