JP2002110836A - Package for housing electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package in which an electronic component, which is miniaturized along with the miniaturizing trend, can be firmly adhered and fixed. SOLUTION: This package for housing an electronic component comprises an insulating substrate 1 having a recess 1a for accommodating the electronic component 3, and a lid 2. The electronic component 3 is adhered and fixed on the bottom face of the recess 1a of the insulating substrate 1 with a resin 5, and the recess 1a is sealed by the lid 2. The bottom face of the recess 1a of the insulating substrate 1 is formed in a circular arc shape with its apex at the center of the bottom face of the recess 1a, and stripe-shaped protrusions 6 are formed on the bottom face of the recess 1a.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package for housing electronic components such as semiconductor devices and surface acoustic wave devices.

[0002]

2. Description of the Related Art Conventionally, electronic component storage packages for storing electronic components such as semiconductor elements and surface acoustic wave elements have been developed.
It is made of an electrical insulating material such as an aluminum oxide sintered body,
An insulating base having a concave portion for accommodating an electronic component at a substantially central portion of the upper surface thereof and a metallized wiring layer made of a high melting point metal powder such as tungsten, molybdenum, manganese or the like led out from the periphery of the concave portion to the outer surface; The electronic component is bonded and fixed to the bottom of the concave portion of the insulating base via a bonding resin such as an epoxy resin, and each electrode of the electronic component is electrically connected via a bonding wire. The lid is joined to the upper surface of the insulating base with a sealing member such as glass or resin, and the electronic components are hermetically sealed inside to provide an electronic device as a final product.

For bonding the electronic component to the bottom surface of the concave portion, for example, first, an uncured epoxy resin or the like is applied to the bottom surface of the concave portion, and then the electronic component is positioned and mounted on the bottom surface of the concave portion. At the same time, an appropriate load is applied to the electronic component, the resin is spread and filled between the lower surface of the electronic component and the bottom of the concave portion, and finally, the uncured resin is heated and cured.

In recent years, electronic components which have been reduced in size to several mm square or less are frequently used. In this case, since the bonding area between the electronic component and the bottom surface of the concave portion is small and the adhesive strength tends to decrease, the bottom surface of the concave portion is often used. A stripe-shaped projection is provided on the electronic component, and the electronic component is placed over the stripe-shaped projection to secure a certain space between the lower surface of the electronic component and the bottom surface of the concave portion. There is a growing use of a structure in which the resin is filled with a resin to secure the volume of the resin and prevent the adhesive strength of the electronic component from being reduced.

[0005]

However, in this conventional electronic component housing package, a large number of irregularities of about several μm are present on the surface of an insulating base made of an aluminum oxide sintered body or the like. Since the bottom surface of the concave portion is flat, it is difficult for the resin for bonding to flow, it is difficult to uniformly spread the resin between the electronic component and the bottom surface of the concave portion, and the adhesive strength partially varies, and the electronic component Cannot be firmly bonded and fixed to the bottom surface of the concave portion.

At the same time, since the bonding resin is difficult to flow, it is difficult for bubbles and the like entrapped in the resin to move to the outside, and remains in the resin to cause defects such as voids.
There is also a problem that the electronic component cannot be firmly bonded and fixed to the bottom of the concave portion.

The present invention has been made in view of the above-mentioned problems in the prior art, and has as its object to fill a resin between an electronic component and a bottom surface of a concave portion uniformly and without causing defects such as voids. Another object of the present invention is to provide an electronic component storage package that can firmly adhere and fix an electronic component to the bottom surface of a concave portion.

[0008]

A package for storing an electronic component according to the present invention comprises an insulating substrate having a concave portion for accommodating the electronic component and a lid, and the electronic component is provided on the bottom surface of the concave portion of the insulating substrate via a resin. An electronic component housing package in which the recess is sealed with the lid and the recess is sealed with the lid, wherein the bottom of the recess of the insulating base is formed into an arc shape having the center of the bottom of the recess as an apex. A stripe-shaped projection is provided on the bottom surface.

In the electronic component storage package according to the present invention, a maximum height difference of the bottom surface of the arc-shaped concave portion is 5 μm to 15 μm.

According to the electronic component housing package of the present invention, the bottom surface of the concave portion of the insulating base is formed in an arc shape having the center of the bottom surface of the concave portion as an apex, and the stripe-shaped projection is provided on the bottom surface of the concave portion. The resin for bonding the electronic component can easily flow from the center of the bottom surface of the concave portion toward the outer periphery, and the resin can be uniformly filled between the electronic component and the bottom surface of the concave portion so that the adhesive strength can be made uniform. The air bubbles and the like entrapped in the resin can be easily moved to the outside and discharged by the flow of the resin for bonding toward the outside, effectively preventing defects such as voids in the resin from being caused by the air bubbles and the like. Thus, the electronic component can be firmly bonded and fixed to the bottom surface of the concave portion.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described in detail with reference to the accompanying drawings. 1 and 2 show an embodiment of an electronic component storage package according to the present invention, wherein 1 is an insulating base made of an electrically insulating material, and 2 is a lid. The insulating base 1 and the lid 2 constitute a container 4 for housing an electronic component 3 such as a semiconductor element or a surface acoustic wave element.

The insulating substrate 1 is made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, and the like. An appropriate organic binder, a solvent, and the like are added to and mixed with raw material powders such as silicon oxide, magnesium oxide, and calcium oxide to form a slurry, and the slurry is formed into a sheet by a doctor blade method, a calendar roll method, or the like to form a ceramic. Obtain a green sheet, and then, after performing appropriate punching processing on the ceramic green sheet and laminating a plurality of these,
It is manufactured by firing at a high temperature of about 1600 ° C.

The insulating base 1 has a rectangular recess 1a for accommodating the electronic component 3 at the center of the upper surface thereof, and has a striped projection 6 formed on the bottom of the recess 1a. The electronic component 3 is placed so as to straddle the stripe-shaped protrusion 6, and the recess 1 is interposed via a resin 5 such as an epoxy resin.
a Adhesively fixed to the bottom surface.

The bonding and fixing of the electronic component 3 to the bottom surface of the concave portion 1a is performed by first applying a bonding resin such as an uncured thermosetting epoxy resin to the bottom surface of the concave portion 1a where the stripe-shaped projections 6 are formed. Then, the electronic component 3 is positioned and mounted so as to straddle the stripe-shaped projections 5, and an appropriate load is applied to the electronic component 3, and a resin for bonding is applied to the lower surface of the electronic component 3 and the upper surface of the recess 1 a. This is performed by spreading the resin between the layers and then curing the bonding resin with heat or the like.

The striped projections 6 function as spacers for securing a certain space between the electronic component 3 and the bottom surface of the concave portion 1a. By filling the space with the resin 5, the electronic component 3 is filled. The amount of resin for bonding the electronic component 3 to the insulating base 1a is made sufficient to ensure the bonding strength of the electronic component 3.

The striped projections 6 are made of a high melting point metal powder such as tungsten, molybdenum, manganese, etc., and a metal paste obtained by adding an appropriate organic solvent and a solvent to the high melting point metal powder. Is formed on a ceramic green sheet serving as a bottom surface of the concave portion 1a of the insulating substrate 1 by applying a predetermined thickness by employing a known thick film method such as a screen printing method. Is done.

It is preferable that the stripe-shaped projections 6 are formed so that the maximum height thereof is about 25 μm to 35 μm, and a sufficient space is provided between the bottom surface of the recess 1 a and the electronic component 3. In addition to ensuring the above, it is possible to effectively prevent the stripe-shaped projections 6 from being defective such as chipping and peeling.

Further, when the striped projections 6 are made of a high melting point metal powder such as tungsten, molybdenum, manganese, etc., a plating layer of nickel, gold, etc.
If it is applied to a thickness of about μm, its oxidative corrosion can be effectively prevented, and the electronic component can be more easily and reliably bonded. Accordingly, it is preferable that a plating layer of nickel, gold, or the like is applied to the surface of the stripe-shaped protrusion 6 to a thickness of 1 to 20 μm.

In the electronic component housing package according to the present invention, the projection 6 is provided on the bottom surface of the concave portion 1a of the insulating base 1, and the bottom surface of the concave portion 1a is a circle having the center at the center of the bottom surface of the concave portion 1a. It is important to make it arc-shaped.

By forming the bottom surface of the concave portion 1a into an arc shape having the center of the concave portion 1a as an apex, the bottom surface of the concave portion 1a can be formed so as to be inclined from the center toward the outer periphery. When adhering to the bottom surface of the concave portion 1a, the adhesive resin can easily flow from the center toward the outer periphery along the inclined surface. As a result, the resin can be uniformly filled between the electronic component and the bottom surface of the concave portion, so that the adhesive strength can be made uniform, and air bubbles entrapped in the resin due to the flow of the adhesive resin toward the outer periphery. Etc. can be easily moved and discharged to the outside, and defects such as voids in the resin due to bubbles or the like can be effectively prevented, and the electronic component is firmly adhered and fixed to the bottom of the concave portion. Can be.

In this case, the maximum height difference of the bottom surface of the concave portion 1a is 5
If it is less than μm, the inclination from the center to the outer periphery of the bottom surface of the concave portion 1a becomes insufficient, and it becomes difficult to effectively make the adhesive resin easily flow toward the outer periphery. If it is less than 15 μm, the inclination becomes too strong. It becomes difficult to horizontally fix the electronic component to the bottom surface of the concave portion 1a, the electronic component tends to be inclined, and the adhesive strength tends to deteriorate, and it is difficult to accurately connect a bonding wire described later to the electrode of the electronic component 3. Becomes Therefore, it is preferable that the maximum height difference of the bottom surface of the concave portion 1a is in the range of 5 μm to 15 μm.

In order to make the bottom surface of the concave portion 1a arc-shaped with the center of the bottom surface of the concave portion 1a as an apex, a load larger than the center is applied to the outer peripheral portion of the region of the ceramic green sheet which becomes the bottom surface of the concave portion 1a. A method in which the entire bottom surface of the concave portion 1a is curved in an arc shape, or a method in which a ceramic paste is applied so as to form an arc-shaped cross section from the center to the outer periphery of a region of the ceramic green sheet which is the bottom surface of the concave portion 1a. Can be used.

Further, the metallized wiring layer 7 is formed on the insulating substrate 1 from the periphery of the concave portion 1a to the outside of the container 4, and each electrode of the electronic component 3 is bonded around the concave portion 1a of the metallized wiring layer 7. The part which is electrically connected through the wire 8 and led out of the container 4 is connected to an external electric circuit through a low melting point brazing material such as tin-lead solder.

The metallized wiring layer 7 is made of tungsten,
A metal paste obtained by adding a suitable organic solvent and a solvent to the high melting point metal powder, such as molybdenum, manganese, etc., is applied to the metal paste by using a conventionally known thick film method such as a screen printing method. The insulating substrate 1 is printed and coated on a ceramic green sheet serving as the substrate 1 in advance.
From the periphery of the concave portion 1 a to the outside of the container 4.

The insulating substrate 1 is further joined with a lid 2 on the upper surface thereof via a sealing member 9, whereby the insulating substrate 1
The inside of the recess 1 a is hermetically sealed by the lid 2.

The lid 2 is made of an iron-nickel-cobalt alloy, an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, or the like. It is formed by molding a raw material powder such as aluminum oxide, magnesium oxide, calcium oxide or the like by using a conventionally known press molding method, and firing it at a temperature of about 1500 ° C.

Thus, according to this electronic component storage package, the electronic component 3 is bonded to the bottom surface of the concave portion 1a of the insulating base 1 via the resin 5 made of epoxy resin or the like, and then each electrode of the electronic component 3 is metallized. The wiring layer 7 is electrically connected to the wiring layer 7 through the bonding wires 8.
Lid 2 is joined to the upper surface of the container via a sealing member 9 made of glass, resin or the like, and a container 4 composed of the insulating base 1 and the lid 2
An electronic device as a final product is obtained by hermetically housing the electronic component 3 therein.

The present invention is not limited to the above embodiment, and various changes and improvements may be made without departing from the spirit of the present invention. For example,
In the above embodiment, the case where the insulating substrate is made of aluminum oxide sintered body or the like is described. However, the insulating substrate may be made of a resin material such as plastic or a composite material of an organic material and an inorganic material. Good.

[0029]

According to the electronic component housing package of the present invention, the bottom surface of the concave portion of the insulating base is formed into an arc shape having the center of the bottom surface of the concave portion as an apex and the stripe-shaped projection is provided on the bottom surface of the concave portion. From this, it is possible to easily flow the resin for bonding the electronic component from the center of the bottom surface of the concave portion toward the outer periphery, and to uniformly fill the resin between the electronic component and the bottom surface of the concave portion, thereby making the bonding strength uniform. Bubbles and the like entrapped in the resin can be easily moved to the outside and discharged by the flow of the bonding resin toward the outer periphery, and the effect that defects such as voids in the resin due to the bubbles and the like are generated. The electronic component can be firmly bonded and fixed to the bottom surface of the concave portion.

[Brief description of the drawings]

FIG. 1 is a sectional view showing one embodiment of the present invention.

FIG. 2 is a plan view showing an embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Insulating base 1a ... Depression 2 ... Lid 3 ... Electronic components 4 ... Container 5 ... Resin 6 ... Stripe-shaped protrusion 7 ... ... Metalized wiring layer 8 ... Bonding wire 9 ... Sealing member

Continued on the front page (72) Inventor Koichi Nakahara 1-1, Yamashita-cho, Kokubu-shi, Kagoshima F-term in Kyocera Corporation's Kagoshima Kokubu Plant (reference) 5J097 AA24 AA32 HA04 JJ01 JJ03

Claims (2)

[Claims] An electronic device comprising: an insulating base having a concave portion for accommodating an electronic component; and a lid, wherein the electronic component is bonded and fixed to a bottom surface of the concave portion of the insulating base via a resin, and the concave portion is sealed with the lid. An electronic component housing package as described above, wherein a bottom surface of the concave portion of the insulating base is formed in an arc shape having a center at the center of the bottom surface of the concave portion, and a stripe-shaped protrusion is provided on the bottom surface of the concave portion. Electronic component storage package. 2. The electronic component storage package according to claim 1, wherein the maximum height difference of the bottom surface of the arc-shaped concave portion is 5 μm to 15 μm.