JP2002111066A - Optical semiconductor device and mounting substrate thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To allow high-density mounting on a mounting substrate by comprising a structure for optical output/input in the upward direction or in the direction parallel to an element mount surface of a support member where a light-emitting element or a light-receiving element is mounted. SOLUTION: There are provided a light-emitting element 11 formed at a semiconductor pellet; a lead frame where the light-emitting element is mounted on a bed part 12; a bonding wire 14 connecting an electrode of the light-emitting element with an inner lead 13 of the lead frame, a translucent resin 15 which seals the light-emitting element, the bonding wire, and the inner lead; and an outer lead 16 exposed outside the translucent resin. The light-emitting element is mounted in such direction as parallel to the element mount surface of the lead frame, while in such orientation as an optical output is emitted in the direction perpendicular to the length direction of the outer lead.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor device in which optical semiconductor elements such as a semiconductor laser, a light emitting diode, and a light receiving diode are mounted on a support member and sealed with a translucent resin. The present invention relates to an optical semiconductor device that enables optical output or optical input in a direction parallel to an optical semiconductor element mounting surface.

[0002]

2. Description of the Related Art FIG. 9A is a plan view showing, as an example of a conventional light emitting semiconductor device, a light emitting diode device (LED device) partially viewed through from the front. FIG. 9B
FIG. 3 is a cross-sectional view schematically shown along the line CC ′ in FIG.

An LED device shown in FIGS. 9A and 9B
In 90, the LED element (pellet) 91 is mounted on a bed 92 of a metal lead frame,
And the inner lead portion 93 of the lead frame are connected by a bonding wire 94. Then, the LED element 91, the bonding wires 94 and the inner lead portions 93 are sealed with a light transmitting resin 95, and the outer lead portions 96 of the lead frame are exposed to the outside.

The above-mentioned LED device 90 utilizes, of the light output emitted in all directions from the LED element 91, the component emitted in the front direction perpendicular to the element mounting surface of the lead frame.

FIGS. 10 (a) and 10 (b) show an example of an LED device mounting substrate in which the LED device 90 shown in FIGS. 9 (a) and 9 (b) is mounted on a mounting substrate and optical fibers are opposed to each other. FIG. 3 is a plan view partially seen through when viewed from above.

In this LED device mounting board, an LED
The device 90 is mounted so as to be perpendicular to the mounting substrate surface 100 and the light emitting direction is directed to the length direction of the mounting substrate 100. One end of the optical fiber 101 is connected to the light emitting surface of the LED device 90. They are arranged in parallel to the surface of the mounting board so as to face each other. In many cases, the one end of the optical fiber 101 and the light emitting portion of the LED device 90 are inserted into an optical coupling connector (not shown) to fix the relative position.

However, in such a mounting structure, the mounting substrate 100 needs to have at least the same width as the width of the LED device 90, and the connector for optical coupling needs to have at least the LED device 90.
Since the same width as 90 is required, it is difficult to increase the density of components on the mounting board 100 (high-density mounting).

As an LD device having a semiconductor laser (LD) device mounted thereon in place of the LED device 91, there is an LD device having a structure for emitting a surface light emission output in the front direction. is there.

Further, as shown in FIGS. 11A and 11B, the surface emission output of the LD element 111 is
A structure in which light is emitted upward parallel to the element mounting surface has been proposed.

FIGS. 11 (a) and 11 (b) are plan views showing an example of the LD device 110 in a partially transparent manner as viewed from the front and side. In this LD device 110, an LD element (pellet)
111 is mounted on the bed of a metal lead frame 112 as a support member, and the electrodes of the PD element 111 and the inner leads of the lead frame are connected by bonding wires (not shown). And the LD
The element 111, the bonding wire and the inner lead portion are sealed with a light-transmitting resin 113, and the lead frame 11 is sealed.
The outer lead part 2 is exposed to the outside.

FIGS. 12A and 12B show a conventional light receiving semiconductor device (eg, photodiode; PD device) 120.
FIG. 2 is a plan view showing an example of the first embodiment in a partially transparent manner as viewed from the front and side.

In this PD device 120, a PD element (pellet) 121 is a metal lead frame serving as a support member.
The electrodes of the PD element 121 and the inner leads of the lead frame are connected by bonding wires (not shown). The PD element 121, the bonding wire and the inner lead are sealed with a light-transmitting resin 123, and the outer lead of the lead frame 122 is exposed to the outside.

The PD device 120 includes a lead frame 122
Incident light from the front direction perpendicular to the PD element mounting surface.

However, when the light receiving semiconductor device having such a structure is mounted on a mounting substrate as shown in FIGS. 10A and 10B, the mounting substrate needs to have the same width as the light receiving semiconductor device. Since the coupling connector also needs to have the same width as the light receiving semiconductor device, it is difficult to increase the density of components on the mounting board (high density mounting).

FIGS. 9A and 9B described above.
LED device 90 having the structure shown in FIG. 10A, LD device 110 having the structure shown in FIGS. 10A and 10B, and FIGS. 12A and 12B.
In the PD device 120 having the structure shown in FIG. 1, the heat generated by the elements is radiated by the outer leads projecting outside the sealing resin (package), but the radiation effect is not necessarily high.

[0016]

As described above, the conventional optical semiconductor device has a resin-sealed structure capable of outputting or inputting light in a front direction perpendicular to the element mounting surface of the lead frame. When mounted on a mounting board, there is a problem that high-density mounting is difficult.

Further, the conventional optical semiconductor device has a resin sealing structure in which heat is radiated by outer leads of a lead frame in which elements are mounted on a bed portion, and the heat radiation effect is not necessarily high.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and is directed to a lateral or upward direction parallel to an element mounting surface of a plate-like support member on which a light emitting element or a light receiving element is mounted. It is an object of the present invention to provide an optical semiconductor device having a structure capable of optical output or optical input and capable of high-density mounting when mounted on a mounting substrate.

Further, the present invention provides an optical semiconductor device having a resin sealing structure in which the heat radiation effect of the support member on which the light emitting element or the light receiving element is mounted is higher than the heat radiation effect of the outer lead of the conventional lead frame. With the goal.

Further, the present invention enables high-density (high-density mounting) of components on a mounting substrate on which a light-emitting semiconductor device or a light-receiving semiconductor device is mounted, which is advantageous for miniaturization of a device incorporating a mounting substrate. It is an object of the present invention to provide an optical semiconductor device mounting substrate that becomes:

[0021]

According to a first optical semiconductor device of the present invention, there is provided a light emitting element formed on a semiconductor pellet, a lead frame having the light emitting element mounted on a bed, and an electrode of the light emitting element. A bonding wire for connecting the inner lead portion of the lead frame, a light-transmitting resin for sealing the light emitting element, the bonding wire and the inner lead portion, and an outer part of the lead frame exposed outside the light-transmitting resin. A light-emitting element is mounted in a direction parallel to an element mounting surface of the lead frame, and in a direction to emit light output in a direction perpendicular to a length direction of the outer lead part. It is characterized by the following.

According to a second optical semiconductor device of the present invention, a light emitting element formed on a semiconductor pellet and a wiring pattern are formed on an insulating substrate, and the light emitting element is mounted and its electrodes are connected to a predetermined wiring pattern. And a light-transmitting resin that seals the light emitting element and its peripheral portion on the printed wiring board, and a light-transmitting resin outside the light-transmitting resin on the printed wiring board. An exposed wiring pattern portion for external connection leads, wherein the light emitting element is in a direction parallel to an element mounting surface of the printed wiring board, and
It is characterized by being mounted so as to emit light output in a direction perpendicular to the length direction of the wiring pattern portion for the external connection lead.

Further, the first optical semiconductor device mounting substrate of the present invention comprises the first or second optical semiconductor device of the present invention, wherein the optical semiconductor device is in a state perpendicular to the mounting substrate surface and the light emission thereof. A mounting substrate mounted in such a manner that the direction is parallel to the mounting substrate surface and oriented in the mounting substrate length direction, and one end faces a light emitting surface of the light emitting semiconductor device, and the mounting substrate is mounted on the mounting substrate. And an optical fiber disposed parallel to the substrate surface.

Further, a second optical semiconductor device mounting substrate of the present invention comprises a plurality of the first or second optical semiconductor devices of the present invention, and the plurality of optical semiconductor devices are respectively in a state perpendicular to the mounting substrate surface. And a mounting board mounted in a mounting board width direction such that each light emitting direction is parallel to the mounting board surface and faces the mounting board length direction, and each of the plurality of light emitting semiconductor devices. And a plurality of optical fibers disposed on the mounting board in parallel with the mounting board surface, with one end facing each of the light emitting surfaces.

In a third optical semiconductor device according to the present invention, a light emitting element formed on a semiconductor pellet and a wiring pattern are formed on an insulating substrate, and the light emitting element is mounted and its electrode is connected to a predetermined wiring pattern. And a light-transmitting resin that seals the light emitting element and its peripheral portion on the printed wiring board, and a light-transmitting resin outside the light-transmitting resin on the printed wiring board. An exposed wiring pattern portion for external connection leads, wherein the light emitting element is in a direction parallel to an element mounting surface of the printed wiring board, and
It is characterized in that it is mounted above the opposite side to the direction of the wiring pattern portion for the external connection lead so as to emit light output.

In a fourth optical semiconductor device according to the present invention, a light receiving element formed on a semiconductor pellet and a wiring pattern are formed on an insulating substrate, and the light receiving element is mounted and its electrode is connected to a predetermined wiring pattern. And a light-transmitting resin that seals the light emitting element and its peripheral portion on the printed wiring board, and a light-transmitting resin outside the light-transmitting resin on the printed wiring board. An exposed wiring pattern portion for an external connection lead, wherein a cut is formed in the front of the translucent resin in a downward tapered shape inside, and a tapered surface of the cut is formed of the light-receiving element. It is characterized by being opposed to the front.

According to a fifth optical semiconductor device of the present invention, there is provided a light receiving element formed on a semiconductor pellet, a lead frame having the light receiving element mounted on a bed, an electrode of the light receiving element and a lead frame. A bonding wire connecting the inner lead portion, a light-transmitting resin for sealing the light emitting element, the bonding wire and the inner lead portion, and an outer lead portion of the lead frame exposed to the outside of the light-transmitting resin. A cut is formed in the front of the translucent resin in a downward tapered shape inside, and the tapered surface of the cut is opposed to the front of the light receiving element.

[0028]

Embodiments of the present invention will be described below in detail with reference to the drawings.

<First Embodiment> FIG. 1A is a plan view showing an example of a light-emitting semiconductor device according to a first embodiment of the present invention, partially seen through from the front. FIG. 1 (b)
FIG. 2 is a cross-sectional view schematically shown along line AA ′ in FIG.

In the light emitting semiconductor device 10 shown in FIGS. 1A and 1B, a light emitting element (pellet) 11 is mounted on a bed portion 12 of a metal lead frame.
And the inner lead portion 13 of the lead frame are connected by a bonding wire 14. Then, the light emitting element 11, the bonding wire 14, and the inner lead portion 13 are sealed with a translucent resin (transparent resin) 15, and the outer lead portion 16 of the lead frame is exposed to the outside.

When the light emitting element 11 is an LD element, an element that emits light output in the side direction of the element is used. The light output element 11 is parallel to the element mounting surface of the lead frame and perpendicular to the outer lead portion 16. It is mounted so as to emit light output in the direction.

When the light emitting element 11 is an LED element, the light output emitted from the element in all directions includes a direction parallel to the element mounting surface of the lead frame and a direction perpendicular to the outer lead portion 16. The component that emits light is used.

According to such a structure, the light emitting semiconductor device
Since the light emission direction of 10 is a side parallel to the lead frame and a direction perpendicular to the outer lead portion 16, the area of the optical coupling portion can be reduced when the light emitting semiconductor device 10 is optically coupled to an optical fiber. .

Incidentally, one end of the optical fiber and the light emitting portion of the light emitting semiconductor device 10 may be inserted into an optical coupling connector (not shown) to fix the relative position. The width of the optical coupling connector can be reduced.

FIG. 2 shows an example of a light emitting semiconductor device mounting substrate in which the light emitting semiconductor device shown in FIGS. 1A and 1B is mounted on a mounting substrate and optical fibers are opposed to each other when viewed from the side. It is a top view shown by seeing-through.

In FIG. 2, the light emitting semiconductor device 10 is in a state perpendicular to the substrate surface of the mounting substrate 21 and the light emitting direction is parallel to the mounting substrate surface and the length direction of the mounting substrate 21 (left and right direction in the drawing).
The optical fiber 22 is disposed parallel to the mounting substrate surface with one end thereof facing the light emitting surface of the light emitting semiconductor device 10.

According to such a mounting structure, the mounting substrate 21
Width (in the front-back direction of the drawing) is at least the light-emitting semiconductor device.
Since only 10 thicknesses (dimensions shorter than the width) are required, it is possible to increase the density of components on the mounting board (high-density mounting), which is advantageous for miniaturization of a device incorporating the mounting board 21. .

FIG. 3 shows an example of a light emitting semiconductor device mounting substrate in which a plurality of the light emitting semiconductor devices shown in FIGS. 1A and 1B are mounted on a mounting substrate and a plurality of optical fibers are opposed to each other. FIG. 3 is a plan view showing a part of the structure as viewed from above.

In FIG. 3, n (plurality) light emitting semiconductor devices 10 are perpendicular to the substrate surface of one mounting substrate (not shown), and the light emission direction is the length direction of the mounting substrate. (Left and right direction of the drawing). Then, n (n) corresponding to the n light emitting semiconductor devices 10 described above.
The optical fibers 22 of the (channel) are arranged in parallel with the surface of the mounting substrate with one end thereof facing the light emitting surface of the corresponding light emitting semiconductor device 10.

The relative position may be fixed by inserting one end of the optical fiber 22 and the light emitting section of the light emitting semiconductor device 10 into an optical coupling connector (not shown).

According to the mounting structure for obtaining such multi-channel optical output, the distance between the optical fibers of each channel can be reduced, and the width of the mounting substrate (vertical direction in the drawing) can be reduced. Thickness of device 10 (dimension shorter than width)
N times as long as the width of the mounting substrate is small.
Since the light emitting semiconductor devices 10 can be mounted, it is possible to increase the density of components on the mounting board (high density mounting).

<Second Embodiment> FIG. 4A is a plan view showing an example of a light emitting semiconductor device according to a second embodiment of the present invention as seen from the front and partially seen through. FIG. 4 (b)
FIG. 2 is a cross-sectional view schematically shown along the line BB ′ in FIG.

The light emitting semiconductor device 40 has the same light emitting element 11 as the light emitting semiconductor device 10 of the first embodiment, but a printed wiring board 42 is used instead of the lead frame.
Is fundamentally different.

That is, in FIGS. 4A and 4B,
The light emitting element (pellet) 11 is mounted on a printed wiring board 42 in which a wiring pattern made of, for example, a body foil is formed on an insulating substrate 43, and an electrode of the light emitting element 11 and a wiring pattern section 44 at the center of the printed wiring board 42. Are electrically connected to each other, and the light emitting element 11 and its peripheral portion are
Is sealed. In this case, the peripheral portion on the printed wiring board 42 and the wiring pattern portion 46 for external connection leads are exposed to the outside.

Here, when the light emitting element 11 is an LD element, a light emitting element which emits light output in the side direction of the element is used. It is mounted so as to emit light output in a direction perpendicular to the pattern section 46. In the case where the light emitting element 11 is an LED element, of the light output emitted in all directions from the element, a direction parallel to the printed wiring board surface and a direction perpendicular to the wiring pattern portion 46 for external connection leads. The component that emits light is used.

According to such a structure, the light emitting semiconductor device
40 light emission directions are parallel to the surface of the printed wiring board, and
Since the direction is perpendicular to the wiring pattern portion 46 for external connection leads, the area of the optical coupling portion can be reduced when the light emitting semiconductor device 40 is optically coupled to an optical fiber.

It should be noted that one end of the optical fiber and the light emitting portion of the light emitting semiconductor device 40 may be inserted into a connector (not shown) for optical coupling to fix the relative position. The width of the optical coupling connector can be reduced.

Further, since the printed wiring board has a larger heat radiation area than the outer leads of the conventional lead frame, the heat radiation effect of the light emitting element can be enhanced. Moreover, if a material having a high heat dissipation property (such as a ceramic substrate) is used as the insulating substrate, the heat dissipation effect can be further enhanced.

FIG. 5 shows an example of a light emitting semiconductor device mounting substrate in which a plurality of the light emitting semiconductor devices shown in FIGS. 4A and 4B are mounted on a mounting substrate and a plurality of optical fibers are opposed to each other. FIG. 3 is a plan view showing a part of the structure as viewed from above.

In FIG. 5, n (plurality) light emitting semiconductor devices 40 are perpendicular to the substrate surface of one mounting substrate (not shown), and the light emitting direction is the length direction of the mounting substrate. (Left and right direction of the drawing). Then, n (n) corresponding to the n light emitting semiconductor devices 40 are described.
The optical fibers 22 of the (channel) are disposed in parallel with the surface of the mounting substrate with one end thereof facing the light emitting surface of the corresponding light emitting semiconductor device 40.

According to the mounting structure for obtaining such multi-channel optical output, the distance between the optical fibers of each channel can be reduced, and the width of the mounting substrate (vertical direction in the drawing) can be reduced. The thickness of the device 40 (dimensions shorter than the width)
N times as long as the width of the mounting substrate is small.
Since the light emitting semiconductor devices 40 can be mounted, the density of components on the mounting board can be increased (high density mounting).

Further, the peripheral portion exposed to the outside of the transparent resin 45 on the printed wiring board has a role of preventing light interference between the light emitting semiconductor devices (between the channels).

<Third Embodiment> FIGS. 6A and 6B
FIG. 9 is a plan view showing an example of a light emitting semiconductor device according to a third embodiment of the present invention, partially seen through from the front and side.

The light emitting semiconductor device 60 is different from the light emitting semiconductor device 40 of the second embodiment in that the light output direction of the light emitting element 11 is upward, and the other components are the same.

That is, in the light emitting semiconductor device 60 shown in FIGS. 6A and 6B, the light emitting element (pellet) 11 is mounted on the printed wiring board 42, and the electrodes of the light emitting element 11 are connected to the wiring of the printed wiring board 42. The pattern unit 44 is electrically connected,
On the printed wiring board, the light emitting element 11 and its peripheral portion are sealed with a translucent resin 45. In this case, the wiring pattern portion 46 for external connection leads and the peripheral portion on the printed wiring board are exposed to the outside of the translucent resin 45.

Here, when the light emitting element 11 is an LD element, an element that emits light output in the side direction of the element is used, and the light emitting element 11 is mounted in an upward direction parallel to the surface of the printed wiring board so as to emit light output. Have been. The light emitting element 11 is LE
In the case of the D element, a component of light output emitted from the element in all directions and emitted upward in parallel with the printed wiring board surface is used.

According to such a structure, the printed wiring board 42
Since the heat radiation area is larger than that of the outer lead of the conventional lead frame, the heat radiation effect of the light emitting element 11 can be enhanced. Moreover, when a ceramic substrate or the like having high heat dissipation properties is used as the substrate material, the heat dissipation effect can be further enhanced.

<Fourth Embodiment> FIG. 7A is a partial perspective view of an example of a light receiving semiconductor device (for example, a photodiode; PD) according to a fourth embodiment of the present invention as viewed from the front. FIG. FIG. 7B is a cross-sectional view schematically shown along the line BB ′ in FIG.

In this light receiving semiconductor device 70, a light receiving element (pellet) 71 is mounted on a printed wiring board 72, and an electrode of the light receiving element 71 is electrically connected to a wiring pattern portion 74 at the center of the printed wiring board 72. Then, the light receiving element 71 on the printed wiring board and its peripheral portion are sealed with a light transmitting resin 75. In this case, the wiring pattern portion 46 for the external connection lead and the peripheral portion on the printed wiring board are exposed outside the translucent resin 75.

Further, a notch (recess) 77 is formed on the front surface of the translucent resin 75 in a downward tapered shape, and the tapered surface 77a of the notch 77 is provided on the light receiving element.
It faces the front of 71. Thereby, the printed wiring board 72
The incident light from above parallel to the mounting surface is reflected by the tapered surface 77a of the cut 77 toward the front of the light receiving element 71.

According to the structure of the light receiving semiconductor device 70, the printed wiring board 72 has a larger heat radiation area than the outer leads of the conventional lead frame, so that the heat radiation effect of the light receiving element 71 can be enhanced. Moreover, when a ceramic substrate or the like having high heat dissipation properties is used as the substrate material, the heat dissipation effect can be further enhanced.

<Fifth Embodiment> FIG. 8A is a partial perspective view of an example of a light receiving semiconductor device (for example, a photodiode; PD) according to a fifth embodiment of the present invention as viewed from the front. FIG. FIG. 8B is a cross-sectional view schematically shown along the line BB ′ in FIG.

The light-receiving semiconductor device 80 has the same light-receiving elements as the light-receiving semiconductor device of the fourth embodiment described above, but basically uses a lead frame instead of a printed wiring board. Differently.

That is, in the light receiving semiconductor device 80 shown in FIGS. 8A and 8B, the light receiving element (pellet) 81 is mounted on the bed of the metal lead frame 82, and the electrode of the light receiving element 81 and the lead frame are connected. The inner lead portions 82 are connected by bonding wires (not shown). Then, the light receiving element 81, the bonding wire and the inner lead portion are sealed with the translucent resin 85, and the outer lead portion of the lead frame 82 is exposed to the outside.

Further, at the front of the translucent resin 85, there is formed a notch 87 which tapers downward in the interior.
The tapered surface 87a of the cut 87 faces the front of the light receiving element 81. As a result, incident light from above parallel to the mounting surface of the lead frame 82 is cut into the tapered surface 87 of the cut 87.
The light is reflected to the front of the light receiving element 81 at a.

According to the structure of the light receiving semiconductor device 80, it is possible to receive the incident light from above parallel to the element mounting surface of the lead frame 82 with the light receiving element 81. High-density mounting becomes possible.

[0067]

As described above, according to the optical semiconductor device of the present invention, the light is emitted in the direction parallel to the element mounting surface of the plate-like supporting member on which the light emitting element or the light receiving element is mounted, or in the upward direction. It has a structure that allows output or light input, and enables high-density mounting when mounted on a mounting substrate.

Further, according to the optical semiconductor device of the present invention, the heat radiation effect of the support member on which the light emitting element or the light receiving element is mounted can be made higher than that of the outer lead of the conventional lead frame.

Further, according to the optical semiconductor device mounting substrate of the present invention, it is possible to increase the density of components on the mounting substrate on which the light emitting semiconductor device or the light receiving semiconductor device is mounted (high density mounting). The built-in device can be reduced in size.

[Brief description of the drawings]

FIGS. 1A and 1B are a plan view and a cross-sectional view showing an example of a light-emitting semiconductor device according to a first embodiment of the present invention, partially seen through from the front.

FIG. 2 is a plan view showing an example of a light emitting semiconductor device mounting substrate in which the light emitting semiconductor device shown in FIG. 1 is mounted on a mounting substrate and optical fibers are opposed to each other when viewed from the side.

FIG. 3 is a plan view showing an example of a light emitting semiconductor device mounting substrate in which a plurality of light emitting semiconductor devices shown in FIG. 1 are mounted on a mounting substrate and a plurality of optical fibers are opposed to each other when viewed from above; FIG.

FIGS. 4A and 4B are a plan view and a cross-sectional view showing an example of a light emitting semiconductor device according to a second embodiment of the present invention, partially seen through from the front.

FIG. 5 is a plan view showing an example of a light emitting semiconductor device mounting substrate in which a plurality of light emitting semiconductor devices shown in FIG. 4 are mounted on a mounting substrate and a plurality of optical fibers are opposed to each other when viewed from above; FIG.

FIGS. 6A and 6B are a plan view and a cross-sectional view showing an example of a light emitting semiconductor device according to a third embodiment of the present invention, partially seen through from the front.

FIG. 7 is a plan view showing an example of a light receiving semiconductor device according to a fourth embodiment of the present invention in a partially transparent manner as viewed from the front and side.

FIGS. 8A and 8B are a plan view and a cross-sectional view showing an example of a light-receiving semiconductor device according to a fifth embodiment of the present invention, partially seen through from the front.

FIG. 9 is a plan view and a cross-sectional view showing a conventional light-emitting diode device in a partially transparent manner as viewed from the front.

FIG. 10 is a plan view showing an example of a light emitting diode device mounting substrate in which the light emitting diode device shown in FIG. 9 is mounted on a mounting substrate and optical fibers are opposed to each other when viewed from the side and above.

FIG. 11 is a plan view showing an example of a conventional semiconductor laser device in a partially transparent manner as viewed from the front and side.

FIG. 12 is a plan view showing an example of a conventional photodiode device in a partially transparent manner as viewed from the front and side.

[Explanation of symbols]

 10: Light emitting semiconductor device, 11: Light emitting element, 12: Bed part of lead frame, 13: Inner lead part of lead frame, 14: Bonding wire, 15: Translucent resin (transparent resin), 16: Outer of lead frame Lead section.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yukiko Kashiura 1st address, Komukai Toshiba-cho, Saiwai-ku, Kawasaki-shi, Kanagawa Prefecture Inside the Toshiba Microelectronics Center Co., Ltd. No. 1 Komukai Toshiba-cho F-term in Toshiba Microelectronics Center (reference) 5F041 AA47 DA07 DA17 DA43 DC03 5F073 FA07 FA27 FA28 FA29 5F088 JA02 JA06 JA10

Claims (7)

[Claims] A light emitting element formed on a semiconductor pellet; a lead frame on which the light emitting element is mounted on a bed; a bonding wire connecting an electrode of the light emitting element with an inner lead part of the lead frame; The light emitting device includes: a light-transmitting resin that seals the light-emitting element, the bonding wire and the inner lead portion; and an outer lead portion of the lead frame exposed to the outside of the light-transmitting resin. The optical semiconductor device is mounted in a direction parallel to the element mounting surface and in a direction perpendicular to the length direction of the outer lead portion to emit light output. 2. A light-emitting element formed on a semiconductor pellet, and a printed wiring having a wiring pattern formed on an insulating substrate, the light-emitting element being mounted, and the electrode being electrically connected to a predetermined wiring pattern portion. A substrate, a light-transmitting resin that seals the light emitting element and its peripheral portion on the printed wiring board, and a wiring pattern portion for an external connection lead exposed outside the light-transmitting resin on the printed wiring board. The light emitting element is mounted in a direction parallel to an element mounting surface of the printed wiring board and in a direction to emit light output in a direction perpendicular to a length direction of the wiring pattern portion for the external connection lead. An optical semiconductor device, comprising: 3. A light-emitting element formed on a semiconductor pellet, and a printed wiring on which a wiring pattern is formed on an insulating substrate, and the light-emitting element is mounted and the electrode is electrically connected to a predetermined wiring pattern portion. A substrate, a light-transmitting resin that seals the light emitting element and its peripheral portion on the printed wiring board, and a wiring pattern portion for an external connection lead exposed outside the light-transmitting resin on the printed wiring board. The light emitting element is mounted in a direction parallel to the element mounting surface of the printed wiring board, and in a direction to emit light output upward on a side opposite to a direction of the wiring pattern portion for the external connection lead. An optical semiconductor device, comprising: 4. A printed wiring in which a light receiving element formed on a semiconductor pellet and a wiring pattern are formed on an insulating substrate, and the light receiving element is mounted and an electrode thereof is electrically connected to a predetermined wiring pattern portion. A substrate, a light-transmitting resin that seals the light emitting element and its peripheral portion on the printed wiring board, and a wiring pattern portion for an external connection lead exposed outside the light-transmitting resin on the printed wiring board. In the front surface of the translucent resin, a cut is formed in a downward tapered shape inside, and the tapered surface of the cut faces the front surface of the light receiving element. Optical semiconductor device. 5. A light receiving element formed on a semiconductor pellet, a lead frame in which the light receiving element is mounted on a bed, a bonding wire for connecting an electrode of the light receiving element and an inner lead part of the lead frame, A light-transmitting resin that seals the light-emitting element, the bonding wire and the inner lead portion; and an outer lead portion of the lead frame exposed to the outside of the light-transmitting resin. The optical semiconductor device is characterized in that a notch is formed in a downward tapered shape inside, and a tapered surface of the notch faces the front of the light receiving element. 6. The optical semiconductor device according to claim 1, wherein the optical semiconductor device is in a state perpendicular to a surface of the mounting substrate, and a light emitting direction is parallel to the surface of the mounting substrate and in a length direction of the mounting substrate. A mounting substrate mounted so as to face, and an optical fiber disposed on the mounting substrate in a state where one end faces a light emitting surface of the light emitting semiconductor device and parallel to the mounting substrate surface. An optical semiconductor device mounting board characterized by the above-mentioned. 7. A plurality of optical semiconductor devices according to claim 1 or 2, wherein the plurality of optical semiconductor devices are perpendicular to the surface of the mounting substrate, and the light emitting directions of the plurality of optical semiconductor devices are perpendicular to the surface of the mounting substrate. A mounting substrate mounted in parallel with the mounting substrate width direction so as to face the mounting substrate length direction, and a state in which one end faces each light emitting surface of the plurality of light emitting semiconductor devices, and An optical semiconductor device mounting substrate, comprising: a plurality of optical fibers arranged on the mounting substrate in parallel with the surface of the mounting substrate.