JP2002100912A - Method for manufacturing waveguide circuit and waveguide circuit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the number of manufacturing steps as well as parts, make a waveguide circuit small in size and weight, and stabilize its characteristics, by intergrally forming a waveguide and a conductor plate in the waveguide circuit, in which the conductor plate is inserted parallel to the E-shaped plane of the waveguide. SOLUTION: In the waveguide circuit, in which a single conductor plate 1 is inserted parallel to a waveguide 2 and its E-shaped plane and the single conductor plate 1, is provided with an opening showing at least one resonance work, the conductor plate 1 is held parallel to its E-shaped plane by using inner molds 5 and 5' for forming the inside shape of the waveguide made of water-soluble polymer or hydrolytic polymer, and the waveguide is made integral with the conductor plate 1 and inner molds 5 and 5' by using a resin material; and after the inner molds 5 and 5' are removed, the inside of the waveguide 1 is plated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a waveguide circuit used mainly in a microwave / millimeter wave band, and more particularly to a method of manufacturing a waveguide circuit having a conductor plate inserted in parallel with an E-plane.

[0002]

2. Description of the Related Art A circuit using a waveguide has been used in a radio communication device in a microwave or millimeter wave band from the viewpoint of loss of transmission characteristics. In recent years, a planar circuit using a dielectric substrate such as a microstrip line has been developed, but a low-loss circuit is particularly required after a transmission amplifier and before a reception low-noise amplifier, so a waveguide is used. Often. Also, in radio equipment in the microwave and millimeter wave bands, the antenna often has a waveguide input / output unit, which is one of the reasons why the waveguide circuit is used.

As described above, a circuit using a waveguide can obtain better performance than a planar circuit in terms of loss.
There is a problem that a radio device combined with a waveguide circuit has a large device scale, low mass productivity and high cost. Therefore, there is a demand for making a waveguide circuit small and simple.

On the other hand, Japanese Patent No. 1330127 describes a configuration for simply forming a filter circuit of a waveguide. FIG. 8 shows the configuration. The configuration shown in FIG. 8 is such that a small filter circuit can be easily formed by inserting a conductor plate provided with an opening exhibiting a resonance action in parallel with the E-plane of the waveguide. The openings 102 and 103 serving as containers are formed, and the conductor plate 101 is
It is configured to be sandwiched between split waveguides 104 and 104 '. The resonator 1 is formed by punching a metal plate on the conductor plate 101.
02 and 103 can be formed. Patent No. 1
No. 330127 describes that the waveguides 104 and 104 ′ can also be formed by plating a resin material or the like using a mold. As described above, a filter circuit of a waveguide is realized with a simple configuration in which the conductor plate 101 is sandwiched between the waveguides 104 and 104 '.

[0005]

However, in the configuration shown in FIG. 8, the parts are divided into a split waveguide and a conductor plate.
Although each of them can be manufactured at low cost, man-hours for finally assembling them are required, and the manufacturing cost increases accordingly. In assembly, such a waveguide filter generally has a waveguide, as shown in FIG.
A hole for screwing is formed in each of the conductor plates, and the conductor plate is screwed in a state sandwiched between the waveguides. Therefore, the weight increases at least by the amount of the screw.

In addition, since the waveguide is divided into two parts in parallel with the E-plane, it is often inconvenient to integrally process it with other waveguide parts. The number of connection points of the circuit increases. In the connection of the waveguide circuit, since it is screwed to the input / output part of each waveguide circuit using a flange provided orthogonal to the waveguide axis,
The outer shape also becomes larger. If the axis of each waveguide circuit is shifted when the connection is fixed, or if the waveguide inside dimensions of each waveguide circuit are different due to processing accuracy,
A step occurs at the connection portion of the waveguide circuit, and the discontinuity causes a deterioration in impedance characteristics or a phase change. When it is necessary to accurately design the phase and the like between the waveguide circuits such as an antenna duplexer, it is necessary to reduce the discontinuity caused by the connection between the circuits.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and by forming a waveguide and a conductor plate integrally, the number of manufacturing steps, the number of parts, the size, the weight, and the characteristics are reduced. The aim is to stabilize

[0008]

In order to achieve the above object, a first invention (corresponding to claim 1) comprises a waveguide,
A method for manufacturing a waveguide circuit, comprising: a partition provided in the waveguide so as to be parallel to the E-plane of the waveguide and having at least one opening exhibiting a resonance action. Using an inner mold for forming the inner shape of the tube, a step of sandwiching a plate-like member for forming the partition from both surfaces thereof, and an outer mold for forming the outer shape of the waveguide,
Arranging around the inner mold and the plate member;
A step of filling a resin material into a space formed between the outer mold and the inner mold and the plate-like member, and removing the outer mold and the inner mold to produce a waveguide main body. And a step of plating at least an inner wall of the waveguide of the waveguide body.

Further, the second invention (corresponding to claim 2)
The present invention is characterized in that the inner mold is made of a water-soluble polymer or a hydrolyzable polymer, and is dissolved and removed in the removing step.

Further, the third invention (corresponding to claim 3)
The present invention is characterized in that the resin material has a thermal expansion coefficient substantially equal to a thermal expansion coefficient of the plate-shaped member.

A fourth aspect of the present invention (corresponding to claim 4)
The present invention is characterized in that the plate member is a single conductor plate, a non-conductor plated or a non-conductor.

With the above configuration, the number of steps for assembling the waveguide and the conductor plate with screws or the like can be reduced. Also, the effect of weight reduction by eliminating the screw can be obtained.

Further, the fifth invention (corresponding to claim 5)
Is a method for manufacturing a waveguide circuit, comprising: a waveguide; and a partition provided in the waveguide so as to be parallel to the E-plane of the waveguide and having at least one opening exhibiting a resonance action. A step of arranging an inner mold for forming the inner shape of the waveguide and the partition wall, and arranging an outer mold for forming an outer shape of the waveguide around the inner mold. Forming the waveguide and the partition by filling a resin material into a space formed between the outer mold and the inner mold; and forming the outer mold and the inner mold. And a step of manufacturing a waveguide body, and a step of plating the inner wall and the partition wall of the waveguide body.

With the above configuration, the assembly of the waveguide and the conductor plate becomes unnecessary, and the number of manufacturing steps can be reduced. In addition, the number of parts can be reduced and the weight can be reduced by eliminating the screws and the conductor plate for assembly. Since all are formed of the same resin material, there is no distortion generated when materials having different expansion coefficients are used, and the advantageous effects of improving the strength and reliability of the waveguide circuit can be obtained.

Further, a sixth aspect of the present invention (corresponding to claim 6)
Is a method for manufacturing a waveguide circuit, comprising: a waveguide; and a partition provided in the waveguide so as to be parallel to the E-plane of the waveguide and having at least one opening exhibiting a resonance action. By coating the periphery of a plate-like member for forming the partition wall with a resin material, forming the resin material inside the waveguide, and plating the periphery of the resin material. And forming the plating as an outer wall of the waveguide.

A seventh aspect of the present invention (corresponding to claim 7)
The present invention is the above-mentioned invention, wherein the plate-like member is formed by plating a single conductor plate or a nonconductor.

According to the above configuration, a waveguide circuit can be realized with a simple configuration in which a conductor plate is embedded in a resin, and mass productivity is good. Further, since the resin is filled in the waveguide, the size can be reduced to one-square root of the relative dielectric constant of the resin material as compared with the waveguide circuit having a cavity.

The eighth invention (corresponding to claim 8)
The invention is characterized in that the waveguide has another waveguide circuit provided at one or both ends thereof and communicating with the inside of the waveguide.

With this configuration, a flange required for connecting a plurality of waveguide circuits is not required, and the waveguide circuit can be downsized. In addition, since the discontinuity occurring at the connection portion can be eliminated, the advantageous effect of stabilizing the characteristics can be obtained.

A ninth aspect of the present invention (corresponding to claim 9)
The present invention is characterized in that the plate-shaped member has at least two processed portions functioning as independent circuits, and the transmission area of the waveguide is arranged between the processed portions. It is.

According to this configuration, the circuit formed on the conductor plate can be a combination of easily designed circuits, and the design can be eased. Further, since the discontinuity at the connection portion when the waveguide circuit is connected can be eliminated, an advantageous effect of stabilizing characteristics can be obtained.

According to a tenth aspect of the present invention (corresponding to claim 10), the waveguide has an input / output port communicating with a transmission area in the waveguide between the at least two processing portions. The present invention is characterized in that the present invention has a branch portion provided.

With this configuration, an antenna duplexer using a waveguide circuit can be realized with a simple configuration. In addition, discontinuity at the connection portion when the waveguide circuits are connected can be eliminated, and the relative positional relationship between the respective circuits can be always kept constant. An effect can also be obtained.

Further, an eleventh invention (corresponding to claim 11) is characterized in that the waveguide is manufactured by any one of the first to fourth methods of manufacturing a waveguide circuit of the invention. Circuit.

A twelfth aspect of the present invention (corresponding to claim 12) is a waveguide circuit manufactured by the method of manufacturing a waveguide circuit according to the fifth aspect of the present invention.

A thirteenth aspect of the present invention (corresponding to claim 13) is a waveguide circuit manufactured by the sixth or seventh aspect of the waveguide circuit manufacturing method of the present invention. .

According to a fourteenth aspect of the present invention (corresponding to claim 14), at least a waveguide is provided in the waveguide so as to be parallel to the E-plane of the waveguide and exhibits a resonance action. A waveguide having a partition having one opening, wherein the partition has at least two processed portions functioning as independent circuits, and the transmission area of the waveguide is formed by the processed portion. It is a waveguide circuit characterized by being arranged between.

According to a fifteenth aspect of the present invention (corresponding to claim 15), the waveguide has an input / output port communicating with a transmission area in the waveguide between the at least two processing portions. The present invention is characterized in that the present invention has a branch portion provided.

[0029]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. Note that the present invention is not limited to these embodiments.

(Embodiment 1) A first embodiment of the present invention will be described below with reference to FIG.

FIG. 1A is a perspective view of a waveguide circuit manufactured by the method of manufacturing a waveguide circuit according to the first embodiment of the present invention. Reference numeral 1 denotes a conductor plate, and 2 denotes a waveguide integrally formed of a resin material. The conductor plate 1 is disposed parallel to the E plane in the waveguide 2 as a member corresponding to the partition wall of the present invention. I have.

FIG. 1B shows an inner mold for forming an inner shape in the waveguide 2 used in the method of manufacturing a waveguide circuit of the present invention, and inserted into the waveguide 2. FIG. 2 is a perspective view of a conductor plate 1 which is an example of a plate member according to the present invention. Openings 3 and 4 as resonators are formed in the conductor plate 1, and by providing these openings 3 and 4, the manufactured waveguide circuit has, for example, a circuit function as a band-pass filter. are doing.

In the method of manufacturing a waveguide circuit according to the present invention, the conductor plate 1 is placed in a space in which the main body of the waveguide 2 is formed so as to be parallel to the E-plane of the manufactured waveguide. While holding as it is, the outside is fixed with an outer mold (not shown), and a resin material is filled into a space between the outer mold and the inner mold to be integrally molded. For this reason, the conductor plate 1 is arranged so as to be sandwiched by the inner molds 5 and 5 ′ made of a water-soluble polymer or a hydrolyzable polymer inside the outer mold. At this time, the inner die 5 is provided with a projection 6 having a shape corresponding to the openings 3 and 4 of the conductor plate 1.

Next, FIG. 1C shows that in the manufacturing process,
It is a front view of the waveguide circuit before removing only the outer mold | die and removing the inner mold | die 5,5 '. The conductor plate 1 is sandwiched between the inner dies 5 and 5 ', and a waveguide 2 is formed outside thereof. The inner molds 5, 5 'are designed so that their combined shape becomes a rectangular waveguide shape. The waveguide 2 is integrally formed of a resin material while the conductor plate 1 is held between the inner dies 5 and 5 '.

After integral molding with the resin, the inner dies 5, 5 'are removed. Since the inner molds 5, 5 'are made of a water-soluble polymer or a hydrolyzable polymer, they can be easily removed using water, an aqueous alkali solution or an acid solution. Thereby, a space inside the waveguide can be obtained. However, in this state, since the waveguide 2 is formed of resin, a conductor for forming the waveguide wall is required,
The entire inside of the waveguide 2 is plated, if necessary, on the outside. The conductor plate 1 does not necessarily need to be plated, and a preferred one may be selected. When plating the conductor plate 1, a nonconductor may be used instead of the conductor plate.

Thus, the same structure as the waveguide circuit, which has conventionally been constituted by sandwiching a conductor plate between two split waveguides, can be realized by integral molding with resin. Here, an inexpensive resin such as ABS can be used as the resin material, but it is desirable to select a material having good plating properties. In plating, electroless copper plating is used, but the thickness of the plating should be sufficiently thicker than the skin depth calculated from the frequency to be used and the conductivity of the plated conductor from the viewpoint of high-frequency electrical characteristics. It is preferable that the thickness be three times or more the skin depth. The plating conductor and plating method may be other than electroless copper plating.

With such a configuration, the assembly of the waveguide and the conductor plate becomes unnecessary, and the number of manufacturing steps can be reduced. Further, by eliminating the screws for assembly, an effect of weight reduction can be obtained.

Here, by using a material having a thermal expansion coefficient close to the thermal expansion coefficient of the conductive plate 1 as a resin material for forming the waveguide 2, the conductive plate 1 and the conductive The distortion caused by the expansion and contraction of the tube 2 can be suppressed as much as possible, and an advantageous effect of improving the strength and reliability of the waveguide circuit can be obtained. Materials such as stainless steel, copper, and brass are used as materials for the conductive plate, and their expansion coefficients are on the order of 1 × 10 ⁻⁵ / ° C., and as a resin having an expansion coefficient close to this, for example, liquid crystal polymer It is preferable to use the above material.

Further, by using a plate-shaped resin in which openings 3 and 4 are processed in the same shape as the conductor plate 1 and plated, instead of the conductor plate 1, the weight can be further reduced. Here, the plating of the resin plate is as described in the plating of the waveguide 2. At this time, since the plating of the resin plate may be performed together with the plating of the inside of the waveguide 2, the resin plate is sandwiched between the inner molds 5 and 5 ′ without being plated to produce a waveguide circuit. It may be.

It is preferable to use the same material as the material of the waveguide 2 as the material of the resin plate, thereby minimizing distortion caused by expansion and contraction of the plate and the waveguide during integral molding. As a result, the advantageous effects of improving the strength and reliability of the waveguide circuit can be obtained.

Embodiment 2 Hereinafter, a second embodiment of the present invention will be described with reference to FIG.

FIG. 2A is a perspective view of a waveguide circuit manufactured by the method of manufacturing a waveguide circuit according to the present invention. 2
Is a waveguide integrally formed by using a resin material, and an opening is formed in the waveguide 2 so as to function as a resonator in parallel with the E-plane of the waveguide when the waveguide 2 is resin-molded. A plurality of plate-shaped resin pillars 7 provided with are provided.

FIG. 2B shows a plate-like resin pillar 7 corresponding to a partition wall of the present invention and an inner shape in the waveguide 2 used in the method of manufacturing a waveguide circuit. FIG. 2 is a perspective view of an inner mold for the present invention. The inner molds 5 and 5 'are made of a water-soluble polymer or a hydrolyzable polymer, and the inner mold 5 has a projection 6 for providing an opening for functioning as a resonator in parallel with the E-plane of the waveguide. Is provided.

In the manufacturing method of the waveguide circuit of the present invention, the main body of the waveguide 2 is formed in the longitudinal direction of the inner dies 5 and 5 ', that is, the direction along the extending direction of the waveguide 2. In the space, the outside is fixed with an outer mold (not shown) while holding the waveguide so as to be parallel to the E-plane of the waveguide to be manufactured.
The space between the outer mold and the inner mold is filled with a resin material, and the main body of the waveguide is integrally formed.

FIG. 2C is a front view of the waveguide circuit in which only the outer mold is removed and the inner molds 5 and 5 'are not removed in the manufacturing process. The inner molds 5 and 5 'are designed so that their combined shape becomes the shape of a rectangular waveguide, and there is a gap around the protrusion 6. And inner mold 5, 5 '
When the waveguide 2 is integrally formed of a resin material together with the resin, the resin penetrates into the gap, thereby forming a plate-like resin pillar 7.
Is formed.

The removal of the inner molds 5 and 5 'is performed in the same manner as described in the first embodiment. By removing the inner molds 5 and 5', the space inside the waveguide and the waveguide are removed. Plate-shaped resin pillars can be formed parallel to the E-plane. By plating the entire inside of the waveguide 2 and the resin column 7,
Conventionally, a configuration similar to a waveguide circuit which has been configured by sandwiching a conductor plate between two split waveguides can be realized by integral molding with resin. Here, the plating of the resin is described in the first embodiment.
This is performed in the same manner as described above.

With such a configuration, the assembly of the waveguide and the conductor plate becomes unnecessary, and the number of manufacturing steps can be reduced. In addition, the number of parts can be reduced and the weight can be reduced by eliminating the screws and the conductor plate for assembly. Since all are formed of the same resin material, there is no distortion generated when materials having different expansion coefficients are used, and the advantageous effects of improving the strength and reliability of the waveguide circuit can be obtained.

(Embodiment 3) Hereinafter, a third embodiment of the present invention will be described with reference to FIG.

FIG. 3A is a perspective view of a waveguide circuit manufactured by the method of manufacturing a waveguide circuit according to the third embodiment of the present invention, and FIG. showed that. In the waveguide circuit according to the present embodiment, similarly to the first embodiment, the conductor plate 1 is arranged parallel to the E-plane in the waveguide 2, and the waveguide 2 together with the conductor plate 1 is made of a resin material. It is configured to be integrally molded.

Further, in the present embodiment, another waveguide circuit 9 is provided adjacent to the waveguide circuit 8 comprising the conductor plate 1 and the waveguide 2.
Are connected, and this waveguide circuit 9 is also
According to the same integral molding procedure as in the first embodiment, an inner mold is used to integrally mold with the waveguide 2 using a resin material.

According to the present embodiment, by using the inner mold made of a water-soluble polymer or a hydrolyzable polymer, a complicated shape inside the waveguide can be formed.
Not only the waveguide circuit 8 but also the waveguide circuit 9 can be formed at the same time. Here, the waveguide circuit 9 is a Y-branch circuit on the H plane, but may be another waveguide circuit such as a bent waveguide having 90 degrees or any other bending angle. For example, when the Y-branch circuit on the H plane is manufactured by a method other than the integral molding, the waveguide groove is divided into two parts in parallel with the H plane and one or both of the grooves are processed. The simplest configuration is to combine two parts.

On the other hand, the portion of the waveguide circuit 8 in the conventional configuration is made by combining a waveguide divided into two parallel to the E plane, and the waveguide circuit 8 has a configuration divided in parallel to the H plane. In connection with the waveguide circuit, it was necessary to make each of them separately, but in the waveguide according to the embodiment of the present invention, they can be formed integrally.

With such a configuration, a flange required for connecting a plurality of waveguide circuits is not required, and the waveguide circuit can be downsized. In addition, since the discontinuity occurring at the connection portion can be eliminated, the advantageous effect of stabilizing the characteristics can be obtained.

In the description of the present embodiment, a waveguide circuit is formed by inserting a conductor plate into the E-plane of the waveguide according to the first embodiment and integrally forming the waveguide circuit. It goes without saying that a similar effect can be obtained even with the waveguide circuit according to the second embodiment.

(Embodiment 4) Hereinafter, a fourth embodiment of the present invention will be described with reference to FIG.

FIG. 4A is a perspective view of a waveguide circuit manufactured by the method of manufacturing a waveguide circuit according to the fourth embodiment of the present invention. Reference numeral 11 denotes a conductor plate, and 12 denotes a waveguide integrally formed of a resin material in the same manner as in Embodiment 1 or 2 of the present invention. The conductor plate 11 serves as a member corresponding to a partition wall of the present invention. This is a configuration arranged in parallel with the E plane in the tube 12.

FIG. 4B is a plan view of the conductive plate 11. Circuits 13 and 14 are formed in the conductor plate 11 and have openings serving as resonators. Circuits 13, 14
Are arranged so as not to be coupled to each other with an opening 15 acting as a transmission area of the waveguide therebetween. In the conductor plate 11 shown in FIG.
Numeral 14 is provided with two resonators (apertures) and functions as a band-pass filter having two stages, each of which is independently designed. The entire waveguide circuit corresponds to four stages. Function as a band-pass filter. As the number of resonator stages increases, the number of design points such as the resonance frequency of the resonator and the amount of coupling between the resonators increases, making it difficult to design. I'm trying to get

According to the present embodiment, by adopting such a configuration, the circuit (resonator) formed on the conductor plate can be a combination of easily designed circuits, and the design can be eased. In this case, a configuration in which a plurality of waveguide circuits are connected for the same purpose is also conceivable. However, a flange is required at a connection portion of the waveguide circuits, the outer shape becomes large, and man-hours for connection are required. The waveguide circuit of the present invention does not require a flange and can be miniaturized, and does not require connection man-hours. Further, since the discontinuity at the connection portion when the waveguide circuit is connected can be eliminated, an advantageous effect of stabilizing characteristics can be obtained.

In the embodiment of the present invention, the circuit 13,
Although 14 is a band-pass filter, other circuits may be used. For example, the circuit 14 may be an attenuator in which a resistor is applied to a part of the conductive plate 11.

Although the embodiment of the present invention has been described as the configuration of the waveguide circuit in which the conductor plate is formed integrally with the resin material in parallel with the E-plane of the waveguide, the present invention is not limited to this configuration. Instead, a configuration in which a conductor plate is sandwiched between conventional two-split waveguides may be used.

Embodiment 5 Hereinafter, a fifth embodiment of the present invention will be described with reference to FIG.

FIG. 5A is a perspective view of a waveguide circuit manufactured by the method of manufacturing a waveguide circuit according to the fifth embodiment of the present invention. Reference numeral 11 denotes a conductor plate, and reference numeral 12 denotes a waveguide integrally formed of a resin material as in the first or second embodiment.
Are arranged in parallel to the E-plane in the waveguide 12.
Reference numeral 16 denotes a first input / output unit of the waveguide circuit of the present invention, 17 denotes a second input / output unit, and 18 denotes a third input / output unit, which is provided between the input / output units 16 and 17.

FIG. 5B is a plan view of the conductor plate 11. Circuits 13 and 14 are formed in the conductor plate 11 and have openings serving as resonators. Circuits 13, 14
Are arranged so as not to be coupled to each other with an opening 15 acting as a transmission area of the waveguide therebetween. In the conductor plate 11 shown in FIG. 5B, each of the circuits 13 and 14 is provided with two resonators (openings) and functions as a band-pass filter having two stages.

FIG. 5C is a top view of the waveguide circuit according to the present embodiment. The third input / output unit 18 is provided in a range of the opening 15 which is a transmission area of the waveguide. Here, the first input / output unit 16 is connected to the transmission circuit of the radio, the second input / output unit 17 is connected to the reception circuit of the radio, and the third input / output unit 18 is connected to the antenna. 13 is designed as a band-pass filter for passing a transmission signal, and the circuit 14 is designed as a band-pass filter for passing a reception signal.

The length of the opening 15 as a transmission area and the position of the third input / output unit 18 are determined by the fact that the transmission signal input from the input / output unit 16 is not output in the direction of the input / output unit 17. , The received signal input from the input / output unit 18
6 is designed not to be output. That is, as shown in FIG. 6, the length from the branch point P of the third input / output unit 18 to the circuit 14 is such that the impedance when the circuit 14 is viewed from the point P is substantially open or short at the transmission frequency. I have to. Also, the circuit 13 from the point P
The impedance seen from the side is made almost open or short at the reception frequency.

According to the present embodiment, with such a configuration, an antenna duplexer using a waveguide circuit can be realized with a simple configuration. In this case, it is conceivable to separately manufacture the waveguide filter on the transmission side and the waveguide filter on the reception side for the same purpose and connect them with a branch circuit interposed therebetween. In this case, a flange is required and the outer shape becomes large, and man-hours for connection are required. The waveguide circuit of the present invention does not require a flange and can be miniaturized, and does not require connection man-hours. In addition, discontinuity at the connection portion when the waveguide circuits are connected can be eliminated, and the relative positional relationship between the respective circuits can be always kept constant. An effect can also be obtained.

In the embodiment of the present invention, the circuit 13,
Although 14 is a band-pass filter, other circuits such as a band rejection filter may be used.

Although the embodiment of the present invention has been described as a configuration of the waveguide circuit in which the conductor plate is integrally formed of a resin material in parallel with the E-plane of the waveguide, the present invention is not limited to this configuration. Instead, a configuration in which a conductor plate is sandwiched between conventional two-split waveguides may be used.

(Embodiment 6) A sixth embodiment of the present invention will be described below with reference to FIG.

FIG. 7A is a perspective view of a waveguide circuit manufactured by the method of manufacturing a waveguide circuit according to the sixth embodiment of the present invention. Reference numeral 21 denotes a conductor plate, and reference numeral 22 denotes a waveguide integrally formed of a resin material. The waveguide 22 has a rectangular waveguide shape in cross section. As a member corresponding to the partition wall of the present invention, a conductor plate 21 is arranged in parallel with the E plane, and the inside is filled with a resin material. It is.

FIG. 7B is a plan view of a conductor plate 21 as a plate-like member of the present invention, which is used in a method of manufacturing a waveguide circuit. The conductor plate 21 has an opening 2 as a resonator.
3 and 24 are formed, and these openings 23 and 24 have, for example, a circuit function as a band-pass filter.

FIG. 7C is a front view of the waveguide circuit manufactured according to the present embodiment. The waveguide 22 is a conductor plate 2
A rectangular waveguide main body is integrally formed by coating resin around the periphery of the conductor plate so as to be in close contact with the conductor plate, and a conductor 25 is provided outside the waveguide main body by plating. At this time, at least the edge of the conductor plate 21 is electrically coupled to the conductor 25 without any leakage to form a waveguide. The conductor plate 21 may be exposed to the outside of the waveguide main body as long as it is electrically connected. The conductor 25 forms a conductor wall of the waveguide. Here, the conductor 25 is the waveguide 2
Of the six surfaces (2), they are provided on four surfaces parallel to the traveling direction of the radio wave. The plating of the resin is performed in the same manner as in each of the above embodiments.

With the above configuration, a circuit formed on the conductor plate is arranged inside the waveguide, and a waveguide circuit having a structure in which the inside of the waveguide is filled with resin can be realized. Here, as the material of the resin, a material having a small dielectric loss tangent and good high-frequency characteristics is preferable.

According to the present embodiment, by adopting such a configuration, a waveguide circuit can be realized with a simple configuration in which a conductor plate is embedded in a resin, and mass productivity is good. Also,
Since the inside of the waveguide is filled with the resin, the size can be reduced to one-square root of the relative permittivity of the resin material as compared with the waveguide circuit having a cavity.

Here, if a resin material and a conductor plate having similar expansion coefficients are selected, distortion caused by expansion and contraction of the conductor plate and the waveguide during molding can be suppressed as much as possible, and the strength of the waveguide circuit can be reduced. Also, an advantageous effect of improving reliability can be obtained.

Further, as described in the fourth embodiment, the conductor plate is processed so as to function as at least two independent circuits, and between them a transmission region of a waveguide is formed. If an opening is provided, a circuit (resonator) formed on the conductor plate can be a combination of circuits that are easy to design, and the design can be eased.

Further, as described in the fifth embodiment, the conductor plate is processed to function as two independent circuits, and an opening is formed between them to form a transmission region of a waveguide. If a third input / output unit is provided in addition to the input / output unit of the waveguide circuit in the range of the transmission area,
A small antenna duplexer can be realized.

[0078]

As described above, according to the present invention,
In a waveguide circuit in which a conductor plate is inserted in parallel with the E-plane of the waveguide, the number of manufacturing steps, the number of parts, the size, and the weight are reduced by integrally molding the waveguide and the conductor plate. Or by improving the strength and reliability by selecting the resin material, or by stabilizing the characteristics by eliminating the discontinuity occurring at the connection, or by adopting a configuration in which the resin is filled inside the waveguide. At least one of the effects of miniaturization can be obtained.

[Brief description of the drawings]

FIG. 1A is a perspective view of a first embodiment. FIG. 1B is a perspective view showing an inner mold and a conductor plate according to the first embodiment. FIG. 1C is a front view of the first embodiment.

FIG. 2A is a perspective view of a second embodiment. FIG. 2B is a perspective view showing an inner mold of the second embodiment. FIG. 2C is a front view of the second embodiment.

FIG. 3A is a perspective view of a third embodiment. FIG. 3B is a cross-sectional view of the third embodiment taken along a plane H.

FIG. 4A is a perspective view of a fourth embodiment. FIG. 4B is a plan view of a conductor plate according to the fourth embodiment.

FIG. 5A is a perspective view of a fifth embodiment. FIG. 5B is a plan view of a conductor plate according to a fifth embodiment. FIG. 5C is a top view of the fifth embodiment.

FIG. 6 is a top view according to a fifth embodiment.

7A is a perspective view of a sixth embodiment. FIG. 7B is a perspective view of a conductor plate according to a sixth embodiment. FIG. 7C is a front view of the sixth embodiment.

8A is an exploded perspective view showing an example of a waveguide circuit having a conventional configuration. FIG. 8B is an exploded perspective view showing an example of a waveguide circuit having a conventional configuration.

[Explanation of symbols]

 1, 11, 21 Conductor plate 2, 12, 22 Waveguide 3, 4, 23, 24 Resonator (opening) 5, 5 'Inner mold 6 Projection 7 Resin pillar 8, 9 Waveguide circuit 13, 14 Circuit (Aperture) 15 Transmission area (Aperture) 16, 17, 18 Input / output part of waveguide circuit P Branch point 25 Waveguide wall (Conductor) 101 Conductor plate 102, 103 Resonator (Aperture) 104, 104 'Waveguide tube

Continued on the front page (72) Inventor Koichi Ogawa 1006 Kazuma Kadoma, Kazuma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. F term (reference) 5J006 LA26 NA09

Claims (15)

[Claims] 1. A waveguide circuit comprising: a waveguide; and a partition provided in the waveguide so as to be parallel to an E-plane of the waveguide and having at least one opening exhibiting a resonance action. Using an inner mold for forming the inner shape of the waveguide,
A step of sandwiching a plate-shaped member for forming the partition wall from both surfaces thereof, and a step of disposing an outer die for forming an outer shape of the waveguide around the inner die and the plate-shaped member. Filling a resin material into a space formed between the outer mold and the inner mold and the plate-like member; removing the outer mold and the inner mold to produce a waveguide main body. And a step of plating at least the inner wall of the waveguide body of the waveguide body. 2. The waveguide according to claim 1, wherein the inner mold is made of a water-soluble polymer or a hydrolyzable polymer, and is dissolved and removed in the removing step. Manufacturing method of tube circuit. 3. The method according to claim 1, wherein the resin material has a thermal expansion coefficient substantially equal to a thermal expansion coefficient of the plate-shaped member. 4. The method for manufacturing a waveguide circuit according to claim 1, wherein the plate-shaped member is a single conductor plate, a non-conductor plated or a non-conductor. . 5. A waveguide circuit, comprising: a waveguide; and a partition provided in the waveguide so as to be parallel to an E-plane of the waveguide and having at least one opening exhibiting a resonance action. A method of arranging an inner mold for forming the inner shape of the waveguide and the partition wall, and an outer mold for forming an outer shape of the waveguide, Disposing the waveguide and the partition wall by filling a resin material into a space formed between the outer mold and the inner mold; and A method for manufacturing a waveguide circuit, comprising: a step of removing the inner mold and manufacturing a waveguide main body; and a step of plating the inner wall and the partition wall of the waveguide main body. 6. A waveguide circuit comprising: a waveguide; and a partition provided in the waveguide so as to be parallel to an E-plane of the waveguide and having at least one opening exhibiting a resonance action. Forming the resin material inside the waveguide by coating the periphery of a plate-like member for forming the partition wall with a resin material; and plating the periphery of the resin material. And forming the plating as an outer wall of the waveguide. 7. The method according to claim 6, wherein the plate-shaped member is formed by plating a single conductor plate or a non-conductor. 8. The waveguide according to claim 1, further comprising a branch provided at one or both ends thereof and having another waveguide circuit communicating with the inside of the waveguide. ,
7. The method of manufacturing a waveguide circuit according to any one of 5 and 6. 9. The plate-shaped member has at least two processed portions functioning as independent circuits, and a transmission area of the waveguide is disposed between the processed portions. A method for manufacturing the waveguide circuit according to claim 1. 10. The waveguide according to claim 1, wherein the waveguide has a branch portion provided with an input / output port communicating with a transmission area between the at least two processing portions. 10. The method for manufacturing a waveguide circuit according to item 9. 11. A waveguide circuit manufactured by the method for manufacturing a waveguide circuit according to claim 1. Description: 12. A waveguide circuit manufactured by the method for manufacturing a waveguide circuit according to claim 5. 13. A waveguide circuit manufactured by the method for manufacturing a waveguide circuit according to claim 6. Description: 14. A waveguide circuit comprising: a waveguide; and a partition provided in the waveguide so as to be parallel to the E-plane of the waveguide and having at least one opening exhibiting a resonance action. Wherein the partition has at least two functions as an independent circuit.
A waveguide circuit, comprising: two processed parts, wherein a transmission area of the waveguide circuit is disposed between the processed parts. 15. The waveguide according to claim 15, wherein the waveguide has a branch portion provided with an input / output port communicating with a transmission area between the at least two processing portions. 15. The waveguide circuit according to 14.